TW202340726A - Multi-cavity test base structure capable of satisfying the specific pressure and temperature condition required for each cavity during testing - Google Patents

Abstract

A multi-cavity test base structure includes: a metal carrier plate, which carries a plurality of chips to be tested; a carrier component, which includes a carrier platform on which the metal carrier plate is mounted in a contact manner; and a pressure-fitting assembly, which includes a pressure-fitting base disposed at the bottom of the pressure-fitting assembly. The surface of the pressure-fitting base that faces the carrier platform is embedded with a mesh sealing gasket. The mesh sealing gasket is formed with a plurality of grid areas on the surface of the pressure-fitting base. The pressure-fitting base is also provided with a plurality of positioning posts. The metal carrier plate is also provided with a plurality of corresponding holes. When the pressure-fitting base is pressed on the carrier platform, the positioning posts are disposed in the corresponding holes, and the mesh sealing gasket is in contact with the metal carrier plate, so that each grid area corresponds to one chip to be tested and an independent closed space is formed, thereby satisfying the specific pressure and temperature condition required for each cavity during testing.

Description

Multi-cavity test seat structure

The invention is in the technical field of conducting three-temperature (high temperature, room temperature and low temperature) and high-voltage testing of wafers, and particularly relates to a multi-cavity test seat structure.

After the wafer is produced, it needs to be tested, including testing in three-temperature environments of high temperature, room temperature and low temperature, and high-pressure conditions. The wafer must also be rotated during the process to meet actual needs. Usually, multiple wafers to be tested are carried on a metal carrier. In the pressurized state, a closed space is formed between a pressing unit and the metal carrier, and multiple wafers are tested in the same closed space. However, the high pressure and three-temperature test environment applied during the test sometimes still cannot achieve a good sealing effect, and when some chips require higher test pressure, this requirement cannot be met, which affects the quality of the test. Accuracy.

In order to solve the above-mentioned problems, the main purpose of the present invention is to provide a multi-cavity test seat structure, which mainly allows each material slot of the metal carrier to form an independent closed space during the test process, so that under three-temperature test conditions , and can also increase the required test pressure to comply with the required test conditions.

In order to achieve the aforementioned objectives, the present invention adopts the following technical solutions:

The invention is a multi-cavity test seat structure, which includes: a metal carrier plate, which carries a plurality of wafers to be tested; a carrier component, which includes a carrier platform, and the metal carrier plate is mounted on the carrier platform in a contact manner; The press-fitting component includes a press-fit seat, which is located at the bottom of the press-fit component. A mesh sealing gasket is embedded in the surface of the press-fit seat facing the carrier. The mesh sealing gasket is mounted on the press-fit seat A plurality of grid areas are formed on the surface. The press-fitting seat is also provided with several positioning posts. The metal carrier plate is also provided with several corresponding holes. When the press-fitting seat is pressed onto the carrier, the positioning posts are located on the In the corresponding hole, the mesh sealing gasket is in contact with the metal carrier, so that each mesh area corresponds to a wafer to be tested and forms an independent closed space.

By adopting the above technical solution, the wafer is placed in an independent closed space for testing, which facilitates maintaining a high-temperature and high-pressure environment in a smaller space and improves the accuracy of the test.

As one of the better preferred embodiments, the surface of the pressure-fitting seat forms a mesh groove, and the mesh sealing gasket is embedded in the mesh groove;

By adopting the above technical solution, the mesh sealing gasket further improves the sealing effect between the pressing seat and the carrier, making it easier to form a high-temperature and high-pressure environment in the closed space of the metal carrier.

As one of the better preferred embodiments, the positioning post is disposed in the mesh groove.

By adopting the above technical solution, the positioning column improves the positioning accuracy between the press-fitting seat and the carrier, while minimizing the impact on the sealing effect of the mesh gasket and maintaining high accuracy when the press-fitting seat and the carrier are pressed together. and high air tightness.

As one of the better preferred embodiments, the mesh sealing gasket has several positioning holes. When the mesh sealing gasket is embedded in the mesh groove, the positioning post is located in the positioning holes.

By adopting the above technical solution, the positioning holes are used to position the mesh sealing gasket on the pressing seat, thereby improving the positioning accuracy of the mesh gasket. At the same time, the positioning holes play a role in giving way, reducing the impact of the positioning columns on the sealing effect of the mesh gasket, and ensuring the sealing effect of the mesh gasket.

As one of the better preferred embodiments, the longitudinal opening size of the mesh groove is smaller than the depth size of the groove.

By adopting the above technical solution, the stability of the mesh sealing gasket in the mesh groove is improved.

As one of the better preferred embodiments, an adhesive is provided at the depth of the mesh groove. When the mesh sealing gasket is embedded in the mesh groove, the adhesive fills up other parts of the mesh groove. space, and the mesh sealing gasket is partially protruded outside the opening.

By adopting the above technical solution, the adhesive improves the tightness of the mesh seal during the pressurization process.

As one of the preferred embodiments, the carrier is a temperature-controlled carrier that can control the temperature of the metal carrier disposed on it.

By adopting the above technical solution, it is convenient to adjust the temperature of the carrier platform, and thus to facilitate the adjustment of the temperature of the metal carrier disk, and to facilitate the control of the test environment in the metal carrier disk.

As one of the better preferred embodiments, the pressure-fitting seat is provided with an array of test units and is distributed in an array. Each group of test units is distributed in one of the grid areas. The test unit includes at least one air inlet and a probe. The test unit provides the high voltage state and electrical contacts required in the test environment.

By adopting the above technical solution, each wafer under test in the metal carrier is conveniently detected, and the detection accuracy of the wafer under test is improved.

As one of the better preferred embodiments, it also includes two sets of fastening components, respectively located on opposite sides of the load-bearing component and the pressure-fitting component. The fastening components can be used after the pressure-fitting component and the load-bearing component are combined. Lock.

By adopting the above technical solution, the buckling component is used to clamp the pressing component and the load-bearing component, preventing the pressing component from being separated from the load-bearing component when a high-temperature and high-pressure environment is created in the load-bearing component, thereby lifting the pressing component. The stability of the connection between the component and this load-bearing component.

As one of the better preferred embodiments, the metal carrier plate includes an outer frame and a plurality of bearing members. The plurality of bearing members are arranged in the outer frame. A plurality of connecting strips are spaced on the side walls of the bearing member. A plurality of connecting grooves are provided at intervals on the side walls of the bearing members for the connecting strips to engage, and seals for closing the gaps between the bearing members are provided in the outer frame.

By adopting the above technical solution, the bearing member can be taken out from the outer frame, making it easy to replace the bearing member. When the bearing member is damaged, the bearing member can be easily replaced, thereby reducing production costs. The seal is used to further improve the sealing effect, support and limit the bearing parts, and improve the connection stability between the bearing parts.

Compared with the prior art, the present invention has the following specific effects: 1. This invention uses a mesh seal to provide an independent sealed space for each wafer to be tested during testing, ensuring that a high-pressure, three-temperature testing environment is maintained. 2. The present invention uses a mesh sealing gasket to provide an independent sealed space for each wafer to be tested during testing. Together with the combination of positioning posts and corresponding holes, it can withstand higher pressure testing environments, such as pressures up to 1500kpa. 3. The present invention utilizes the longitudinal opening size of the mesh groove of the pressure-fitting seat to be smaller than the depth of the groove. After the mesh sealing gasket is embedded in the mesh groove, it is not easy to separate, thereby reducing the possibility of falling off during long-term operation. Failure problem.

The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments and drawings. It should be noted that when an element is referred to as being "mounted or secured to" another element, it means that it can be directly on the other element or intervening elements may also be present. When an element is said to be "connected" to another element, this means that it can be directly connected to the other element or that intervening elements may also be present. In the illustrated embodiment, directions indicating up, down, left, right, front and back, etc. are relative and are used to explain that the structure and movement of different components in this case are relative. These representations are appropriate when the parts are in the position shown in the figures. However, if the description of a component's location changes, it is assumed that these representations will change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein is for the purpose of describing specific embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in Figures 1, 2 and 3, a multi-cavity test seat structure of the present invention includes: a bearing component 1, a pressing component 2, a metal carrier plate 3 and a mesh sealing gasket 4. The carrier assembly 1 includes a carrier 11 on which the metal carrier 3 is mounted in a contact manner. The pressing assembly 2 includes a pressing seat 21, which is located at the bottom of the pressing assembly 2. A mesh seal 4 is embedded in the surface of the pressing seat 21 facing the carrier 11. A plurality of grid areas 213 are formed in the sealing gasket 4 on the surface of the pressing seat 21. Each grid area 213 corresponds to a wafer to be tested. The pressing seat 21 is also provided with a plurality of positioning posts 211. The metal carrier 3 It is also provided with a plurality of corresponding holes 31. When the pressing seat 21 is pressed on the carrier 11, the positioning post 211 will be located in the corresponding hole 31, and the mesh sealing gasket 4 and the metal carrier are 3 contacts, so that each grid area 213 corresponds to a test wafer and forms an independent sealed space. In this way, the correct high-pressure and three-temperature (high temperature, room temperature and low temperature) test environment can be maintained during the test operation.

In order to provide a three-temperature test environment, the stage 11 is a temperature control seat, which can be connected to external temperature control equipment through internal pipelines to accurately control the temperature, and then synchronously control the temperature of the metal carrier 3 installed on it. , providing the required three-temperature (high temperature, room temperature and low temperature) testing environment. In addition, the pressure-fitting seat 21 is provided with a plurality of groups of test units 22 , and each of the test units 22 is distributed in one of the grid areas 213 . The test units 22 include at least one air hole 221 and a probe group 223 . The probe set 223 is composed of several probes, and the probe set 223 provides electrical contact during testing. The air hole 221 can be connected to external air supply equipment to provide a high-pressure environment during testing or to relieve the high-pressure state in a timely manner. In this embodiment, the pressure-fitting seat 21 is provided with an air inlet hole 224 and an air outlet hole 225. The inside of the pressure-fitting seat 21 is provided with pipelines connected to the air holes 221. The air inlet hole 224 is used to connect external air supply equipment. , to generate high pressure or to release air and pressure in a timely manner. The air outlet 225 is connected to an instrument to confirm the pressure value during operation. In addition, of course, the load-bearing component 1 and the pressing component 2 can be installed on a rotating machine platform to provide another rotation testing mode during testing.

In addition, the present invention also includes two sets of fastening components 5. The fastening components 5 are respectively located on opposite sides of the load-bearing component 1 and the pressing component 2. The fastening components 5 can be connected between the pressing component 2 and the load-bearing component 2. Component 1 is locked after being combined to further confirm the sealing state during pressing. Since the fastening component 5 can be implemented in many different ways, only one of them will be described in the present invention. In this embodiment, the fastening component 5 is provided with two groups. Each set of fastening components 5 includes a pneumatic cylinder 51 , a clamping component 52 and a coupling post 53 . The pneumatic cylinder 51 and the clamping member 52 are installed on the carrying component 1 and are located on both sides of the carrier 11 (as shown in Figure 1). A plurality of matching posts 33 are provided at the bottom of the pressing assembly 2 and located on both sides of the pressing seat 21 . The pneumatic cylinder 51 is responsible for pushing the clamping member 52 to move back and forth. A plurality of guide grooves 521 are formed on the side wall of the clamping member 52. The guide grooves 521 are L-shaped, and the transverse slide grooves have a slope. In this embodiment, the number of the guide grooves 521 on each side wall is three, and the number of the coupling posts 53 is also three. The position of the coupling 53 corresponds to the guide groove 521 .

When the pressing assembly 2 is pressed down, the coupling column 53 will enter through the vertical opening of the guide groove 521, and then gradually descend to the bottom point, and the pneumatic cylinder 51 will drive the clamping member 52 to move linearly, so that the pair The closing column 53 enters the transverse chute of the guide groove 521. Since the transverse chute has a slope, during the movement of the clamping member 52, the mesh gasket 4 will be further pressed on the metal carrier plate 3 to achieve The sealing effect is better and the pressing component 2 and the bearing component 1 cannot be separated.

As shown in FIG. 4 , the central area of the metal carrier 3 is convex and forms several troughs 32 , and the trough 31 is surrounded by a flat grid-shaped contact surface 33 . The trough 32 is for placing a wafer 6 to be tested. The wafer under test 6 is placed with its contacts 61 for electrical contact facing upward. In addition, the corresponding holes 31 are distributed in the grid-shaped contact surface 33 for matching the positioning post 211 . The bottom of the metal carrier 3 is a flat surface, and the flat surface is in contact with the carrier 11 to facilitate rapid heating or cooling. The metal carrier 3 uses contact heat transfer to quickly heat up or cool down, thereby allowing the wafer to be tested 6 to reach the required test temperature.

As shown in Figures 2 and 3, the mesh sealing gasket 4 is embedded on the surface of the pressure-fitting seat 21, and its structure is shown in Figures 4, 5, 6 and 7. In the structures of Figures 4 to 7, The probes of the probe set 223 are not shown. A mesh groove 212 is formed on the surface of the pressing seat 21. The mesh groove 212 forms a plurality of grid areas 213 on the bottom surface of the pressing seat 21. Each grid area 213 corresponds to a wafer to be tested. Each of the aforementioned grid areas 213 corresponds to a wafer to be tested. An air hole 221 and a probe set 223 of the test unit 22 are located in a grid area 213 . The positioning posts 211 are distributed in the mesh groove 212. In addition, the mesh seal 4 also has a plurality of positioning holes 41. After assembly, the positioning posts 211 are also located in the positioning holes 41.

As shown in Figures 6, 7 and 8, the opening size of the longitudinal dimension of the mesh groove 212 is smaller than the depth of the groove. This design makes it difficult for the mesh seal 4 to be embedded in the mesh groove 212. Fall off again. In order to further improve the firmness and sealing performance, adhesive 23 can be filled into the depth of the mesh groove 212 before assembly. The adhesive 23 can be silicone. When the mesh seal 4 is embedded in the mesh groove 212 , the adhesive 23 will fill up other spaces in the mesh groove 212 and make the mesh seal 4 partially protrude outside the opening. . Thereby, during the pressing process, the exposed mesh gasket 4 can be deformed to achieve a good sealing effect.

In summary, the present invention utilizes the mesh sealing gasket 4 embedded on the surface of the pressing seat 21. During the pressing process, the grid-shaped contact surface 33 between the mesh sealing gasket 4 and the metal carrier 3 Close contact allows the wafers 6 to be tested in each trough 32 to form an independent sealed space, and then maintain high-pressure air supply from the air holes 221 of the test unit 22 in the grid area 213 to ensure that the sealed space is maintained. High-pressure environment to meet the required test environment requirements.

Referring to Figures 9 and 10, another embodiment of the metal carrier 3 of the present invention is shown. In this embodiment, the metal carrier 3 includes an outer frame 32 and a plurality of cylindrical bearing members 33 . The plurality of bearing members 33 are all arranged in the outer frame 32 . Two connecting bars 38 are integrally formed on the side wall of each bearing member 33 , and the two connecting bars 38 are spaced apart along the circumferential direction of the bearing member 33 . Two connecting grooves 36 are provided on the side wall of the bearing member 33 for the connecting bars 38 to be engaged. The connecting bars 38 are dovetail bars, and the connecting grooves 36 are dovetail grooves. The inner wall of the outer frame 32 is provided with a clamping slot 37 for the connecting strip 38 to be clamped. The clamping slot 37 is a dovetail groove, and the inner wall of the outer frame 32 is integrally formed with a clamping block 35. The clamping block 35 is a dovetail block. The bearing parts 33 are connected to each other through the connecting blocks and the connecting grooves 36 to improve the stability of the bearing part 33. The connecting strip 38 on the bearing member 33 snaps into the slot 37 on the outer frame 32, and the clamping block 35 on the outer frame 32 snaps into the connecting slot 36 on the bearing member 33 to connect the outer frame 32 to the bearing member 33. The outer frame 32 is used to block the tilt of the load-bearing parts 33, further improving the stability of the load-bearing parts 33 after they are spliced together. At the same time, when a single bearing member 33 needs to be replaced after being damaged, the bearing member 33 can be separated and replaced separately, without replacing the entire metal carrier plate 3 .

Referring to FIGS. 9 and 10 , a seal 34 is provided inside the outer frame 32 . The seal 34 seals the gap between the carrier 33 and the outer frame 32 to improve the airtightness of the metal carrier 3 . After the sealing member 34 is inserted into the outer frame 32, the sealing member 34 is fixed in the outer frame 32 using screws, etc., and the bearing member 33 is set on the sealing member 34. The outer frame 32 can be carried with the bearing member 33 and the sealing member 34. It is convenient to transport the metal carrier 3. The sealing member 34 snaps into the gap between the bearing members 33 to block the relative sliding between the bearing members 33 and further improves the connection stability of the bearing members 33.

The implementation principle of this embodiment is: first arrange the bearing members 33 on the sealing member 34, connect multiple bearing members 33 to each other through the connecting strips 38 and the connecting grooves 36 on the bearing member 33, and then set the outer frame 32 on on the sealing member 34, and fix the sealing member 34 in the outer frame 32. When the bearing member 33 is damaged, the bearing member 33 is removed from the sealing member 34 and the intact bearing member 33 is reinstalled, so that the bearing member 33 can continue to be put into use.

The above are only preferred embodiments of the present invention and are not intended to limit the scope of the embodiments of the present invention. That is to say, all equivalent changes and modifications made in accordance with the patentable scope of the present invention are covered by the patentable scope of the present invention.

1: Bearing component 11: Carrier platform 2: Pressed components 21: Press fit seat 211: Positioning column 212: Mesh groove 213:Grid area 22:Test unit 221:Stomata 223:Probe set 224:Air intake hole 225: vent 23: Adhesive 3:Metal carrier plate 31: Corresponding hole 32:Outer frame 33: Bearing part 34:Seals 35: card block 36:Connection slot 37:Card slot 38:Connection slot 4: Mesh gasket 5: Fastening components 51:Pneumatic cylinder 52: Card parts 521:Guide groove 53: Column 6: Chip to be tested 61:Contact

Figure 1 is an exploded view of the multi-cavity test seat structure of the present invention.

FIG. 2 is a schematic structural diagram of the pressing assembly of the multi-cavity test seat structure of the present invention from an upward view.

Figure 3 is a partial enlarged view of Figure 2.

FIG. 4 is a schematic diagram of the first embodiment of the metal carrier plate of the multi-cavity test base structure of the present invention.

Figure 5 is an exploded view of the press-fit seat of the multi-cavity test seat structure of the present invention.

Figure 6 is a top view of the press-fit seat of the multi-cavity test seat structure of the present invention.

FIG. 7 is a cross-sectional view of plane AA in FIG. 6 .

Figure 8 is a partial enlarged view of Figure 7.

Figure 9 is a schematic diagram of a second embodiment of the metal carrier plate of the multi-cavity test base structure of the present invention.

Figure 10 is an exploded view of the second embodiment of the metal carrier plate of the multi-cavity test seat structure of the present invention.

1: Bearing component

11: Carrier platform

2: Pressed components

224:Air intake hole

225: vent

3:Metal carrier plate

31: Corresponding hole

5: Fastening components

51:Pneumatic cylinder

52: Card parts

521:Guide groove

53: Column

Claims (10)

A multi-cavity test seat structure includes: A metal carrier plate carries multiple wafers to be tested; A carrying component includes a carrier platform, and the metal carrier plate is mounted on the carrier platform in a contact manner; A pressing component includes a pressing seat located at the bottom of the pressing component; It is characterized in that: a mesh sealing gasket is embedded in the surface of the pressure-fitting seat facing the stage, and the mesh-like sealing gasket forms a plurality of grid areas on the surface of the pressure-fitting seat. The pressure-fitting seat is also provided with a plurality of grid areas. The positioning post is also provided with a plurality of corresponding holes on the metal carrier plate. When the press-fitting seat is pressed on the carrier platform, the positioning post is located in the corresponding hole, and is connected to the metal carrier by the mesh sealing gasket. Disk contact allows each grid area to correspond to a wafer to be tested and form an independent closed space. As for the multi-cavity test seat structure described in claim 1, a mesh groove is formed on the surface of the pressing seat, and the mesh sealing gasket is embedded in the mesh groove. As for the multi-cavity test seat structure described in claim 2, the positioning post is disposed in the mesh groove. As for the multi-cavity test seat structure described in claim 2, the mesh sealing gasket has a plurality of positioning holes. When the mesh sealing gasket is embedded in the mesh groove, the positioning post is located in the positioning holes. As for the multi-cavity test seat structure described in claim 2, the longitudinal opening size of the mesh groove is smaller than the depth size of the groove. For the multi-cavity test seat structure described in claim 5, the mesh groove is further provided with adhesive, and the mesh sealing gasket is embedded in the mesh groove, and the mesh is filled with the adhesive. other spaces in the groove, and the mesh sealing gasket is partially protruded outside the opening. As for the multi-cavity test seat structure described in claim 1, the carrier is a temperature-controlled carrier that can control the temperature of the metal carrier disposed on it. As for the multi-cavity test seat structure described in claim 1, the press-fit seat is provided with a plurality of test units, and each group of test units is distributed in one of the grid areas. The test unit includes at least one air inlet hole and a probe. The test unit provides the high voltage state and electrical contacts required in the test environment. The multi-cavity test seat structure as described in claim 1 further includes two sets of fastening components, respectively located on opposite sides of the load-bearing component and the pressing component. The fastening component can be between the pressing component and the pressing component. The load-bearing components are locked after being aligned. As for the multi-cavity test seat structure described in claim 1, the metal carrier plate includes an outer frame and a plurality of bearing parts, and a plurality of the bearing parts are arranged in the outer frame, and a plurality of bearing parts are spaced on the side walls of the bearing part. The side wall of the carrier is provided with a plurality of connecting grooves for the connecting bars to be connected. The outer frame is provided with a seal for closing the gap between the carriers.