TWI680041B - Multi-point diamond cutter - Google Patents

Abstract

The multi-point diamond cutter of the present invention can reduce the number of tool replacements even if the sharp points are worn due to scoring. The solution is as follows: the corners of the base 11 of the diamond cutter 10 form inclined surfaces from both sides of the base, and the two sides of the ridge line are used as sharp points P1 to P16. Tilt the diamond cutter 10 so that one sharp point contacts the substrate and scribing without rolling. When the sharp point is worn by the scoring, the diamond cutter 10 is rotated to cause the other sharp points to contact the substrate to perform the scoring. Thereby, a plurality of sharp points can be used in one diamond tool, and the frequency of tool replacement can be reduced.

Description

Multi-point diamond cutter

The present invention relates to a multi-point diamond cutter for scoring a brittle material substrate such as a glass substrate or a silicon wafer with diamond sharp points.

To scribe glass substrates or silicon wafers, a tool that uses a scribe wheel or a diamond tip made of single crystal diamond has been used. For glass substrates, the scribe wheel that rolls relative to the substrate is mainly used. However, from the perspective of improving the strength of the substrate after scribed, etc., the point of the diamond with a fixed blade is also discussed. Patent Documents 1 and 2 propose sharp-point cutters for scoring high-hardness substrates such as sapphire wafers and alumina wafers. In these patent documents, a tool provided with a tangent point on a ridgeline of a pyramid or a tool having a cone at the front end is used. In addition, Patent Document 3 proposes a scoring device using a glass scriber having a conical tip for scoring a glass plate.

Patent Document 1: Japanese Patent Application Laid-Open No. 2003-183040

Patent Document 2: Japanese Patent Laid-Open No. 2005-079529

Patent Document 3: Japanese Patent Application Publication No. 2013-043787

When scoring is performed using a conventional fixed-blade tool, the sharp point must be changed due to abrasion of the sharp point. In a pyramid or cone tool, the apex of the sharp point can be 2 Or up to 4 places. Therefore, the tool must be changed when changing the sharp points at two or four points, and there is a problem of frequent replacement. In addition, in the scoring performed by the tool, the sharp point must be brought into contact with the substrate at an appropriate angle. However, in conventional tools, it is necessary to rotate the tool in the axial direction when changing the sharp point, and it is not easy to set the contact angle with good accuracy.

The present invention has been made in view of such a conventional problem, and an object thereof is to provide a diamond cutter that can easily change the position of the sharp point and reduce the frequency of replacement even if the sharp point used for scoring is worn.

In order to solve this problem, the multi-point diamond cutter of the present invention includes a base having an angular columnar shape with a predetermined thickness, and having two bottom surfaces and a plurality of outer peripheral surfaces; a ridge line, an intersection of the outer peripheral surfaces; , At least one side is ground from the bottom surface toward the ridge line; at least the outer peripheral surface of the base is formed of diamond (diamond), and the intersection of the inclined surface and the ridge line is used as a sharp point.

Here, the inclined surface may include a first inclined surface formed from a bottom surface of one side of the base and a second inclined surface formed from a bottom surface of the other side of the base.

Here, it may be a second edge line having two polishing surfaces formed by grinding from two adjacent peripheral surfaces of the base toward the end of the edge line, and a second edge line intersecting the line of the two polishing surfaces. An intersection of the two polished surfaces and the second edge line is defined as a sharp point.

Here, the inclined surfaces may be formed by laser processing.

Here, the two polishing surfaces may be formed by machining.

According to the present invention having the above-mentioned features, a plurality of sharp points can be provided around the diamond cutter. Therefore, the following effects can be obtained: even if a sharp point is worn, the drill can be changed by changing Using new sharp points with a fixed angle of the stone cutter can reduce the frequency of diamond cutter replacement. Further, since the sharp point can be changed while the mounting angle of the tool with respect to the substrate is maintained constant, the contact angle of the sharp point can be easily set.

10, 30‧‧‧ multi-point diamond cutter

11, 31‧‧‧ base

12, 32‧‧‧through holes

13a ~ 13h, 33a ~ 33h‧‧‧Edge

14a ~ 14h, 34a ~ 34h‧‧‧The first inclined surface

15a ~ 15h, 35a ~ 35h ‧‧‧ 2nd inclined surface

21a, 51c‧‧‧3rd inclined surface

36a, 36b ~ 43a, 43b‧‧‧ polished surface

P1 ~ P16‧‧‧ sharp points

FIG. 1 is a front view and a side view of a multi-point diamond cutter according to the first embodiment of the present invention.

Fig. 2 is a side view showing the scribing using the multi-point diamond cutter of the first embodiment.

FIG. 3 is an enlarged view of a main part of a multi-point diamond cutter showing a modified example of the first embodiment of the present invention.

4 is a front view and a side view of a diamond cutter according to a second embodiment of the present invention.

FIG. 5 is an enlarged bottom view of a main part of a diamond cutter according to a second embodiment of the present invention.

FIG. 6 is a side view and a bottom view of an enlarged main part of a diamond cutter according to a second embodiment of the present invention.

FIG. 7 is an enlarged view of a main part of a multi-point diamond cutter showing a modified example of the second embodiment of the present invention.

Next, a first embodiment of the present invention will be described. FIG. 1 is a front view and a side view showing an example of a multi-point diamond cutter (hereinafter, simply referred to as a diamond cutter) 10 according to this embodiment. The diamond cutter 10 is based on a polygonal corner post having a certain thickness and formed by any number of sides of rotational symmetry. In this embodiment, a base 11 having a regular octagonal pillar having a certain thickness is formed of a single crystal diamond, and has a through hole 12 in the center thereof. In this case, ridge lines 13a to 13h are evenly formed on the octagonal outer peripheral surface of the base 11, and the ridge lines 13a to 13h are parallel to the polygonal pillars. The thickness direction is parallel to the axis passing through the through hole 12 (the axis perpendicular to the paper surface in FIG. 1 (a)).

In addition, in the present embodiment, as shown in FIG. 1, the base 11 is polished so as to be angled from the two bottom surfaces of the polygonal pillars of the octagonal corner portion to the ridge line crossing the outer peripheral surface. That is, from the eight corners of one surface of the base 11 toward the ridge line of the base 11 in a range smaller than 1/2 of the thickness of the base 11, the first inclined surfaces 14 a to 14 h are polished. At this time, the angle between the side of the bottom surface of the base 11 and the inclined surface is equal, that is, the inclined surface becomes an isosceles triangle with one end of the ridgeline as the vertex. The inclined surface can be easily formed by laser processing or machining. In addition, mechanical polishing may be performed after laser processing to further form a precise polished surface. According to this, the intersections of the ridgelines 13a to 13h and the first inclined surfaces 14a to 14h can be used as apexes. As shown in Fig. 1 (b), when viewed from the side of the base, eight sharp points P1 to P8 are formed on the right . At this time, the inclined surfaces 14a to 14h of the base 11 become top surfaces. Here, the so-called top surface means a surface which is in contact with two outer peripheral surfaces forming a ridgeline and shares one end of the ridgeline.

Next, from the other surface of the base 11 to the outer periphery of the base 11 in the same manner, the second inclined surface 15a to 15h are formed by grinding in a range smaller than 1/2 of the thickness of the base. According to this, the intersections of the ridgelines 13a to 13h and the second inclined surfaces 15a to 15h can be used as sharp points. As shown in FIG. 1 (b), when viewed from the side of the base, eight sharp points P9 are formed on the left side. P16. As described above, by using both ends of the ridge lines 13a to 13h as the sharp points P1 to P16, it is possible to form 16 sharp points on the outer periphery of the octagonal diamond cutter 10.

Next, a case where the scribe is performed using the diamond cutter 10 of this embodiment will be described with reference to FIG. 2. When scoring the substrate 20, as shown in FIG. 2 (a), the diamond cutter 10 is tilted so that the angle formed by the ridge line and the brittle material substrate is θ, and one sharp point P1 is fixed to contact the substrate 20 And move the diamond cutter 10 in the direction of arrow A in the figure to Scratching. At this time, since the diamond cutter 10 is not rolled, the scribe can be performed with the same sharp point. When the sharp point P1 in contact with the substrate 20 deteriorates due to abrasion, as shown in FIG. 2 (b), the diamond cutter 10 is rotated 45 ° around the through hole 12 as a center, and the adjacent sharp point P2 contacts the substrate 20 And scribe in the same way. Even if the diamond cutter 10 is rotated 45 °, the angle θ at which the ridge line at the tip of the blade contacts the substrate does not change, so it is easy to set the contact angle with respect to the substrate when the sharp point is changed.

In addition, when the sharp points at 8 of the sharp points P1 to P8 are worn out, the diamond cutter 10 is reversed, and the angle formed by the ridge line and the brittle material substrate is fixed again to make the sharp points on the other side. P9 ~ P16 contact the substrate in order to score. According to this, it is possible to further change the position of the sharp point 8 times to perform the scribe, and to change the sharp point 16 times in total to perform the scribe.

Next, a modification of the first embodiment will be described. In the first embodiment, an inclined surface on the outer periphery of the base is used as a top surface, and a vertex of a triangle of the first inclined surface is used as a sharp point. FIG. 3 is a modification example. As shown in an enlarged view showing a peripheral portion of one sharp point P1, the portion close to the ridge line is further polished at a slight angle to form a third inclined surface 21a, and the inclined surface 21a becomes a top surface. . The same applies to other inclined surfaces. Further, similarly to the second inclined surface, the portion close to the ridge line of the second inclined surface is further polished in a slightly inclined manner to form a fourth inclined surface. According to this, it is possible to finely adjust the positions of the sharp points, and to perform processing more accurately and precisely.

Next, a second embodiment of the present invention will be described using FIGS. 4 and 5. FIG. 4 is a front view and a side view showing an example of a multi-point diamond cutter (hereinafter, simply referred to as a diamond cutter) 30 according to this embodiment. The diamond cutter 30 is a base 31 formed of a symmetric polygonal corner post formed of a single crystal diamond with a octagonal base, and has a through hole 32 in the center. At this time, ridge lines 33a to 33h are uniformly formed on the octagonal outer peripheral surface of the base 31, and the ridge lines 33a to 33h are parallel to each other. The axis passing through the through hole 32 in the thickness direction of the polygonal column (the axis perpendicular to the paper surface in FIG. 4 (a)) is parallel.

In this embodiment, as shown in FIG. 4, the base 31 is polished to be chamfered from both sides of the octagonal corner portion. That is, the first inclined surfaces 34a to 34h are polished by grinding from the corner of one surface toward the inside of the base 31 in a range smaller than 1/2 of the thickness of the base. The second inclined surfaces 35a to 35h are formed from the other side surface of the base 31. At this time, polishing is performed so that the angle between the side of the bottom surface of the base 31 and the inclined surface is equal.

In this embodiment, after the first inclined surfaces 34a to 34h and the second inclined surfaces 35a to 35h are formed, at both ends of the ridgelines 33a to 33h, the two outer peripheral surfaces adjacent to each other between the ridgelines are further polished, so that The angle between the top surface and the ridgeline becomes larger. Fig. 5 is an enlarged view of a circle B shown by a one-dot chain line in the right center of Fig. 4 (b), and Fig. 6 (a) is a circle of a circle C indicated by a one-dot chain line at the lower right of Fig. 4 (b). Enlarged view, Figure 6 (b) is its bottom view. In this polishing, as shown in FIG. 5, a new ridgeline (second ridgeline) is formed at one end of the ridgeline 33a at a small triangular grinding surface 36a, 36b and the intersection of the grinding surfaces 36a, 36b. In the same manner, a new ridgeline (second ridgeline) is formed at one end of the ridgeline 33c at a triangular polishing surface 38a, 38b and an intersection of the polishing surfaces 38a, 38b. The same is true for other ridgelines, and a second ridgeline at the intersection of the grinding surfaces 36a, 36b to 43a, 43b, and the grinding surfaces 36a, 36b to 43a, 43b is formed at one end of each of the ridgelines 33a to 33h. Moreover, one end of the new edge line where the adjacent abrasive surfaces 36a and 36b, 37a and 37b, ... intersect, that is, the intersection point of the second edge line and the top surface becomes the sharp points P1 to P8. At this time, the line where the triangular abrasive surfaces 36a and 36b intersect is a ridge line forming one end of the sharp point. For other angles, the intersection of each of the polishing surfaces 37a, 37b, 38a, 38b, ... is also a ridge line forming one end of the sharp point.

In addition, the other end of the ridgeline is also directed to the inclined surface 35a ~ At the intersection of 35h and the ridge line, the surface is polished in the same manner from the side to form a polished surface. Then, the intersection point of the newly formed polishing surface, that is, the intersection of the second edge line and the inclined surface 35a to 35h is used as the sharp points P9 to P16. When the above-mentioned polished surface is formed by machining, it can be processed with high accuracy, and the position of the sharp point can be processed at a desired position. In addition, the angle between the top surface and the ridgeline can be arbitrarily set in accordance with the workpiece to be scribed.

When scoring is performed using the diamond cutter 30, one sharp point P1 is brought into contact with the substrate 20 to perform scoring. When the sharp point has been worn, the diamond cutter 30 is rotated 45 ° along an axis (not shown) inserted in the through hole in the same manner as in the above embodiment, so that the adjacent sharp point contacts the substrate 20 for engraving. Draw.

In addition, when all the sharp points at 8 of the sharp points P1 to P8 are worn, the diamond cutter 30 is reversed so that the sharp points P9 to P16 on the other side contact the substrate in order to score. According to this, it is possible to further change the position of the sharp point 8 times to perform the scribe, and to change the sharp point 16 times in total to perform the scribe.

Next, a modification of the second embodiment will be described. In the second embodiment, the inclined surface on the outer periphery of the base is also used as the top surface, and the vertex of the triangle of the first inclined surface is used as the sharp point. FIG. 7 is a modification example. As shown in an enlarged view showing a peripheral portion of one sharp point P3, a part of the inclined surface 34c that is close to a ridge line triangle is further polished at a slight angle to form a third inclined surface 51c. The inclined surface 51c is made a top surface. The same applies to other inclined surfaces. Further, similarly to the second inclined surface, the portion close to the ridge line of the second inclined surface is further polished in a slightly inclined manner to form a fourth inclined surface. According to this, it is possible to finely adjust the positions of the sharp points, and to perform processing more accurately.

In the first and second embodiments, although there are 16 sharp points around the base of the regular octagon, it is not limited to the regular octagon, and a polygon with any number of sides can be used as the base. E.g, There are also 24 sharp points for regular dodecagon. In this case, it is preferable to set a plurality of sharp points on the outer peripheral portion as much as possible when the sharp points are changed so that adjacent sharp points do not interfere with each other as described above. As a result, when the sharp points are worn, the sharp points can be changed by rotating the diamond cutter, which can reduce the frequency of replacing the diamond cutter.

In addition, in the above-mentioned embodiment, although the entire circular plate is made of single crystal diamond, since it only needs to have a diamond layer on the surface portion contacting the brittle material substrate, it can also be used on the blade of a base made of cemented carbide or sintered diamond. A polycrystalline diamond layer is formed on the surface of the front end portion, and an inclined surface is formed there. In addition, it is also possible to use a single crystal or polycrystalline diamond doped with impurities such as boron and having conductivity. By using a diamond with conductivity, a notch can be easily formed by electric discharge machining.

The multi-point diamond cutter of the present invention can be used for a scoring device for scoring a brittle material substrate, and can be effectively used especially for scoring objects with high hardness that increase the wear of the diamond cutter.

Claims (6)

A multi-point diamond cutter has: a base, an angular pillar having a predetermined thickness, and having two bottom surfaces and a plurality of outer peripheral surfaces; a ridge line, which is the intersection of the outer peripheral surfaces; and an inclined surface, from at least one of the bottom surfaces toward the ridge line Grinded; at least the outer peripheral surface of the base is made of diamond; the intersection of the inclined surface and the ridgeline is used as a sharp point. For example, the multi-point diamond cutter of item 1 of the patent application scope, wherein the inclined surface has a first inclined surface formed from the bottom surface of one side of the base and a second inclined surface formed from the bottom surface of the other side of the base. surface. For example, the multi-point diamond cutter of item 1 or 2 of the patent application scope has two grinding surfaces formed by grinding from two adjacent peripheral surfaces of the base toward the end of the ridge line, and two grinding surfaces of the two grinding surfaces. A second edge line of the intersection line, and an intersection point of the inclined surface and the second edge line is used as a sharp point. For example, the multi-point diamond cutters in the scope of patent application No. 1 or 2, wherein each inclined surface is formed by laser processing. For example, the multi-point diamond cutter of item 3 of the patent application scope, wherein the inclined surfaces are formed by laser processing. For example, the multi-point diamond cutter of item 3 of the patent application scope, wherein the two grinding surfaces are formed by machining.