TWI752498B - Laser module and laser die and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a laser module including a laser die, an optical lens, and a lead frame. The laser die and the optical lens are arranged on the lead frame. The laser die includes an edge emitting laser unit and a reflecting unit. A laser beam provided by the edge emitting laser unit is reflected by the reflecting unit, and the reflected laser beam is transmitted through the optical lens. Besides, a manufacturing method of the laser module is also provided.

Description

Laser module and laser die and manufacturing method thereof

The present invention relates to the field of optics, and in particular, to a laser module, a laser die and a manufacturing method of the laser die.

Because the laser light source has high photoelectric conversion efficiency, and the laser beam output by the laser light source has the optical characteristics of high energy, consistent wavelength, single frequency and good collimation, the laser light source is gradually widely used. Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic cross-sectional conceptual diagram of a partial structure of a conventional laser module, and FIG. 2 is a perspective exploded schematic diagram of a partial structure of the laser module shown in FIG. 1 . The conventional laser module 1 includes an outer casing 10 , an inner casing 11 , a substrate 12 , a laser die 13 , a reflective optical element 15 , a collimating optical element 16 , and a diffractive optical element (DOE) 17 and the ceramic plate 14, the outer casing 10 is used for disposing the diffractive optical element 17 thereon, and the inner casing 11 and the laser die 13 are arranged in the accommodating space of the outer casing 10, wherein the inner casing 11 is used for Fixed reflecting optical element 15 and collimating optical element 16, Therefore, the reflecting optical element 15 and the collimating optical element 16 can be linked through the inner casing 11 .

Furthermore, the substrate 12 is used to carry the laser die 13 , the ceramic plate 14 , the outer casing 10 and the inner casing 11 , and the laser die 13 is disposed on the ceramic plate 14 to be electrically connected to the substrate 12 . After the die 13 receives the power, the laser die 13 can provide a plurality of laser beams L1, and the laser beams L1 will travel in the direction of the reflective optical element 15, and be reflected optically after being projected on the reflective optical element 15. The element 15 reflects and travels in the direction of the collimating optical element 16 and the diffractive optical element 17 . The collimating optical element 16 is used for collimating the laser beam L1 reflected by the reflecting optical element 15, so that the laser beam L1 passing through the collimating optical element 16 is incident on the diffractive optical element in a preferred incident direction 17, and the diffractive optical element 17 is used to shape the laser beam L1 passing through the collimating optical element 16 and output it to the outside.

Next, an assembling method of the laser module 1 will be described. The packaging method of the laser module 1 includes: step S11, fixing the laser die 13 on the ceramic plate 14; step S12, using the inner casing 11 to fix the reflective optical element 15 and the collimating optical element 16, so that the reflective optical element 15 and the collimating optical element 16 are fixed. The element 15 and the collimating optical element 16 are aligned; step S13, the reflective optical element 15 in the inner casing 11 is aligned with the laser die 13 by moving and fixing the inner casing 11; and step S14, setting the outer casing 10 The inner casing 11 is sleeved on the substrate 12 , wherein the diffractive optical element 17 can be placed and fixed on the outer casing 10 after the outer casing 10 is fixed, or before the outer casing 10 is fixed. It is placed and fixed on the outer casing 10 first.

It is particularly noted that, based on the above-mentioned assembling method, the relative positional relationship between the laser die 13 and the reflective optical element 15 and the relative positional relationship between the reflective optical element 15 and the collimating optical element 16 can meet the requirements of the industry in the past. position accuracy requirements. However, in the use of the laser module 1 in the past, the relative positional relationship between the diffractive optical element 17 and the collimating optical element 16 needs to satisfy a relatively low positioning accuracy, so in the process of assembling the laser module 1 , the outer casing 10 carrying the diffractive optical element 17 only needs to be fixed according to the principle of not being relatively skewed with the substrate 12 , so that the appearance of the laser module 1 can be maintained, thereby helping the laser module 1 When mounted to an electronic device, it does not interfere with adjacent components or mechanisms in the electronic device.

However, with the evolution of the electronic industry and the vigorous development of industrial technology, the design and development of various electronic devices have been developed in the direction of being extremely lightweight and easy to carry. Therefore, the manufacturing accuracy and assembly accuracy of the conventional laser module 1 can no longer meet the current requirements. demand. To be more specific, the conventional laser module 1 has the following disadvantages: (1) the components are too many, which not only increases the complexity of the assembly, but also becomes a barrier to improve the assembly accuracy; (2) the laser output from the laser die 13 The optical axis A11 of the incident beam L1 may not be parallel to the substrate 12 due to the limitation of the manufacturing process, and since most of the reflective optical elements 15 are manufactured with an inclination angle θ1 of 45 degrees, even in the laser module Aligning the laser die 13 with the reflective optical element 15 during the assembly process of It has poor optical power; (3) the collimating optical element 16 and the diffractive optical element 17 are both limited by the fact that they are made by injection molding, resulting in a manufacturing tolerance of more than tens of micrometers (μm); (4) the substrate 12 Most of them use a flexible circuit board, which is not conducive to the positioning and installation of the laser die 13 and leads to a poor heat dissipation effect. Therefore, a substrate 12 made of ceramic material is proposed. Although the substrate 12 made of ceramic material can improve the laser module 1 The heat dissipation capacity is high, but the problem of easy cracking occurs.

According to the above description, the conventional laser module has room for improvement.

One of the first objectives of the present invention is to provide a laser module that utilizes a lead frame to carry laser chips and optical lenses.

A second object of the present invention is to provide a laser die having an edge-emitting laser unit and a reflection unit.

A third object of the present invention is to provide a method for manufacturing a laser die having an edge-emitting laser unit and a reflection unit.

A fourth object of the present invention is to provide a manufacturing method of a laser module based on Active Alignment.

In a preferred embodiment, the present invention provides a laser module, comprising: a laser die for outputting a laser beam; at least one optical lens for allowing the laser beam to pass through and project outwards ; And a lead frame, comprising a substrate and a frame, and the frame is connected to the substrate and has at least one alignment structure; wherein, the laser die is electrically connected to the substrate, and the at least one The optical lens is mounted on the frame through the at least one pair of alignment structures.

In a preferred embodiment, the frame includes a plurality of walls, and the inner surfaces of the walls respectively have at least one stepped structure, and the stepped structures together form the at least one pair structure with at least one accommodating space ; wherein, the at least one accommodating space is used for accommodating the at least one optical lens.

In a preferred embodiment, the at least one pair of bit structures includes a first an alignment structure, the at least one stepped structure includes a first stepped structure, and the at least one accommodating space includes a first accommodating space; wherein, the first stepped structures together form a space having the first accommodating space The first alignment structure.

In a preferred embodiment, the at least one alignment structure further includes a second alignment structure, the at least one stepped structure further includes a second stepped structure, and the at least one accommodating space further includes a second accommodating space. an accommodating space; wherein, the second step structures together form the second aligning structure having the second accommodating space, and the second aligning structure is located below the first aligning structure.

In a preferred embodiment, at least part of the walls of the frame each have an exhaust hole, and at least part of the thermal energy generated by the laser die is discharged through the exhaust hole.

In a preferred embodiment, the substrate of the lead frame is a metal substrate.

In a preferred embodiment, the lead frame is formed through at least a masking process, an etching process and a molding process.

In a preferred embodiment, the at least one optical lens includes a diffractive optical element (DOE) for beam shaping the laser beam passing therethrough, so that the laser beam forms a Structured light.

In a preferred embodiment, the diffractive optical element is formed through an imprint process.

In a preferred embodiment, the diffractive optical element is a monolithic lens formed by imprinting a liquid material and curing by ultraviolet (UV); or the at least one optical lens further comprises a monolithic lens. A light-transmitting substrate, And the diffractive optical element is formed on the transparent substrate through the imprinting process.

In a preferred embodiment, the at least one optical lens further includes a collimating optical element disposed between the laser die and the diffractive optical element for collimating the collimating optical element through the collimating optical element. laser beam.

In a preferred embodiment, at least one of the diffractive optical element and the collimating optical element is formed through an imprint process.

In a preferred embodiment, the diffractive optical element and the collimating optical element are formed by simultaneously forming a monolithic lens by imprinting a liquid material and curing it by ultraviolet rays (UV); or The at least one optical lens further includes at least one transparent substrate, and at least one of the diffractive optical element and the collimating optical element is formed on the at least transparent substrate through the imprinting process.

In a preferred embodiment, the laser die is an edge emitting laser (EEL) die, which includes an edge emitting laser unit and a reflection unit, and the edge emitting laser The unit is used for generating the laser beam, and the reflecting unit is used for reflecting the laser beam.

In a preferred embodiment, the edge-emitting laser die further includes a stacked material adjacent to the edge-emitting laser unit, and the reflecting unit includes a reflecting slope and one located on the reflecting slope. A reflective layer; wherein, the edge-emitting laser unit and the stacked layered material are formed after a wafer is subjected to a wafer processing process, and the reflective bevel is formed by a micromachining process due to the stacked layered material It is then formed on the build-up laminate.

In a preferred embodiment, the reflective layer is a dielectric coating or a gold coating.

In a preferred embodiment, the reflective unit is processed by a six-axis machine It is manufactured at a specific position and has a specific angle, so that the optical axis of the laser beam reflected by the reflection unit is perpendicular to the at least one optical lens.

In a preferred embodiment, the laser module further includes a reflective optical element disposed on the substrate and in the frame for reflecting the laser beam from the laser die.

In a preferred embodiment, the laser die is a Vertical Cavity Surface Emitting Laser (VCSEL) die.

In a preferred embodiment, the present invention also provides a laser module, comprising: at least one optical lens; a laser die disposed under the at least one optical lens, including: an edge-firing laser unit, for generating a laser beam; and a reflection unit for reflecting the laser beam from the edge-emitting laser unit to make the laser beam travel in the direction of the at least one optical lens; and a carrier for to carry the at least one optical lens and the laser die.

In a preferred embodiment, the laser die further includes a stacked layered material adjacent to the edge-emitting laser unit, and the reflection unit includes a reflection slope and a reflection layer on the reflection slope; Wherein, the edge-emitting laser unit and the stacked material are formed after a wafer is subjected to a wafer processing process, and the reflective slope is formed after the stacked material is subjected to a micromachining process on the stacked laminate.

In a preferred embodiment, the reflective layer is a dielectric coating or a gold coating.

In a preferred embodiment, the reflective unit is processed by a six-axis machine It is manufactured at a specific position and has a specific angle, so that the optical axis of the laser beam reflected by the reflection unit is perpendicular to the at least one optical lens.

In a preferred embodiment, the at least one optical lens includes a diffractive optical element (DOE) for beam shaping the laser beam passing therethrough, so that the laser beam forms a Structured light.

In a preferred embodiment, the diffractive optical element is formed through an imprint process.

In a preferred embodiment, the at least one optical lens further includes a collimating optical element disposed between the laser die and the collimating optical element for collimating the collimating optical element through the collimating optical element. laser beam.

In a preferred embodiment, at least one of the diffractive optical element and the collimating optical element is formed through an imprint process.

In a preferred embodiment, the carrier system is a lead frame, which includes a substrate and a frame, and the frame is connected to the substrate and has at least a pair of alignment structures; wherein the laser die It is electrically connected to the substrate, and the at least one optical lens is mounted on the frame through the at least one pair of alignment structures.

In a preferred embodiment, the frame includes a plurality of walls, and the inner surfaces of the walls respectively have at least one stepped structure, and the stepped structures together form the at least one pair structure with at least one accommodating space ; wherein, the at least one accommodating space is used for accommodating the at least one optical lens.

In a preferred embodiment, the at least one alignment structure includes a first alignment structure, the at least one stepped structure includes a first stepped structure, and the at least one accommodating space includes a first accommodating space; Wherein, the first step structures together form the first alignment structure having the first accommodating space.

In a preferred embodiment, the at least one alignment structure further includes a second alignment structure, the at least one stepped structure further includes a second stepped structure, and the at least one accommodating space further includes a second accommodating space. an accommodating space; wherein, the second step structures together form the second aligning structure having the second accommodating space, and the second aligning structure is located below the first aligning structure.

In a preferred embodiment, the substrate of the lead frame is a metal substrate.

In a preferred embodiment, the carrier has at least one vent hole, and at least part of the thermal energy generated by the laser die is discharged to the outside through the at least one vent hole.

In a preferred embodiment, the present invention also provides a laser die, comprising: an edge-fired laser unit for generating a laser beam; a stacked layered material adjacent to the edge-fired laser unit ; wherein, the edge-emitting laser unit and the stacked laminated material are formed after a wafer is subjected to a wafer processing process; and a reflection unit is used to reflect the laser beam, and includes a reflection slope and A reflective layer located on the reflective slope; wherein, the reflective slope is formed on the stacked stacked material after the stacked stacked material is subjected to a micromachining process.

In a preferred embodiment, the reflective layer is a dielectric coating or a gold coating.

In a preferred embodiment, the reflection unit has a pitch angle, a roll angle and a yaw angle, and the pitch angle, the The roll angle and the yaw angle are used to make the optical axis of the laser beam face a specific direction.

In a preferred embodiment, the present invention also provides a method for manufacturing a laser die, which includes: (a) performing a semiconductor process on a semiconductor substrate to form an edge-emitting laser unit; A stacked laminate material adjacent to one of the laser units; wherein, the edge-emitting laser unit is used to generate a laser beam; (b) a micromachining process is performed on the stacked stacked material to form on the stacked stacked material a reflecting slope; and (c) disposing a reflecting layer on the reflecting slope; wherein, the reflecting layer is used for reflecting the laser beam from the edge-emitting laser unit.

In a preferred embodiment, the step (b) includes: (b1) forming a groove space on the stacked laminated material; (b2) placing a mirror element for reflecting the laser beam into the groove space (b3) Adjusting a setting position and/or a setting angle of the mirror element so that the optical axis of the reflected laser beam faces a specific direction, and according to the setting position and/or the setting angle after the adjustment obtaining an X-axis position, a Y-axis position, a Z-axis position, a pitch angle, a roll angle and/or a yaw angle of the reflection slope; and (b5) in the The reflective slope is formed on the stacking material at the X-axis position, the Y-axis position and/or the Z-axis position and having the pitch angle, the roll angle and/or the yaw angle.

In a preferred embodiment, the reflective layer is formed on the reflective slope through a sputtering process.

In a preferred embodiment, the reflective layer is a dielectric coating or a gold coating.

In a preferred embodiment, the present invention also provides a method for manufacturing a laser module, comprising: (a) disposing a laser die on a carrier; and (b) utilizing an active alignment ) method to dispose at least one optical lens on the carrier so that the laser die and the at least one optical lens are aligned.

In a preferred embodiment, the carrier system is a lead frame, which includes a substrate and a frame connected to the substrate; wherein the laser die is electrically connected to the substrate, and the at least one The optical lens is mounted on the frame by means of the active alignment.

In a preferred embodiment, the at least one optical lens includes a diffractive optical element (DOE) for beam shaping the laser beam passing therethrough, so that the laser beam forms a Structured light.

In a preferred embodiment, the at least one optical lens further includes a collimating optical element disposed between the laser die and the diffractive optical element for collimating the collimating optical element through the collimating optical element. laser beam.

1: Laser module

2A: Laser Module

2B: Laser Module

2C: Laser Module

2D: Laser Module

2E: Laser Module

3: Mirror element

10: Outer shell

11: Inner shell

12: Substrate

13: Laser Die

14: Ceramic plate

15: Reflective optics

16: Collimating optics

17: Diffractive optics

21: Laser Die

21': Laser Die

21": Laser Die

22: Optical lens

23: Lead frame

23': Lead Frame

24: Reflective optics

25: Substrate

26: Outer shell

27: Ceramic plate

29: Wire

211: Edge-fired laser unit

212: Reflective unit

213: Stacked Laminated Materials

214: Recessed space

221: Diffractive Optical Components

221': Diffractive optics

222: Collimating Optics

222': Collimating Optics

223: The first transparent substrate

224: The second transparent substrate

225: light-transmitting substrate

226: Diffractive Optical Elements

227: Collimating Optics

231: Substrate

232: Frame

241: Reflective layer

2121: Reflective Bevel

2122: Reflective layer

2321: Parametric structure

2321’: Parametric structure

2322: Wall

23211: First pair structure

23212: Second Parametric Structure

23221: The first ladder structure

23222: Second Ladder Structure

23223: Vent hole

A11: Optical axis

A12: Optical axis

A21: Optical axis

A22: Optical axis

P1: Steps

P2: Steps

P3: Steps

P4: Steps

P5: Steps

P6: Steps

L1: Laser beam

L2: Laser beam

T1: Step

T2: Steps

Z1: The first part of the semiconductor substrate

Z2: The second part of the semiconductor substrate

θ1: Inclination angle

FIG. 1 is a schematic cross-sectional conceptual diagram of a part of the structure of a conventional laser module.

Fig. 2 is a three-dimensional exploded view of a part of the structure of the laser module shown in Fig. 1 Schematic.

FIG. 3A is a schematic cross-sectional schematic diagram of a partial structure of the laser module of the present invention in a first embodiment.

FIG. 3B is a schematic structural diagram of the diffractive optical element and the collimating optical element shown in FIG. 3A in another embodiment.

FIG. 4 is a schematic diagram of a preferred block flow of the manufacturing method of the laser module of the present invention.

FIG. 5 is a schematic structural conceptual diagram of a side wall of the lead frame shown in FIG. 3A and its exhaust hole.

FIG. 6 is a conceptual schematic top view of the laser die of the laser module shown in FIG. 3A .

FIG. 7 is a schematic block diagram of a preferred block flow of the manufacturing method of the laser chip of the present invention.

FIG. 8A is a schematic diagram of the execution concept of the method shown in FIG. 7 .

FIG. 8B is a schematic diagram of the execution concept of the method shown in FIG. 7 .

FIG. 8C is a schematic diagram of the execution concept of the method shown in FIG. 7 .

FIG. 8D is a schematic diagram of the execution concept of the method shown in FIG. 7 .

FIG. 8E is a schematic diagram of the execution concept of the method shown in FIG. 7 .

FIG. 9 is a schematic cross-sectional conceptual diagram of a partial structure of the laser module of the present invention in a second embodiment.

FIG. 10 is a schematic cross-sectional conceptual diagram of a partial structure of the laser module of the present invention in a third embodiment.

FIG. 11 is a schematic cross-sectional conceptual diagram of a part of the structure of the laser module of the present invention in a fourth embodiment.

FIG. 12 is a schematic cross-sectional conceptual diagram of a partial structure of the laser module of the present invention in a fifth embodiment.

Embodiments of the present invention will be further explained with the help of the related drawings below. Wherever possible, in the drawings and the description, the same reference numbers refer to the same or similar components. In the drawings, shapes and thicknesses may be exaggerated for simplicity and convenience. It should be understood that the elements not particularly shown in the drawings or described in the specification have forms known to those of ordinary skill in the art. Those skilled in the art can make various changes and modifications based on the content of the present invention.

Please refer to FIG. 3A , which is a schematic cross-sectional conceptual diagram of a partial structure of the laser module of the present invention in a first embodiment. The laser module 2A includes a laser die 21 , a plurality of optical lenses 22 and a lead frame 23 , and the lead frame 23 includes a substrate 231 and a frame 232 ; wherein, the substrate 231 is a conductive substrate, and the bottom of the frame 232 is It is connected to the substrate 231 , and the top of the frame 232 has a plurality of alignment structures 2321 , and each optical lens 22 can be mounted on the frame 232 via the corresponding alignment structures 2321 . In addition, the laser die 21 is disposed on the substrate 231 , and is electrically connected to the substrate 231 through wire bonding 29 , and is used for outputting the laser beam L2 after receiving power, and the laser die 21 is The output laser beam L2 is projected outward after passing through the optical lenses 22 . However, the electrical connection between the laser die 21 and the substrate 231 is not limited to the above.

In this preferred embodiment, the optical lenses 22 include diffractive optics The element 221 and the collimating optical element 222, and the collimating optical element 222 is arranged between the laser die 21 and the diffractive optical element 221, for collimating the laser beam L2 passing through the collimating optical element 222, and diffracting the laser beam L2 The optical element 221 is used for beam shaping the laser beam L2 passing through it, so that the laser beam L2 forms structured light and is outputted to the outside, so the laser module 2A can be regarded as a structured light module for providing structured light .

Preferably, but not limited to this, the optical lenses 22 further include a first transparent substrate 223 and a second transparent substrate 224, and the diffractive optical element 221 is formed on the first transparent substrate 221 through an embossing process. The light-transmitting base material 223 is, therefore, the diffractive optical element 221 and the first light-transmitting base material 223 are a single-piece optical element, and the collimating optical element 222 is also formed on the second light-transmitting base material 224 through an embossing process. Therefore, the collimating optical element 222 and the second transparent substrate 224 are also single-piece optical elements.

The above is only one embodiment of manufacturing the diffractive optical element 221 and the collimating optical element 222 , and the manufacturing of the diffractive optical element 221 and the collimating optical element 222 is not limited to the above. Please refer to FIG. 3B , which is a schematic structural conceptual diagram of the diffractive optical element and the collimating optical element shown in FIG. 3A in another embodiment. The diffractive optical element 226 shown in FIG. 3B is a monolithic lens formed by imprinting a liquid material and curing it by ultraviolet (UV) rays, and the liquid material can be epoxy resin, for example. ), similarly, the collimating optical element 227 shown in FIG. 3B can also be a monolithic lens formed by imprinting a liquid material and curing it by ultraviolet (UV).

In addition, in this preferred embodiment, the frame 232 of the lead frame 23 includes a plurality of wall bodies 2322, and the inner surface of each wall body 2322 has a first stepped structure 23221 and a second stepped structure 23222 connected respectively, and the The first stepped structures 23221 of the walls 2322 together form a first alignment having a first accommodating space structure 23211, and the second stepped structures 23222 of the walls 2322 together form a second alignment structure 23212 having a second accommodating space, and the second alignment structure 23212 is located below the first alignment structure 23211.

The first accommodating space of the first alignment structure 23211 is for the first transparent substrate 223 and the diffractive optical element 221 thereon to be placed therein, and the first transparent substrate 223 and the diffractive optical element 221 thereon are placed therein. The optical element 221 is aligned with the laser die 21 and the first alignment structure 23211 by means of Active Alignment, and is then fixed on the first alignment structure 23211 through colloid. In addition, the second accommodating space of the second alignment structure 23212 is for the second transparent substrate 224 and the collimating optical element 222 thereon to be placed, and the second transparent substrate 224 and the collimation optical element 222 thereon are placed therein. The optical element 222 is aligned with the laser die 21 and the second alignment structure 23212 through an active alignment method, and is then fixed on the second alignment structure 23212 through colloid. However, the alignment and fixing methods of the diffractive optical element 221 and the collimating optical element 222 are not limited to the above.

Based on the above description, the present invention provides a manufacturing method of a laser module as shown in FIG. 4 . First, step T1 is performed to set the laser die 21 on the lead frame 23 , and then step T2 is performed to utilize active alignment In the (Active Alignment) method, the optical lens 22 is arranged on the lead frame 23 so that the optical lens 22 is aligned with the laser die 21 .

Please also refer to FIG. 5 , which is a schematic structural conceptual diagram of a side wall of the lead frame and its exhaust hole shown in FIG. 3A . At least part of the wall 2322 of the frame 232 of the lead frame 23 also has an exhaust hole 23223 penetrating the wall 2322, so that at least part of the heat energy generated by the laser die 21 can be discharged through the exhaust hole 23223, which is helpful for Improve the heat dissipation effect of the laser die 21, especially for the high power laser die 21 will be more effective. Preferably, but not limited to this, the substrate 231 of the lead frame 23 is a metal substrate, which can not only improve the heat dissipation capability and structural strength of the laser module 2A, but also provide a flat structure, so that the laser die 21 can be It is precisely arranged on the substrate 231 . In one embodiment, the lead frame 23 is formed through at least a masking process, an etching process and a molding process, so as to improve the manufacturing accuracy of the overall structure. The specific implementation of the above process The method is known to those skilled in the art, so it will not be repeated here.

Furthermore, in this preferred embodiment, the laser die 21 is an edge-emitting laser (EEL) die, which includes an edge-emitting laser unit 211 and a reflection unit 212, and the edge-emitting laser The laser unit 211 is used for generating the laser beam L2, and the reflecting unit 212 is used for reflecting the laser beam L2 from the edge-emitting laser unit 211, so that the laser beam L2 is directed to the collimating optical element 222 and the diffractive optical element 221 direction of travel.

Please also refer to FIG. 6 , which is a conceptual schematic top view of the laser die of the laser module shown in FIG. 3A . The laser die 21 of this preferred embodiment further includes a stacked layered material 213 adjacent to the edge-emitting laser unit 211, and the reflection unit 212 includes a reflection slope 2121 and a reflection layer 2122 on the reflection slope 2121; wherein, The edge-emitting laser unit 211 and the stacking material 213 are formed after a wafer is subjected to a wafer processing process, and the reflective slope 2121 is formed on the stacking after the stacking material 213 is subjected to a micromachining process. on the laminate material 213.

In detail, please refer to FIG. 7 and FIGS. 8A to 8E. FIG. 7 is a schematic block diagram of a preferred block flow of the method for manufacturing a laser die according to the present invention, and FIGS. 8A to 8E respectively illustrate the execution of the method shown in FIG. 7. Concept sketch. First, step P1 is executed to perform a semiconductor process on the semiconductor substrate to form the edge-emitting laser unit 211 and the The edge-emitting laser units 211 are adjacent to the stacked material 213, as shown in FIG. 8A . To be more specific, in this case, the size of the semiconductor substrate required to fabricate each laser die 21 is larger than the size of the semiconductor substrate required for the conventional laser die 21 , that is, in this case, each The semiconductor substrate required for the laser die 21 can be divided into a first part Z1 and a second part Z2 which is expanded and extended. The first part Z1 can form an edge-emitting laser unit 211 after a semiconductor process. The above-mentioned semiconductor process It is no different from the conventional method of manufacturing the laser die 21 , so it will not be repeated here, but it can be understood that while the edge-emitting laser unit 211 is manufactured, the extended second portion Z2 is expanded. Various materials used in the semiconductor process are stacked on the above, so that the second portion Z2 of the amplification and extension forms the stacked layered material 213 .

Next, step P2 is performed to form a concave space 214 on the stacked laminate material 213 , as shown in FIG. 8B ; and then step P3 is performed to place the mirror element 3 for reflecting the laser beam L2 into the groove of the stacked laminate material 213 In the space 214, which is shown in FIG. 8C; then, step P4 is executed, by adjusting the setting position and setting angle of the mirror element 3 to make the optical axis of the reflected laser beam L2 face a specific direction, that is, by adjusting the setting position and setting angle of the mirror element 3 By adjusting the setting position and setting angle of the mirror element 3 until the optical axis A22 of the reflected laser beam L2 is perpendicular to the horizontal plane, the reflecting unit 212 can be obtained according to the adjusted setting position and setting angle of the mirror element 3 The position and angle that the reflection slope 2121 should be set to have, wherein, the position where the reflection slope 2121 of the reflection unit 212 should be set includes the X-axis position, the Y-axis position and/or the Z-axis position, and the reflection unit 212 The angle that the reflection slope 2121 should have includes a pitch angle, a roll angle and/or a yaw angle; and then step P5 is performed to remove the mirror element 3 and form the above-mentioned X on the stacked laminated material 213. axis position, Y-axis position and/or Z-axis position with the above pitch angle degree, roll angle and/or yaw angle of the reflective slope 2121, as shown in FIG. 8D; finally, step P6 is performed, and a reflective layer 2122 for reflecting the laser beam L2 is arranged on the reflective slope 2121, as shown in FIG. 8E shown.

The above steps P2 to P5 can be performed through a micromachining process, wherein the steps P4 to P5 can also use a precision machining machine with more than six axes, and the step P6 can be performed through a sputtering process to make the reflective layer 2122 Formed on the reflective slope 2121. Preferably, the reflective layer 2122 is a dielectric coating or a gold coating. However, the processes used in steps P2 to P6 and the form of the reflective layer 2122 are not limited to the above, and those skilled in the art can make any equivalent design changes according to practical application requirements.

According to the above description, the laser module 2A of the present application has at least the following advantages: (1) The component composition is less, the assembly procedure is simplified, and the assembly accuracy is improved; for example, the diffractive optical element 221 and the collimating optical element 222 can be directly It is positioned on the lead frame 23 through the alignment structure 2321 of the frame 232 and the active alignment (Active Alignment); (2) the laser die 21 not only has the edge-emitting laser unit 211, but also has its position The reflection unit 212 can adjust the tilt angle according to the angle of the optical axis A21 of the laser beam L2 output by the edge-emitting laser unit 211, so that the optical axis A22 of the reflected laser beam L2 can be perpendicular to the The collimating optical element 222 and/or the diffractive optical element 221, so that the laser module 2A has excellent electrical/optical conversion efficiency; (3) The collimating optical element 222 and the diffractive optical element 221 are both processed by imprinting Therefore, the manufacturing tolerance can be controlled to be less than 5 micrometers (μm); (4) the substrate 231 of the lead frame 23 adopts a metal substrate, which can not only improve the heat dissipation capability and structural strength of the laser module 2A, but also provide a flat structure , so that the laser die 21 can be accurately arranged on the substrate 231; (5) the wall 2322 of the frame 232 of the lead frame 23 has a laser The exhaust hole 23223 through which the heat energy generated by the die 21 is discharged to the outside helps to improve the heat dissipation effect of the laser die 21 , especially for the high power laser die 21 .

Of course, the above are only examples, and those skilled in the art can make any equivalent changes and designs according to actual application requirements. Hereinafter, several embodiments of the laser module of the present case are proposed. Please refer to FIG. 9 , which is a schematic cross-sectional conceptual diagram of a partial structure of the laser module of the present invention in a second embodiment. The laser module 2B of this embodiment is substantially similar to that described in the first embodiment, and will not be repeated here. They are respectively formed on opposite sides of the same transparent substrate 225 through the printing process, so the diffractive optical element 221 ′, the collimating optical element 222 ′ and the transparent substrate 225 are one-piece optical elements. The light-transmitting substrate 225 and the diffractive optical element 221 ′ and the collimating optical element 222 ′ imprinted thereon can be arranged on the alignment structure of the lead frame 23 ′ by means of Active Alignment 2321' on. In another embodiment, the diffractive optical element 221 ′ and the collimating optical element 222 ′ can also be a monolithic lens formed simultaneously by imprinting a liquid material and curing it by ultraviolet (UV). ).

Please refer to FIG. 10 , which is a schematic cross-sectional conceptual diagram of a partial structure of the laser module of the present invention in a third embodiment. The laser module 2C of this embodiment is substantially similar to that described in the second embodiment, and will not be repeated here, but the difference is that the laser die 21 ′ is designed to be a vertical resonant surface-emitting laser. Shot (Vertical Cavity Surface Emitting Laser, VCSEL) die.

Please refer to FIG. 11 , which is a schematic cross-sectional conceptual diagram of a partial structure of the laser module of the present invention in a fourth embodiment. The 2D laser module of this embodiment is roughly similar What was described in the first embodiment will not be repeated here, and the difference is that the laser module 2D further includes a reflective optical element 24, and the laser die 21" adopts a conventional edge-emitting laser. The edge-emitting laser die of the emitting unit 211 , wherein the laser die 21 ″ and the reflective optical element are all disposed on the substrate 231 of the lead frame 23 , and the laser die 21 ″ is electrically connected to the substrate 231 . After the edge-emitting laser die generates the laser beam L2, the reflective layer 241 of the reflective optical element 24 can reflect the laser beam L2 from the laser die 21", so that the laser beam L2 is directed to the collimating optical element 222 and is deflected. The direction of the radiation optical element 221 travels and then the structured light is formed and outputted to the outside.

Please refer to FIG. 12 , which is a schematic cross-sectional conceptual diagram of a partial structure of the laser module of the present invention in a fifth embodiment. The laser module 2E of this embodiment is substantially similar to that described in the first embodiment, and will not be repeated here, but the difference is that the carrier of the laser module 2E is changed from the lead frame 23 to a The substrate 25 in the form of a circuit board adopts the traditional collimating optical element 16 and the diffractive optical element 17 as shown in Figures 1 and 2, and the laser module 2E also includes a collimating optical element 16 and a diffractive optical element for The optical element 17 is fixed to the outer housing 26 in which it is arranged. The assembling method of the laser module 2E includes: firstly disposing the laser die 21 including the edge-emitting laser unit 211 and the reflective unit 212 on the base material 25 through the ceramic plate 27 , and then moving the outer casing 26 to make The collimating optical element 16 and the diffractive optical element 17 are aligned with the reflection unit 212 of the laser die 21 , and finally the outer casing 26 is fixed.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention. Therefore, all other equivalent changes or modifications made without departing from the spirit disclosed in the present invention shall be included in this case. within the scope of the patent application.

2A: Laser Module

21: Laser Die

22: Optical lens

23: Lead frame

211: Edge-fired laser unit

212: Reflective unit

213: Stacked Laminated Materials

221: Diffractive Optical Components

222: Collimating Optics

223: The first transparent substrate

224: The second transparent substrate

231: Substrate

232: Frame

2121: Reflective Bevel

2122: Reflective layer

2321: Parametric structure

2322: Wall

23211: First pair structure

23212: Second Parametric Structure

23221: The first ladder structure

23222: Second Ladder Structure

23223: Vent hole

A21: Optical axis

A22: Optical axis

L2: Laser beam

Claims (39)

A laser module includes: a laser die for outputting a laser beam; at least one optical lens for allowing the laser beam to pass through and project outward; and a lead frame, comprising: a substrate and a frame, and the frame is connected to the substrate and has at least one alignment structure; wherein, the laser die is electrically connected to the substrate, and the at least one optical lens is mounted through the at least one alignment structure On the frame; wherein, the laser die is an edge-emitting laser (Edge Emitting Laser, EEL) die, which includes an edge-emitting laser unit and a reflection unit, and the edge-emitting laser unit is used for generating the laser beam, and the reflecting unit is used for reflecting the laser beam, wherein the edge-emitting laser die further comprises a stacked laminated material adjacent to the edge-emitting laser unit, and the edge-emitting laser chip is used for generating the laser beam. The laser unit and the stacking material are formed after a wafer is subjected to a wafer processing process; the reflecting unit is formed on the stacking material. The laser module according to claim 1, wherein the frame includes a plurality of walls, and the inner surfaces of the walls respectively have at least one stepped structure, and the stepped structures together form at least one accommodating structure. The at least one paired structure of the space; wherein, the at least one accommodating space is used for accommodating the at least one optical lens. The laser module of claim 2, wherein the at least one alignment structure includes a first alignment structure, and the at least one stepped structure includes a first stepped junction The at least one accommodating space includes a first accommodating space; wherein, the first stepped structures together form the first alignment structure having the first accommodating space. The laser module of claim 3, wherein the at least one alignment structure further includes a second alignment structure, and the at least one stepped structure further includes a second stepped structure, and the at least one accommodating structure further includes a second stepped structure. The accommodating space further includes a second accommodating space; wherein, the second step structures together form the second aligning structure with the second accommodating space, and the second aligning structure is located in the first aligning structure below. The laser module as described in claim 1, wherein at least part of the walls of the frame each have a vent hole, and at least part of the thermal energy generated by the laser die is discharged through the vent hole. out. The laser module of claim 1, wherein the substrate of the lead frame is a metal substrate; and/or the lead frame is at least subjected to a masking process and an etching process and a molding process. The laser module of claim 1, wherein the at least one optical lens comprises a diffractive optical element (DOE) for beam shaping the laser beam passing therethrough, The laser beam forms a structured light. The laser module as described in claim 7, wherein the diffractive optical element It is formed through an imprinting process. or The at least one optical lens further includes a transparent substrate, and the diffractive optical element is formed on the transparent substrate through the imprinting process. The laser module of claim 7, wherein the at least one optical lens further comprises a collimating optical element disposed between the laser die and the diffractive optical element for collimating The laser beam passes through the collimating optical element. The laser module of claim 10, wherein at least one of the diffractive optical element and the collimation optical element is formed through an imprinting process. The laser module of claim 11, wherein the diffractive optical element and the collimating optical element are simultaneously formed in one piece by imprinting a liquid material and curing it by ultraviolet rays (UV). a monolithic lens; or the at least one optical lens further includes at least one light-transmitting substrate, and at least one of the diffractive optical element and the collimating optical element is formed on the at least one through the imprinting process on a transparent substrate. The laser module of claim 1, wherein the reflection unit comprises a reflection slope and a reflection layer on the reflection slope; wherein, the reflection The bevels are formed on the build-up stack material after the build-up stack material is subjected to a micromachining process. The laser module of claim 13, wherein the reflective layer is a dielectric coating or a gold coating. The laser module as described in claim 13, wherein the reflecting unit is manufactured by a six-axis machining machine and is located at a specific position and has a specific angle, so as to make the laser beam reflected by the reflecting unit The optical axis is perpendicular to the at least one optical lens. The laser module as described in claim 1 further includes a reflective optical element disposed on the substrate and in the frame for reflecting the laser beam from the laser die. A laser module, comprising: at least one optical lens; a laser die disposed under the at least one optical lens, including: an edge-emitting laser unit for generating a laser beam; a stacking layered material , adjacent to the edge-emitting laser unit, the edge-emitting laser unit and the stacked layered material are formed after a wafer is subjected to a wafer processing process; The laser beam of the edge-emitting type laser unit makes the laser beam travel toward the direction of the at least one optical lens, and the reflection unit is formed on the stacked laminated material; and a carrier for carrying the at least one optical lens and the laser die. The laser module of claim 17, wherein the reflecting unit comprises a reflecting slope and a reflecting layer on the reflecting slope; wherein, the reflecting slope is subjected to a micro-mechanical process for stacking the laminated materials After processing, it is formed on the build-up laminate. The laser module of claim 18, wherein the reflective layer is a dielectric coating or a gold coating. The laser module of claim 17, wherein the reflection unit has a pitch angle, a roll angle, and a yaw angle, and the pitch angle, the roll angle and the deflection angle is used to make the optical axis of the laser beam perpendicular to the at least one optical lens. The laser module of claim 17, wherein the at least one optical lens comprises a diffractive optical element (DOE) for beam shaping the laser beam passing therethrough, The laser beam forms a structured light. The laser module of claim 21, wherein the diffractive optical element is formed through an imprinting process. The laser module of claim 21, wherein the at least one optical The lens further includes a collimating optical element disposed between the laser die and the collimating optical element for collimating the laser beam passing through the collimating optical element. The laser module of claim 23, wherein at least one of the diffractive optical element and the collimating optical element is formed through an imprinting process. The laser module of claim 17, wherein the carrier system is a lead frame, which includes a substrate and a frame, and the frame is connected to the substrate and has at least a pair of alignment structures ; wherein, the laser die is electrically connected to the substrate, and the at least one optical lens is mounted on the frame through the at least one pair of alignment structures. The laser module of claim 25, wherein the frame includes a plurality of walls, and inner surfaces of the walls respectively have at least one stepped structure, and the stepped structures together form at least one accommodating structure. The at least one paired structure of the space; wherein, the at least one accommodating space is used for accommodating the at least one optical lens. The laser module of claim 26, wherein the at least one alignment structure includes a first alignment structure, the at least one stepped structure includes a first stepped structure, and the at least one accommodating space A first accommodating space is included; wherein, the first step structures together form the first alignment structure having the first accommodating space. The laser module of claim 27, wherein the at least one alignment structure further includes a second alignment structure, and the at least one stepped structure further includes a second a stepped structure, and the at least one accommodating space further includes a second accommodating space; wherein, the second stepped structures together form the second alignment structure having the second accommodating space, and the second alignment structure A structure is located below the first alignment structure. The laser module of claim 25, wherein the substrate of the lead frame is a metal substrate. The laser module of claim 17, wherein the carrier has at least one exhaust hole, and at least part of the thermal energy generated by the laser die is discharged to the outside through the at least one exhaust hole. A laser die, comprising: an edge-fired laser unit for generating a laser beam; a stacked layered material adjacent to the edge-fired laser unit; wherein the edge-fired laser unit and the edge-fired laser unit The stacked layered material is formed after a wafer is subjected to a wafer processing process; and a reflection unit is used to reflect the laser beam, and includes a reflection slope and a reflection layer on the reflection slope; wherein, The reflective slope is formed on the build-up stack material after the build-up stack material is subjected to a micromachining process. The laser die as described in claim 31, wherein the reflective layer is a dielectric coating or a gold coating. The laser die as described in claim 31, wherein the reflective unit is manufactured by a six-axis machine and is located at a specific position and has a specific angle, so as to make the laser reflected by the reflective unit The optical axis of the light beam is oriented in a specific direction. A method for manufacturing a laser die, comprising: (a) performing a semiconductor process on a semiconductor substrate to form an edge-emitting laser unit and a stacking material adjacent to the edge-emitting laser unit; wherein, The edge-emitting laser unit is used for generating a laser beam; (b) performing a micromachining process on the stacked material to form a reflective slope on the stacked material; and (c) providing a reflective layer on the reflective slope; wherein, the reflective layer is used for reflecting the laser beam from the edge-emitting laser unit. The method for manufacturing a laser die as described in claim 34, wherein the step (b) comprises: (b1) forming a groove space on the stacked laminated material; (b2) placing a space for reflecting the laser Sending a mirror element of the beam to the groove space; (b3) adjusting a setting position and/or a setting angle of the mirror element so that the optical axis of the reflected laser beam is oriented in a specific direction, and according to the adjusted The setting position and/or the setting angle to obtain an X-axis position, a Y-axis position, a Z-axis position, a pitch angle, a roll angle and/or a yaw of the reflection slope (yaw) angle; and (b5) forming on the stacked laminate material at the X-axis position, the Y-axis position and/or the Z-axis position and having the pitch angle, the roll angle and/or the yaw angle the reflective slope. The method for manufacturing a laser die as described in claim 34, wherein the reflective layer is formed on the reflective slope through a sputtering process; and/or the reflective layer is a dielectric (dielectric) coating or a gold (gold) coating. A method of manufacturing a laser module, comprising: (a) disposing a laser die on a carrier, wherein the laser die includes an edge-emitting laser unit for generating a laser beam, and the edge A stacked layered material and a reflective unit adjacent to the radiation type laser unit, the edge-emitting laser unit and the stacked stacked material are formed in response to a wafer being subjected to a wafer processing process, and the reflective unit is used for Reflecting the laser beam, the reflecting unit is formed on the stacked laminated material; and (b) disposing at least one optical lens on the carrier using an active alignment method to make the laser die and The at least one optical lens is aligned. The method for manufacturing a laser module as described in claim 37, wherein the carrier system is a lead frame, which includes a substrate and a frame connected to the substrate; wherein the laser die is The particles are electrically connected to the substrate, and the at least one optical lens is mounted on the frame through the active alignment. The method for manufacturing a laser module as described in claim 37, wherein the at least one optical lens comprises a diffractive optical element (diffractive optical element, DOE) and/or a collimating optical element, and the diffractive optical element is used for beam shaping the laser beam passing through it, so that the laser beam forms a structured light, and the collimating optical element is used for beam shaping Collimating the laser beam passing through the collimating optics.

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