TWI718458B - Treatment liquid discharge pipe and substrate treatment device - Google Patents

Abstract

The present invention provides a processing liquid discharge pipe that prevents droplets from falling in a discharge port, and a substrate processing apparatus including the processing liquid discharge pipe. The processing liquid discharge pipe 41 has a flow path 44 in which the processing liquid flows, and the processing liquid flowing in the flow path 44 is discharged from the discharge port 41A to the surface of the substrate. The flow path 44 includes a hydrophilic flow path in which at least a part of the wall surface is hydrophilic, and a second piping flow path 442. In a state where the processing liquid discharge pipe 41 is attached to the substrate processing apparatus, the second pipe flow path 442 is inclined with respect to the vertical direction, and the upstream end is higher than the downstream end.

Description

Processing liquid discharge piping and substrate processing device

The present invention relates to a processing liquid discharge pipe through which a processing liquid flows in an apparatus for discharging a processing liquid onto a substrate surface, and a substrate processing apparatus including the processing liquid discharge pipe.

Previously, in the manufacturing steps of semiconductor wafers, various processing liquids such as photoresist liquid, etching liquid, cleaning liquid, and pure water were supplied to the surface of the substrate. In the supply process of the processing liquid, when the supply of the processing liquid is stopped, an unexpected drop of liquid droplets may occur from the discharge port of the processing liquid, which is a so-called “dripping phenomenon”. The dripping phenomenon of this kind of droplets is a cause of nonuniformity on the surface of the substrate, and therefore needs to be avoided.

Patent Document 1 discloses a supply nozzle in which the discharge hole of the treatment liquid is made super-hydrophilic in order to prevent the dripping phenomenon. In Patent Document 1, by making the discharge hole superhydrophilic, the droplets of the treatment liquid adhering to the surface of the tip portion do not become spherical, but expand into a thin film. This prevents spherical droplets from flowing down from the surface of the tip portion due to vibration. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 10-256116

[Problem to be Solved by the Invention] According to the configuration of Patent Document 1, it is possible to suppress the dripping phenomenon of the processing liquid adhering to the tip of the nozzle. However, if the processing liquid remains inside (upstream) from the front end portion, there is a possibility that the liquid dripping phenomenon may occur due to the weight of the processing liquid.

The present invention was made in view of the above-mentioned circumstances, and its object is to provide a processing liquid discharge pipe that prevents droplets from falling in the discharge port, and a substrate processing apparatus including the processing liquid discharge pipe. [Means to solve the problem]

In order to solve the problem, the first invention of the present application is a processing liquid discharge pipe, which is installed in a processing device that discharges a processing liquid to the surface of a substrate, and includes: a flow path through which the processing liquid flows; and a discharge port, The processing liquid flowing in the flow path is ejected to the surface of the substrate, and the flow path includes a hydrophilic flow path in which at least a part of the wall surface is hydrophilic. When installed in the processing device, the hydrophilic The sexual flow path is inclined with respect to the vertical direction, and the upstream end is higher than the downstream end.

The second invention of the present application is the processing liquid discharge pipe according to the first invention, wherein the flow path has a flow path whose wall surface is hydrophobic.

The third invention of the present application is the treatment liquid discharge pipe according to the first invention or the second invention, wherein the flow path has a first flow path whose wall surface is hydrophobic and is located on the downstream side of the hydrophilic flow path. In a state of being installed in the processing device, the first flow path extends in a vertical direction.

The fourth invention of the present application is the processing liquid discharge pipe according to the third invention, wherein the discharge port is located at the downstream end of the first flow path.

The fifth invention of the present application is the treatment liquid discharge pipe according to the third invention or the fourth invention, wherein the hydrophilic flow path is adjacent to the first flow path.

The sixth invention of the present application is a processing liquid discharge piping according to any one of the first to fifth inventions, wherein the flow path has a second flow path located upstream of the hydrophilic flow path, and is installed in In the state of the processing device, the second flow path extends in a horizontal direction.

The seventh invention of the present application is a treatment liquid discharge piping according to any one of the first to sixth inventions, wherein the hydrophilic flow path is formed of resin, and at least a part of the wall surface becomes hydrophilic by being immersed in the chemical liquid. Sex.

The eighth invention of the present application is a processing liquid discharge pipe according to any one of the first to seventh inventions, wherein the wall surface of the hydrophilic flow path is rougher than the wall surfaces of other flow paths.

The ninth invention of the present application is a processing liquid discharge piping, which is installed in a processing device that discharges a processing liquid to the surface of a substrate, and includes: a flow path for the processing liquid to circulate; and a discharge port to discharge the surface of the substrate The processing liquid circulates in the flow path, and the processing liquid discharge piping is formed of resin, and the flow path includes at least a part of the wall surface being immersed in the chemical solution in a state where water is in contact with at least a part of the wall surface The hydrophilic flow path becomes hydrophilic, and when installed in the processing device, the hydrophilic flow path is inclined with respect to the vertical direction, and the upstream end is higher than the downstream end.

The tenth invention of the present application is the treatment liquid discharge pipe according to the ninth invention, wherein the hydrophilic flow path is immersed in a chemical liquid in a state where the flow path is filled with water to become hydrophilic.

The eleventh invention of the present application is a substrate processing apparatus including any one of the first to tenth inventions of the processing liquid discharge piping, which includes: a chamber; Be held horizontally; a processing liquid supply unit that supplies processing liquid to the upper surface of the substrate held by the substrate holding unit via the processing liquid discharge pipe; and a retraction mechanism that discharges the processing liquid out of the flow of the pipe The treatment liquid in the road is drawn back toward the upstream side. [Effects of the invention]

According to the first to eleventh inventions of this application, the wall surface of the inclined flow path is hydrophilic. When the flow path is inclined, it becomes difficult to hold the treatment liquid. However, by making the wall surface of the inclined flow path hydrophilic, the holding force of the wall facing the treatment liquid is improved. That is, the treatment liquid is held on the upstream side of the discharge port. Thereby, it is possible to prevent dripping of the processing liquid from the discharge port (droplet phenomenon).

According to the fourth invention of the present application, the treatment liquid is not held by the wall surface of the first flow path, but is easily dripped from the discharge port. Thereby, it is possible to prevent the treatment liquid from remaining in the vicinity of the discharge port and dripping unexpectedly. In addition, it is possible to prevent the treatment liquid remaining in the vicinity of the discharge port from being dried due to contact with air.

According to the sixth invention of the present application, the flow path resistance of the treatment liquid in the second flow path is low. Therefore, in the second flow path, it is possible to avoid obstructing the flow of the processing liquid.

Hereinafter, the substrate processing apparatus including the processing liquid discharge pipe of the present invention will be described.

<1. Overall structure of substrate processing apparatus> FIG. 1 is a plan view of a substrate processing apparatus 100 of this embodiment. The substrate processing apparatus 100 is an apparatus that processes the surface of a disc-shaped substrate W (silicon substrate) in a manufacturing step of a semiconductor wafer. The substrate processing apparatus 100 performs liquid supply processing for supplying a processing liquid to the surface of the substrate W and drying processing for drying the surface of the substrate W.

The substrate processing apparatus 100 includes an indexer 101, a plurality of processing units 102, and a main transfer robot 103.

The indexer 101 is used to carry in the substrate W before processing from the outside, and to carry out the substrate W after processing to an outside location. In the indexer 101, a plurality of carriers for accommodating a plurality of substrates W are arranged. In addition, the indexer 101 includes a transfer robot (not shown). The transfer robot transfers the substrate W between the carrier in the indexer 101 and the processing unit 102 or the main transfer robot 103. Furthermore, in the carrier, for example, a known front opening unified pod (FOUP) or Standard Mechanical Inter Face (SMIF) box, or a storage box, which stores the substrate W in a closed space can be used. Open Cassette (OC) in which the substrate W is in contact with the outside air.

The processing unit 102 is a so-called single-chip processing section that processes the substrate W piece by piece. The plurality of processing units 102 are arranged around the main transport robot 103. In this embodiment, the four processing units 102 arranged around the main transport robot 103 are stacked in three layers in the height direction. That is, the substrate processing apparatus 100 of this embodiment includes twelve processing units 102 in total. The plurality of substrates W are processed in parallel in each processing unit 102. However, the number of processing units 102 included in the substrate processing apparatus 100 is not limited to twelve, and the number can be changed as appropriate. For example, it can also be twenty-four, sixteen, eight, four, one, etc.

The main transport robot 103 is a mechanism for transporting the substrate W between the indexer 101 and the plurality of processing units 102. The main transfer robot 103 includes, for example, a hand that holds the substrate W and an arm that moves the hand. The main transport robot 103 takes out the substrate W before processing from the indexer 101 and transports it to the processing unit 102. In addition, after the processing of the substrate W in the processing unit 102 is completed, the main transport robot 103 takes out the processed substrate W from the processing unit 102 and transports it to the indexer 101.

<2. Configuration of the processing unit> Next, the configuration of the processing unit 102 will be described. Hereinafter, one of the plurality of processing units 102 included in the substrate processing apparatus 100 will be described, but the other processing units 102 also have the same configuration.

FIG. 2 is a plan view of the processing unit 102. FIG. 3 is a longitudinal cross-sectional view of the processing unit 102. As shown in FIGS. 2 and 3, the processing unit 102 includes a chamber 10, a substrate holding unit 20, a rotating mechanism 30, a processing liquid supply unit 40, a processing liquid collection unit 50, and a control unit 60.

The chamber 10 is a housing in which a processing space 11 for processing the substrate W is built-in. The chamber 10 includes: a side wall 12, a top plate portion 13, and a bottom plate portion 14. The side wall 12 surrounds the side of the processing space 11. The top plate portion 13 covers the upper part of the processing space 11. The bottom plate portion 14 covers the lower part of the processing space 11. The substrate holding unit 20, the rotating mechanism 30, the processing liquid supply unit 40, and the processing liquid collection unit 50 are housed in the chamber 10. A loading/unloading port and a shutter for opening and closing the loading/unloading port are provided in a part of the side wall 12 (all are not shown). In the carry-in and carry-out port, the substrate W is carried into the chamber 10 and the substrate W is carried out from the chamber 10.

As shown in FIG. 3, a fan filter unit (FFU) 15 is provided on the ceiling portion 13 of the chamber 10. The fan filter unit 15 includes a dust collection filter such as a High Efficiency Particulate Air (HEPA) filter, and a fan that generates airflow. When the fan filter unit 15 is operated, the air in the clean room (clean room) where the substrate processing apparatus 100 is installed is taken to the fan filter unit 15, cleaned by the dust collecting filter, and supplied to the chamber 10 in the processing space 11. Thereby, a down flow of clean air is formed in the processing space 11 in the chamber 10.

In addition, an exhaust duct 16 is connected to a part of the lower part of the side wall 12. After the air supplied from the fan filter unit 15 flows downward in the chamber 10, it is discharged to the outside of the chamber 10 through the exhaust duct 16.

The substrate holding portion 20 is a mechanism for holding the substrate W horizontally (in a posture in which the normal line faces the vertical direction) inside the chamber 10. The substrate holding portion 20 includes a disk-shaped spin base 21 and a plurality of chuck pins 22. The plurality of clamping pins 22 are provided at equal angular intervals along the outer peripheral portion of the upper surface of the spin base 21. The substrate W is held by the plurality of clamping pins 22 in a state where the surface to be processed on which the pattern is formed faces the upper side. Each clamping pin 22 is in contact with the lower surface and the outer peripheral end surface of the peripheral edge portion of the substrate W, and supports the substrate W at an upper position from the upper surface of the spin base 21 via a minute gap.

A clamping pin switching mechanism 23 for switching the positions of the plurality of clamping pins 22 is provided inside the spin base 21. The clamp pin switching mechanism 23 switches the plurality of clamp pins 22 between a holding position for holding the substrate W and a release position for releasing the holding of the substrate W.

The rotation mechanism 30 is a mechanism for rotating the substrate holding portion 20. The rotating mechanism 30 is housed in a motor cover 31 provided below the spin base 21. As shown by a dotted line in FIG. 3, the rotating mechanism 30 includes a spin motor 32 and a support shaft 33. The support shaft 33 extends in the vertical direction, its lower end is connected to the spin motor 32, and the upper end is fixed at the center of the lower surface of the spin base 21. When the spin motor 32 is driven, the support shaft 33 rotates with its shaft core 330 as the center. In addition, together with the support shaft 33, the substrate holding portion 20 and the substrate W held by the substrate holding portion 20 also rotate around the shaft core 330.

The processing liquid supply unit 40 is a mechanism that supplies the processing liquid to the upper surface of the substrate W held by the substrate holding unit 20. The processing liquid supply unit 40 has three processing liquid discharge pipes 41. The three processing liquid discharge pipes 41 each have a flow path in which the processing liquid flows. The processing liquid discharge pipe 41 is formed of, for example, a fluororesin such as polytetrafluoroethylene (PTFE) or perfluoroalkoxy alkane (PFA). In addition, the number of processing liquid discharge pipes 41 is not limited to three, and may be one, two, or four or more.

As shown in FIG. 2, one end of the processing liquid discharge pipe 41 is supported by the motor 42. The processing liquid discharge pipe 41 has an end supported on the motor 42 side as a base end, extends from the base end in the horizontal direction, and has a front end that is bent downward in the vertical direction. That is, the processing liquid discharge pipe 41 of this embodiment has an L-shaped outer shape. A discharge port 41A is provided at the lower end of the portion of the processing liquid discharge pipe 41 that is bent downward in the vertical direction.

The processing liquid discharge piping 41 is driven by the motor 42 and is individually rotated in the horizontal direction with the motor 42 as the center as shown by the arrow in FIG. 2. Thereby, the discharge port 41A of the processing liquid discharge pipe 41 moves between the processing position above the substrate W held by the substrate holding portion 20 and the retreat position outside the processing liquid collecting portion 50. When the processing liquid is supplied, the discharge port 41A is arranged at a processing position above the substrate W. Then, the processing liquid flowing in the flow path of the processing liquid discharge pipe 41 is discharged to the upper surface of the substrate W from the discharge port 41A. The specific configuration of the treatment liquid discharge pipe 41 will be described in detail below.

A liquid supply part for supplying a processing liquid is connected to each processing liquid discharge pipe 41, respectively. FIG. 4 is a diagram showing an example of the liquid supply unit 45 connected to the processing liquid discharge pipe 41. FIG. 4 shows an example of a case where an SPM cleaning liquid, which is a mixed _{liquid of sulfuric acid (H 2} SO ₄ ) and hydrogen peroxide water (H ₂ O ₂ ) as a treatment liquid, is supplied.

The liquid supply unit 45 has a sulfuric acid supply source 451 and a hydrogen peroxide water supply source 452. A first valve 453 is provided in the middle of the flow path connected to the sulfuric acid supply source 451. In addition, a second valve 454 is provided in the middle of the flow path connected to the hydrogen peroxide water supply source 452. The flow paths connected to each of the sulfuric acid supply source 451 and the hydrogen peroxide water supply source 452 merge on the downstream side and are connected to the processing liquid discharge pipe 41.

When the first valve 453 and the second valve 454 are opened in the state where the discharge port 41A is arranged at the processing position, the sulfuric acid is discharged from the sulfuric acid supply source 451, and the hydrogen peroxide water is discharged from the hydrogen peroxide water supply source 452. The discharged sulfuric acid and hydrogen peroxide water merge to form an SPM cleaning liquid, and the SPM cleaning liquid is supplied to the processing liquid discharge pipe 41. Next, the SPM cleaning liquid is discharged from the discharge port 41A of the processing liquid discharge pipe 41 toward the upper surface of the substrate W held by the substrate holding portion 20.

In addition, the three processing liquid discharge pipes 41 respectively discharge different processing liquids. As an example of the treatment liquid, in addition to the above-mentioned SPM cleaning liquid, SC1 cleaning liquid (a mixture of ammonia, hydrogen peroxide water and pure water), SC2 cleaning liquid (hydrochloric acid, hydrogen peroxide water and pure water) ), DHF (Dilute Hydrofluoric Acid) cleaning solution (dilute hydrofluoric acid), and pure water (deionized water), etc.

In addition, a suck back pipe 43 is provided in the processing liquid discharge pipe 41. The suction pipe 43 is an example of the "return mechanism" of the present invention. The suction pipe 43 is a pipe extending in the vertical direction. The upper end of the suction pipe 43 is connected to a portion of the processing liquid discharge pipe 41 that extends in the horizontal direction. Thereby, the flow path extending in the horizontal direction of the processing liquid discharge pipe 41 is branched. In addition, the height of the lower end of the suction pipe 43 is lower than the height of the discharge port 41A.

When the first valve 453 and the second valve 454 are closed and the supply of the processing liquid from the liquid supply unit 45 to the processing liquid discharge pipe 41 is stopped, the discharge of the processing liquid from the discharge port 41A is stopped. At this time, the treatment liquid remaining in the flow path 44 of the treatment liquid discharge pipe 41 flows into the flow path of the suction pipe 43 by the principle of siphon. That is, since the height of the lower end of the suction pipe 43 is lower than the height of the discharge port 41A, the processing liquid remaining in the flow path 44 on the downstream side from the connection portion of the suction pipe 43 is drawn back toward the suction pipe 43 . This suppresses the dripping of the processing liquid from the discharge port 41A.

The processing liquid collection part 50 is a part which collects the processing liquid after use. As shown in FIG. 3, the processing liquid collection part 50 includes an inner cup 51, a middle cup 52 and an outer cup 53. The inner cup body 51, the middle cup body 52, and the outer cup body 53 can be moved up and down independently of each other by the lifting mechanism 500 (refer to FIG. 5).

The inner cup 51 includes an annular first guide plate 510 surrounding the periphery of the substrate holding portion 20. The middle cup 52 includes an annular second guide plate 520 located outside and on the upper side of the first guide plate 510. The outer cup 53 includes an annular third guide plate 530 located outside and on the upper side of the second guide plate 520. In addition, the bottom of the inner cup 51 is expanded to below the middle cup 52 and the outer cup 53. Furthermore, on the upper surface of the bottom, a first drain tank 511, a second drain tank 512, and a third drain tank 513 are sequentially provided from the inside.

After the processing liquid discharged from each processing liquid discharge pipe 41 of the processing liquid supply unit 40 is supplied to the substrate W, it is scattered outward due to the centrifugal force generated by the rotation of the substrate W. Then, the processing liquid scattered from the substrate W is collected in any one of the first guide plate 510, the second guide plate 520, and the third guide plate 530. The processing liquid collected on the first guide plate 510 passes through the first drainage tank 511 and is discharged to the outside of the processing unit 102. The processing liquid collected on the second guide plate 520 passes through the second liquid drain tank 512 and is discharged to the outside of the processing unit 102. The processing liquid collected on the third guide plate 530 passes through the third liquid drain tank 513 and is discharged to the outside of the processing unit 102.

As described above, the processing unit 102 has multiple discharge paths for the processing liquid. Therefore, the processing liquid supplied to the substrate can be recovered for each type. Therefore, the disposal or regeneration treatment of the recovered treatment liquid can also be performed separately according to the properties of each treatment liquid.

The control unit 60 is a part for performing operation control of each unit in the processing unit 102. FIG. 5 is a block diagram showing the connection between the control unit 60 and each unit in the processing unit 102. As shown conceptually in FIG. 5, the control unit 60 includes a processor 61 such as a central processing unit (CPU), a memory 62 such as a random access memory (random access memory, RAM), and a hard magnetic A computer in the storage section 63 such as a disc player. In the storage section 63, a computer program P for executing the processing of the substrate W in the processing unit 102 is installed.

In addition, as shown in FIG. 5, the control unit 60 interacts with the fan filter unit 15, the clamp pin switching mechanism 23, the spin motor 32, the three motors 42, and the first valve 453 and the second valve of the processing liquid supply unit 40. Valve 454, and lifting mechanism of treatment liquid collection part 50 They are connected communicatively. The control unit 60 temporarily reads the computer program P and data stored in the storage unit 63 to the memory 62, and based on the computer program P, the processor 61 performs arithmetic processing to control the operations of the various units. Thereby, the processing of the substrate W in the processing unit 102 is performed.

<3. Configuration of treatment liquid discharge pipe 41>

Next, the specific configuration of the processing liquid discharge pipe 41 will be described. FIG. 6 is a partial cross-sectional view of the processing liquid discharge pipe 41.

As shown in FIG. 6, the processing liquid discharge pipe 41 includes a first pipe portion 411, a second pipe portion 412, and a third pipe portion 413. The first piping portion 411 is a portion extending in the horizontal direction. The upstream end of the first piping portion 411 is connected to the aforementioned liquid supply portion 45. The second piping portion 412 is an approximately L-shaped portion located at the curved portion of the processing liquid discharge pipe 41. The upstream end of the second piping portion 412 is connected to the downstream end of the first piping portion 411. The downstream end of the second piping portion 412 is located below the upstream end of the second piping portion 412. In addition, the second piping portion 412 is bent and extends from an end on the upstream side to an end on the downstream side. The third piping portion 413 is a portion extending in the vertical direction. The upstream end of the third piping portion 413 is connected to the downstream end of the second piping portion 412. The downstream end of the third piping portion 413 is located below the upstream end of the third piping portion 413. The aforementioned discharge port 41A is provided at the lower end of the third piping portion 413.

Furthermore, the first piping part 411, the second piping part 412, and the third piping part 413 may be one part or different parts.

The processing liquid discharge pipe 41 has a flow path 44 in which the processing liquid flows. The flow path 44 includes a first piping flow path 441, a second piping flow path 442, and a third piping flow path 443 in this order from the upstream side.

The first piping flow path 441 is formed inside the first piping portion 411 and is a straight flow path extending in the horizontal direction. The suction pipe 43 is connected to the first pipe portion 411. That is, the suction pipe 43 is branched from the first pipe portion 411. The wall surface of the first pipe flow path 441, that is, the inner wall surface 411A of the first pipe portion 411, is hydrophobic. Specifically, the inner wall surface 411A of the first piping portion 411 is a smoother surface than the inner wall surface 412A of the second piping portion 412 described later. The first piping flow path 441 is an example of the "second flow path" of the present invention.

The second piping flow path 442 is formed inside the second piping portion 412 and is a flow path inclined with respect to the vertical direction. The second piping flow path 442 exists adjacent to the downstream side of the first piping flow path 441. The position of the end on the upstream side of the second piping flow path 442 is higher than the position of the end on the downstream side of the second piping flow path 442. The wall surface of the second pipe flow path 442, that is, the inner wall surface 412A of the second pipe portion 412, is hydrophilic. Specifically, the inner wall surface 412A of the second pipe portion 412 is a rougher surface than the inner wall surface 411A of the first pipe portion 411 described above and the inner wall surface 413A of the third pipe portion 413 described later. In addition, the inner wall surface 412A of the second piping portion 412 has a rougher surface than the outer wall surface of the processing liquid discharge pipe 41. The second piping flow path 442 is an example of the "hydrophilic flow path" of the present invention.

The third piping flow path 443 is formed inside the third piping portion 413 and is a straight flow path extending in the vertical direction. The third piping flow path 443 is adjacent to the downstream side of the second piping flow path 442 and exists. The lower end of the third piping flow path 443 is a discharge port 41A. The wall surface of the third pipe flow path 443, that is, the inner wall surface 413A of the third pipe portion 413, is hydrophobic. Specifically, the inner wall surface 413A of the third piping portion 413 is a smoother surface than the inner wall surface 412A of the second piping portion 412 described above. The third piping flow path 443 is an example of the "first flow path" of the present invention.

As a method of making the wall surface of the second pipe flow path 442 hydrophilic, for example, a method of immersing the fluororesin processing liquid discharge pipe 41 in hydrochloric acid (hydrogen chloride (HCL) aqueous solution) is mentioned. When immersed in hydrochloric acid, the inside of the second piping part 412 among the first piping part 411 to the third piping part 413 is filled with only water. In this state, when the processing liquid discharge pipe 41 is immersed in hydrochloric acid, the hydrochloric acid gas dissolved in the hydrochloric acid permeates the second pipe portion 412. In this way, the permeated hydrochloric acid gas acts on the surface of the inner wall surface 412A of the second pipe portion 412 that is in contact with water. As a result, the inner wall surface 412A of the second piping portion 412 is roughened. In contrast, since only hydrochloric acid gas is accumulated in the first pipe portion 411 and the third pipe portion 413 that are not filled with water, the inner wall surface 411A and the inner wall surface 413A are not roughened.

That is, the surface roughness of the inner wall surface 412A of the second pipe portion 412 is larger than the surface roughness of the inner wall surface 411A of the first pipe portion 411 and the inner wall surface 413A of the third pipe portion 413. The surface roughness of the inner wall surface 412A of the second piping portion 412 is preferably, for example, Japanese Industrial Standard (JIS) B 0601:2013 (corresponding to the international standard: International Organization for Standardization (ISO) 4287:1997 The value of "arithmetic mean roughness Ra" defined in) is Ra=0.04～0.15.

The wall surface of the first piping flow path 441 is hydrophobic, so the flow path resistance of the processing liquid in the first piping flow path 441 is low. Therefore, when the processing liquid is supplied from the liquid supply unit 45, the flow of the processing liquid in the first pipe flow path 441 is not easily hindered.

In addition, since the wall surface of the third piping flow path 443 is hydrophobic, the processing liquid in the third piping flow path 443 is not held by the wall surface of the third piping flow path 443, but is likely to drip from the discharge port 441A. In addition, when the supply of the processing liquid from the liquid supply unit 45 is stopped, the processing liquid in the third pipe flow path 443 is drawn back to the upstream side by the suction pipe 43. Therefore, the treatment liquid is unlikely to remain in the third pipe flow path 443. As a result, it is possible to prevent the treatment liquid from remaining in the third piping flow path 443, and the remaining treatment liquid can be prevented from dripping unexpectedly. In addition, it is possible to prevent the treatment liquid remaining in the vicinity of the discharge port 41A from drying due to contact with air.

In addition, the wall surface of the second piping flow path 442 is hydrophilic, so the treatment liquid remaining in the second piping flow path 442 is easily held on the wall surface of the second piping flow path 442. Therefore, the treatment liquid remaining in the second piping flow path 442 hardly flows down to the third piping flow path 443. In particular, the second pipe flow path 442 is inclined with respect to the vertical direction. The processing liquid held by the wall surface of the flow path tends to flow down downstream due to the own weight of the processing liquid. Regarding the ease of flow of the processing liquid in the flow path, the case where the flow path is inclined is greater than the case where the flow path is not inclined. When the processing liquid held by the wall surface of the second piping flow path 442 flows down, the processing liquid drips from the discharge port 41A. However, in this processing liquid discharge pipe 41, the wall surface of the inclined second pipe flow path 442 is made hydrophilic, which increases the holding force of the processing liquid. This can prevent the treatment liquid from dripping due to its own weight.

<4. Processing of substrate W> Hereinafter, an example of processing of the substrate W in the substrate processing apparatus 100 configured as described above will be described. The following processing is performed by the control unit 60 controlling each unit.

When the substrate W is carried into the chamber 10 by the main transfer robot 103, the substrate holding portion 20 horizontally holds the carried substrate W by the plurality of clamping pins 22. Then, when the spin motor 32 of the rotation mechanism 30 is driven, the substrate W is started to rotate. Then, the motor 42 is driven, and the third piping portion 413 of the processing liquid supply portion 40 moves toward the processing position facing the upper surface of the substrate W. Next, the first valve 453 and the second valve 454 of FIG. 4 are opened, and the SPM cleaning liquid, which is a mixed liquid of sulfuric acid and hydrogen peroxide water, is discharged from the third pipe portion 413 toward the upper surface of the substrate W. The temperature of the SPM cleaning liquid is set to 150°C to 200°C, for example.

After the SPM cleaning solution has been discharged for a predetermined time, only the first valve 453 is closed to stop the supply of sulfuric acid. Thereby, the so-called "overwater extrusion process" in which only the sulfuric acid hydrogen peroxide water is discharged from the third piping portion 413 is performed. The overwater extrusion treatment is performed for the purpose of washing away sulfuric acid components remaining in the flow path and preventing the unintended dripping of sulfuric acid from the third piping portion 413 after the supply of the treatment liquid is stopped. After that, when a predetermined time has elapsed, the second valve 454 is also closed, and the discharge of hydrogen peroxide water is stopped.

After the supply of various processing liquids to the substrate W is completed, the surface of the substrate W is dried. When the drying process of the substrate W is completed, the holding of the substrate W by the plurality of clamping pins 22 is released. After that, the processed substrate W is taken out from the substrate holding portion 20 by the main transfer robot 103 and carried out to the outside of the chamber 10.

As described above, by making the wall surface of the inclined second pipe flow path 442 of the processing liquid discharge pipe 41 hydrophilic, the holding force of the processing liquid on the wall surface of the second pipe flow path 442 can be improved. Furthermore, it is possible to prevent the processing liquid held by the wall surface of the second pipe flow path 442 from dripping due to its own weight. As a result, the surface of the substrate W can be processed accurately. In particular, the SPM cleaning solution shown in this example has a higher specific gravity (for example, purer water) and a lower surface tension (for example, purer water). Such a high specific gravity and low surface tension liquid medicine is extremely easy to drip due to its own weight. However, in the substrate processing apparatus 100 of this type, by making the wall surface of the second pipe flow path 442 hydrophilic, it is possible to prevent the drop of the chemical solution due to its own weight.

<5. Modifications> The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments.

The flow path for making the wall surface hydrophilic is not limited to the second piping flow path 442 of the above-mentioned embodiment. The flow path for making the wall surface hydrophilic should be at least a flow path that is more upstream than the discharge port 41A, is inclined with respect to the vertical direction, and the upstream end is located at a higher position than the downstream end. can.

FIG. 7 is a partial cross-sectional view of a processing liquid discharge pipe 46 according to a modification.

The processing liquid discharge pipe 46 of FIG. 7 includes a first pipe portion 461, a second pipe portion 462, and a third pipe portion 463. The first piping portion 461 is a portion extending in the horizontal direction. The second piping portion 462 is a linear portion located on the downstream side of the first piping portion 461 and inclined with respect to the vertical direction. The upstream end of the second piping portion 462 is connected to the downstream end of the first piping portion 461. The downstream end of the second piping portion 462 is located below the upstream end of the second piping portion 462. The third piping portion 463 is a portion located on the downstream side of the second piping portion 462 and extending in the horizontal direction. The upstream end of the third piping portion 463 is connected to the downstream end of the second piping portion 462. A discharge port 46A is provided at an end on the downstream side of the third piping portion 463. The third piping portion 463 is an example of the "first linear flow path" of the present invention.

The processing liquid discharge pipe 46 has a flow path 47 in which the processing liquid circulates. The flow path 47 includes a first piping flow path 471, a second piping flow path 472, and a third piping flow path 473.

The first piping flow path 471 is formed inside the first piping portion 461 and is a straight flow path extending in the horizontal direction. The suction pipe 43 illustrated in FIG. 4 is connected to the first pipe portion 461. The wall surface of the first pipe flow path 471, that is, the inner wall surface 461A of the first pipe portion 461, is hydrophobic.

The second piping flow path 472 is formed inside the second piping portion 462 and is a flow path inclined with respect to the vertical direction. The second piping flow path 472 is located on the downstream side of the first piping flow path 471. The position of the upstream end of the second piping flow path 472 is higher than the position of the downstream end of the second piping flow path 472. The wall surface of the second pipe flow path 472, that is, the inner wall surface 462A of the second pipe portion 462, is hydrophilic. As in the above-described embodiment, the wall surface of the second pipe flow path 472 is hydrophilic by immersing the processing liquid discharge pipe 46 in hydrochloric acid in a state where the second pipe flow path 472 is filled with water. The second piping flow path 472 is an example of the "hydrophilic flow path" of the present invention.

The third piping flow path 473 is formed inside the third piping portion 463 and is a straight flow path extending in the horizontal direction. The third piping flow path 473 is located on the downstream side of the second piping flow path 472. The wall surface of the third pipe flow path 473, that is, the inner wall surface 463A of the third pipe portion 463, is hydrophobic.

In the processing liquid discharge pipe 46 configured as described above, similarly to the processing liquid discharge pipe 41 of the above embodiment, the processing liquid is also held by the wall surface of the inclined second pipe flow path 472. This prevents the treatment liquid from dripping due to its own weight.

In addition, in the above-mentioned embodiment and the modification of FIG. 7, the entire wall surface of the inclined second pipe flow path 472 is made hydrophilic, but as long as at least a part of the wall surface of the inclined second pipe flow path 472 is hydrophilic Sex is enough. In this case, it is only necessary to seal water in the wall surface of the portion to be hydrophilic in the second pipe flow path 472, and to immerse the treatment liquid discharge pipe in hydrochloric acid.

In addition, the method of making the wall surface of the flow path hydrophilic may be a method other than immersion in a chemical liquid. In addition, the method of making the wall surface of the flow path hydrophilic may be a method other than roughening. Furthermore, in the above-mentioned embodiment and the modification of FIG. 7, the wall surfaces of the first piping flow path 441 and the first piping flow path 471 located upstream of the second piping flow path 442 and the second piping flow path 472 are set as Hydrophobic, but can also be made hydrophilic. In addition, the first piping part 411, the second piping part 412, and the third piping part 413 are made of different parts, and only the piping whose wall surface should be made hydrophilic can be immersed in hydrochloric acid.

Furthermore, in the above description, each pipe does not have to extend in parallel to the defined direction (vertical direction or horizontal direction). For example, the third piping portion 413 of FIG. 6 may be slightly inclined with respect to the vertical direction.

The detailed configuration of the substrate processing apparatus 100 may be different from the drawings in this application. In addition, the respective elements appearing in the above-mentioned embodiment and modification examples may be appropriately combined within a range that does not cause any contradiction.

10‧‧‧Chamber 11‧‧‧Processing space 12‧‧‧Side wall 13‧‧‧Top plate 14‧‧‧Bottom plate 15‧‧‧Fan filter unit 16‧‧‧Exhaust duct 20‧‧‧Substrate holding Section 21‧‧‧Spin base 22‧‧‧Clamp pin 23‧‧‧Clamp pin switching mechanism 30‧‧‧Rotation mechanism 31‧‧‧Motor cover 32‧‧‧Spin motor 33‧‧‧Support shaft 40 ‧‧‧Processing liquid supply part 41, 46‧‧‧Processing liquid discharge pipe 41A, 46A‧‧‧Discharge outlet 42‧‧‧Motor 43‧‧‧Suction pipe 44, 47‧‧‧Flow path 45‧‧‧Suction Liquid part 50‧‧‧Process liquid collection part 51‧‧‧Inner cup 52‧‧‧Middle cup 53‧‧‧Outer cup 60‧‧‧Control part 61‧‧‧Processor 62‧‧‧Memory 63 ‧‧‧Storage part 100‧‧‧Substrate processing device 101‧‧‧Indexer 102‧‧‧Processing unit 103‧‧‧Main transport robot 330‧‧‧Axle core 411,461‧‧‧First piping part 411A, 412A, 413A, 461A, 462A, 463A‧‧‧Inner wall surface 412, 462‧‧‧Second piping part 413, 463‧‧‧Third piping part 441, 471‧‧‧First piping flow path 442, 472‧‧‧ The second piping flow path 443, 473‧‧‧The third piping flow path 451‧‧‧Sulfuric acid supply source 452‧‧‧Hydrogen peroxide water supply source 453‧‧‧The first valve 454‧‧‧The second valve 500‧‧‧ Lifting mechanism 510‧‧‧First guide plate 511‧‧‧First drainage tank 512‧‧‧Second drainage tank 513‧‧‧Third drainage tank 520‧‧‧Second guide plate 530‧‧‧Second guide plate 530‧‧‧ Three guide board P‧‧‧computer program W‧‧‧base board

Fig. 1 is a plan view of a substrate processing apparatus. Fig. 2 is a plan view of the processing unit. Fig. 3 is a longitudinal sectional view of the processing unit. Fig. 4 is a diagram showing an example of a liquid supply unit connected to a processing liquid discharge pipe. Fig. 5 is a block diagram showing the connection between the control unit and each unit in the processing unit. Fig. 6 is a partial cross-sectional view of a processing liquid discharge pipe. Fig. 7 is a partial cross-sectional view of a processing liquid discharge pipe according to a modification.

41‧‧‧Processing liquid discharge piping

41A‧‧‧Exit

44‧‧‧Flow Path

411‧‧‧First Piping Department

411A‧‧‧Inner wall

412‧‧‧Second Piping Department

412A‧‧‧Inner wall

413‧‧‧The third piping department

413A‧‧‧Inner wall

441‧‧‧The first piping flow path

442‧‧‧Second piping flow path

443‧‧‧Third piping flow path

Claims (11)

A processing liquid discharge piping is installed in a processing device that discharges a processing liquid to a substrate surface, and includes: a flow path for the processing liquid to circulate; and a discharge port to discharge the processing liquid flowing in the flow path to the surface of the substrate , And the flow path includes: a hydrophilic flow path with at least a part of the wall surface being hydrophilic, and when installed in the processing device, the hydrophilic flow path is inclined with respect to the vertical direction, and the upstream side The end of is higher than the end on the downstream side. The processing liquid discharge piping described in claim 1, wherein the flow path includes a flow path whose wall surface is hydrophobic. The processing liquid discharge piping described in claim 1, wherein the flow path includes: a first flow path that is located on the downstream side of the hydrophilic flow path and has a hydrophobic wall surface, and is installed in the process In the state of the device, the first flow path extends in the vertical direction. The processing liquid discharge piping described in claim 3, wherein the discharge port is located at the downstream end of the first flow path. The processing liquid discharge piping described in claim 3, wherein the hydrophilic flow path is adjacent to the first flow path. The processing liquid discharge piping described in claim 1, wherein the flow path includes: a second flow path located upstream of the hydrophilic flow path, and in a state of being installed in the treatment device, The second flow path extends in the horizontal direction. The processing liquid discharge piping described in claim 1, wherein the hydrophilic flow path is formed of a resin and is immersed in a chemical liquid to make at least a part of the wall surface hydrophilic. The processing liquid discharge piping described in claim 1, wherein the wall surface of the hydrophilic flow path which is hydrophilic is rougher than the wall surfaces of other flow paths. A processing liquid discharge pipe is installed in a processing device that discharges a processing liquid to a substrate surface, and includes: a flow path for the processing liquid to circulate; and a discharge port for processing the substrate surface and flow through the flow path The processing liquid discharge pipe includes: a resin, and the flow path includes: a hydrophilic flow path that is immersed in the chemical solution in a state where water contacts at least a part of the wall surface to make at least a part of the wall surface hydrophilic In a state of being attached to the processing device, the hydrophilic flow path is inclined with respect to the vertical direction, and the end on the upstream side is higher than the end on the downstream side. The processing liquid discharge piping described in claim 9, wherein the hydrophilic flow path is immersed in a chemical liquid in a state where the flow path is filled with water to become hydrophilic. A substrate processing apparatus, comprising the processing liquid discharge piping according to any one of items 1 to 10 in the scope of the patent application, and the substrate processing apparatus includes: a chamber; a substrate holding portion, located in the chamber The inside of the substrate is held horizontally; the processing liquid supply unit supplies the processing liquid to the upper surface of the substrate held by the substrate holding unit via the processing liquid discharge pipe; and the retraction mechanism discharges the processing liquid from the pipe The processing liquid in the flow path is drawn back toward the upstream side.

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