CN109304670A - A kind of polishing handling parts module flexible - Google Patents
A kind of polishing handling parts module flexible Download PDFInfo
- Publication number
- CN109304670A CN109304670A CN201811158614.7A CN201811158614A CN109304670A CN 109304670 A CN109304670 A CN 109304670A CN 201811158614 A CN201811158614 A CN 201811158614A CN 109304670 A CN109304670 A CN 109304670A
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- China
- Prior art keywords
- polishing
- module
- platform
- rubbing head
- loading position
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of polishing handling parts modules flexible, include a handling module and two polishing modules.Handling module is placed in the middle, two polishing modules are located at its two sides, there are two platform modules on the direction perpendicular with handling module and two polishing module orientations for handling module, and two loading positions of two platform modules respectively correspond described two polishing modules.Handling module includes fixed frame, sink, the first platform module, the second platform module, the first platform fixed block, the second platform fixed block, the first isolation cover, the second isolation cover.The present invention carries out modularization by that will load and unload part and polishing part, be spliced into polishing and load and unload integral module, and this topological simplicity device structure improves the manufacture efficiency of equipment, and reduce the space occupied of equipment.The wafer transfer time is saved by the transmitting that the corresponding two platform modules of two rubbing heads carry out wafer, also significantly increases the efficiency of machinery planarization.
Description
Technical field
The invention belongs to be ground or burnishing device technical field, and in particular to a kind of semiconductor integrated circuit chip manufactured
One kind polishing handling parts module flexible of based CMP apparatus used in journey.
Background technique
Currently, foundation stone of the integrated circuit industry as advanced information society, all plays more and more non-in all trades and professions
Normal important role.With the rapid development of semiconductor technology, integrated circuit feature size constantly tends to miniaturize.Semiconductor system
Journey is a complicated production process, and production process required for advanced IC is up to 1,000 or more steps, therefore semiconductor
The high planarization of film surface has important influence to the high-performance, low cost, high finished product rate of device.
Chemical-mechanical planarization (CMP) equipment is one of the seven big key equipments in IC manufacturing field.Its principle is
It is acted on using the overall balance of polishing fluid chemical etching and polishing pad mechanical friction, crystal column surface material is finely removed.
In integrated circuit fabrication, CMP is primarily used for the planarization of the preceding road technique of chip manufacturing, device isolation, device configuration, secondly
Chip manufacturing postchannel process metal interconnection also need using.Meanwhile CMP is also to close in integrated circuit 3 D encapsulation TSV technique
The process means of key.Exactly because there is multiplicity relatively and crucial application, CMP have become the standard in IC manufacturing
Technique and Core equipment.
Currently, chemical Mechanical Polishing Technique, which has developed into, collects the technologies such as online measuring, online end point determination, cleaning in one
The chemical Mechanical Polishing Technique of body is the product that integrated circuit develops to miniaturization, multiple stratification, slimming, flatening process.Together
When be also wafer from 200mm to 300mm or even larger diameter transition, improve that productivity, to reduce manufacturing cost, the substrate overall situation flat
Technology necessary to changing.
One typical based CMP apparatus generally includes multiple polishing units and cleaning, wafer transport, does
Dry equal auxiliary devices.Polishing unit generally includes workbench, polishing disk, rubbing head, polishing arm, trimmer, polishing fluid arm etc., throws
CD, rubbing head, polishing arm, trimmer, polishing fluid arm are arranged on the table according to technique Working position.Actual wafer adds
It is found during work, the space layout of the modules such as polishing unit and cleaning, wafer transport is whole for based CMP apparatus
The polishing output of body has significant effect.Wafer is usually relied in polishing unit and outside and the transmission between polishing unit
The device of platform or similar effect is realized.About the space layout of platform and polishing unit, some uses platform
The form that unit is square layout is polished with three.Since a platform needs to provide handling clothes to three polishing units
Business, therefore the shortcomings that this technology layout is complex technical process.Separately have using four polishing units are arranged side by side, wafer passes
The defeated loading place by being located at flattening device end and two linear transport establishments' completions along polishing unit orientation setting,
The other side of linear transport establishment is cleaning area.Each above-mentioned linear transport establishment provides service for two polishing units, and
Two transmission stations are set for each polishing unit, the rubbing head for polishing unit can be brilliant from one of transmission station handling
Circle.Although but the shortcomings that this layout is that two transmission stations are arranged in each polishing unit, polishing unit in polishing process
Wafer is directly loaded and unloaded from one of them, therefore from the angle analysis of wafer transfer efficiency room for improvement also in need.
Summary of the invention
Present invention aims at for wafer transfer low efficiency, conveyer present in existing based CMP apparatus
Structure proposes a kind of polishing handling parts module flexible of based CMP apparatus the problem of structure is complicated, can simplify
Device structure, improves the manufacture efficiency of equipment, reduces the space occupied of equipment.
To achieve the above object, the technical solution adopted by the present invention is a kind of polishing handling parts module flexible, includes
One handling module and two polishing modules, handling module is placed in the middle, and two polishing modules are located at its two sides, and the handling module exists
There are two platform module, two platform modules on perpendicular direction with handling module and two polishing module orientations
Two loading positions respectively correspond described two polishing modules.
Polishing module includes fixed platform, and polishing pad, rubbing head, polishing shaft, polishing shaft can drive rubbing head to rotate
To the corresponding loading position of handling module.
Handling module is fixed comprising fixed frame, sink, the first platform module, the second platform module, the first platform
Block, the second platform fixed block, the first isolation cover, the second isolation cover, corresponding first loading position of the first platform module,
Second platform module corresponds to the second loading position, sink and the fixed peace of the first platform fixed block, the second platform fixed block
On fixed frame, two isolation covers are separately fixed on respective platform fixed station, make platform module lower part and liquid
Isolation, the first platform module and the second platform module is separately fixed at the first platform fixed block and the second platform is fixed
On block, corresponding first loading position and the second loading position.
It is respectively arranged with first jet module and second nozzle module on two loading positions of handling module, the two is all solid
It is scheduled on fixed frame.
Preferably, above-mentioned first jet module and second nozzle module are separately positioned on the first loading position and the second dress
Unload the edge of position.
Platform module can raising and lowering in vertical direction, complete wafer transfer with rubbing head.
The present invention it is further proposed that it is a kind of using above-mentioned polishing handling parts module carry out wafer transfer method, include
Following steps:
The wafer that S1: the first platform module waits the first rubbing head to polish the completion first stage in the first loading position
It is rotated by the first rubbing head shaft to the first loading position；
S2: when polished wafer is rotated by the first rubbing head shaft to the first loading position, in the first platform module
It rises, loads the good wafer for having completed first stage polishing；
S3: and then the first rubbing head rotates back into above the first polishing pad, manipulator starts to take away in the first platform module
The wafer for having completed first stage polishing be put into the second platform module on the second loading position, the first rubbing head is gone back to
Start to clean the first rubbing head to the first loading position；
S4: after cleaning, the first rubbing head is gone back on the first polishing pad.Second rubbing head rotates back into the second handling position
It sets, the second platform module rises, and the second rubbing head takes the wafer for completing first stage polishing away, and the second rubbing head goes back to second
It is polished on polishing pad, at the same time, unpolished wafer is placed on the first platform of the first loading position by manipulator
In module；
S5: the first rubbing head, which is rotated, to be taken polished wafer away to the first loading position and then starts to polish, when the second throwing
After the completion of shaven head polishing, the second rubbing head, which is rotated to the second loading position, is placed on second for the wafer for completing second stage polishing
In platform module, the second rubbing head rotates back to the second polishing pad, and manipulator takes polished wafer away；
S6: the second rubbing head rotates back to the second loading position and starts to clean the second rubbing head, cleans the second polishing finished
Head is gone back on the second polishing pad, and the first platform module waits the first rubbing head that will complete first stage throwing in the first loading position
The wafer of light is rotated by the first rubbing head shaft to the first loading position；
S7: step 2 is repeated to 6, until whole polishing wafers finish.
Compared with existing based CMP apparatus technology, the present invention has following advantageous effects:
1, the present invention carries out modularization by that will load and unload part and polishing part, is spliced into a polishing and loads and unloads whole mould
Block, this topological simplicity device structure, improves the manufacture efficiency of equipment, and reduce the space occupied of equipment.
2, the wafer transfer time is saved by the transmitting that the corresponding two platform modules of two rubbing heads carry out wafer, together
When significantly improve the whole efficiency of machinery planarization.
3, polishing handling integral module can according to need carry out spread, can be by three and more module
Spliced, further increases the flexibility of wafer manufacture, improve manufacture efficiency, reduce the space of equipment, and increase whole
The yield of a equipment.
Detailed description of the invention
Fig. 1 is the three-dimensional effect diagram of present invention polishing handling integral module；
Fig. 2 is the structural schematic diagram of the handling module in module shown in Fig. 1；
The meaning of appended drawing reference used in figure:
1: the first loading position, 2: the first rubbing head shafts, 3: the first rubbing heads, 4: the first polishing pads, 5: the first is fixed
Platform, 6: the second loading positions, 7: the second rubbing head shafts, 8: the second rubbing heads, 9: the second polishing pads, 10: the second is fixed flat
Platform, 11: sink, 12: the first isolation covers, 13: first jet module, 14: the second platform fixed blocks, 15: the second platform moulds
Block, 16: second nozzle module, 17: the second isolation covers, 18: the first platform modules, 19: the first platform fixed blocks, 20: Gu
Determine frame.
Specific embodiment
The invention will now be described in further detail with reference to the accompanying drawings.
The structure that the present invention polishes handling integral module is mainly made of 1 handling module and 2 polishing modules.The present invention
The layout of polishing handling integral module is as shown in Figure 1, polishing handling integral module includes by the first loading position 1, the first polishing
Head shaft 2, the first rubbing head 3, the first polishing pad 4, the first fixed platform 5, the second loading position 6, the second rubbing head shaft 7,
Second rubbing head 8, the second polishing pad 9, the second fixed platform 10 composition.Polishing pad, polishes shaft and other component composition is fixed
On the stationary platform, rubbing head is fixed in polishing shaft.Polishing shaft drives rubbing head to rotate to loading position, execution
Afterwards, it is polished above rotation to polishing pad.First loading position 1 corresponds to the first rubbing head 3, the second loading position 6 corresponding the
Two rubbing heads 8.
First loading position 1, the second loading position 6, sink 11, the first isolation cover 12, first jet module 13, the second dress
Unload platform fixed block 14, the second platform module 15, second nozzle module 16, the second isolation cover 17, the first platform module 18,
One platform fixed block 19, fixed frame 20 form.Wherein corresponding first loading position 1 of the first platform module 18, the second handling
Corresponding second handling of platform module 15 position 6.Sink 11 and the first platform fixed block 19, the second platform fixed block 14 are fixed on
Determine on frame 20.Isolation cover, which is fixed on handling fixed station, is isolated platform lower part with liquid.Platform module is fixed on handling
On platform fixed block, nozzle module is corresponding at loading position edge.Nozzle module is all fixed on fixed frame 20.
Now the process for carrying out wafer transfer using the present invention is given and is described in detail:
When beginning, the first platform module 18 waits the first rubbing head 3 that will complete first stage throwing in the first loading position 1
The wafer of light is rotated by the first rubbing head shaft 2 to the first loading position 1.
Then, when polished wafer is by the first rubbing head shaft 2 rotation to the first loading position 1, the first platform mould
Block 18 rises, and loads good polished wafer.
Then the first rubbing head 3 rotates back into 4 top of the first polishing pad, and manipulator starts to take away in the first platform module 18
Completed the first stage polishing wafer, the second platform module 15 being put on the second loading position 6, the first rubbing head
3, which rotate back into the first loading position 1, starts to clean the first rubbing head 3.
After cleaning, the first rubbing head 3 is gone back on the first polishing pad 4.Second rubbing head 8 rotates back into the second loading position
6, the second platform module 15 rises, and the second rubbing head 8 takes the wafer for completing first stage polishing, at the same time, manipulator away
Unpolished wafer is placed in the first platform module 18 of the first loading position 1, it is two corresponding by two rubbing heads
The transmitting that platform module carries out wafer saves the wafer transfer time, improves efficiency.
Then, the second rubbing head 8 rotates back into above the second polishing pad 9 and starts to polish, the first rubbing head 3 rotation to the first dress
Position 1 is unloaded to take unpolished wafer away and then start to polish.After the completion of the polishing of the second rubbing head 8, rotation to the second handling position
6 are set, the wafer for completing second stage polishing is placed in the second platform module 15, the second rubbing head 8 rotates back to the second throwing
Light pad 9.Manipulator takes polished wafer away, and the second rubbing head 8 rotates back to the second loading position 6 and starts to clean the second rubbing head
8, it cleans the second rubbing head 8 finished and goes back on the second polishing pad 9.First platform module 18 is waited in the first loading position 1
Wafer on first rubbing head 3 starts the cycle over.
The advantages of wafer load component models of the invention: carrying out modularization by that will load and unload part and polishing part, can
To be spliced into layout shown in Fig. 1.This topological simplicity device structure, improves the manufacture efficiency of equipment, and the land occupation for reducing equipment is empty
Between.And it can according to need carry out spread, can be as 3 and the module of layout shown in more Fig. 1 is spliced,
The flexibility for further increasing wafer manufacture, improves the manufacture efficiency of equipment, reduces the space of equipment, increases yield.
The description of the above specific embodiment is not intended to limit the invention, all within the spirits and principles of the present invention institute
Any modification, equivalent substitution, improvement and etc. of work, should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of polishing handling parts module flexible, it is characterised in that include a handling module and two polishing modules, dress
It is placed in the middle to unload module, two polishing modules are located at its two sides, the handling module with handling module and two polishing module arrays
There are two platform modules on the perpendicular direction in direction, and two loading positions of two platform modules respectively correspond described two
A polishing module.
2. polishing handling parts module according to claim 1, it is characterised in that the polishing module includes fixed platform,
Polishing pad, rubbing head polish shaft, and polishing pad is located in fixed platform, and polishing shaft can drive rubbing head to rotate to handling mould
The corresponding loading position of block.
3. polishing handling parts module according to claim 2, it is characterised in that the handling module includes fixed frame
(20), sink (11), the first platform module (18), the second platform module (15), the first platform fixed block (19), second
Platform fixed block (14), the first isolation cover (12), the first isolation cover (17), the first platform module (18) corresponding first
Loading position (1), the second platform module (15) is corresponding second loading position (6), sink (11) and the first platform fixed block
(19), the second platform fixed block (14) is fixedly mounted on fixed frame (20), and two isolation covers are separately fixed at corresponding dress
It unloads on platform fixed station, platform module lower part is isolated with liquid, the first platform module (18), the second platform module (15)
Be separately fixed on the first platform fixed block (19) and the second platform fixed block (14), corresponding first loading position (1) and
Second loading position (6).
4. polishing handling parts module according to claim 3, it is characterised in that two handling positions of the handling module
It sets and is respectively arranged with first jet module (13) and second nozzle module (16), first jet module (13) and second nozzle mould
Block (16) is all fixed on fixed frame (20).
5. polishing handling parts module according to claim 4, it is characterised in that the first jet module (13) and
Two nozzle modules (16) are separately positioned on the edge of the first loading position (1) and the second loading position (6).
6. polishing handling parts module according to claim 3, it is characterised in that the platform module can be in Vertical Square
Upward raising and lowering completes wafer transfer with rubbing head.
7. a kind of method that polishing handling parts module according to claim 6 carries out wafer transfer, it is characterised in that packet
Containing following steps:
S1: the first platform module (18) waits the first rubbing head (3) will complete first stage polishing in the first loading position (1)
Wafer rotated by the first rubbing head shaft to the first loading position (1)；
S2: when polished wafer is by the first rubbing head shaft (2) rotation to the first loading position (1), the first platform module
(18) rise, load the good wafer for having completed first stage polishing；
The first rubbing head of S3 (3) rotates back into above the first polishing pad, and manipulator starts to take away in the first platform module
The wafer for completing first stage polishing is put into the second platform module (15) on the second loading position, and the first rubbing head (3) turns
The first loading position (1) is returned to start to clean the first rubbing head (3)；
S4: after cleaning, the first rubbing head (3) is gone back on the first polishing pad, and the second rubbing head (8) rotates back into the second handling position
It sets (6), the second platform module (15) rises, and the second rubbing head (8) takes the wafer for completing first stage polishing, the second polishing away
Head (8), which is gone back on the second polishing pad, to be polished, and unpolished wafer is placed on the first loading position by manipulator at the same time
The first platform module (18) on；
S5: the first rubbing head (3) rotation takes polished wafer away to the first loading position (1) and then starts to polish, when second
After the completion of rubbing head (8) polishing, the second rubbing head, which is rotated to the second loading position (6), puts the wafer for completing second stage polishing
It sets in the second platform module (15), the second rubbing head (8) rotates back to the second polishing pad (9), and manipulator is taken away polished
Wafer；
S6: the second rubbing head (8) rotates back to the second loading position (6) and starts to clean the second rubbing head (8), cleans second finished
Rubbing head (8) is gone back on the second polishing pad 9, and the first platform module (18) waits the first rubbing head will be complete in the first loading position
It is rotated by the first rubbing head shaft to the first loading position at the wafer that the first stage polishes；
S7: step 2 is repeated to 6, until whole polishing wafers finish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107141090A TWI739048B (en) | 2018-09-20 | 2018-11-19 | Flexible polishing assembly and disassembly component module and wafer transmission method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811097868 | 2018-09-20 | ||
| CN2018110978682 | 2018-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109304670A true CN109304670A (en) | 2019-02-05 |
Family
ID=65225362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811158614.7A Withdrawn CN109304670A (en) | 2018-09-20 | 2018-09-30 | A kind of polishing handling parts module flexible |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN109304670A (en) |
| TW (1) | TWI739048B (en) |
| WO (1) | WO2020056817A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110103119A (en) * | 2018-09-20 | 2019-08-09 | 杭州众硅电子科技有限公司 | A kind of polishing handling parts module |
| CN113732936A (en) * | 2021-05-08 | 2021-12-03 | 清华大学 | Polishing temperature control device, chemical mechanical polishing system and method |
| CN113910099A (en) * | 2021-09-07 | 2022-01-11 | 杭州众硅电子科技有限公司 | A wafer polishing system |
| CN114147611A (en) * | 2021-09-07 | 2022-03-08 | 杭州众硅电子科技有限公司 | Wafer polishing system |
| CN114425742A (en) * | 2021-12-29 | 2022-05-03 | 华海清科股份有限公司 | Distributed cleaning device |
| CN115338705A (en) * | 2022-06-30 | 2022-11-15 | 杭州众硅电子科技有限公司 | Continuous wafer polishing system |
| CN115338718A (en) * | 2022-10-18 | 2022-11-15 | 杭州众硅电子科技有限公司 | Wafer polishing system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118650501A (en) * | 2024-08-20 | 2024-09-17 | 建平新瑞德陶瓷有限公司 | A ceramic plate grinding and polishing process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004106084A (en) * | 2002-09-17 | 2004-04-08 | Ebara Corp | Polishing device and substrate processing device |
| WO2010002595A2 (en) * | 2008-07-01 | 2010-01-07 | Applied Materials, Inc. | Modular base-plate semiconductor polisher architecture |
| US20160074988A1 (en) * | 2014-09-11 | 2016-03-17 | Ebara Corporation | Processing module, processing apparatus, and processing method |
| US10293454B2 (en) * | 2015-06-11 | 2019-05-21 | Toshiba Memory Corporation | Polishing head, polishing apparatus and polishing method |
| JP6517108B2 (en) * | 2015-08-05 | 2019-05-22 | 株式会社ディスコ | CMP polisher |
| US10160090B2 (en) * | 2015-11-12 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method |
| CN105598827B (en) * | 2016-01-05 | 2018-05-22 | 天津华海清科机电科技有限公司 | Chemical-mechanical polishing mathing |
| TWI615239B (en) * | 2017-03-20 | 2018-02-21 | 台灣積體電路製造股份有限公司 | Chemical mechanical polishing apparatus and chemical mechanical polishing process |
-
2018
- 2018-09-30 CN CN201811158614.7A patent/CN109304670A/en not_active Withdrawn
- 2018-10-12 WO PCT/CN2018/110038 patent/WO2020056817A1/en active Application Filing
- 2018-11-19 TW TW107141090A patent/TWI739048B/en active
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020057330A1 (en) * | 2018-09-20 | 2020-03-26 | 杭州众硅电子科技有限公司 | Polishing and loading/unloading component module |
| US12194592B2 (en) | 2018-09-20 | 2025-01-14 | Hangzhou Sizone Electronic Technology Inc. | Polishing and loading/unloading component module |
| CN110103119A (en) * | 2018-09-20 | 2019-08-09 | 杭州众硅电子科技有限公司 | A kind of polishing handling parts module |
| CN113732936B (en) * | 2021-05-08 | 2022-07-15 | 清华大学 | Polishing temperature control device, chemical mechanical polishing system and method |
| CN113732936A (en) * | 2021-05-08 | 2021-12-03 | 清华大学 | Polishing temperature control device, chemical mechanical polishing system and method |
| TWI825934B (en) * | 2021-09-07 | 2023-12-11 | 大陸商杭州眾硅電子科技有限公司 | Wafer polishing system |
| WO2023036012A1 (en) * | 2021-09-07 | 2023-03-16 | 杭州众硅电子科技有限公司 | Wafer polishing system |
| WO2023036011A1 (en) * | 2021-09-07 | 2023-03-16 | 杭州众硅电子科技有限公司 | Wafer polishing system |
| TWI818688B (en) * | 2021-09-07 | 2023-10-11 | 大陸商杭州眾硅電子科技有限公司 | Wafer polishing system |
| CN114147611A (en) * | 2021-09-07 | 2022-03-08 | 杭州众硅电子科技有限公司 | Wafer polishing system |
| CN113910099A (en) * | 2021-09-07 | 2022-01-11 | 杭州众硅电子科技有限公司 | A wafer polishing system |
| CN114425742A (en) * | 2021-12-29 | 2022-05-03 | 华海清科股份有限公司 | Distributed cleaning device |
| CN115338705A (en) * | 2022-06-30 | 2022-11-15 | 杭州众硅电子科技有限公司 | Continuous wafer polishing system |
| WO2024002224A1 (en) * | 2022-06-30 | 2024-01-04 | 杭州众硅电子科技有限公司 | Continuous wafer polishing system |
| CN115338718A (en) * | 2022-10-18 | 2022-11-15 | 杭州众硅电子科技有限公司 | Wafer polishing system |
| WO2024083063A1 (en) * | 2022-10-18 | 2024-04-25 | 杭州众硅电子科技有限公司 | Wafer polishing system |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI739048B (en) | 2021-09-11 |
| TW202012103A (en) | 2020-04-01 |
| WO2020056817A1 (en) | 2020-03-26 |
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| PB01 | Publication | ||
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Application publication date: 20190205 |