TW201943004A - Cleaning device, plating device including the same, and cleaning method - Google Patents

Abstract

There is provided a cleaning device capable of conveying a substrate even when having large warpage. A cleaning device configured to clean a substrate W1 includes a horizontal conveyance mechanism 56 configured to convey the substrate W1 to be subjected to cleaning processing. Furthermore, the cleaning device includes a pressurizing roller 70 provided at a position facing the horizontal conveyance mechanism 56 with the substrate W1 therebetween and configured to press the substrate W1 against the horizontal conveyance mechanism 56, and a roller moving mechanism 72 configured to move the pressurizing roller 70 toward the horizontal conveyance mechanism 56 to cause the pressurizing roller 70 to press the substrate W1 against the horizontal conveyance mechanism 56.

Description

Cleaning device, plating device including the same, and cleaning method

The present invention relates to a cleaning device, a plating device including the same, and a cleaning method.

Conventionally, wiring, bumps (protruded electrodes), and the like are formed on the surface of a substrate such as a semiconductor wafer or a printed circuit board. As a method for forming the wirings and bumps, an electrolytic plating method is known.

In general, a plating apparatus used in the electrolytic plating method performs a plating process on a circular substrate such as a wafer having a diameter of 300 mm. However, in recent years, it is not limited to such a circular substrate, and it is also required to plate a square substrate.

Round substrates and square substrates differ in size or rigidity depending on the product type. A small rigid square substrate will bend. In a cleaning device for cleaning a substrate, when a substrate is transferred to a cleaning device by a transfer roller, a contact area between the substrate having a large warpage and the transfer roller is small. As a result, the transfer rollers become idle, and the substrate cannot be transferred.

In addition, even if the substrate is warped, the substrate may interfere with the slit at the entrance of the processing area in the cleaning device even if the substrate can be transported, and the problem that the slit cannot pass through occurs. For this reason, in order to prevent the gas and the like in the cleaning device from leaking to the outside of the cleaning device, the slit width is made as narrow as possible.

Furthermore, a cleaning device for measuring the thickness of a plated film after cleaning the plated substrate is disclosed in Japanese Patent Application Laid-Open No. 2005-240108. Round substrates and square substrates differ in size or rigidity depending on the product type. On the other hand, a square substrate with a small rigidity will bend. The technique disclosed in Japanese Patent Application Laid-Open No. 2005-240108 cannot cope with a substrate having warpage, and because of the warpage, a problem that a film thickness of a plating film cannot be accurately measured occurs.

In addition, the technique disclosed in Japanese Patent Application Laid-Open No. 2005-240108 is to peel the resist layer after plating, and then measure the film thickness of the plating film. Therefore, if the measurement result is unacceptable because the thickness of the plating film is thin and / or the thickness is not uniform, it is necessary to re-apply a resist layer on the substrate and perform plating again, or discard the substrate. Therefore, a problem of increased cost occurs.
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2018-6404
[Patent Document 2] Japanese Patent Laid-Open No. 2005-240108

(Problems to be solved by the invention)

One aspect of the present invention is to solve such a problem, and an object of the present invention is to provide a cleaning device that can carry even a substrate with a large warpage.

Another object of the present invention is to provide a cleaning device capable of measuring the film thickness of a plated film even on a substrate having a large warpage.

In addition, an object of another aspect of the present invention is to provide a cleaning device capable of measuring a film thickness of a plating film without removing a resist layer.
(Means for solving problems)

In order to solve the above problems, the first form adopts a configuration of a cleaning device capable of cleaning the object to be processed. The cleaning device includes a conveying mechanism capable of conveying the object to be processed as the object of the cleaning process; pressurization A roller is provided at a position which can be opposed to the conveyance mechanism through the object to be processed, and can press the object to be processed by the conveyance mechanism; and a roller moving mechanism, which makes the pressure roller face the foregoing The conveyance mechanism moves, and the object to be processed can be pressed to the conveyance mechanism by the pressure roller.

In this embodiment, the object can be positioned opposite to the conveying mechanism through the object to be processed, and the object to be processed can be pressed against the pressure roller of the conveying mechanism. The roller presses the object to be processed to the transport mechanism. Therefore, even a substrate with a large warpage (to-be-processed object) can press the substrate to a conveying roller (conveying mechanism), and the conveying roller does not idle. The substrate pressed by the pressure roller can be transferred to the processing area by the transfer roller.

In addition, since the substrate is pressed against the transfer roller by a pressure roller, the warped-corrected substrate does not interfere with the slit at the entrance of the processing area.

The second aspect adopts the structure of the cleaning device of the first aspect, which is characterized in that there are at least four pressure rollers.

The third form adopts the structure of the cleaning apparatus of the first form or the second form, and is characterized by having a driving device that can drive the aforementioned pressure roller in a rotatable manner.

The fourth aspect is a configuration using a plating device, which is provided with a cleaning device of any one of the first to third aspects.

The fifth form is a structure adopting a washing method, which is a method for washing the to-be-processed object in a washing device capable of washing the to-be-processed object. The aforementioned washing device has a transport mechanism, which is capable of being transported as Washing the object to be processed; the pressure roller is provided at a position opposite to the conveying mechanism through the object to be processed, and can press the object to be processed to the conveying mechanism; and The pressure roller moving mechanism moves the pressure roller toward the conveyance mechanism, and the object to be processed can be pressed to the conveyance mechanism by the pressure roller; and the cleaning method has the following steps: during the conveyance The object to be processed is mounted on the mechanism; the pressure roller is moved toward the conveyance mechanism by the roller moving mechanism, and the object to be processed is pressed against the conveyance mechanism by the pressure roller; and The object to be processed is transported in a state of being pressed under the transport mechanism.

In order to solve the above-mentioned problem, the sixth form adopts a configuration of a cleaning device capable of cleaning the object to be processed. The cleaning device includes a support portion that supports the aforementioned processed object that has been subjected to plating treatment and cleaning treatment. A pressurizing portion which is provided at a position which can be opposed to the support portion across the object to be processed and can press the object to be processed by the support portion; a moving mechanism which makes the pressure portion It can move toward the said support part, and can press the said to-be-processed object to the said support part by the said pressure part; and a film thickness measurement part which can measure the film thickness of the plating film of the to-be-processed object.

In this embodiment, since the object to be processed is pressed by the pressing portion to the supporting portion, the warpage of the substrate can be pressed to measure the film thickness. Thereby, the film thickness of the plating film can be accurately measured. According to this embodiment, it is possible to provide a cleaning device capable of measuring the film thickness of a plating film even on a substrate having a large warpage.

The seventh aspect adopts the structure of the cleaning device of the sixth aspect, characterized in that the support part is a conveying mechanism capable of conveying the object to be processed.

The eighth aspect adopts the structure of the cleaning device of the sixth aspect or the seventh aspect, characterized in that the pressurizing part has a roller, and the roller can press the object to be processed onto the support part.

The ninth aspect adopts the structure of the cleaning device in any one of the sixth aspect to the eighth aspect, and is characterized in that there are at least four rollers.

The tenth aspect is a configuration of a cleaning device adopting any one of the sixth aspect to the ninth aspect, wherein the film thickness measurement section moves during the measurement and can be located at a plurality of positions of the object to be processed. The film thickness of the plating film of the to-be-processed object was measured.

The eleventh aspect is a configuration of a cleaning device using any one of the sixth aspect to the tenth aspect, and is characterized by having a plurality of the aforementioned film thickness measuring sections.

The twelfth aspect is a configuration of a cleaning device adopting any one of the sixth aspect to the eleventh aspect, wherein the film thickness measuring section includes an eddy current sensor.

The thirteenth aspect is a configuration of a cleaning device adopting any one of the sixth aspect to the twelfth aspect, wherein the object to be processed has a resist layer, and the film thickness measurement unit can measure the presence of the foregoing. The thickness of the plating film of the resist to be processed. In this embodiment, since the film thickness of the plating film is measured in a state having a resist layer, it is not necessary to peel off the resist layer. According to this embodiment, it is possible to provide a cleaning device capable of measuring the film thickness of the plating film without removing the resist layer.

As a result of the measurement, if the thickness of the plating film is thin and / or the thickness is not uniform, it is not necessary to apply a resist layer on the substrate again, and the plating can be performed again. In addition, it is not necessary to discard the defective substrate, and the plating can be performed again. As a result, costs are reduced.

The fourteenth aspect adopts a configuration of a plating device, and is provided with a cleaning device of any one of the sixth aspect to the thirteenth aspect.

The fifteenth aspect is a structure adopting a washing method, which is a method of washing the to-be-processed object in a washing device capable of washing the to-be-processed object. The said washing device has a support portion which can support the process. The above-mentioned object to be subjected to the plating treatment and the cleaning treatment; the pressurizing portion is provided at a position which can be opposed to the support portion through the object to be processed, and can press the object to be processed to the support A moving mechanism that moves the pressurizing portion toward the support portion and can press the object to be processed by the pressurizing portion to the support portion; and a film thickness measurement portion that measures the object The thickness of the plated film of the processed object; and the cleaning method has the following steps: mounting the processed object on the supporting portion; moving the pressing portion toward the supporting portion by the moving mechanism, and moving the pressing portion by the moving mechanism The pressing part presses the object to be processed onto the support part; and in a state where the object to be processed is pressed onto the support part, the film thickness of the object to be processed is measured using the film thickness measurement part. .

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same reference numerals are given to the same or corresponding components, and redundant descriptions are omitted. In addition, the features shown in each embodiment can be applied to other embodiments as long as they do not contradict each other. The first figure is an overall layout diagram of a plating apparatus provided with the cleaning apparatus of this embodiment. As shown in the first figure, the plating apparatus 100 is roughly divided into: a substrate loading (loading / unloading) 110 on a substrate holder (equivalent to an example of an object to be processed); The processing part 120 of the substrate; and the cleaning part 50a. The processing unit 120 further includes: a pre-processing and post-processing unit 120A that performs pre-processing and post-processing of the substrate; and a plating processing unit 120B that performs plating processing on the substrate. The substrate processed by the plating apparatus 100 includes a square substrate and a circular substrate. In addition, the square substrate includes a square printed substrate or other objects to be plated.

The loading / unloading unit 110 includes two cassette stages 25 and a substrate loading / unloading mechanism 29. The cassette stage 25 carries a cassette 25 a that houses a substrate such as a semiconductor wafer or a printed circuit board. The substrate attaching and detaching mechanism 29 is configured to attach and detach substrates to and from a substrate holder (not shown). In addition, an automatic stocker 30 for accommodating a substrate holder is provided near (for example, below) the substrate attaching and detaching mechanism 29. In the center of these units 25, 29, and 30, a substrate transfer device 27 composed of a transfer robot that transfers substrates between these units is arranged. The substrate transfer device 27 is configured to be able to travel by the travel mechanism 28.

The cleaning unit 50a includes a cleaning device 50 that cleans and dries the substrate after the plating process. The substrate transfer device 27 is configured to transfer the substrate after the plating process to the cleaning device 50 and then take out the cleaned substrate from the cleaning device 50. Details of the cleaning device 50 will be described together with a second figure described later.

The pre-processing and post-processing unit 120A includes a pre-wet tank 32, a prepreg tank 33, a pre-flush tank 34, a spray tank 35, and a flush tank 36. The pre-wet tank 32 immerses the substrate in pure water. The prepreg groove 33 is formed by etching to remove an oxide film on the surface of a conductive layer such as a seed layer formed on the substrate surface. The pre-rinsing tank 34 cleans the pre-soaked substrate together with the substrate holder with a cleaning solution (pure water, etc.). The spray tank 35 is a substrate drain after the cleaning. The rinsing tank 36 cleans the plated substrate together with the substrate holder with a cleaning solution. The pre-wet tank 32, the pre-soak tank 33, the pre-rinsing tank 34, the blowing tank 35, and the flushing tank 36 are arranged in this order.

The plating treatment section 120B has a plurality of plating tanks 39, and these plating tanks 39 are provided with an overflow tank 38. Each plating tank 39 accommodates one substrate inside, and the substrate is immersed in a plating solution held inside, and the surface of the substrate is plated with copper plating or the like. In this case, the type of the plating solution is not particularly limited, and various plating solutions are used depending on the application.

The plating apparatus 100 includes a substrate holder transfer device 37 using a linear motor method, for example, a linear motor method, which is located at the side of these devices and transfers the substrate holder and the substrate between the devices. The substrate holder transfer device 37 is configured to transfer and hold a substrate between the substrate holding and unloading mechanism 29, the pre-wet tank 32, the prepreg tank 33, the pre-rinsing tank 34, the blowing tank 35, the washing tank 36, and the plating tank 39. Device way.

Next, the cleaning device 50 shown in the first figure will be described in detail. The second figure is a schematic side sectional view of the cleaning device 50. The cleaning device 50 includes an inlet 51 of the substrate W1, a first conveyance path 52, a vertical conveyance path 53, a second conveyance path 54, and an outlet 55 of the substrate W1. As shown in the figure, the first conveying path 52 and the second conveying path 54 are arranged side by side in the vertical direction, and the first conveying path 52 is located below the second conveying path. The first conveyance path 52 is a path that communicates with the inlet 51 and conveys the substrate W1 loaded from the inlet 51. The second conveyance path 54 is a path that conveys the substrate W1 in a direction opposite to the direction in which the substrate W1 is conveyed in the first conveyance path 52. The second conveyance path 54 is connected to the first conveyance path via a vertical conveyance path 53 and also communicates with the exit. The vertical conveyance path 53 is a path extending in the vertical direction so as to connect the first conveyance path 52 and the second conveyance path.

An entrance gate 51 a for opening and closing the entrance 51 is provided at the entrance 51. Further, an exit gate 55 a for opening and closing the exit 55 is provided at the exit 55. When the cleaning device 50 is mounted on the plating device 100 as in this embodiment, or when it is mounted on, for example, a CMP device, the cleaning device 50 floats with particles generated during cleaning, and is therefore similar to the plating device. Environments such as 100 or CMP equipment have lower cleanliness. If the negative pressure is maintained in the cleaning device 50, it is possible to prevent the particles in the cleaning device 50 from flowing out of the cleaning device 50. However, the negative pressure may not be maintained in the cleaning device 50 due to a failure of the pressure adjustment device or the like. In this embodiment, the entrance gate 51a and the exit gate 55a can separate the inside and the outside of the cleaning device 50, so that the particles in the cleaning device 50 can be further suppressed from flowing out.

As shown in the figure, a horizontal conveyance mechanism 56 (conveyance mechanism) having a plurality of rollers or the like for conveying the substrate W1 toward the vertical conveyance path 53 is provided on the first conveyance path 52. The horizontal conveyance mechanism 56 may be configured by arranging rollers so that the substrate W1 contacts only a designated portion of the substrate W1 according to the strength, material, or the like of the substrate W1. For example, the rollers of the horizontal conveyance mechanism 56 may be arranged so that the rollers of the horizontal conveyance mechanism 56 may only contact the central portion and both edge portions in the width direction of the substrate W1. An alignment mechanism for adjusting the position of the substrate W1 inserted from the entrance 51 may be provided near the entrance 51 of the first conveyance path 52. Thereby, the board | substrate W1 put in from the inlet 51 can be arrange | positioned at an appropriate position on the horizontal conveyance mechanism 56.

When the substrate W1 is arranged at an appropriate position on the horizontal transfer mechanism 56, the pressing roller 70 of the horizontal transfer mechanism 56 can press the substrate W1 toward the horizontal transfer mechanism 56 and move downward and vertically, and press the substrate W1 to Horizontal transfer mechanism 56. The roller moving mechanism 72 moves the pressure roller 70 downward in the vertical direction. Details of the pressure roller 70 and the roller moving mechanism 72 will be described later. The substrate W1 is transported toward the processing area 82 by the horizontal transport mechanism 56 in a state where the substrate W1 is pressed by the horizontal transport mechanism 56 by the pressure roller 70.

Further, a cleaning unit 57 for cleaning the substrate W1 and a drying unit 58 for drying the substrate W1 are provided on the first conveyance path 52. The washing unit 57 according to one embodiment includes a first washing unit 57a and a second washing unit 57b located downstream of the first washing unit 57a. The first cleaning unit 57a sprays DIW (De-Ionized Water; equivalent to an example of a cleaning liquid) on both or one side of the substrate W1 to clean the substrate W1. The second cleaning unit 57b sprays DIW and gas on both or one surface of the substrate W1 at the same time, and removes particles on the surface of the substrate W1. As the gas sprayed from the second cleaning unit 57b, clean dry air (CDA) or nitrogen can be used. The first cleaning unit 57a and the second cleaning unit 57b are so-called non-contact cleaning units that use a liquid or gas to clean the substrate W1. The drying unit 58 is, for example, a so-called Air Knife that ejects compressed gas from the thin slits in a thin layer, and removes or dries the cleaning liquid attached to both or one side of the substrate W1. The drying unit 58 is a so-called non-contact drying unit that uses a gas to dry the substrate W1.

The first cleaning unit 57a, the second cleaning unit 57b, and the drying unit 58 are surrounded by separate processing chambers, and the openings connecting the processing chambers are connected by an air curtain (Air Curtain, not shown). ) And so on. The first washing unit 57a and the second washing unit 57b are connected to a DIW supply line 59 for supplying DIW to these units. Further, the second washing unit 57b and the drying unit 58 are connected to a gas supply line 60 for supplying gas to these units. The DIW supply line 59 is provided with a filter 59a for capturing particles in the DIW; and a flow meter 59b for measuring the flow rate of the DIW. The gas supply line 60 is provided with a filter 60a for capturing fine particles in the gas.

The vertical transfer path 53 is provided with a vertical transfer mechanism 61 that receives the substrate W1 transferred by the horizontal transfer mechanism 56 and transfers the substrate W1 from the first transfer path 52 to the second transfer path 54 in the vertical direction. The vertical transfer mechanism 61 includes, for example, a support table that supports the substrate W1, and a lifting mechanism that raises and lowers the support table. The vertical conveyance mechanism 61 may include a substrate conveyance mechanism such as a roller for conveying the substrate W1 from the support table to a horizontal conveyance mechanism (not shown) provided in the second conveyance path 54. As in this embodiment, even when the first transfer path 52 and the second transfer path 54 are arranged side by side in the up-down direction, the substrate W1 can be transferred from the first transfer path 52 to the second transfer path 54 by the vertical transfer mechanism 61.

A horizontal transfer mechanism (not shown) is provided on the second transfer path 54 for horizontally transferring the substrate W1 transferred by the vertical transfer mechanism 61 toward the exit 55. This horizontal conveyance mechanism may be constituted by a roller or the like in the same manner as the horizontal conveyance mechanism 56, or may be constituted by a known robot arm. In addition, the second conveyance path 54 is provided with an air-supply unit 62 such as FFU (Fan Filter Unit) that sends out gas from above to below. The example shown in the figure shows that the air-flow unit 62 is near the start point of the second conveyance path 54 One each near the end point. For example, clean dry air or nitrogen can be used for the gas sent from the air blowing unit 62. A pair of position adjustments for the substrate W1 taken out from the outlet 55 can be provided near the outlet 55 of the second conveying path 54 In this way, the substrate W1 can be arranged at an appropriate position on the horizontal transfer mechanism, and the substrate transfer device 27 shown in the first figure can more surely hold the substrate W1 and take it out from the outlet 55.

A procedure for cleaning the substrate W1 using the cleaning device 50 described above will be described. First, the substrate transfer device 27 holds the substrate W1 plated in the plating device 100 shown in the first figure. At this time, although the substrate W1 is drained by the blowing tank 35 shown in the first figure, its surface may be wet or dry. When the entrance gate 51 a of the cleaning device 50 is opened, the substrate transfer device 27 puts the substrate W1 into the cleaning device 50 through the inlet 51. When the substrate W1 is put into the cleaning device 50, the entrance gate 51a is closed.

Next, the pressure roller 70 moves downward toward the horizontal transfer mechanism 56 and presses the substrate W1 to the horizontal transfer mechanism 56. The substrate W1 is conveyed by the horizontal conveyance mechanism 56 in a state of being pressed by the pressure roller 70 in the inlet 51. The horizontal transfer mechanism 56 of the cleaning device 50 transfers the substrate W1 input from the inlet 51 along the first transfer path 52. While the substrate W1 is being conveyed on the first conveyance path 52, the first and second cleaning units 57 a and 57 b perform non-contact cleaning. Specifically, first, the first cleaning unit 57a sprays DIW on the surface of the substrate W1 for cleaning, and continues the second cleaning unit 57b to spray cleaning liquid and gas on the surface of the substrate W1 for cleaning. Then, the substrate W1 is removed by an air knife in a drying unit 58 and dried.

The substrate W1 passing through the first transfer path 52 is received by the vertical transfer mechanism 61. The vertical transfer mechanism 61 transfers the substrate W1 in the vertical direction from the first transfer path 52 to the second transfer path 54. The substrate W1 transported to the second transport path 54 is transported along the second transport path 54 by a horizontal transport mechanism (not shown). The air blowing unit 62 sends out gas from above to below on the second conveyance path 54. Thereby, the fine particles in the cleaning device 50 can be pressed downward, and the environment of the second conveyance path 54 can be kept clean.

When the substrate W1 is transferred to the vicinity of the outlet 55, the outlet gate 55a is opened, and the substrate transfer device 27 shown in the first figure takes the substrate W1 out of the cleaning device 50 through the outlet 55. The substrate transfer device 27 stores the substrate W1 taken out from the cleaning device 50 in a cassette 25 a in a cassette stage 25 shown in the first figure.

Next, with reference to the third to eighth figures, the pressure roller 70 provided at a position opposed to the horizontal transfer mechanism 56 across the substrate W1 and capable of pressing the substrate W1 to the horizontal transfer mechanism 56 will be described in detail; The pressure roller 70 moves toward the horizontal conveyance mechanism 56 and presses the substrate W1 on the pressure roller 70 to a roller moving mechanism 72 of the horizontal conveyance mechanism 56.

First, the problems occurring when the pressure roller 70 does not exist will be described with reference to the third and fourth figures. As shown in the third figure, when the cleaning device 50 for cleaning the substrate W1 transfers the substrate W1 to the cleaning device 50 by the horizontal transfer mechanism 56, the contact area between the substrate W1 with large warpage and the horizontal transfer mechanism 56 is reduced. . Therefore, the horizontal transfer mechanism 56 is idling and the substrate W1 cannot be transferred.

In addition, as shown in the fourth figure, even if the substrate W1 with large warpage can be transferred by the horizontal transfer mechanism 56, the substrate W1 will still interfere with the slit 76 at the entrance of the processing area 82 in the cleaning device 50. This causes a problem that the slit 76 cannot pass through. The width of the slit 76 is designed to be as narrow as possible. This is to prevent the gas or the like in the cleaning device 50 from leaking to the outside of the cleaning device 50.

The fifth and sixth figures are front views of the pressure roller 70 and the roller moving mechanism 72 of this embodiment. The pressure roller 70 is mounted on the frame 80. A roller moving mechanism 72 is mounted on the frame 80. The roller moving mechanism 72 is attached to the upper frame portion 78 of the cleaning device 50 provided with the entrance 51. The roller moving mechanism 72 is, for example, an air cylinder, and drives the frame 80 in the vertical direction. Any driving mechanism can be used for the roller moving mechanism 72 as long as it can drive the frame 80 in the vertical direction.

The fifth figure shows a state before the pressure roller 70 is pressed against the substrate W1, and the sixth figure shows a state when the pressure roller 70 is moved downward by the roller moving mechanism 72 and the pressure roller 70 is fully pressed against the substrate W1. The pressure roller 70 presses the accessible portion of the substrate W1. The warped substrate W1 corrected by the pressure roller 70 is conveyed without disturbing the slit 76 at the entrance of the processing area 82.

The seventh figure shows a plan view of the pressure roller 70 and the roller moving mechanism 72 in this embodiment. The frame 80 is provided with 14 pressure rollers 70 in the case of this embodiment. The number of the pressure rollers 70 depends on the type and size of the substrate, as long as the warpage can be corrected. One or more pressure rollers 70 may be provided depending on the type of the substrate. For a square substrate, the number of pressure rollers should be at least one at each of the four corners of the substrate, that is, four. The material of the surface of the pressure roller 70 may be metal, plastic, or the like. The arrangement and size of the pressure roller 70 depend on the size of the space in the inlet 51, the type and size of the substrate, and the like.

The contact position between the pressure roller 70 and the substrate W1 is a position where the substrate W1 can contact. In addition, the pressure roller 70 also considers the strength and material of the substrate W1, and the rollers may be arranged so as to be in contact with only a specified portion of the substrate W1. For example, in the present embodiment, the pressure roller 70 may be arranged so that the center portion and the both edge portions of the substrate W1 in the width direction contact the pressure roller 70.

The rotation shaft 84 of the pressure roller 70 is mounted on the frame 80 via a bearing. Therefore, the pressure roller 70 can be rotated. It is not necessary to use bearings. This embodiment does not have a driving mechanism for rotationally driving the pressure roller 70, but may have a driving mechanism 88 shown by a dotted line. The number of driving mechanisms 88 can also be set according to the size / weight of the frame 80, the number / size / weight of the pressure rollers 70, the type / size of the substrate, and the like.

In order to reduce weight, two openings 86 are provided in the frame 80. The shape / size / number of the openings 86 and the shape / size of the frame 80 can be appropriately set in consideration of weight reduction and strength required for the frame 80. The number of the frame 80 and the roller moving mechanism 72 in this embodiment is one, but it is not limited to this. A plurality of roller moving mechanisms 72 may be provided on one frame 80, and a plurality of frames 80 may also be provided. The number of the frame 80 and the roller moving mechanism 72 can also be set according to the type and size of the substrate W1 and the size of the space in the entrance 51. The material of the frame 80 may be metal, plastic, or the like.

The roller moving mechanism 72 is provided at the center of the frame 80. The magnitude of the force exerted by the roller moving mechanism 72 on the substrate W1 is a magnitude capable of correcting the warpage of the substrate W1 and / or a magnitude capable of preventing the horizontal transfer mechanism 56 from idling, and / or a magnitude through which the substrate W1 can pass through the slit 76.

The four corners of the frame 80 are provided with guide portions 90 for guiding the movement of the frame 80. The eighth figure is a schematic side sectional view of the guide portion 90. The guide portion 90 includes a shaft 92 and a spline 94. The shaft 92 is fixed to the upper portion 78 by a fixture 96. The frame 80 is arranged on the shaft 92 via a spline 94. The spline 94 is fixed to the frame 80. The shaft 92 and the spline 94 are movable in the axial direction, that is, in the vertical direction.

The spline 94 is generally provided with a tooth at a fitting portion of a shaft and a hole through which the shaft passes. The spline 94 may also be a ball spline. Ball splines are used for the following reasons. When the shaft moves in the axial direction, the movement in the axial direction comes into contact with the surface, and sliding resistance may be large due to sliding friction. The countermeasure is to arrange balls (steel balls) on the part corresponding to the spline teeth, and to perform rolling friction to greatly reduce the sliding resistance is called ball spline. The spline 94 may not be a spline. It can also be a combination of only round rods, square rods, and only round holes, square holes, and the like. The number of the guide portions 90 in this embodiment is four. The number, arrangement, and size of the guides 90 depend on the type, size, and the like of the substrate.

The arrangement of the roller moving mechanism 72 and the guide portion 90 is not limited to the seventh figure. For example, the roller moving mechanism 72 may be provided at four corners of the frame 80, and the guide portion may be provided at the central portion and the peripheral portion of the frame 80 90. The roller moving mechanism 72, the pressure roller 70, and the frame 80 may be movable in the horizontal direction as a whole. Therefore, for example, a member that is mounted on a member that can move the roller moving mechanism 72 and the guide portion 90 in the horizontal direction and that drives the member in the horizontal direction may be provided.

The cleaning method for cleaning the substrate W1 in the cleaning device 50 for cleaning the substrate W1 is performed as follows. The substrate W1 is put into the cleaning device 50 from the inlet 51. The substrate W1 is mounted on the horizontal transfer mechanism 56. The pressure roller 70 is moved toward the horizontal conveyance mechanism 56 by the roller moving mechanism 72, and the substrate W1 is pressed to the horizontal conveyance mechanism 56 by the pressure roller 70. The substrate W1 is transported to the processing area 82 while the substrate W1 is pressed to the horizontal transport mechanism 56. The substrate W1 is washed and dried in the processing area 82.

Next, another embodiment of the cleaning device 50 shown in the first figure will be described in detail. The ninth figure is a schematic side sectional view of another embodiment of the cleaning device 50. The cleaning device 50 includes an inlet 51 of the substrate W1, a first transfer path 52, a vertical transfer path 53, a second transfer path 54, and an outlet 55 of the substrate W1. As shown in the figure, the first conveying path 52 and the second conveying path 54 are arranged side by side in the vertical direction, and the first conveying path 52 is located below the second conveying path. The first conveyance path 52 is a path that communicates with the inlet 51 and conveys the substrate W1 loaded from the inlet 51. The second conveyance path 54 is a path that conveys the substrate W1 in a direction opposite to the direction in which the substrate W1 is conveyed in the first conveyance path 52. The second conveyance path 54 is connected to the first conveyance path via a vertical conveyance path 53 and also communicates with the exit. The vertical conveyance path 53 is a path extending in the vertical direction so as to connect the first conveyance path 52 and the second conveyance path.

An entrance gate 51 a for opening and closing the entrance 51 is provided at the entrance 51. Further, an exit gate 55 a for opening and closing the exit 55 is provided at the exit 55. When the cleaning device 50 is mounted on the plating device 100 as in this embodiment, or when it is mounted on, for example, a CMP device, the cleaning device 50 floats with particles generated during cleaning, and is therefore similar to the plating device. Environments such as 100 or CMP equipment have lower cleanliness. If the negative pressure is maintained in the cleaning device 50, it is possible to prevent the particles in the cleaning device 50 from flowing out of the cleaning device 50. However, the negative pressure may not be maintained in the cleaning device 50 due to a failure of the pressure adjustment device or the like. In this embodiment, the entrance gate 51a and the exit gate 55a can separate the inside and the outside of the cleaning device 50, so that the particles in the cleaning device 50 can be further suppressed from flowing out.

As shown in the figure, a horizontal conveyance mechanism 56 (conveyance mechanism) having a plurality of rollers or the like for conveying the substrate W1 toward the vertical conveyance path 53 is provided on the first conveyance path 52. The horizontal conveyance mechanism 56 may be configured by arranging rollers so that the substrate W1 contacts only a designated portion of the substrate W1 according to the strength, material, or the like of the substrate W1. For example, the rollers of the horizontal conveyance mechanism 56 may be arranged so that the rollers of the horizontal conveyance mechanism 56 may only contact the central portion and both edge portions in the width direction of the substrate W1. An alignment mechanism for adjusting the position of the substrate W1 inserted from the entrance 51 may be provided near the entrance 51 of the first conveyance path 52. Thereby, the board | substrate W1 put in from the inlet 51 can be arrange | positioned at an appropriate position on the horizontal conveyance mechanism 56.

Further, a cleaning unit 57 for cleaning the substrate W1 and a drying unit 58 for drying the substrate W1 are provided on the first conveyance path 52. The washing unit 57 according to one embodiment includes a first washing unit 57a and a second washing unit 57b located downstream of the first washing unit 57a. The first cleaning unit 57a sprays DIW (De-Ionized Water; equivalent to an example of a cleaning liquid) on both or one side of the substrate W1 to clean the substrate W1. The second cleaning unit 57b sprays DIW and gas on both or one surface of the substrate W1 at the same time, and removes particles on the surface of the substrate W1. As the gas sprayed from the second washing unit 57b, clean dry air or nitrogen can be used. The first cleaning unit 57a and the second cleaning unit 57b are so-called non-contact cleaning units that use a liquid or gas to clean the substrate W1. The drying unit 58 is, for example, a so-called Air Knife that ejects compressed gas from the thin slits in a thin layer, and removes or dries the cleaning liquid attached to both or one side of the substrate W1. The drying unit 58 is a so-called non-contact drying unit that uses a gas to dry the substrate W1.

The first cleaning unit 57a, the second cleaning unit 57b, and the drying unit 58 are surrounded by separate processing chambers, and the openings connecting the processing chambers are separated by an air curtain (Air Curtain) or the like (not shown). surroundings. The first washing unit 57a and the second washing unit 57b are connected to a DIW supply line 59 for supplying DIW to these units. Further, the second washing unit 57b and the drying unit 58 are connected to a gas supply line 60 for supplying gas to these units. The DIW supply line 59 is provided with a filter 59a for capturing particles in the DIW; and a flow meter 59b for measuring the flow rate of the DIW. The gas supply line 60 is provided with a filter 60a for capturing fine particles in the gas.

The vertical transfer path 53 is provided with a vertical transfer mechanism 61 that receives the substrate W1 transferred by the horizontal transfer mechanism 56 and transfers the substrate W1 from the first transfer path 52 to the second transfer path 54 in the vertical direction. The vertical transfer mechanism 61 includes, for example, a support table that supports the substrate W1, and a lifting mechanism that raises and lowers the support table. The vertical conveyance mechanism 61 may include a substrate conveyance mechanism such as a roller for conveying the substrate W1 from the support table to a horizontal conveyance mechanism (not shown) provided in the second conveyance path 54. As in this embodiment, even when the first transfer path 52 and the second transfer path 54 are arranged side by side in the up-down direction, the substrate W1 can be transferred from the first transfer path 52 to the second transfer path 54 by the vertical transfer mechanism 61.

A horizontal transfer mechanism (not shown) is provided on the second transfer path 54 for horizontally transferring the substrate W1 transferred by the vertical transfer mechanism 61 toward the exit 55. This horizontal conveyance mechanism may be constituted by a roller or the like in the same manner as the horizontal conveyance mechanism 56, or may be constituted by a known robot arm. In addition, the second conveyance path 54 is provided with an air-supply unit 62 such as FFU (Fan Filter Unit) that sends out gas from above to below. The example shown in the figure shows that the air-flow unit 62 is near the start point of the second conveyance path 54 One each near the end point. For example, clean dry air or nitrogen can be used for the gas sent from the air blowing unit 62. A pair of position adjustments for the substrate W1 taken out from the outlet 55 can be provided near the outlet 55 of the second conveying path 54 In this way, the substrate W1 can be arranged at an appropriate position on the horizontal transfer mechanism, and the substrate transfer device 27 shown in the first figure can more surely hold the substrate W1 and take it out from the outlet 55.

When the substrate W1 is arranged at an appropriate position on the horizontal conveying mechanism in the outlet 55, the pressing portion of the substrate W1 can be moved to the horizontal conveying mechanism and moved downward to the horizontal conveying mechanism to press the substrate W1 to the horizontal direction. Transfer agency. The moving mechanism moves the pressing portion downward in the vertical direction. In a state where the substrate W1 is pressed to the horizontal transfer mechanism by the pressurizing section, the film thickness of the plated film is measured by the film thickness measuring section. After the measurement, the substrate W1 is transferred to the outside of the cleaning device 50 by the substrate transfer device 27. Details of the pressurizing section, the moving mechanism, and the film thickness measuring section will be described later.

As a result of the measurement, if the film thickness of the plating film is thin and / or the film thickness is not uniform, it is not necessary to apply a resist layer to the substrate again and perform plating again. That is, the defective substrate is transferred to the inlet 51 by the substrate transfer device 27 to be plated again. In addition, if it fails, the substrate W1 may be discarded without further plating.

A procedure for cleaning the substrate W1 using the cleaning device 50 described above will be described. First, the substrate transfer device 27 holds the substrate W1 plated in the plating device 100 shown in the first figure. At this time, the substrate W1 is drained in the blowing tank 35 shown in the first figure, but its surface may be wet or dry. When the entrance gate 51 a of the cleaning device 50 is opened, the substrate transfer device 27 puts the substrate W1 into the cleaning device 50 through the inlet 51. When the substrate W1 is put into the cleaning device 50, the entrance gate 51a is closed.

The horizontal transfer mechanism 56 of the cleaning device 50 transfers the substrate W1 input from the inlet 51 along the first transfer path 52. The substrate W1 is cleaned in a non-contact manner by the first cleaning unit 57 a and the second cleaning unit 57 b while being conveyed on the first conveyance path 52. Specifically, first, the first cleaning unit 57a sprays DIW on the surface of the substrate W1 for cleaning, and continues the second cleaning unit 57b sprays cleaning liquid and gas on the surface of the substrate W1 for cleaning. Then, the substrate W1 is removed by the air knife in the drying unit 58 and dried.

The substrate W1 passing through the first transfer path 52 is received by the vertical transfer mechanism 61. The vertical transfer mechanism 61 vertically transfers the substrate W1 from the first transfer path 52 toward the second transfer path 54. The substrate W1 transported on the second transport path 54 is transported along the second transport path 54 by a horizontal transport mechanism (not shown). The air blowing unit 62 sends out gas from above to below on the second conveyance path 54. Thereby, the fine particles in the cleaning device 50 can be pressed downward, and the ambient gas in the second conveyance path 54 can be kept clean.

When the substrate W1 is transferred to the vicinity of the outlet 55, the outlet gate 55a is opened, and the substrate transfer device 27 shown in the first figure takes out the substrate W1 from the cleaning device 50 through the outlet 55. The substrate transfer device 27 stores the substrate W1 taken out from the cleaning device 50 in a cassette 25 a on the cassette table 25 shown in the first figure.

Next, details of the film thickness of the plating film at the outlet 55 will be described with reference to the tenth to thirteenth drawings. As shown in FIG. 11, the cleaning device 50 includes a horizontal transfer mechanism 102 (supporting portion) that supports the substrate W1 (to-be-processed object) subjected to the plating process and the cleaning process, and is provided on the substrate W1 via the substrate W1. The position opposite to the horizontal conveying mechanism 102 can press the substrate W1 to the pressing part 104 of the horizontal conveying mechanism 102; the pressing part 104 can be moved toward the horizontal conveying mechanism 102, and the substrate W1 can be pressed by the pressing part 104 A moving mechanism 106 of the horizontal conveyance mechanism 102 and a film thickness measuring unit 108 that measures the thickness of the plated film of the substrate W1.

Hereinafter, the case where the pressurizing part 104, the moving mechanism 106, and the film thickness measurement part 108 are arrange | positioned at the exit 55 is demonstrated, However, These may be arrange | positioned other than the exit 55. For example, it may be provided in any place of the vertical conveyance path 53 or the second conveyance path 54 in the cleaning device 50. When the substrate W1 is provided on the support table of the vertical transfer mechanism 61, the film thickness of the plating film may be measured. In addition, the film thickness may be measured by providing a pressurizing section 104, a moving mechanism 106, and a film thickness measuring section 108 outside the main body of the cleaning device 50 and inside the plating device 100.

First, a problem occurring when the pressurizing section 104 does not exist will be described with reference to a tenth figure. In order to measure the film thickness after plating, for example, as shown in the tenth figure, a substrate W1 having a large warpage is provided on the horizontal transfer mechanism 102 in the outlet 55. When the plating film thickness of the substrate W1 was measured, the warped size 112 of the substrate W1 having a large warpage was several millimeters or more. When measuring the film thickness of a plated film, the measurement value of the film thickness varies depending on the distance between the film thickness measuring device and the substrate W1. In the past, when the warped dimension 112 reached several millimeters or more, the film could not be measured with the necessary accuracy. thick.

The eleventh figure is a front view showing the pressurizing section 104, the moving mechanism 106, and the film thickness measuring section 108 according to an embodiment of the invention of the present application. The twelfth figure is a plan view viewed from the direction AA of the eleventh figure. The support portion of the substrate W1 in the present embodiment is the horizontal transfer mechanism 102 that transports the substrate W1, but the support portion is not limited, as long as it supports the substrate W1. For example, it may be a fixed support portion. The horizontal conveyance mechanism 102 includes a roller 114 and a rotation shaft 116 to which the roller 114 is attached. The rotating shaft 116 is mounted on a frame (not shown) of the cleaning device 50 via a bearing. The rotation shaft 116 is rotationally driven by a driving mechanism (for example, a motor) (not shown). The roller 114 is in contact with a contactable portion on the back surface of the substrate W1. The side portion and the center portion of the back surface of the substrate W1 in this embodiment are contactable portions.

The pressing section 104 can press the substrate W1 to the horizontal transfer mechanism 102. The pressurizing portion 104 is in contact with a portion accessible to the surface of the substrate W1. As shown in the twelfth figure, the accessible portion in this embodiment is a cross-shaped portion on the surface of the substrate W1. The shape of the pressing portion 104 is a cross shape in accordance with the accessible portion. The shape of the pressing portion 104 is not limited to a cross shape. The shape of the pressurizing portion 104 can be selected in consideration of, for example, a contactable portion, a portion where a film thickness needs to be measured, and a pressing portion which needs to correct warpage. The shape of the pressing portion 104 may be, for example, a polygon, a circle, or an oval.

The moving mechanism 106 that moves the pressurizing portion 104 toward the horizontal conveyance mechanism 102 includes a cylinder 118, a sensor support plate 122, a shaft 124, and a guide portion 90. The air cylinder 118 is fixed to the upper frame 128 of the outlet 55 by a bolt or the like. The cylinder 118 may adopt any driving method such as an air pressure cylinder, a hydraulic cylinder, and an electric cylinder. A pressurizing portion 104 is attached to a front end of a shaft 124 of the air cylinder 118. The shaft 124 is movable in the vertical direction by the air cylinder 118.

A sensor support plate 122 is attached to a middle portion of the shaft 124. The sensor support plate 122 of this embodiment is a rectangular flat plate having a size substantially the same as that of the substrate W1. The shape of the sensor support plate 122 may be a circle other than a square, a polygon, a frame structure, or the like. The shape of the sensor support plate 122 is determined by the arrangement of the film thickness measurement portion 108, the arrangement of the guide portion 90 described later, and the strength and weight required for the sensor support plate 122 itself. A film thickness measuring section 108 is mounted on the sensor support plate 122 via the sensor driving section 130.

The sensor driving unit 130 moves the film thickness measurement unit 108 during measurement. The film thickness measurement unit 108 moves to measure the film thickness of the plating film on the substrate W1 at a plurality of locations on the substrate W1. The material of the sensor supporting plate 122 and the pressing portion 104 is metal, plastic, or the like. The material is determined in consideration of the strength, weight, cleanliness, processability, etc. required for the sensor support plate 122 and the pressurizing portion 104.

In this embodiment, as shown in FIG. 12, four film thickness measurement units 108 are provided. One or more film thickness measurement units 108 may be arranged. The film thickness measurement unit 108 may not be movable. The number, arrangement, and movement of the film thickness measurement units 108 are determined in consideration of the number of measurement locations, measurement frequency, and the like. In the present embodiment, as shown in FIG. 12, the film thickness measurement unit 108 moves on the substrate W1 as shown by an arrow 134 by the sensor driving unit 130. Arrow 134 shows the movement in the Y direction.

The film thickness measurement unit 108 can be moved on the substrate W1 as shown by an arrow 134 by the horizontal transfer mechanism 102. Arrow 134 shows the movement in the X direction. The X direction is a direction in which the substrate W1 is transferred by the horizontal transfer mechanism 102. The Y direction is a direction roughly orthogonal to the X direction. The Y direction is not limited to a direction orthogonal to the X direction. As long as the Y direction is a direction different from the X direction, the film thickness can be measured including the entire substrate W1.

In this embodiment, the movement in the X direction and the movement in the Y direction are performed by different driving mechanisms, but the movement in the X direction and the movement in the Y direction may also be performed by a single driving mechanism. In addition, the film thickness measurement unit 108 of this embodiment only performs movement in the X direction and movement in the Y direction, but it is not limited to this. The film thickness measurement unit 108 may also move on a curve. For example, a circular or polygonal spiral movement may be used.

The sensor driving unit 130 may be a driving unit of an air pressure type, a hydraulic type, or an electric type (for example, a linear motor). The driving method can be selected from the speed, position accuracy, cleanliness, power consumption, strength, weight, etc. required for the sensor driving section 130.

Guide portions 90 for guiding the sensor support plate 122 are provided at four positions shown in the twelfth figure of the sensor support plate 122. It can be seen in the twelfth figure that the guide portion 90 is arranged on the pressure portion 104, but the position of the guide portion 90 shown in the twelfth figure is merely a projection of the actual position on the sensor support plate 122 onto the pressure portion Shown on 104.

The thirteenth figure is a schematic side sectional view of the guide portion 90. The guide portion 90 includes a shaft 92 and a spline 94. The shaft 92 is fixed to the upper portion 128 by a fixture 96. The sensor support plate 122 is arranged on the shaft 92 via the spline 94. The spline 94 is fixed to the sensor support plate 122. The shaft 92 and the spline 94 are relatively movable in the axial direction, that is, in the vertical direction.

The so-called spline 94 is generally provided with a tooth at a portion where the shaft fits with a hole through which the shaft passes. The spline 94 may also be a ball spline. Ball splines are used for the following reasons. When the shaft moves in the axial direction, the movement in the axial direction is in contact with the surface, and the sliding resistance is large because of sliding friction. The countermeasure is to arrange balls (steel balls) on the part corresponding to the teeth of the spline and perform rolling friction to reduce the sliding resistance greatly, which is called ball spline. The spline 94 may not be a spline. It can also be a combination of round rods and square rods, and only round holes and square holes. The number of the guide portions 90 in this embodiment is four. The number, arrangement, and size of the guides 90 depend on the type, size, and the like of the substrate.

The arrangement of the air cylinder 118 and the guide portion 90 is not limited to that shown in the twelfth figure. For example, the air cylinder 118 may be provided at four corners of the sensor support plate 122, and the center portion and the periphery of the sensor support plate 122 may be provided.部 被 制造 部 90。 The guide portion 90 is provided. In addition, the guide portions 90 may be provided at the four corners of the sensor support plate 122, and the air cylinder 118 may be provided at the center and peripheral portions of the sensor support plate 122. In addition, the air cylinder 118 and the guide portion 90 may be horizontally movable as a whole. Therefore, for example, a driving portion that mounts the air cylinder 118 and the guide portion 90 on a member that can be moved in the horizontal direction and drives the member in the horizontal direction may be provided.

The pressing part 104 in the embodiment of the eleventh and twelfth figures is formed in a plate shape, but the pressing part is not limited to a plate shape. The pressing part 104 may also include a roller and a roller mounting portion. Horizontal transfer mechanism 102. As long as the number of rollers can correct the warpage, there should be at least four. The roller mounting portion is a plate or a frame, and the shaft 124 of the moving mechanism 106 is mounted on the roller mounting portion. At this time, the moving mechanism 106 presses the substrate W1 via the roller mounting portion and the roller.

The film thickness measurement unit 108 may be, for example, an eddy current sensor. The eddy current sensor has an excitation coil and a detection coil. High-frequency alternating current (2MHz ～) is caused to flow on the excitation coil to generate an alternating magnetic field. An AC magnetic field generates an eddy current on the conductive metal surface of the substrate W1 in the vicinity of the field coil. Eddy currents flow in a direction that cancels the AC magnetic field. The detection coil detects a magnetic field generated by an eddy current. Since the magnitude of the magnetic field detected by the detection coil depends on the film thickness of the substrate W1, the film thickness can be detected. The eddy current sensor detects the magnitude of the magnetic field as the current flowing in the detection coil or the impedance of the detection coil.

The film thickness measurement unit 108 is not limited to an eddy current sensor (that is, a sensor that detects the magnitude of an eddy current induced on a metal surface). As long as the thickness of the plated film can be measured, a film thickness measuring device of any method can be used. For example, the film thickness measuring unit 108 may use an electromagnetic induction type film thickness measuring device (when a magnetic body is brought close to the front end of the exciting coil, the exciting coil generates a reaction (electromagnetic induction) against the attracted magnetic body) Film thickness measuring device with a small change in voltage to film thickness) or resistive film thickness measuring device (contacting four measurement terminals to a metal surface, flowing current from the two outer terminals, and measuring the voltage between the two inner terminals simultaneously Film thickness measuring device for degree of decrease), or magnetic film thickness measuring device (film thickness measuring device using Hall effect).

The substrate W1 of the present embodiment has a resist layer, and the film thickness measurement unit 108 measures the plating film thickness of the substrate W1 having a resist layer. However, the substrate W1 may not have a resist. When the substrate W1 has a resist layer, the film thickness is measured. If the thickness of the plating film is thin and / or the film thickness is not uniform, the coating can be performed again without coating the resist layer on the substrate again. In addition, it is also possible to perform plating again without discarding the substrate determined to be unacceptable. As a result, costs are reduced.

There are four film thickness measurement sections 108 in the twelfth figure, but there may be only two film thickness measurement sections 108 of the film thickness measurement section 108a and the film thickness measurement section 108b. At this time, by transporting the substrate W1 in the X direction by the horizontal transport mechanism 102, the film thickness of the entire substrate W1 can be measured by the two film thickness measurement sections 108a and the film thickness measurement section 108b.

The sensor support plate 122 shown in FIG. 12 may not be provided. At this time, the film thickness measuring section 108 and the sensor driving section 130 may be directly mounted on the upper frame 128 via a cylinder other than the cylinder 118. The cylinders other than the cylinder 118 move the film thickness measurement unit 108 and the sensor driving unit 130 in the vertical direction. When it is not necessary to move the film thickness measurement unit 108 in the horizontal direction, the sensor driving unit 130 is not required.

The cleaning method for cleaning the substrate W1 in the cleaning device 50 for cleaning the substrate W1 is performed as follows. The substrate W1 is put into the cleaning device 50 from the inlet 51. With the substrate W1 mounted on the horizontal transfer mechanism 56, the substrate W1 is transferred to the processing area 82. The substrate W1 is washed and dried in the processing area 82. Then, the substrate W1 is mounted on the horizontal transfer mechanism 102 of the second transfer path 54 and is transferred to the exit 55. The pressing unit 104 is moved toward the horizontal conveyance mechanism 102 by the moving mechanism 106. The substrate W1 is pressed by the pressing portion 104 to the horizontal transfer mechanism 102 to correct the warpage of the substrate W1. In a state where the substrate W1 is pressed to the horizontal transfer mechanism 102, the film thickness of the plated film of the substrate W1 is measured using the film thickness measurement unit 108. The substrate W1 is carried out from the outlet 55 after the measurement.

The above description is an example of the embodiment of the present invention, but the embodiment of the invention described above is for the purpose of easy understanding of the inventor, and is not intended to limit the present inventor. The present invention can be changed and improved without departing from the scope of the invention, and the present invention naturally includes equivalents thereof. In addition, within the range that can solve at least a part of the above problems, or that can achieve at least a part of the effect, each element described in the scope of the patent application and the specification can be arbitrarily combined or omitted.

25‧‧‧Box Box

25a‧‧‧Box

27‧‧‧ substrate transfer device

28‧‧‧ Driving mechanism

29‧‧‧ substrate loading and unloading mechanism

30‧‧‧ Automatic Storage

32‧‧‧Pre-wet tank

33‧‧‧ prepreg tank

34‧‧‧Pre-rinsing tank

35‧‧‧Blowing trough

36‧‧‧Flushing tank

37‧‧‧ substrate holder transfer device

38‧‧‧ overflow tank

39‧‧‧plating tank

50‧‧‧washing device

50a‧‧‧washing department

51‧‧‧Entrance

51a‧‧‧ entrance gate

52‧‧‧The first conveying path

53‧‧‧Vertical transport route

54‧‧‧Second transfer route

55‧‧‧Export

55a‧‧‧Exit gate

56‧‧‧Horizontal Transfer Agency

57‧‧‧washing unit

57a‧‧‧first washing unit

57b‧‧‧Second washing unit

58‧‧‧ drying unit

59‧‧‧DIW supply pipeline

59a‧‧‧filter

59b‧‧‧flow meter

60‧‧‧Gas supply line

60a‧‧‧filter

61‧‧‧Vertical Transfer Agency

62‧‧‧Air supply unit

70‧‧‧Pressure roller

72‧‧‧ roller moving mechanism

76‧‧‧Slit

78‧‧‧upper

80‧‧‧ rack

82‧‧‧Treatment area

84‧‧‧rotation axis

86‧‧‧ opening

88‧‧‧Drive mechanism

90‧‧‧Guide

92‧‧‧axis

94‧‧‧Spline

100‧‧‧ plating equipment

102‧‧‧Horizontal Transfer Agency

104‧‧‧Pressure section

106‧‧‧ Mobile agency

108‧‧‧ Film thickness measurement section

110‧‧‧Loading / unloading department

112‧‧‧Warped size

114‧‧‧ roller

116‧‧‧rotation axis

118‧‧‧ cylinder

120‧‧‧ Processing Department

120A‧‧‧Pre-processing‧Post-processing department

120B‧‧‧Plating Treatment Department

122‧‧‧Sensor support plate

124‧‧‧axis

128‧‧‧ Upper Rack

130‧‧‧Sensor drive unit

134‧‧‧arrow

W1‧‧‧ substrate

The first figure is an overall layout diagram of a plating apparatus provided with the cleaning apparatus of this embodiment.

The second figure is a schematic side sectional view of the cleaning device.

The third diagram is a diagram illustrating a problem that occurs when a pressure roller is not present.

The fourth diagram is a diagram illustrating a problem that occurs when a pressure roller is not present.

The fifth figure is a front view showing a pressure roller and a roller moving mechanism according to this embodiment.

The sixth figure is a front view showing a pressure roller and a roller moving mechanism according to this embodiment.

The seventh figure is a plan view of a pressure roller and a roller moving mechanism according to this embodiment.

The eighth figure is a schematic side sectional view of the guide portion.

The ninth figure is a schematic side sectional view of a cleaning device according to another embodiment.

The tenth figure is a diagram illustrating a problem that occurs when the pressurizing portion does not exist.

The eleventh figure is a front view showing a pressurizing section, a moving mechanism, and a film thickness measuring section of another embodiment.

The twelfth figure is a plan view as viewed from the direction AA of the eleventh figure.

The thirteenth figure is a schematic side sectional view of the guide portion.

Claims (15)

A washing device capable of washing objects to be treated, which comprises: A transfer mechanism, which is capable of transferring the aforesaid objects to be treated as cleaning objects; The pressure roller is provided at a position which can be opposed to the conveyance mechanism through the object to be processed, and can press the object to be processed to the conveyance mechanism; and The roller moving mechanism moves the pressure roller toward the conveyance mechanism, and the object to be processed can be pressed to the conveyance mechanism by the pressure roller. For example, the cleaning device of the first scope of the patent application, wherein the aforementioned pressure roller has at least four. For example, the cleaning device of the first or second scope of the patent application has a driving device which can rotate and drive the aforementioned pressure roller. A plating device includes a cleaning device according to any one of claims 1 to 3 of the scope of patent application. A washing method is a method for washing the to-be-processed object in a washing device capable of washing the to-be-processed object. The washing device has a conveying mechanism for conveying the to-be-treated object as a washing treatment object. Processed object; a pressure roller provided at a position which can be opposed to the conveyance mechanism through the object to be processed, and capable of pressing the object to be processed to the conveyance mechanism; and a roller moving mechanism which makes the foregoing The pressure roller moves toward the conveying mechanism, and the object to be processed can be pressed to the conveying mechanism by the pressure roller; And the aforementioned washing method has the following steps: Mounting the object to be processed on the transfer mechanism; The pressure roller is moved toward the conveyance mechanism by the roller moving mechanism, and the object to be processed is pressed by the conveyance mechanism by the pressure roller; and The object to be processed is transported in a state where the object to be processed is pressed to the transport mechanism. A washing device capable of washing objects to be treated, which comprises: A supporting part, which can support the object to be processed which has undergone plating treatment and cleaning treatment; The pressurizing portion is provided at a position which can be opposed to the supporting portion across the object to be processed, and can press the object to be processed to the supporting portion; A moving mechanism that moves the pressurizing portion toward the support portion, and can press the object to be processed by the pressurizing portion to the support portion; and The film thickness measurement section measures the film thickness of the plated film of the object to be processed. For example, if the cleaning device according to item 6 of the patent application is applied, the aforementioned supporting part is a transport mechanism capable of transporting the object to be processed. For example, if the cleaning device according to item 6 or item 7 of the patent scope is applied, the pressing part includes a roller, and the roller can press the object to be processed onto the supporting part. For example, if there is a cleaning device in any one of items 6 to 8 of the scope of patent application, there are at least four rollers. For example, if the cleaning device according to any one of claims 6 to 9 is applied, the film thickness measurement section moves during the measurement, and the plating film of the object to be processed can be measured at a plurality of positions of the object to be processed. Of film thickness. For example, the cleaning device according to any one of claims 6 to 10 of the scope of patent application, which has a plurality of the aforementioned film thickness measuring sections. For example, the cleaning device according to any one of claims 6 to 11 in the scope of application for a patent, wherein the film thickness measurement section includes an eddy current sensor. For example, if the cleaning device according to any one of claims 6 to 12 is applied for, the object to be processed has a resist layer, and the film thickness measuring unit may measure the plating of the object to be processed having the resist layer Film thickness. A plating device includes a cleaning device according to any one of claims 6 to 13 in the scope of patent application. A washing method is a method for washing the to-be-processed object in a washing device capable of washing the to-be-processed object. The washing device has a supporting part which can support the plating treatment and the washing treatment. The aforementioned to-be-processed object; a pressurizing portion is provided at a position which can be opposed to the supporting portion across the to-be-processed object, and can press the to-be-processed object to the supporting portion; and a moving mechanism, which The pressurizing section moves toward the support section, and the object to be processed can be pressed against the support section by the pressurizing section; and a film thickness measuring section, which is a film capable of measuring a plating film of the object to be processed. thick; And the aforementioned washing method has the following steps: Mounting the object to be processed on the support portion; Moving the pressing portion toward the supporting portion by the moving mechanism, and pressing the object to be treated against the supporting portion by the pressing portion; and In a state where the object to be processed is pressed against the support portion, the film thickness of the plated film of the object to be processed is measured using the film thickness measurement unit.