TWI787112B - Multi-cavity test socket structure - Google Patents

Abstract

A multi-cavity test seat structure, comprising: a metal carrier, carrying a plurality of wafers to be tested; a carrier component, including a carrier, the metal carrier is mounted on the carrier in a contact manner; a pressing component , including a press-fit seat, the press-fit seat is located at the bottom of the press-fit assembly, a mesh gasket is embedded on the surface of the press-fit seat facing the carrier, and the net-like gasket forms multiple layers on the surface of the press-fit seat grid area, the pressing seat is provided with several positioning posts, and the metal carrier is also provided with several corresponding holes, when the pressing seat is pressed on the carrier, the positioning posts are located in the corresponding holes, And contact with the metal carrier by the mesh sealing gasket, so that each grid area corresponds to a wafer to be tested and forms an independent closed space, thereby satisfying that each mold cavity is under the required specific pressure, temperature conditions.

Description

Multi-cavity test socket structure

The invention relates to the technical field of performing three-temperature (high temperature, room temperature and low temperature) and high-voltage testing on wafers, and in particular relates to a multi-cavity test seat structure.

After the wafer is produced, the wafer needs to be inspected, including testing in a three-temperature environment of high temperature, room temperature, and low temperature, and a high-voltage state. During the process, the wafer must also be rotated to meet actual needs. Usually, a plurality of wafers to be tested are carried on a metal carrier, and a closed space is formed between a pressing unit and the metal carrier in a pressurized state, and a plurality of wafers are tested in the same sealed space. However, the high pressure and three-temperature test environment applied during the test sometimes still cannot achieve a good sealing effect, and when some chips require higher test pressure, this requirement cannot be met, which affects the test. precision.

In order to solve the above-mentioned problems, the main purpose of the present invention is to provide a multi-cavity test seat structure, mainly to allow each trough of the metal carrier to form an independent closed space during the test process, so that it can be tested under the three-temperature test conditions. , but also increase the required test pressure to meet the required test conditions.

To achieve the aforementioned object, the present invention adopts the following technical solutions: The present invention relates to a multi-cavity test seat structure, comprising: a metal carrier plate carrying a plurality of wafers to be tested; a carrier component including a stage on which the metal carrier plate is contact-mounted; The pressing assembly includes a pressing seat, which is located at the bottom of the pressing assembly, and a mesh gasket is embedded on the surface of the pressing seat facing the carrier, and the mesh sealing gasket is placed on the pressing seat A plurality of grid areas are formed on the surface, and the press-fit seat is provided with several positioning columns, and several corresponding holes are also provided on the metal carrier plate. Corresponding to the inside of the hole, and the mesh sealing gasket is in contact with the metal carrier plate, so that each grid area corresponds to a wafer to be tested and forms an independent closed space.

By adopting the above technical solution, the wafer is set in an independent closed space for testing, which facilitates maintaining a high temperature and high pressure environment in a small space and improves the accuracy of testing.

As one of the preferred embodiments, a mesh groove is formed on the surface of the pressing seat, and the mesh sealing gasket is embedded in the mesh groove; by adopting the above-mentioned technical scheme, the mesh sealing gasket further improves the pressing seat. The sealing effect between the carrier and the stage facilitates the formation of a high temperature and high pressure environment in the closed space of the metal carrier.

As one of the preferred embodiments, the positioning column is arranged in the mesh groove.

By adopting the above technical solution, while the positioning column improves the positioning accuracy between the press-fit seat and the carrier, it can avoid affecting the sealing effect of the mesh gasket as much as possible, and maintain the high precision when the press-fit seat and the carrier are pressed together and high air tightness.

As one of the preferred embodiments, the mesh sealing gasket has several positioning holes, and when the mesh sealing gasket is embedded in the mesh groove, the positioning post is located in the positioning holes.

By adopting the above technical solution, the positioning holes are used to locate the position of the mesh sealing gasket on the pressing seat, thereby improving the positioning accuracy of the mesh sealing gasket. At the same time, the positioning hole plays a role of giving way, reducing the impact of the positioning column on the sealing effect of the mesh gasket, and ensuring the sealing effect of the mesh gasket.

As one of the preferred embodiments, the longitudinal opening size of the mesh groove is smaller than the depth size of the groove.

By adopting the above technical solution, the stability of the mesh sealing gasket in the mesh groove is improved.

As one of the preferred embodiments, the depth of the mesh groove is additionally provided with an adhesive, and the mesh sealing gasket is embedded in the mesh groove, and the adhesive fills the rest of the mesh groove. space, and partially protrude the mesh sealing gasket out of the opening.

By adopting the above technical solution, the adhesive enhances the tightness of the mesh gasket during the pressurization process.

As one of the preferred implementations, the carrier is a temperature-controlled carrier capable of controlling the temperature of the metal carrier disposed thereon.

By adopting the above-mentioned technical solution, it is convenient to adjust the temperature of the carrier platform, and then it is convenient to adjust the temperature of the metal carrier plate, and it is convenient to control the test environment in the metal carrier plate.

As one of the preferred embodiments, the press-fit seat is provided with a group of test units and is distributed in an array, and each group of the test units is distributed in one of the grid areas, and the test units include at least one air inlet and a probe group, the test unit provides the high voltage state and electrical contact required in the test environment.

By adopting the above technical solution, it is convenient to detect each wafer to be tested in the metal carrier plate, and the detection accuracy of the wafer to be tested is improved.

As one of the preferred embodiments, it also includes two sets of fastening components, which are respectively located on the opposite sides of the bearing component and the pressing component. locked.

By adopting the above-mentioned technical solution, the pressing assembly and the carrying assembly are clamped by the fastening assembly, preventing the pressing assembly from detaching from the carrying assembly when a high-temperature and high-pressure environment is created in the carrying assembly, and the pressing assembly is lifted. The stability of the connection between the component and the load-bearing component.

As one of the preferred embodiments, the metal tray includes an outer frame and a plurality of supporting parts, and the plurality of supporting parts are arranged in the outer frame, and a plurality of connecting bars are arranged at intervals on the side walls of the supporting parts. The side wall of the supporting part is replaced with a plurality of connecting grooves for the clamping of the connecting bar, and the outer frame is provided with a sealing part for closing the gap between the supporting parts.

By adopting the above technical solution, the carrier can be taken out from the outer frame to facilitate the replacement of the carrier, and when the carrier is damaged, it is convenient to replace the carrier and reduce production costs. The sealing element is used to further improve the sealing effect, support and limit the carrier, and improve the connection stability between the carrier parts.

Compared with the prior art, the present invention has the following specific effects:

1. The present invention utilizes a reticular sealing pad to provide an independent airtight space for each wafer to be tested during testing, ensuring the maintenance of a high-pressure, three-temperature testing environment.

2. The present invention uses a mesh gasket to provide an independent airtight space for each wafer to be tested during testing, and cooperates with the assembly of positioning columns and corresponding holes to withstand a higher pressure testing environment, for example, the pressure can reach 1500kpa.

3. In the present invention, the size of the longitudinal opening of the mesh groove of the pressing seat is smaller than the depth of the groove. After the mesh gasket is embedded in the mesh groove, it is not easy to separate, which reduces the possibility of falling off during long-term operation. glitch problem.

1: Carrying components

11: Carrier

2: Pressing components

21: Press seat

211: positioning column

212: mesh groove

213: grid area

22: Test unit

221: stomata

223: Probe set

224: air intake

225: Vent

23: Adhesive

3: metal tray

301: trough

302: lattice contact surface

31: Corresponding hole

32: Outer frame

33: Carrier

34: Seals

35: block

36: Connection slot

37: card slot

38: Connecting strip

4: mesh gasket

5: Fastening components

51: Pneumatic cylinder

52: card parts

521: guide groove

53: Composite column

6: Wafer to be tested

61: contact

Fig. 1 is an exploded view of the multi-cavity test socket structure of the present invention.

Fig. 2 is a structural schematic diagram of the press-fit assembly of the multi-cavity test seat structure of the present invention viewed from the bottom.

FIG. 3 is a partially enlarged view of FIG. 2 .

Fig. 4 is a schematic view of the first embodiment of the metal carrier plate of the multi-cavity test seat structure of the present invention.

Fig. 5 is an exploded view of the press-fit seat of the multi-cavity test seat structure of the present invention.

Fig. 6 is a top view of the press-fit seat of the multi-cavity test seat structure of the present invention.

FIG. 7 is a cross-sectional view of plane AA of FIG. 6 .

FIG. 8 is a partially enlarged view of FIG. 7 .

FIG. 9 is a schematic diagram of a second embodiment of a metal carrier plate with a multi-cavity test seat structure according to the present invention.

Fig. 10 is an exploded view of the second embodiment of the metal carrier plate of the multi-cavity test seat structure of the present invention.

The technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments and accompanying drawings. It should be noted that when an element is referred to as being "mounted or fixed on" another element, it means that it may be directly on another element or there may be an intervening element. When an element is said to be "connected" to another element, it means that it may be directly connected to the other element or intervening elements may also be present. In the illustrated embodiment, the directions meaning up, down, left, right, front and rear, etc. are relative to explain that the structure and movement of the different components are relative in this case. These representations are pertinent when the components are in the positions shown in the figures. However, if the description of the location of elements changes, these representations are considered to change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , a multi-cavity test seat structure of the present invention includes: a bearing component 1 , a pressing component 2 , a metal carrier plate 3 and a mesh gasket 4 . The carrier assembly 1 includes a carrier platform 11 for the metal carrier plate 3 to be contact mounted thereon. The pressing assembly 2 includes a pressing seat 21, the press-fit seat 21 is located at the bottom of the press-fit assembly 2, and the surface of the press-fit seat 21 facing the carrier 11 is embedded with a mesh gasket 4, and the mesh gasket 4 is embedded in the press-fit seat 21 A plurality of grid areas 213 are formed on the surface, and each grid area 213 corresponds to a wafer to be tested. The pressing seat 21 is also provided with a plurality of positioning columns 211, and the metal carrier plate 3 is also provided with a plurality of corresponding holes 31. When the press-fit seat 21 is pressed onto the stage 11, the positioning column 211 will be located in the corresponding hole 31, and the mesh gasket 4 will be in contact with the metal carrier plate 3, so that each grid area 213 corresponds to a test wafer and forms an independent sealed space. In this way, the correct high pressure and three temperature (high temperature, room temperature and low temperature) test environment can be maintained during the test operation.

In order to provide a three-temperature test environment in the present invention, the stage 11 is a temperature control seat, which can be connected to an external temperature control device through an internal pipeline to precisely control the temperature, and then synchronously control the temperature of the metal carrier plate 3 set on it. , to provide the required three-temperature (high temperature, room temperature and low temperature) test environment. In addition, the press-fit seat 21 is further provided with a plurality of test units 22 , each of the test units 22 is distributed in one of the grid areas 213 , and the test units 22 include at least one air hole 221 and a probe set 223 . The probe set 223 is composed of several probes, and the probe set 223 provides electrical contact during testing. The air hole 221 can be connected to an external air supply device to provide a high-pressure environment during the test or release the high-pressure state in due course. In this embodiment, the press-fit seat 21 is provided with an air inlet 224 and an air outlet 225, and a pipeline is provided inside the press-fit seat 21 to connect with the air holes 221, and the air inlet 224 is used for connecting external air supply equipment. , to generate high pressure or timely release air and pressure, and the air outlet 225 is connected to an instrument to confirm the pressure value during operation. In addition, of course, the bearing assembly 1 and the pressing assembly 2 can be installed on a rotating machine platform to provide another rotating test mode during testing.

In addition, the present invention also includes two sets of fastening components 5, the fastening components 5 are respectively located on the opposite sides of the bearing component 1 and the pressing component 2, and the fastening components 5 can be connected between the pressing component 2 and the bearing component 2. Component 1 is locked after being combined, and the sealing state during pressing is further confirmed. Since the fastening component 5 can be implemented in many different ways, the present invention only illustrates one of them. In this embodiment, there are two sets of fastening components 5 . Each set of fastening components 5 includes a pneumatic cylinder 51 , a locking member 52 and a mating post 53 . The pneumatic cylinder 51 and the clamping Components 52 are mounted on the carrier assembly 1 and located on both sides of the platform 11 (as shown in FIG. 1 ). A plurality of mating posts 53 are disposed on the bottom of the pressing assembly 2 and located on both sides of the pressing seat 21 . The pneumatic cylinder 51 is responsible for pushing the locking part 52 to move back and forth. A plurality of guide grooves 521 are formed on the sidewall of the clamping member 52 , and the guide grooves 521 are L-shaped, wherein the transverse slide grooves have a slope. In this embodiment, there are three guide slots 521 on each side wall, and three matching posts 53 , and the positions of the matching posts 53 correspond to the guide slots 521 .

When the pressing assembly 2 is pressed down, the pairing column 53 will enter through the vertical opening of the guide groove 521, and then gradually descend to the bottom point, and the clamping part 52 will be driven by the pneumatic cylinder 51 to move linearly, so that the pairing The combined column 53 enters the transverse chute of the guide groove 521. Since the transverse chute has an inclined surface, the net-like dense pad 4 will be further pressed on the metal carrier plate 3 during the movement of the clamping part 52 to achieve Better sealing effect, and also make the pressing component 2 and the bearing component 1 inseparable.

As shown in FIG. 4 , the central area of the metal carrier plate 3 protrudes and forms several troughs 301 , and the troughs 301 are surrounded by a flat grid-shaped contact surface 302 . The trough 301 is for a wafer 6 to be tested to be placed therein. After the wafer 6 is placed, the contacts 61 for electrical contact face up. In addition, the corresponding holes 31 are distributed in the grid-like contact surface 302 , which are used for matching the positioning posts 211 . The bottom of the metal carrier plate 3 is a flat surface, which is in contact with the stage 11 through the flat surface, so as to facilitate rapid heating or cooling. The metal carrier plate 3 adopts a contact heat transfer method to rapidly heat up or cool down, so that the wafer 6 to be tested reaches a required test temperature.

As shown in Figures 2 and 3, the mesh sealing gasket 4 is embedded on the surface of the pressing seat 21, and its structure is shown in Figures 4, 5, 6 and 7. In the structures of Figures 4 to 7, and The probes of the probe set 223 are not shown. A mesh groove 212 is formed on the surface of the pressing seat 21, and the mesh groove 212 forms a plurality of grid areas 213 on the bottom surface of the pressing seat 21, and each grid area 213 corresponds to a wafer to be tested. An air hole 221 and a probe set 223 of a test unit 22 are located in a grid area 213 . The positioning posts 211 are distributed in the mesh groove 212 , and the mesh sealing gasket 4 also has a plurality of positioning holes 41 , and the positioning posts 211 are also located in the positioning holes 41 after assembly.

As shown in Fig. 6, Fig. 7 and Fig. 8, the opening size of the longitudinal dimension of the mesh groove 212 is smaller than the depth dimension of the groove, so that the mesh gasket 4 is not easy to insert after being embedded in the mesh groove 212. Fall off again. In order to further enhance the firmness and sealing performance, an adhesive 23 can be filled into the depth of the mesh groove 212 before assembly, and the adhesive 23 can be silicone. When the mesh gasket 4 is embedded in the mesh groove 212, the adhesive 23 will fill up other spaces in the mesh groove 212, and make the mesh gasket 4 partially protrude out of the opening. . In this way, during the pressing process, the exposed mesh sealing gasket 4 is deformed to achieve a good sealing effect.

Based on the above, the present invention utilizes the mesh gasket 4 embedded on the surface of the pressing seat 21. During the pressing process, the lattice contact surface 302 between the mesh gasket 4 and the metal carrier 3 In close contact, the wafers 6 to be tested in each of the troughs 301 form an independent airtight space, and then the air holes 221 of the test unit 22 in the grid area 213 maintain a high-pressure gas supply to ensure the maintenance of the airtight space. High pressure environment, thereby meeting the requirements of the required test environment.

Referring to FIG. 9 and FIG. 10 , it is another embodiment of the metal carrier 3 of the present invention. In this embodiment, the metal carrier plate 3 includes an outer frame 32 and a plurality of cylindrical supporting parts 33 as a whole, and the plurality of supporting parts 33 are all arranged in the outer frame 32 . Two connecting bars 38 are integrally formed on the side wall of each supporting member 33 , and the two connecting bars 38 are arranged at intervals along the circumferential direction of the supporting member 33 . Two connecting grooves 36 are formed on the side wall of the bearing member 33 for the clamping of the connecting bars 38 , the connecting bars 38 are dovetail bars, and the connecting grooves 36 are dovetail grooves. The inner wall of the outer frame 32 is provided with a slot 37 for connecting the connecting strip 38. The slot 37 is a dovetail groove, and the inner wall of the outer frame 32 is integrally formed with a locking block 35, which is a dovetail block. The bearing member 33 is spliced with each other through the connecting strip 38 and the connecting groove 36 to improve the stability of the bearing member 33 . The connecting strip 38 on the carrier 33 snaps into the slot 37 on the outer frame 32, and the block 35 on the outer frame 32 snaps into the connecting groove 36 on the carrier 33 to connect the outer frame 32 to the carrier 33, The outer frame 32 is used to block the inclination of the supporting parts 33, so as to further improve the stability of the supporting parts 33 after they are spliced together. At the same time, when a single carrier 33 is damaged and needs to be replaced, the carrier 33 can be separated and replaced without replacing the entire metal carrier 3 .

Referring to FIG. 9 and FIG. 10 , a seal 34 is provided inside the outer frame 32 , and the seal 34 seals the gap between the carrier 33 and the outer frame 32 to improve the airtightness of the metal carrier 3 . After the sealing member 34 is snapped into the outer frame 32, the sealing member 34 is fixed in the outer frame 32 with screws, etc., the bearing member 33 is arranged on the sealing member 34, and the outer frame 32 can be carried together with the bearing member 33 and the sealing member 34. Handling is convenient for carrying the metal tray 3 . The sealing element 34 is snapped into the gap between the bearing elements 33 to block the relative sliding between the bearing elements 33 and further improve the connection stability of the bearing elements 33 .

The implementation principle of this embodiment is as follows: first arrange the carrier 33 on the sealing member 34, connect the plurality of carrier 33 to each other through the connecting strip 38 and the connecting groove 36 on the carrier 33, and then set the outer frame 32 on the On the seal 34, and fix the seal 34 in the outer frame 32. When the bearing part 33 is damaged, the bearing part 33 is removed from the sealing part 34, and the intact bearing part 33 is reset, and then it can continue to be put into use.

The above are only preferred embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. That is, all equivalent changes and modifications made according to the patent scope of the present invention are covered by the patent scope of the present invention.

1: Carrying components

11: Carrier

2: Pressing components

224: air intake

225: Vent

3: metal tray

31: Corresponding hole

5: Fastening components

51: Pneumatic cylinder

52: card parts

521: guide groove

53: Composite column

Claims (10)

A multi-cavity test seat structure, comprising: a metal carrier, carrying a plurality of wafers to be tested; a carrier component, including a carrier, the metal carrier is mounted on the carrier in a contact manner; a pressing component, It includes a press-fit seat, which is located at the bottom of the press-fit assembly; it is characterized in that: a mesh gasket is embedded on the surface of the press-fit seat facing the carrier, and the mesh gasket is placed on the press-fit seat A plurality of grid areas are formed on the surface, and the pressing seat is also provided with a plurality of positioning columns, and a plurality of corresponding holes are also provided on the metal carrier plate. When the pressing seat is pressed on the carrier, the positioning columns It is located in the corresponding hole, and the mesh sealing gasket is in contact with the metal carrier plate, so that each grid area corresponds to a wafer to be tested and forms an independent closed space. According to the multi-cavity test seat structure described in Claim 1, a mesh groove is formed on the surface of the pressing seat, and the mesh sealing gasket is embedded in the mesh groove. According to the multi-cavity test socket structure described in claim 2, the positioning column is arranged in the mesh groove. According to the multi-cavity test seat structure described in claim 2, the mesh sealing gasket has several positioning holes, and when the mesh sealing gasket is embedded in the mesh groove, the positioning column is located in the positioning holes. According to the multi-cavity test socket structure described in claim 2, the longitudinal opening size of the mesh groove is smaller than the depth size of the groove. According to the multi-cavity test seat structure described in claim 5, the depth of the mesh groove is additionally provided with an adhesive, and the mesh sealing gasket is embedded in the mesh groove, and the mesh is filled with the adhesive Other spaces in the shaped groove, and make the mesh sealing gasket partially protrude out of the opening. According to the multi-cavity test seat structure described in Claim 1, the carrier is a temperature-controlled carrier, which can control the temperature of the metal carrier plate arranged on it. According to the multi-cavity test seat structure described in claim 1, the press-fit seat is provided with an array of test units, and each group of test units is distributed in one grid area, and the test unit includes at least one air inlet and a probe group, the test unit provides the high voltage state and electrical contact required in the test environment. The multi-cavity test socket structure as described in claim 1 further includes two sets of fastening components, which are respectively located on the opposite sides of the bearing component and the pressing component, and the fastening components can be connected between the pressing component and the pressing component. The load-carrying components are combined and locked. According to the multi-cavity test seat structure described in claim 1, the metal carrier plate includes an outer frame and a plurality of supporting parts, and a plurality of the supporting parts are arranged in the outer frame, and the side walls of the supporting parts are provided with multiple A connecting strip, the side wall of the supporting part is replaced with a plurality of connecting grooves for the connecting bar to be clamped at intervals, and a sealing member for closing the gap between the supporting parts is provided in the outer frame.

Images