TWI739048B - Flexible polishing assembly and disassembly component module and wafer transmission method - Google Patents

Abstract

The invention discloses a flexible polishing assembly and disassembly component module, which comprises one assembly and disassembly module and two polishing modules. The loading and unloading module is in the center, two polishing modules are located on its two sides. The loading and unloading module has two loading and unloading platform modules in the direction perpendicular to the arrangement direction of the loading and unloading modules and the two polishing modules, and two loading and unloading platform modules. The two mounting and dismounting positions correspond to the two polishing modules respectively. The loading and unloading module includes a fixed frame, a water tank, a first loading and unloading platform module, a second loading and unloading platform module, a first loading and unloading platform fixing block, a second loading and unloading platform fixing block, a first isolation cover, and a second isolation cover. In the present invention, the assembly and unloading part and the polishing part are modularized and spliced into a polishing assembly and unloading integral module. This layout simplifies the equipment structure, improves the manufacturing efficiency of the equipment, and reduces the footprint of the equipment. The transfer of wafers by two polishing heads corresponding to two loading and unloading platform modules saves wafer transfer time and significantly improves the efficiency of mechanical planarization.

Description

Flexible polishing assembly and disassembly component module and wafer transmission method

The invention belongs to the technical field of grinding or polishing devices, and specifically relates to a flexible polishing assembly and disassembly component module of a chemical mechanical planarization equipment used in the manufacturing process of semiconductor integrated circuit wafers.

At present, as the cornerstone of the modern information society, the integrated circuit industry is playing an increasingly important role in all walks of life. With the rapid development of semiconductor technology, the feature size of integrated circuits continues to be miniaturized. The semiconductor manufacturing process is a complex manufacturing process. Advanced ICs require more than one thousand manufacturing procedures. Therefore, the high planarization of the semiconductor film surface has an important impact on the high performance, low cost, and high yield of the device. .

Chemical mechanical planarization (CMP) equipment is one of the seven key equipment in the field of integrated circuit manufacturing. The principle is to use the comprehensive balance of chemical etching of the polishing liquid and mechanical friction of the polishing pad to finely remove the material on the surface of the wafer. In integrated circuit manufacturing, CMP is first used for planarization, device isolation, and device structure in the front-end process of wafer manufacturing, and secondly, metal interconnections in the back-end process of wafer manufacturing are also used. At the same time, CMP is also a key process method in the integrated circuit 3D packaging TSV process. It is precisely because of relatively diverse and critical applications that CMP has become the standard process and core equipment in integrated circuit manufacturing.

At present, the chemical mechanical polishing technology has been developed into a chemical mechanical polishing technology integrating online measurement, online endpoint detection, cleaning and other technologies. It is the product of the development of integrated circuits to the process of miniaturization, multilayering, thinning, and flattening. At the same time, it is also a necessary process technology for wafers to transition from 200mm to 300mm or even larger diameters, improve productivity, reduce manufacturing costs, and flatten the entire substrate.

A typical chemical mechanical planarization equipment usually includes multiple polishing units and auxiliary devices such as cleaning, wafer transportation, and drying. The polishing unit usually includes a worktable, a polishing disc, a polishing head, a polishing arm, a dresser, a polishing liquid arm, etc. The polishing disc, a polishing head, a polishing arm, a dresser, and a polishing liquid arm are arranged on the worktable according to the processing position of the process. In the actual wafer processing process, it is found that the spatial arrangement of the polishing unit, cleaning, wafer transportation and other modules has a great impact on the overall polishing output of the chemical mechanical planarization equipment. The transfer of the wafer between the polishing unit and the outside and between the polishing unit is usually realized by a loading and unloading table or a similar device. Regarding the spatial layout of the loading and unloading table and polishing unit, some adopt a square layout of the loading and unloading table and three polishing units. Since one loading and unloading station needs to provide loading and unloading services for three polishing units, the disadvantage of this technical layout is that the manufacturing process is complicated. In addition, four polishing units are arranged side by side. The wafer transfer is completed by the loading and unloading area at the end of the flattening equipment and two linear transport mechanisms arranged along the arrangement direction of the polishing units. The other side of the linear transport mechanism is the cleaning area. Each of the above-mentioned linear transport mechanisms provides services for two polishing units, and provides two transfer stations for each polishing unit, and the polishing head of the polishing unit can load and unload wafers from one of the transfer stations. However, the disadvantage of this layout is that although each polishing unit is equipped with two transfer stations, the polishing unit only loads and unloads wafers directly from one of them during the polishing process. Therefore, there is still room for improvement from the perspective of wafer transfer efficiency.

The purpose of the present invention is to solve the problems of low wafer transmission efficiency and complex structure of the transmission mechanism in the existing chemical mechanical planarization equipment, and propose a flexible polishing assembly and disassembly component module for chemical mechanical planarization equipment, which can simplify the equipment structure , Improve equipment manufacturing efficiency and reduce equipment footprint.

In order to achieve the above-mentioned objective, the technical solution adopted by the present invention is a flexible polishing assembly and disassembly component module, including one assembly and disassembly module and two polishing modules. The loading and unloading module has two loading and unloading platform modules in a direction perpendicular to the arrangement direction of the loading and unloading modules and the two polishing modules, and the two loading and unloading positions of the two loading and unloading platform modules respectively correspond to the two polishing molds. Group.

The polishing module includes a fixed platform, a polishing pad, a polishing head, a polishing shaft, and the polishing shaft can drive the polishing head to rotate to the corresponding loading and unloading position of the loading and unloading module.

The loading and unloading module includes a fixed frame, a water tank, a first loading and unloading platform module, a second loading and unloading platform module, a first loading and unloading platform fixing block, a second loading and unloading platform fixing block, a first isolation cover, and a second isolation cover. One loading and unloading platform module corresponds to the first loading and unloading position, and the second loading and unloading platform module corresponds to the second loading and unloading position. The water tank and the first loading and unloading platform fixed block and the second loading and unloading platform fixed block are fixedly installed on the fixed frame, and the two isolation covers are respectively Fixed on the respective loading and unloading platform fixing table to isolate the lower part of the loading and unloading platform module from the liquid. The first loading and unloading platform module and the second loading and unloading platform module are respectively fixed on the first loading and unloading platform fixed block and the second loading and unloading platform fixed block , Corresponding to the first loading and unloading position and the second loading and unloading position.

A first nozzle module and a second nozzle module are respectively arranged on the two installation positions of the installation module, and both are fixed on the fixing frame.

Preferably, the above-mentioned first nozzle module and the second nozzle module are respectively arranged at the edges of the first assembling and disassembling position and the second assembling and disassembling position.

The loading and unloading platform module can rise and fall in the vertical direction to complete the wafer transfer with the polishing head.

The present invention further provides a method for wafer transfer using the above-mentioned polishing loading and unloading component module, which includes the following steps: S1: the first loading and unloading station module waits at the first loading and unloading position for the first polishing head to complete the first stage of polishing the wafer The circle rotates from the first polishing head shaft to the first loading and unloading position; S2: When the polished wafer is rotated from the first polishing head shaft to the first loading and unloading position, the first loading and unloading platform module rises, and the first stage of loading has been completed Polished wafer; S3: Then the first polishing head turns back to the top of the first polishing pad, and the robot starts to remove the wafer that has been polished in the first stage from the first loading and unloading platform module and puts it on the second loading and unloading position S4: After cleaning, the first polishing head is turned back to the first polishing pad. The second polishing head turns back to the second loading and unloading position, the second loading and unloading platform module rises, the second polishing head takes away the wafers that have completed the first stage of polishing, and the second polishing head turns back to the second polishing pad for polishing, and at the same time , The robot puts the unpolished wafer on the first loading and unloading platform module at the first loading and unloading position; S5: the first polishing head rotates to the first loading and unloading position to remove the wafer to be polished and then starts polishing. After the polishing head is polished, the second polishing head rotates to the second loading and unloading position, and the wafer that has been polished in the second stage is placed on the second loading and unloading platform module. The second polishing head rotates back to the second polishing pad, and the robot removes it. Polished wafer; S6: The second polishing head rotates back to the second loading and unloading position to start cleaning the second polishing head, the cleaned second polishing head is turned back to the second polishing pad, and the first loading and unloading platform module is in the first loading and unloading position Waiting for the first polishing head to rotate the wafer that has completed the first stage of polishing by the first polishing head shaft to the first loading and unloading position; S7: Repeat steps 2 to 6 until all wafers are polished.

Compared with the existing chemical mechanical planarization equipment technology, the present invention has the following beneficial technical effects:

1. In the present invention, the loading and unloading part and the polishing part are modularized and spliced into a polishing loading and unloading overall module. This layout simplifies the equipment structure, improves the manufacturing efficiency of the equipment, and reduces the footprint of the equipment.

2. The transfer of wafers by two polishing heads corresponding to two loading and unloading platform modules saves wafer transfer time and significantly improves the overall efficiency of mechanical planarization.

3. The overall module for polishing, loading and unloading can be freely expanded according to needs, and can be spliced by three or more modules, which further improves the flexibility of wafer manufacturing, improves manufacturing efficiency, and reduces equipment space. Increase the output of the entire equipment.

1: The first loading and unloading position

2: The first polishing head shaft

3: The first polishing head

4: The first polishing pad

5: The first fixed platform

6: The second loading and unloading position

7: The second polishing head shaft

8: The second polishing head

9: The second polishing pad

10: Second fixed platform

11: sink

12: The first isolation cover

13: The first nozzle module

14: The second loading and unloading platform fixed block

15: The second loading dock module

16: The second nozzle module

17: The second isolation cover

18: The first loading and unloading platform module

19: Fixed block of the first loading and unloading platform

20: fixed frame

Figure 1 is a three-dimensional effect diagram of the overall polishing assembly module of the present invention; Figure 2 is a schematic structural diagram of the assembly module in the module shown in Figure 1;

The present invention will be described in further detail below in conjunction with the drawings.

The structure of the polishing assembly and unloading module of the present invention is mainly composed of one assembly and unloading module and two polishing modules. The layout of the polishing assembly and unloading module of the present invention is shown in Figure 1. The polishing assembly and unloading module includes a first assembly and unloading position 1, a first polishing head shaft 2, a first polishing head 3, a first polishing pad 4, and a first polishing assembly. The fixed platform 5, the second loading and unloading position 6, the second polishing head shaft 7, the second polishing head 8, the second polishing pad 9, and the second fixed platform 10. The polishing pad, polishing shaft and other components are fixed on a fixed platform and polished The bald head is fixed on the polishing shaft. The polishing rotating shaft drives the polishing head to rotate to the loading and unloading position. After the action is completed, it rotates to the top of the polishing pad for polishing. The first mounting and dismounting position 1 corresponds to the first polishing head 3, and the second mounting and dismounting position 6 corresponds to the second polishing head 8.

The first loading and unloading position 1, the second loading and unloading position 6, the water tank 11, the first isolation cover 12, the first nozzle module 13, the second loading and unloading station fixing block 14, the second loading and unloading station module 15, the second nozzle module 16 , The second isolation cover 17, the first loading and unloading platform module 18, the first loading and unloading platform fixed block 19, the fixed frame 20. The first loading and unloading station module 18 corresponds to the first loading and unloading position 1, and the second loading and unloading station module 15 corresponds to the second loading and unloading position 6. The water tank 11 and the first loading and unloading table fixing block 19, and the second loading and unloading table fixing block 14 are fixed on the fixing frame 20. The isolation cover is fixed on the loading and unloading fixed platform to isolate the lower part of the loading and unloading platform from the liquid. The loading and unloading platform module is fixed on the loading and unloading platform fixed block, and there is a nozzle module corresponding to the edge of the loading and unloading position. The nozzle modules are all fixed on the fixing frame 20.

The process of wafer transfer using the present invention will now be described in detail: at the beginning, the first loading and unloading station module 18 waits at the first loading and unloading position 1 for the first polishing head 3 to complete the first stage polishing of the wafer by the first polishing The head shaft 2 rotates to the first loading and unloading position 1.

Subsequently, when the polished wafer is rotated by the first polishing head shaft 2 to the first loading and unloading position 1, the first loading and unloading platform module 18 rises, and the polished wafer is loaded.

Then the first polishing head 3 turns back to the top of the first polishing pad 4, and the robot starts to remove the wafers that have completed the first stage of polishing on the first loading and unloading platform module 18, and place them on the second loading and unloading position 6. The second loading and unloading platform module 15, the first polishing head 3 is turned back to the first loading and unloading position 1 to start cleaning the first polishing head 3.

After the cleaning is completed, the first polishing head 3 is turned back to the first polishing pad 4. The second polishing head 8 is turned back to the second loading and unloading position 6, the second loading and unloading platform module 15 rises, and the second polishing head 8 takes away the wafers that have completed the first stage of polishing. The circle is placed on the first loading and unloading station module 18 in the first loading and unloading position 1. By using two polishing heads corresponding to the two loading and unloading station modules for wafer transfer, the wafer transfer time is saved and the efficiency is improved.

Subsequently, the second polishing head 8 is turned back to the second polishing pad 9 to start polishing, and the first polishing head 3 is rotated to the first loading and unloading position 1 to remove the unpolished wafers and then start polishing. When the polishing of the second polishing head 8 is completed, it rotates to the second loading and unloading position 6, and the wafer that has been polished in the second stage is placed on the second loading and unloading platform module 15, and the second polishing head 8 rotates back to the second polishing pad 9 . The robot takes the polished wafer, the second polishing head 8 rotates back to the second loading and unloading position 6 to start cleaning the second polishing head 8, and the cleaned second polishing head 8 is turned back to the second polishing pad 9. The first loading and unloading station module 18 waits for the wafers on the first polishing head 3 to start circulating in the first loading and unloading position 1.

The advantage of the wafer loading component module of the present invention is that by modularizing the loading and unloading part and the polishing part, it can be spliced into the layout shown in Figure 1. This layout simplifies the structure of the equipment, improves the manufacturing efficiency of the equipment, and reduces the footprint of the equipment. And it can be expanded freely according to needs, and it can be spliced by 3 or more modules with the layout shown in Figure 1 to further improve the flexibility of wafer manufacturing, improve equipment manufacturing efficiency, reduce equipment space, and increase Yield.

The description of the above specific embodiments is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

1: The first loading and unloading position

6: The second loading and unloading position

11: sink

12: The first isolation cover

13: The first nozzle module

14: The second loading and unloading platform fixed block

15: The second loading dock module

16: The second nozzle module

17: The second isolation cover

18: The first loading and unloading platform module

19: Fixed block of the first loading and unloading platform

20: fixed frame

Claims (5)

A flexible polishing assembly and disassembly component module, which includes a assembly and disassembly module and two polishing modules. There are two loading and unloading platform modules in the direction perpendicular to the arrangement direction of the two polishing modules, and the two loading and unloading positions of the two loading and unloading platform modules correspond to the two polishing modules respectively; wherein, the loading and unloading module Including fixing frame (20), water tank (11), first loading and unloading platform module (18), second loading and unloading platform module (15), first loading and unloading platform fixing block (19), second loading and unloading platform fixing block (14) ), the first isolation cover (12), the second isolation cover (17), the first loading and unloading platform module (18) corresponds to the first loading and unloading position (1), and the second loading and unloading platform module (15) corresponds to the second The loading and unloading position (6), the water tank (11), the first loading and unloading platform fixing block (19), and the second loading and unloading platform fixing block (14) are fixedly installed on the fixing frame (20), and the two isolation covers are respectively fixed The lower part of the loading and unloading platform module is isolated from the liquid on the corresponding loading and unloading platform fixed platform, and the first loading and unloading platform module (18) and the second loading and unloading platform module (15) are respectively fixed on the first loading and unloading platform. The block (19) and the second loading and unloading platform fixed block (14) correspond to the first loading and unloading position (1) and the second loading and unloading position (6), and the two loading and unloading positions of the loading and unloading module are respectively provided with The first nozzle module (13) and the second nozzle module (16), the first nozzle module (13) and the second nozzle module (16) are both fixed on the fixing frame (20); the polishing The module includes a polishing head and a polishing rotating shaft, wherein the polishing rotating shaft drives the polishing head to rotate to the loading and unloading position corresponding to the loading and unloading module, and the polishing rotating shaft is adjacent to the corresponding loading and unloading position. The polishing assembly and disassembly component module according to claim 1, wherein the polishing module also includes Contains a fixed platform and a polishing pad, wherein the polishing pad is located on the fixed platform. The polishing assembling and disassembling component module according to claim 1, wherein the first nozzle module (13) and the second nozzle module (16) are respectively arranged at the first assembling and disassembling position (1) and the second assembling and disassembling position (6) The edge. The polishing loading and unloading component module according to claim 2, wherein the loading and unloading platform module can rise and fall in a vertical direction to complete wafer transfer with the polishing head. A method for wafer transfer of a polishing loading and unloading component module according to any one of claims 1 to 4, comprising the following steps: S1: the first loading and unloading platform module (18) is in the first loading and unloading position (1) Wait for the first polishing head (3) to rotate the wafer that has completed the first stage of polishing from the first polishing head shaft to the first loading and unloading position (1); S2: the polished wafer is transferred from the first polishing head When the rotating shaft (2) rotates to the first loading and unloading position (1), the first loading and unloading platform module (18) rises to load the wafers that have completed the first stage of polishing; S3 the first polishing head (3) rotates Returning to the top of the first polishing pad, the robot starts to remove the wafers that have completed the first stage of polishing on the first loading and unloading platform module and place them on the second loading and unloading platform module (15) at the second loading and unloading position. , The first polishing head (3) is turned back to the first loading and unloading position (1) to start cleaning the first polishing head (3); S4: After cleaning, the first polishing head (3) is turned back to the first On the polishing pad, the second polishing head (8) rotates back to the second loading and unloading position (6), the second loading and unloading platform module (15) rises, and the second polishing head (8) takes away the first stage polishing Wafer, the second polishing head (8) is turned back to the second polishing pad for polishing, and at the same time, the robot puts the unpolished wafer on the first loading and unloading station module (18) at the first loading and unloading position ； S5: The first polishing head (3) rotates to the first loading and unloading position (1) to remove the wafer to be polished and then starts polishing. When the polishing of the second polishing head (8) is completed, the second polishing head rotates To the second loading and unloading position (6), the wafer that has completed the second stage of polishing is placed on the second loading and unloading platform module (15), and the second polishing head (8) rotates back to the second polishing pad (9) , The robot takes away the polished wafer; S6: the second polishing head (8) rotates back to the second loading and unloading position (6) to start cleaning the second polishing head (8), the cleaned second polishing head (8) Turn back to the second polishing pad 9, the first loading and unloading platform module (18) waits for the first polishing head to complete the first stage of polishing in the first loading and unloading position by the first polishing head The rotating shaft rotates to the first loading and unloading position; S7: Repeat steps 2 to 6 until all wafers are polished.

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