TWI498293B - Scribe method, diamond point and scribe apparatus - Google Patents

Description

Scribing method, diamond tip, scribing device

The present invention relates to a method of forming a score line on a substrate of a brittle material, and a diamond tip for the method, and further comprising a scribing device for the diamond tip.

Heretofore, a technique of cutting a glass substrate by a diamond tip or a scribing cutter wheel to form a scribe line on a glass substrate has been known (for example, Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-085791

The technique of Patent Document 1 causes a problem that chips are generated in the vicinity of the scribe line by cutting the glass substrate. Further, the technique of Patent Document 1 has a problem that microcracks (small cracks) are generated on the cross-hatched cross section depending on the situation.

Accordingly, it is an object of the present invention to provide a scribing method capable of forming a good scribing line on a brittle material substrate, and a diamond tip for the method, and further including a scribing device for the diamond tip.

In order to solve the above problems, the invention of claim 1 is a scribing method characterized in that a scribing is formed on a brittle material substrate by a cutter having a blade portion including a diamond inclusion, and the following steps are included: (a) by aligning the blade portion with the brittle material substrate (b) in a state where the blade portion of the cutter is brought into contact with the brittle material substrate, the cutter is relatively moved by the brittle material substrate to form a scribe line on the brittle material substrate. And the outer surface of the blade portion has a rounded surface having a curved surface shape; and in the step (a), the rounded surface is brought into contact with the brittle material substrate to apply a force to the brittle material substrate from the cutter; In the above step (b), the state in which the rounded surface is convex downward is maintained, and the cutter is relatively moved to the brittle material substrate.

The invention of claim 2 is the scribing method according to claim 1, wherein the cutter is provided with a diamond tip of the blade portion at one end of the cylindrical or prismatic rod, that is, the grip portion.

The invention of claim 3 is the scribing method according to claim 2, wherein the diamond tip is set in such a manner that the blade portion has a front end surface, a plurality of inclined surfaces, each of which is connected to the front end surface, and a plurality of The rounded surface, each of which is surrounded by two of the plurality of inclined surfaces, that is, the adjacent inclined surface, and the front end surface; and each of the ridge lines of the blade portion has a straight portion which is an intersection of the two adjacent inclined surfaces; a curved portion located on a fillet surface connected to each of the two adjacent inclined surfaces, and connected to the straight portion and the front end surface; and the straight portion on the ridge line of the blade portion with respect to the front end The slope of the surface is set to be larger than the slope of the curved portion with respect to the front end surface when the front end surface is horizontal.

The invention of claim 4 is the scribing method of claim 3, wherein the diamond tip is used as follows: the diamond inclusion is a polycrystalline diamond, and the polycrystalline diamond system will contain fine grain structure or amorphous Graphite type The carbon material is used as a starting material and is directly sintered at a high pressure and high temperature to be converted into a diamond, and is essentially composed only of diamonds.

The invention of claim 5 is the scribing method according to claim 3, wherein the diamond tip is used as follows: the diamond inclusions contain: 65.0% by weight to 75.0% by weight of diamonds, and the content is 3.0% by weight to 10.0% The ultrafine particle carbide of the weight % and the diamond sintered body of the other bonding material, wherein the diamond has an average particle diameter of 0.1 μm to 5.0 μm, and the bonding material is an iron-based metal mainly composed of cobalt.

The invention of claim 6 is the scribing method according to claim 5, wherein the diamond tip is used as follows: the content of the ultrafine carbide in the diamond sintered body is 6.0% by weight to 8.0% by weight, and the ultrafine particles are The carbide contains 1.0% by weight to 4.0% by weight of titanium carbide, and the rest of the tungsten carbide.

The invention of claim 7 is the scribing method according to claim 1, wherein the cutter is a scribing cutter wheel provided with the blade portion on the outer circumference of the disc-shaped main body portion.

The invention of claim 8 is a diamond tip characterized by forming a scribe on the brittle material substrate by relatively moving the substrate of the brittle material, and comprising: a grip portion which is cylindrical or prismatic a rod body, and a blade portion including a diamond inclusion and disposed at one end of the grip portion; the blade portion having: a front end surface; a plurality of slope surfaces each connected to the front end surface; and a plurality of circles Each of the plurality of inclined faces, that is, the adjacent inclined surface, is surrounded by the front end surface; each of the ridge lines of the blade portion has a straight line portion which is an intersection line of the two adjacent inclined surfaces, and a curved portion, It is located in a circle connected to each of the above two adjacent slopes The angled surface is connected to the linear portion and the distal end surface; and the slope of the linear portion with respect to the distal end surface on each ridge line of the blade portion is set to be larger than the curved portion when the distal end surface is horizontal The slope relative to the front end face described above.

The invention of claim 9 is the diamond tip of claim 8, wherein the diamond inclusion is a polycrystalline diamond, and the polycrystalline diamond comprises a fine grain structure or an amorphous graphite type carbon material as a starting point The substance is directly sintered at a high pressure and high temperature to be converted into a diamond, and is essentially composed only of diamonds.

The invention of claim 10 is the diamond tip of claim 8, wherein the diamond inclusion is a diamond sintered body, and the diamond sintering system contains a diamond having a content of 65.0% by weight to 75.0% by weight, and the content is 3.0% by weight to 10.0%. The ultrafine particle carbide of the weight% and the remaining bonding material; the average particle diameter of the diamond is 0.1 μm to 5.0 μm, and the bonding material is an iron-based metal mainly composed of cobalt.

The invention of claim 11 is the diamond tip according to claim 10, wherein the ultrafine particle carbide in the diamond sintered body is 6.0% by weight to 8.0% by weight, and the upper ultrafine particle carbide is contained in an amount of 1.0% by weight to 4.0% by weight. Titanium carbide, and the rest of the tungsten carbide.

The invention of claim 12 is the diamond tip according to any one of claims 8 to 11, wherein the plurality of rounded faces are contact portions of the fragile material substrate that are in contact with the brittle material substrate when the scribe line is formed on the brittle material substrate.

The invention of claim 13 is characterized in that the scribing device includes: a scribing unit including the diamond tip according to any one of claims 8 to 11; and a holding unit that maintains one side of the brittle material substrate on one side Moving it; and forming a scribe line on the brittle material substrate by causing the holding unit to relatively move the scribe line unit.

The invention of claim 14 is characterized in that: a scribing device comprising: a scribing unit including the diamond tip of claim 12; and a holding unit that holds the fragile material substrate while moving on one side; and The holding unit moves the scribe line unit to form a scribe line on the brittle material substrate.

According to the inventions of the first aspect to the seventh aspect, when the cutter is moved while being in contact with the brittle material substrate, it is not necessary to cut the contact portion of the brittle material substrate that is in contact with the rounded surface of the cutter, so that the contact portion can be made more Large compressive stress and tensile stress. The scribe line and the vertical crack are formed on the brittle material substrate by the compressive stress and the tensile stress. Thereby, it is possible to prevent chips and microcracks from being generated in the vicinity of the scribe line, and it is possible to satisfactorily scribe the brittle material substrate.

According to the invention of claim 8 to claim 14, if the rounded surface of the blade portion is brought into contact with the brittle material substrate and the diamond tip is moved from the rounded corner to the brittle material substrate, the cutting and the cutting are not required. The contact portion of the brittle material substrate that is in contact with the rounded surface can cause large compressive stress and tensile stress in the contact portion. The scribe line and the vertical crack are formed on the brittle material substrate by the compressive stress and the tensile stress. Thereby, it is possible to prevent chips and microcracks from being generated in the vicinity of the scribe line, and it is possible to satisfactorily scribe the brittle material substrate.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<1. First embodiment>

<1.1. Composition of the scribing device>

1 and 2 are respectively a front view and a side view showing an example of the overall configuration of the scribing device 1 in the first embodiment. The scribing device 1 is formed with a scribe line (cut grain: longitudinal crack) on the surface of a substrate (hereinafter, also simply referred to as "brittle material substrate") 4 made of a brittle material such as a glass substrate or a ceramic substrate. Device.

As shown in FIGS. 1 and 2, the scribing apparatus 1 mainly includes a holding unit 10, a scribing unit 20, an imaging unit 80, and a control unit 90. In addition, in FIG. 1 and the following drawings, in order to clarify the direction relationship of these members, an XYZ orthogonal coordinate system in which the Z-axis direction is the vertical direction and the XY plane is the horizontal plane is appropriately set as needed.

Here, in the first and second embodiments, the following method is referred to as "fracture", that is, (1) by the scribing device 1 (in the case of the second embodiment, the scribing device 100) A scribe line SL and a vertical crack K are formed on the surface of the brittle material substrate 4 (see FIGS. 7 and 10 below) (line step); (2) second, the vertical crack K is further stretched by stress. The brittle material substrate 4 is cut (breaking step).

On the other hand, the following method is referred to as "breaking", which extends the vertical crack K from the main surface of the scribe line SL of the brittle material substrate 4 by only the scribing step (i.e., the rupture step is not performed). Until the opposite side of the main side, will The brittle material substrate 4 is cut.

Moreover, examples of the material of the brittle material substrate 4 which can be broken or broken by the scribing method of the present embodiment include glass, ceramics, enamel, or sapphire. In particular, in recent years, as a substrate for a high-frequency module associated with a communication device, HTCC (High Temperature Co-fired Ceramics) is being moved toward a relatively easy-to-process LTCC (Low Temperature Co-fired Ceramics). ) Accelerate the transfer. Therefore, the scribing method of the present embodiment is continuously utilized effectively.

The holding unit 10 moves the brittle material substrate 4 relative to the scribing unit 20 by moving the brittle material substrate 4 while moving it. As shown in FIG. 1, the holding unit 10 is provided on the base 10a, and mainly includes a mounting table 11, a ball screw mechanism 12, and a motor 13.

Here, the base portion 10a is formed of, for example, a substantially cubic stone plate, and its upper surface (the surface facing the holding unit 10) is flattened. Thereby, the thermal expansion of the base portion 10a can be lowered, so that the brittle material substrate 4 held by the holding unit 10 can be well moved.

The mounting table 11 sucks and holds the brittle material substrate 4 placed thereon. Further, the mounting table 11 moves the brittle material substrate 4 held in the direction of the arrow AR1 (positive or negative direction of the X-axis: hereinafter, also referred to simply as "advancing and retracting direction"), and rotates in the direction of the arrow R1. As shown in FIGS. 1 and 2, the mounting table 11 mainly includes an adsorption unit 11a, a rotary table 11b, and a moving table 11c.

The adsorption unit 11a is provided on the upper side of the rotary table 11b. As shown in FIGS. 1 and 2, the brittle material substrate 4 can be placed on the upper surface of the adsorption portion 11a. Again, in A plurality of adsorption grooves (not shown) are arranged in a grid shape on the upper surface of the adsorption portion 11a. In a state in which the brittle material substrate 4 is placed on the upper surface of the adsorption portion 11a, the ambient gas in each adsorption tank is evacuated (sucked), whereby the brittle material substrate 4 is adsorbed to the adsorption portion 11a.

The turntable 11b is provided on the lower side of the adsorption unit 11a, and the adsorption unit 11a is rotated about the rotation axis 11d substantially parallel to the Z axis. Further, the mobile station 11c is provided on the lower side of the turntable 11b, and moves the suction portion 11a and the rotary table 11b in the advancing and retracting direction.

Therefore, the brittle material substrate 4 adsorbed and held by the mounting table 11 moves forward and backward in the direction of the arrow AR1, and rotates around the rotating shaft 11d that moves in accordance with the advancing and retracting operation of the adsorption portion 11a.

The ball screw mechanism 12 is disposed on the lower side of the mounting table 11, and moves the mounting table 11 forward and backward in the direction of the arrow AR1. As shown in FIGS. 1 and 2, the ball screw mechanism 12 mainly includes a feed screw 12a and a nut 12b.

The feed screw 12a is a rod that extends in the advancing and retracting direction of the mounting table 11. A spiral groove (not shown) is provided on the outer peripheral surface of the feed screw 12a. Further, one end of the feed screw 12a is rotatably supported by the support portion 14a, and the other end of the feed screw 12a is rotatably supported by the support portion 14b. Further, the feed screw 12a is coupled to the motor 13 in a linked manner, and when the motor 13 rotates, the feed screw 12a rotates in the rotation direction of the motor 13.

The nut 12b moves forward and backward in the direction of the arrow AR1 by the rolling of the balls (not shown) as the feed screw 12a rotates. As shown in FIGS. 1 and 2, the nut 12b is fixed to the lower portion of the moving table 11c.

Thereby, if the motor 13 is driven and the rotational force of the motor 13 is transmitted to the feed screw With the rod 12a, the nut 12b moves forward and backward in the direction of the arrow AR1. As a result, the mounting table 11 to which the nut 12b is fixed moves forward and backward in the direction of the arrow AR1 in the same manner as the nut 12b.

The pair of guide rails 15, 16 regulate the movement of the mounting table 11 in the traveling direction. As shown in Fig. 2, the pair of guide rails 15, 16 are fixed to the base portion 10a by a predetermined distance and fixed in the direction of the arrow AR2.

A plurality of (two in the present embodiment) sliding portions 17 (17a, 17b) are slidable along the guide rail 15 in the direction of the arrow AR1. As shown in FIGS. 1 and 2, each of the sliding portions 17 (17a, 17b) is fixed to the direction of the arrow AR1 at a predetermined distance from the lower portion of the moving table 11c.

A plurality of (two in the present embodiment, only the sliding portion 18a is shown for convenience of illustration), and the sliding portion 18 is slidable along the guide rail 16 in the direction of the arrow AR1. As shown in FIGS. 1 and 2, each of the sliding portions 18 is fixed to the direction of the arrow AR1 at a predetermined distance from the lower portion of the moving table 11c, similarly to the sliding portions 17 (17a, 17b).

With the above configuration, when the rotational force of the motor 13 is applied to the ball screw mechanism 12 in the holding unit 10, the mounting table 11 moves along the pair of guide rails 15, 16. Therefore, the linearity of the mounting table 11 in the advancing and retracting direction can be ensured.

The scribing unit 20 forms a scribe line on the brittle material substrate 4 by using the diamond tip 60 (see FIG. 3 described below). As shown in FIGS. 1 and 2, the scribing unit 20 mainly includes a scribing head 30 and a driving portion 70.

The scribing head portion 30 applies a pressing force (hereinafter, also simply referred to as "streaking load") to the surface of the brittle material substrate 4 from the held diamond tip 60. Again In the wire head portion 30, the diamond tip 60 is moved while the blade portion 61 (see FIG. 3) of the diamond tip 60 is brought into contact with the brittle material substrate 4, and a scribe line is formed on the brittle material substrate 4. Further, the detailed configuration of the scribing head 30 will be described later.

The drive unit 70 reciprocates the diamond tip 60 held by the scribing head 30 in the direction of the arrow AR2 (positive or negative direction of the Y-axis). As shown in FIG. 2, the drive unit 70 mainly includes a support 71, a guide rail 72, and a motor 73.

A plurality of (two in the present embodiment) pillars 71 (71a, 71b) extend from the base portion 10a in the vertical direction (Z-axis direction). As shown in Fig. 2, each of the guide rails 72 is fixed to the pillars 71a and 71b in a state of being sandwiched between the pillars 71a and 71b.

A plurality of (two in the present embodiment) guide rails 72 regulate the movement of the scribing head portion 30 in the machine direction. As shown in FIG. 2, a plurality of guide rails 72 are fixed in the up and down direction with a certain distance apart.

The motor 73 is coupled to a feed mechanism (for example, a ball screw mechanism) (not shown). Thereby, when the motor 73 rotates, the scribing head portion 30 reciprocates along the plurality of guide rails 72 in the direction of the arrow AR2.

The imaging unit unit 80 captures the brittle material substrate 4 held by the holding unit 10. As shown in FIG. 2, the imaging unit unit 80 includes a plurality of cameras 85 (85a, 85b).

As shown in FIGS. 1 and 2, a plurality of cameras (two in the present embodiment) are disposed above the holding unit 10 with the cameras 85 (85a, 85b). Each of the cameras 85 (85a, 85b) captures an image of a characteristic portion (for example, an alignment mark (not shown)) formed on the brittle material substrate 4. And based on each photo The image taken by the camera 85 (85a, 85b) determines the position and posture of the brittle material substrate 4.

The control unit 90 realizes operation control and data calculation of each element of the scribing device 1. As shown in FIG. 1 and FIG. 2, the control unit 90 mainly includes a ROM (Read Only Memory) 91, a RAM (Random Access Memory) 92, and a CPU (Central Processing Unit). Processing unit) 93.

The ROM (Read Only Memory) 91 is a so-called non-volatile memory unit, and stores, for example, a program 91a. Further, as the ROM 91, a non-volatile memory which is freely readable and writable, that is, a flash memory can also be used.

The RAM (Random Access Memory) 92 is a volatile memory unit and stores, for example, data used in the calculation of the CPU 93. The CPU (Central Processing Unit) 93 executes the control of the program 91a following the ROM 91 (for example, the drive unit 70 reciprocates the wheel frame 31 and the lifting and lowering operation of the wheel unit 31 (see FIG. 3 below). Control), and various data processing and so on.

<1.2. Composition of the scribing head>

Fig. 3 is a front view showing an example of the configuration in the vicinity of the scribing head portion 30. 4 and 5 are side views showing an example of the configuration in the vicinity of the wheel swinging portion 34, respectively. As shown in FIGS. 3 to 5, the scribing head portion 30 mainly includes a wheel frame 31, a wheel frame swinging portion 34, a wheel frame joint 35, a lifting portion 50, and a diamond tip 60.

The wheel frame 31 fixes the diamond tip 60 to the scribing head 30. As shown in FIGS. 3 to 5, the wheel frame 31 holds the grip portion 62 of the diamond tip 60 so that the blade portion 61 of the diamond tip 60 becomes the brittle material substrate 4 side.

The diamond tip 60 is a cutter (tool) that forms a scribe line on the brittle material substrate 4 by moving relative to the brittle material substrate 4. Further, the detailed configuration of the diamond tip 60 will be described below.

The wheel frame swinging portion 34 swings the blade portion 61 of the diamond tip 60 around the swing shaft 36a and/or the rotation shaft 38a. As shown in FIGS. 4 and 5, the wheel carrier swinging portion 34 mainly includes a wheel carrier joint 35 and a wheel carrier mounting block 40.

The wheel frame joint 35 links the wheel frame 31 and the wheel frame mounting block 40 in series. As shown in FIGS. 3 to 5, the wheel carrier joint 35 is fixed to the lower end of the turning portion 38, and mainly includes a mounting piece 36 and a turning portion 38.

The mounting tab 36 is used to mount the mounting elements of the wheel carrier 31 below the wheel carrier joint 35. As shown in FIGS. 3 to 5, the mounting piece 36 is disposed at the lower end of the wheel carrier joint 35, and the shape of the mounting piece 36 is substantially L-shaped in a side view.

Further, as shown in FIGS. 3 to 5, the attachment piece 36 includes a swing shaft 36a. The swing shaft 36a extends in a direction substantially perpendicular to the direction in which the diamond tip 60 extends (the direction of the arrow AR3) (the direction of the arrow AR4: hereinafter, also simply referred to as the "axis direction"). Further, the wheel frame 31 swings around the swing shaft 36a provided on the attachment piece 36.

The turning portion 38 is rotatable about the rotation axis 38a of the direction in which the diamond tip 60 extends (the direction of the arrow AR3). As shown in FIG. 3, the turning portion 38 is inserted so as to face the inner diameters of the bearings 46, 47.

The wheel carrier mounting block 40 rotatably supports the wheel carrier joint 35 as described above. As shown in FIG. 3, the wheel carrier mounting block 40 is disposed above the mounting piece 36 of the wheel carrier joint 35 and above the wheel frame 31, and mainly includes bearings 46, 47 and a fixing portion 49.

The bearings 46, 47 are attached to the mounting block body 40a, and are disposed in order from top to bottom. The bearings 46, 47 are journaled to support the swivel portion 38 of the wheel carrier joint 35.

The fixing portion 49 fixes the rotatably rotating portion 38 to the wheel frame mounting block 40 by bearings 46 and 47. Thereby, the angle of rotation of the wheel carrier joint 35 about the rotation axis 38a can be set.

Further, as the fixing portion 49, a fastening member such as a screw may be used. Further, the number of the bearings is not limited to two, and may be, for example, one or three or more.

The lifting portion 50 moves the blade portion 31 of the diamond tip 60 fixed to the wheel frame 31 against the brittle material substrate 4 by moving the wheel frame 31 in a direction approaching the holding unit 10. As shown in FIG. 3, the lifting portion 50 mainly includes a cylinder 51 and a transmission portion 52.

The cylinder 51 is a driving force supply source that applies a driving force in the vertical direction (positive or negative direction of the Z-axis) to the side of the carrier mounting block 40. As shown in FIG. 3, the cylinder 51 is disposed above the wheel mounting block 40, and mainly includes a body portion 51a and a link 51b.

The link 51b is movable forward and backward with respect to the body portion 51a. As shown in FIG. 3, the lower end of the link 51b is coupled to the transmission portion 52. Therefore, the rod 51 is driven by the cylinder 51, and the link 51b is moved in and out from the main body portion 51a, and the lower end of the link 51b pushes the transmission portion 52 downward.

The transmission portion 52 is provided between the cylinder 51 and the carrier mounting block 40 and transmits the driving force from the cylinder 51 to the carrier mounting block 40.

As shown in FIG. 3, the guiding mechanism 53 mainly includes a guide rail 53a and a guide along the guide. The rail 53a is a guide block 53b that slides freely in the vertical direction. Further, the mounting plate 54 is a plate member interposed between the guiding mechanism 53 and the carrier mounting block 40. The wheel carrier mounting block 40 is fixed to the guide block 53b via the mounting plate 54. Thereby, when the driving force in the vertical direction is given to the carrier mounting block 40, the guide mechanism 53 guides the carrier mounting block 40 along the lifting direction of the guide block 53b.

As shown in FIGS. 3 to 5, the rotating shaft 56 is substantially perpendicular to the extending direction of the diamond tip 60 (the direction of the arrow AR3), and extends in a direction substantially perpendicular to the swing shaft 36a provided on the mounting piece 36. Thereby, the rotation angle of the wheel mounting block 40 about the rotation axis 56 can be set. Therefore, the posture of the diamond tip 60 fixed to the wheel frame 31 can be adjusted in the YZ plane.

<1.3. Composition of Diamond Tips>

Fig. 6 is a side view showing an example of the configuration of the diamond tip 60. Fig. 7 is a front view showing an example of the shape of the blade portion 61 of the diamond tip 60. Fig. 8 is a front view for explaining the ridge line 66 of the blade portion 61 in Fig. 7. As shown in FIG. 6, the diamond tip 60 mainly includes a blade portion 61 and a grip portion 62.

As shown in Fig. 6, the diamond tip 60 is provided with a blade portion 61 at one end 62a of the grip portion 62 which is a cylindrical or prismatic rod. The diamond tip 60 is attached to the scribing head 30 by gripping the grip portion 62 by the wheel frame 31.

Here, in the present embodiment, the diameter of the grip portion 62 is preferably 2 mm to 6 mm, and the length of the grip portion 62 is preferably 10 mm to 70 mm.

The blade portion 61 is formed from diamond inclusions. A scribe line is formed on the brittle material substrate 4 by causing the blade portion 61 against the brittle material substrate 4. As shown in FIGS. 7 and 8, the blade portion 61 has a quadrangular frustum shape and mainly includes a front end surface 64, a plurality of inclined surfaces 65 (65a to 65d), and a plurality of rounded surfaces 67 (67a to 67d: wherein The rounded surface 67d) is omitted for convenience of illustration. Further, the ridgeline 66 of the blade portion 61 is formed by the adjacent two inclined faces 65.

As shown in FIGS. 7 and 8, a plurality of inclined faces 65 (65a to 65d) are formed as side faces of the blade portion 61 having a quadrangular frustum shape. Each of the inclined surfaces 65 (65a to 65d) is a plane of a trapezoid.

A plurality of rounded faces 67 (67a to 67d) are formed at respective corners of the front end face 64 and have a curved shape. Further, each of the rounded surfaces 67 is surrounded by a corresponding inclined surface 65 and a front end surface 64 of the plurality of inclined surfaces 65. For example, as shown in FIG. 7, the rounded surface 67a is surrounded by the inclined surfaces 65a, 65b adjacent to each other and the front end surface 64.

Here, in the present embodiment, each of the ridgelines 66 of the blade portion 61 includes a line portion (an intersection line of two adjacent inclined surfaces 65) formed between the two adjacent inclined surfaces 65, that is, a straight portion 68, and A curved portion 69 connected to the rounded surface 67 of the adjacent inclined surface 65 and connected to the straight portion 68 and the front end surface 64 is formed.

For example, as shown in FIGS. 7 and 8, the ridgeline 66b includes a straight portion 68b and a curved portion 69b. The straight portion 68b is formed in a line segment (the intersection of the inclined surfaces 65a, 65d) between the adjacent inclined surfaces 65a, 65d. On the other hand, the curved portion 69b is an arc-shaped curve connected to the straight portion 68b and the front end surface 64.

Further, as shown in FIG. 8, in the ridge lines 66 of the blade portion 61, the inclination of the straight portion 68 with respect to the front end surface 64 is set to be larger than the slope of the curved portion 69 with respect to the front end surface 64 when the front end surface 64 is horizontal (ie, The slope of the tangent at each position on the curved portion 69).

Further, in the present embodiment, the size of the blade portion 61 near the mounting position of the grip portion 62 (the bottom surface of the quadrangular frustum on the side opposite to the front end surface 64) is preferably 0.5 mm square to 3.0 mm square. More preferably 0.8 mm square ~2.0 mm square.

<1.4. Materials contained in the blade section>

As described above, the blade portion 61 is formed from the diamond inclusions. Examples of the diamond inclusions include diamond sintered bodies, polycrystalline diamonds, natural single crystal diamonds, and synthetic single crystal diamonds. Hereinafter, the diamond sintered body and the polycrystalline diamond will be specifically described.

<1.4.1. Diamond sintered body>

The diamond sintered body used in the formation of the blade portion 61 preferably contains diamond particles and the remaining bonded phase, and the adjacent diamond particles are bonded to each other. Excellent wear resistance and strength can be obtained by bonding adjacent diamond particles to each other.

Here, the diamond particles in the material contained in the diamond sintered body, and the binder and the additive contained in the binder phase will be described.

The average particle diameter of the diamond particles is preferably from 0.1 μm to 5.0 μm, more preferably from 0.5 μm to 1.0 μm.

Here, when the average particle diameter of the diamond is less than 0.6 μm, the crack is likely to propagate in the grain boundary of the diamond. Therefore, there is a problem that the life of the diamond tip 60 is shortened.

The content of the diamond in the diamond sintered body is preferably from 65.0% by weight to 75.0% by weight (more preferably from 68.0% by weight to 72.0% by weight: from 83.0% by volume to 88.0% by volume). Here, when the content of the diamond is less than 68.0% by weight, the wear resistance of the diamond sintered body is lowered.

As the additive, for example, an ultrafine particle carbide of at least one element selected from the group consisting of tungsten, titanium, niobium and tantalum is used.

The content of the ultrafine particle carbide in the diamond sintered body is preferably from 3.0% by weight to 10.0% by weight.

More preferably, the ultrafine carbide content is from 6.0% by weight to 8.0% by weight, and the ultrafine carbide contains 1.0% by weight to 4.0% by weight of titanium carbide and the remaining tungsten carbide. Thereby, abnormal grain growth of the diamond particles can be suppressed during the melting-solidification of the diamond during the sintering process. Therefore, the torsional strength characteristics can be further improved.

Generally, it is preferred to use an iron group element as a binder. Examples of the iron group element include cobalt, nickel, iron, and the like, and among them, cobalt is preferable. Further, it is preferable that the binder is the remainder of the diamond and the ultrafine carbide in the diamond sintered body, and more preferably the binder is contained in an amount of from 20% by weight to 25% by weight.

In addition, the content represented by "% by weight" in the present embodiment is determined based on elemental analysis by EDX (Energy Dispersive X-ray spectrometry). On the other hand, the content represented by "capacity%" means the ratio of the total volume of the diamond particles to the total volume of the diamond sintered body including the voids.

<1.4.2. Polycrystalline Diamond>

Further, the polycrystalline diamond used in the formation of the blade portion 61 is formed by directly sintering and converting into a diamond by containing a fine grain structure or an amorphous graphite-type carbon material as a starting material at an ultrahigh pressure and high temperature. Further, the polycrystalline diamond is substantially composed only of diamonds, and other substances are not intentionally added to the polycrystalline diamond.

Examples of the graphite-based carbon material containing a fine grain structure include diamond particles having an average particle diameter of 0.5 μm to 1 μm. Further, examples of the amorphous graphite-based carbon material include amorphous carbon (aG), carbon nanotube (CNT), and fullerene C ₆₀ .

<1.5. Scribing method>

Here, a method in which a diamond tip 60 exemplified by a tool as a diamond inclusion is formed on a brittle material substrate 4 by forming a scribe line SL ( scribe line) will be described with reference to FIGS. 1 , 2 , and 7 . .

In the present method, the rounded surface 67 in the outer surface of the diamond tip 60 is brought into contact with the brittle material substrate 4 by the action of the scribing head 30. Then, the brittle material substrate 4 is biased (line load) from the rounded surface 67 that is in contact with the brittle material substrate 4.

Then, the diamond tip 60 is relatively moved with respect to the brittle material substrate 4 in a state where the rounded surface 67 of the diamond tip 60 is brought into contact with the brittle material substrate 4. In this case, the diamond tip 60 is moved in the X-axis direction (arrow AR1 direction: see FIG. 1), and the holding unit 10 holding the brittle material substrate 4 is placed in the Y-axis direction (arrow AR2 direction: see FIG. 2). mobile.

Thereby, a scribe line SL corresponding to the trajectory of the blade portion 61 (see FIG. 7) of the diamond tip 60 is formed on the surface of the brittle material substrate 4. Further, a vertical crack K extending from the scribe line SL in the vertical direction (Z-axis direction) is formed on the brittle material substrate 4.

Here, when the diamond tip 60 is brought into contact with the brittle material substrate 4 while the diamond tip 60 is moved relative to the brittle material substrate 4, as shown in FIG. 7, the rounded surface 67 which is in contact with the brittle material substrate 4 is turned toward Bottom protruding.

Further, the scribing load is preferably set to 0.3 N to 3.0 N, and more preferably set to 0.5 to 2.5 N. Moreover, the moving speed of the diamond tip 60 relative to the brittle material substrate 4 It is usually set to 50 mm/sec to 1200 mm/sec, preferably 100 mm/sec to 800 mm/sec. Further, the specific values of the scribing load and the moving speed are appropriately set depending on the material and/or the thickness of the brittle material substrate 4.

<1.6. Principle of scribe>

Here, the principle of the scribe line when the rounded surface 67 is formed in the blade portion 61 will be described in comparison with the case where the rounded surface 67 is not formed in the blade portion 61 with reference to FIGS. 7 and 9 . 9 is a case where the blade portion 61 does not have the rounded surface 67 and has the shape of the straight portion 68 of the ridge 66 reaching the corner portion of the distal end surface 64 (when the ridge line 66 does not include the curved portion 69) before the blade portion 61 view.

First, the formation of the scribe line SL and the vertical crack K when the rounded surface 67 is not formed in the blade portion 61 will be described.

In the above case, as shown in FIG. 9, when the ridge line 66 of the blade portion 61 is in contact with the brittle material substrate 4, the brittle material substrate 4 is biased from the blade portion 61, and the blade portion 61 is opposed to the brittle material substrate. When the movement is performed, the brittle material substrate 4 is cut by the ridge line 66 of the blade portion 61 composed only of the straight portion 68, and the scribe line SL is formed on the brittle material substrate 4. Further, a vertical crack K extending from the scribe line SL in the vertical direction is formed on the brittle material substrate 4 by the force acting on the brittle material substrate 4 from the blade portion 61.

That is, when the blade portion 61 does not have the rounded surface 67, the brittle material substrate 4 in the vicinity of the scribe line SL is cut. Eventually, problems such as chips causing the brittle material substrate 4 are caused. Further, depending on the situation, a problem of microcracking occurring near the scribe line SL (cross-section of the scribe line) may occur.

Next, a description will be given of a formation form of the scribe line SL and the vertical crack K when the rounded surface 67 is formed in the blade portion 61.

As shown in FIG. 7, the shape of the curved portion 69 is gentler than the shape of the straight portion 68. That is, in each of the ridgelines 66 of the blade portion 61, the slope of the straight portion 68 with respect to the front end surface 64 is set to be larger than the slope of the curved portion 69 with respect to the front end surface 64.

Therefore, when the blade portion 61 does not have the rounded surface 67 (see FIG. 9), even the force equal to the force of the large-size machinable brittle material substrate 4 is applied to the brittle material substrate from the rounded surface 67 of the blade portion 61. 4. The brittle material substrate 4 is also not cut.

In other words, when the rounded surface 67 is formed in the blade portion 61, when the curved portion 69 of the blade portion 61 is brought into contact with the brittle material substrate 4, the same force is applied from the blade portion 61 (as appropriate) The above force) generates a compressive stress (stress from both sides of the scribe line SL toward the scribe line SL) in the contact portion 4a of the brittle material substrate 4 that is in contact with the rounded surface 67. Then, when the blade portion 61 is moved in the direction separating from the contact portion 4a, tensile stress is generated in the contact portion 4a. Further, since the contact portion 4a moves in the moving direction of the blade portion 61, compressive stress and tensile stress are generated in each of the contact portions 4a, and a scribe line SL starting from the initial crack is formed on the brittle material substrate 4. And vertical crack K.

When the rounded surface 67 is formed in the blade portion 61 as described above, a large scribing load can be applied to the brittle material substrate 4 from the rounded surface 67 without cutting the brittle material substrate 4. In other words, when the rounded surface 67 is formed in the blade portion 61, the scribe line SL and the vertical crack K are formed by the curved portion 69 of the ridge line 66 of the blade portion 61, so that the contact portion 4a can be formed. Than the blade portion 61 The ridge line 66 does not include the curved portion 69 and the large compressive stress and tensile stress in the case where the scribe line SL and the vertical crack K are formed by the straight portion 68. Therefore, chipping and microcracking can be prevented, and the brittle material substrate 4 can be satisfactorily scribed.

<1.7. Advantages of the Diamond Tip of the Present Embodiment>

As described above, in the diamond tip 60 included in the scribing device 1 of the present embodiment, as shown in FIGS. 7 and 8, the blade portion 61 includes a distal end surface 64, a plurality of inclined surfaces 65, and a curved surface shape. A plurality of rounded faces 67.

Further, each of the ridgelines 66 of the blade portion 61 includes a straight portion 68 formed between the corresponding two adjacent inclined faces of the plurality of inclined faces 65, and a curved portion 69 located at a corner which is respectively connected to the two adjacent inclined faces On the surface 67, the straight portion 68 and the front end surface 64 are connected. Further, in each of the ridgelines 66 of the blade portion 61, the slope of the straight portion 68 with respect to the front end surface 64 is set to be larger than the slope of the curved portion 69 with respect to the front end surface 64.

Moreover, when the scribe line SL is formed on the brittle material substrate 4 by the diamond tip 60, the rounded surface 67 which is in contact with the brittle material substrate 4 is in a state of being convex downward.

Therefore, when the brittle material substrate 4 is biased by the rounded surface 67 of the blade portion 61, the diamond tip 60 can not cut the contact portion 4a of the brittle material substrate 4 that is in contact with the rounded surface 67 (see FIG. 7). A large compressive stress and tensile stress are generated in the contact portion 4a. Further, the scribe line SL and the vertical crack K are formed on the brittle material substrate 4 by the compressive stress and the tensile stress.

Therefore, the diamond tip 60 can prevent chips and microcracks from being generated in the vicinity of the scribe line SL, so that the brittle material substrate 4 can be satisfactorily scribed. Also, the drill can be lifted The life of the stone tip 60.

<2. Second embodiment>

Next, a second embodiment of the present invention will be described. The scribing devices 1 and 100 of the first and second embodiments have the same configuration except that the configurations of the corresponding scribing units 20 and 120 are different from each other. Therefore, the following description focuses on this difference.

In the scribe apparatus 1 and 100, the same components are denoted by the same reference numerals, and the components denoted by the same reference numerals are described in the first embodiment. Therefore, the description of the constituent elements corresponding to the same reference numerals will be omitted below.

<2.1. Composition of the scribing device>

10 and 11 are a front view and a bottom view showing an example of the configuration in the vicinity of the scribing cutter wheel 160. Figure 12 is a bottom view for explaining the stabilizing effect of the kingpin. Hereinafter, the configuration of the scribing device 100 will be described with reference to FIGS. 1, 2, and 10 to 12.

The scribing device 100 is a device for scribing the brittle material substrate 4 in the same manner as the scribing device 1 of the first embodiment. As shown in FIGS. 1 and 2, the scribing apparatus 100 mainly includes a holding unit 10, a scribing unit 120, an imaging unit 80, and a control unit 190.

The holding unit 10 moves the brittle material substrate 4 relative to the scribing unit 120 by moving the brittle material substrate 4 while moving it. As shown in FIG. 1, the holding unit 10 is provided on the base 10a, and mainly includes a mounting table 11, a ball screw mechanism 12, and a motor 13.

The scribing unit 120 presses the scribing cutter wheel 160 against the brittle material substrate 4 Rolling is performed to form a scribe line on the brittle material substrate 4. As shown in FIGS. 1 and 2 , the scribe unit 120 mainly includes a scribe head 130 and a drive unit 170 .

The scribing head portion 130 applies a scribing load to the surface of the brittle material substrate 4 from the scribing cutter wheel 160 that is held. As shown in FIG. 10, the scribing head 130 has a wheel frame 131. Further, the wheel frame 131 rotatably holds the components of the scribing cutter wheel 160. As shown in FIG. 10, the wheel frame 131 mainly includes a pin 136, a support frame 137, and a turning portion 138.

The pin 136 is a rod that is inserted in a state of being inserted into the through hole 160a of the scribing cutter wheel 160. Here, as shown in FIGS. 10 and 11, the through hole 160a extends along the rotation shaft 160b substantially parallel to the X axis.

As shown in FIG. 10, the support frame 137 is a structure which is disposed so as to cover both openings (both ends) of the through hole 160a. Pins 136 protruding from both ends of the through hole 160a are rotatably provided to the support frame 137. Therefore, the scribing cutter wheel 160 fixed by the pin 136 can be freely rotated with respect to the support frame 137.

As shown in FIG. 10, the turning portion 138 is provided on the upper portion of the support frame 137, and the support frame 137 is rotated about the rotation shaft 138a substantially parallel to the Z-axis. As shown in FIG. 11, the position of the rotating shaft 138a of the turning portion 138 as viewed from the lower side is shifted from the grounding position 160c of the holding unit 10 in the brittle material substrate 4.

Therefore, as shown in FIG. 12, if the traveling direction of the scribing cutter wheel 160 is changed from the arrow AR5 (two-point chain line) direction to the arrow AR6 (solid line) direction, the circumferential rotation axis is stabilized by the kingpin backward tilting effect. The torque of 138a acts on the scribing cutter wheel 160. Thereby, the scribing cutter wheel 160 is rotated in the direction of the arrow R2, and the position of the scribing cutter wheel 160 is changed from the two-point chain line position to the solid line position.

As described above, in the scribing device 100 of the present embodiment, even if the traveling direction of the scribing cutter wheel 160 changes, the posture of the scribing cutter wheel 160 is shifted by the angle θ1 with respect to the traveling direction, and the torque in the direction of the arrow R2 acts. The scribing wheel 160 is scribed. As a result, the scribing cutter wheel 160 rotates so that the direction of the scribing cutter wheel 160 and the traveling direction of the scribing cutter wheel 160 are substantially parallel.

The drive unit 170 reciprocates the scribing cutter wheel 160 held by the scribing head 130 in the direction of the arrow AR2. As shown in FIG. 2, the drive unit 170 mainly includes a support 71, a guide rail 72, and a motor 73.

The control unit 190 implements operation control and data calculation of each component of the scribing device 100. As shown in FIGS. 1 and 2, the control unit 190 mainly includes a ROM 91, a RAM 92, and a CPU 93.

<2.2. Composition of the scribing wheel]

13 and 14 are a side view and a front view showing an example of the configuration of the scribing cutter wheel 160. Figure 15 is a partial enlarged view of the symbol A of Figure 14. The scribing cutter wheel 160 is formed of the same diamond content (for example, a diamond sintered body or a polycrystalline diamond) as the blade portion 61 of the first embodiment. The scribing cutter wheel 160 is a cutter that forms a scribe line on the brittle material substrate 4 by moving relative to the brittle material substrate 4.

As shown in FIGS. 10 to 14, the scribing cutter wheel 160 is disposed such that the bottom surface of the two truncated cones (where the area of the lower bottom surface is larger than the upper bottom surface) is opposite to each other, and is substantially disk-shaped (abacus beads). shape). As shown in FIGS. 13 and 14, the scribing cutter wheel 160 mainly includes a main body portion 161 and a blade portion 162.

As shown in FIGS. 13 and 14, the main body portion 161 is removed from the scribing cutter wheel 160. A disk-shaped portion other than the blade portion 162 included in the peripheral portion is provided with a through hole 160a penetrating the main body portion 161 along the rotating shaft 160b in the vicinity of the center of the main body portion 161. Further, an annular blade portion 162 is provided on the outer circumference of the main body portion 161.

As shown in FIG. 13, the blade portion 162 is an outer peripheral portion of the scribing cutter wheel 160. As shown in FIG. 14, the blade portion 162 is formed in a V shape in a front view. In the blade portion 162, the thickness Tb (see FIG. 14) along the direction of the rotation shaft 160b gradually decreases toward the blade edge 162a from the side of the rotation shaft 160b.

The blade edge 162a is provided along the outermost peripheral portion of the blade portion 162 (i.e., the portion of the blade portion 162 that is the largest distance from the rotating shaft 160b and the thickness Tb of the blade portion 162 is the smallest). As shown in FIG. 15, the cutting edge 162a mainly includes a plurality of inclined faces 165 (165a, 165b) and a rounded surface 167.

Further, as shown in Fig. 13, the unevenness is not intentionally formed on the blade edge 162a.

As shown in Fig. 15, a plurality of (two in the present embodiment) inclined surfaces 165 (165a, 165b) form side faces of the blade portion 162. Moreover, as shown in FIG. 15, the rounded surface 167 and the inclined surface 165 (165a, 165b) are respectively connected.

<2.3. Size of the scribing cutter wheel>

Here, the outer diameter Dm (refer to FIG. 14) of the scribing cutter wheel 160 is usually 1 mm to 10 mm, preferably 1 mm to 5 mm (more preferably 1 mm to 3 mm). When the outer diameter Dm of the scribing cutter wheel 160 is less than 1 mm, the operability and durability of the scribing cutter wheel 160 are lowered. On the other hand, when the outer diameter Dm of the scribing cutter wheel 160 is larger than 5 mm, there is a case where the vertical crack K at the time of scribing is not formed deep on the brittle material substrate 4.

Further, the thickness Th (see FIG. 14) of the scribing cutter wheel 160 is preferably 0.5 mm to 1.2 mm, more preferably 0.5 mm to 1.1 mm. When the thickness Th of the scribing cutter wheel 160 is less than 0.5 mm, workability and workability may be degraded. On the other hand, when the thickness Th of the scribing cutter wheel 160 is larger than 1.2 mm, the material for the scribing cutter wheel 160 and the cost of manufacturing the scribing cutter wheel 160 become high.

Further, the blade edge angle θ2 (see FIG. 14) of the blade portion 162 is usually an obtuse angle, and is preferably 90 deg < θ2 ≦ 160 deg (more preferably 100 deg ≦ θ2 ≦ 140 deg). Further, the specific value of the blade edge angle θ2 is appropriately set depending on the material and/or thickness of the cut brittle material substrate 4.

<2.4. Forming method of scribing cutter wheel>

Here, a method of forming the scribing cutter wheel 160 from a diamond sintered body or a polycrystalline diamond will be described. In the forming method, first, a disk of a desired radius is cut out from a polycrystalline diamond of a preferred thickness (0.5 mm to 1.2 mm).

Then, the peripheral edge portion of the disk is cut so that the thickness Tb of the blade portion 162 along the rotating shaft 160b gradually decreases toward the blade edge 162a from the side of the rotating shaft 160b. Thereby, a blade portion 162 having a V shape in a front view is formed at a peripheral portion of the disk.

<2.5. Scribing method>

Here, a method of forming the scribe line SL on the brittle material substrate 4 by using the scribing cutter wheel 160 exemplified by the tool as an example of the diamond inclusion is described with reference to FIGS. 1 , 2 , and 15 . Be explained.

In the present method, the rounded surface 167 in the outer surface of the scribing cutter wheel 160 is brought into contact with the brittle material substrate 4 by the action of the scribing head 130. Further, the fringe material substrate 4 is biased from the rounded surface 167 which is in contact with the brittle material substrate 4 (the line is negative) Dutch).

Then, the scribing cutter wheel 160 is relatively moved with respect to the brittle material substrate 4 in a state where the rounded surface 167 of the scribing cutter wheel 160 is brought into contact with the brittle material substrate 4. In this case, the scribing cutter wheel 160 is moved in the X-axis direction (arrow AR1 direction: see FIG. 1), and the holding unit 10 holding the brittle material substrate 4 is oriented in the Y-axis direction (arrow AR2 direction: reference drawing) 2) Move on.

Thereby, the scribing cutter wheel 160 is rotated on the brittle material substrate 4, and the scribing line SL corresponding to the locus of the rounded surface 167 (see FIG. 15) of the cutting edge 162a is formed on the brittle material substrate 4. Further, a vertical crack K extending from the scribe line SL in the vertical direction (Z-axis direction) is formed on the brittle material substrate 4.

Here, the scribing load is preferably set to 3 N to 30 N, and more preferably set to 5 N to 20 N. Further, the moving speed of the scribing cutter wheel 160 with respect to the brittle material substrate 4 is usually set to 50 mm/sec to 1200 mm/sec, preferably 50 mm/sec to 300 mm/sec. Further, the specific values of the scribing load and the moving speed are appropriately set depending on the material and/or the thickness of the brittle material substrate 4.

<2.6. Principle of scribing>

As shown in Fig. 15, a rounded surface 167 is formed on the blade edge 162a of the scribing cutter wheel 160 of the present embodiment. Thereby, similarly to the first embodiment, a large scribing load is applied to the brittle material substrate 4 from the rounded surface 167 of the cutting edge 162a, and the brittle material substrate 4 is not cut. That is, when the rounded surface 167 is formed on the cutting edge 162a, and the scribe line SL and the vertical crack K are formed by the rounded surface 167, a large compressive stress and stretching can be generated in the contact portion 4a. stress. Thereby, chipping and microcracking can be prevented, so that it can be well The brittle material substrate 4 is scribed.

<2.7. Advantages of the scribing cutter wheel in this embodiment>

As described above, the scribing cutter wheel 160 included in the scribing device 100 of the present embodiment includes the blade portion 162 whose thickness Tb is smaller from the center of the main body portion 161 toward the blade edge 162a as shown in Fig. 14 .

Further, as shown in FIG. 15, the blade edge 162a of the blade portion 162 has a rounded surface 167 which is connected to the two inclined faces 165 (165a, 165b) of the side surface forming the 162, respectively. Further, the fillet surface 167 has a curved shape.

Therefore, when the brittle material substrate 4 is biased from the rounded surface 167 of the cutting edge 162a, the scribing cutter wheel 160 can generate a large compressive stress and tensile stress in the contact portion 4a without The contact portion 4a of the brittle material substrate 4 that is in contact with the fillet surface 167 is cut (see FIG. 10). Further, the scribe line SL and the vertical crack K are formed on the brittle material substrate 4 by the compressive stress and the tensile stress.

Therefore, the scribing cutter wheel 160 can prevent the occurrence of chips and microcracks in the vicinity of the scribe line SL in the same manner as the diamond tip 60 of the first embodiment, and can scribe the brittle material substrate 4 satisfactorily. Moreover, the life of the scribing cutter wheel 160 can be increased.

<3. Modifications>

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

(1) In the first embodiment, the case where the blade portion 61 has a quadrangular pyramid shape has been described. However, the shape of the blade portion 61 is not limited to a quadrangular frustum shape. For example, the blade portion 61 may have not only a triangular pyramidal shape but also an n-pyramidal shape (its In the middle, n is an integer of 5 or more). Further, the blade portion 61 may have an m-pyramid shape (where m is an integer of 3 or more).

(2) In the first and second embodiments, a ball screw is used as the feeding mechanism of the driving portions 70 and 170 (see FIG. 2), but the feeding mechanism is not limited thereto. For example, a linear motor (linear guide rail) or the like can be used as the feed mechanism.

(3) Further, in the case where the driving unit 70 in the first embodiment and the driving unit 170 in the second embodiment move the scribing heads 30 and 130 to the holding unit 10, respectively, the scribing head is described. The movement patterns of the portions 30 and 130 are not limited thereto.

For example, the scribing heads 30, 130 may be fixed to move the holding unit 10 in the direction of the arrow AR1 (see FIG. 1). Further, the holding unit 10 may be fixed, and the scribing heads 30 and 130 are moved in the direction of the arrow AR2 (see FIG. 2) by the driving units 70 and 170, respectively. Further, both the scribing head portion 30 and the holding unit 10 can be moved.

Thus, as long as at least one of the holding unit 10 of the brittle material substrate 4 and the scribing head 30 holding the diamond tip 60 or the scribing head 130 holding the scribing wheel 160 can be carried out with respect to the other Relative movement can be.

[Examples]

Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited by the examples.

<Example 1 and Comparative Example 1>

Fig. 16 is a view for explaining a test method for evaluating the strength of the end face of the lined brittle material substrate 4. 17 shows the first embodiment and the comparative example 1. Diagram of test conditions. Fig. 18 is a view showing the test results of Example 1 and Comparative Example 1. Fig. 19 is a photograph of the brittle material substrate 4 which is scribed by the blade portion 61 (see Fig. 7) having the rounded surface 67 of the first embodiment. Fig. 20 is a photograph of the brittle material substrate 4 which is scribed by the blade portion (see Fig. 9) having no rounded surface in Comparative Example 1.

In Example 1 and Comparative Example 1, a 4-point bending test was employed as a test for evaluating the strength of the end face of the scribed blank brittle material substrate 4. As shown in Fig. 16 and Fig. 17, in this test, the distance D1 between the upper fulcrums 95 (95a, 95b) is 10.0 mm, and the distance D2 between the lower fulcrums 96 (96a, 96b) is 20.0 mm. In the downward state, the long side is bent in the direction of the arrow AR7.

As shown in Fig. 18, the average value of the rupture load of Example 1 was about 3 times the average value of the rupture load of Comparative Example 1. In this case, the strength of the brittle material substrate 4, which was scribed by Example 1, was higher than that of the brittle material substrate 4, which was scribed by Comparative Example 1.

Further, in Comparative Example 1 (see FIG. 20), chips were generated in the vicinity of the scribe line SL, and in the first embodiment, no chips were generated in the vicinity of the scribe line SL. In this case, it was shown that Example 1 was able to perform a good scribing of the brittle material substrate 4 as compared with Comparative Example 1.

1‧‧‧ scribe device

4‧‧‧Battery substrate

4a‧‧‧Contacts

10‧‧‧Holding unit

10a‧‧‧ base

11‧‧‧ mounting table

11a‧‧‧Adsorption Department

11b‧‧‧Rotary table

11c‧‧‧Mobile Station

11d‧‧‧Rotary axis

12‧‧‧Rolling screw mechanism

12a‧‧‧ screw

12b‧‧‧Nuts

13‧‧‧Motor

14a‧‧‧Support Department

14b‧‧‧Support Department

15‧‧‧rail

16‧‧‧rails

17, 17a, 17b‧‧‧ sliding parts

18, 18a‧‧ ‧ sliding part

20‧‧‧dotted unit

30‧‧‧ scribing head

31‧‧‧round frame

34‧‧‧ Wheel frame swinging part

35‧‧‧ wheel frame connector

36‧‧‧Installation

36a‧‧‧Swing axis

38‧‧‧Revolving Department

38a‧‧‧Rotary axis

40‧‧‧wheel mounting block

40a‧‧‧Installation block body

46, 47‧ ‧ bearings

49‧‧‧ Fixed Department

50‧‧‧ Lifting Department

51‧‧‧cylinder

51a‧‧‧ Body Department

51b‧‧‧ Connecting rod

52‧‧‧Transmission Department

53‧‧‧Guiding agency

53a‧‧‧rail

53b‧‧‧ Guide block

54‧‧‧Installation board

56‧‧‧Rotary axis

60‧‧‧ diamond tip

61‧‧‧blade

62‧‧‧ grip

62a‧‧‧One end of the grip

64‧‧‧ front end

65, 65a, 65b, 65c, 65d‧‧‧ bevel

66‧‧‧ ridgeline

66b‧‧‧ ridgeline

67, 67a, 67b, 67c, 67d‧‧‧ fillet

68‧‧‧ Straight line

68b‧‧‧Linear Department

69‧‧‧ Curve Department

69b‧‧‧ Curve Department

70‧‧‧ Drive Department

71, 71a, 71b‧‧ ‧ pillar

72‧‧‧rails

73‧‧‧Motor

80‧‧‧ camera unit

85, 85a, 85b‧‧‧ cameras

90‧‧‧Control unit

91‧‧‧ROM (read only memory)

91a‧‧‧Program

92‧‧‧RAM (random access memory)

93‧‧‧CPU (Central Processing Unit)

95, 95a, 95b‧‧‧ upper fulcrum

96, 96a, 96b‧‧‧ lower fulcrum

100‧‧‧ scribe device

120‧‧‧Drawing unit

130‧‧‧ scribing head

131‧‧‧round frame

136‧‧ sales

137‧‧‧Support frame

138‧‧‧Revolving Department

138a‧‧‧Rotary axis

160‧‧‧ scribing wheel

160a‧‧‧through hole

160b‧‧‧Rotary axis

160c‧‧‧ Grounding position

161‧‧‧ Body Department

162‧‧‧blade

162a‧‧‧Tool tip

165, 165a, 165b‧‧‧ bevel

167‧‧‧rounded surface

170‧‧‧ Drive Department

190‧‧‧Control unit

AR1‧‧‧ arrow

AR2‧‧‧ arrow

AR3‧‧‧ arrow

AR4‧‧‧ arrow

AR5‧‧‧ arrow

AR6‧‧‧ arrow

AR7‧‧‧ arrow

D1‧‧‧ distance

D2‧‧‧ distance

Dm‧‧‧ outside diameter of the scribing wheel

K‧‧‧ vertical crack

R1‧‧‧ arrow

R2‧‧‧ arrow

R3‧‧‧ arrow

SL‧‧‧

Tb‧‧‧ thickness of the blade

Th‧‧‧ thickness of the scribing wheel

X‧‧‧ coordinate axis

Y‧‧‧ coordinate axis

Z‧‧‧ coordinate axis

Θ1‧‧‧ angle

22‧‧‧knife angle

Fig. 1 is a front view showing an example of the overall configuration of a scribing device according to the first and second embodiments of the present invention.

Fig. 2 is a side view showing an example of the overall configuration of the scribing device in the first and second embodiments of the present invention.

Fig. 3 is a front view showing an example of the configuration in the vicinity of the scribing head.

Fig. 4 is a side view showing an example of the configuration of the vicinity of the swinging portion of the wheel frame.

Fig. 5 is a side view showing an example of the configuration in the vicinity of the swinging portion of the wheel frame.

Fig. 6 is a side view showing an example of a configuration of a diamond tip in the first embodiment.

Fig. 7 is a front view showing an example of the shape of the blade portion in the first embodiment.

Figure 8 is a front view for explaining the ridgeline of the blade portion of Figure 7.

Fig. 9 is a front view showing an example of a shape of a blade portion having no rounded surface.

Fig. 10 is a front view showing an example of the configuration in the vicinity of the scribing cutter wheel in the second embodiment.

Fig. 11 is a bottom view showing an example of the configuration in the vicinity of the scribing cutter wheel in the second embodiment.

Figure 12 is a bottom view for explaining the stabilizing effect of the kingpin.

Fig. 13 is a side view showing an example of a scribing cutter wheel in the second embodiment.

Fig. 14 is a front view showing an example of a scribing cutter wheel in the second embodiment.

Figure 15 is a partial enlarged view of the symbol A of Figure 14.

Fig. 16 is a view for explaining a test method for evaluating the strength of the end face of the lined brittle material substrate.

Fig. 17 is a view for explaining test conditions of Example 1 and Comparative Example 1.

Fig. 18 is a view showing the test results of Example 1 and Comparative Example 1.

Figure 19 is a photograph of a brittle material substrate lined with the blade portion shown in Figure 7.

Figure 20 is a photograph of a brittle material substrate lined with the blade portion shown in Figure 9.

4‧‧‧Battery substrate

4a‧‧‧Contacts

61‧‧‧blade

64‧‧‧ front end

65, 65a, 65b, 65c, 65d‧‧‧ bevel

66, 66b‧‧‧ ridgeline

67, 67a, 67b, 67c, 67d‧‧‧ fillet

68, 68b‧‧‧ Straight line

69, 69b‧‧‧ Curve Department

K‧‧‧ vertical crack

SL‧‧‧

X‧‧‧ coordinate axis

Y‧‧‧ coordinate axis

Z‧‧‧ coordinate axis

Claims (13)

A scribing method characterized in that a scribing is formed on a brittle material substrate by a cutter having a blade portion including a diamond inclusion, and comprising the steps of: (a) by causing the blade portion and The brittle material substrate is in contact with each other, and a force is applied to the brittle material substrate from the cutter; (b) the cutter is moved relative to the brittle material substrate while the blade portion of the cutter is in contact with the brittle material substrate. Thereby, a scribe line is formed on the brittle material substrate; and the outer surface of the blade portion has a rounded surface having a curved shape; and in the step (a), the rounded surface is brought into contact with the brittle material substrate. The cutter applies a force to the brittle material substrate. In the step (b), the rounded surface is convex downward, and the cutter moves relative to the brittle material substrate. The scribing method of claim 1, wherein the cutter is provided with a diamond tip of the blade portion at one end of the cylindrical or prismatic rod, that is, the grip portion. The scribing method of claim 2, wherein the diamond tip is set as follows: the blade portion has: a front end surface; a plurality of inclined surfaces each connected to the front end surface; and a plurality of the rounded surfaces And each of the plurality of inclined faces, that is, the adjacent inclined surface and the front end surface; Each ridge line of the blade portion has a straight portion that is an intersection of the two adjacent inclined surfaces, and a curved portion that is located on a fillet surface that is connected to each of the two adjacent inclined surfaces and that is connected to the straight portion. And the front end surface; and the slope of the straight portion with respect to the front end surface on each ridge line of the blade portion is set to be larger than a slope of the curved portion with respect to the front end surface when the front end surface is horizontal. The scribing method of claim 3, wherein the diamond tip is used as follows: the diamond inclusion is a polycrystalline diamond, and the polycrystalline diamond layer comprises a fine grain structure or an amorphous graphite carbon material. As a starting material, it is directly sintered at a high pressure and high temperature to be converted into a diamond, and is essentially composed only of diamonds. The scribing method of claim 3, wherein the diamond tip is used as follows: the diamond inclusions contain: a diamond having a content of 65.0% by weight to 75.0% by weight, and an ultrafine particle content of 3.0% by weight to 10.0% by weight. The diamond sintered body of the carbide and the other bonding material, wherein the diamond has an average particle diameter of 0.1 μm to 5.0 μm, and the bonding material is an iron-based metal mainly composed of cobalt. The scribing method of claim 5, wherein the diamond tip is used as follows: the content of the ultrafine carbide in the diamond sintered body is 6.0 The amount of % to 8.0% by weight, and the ultrafine particle carbide contains: 1.0% by weight to 4.0% by weight of titanium carbide of the diamond sintered body, and the remaining tungsten carbide. The scribing method according to claim 1, wherein the cutter is provided with a scribing cutter wheel having the blade portion on the outer circumference of the disc-shaped main body portion. A diamond tip, characterized in that it forms a scribe on the brittle material substrate by relatively moving the substrate of the brittle material, and includes: a grip portion which is a cylindrical or prismatic rod body, and a blade portion including a diamond inclusion and disposed at one end of the grip portion, the blade portion having a front end surface, a plurality of inclined surfaces each connected to the front end surface, and a plurality of rounded surfaces Each of the plurality of inclined faces, that is, the adjacent inclined surface, is surrounded by the front end surface; each of the ridge lines of the blade portion has a straight portion which is an intersection of the two adjacent inclined surfaces, and a curved portion which is located at the same as the above Each of the adjacent inclined surfaces is connected to the rounded surface and connected to the straight portion and the front end surface; and the slope of the straight portion with respect to the front end surface is set to be larger than the slope on the ridge line of the blade portion When the front end face is horizontal, the above curve portion The plurality of rounded faces are the contact portions that contact the brittle material substrate when the scribe line is formed on the brittle material substrate, with respect to the slope of the front end surface. The diamond tip of claim 8, wherein the diamond inclusion is a polycrystalline diamond, and the polycrystalline diamond comprises a fine grain structure or an amorphous graphite type carbon material as a starting material in an ultrahigh pressure high temperature. Direct sintering is converted to diamonds and consists essentially of diamonds. The diamond tip of claim 8, wherein the diamond inclusion is a diamond sintered body, and the diamond sintered body comprises: a diamond having a content of 65.0% by weight to 75.0% by weight, and an ultrafine particle content of 3.0% by weight to 10.0% by weight. The carbide and the remaining bonding material; the diamond has an average particle diameter of 0.1 μm to 5.0 μm, and the bonding material is an iron-based metal mainly composed of cobalt. The diamond tip of claim 10, wherein the ultrafine particle carbide in the diamond sintered body is 6.0% by weight to 8.0% by weight, and the ultrafine particle carbide contains 1.0% by weight to 4.0% by weight of the diamond sintered body. Titanium carbide, and the rest of the tungsten carbide. A scribing apparatus, comprising: a scribing unit comprising the diamond of any one of claims 8 to 11 And a holding unit that moves while holding the brittle material substrate on one side, and forms a scribe line on the brittle material substrate by moving the holding unit relative to the scribe line unit. A scribing apparatus, comprising: a scribing unit including the diamond tip of claim 8; and a holding unit that holds the brittle material substrate while moving on one side; and by causing the holding unit to The line unit is relatively moved to form a scribe line on the brittle material substrate.