CN107775825A - Diamond cutter and its scribble method - Google Patents
Diamond cutter and its scribble method Download PDFInfo
- Publication number
- CN107775825A CN107775825A CN201710670374.8A CN201710670374A CN107775825A CN 107775825 A CN107775825 A CN 107775825A CN 201710670374 A CN201710670374 A CN 201710670374A CN 107775825 A CN107775825 A CN 107775825A
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- China
- Prior art keywords
- substrate
- line
- inclined plane
- matrix
- diamond cutter
- Prior art date
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 71
- 239000010432 diamond Substances 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000011159 matrix material Substances 0.000 claims abstract description 57
- 230000002093 peripheral effect Effects 0.000 claims description 45
- 238000003825 pressing Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A kind of diamond cutter and its scribble method, when being rule, can on the outside of the substrate rule, with circumscribed end.Relative to the angle of the matrix (11) of diamond cutter (10), inclined plane is formed from the both sides of matrix, and using the intersection point of crest line (16) and top surface (17) as reamer (P).The reamer (P) of the diamond cutter (10) is set to be contacted with substrate without rollably being rule.In this case, because only having a reamer at the angle of matrix, it can be cut beyond not considering in the case of the damage of other reamers and begin to rule and with circumscribed end.
Description
Technical field
It is used to draw the brittle substrates such as glass substrate, silicon wafer using diamond reamer the present invention relates to one kind
The diamond cutter and its scribble method of line.
Background technology
In the past, in order to be rule to glass substrate, silicon wafer, formed using applying by stitch marker, single-crystal diamond
Diamond reamer cutter.It is main using the stitch marker rolled relative to substrate for glass substrate, but be in order at and carry
The advantages that substrate strength after height line, considers that also gradually research uses diamond reamer as fixing cutter.In patent document
1st, the scheme for the reamer rule for the substrate high to hardness such as sapphire wafer, aluminum oxide wafers is proposed in 2.At this
In a little patent documents, using setting the cutter that the cutter of cutting knife, end are in circular cone on the crest line of pyramid.In addition, in patent text
3 are offered to propose to rule to glass plate and use the chalker of the glass scribes with conical end.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2003-183040 publications
Patent document 2：Japanese Unexamined Patent Publication 2005-079529 publications
Patent document 3：Japanese Unexamined Patent Publication 2013-043787 publications
The content of the invention
Invent problem to be solved
If rule using the conventional cutter as fixing cutter, reamer is gradually worn out, it is therefore desirable to changes hinge
Knife.In addition, it is necessary to make reamer be contacted at a proper angle relative to substrate in the line carried out using cutter.But for
Conventional cutter, in the case where changing reamer, it is necessary to make cutter rotate vertically, it is not easy to which precision adjusts the contact well
Angle.
Therefore, as shown in figure 1, consider to be ground in a manner of making each summit of prism-shaped cutter overlap from two sides and
Inclined plane is formed, and the both sides of the intersection of inclined plane are set to reamer P1, P2 line cutter 100.Using this
The line cutter of sample, crest line is set to be in advance and reamer P1 is against into substrate 101 and entered towards right side as shown in Fig. 1 (a)
Row line in the case of, even in rule in a manner of the end by substrate, with it is so-called it is circumscribed end to substrate 101
Line in the case of will not also bring damage to adjacent other reamers P2.On the other hand, line is proceeded by cutting in addition
In the case of, there is a possibility that the reamer P2 of front collides with the end of substrate 101 and sustains damage.
On the other hand, as shown in Fig. 1 (b), tilted and direction forwards in a manner of making crest line using reamer P2 for rear
In the case that right side is rule, line is proceeded by even if cutting in addition, also will not bring damage to another reamer P1.But
It is problems be present, i.e. when being rule with circumscribed end, untapped reamer P1 is also possible to contact with the face of substrate 101
And damage.
Therefore, in the case where being rule using such line cutter, the situation that proceeds by line is being cut in addition
Under, it is impossible to circumscribed end, with it is circumscribed terminate line in the case of, it is necessary within cut and begin.Therefore, cause in glass plate
The part not being scribed Deng the end residual of substrate.If make the substrate edge line line so rule with internal-cutting way
Trace stops, then the problem of cutting deterioration in accuracy without the base ends punishment for forming stria of ruling be present.
The present invention be in view of this existing issue and make, its object is to, there is provided one kind can beyond cut and begin simultaneously
Terminate the diamond cutter and its scribble method of line.
Means for solving the problems
In order to solve the problem, the present invention provides a kind of diamond cutter, and it possesses：The matrix of polygon, there is side
With multiple outer peripheral faces；First inclined plane and the second inclined plane, relative to an angle of described matrix, from the two sides of described matrix
Formed towards an outer peripheral face；Crest line, it is the intersection of first inclined plane and second inclined plane；And top
Face, formed from one outer peripheral face towards the crest line, at least described crest line and the top surface by diamond, the rib
The intersection point of line and the top surface is as reamer, the press section of a part of end as pressing substrate of the crest line.
Or, there is a reamer at an angle of the polygon herein.
Or, described matrix is the matrix of isosceles triangle herein.
Or, described matrix is square matrix herein.
Or, described matrix is rectangular matrix herein.
In order to solve the problem, the present invention provides a kind of scribble method, using above-mentioned diamond cutter, the diamond tool
Tool is held in scribe head in a manner of the reamer of the diamond cutter is in lowermost position, in the outside of substrate, so that institute
State the mode located more on the lower upper surface of the reamer in than the substrate and push scribe head, by making the scribe head in substrate
Face on move in parallel, the circumscribed line since the end of substrate, rule to the end of the substrate, make one of the crest line
Divide the end for pressing the substrate while being separated with the end of the substrate, so as to terminate to rule.
The effect of invention
According to the present invention having the feature that, can be rule from an end face of brittle substrate until another
End face, i.e. start line and using circumscribed with circumscribed end line.Therefore, following effect is obtained, i.e. after terminating to rule,
When along line stria segmentation substrate, good section can be also obtained in the end of substrate.
Brief description of the drawings
Fig. 1 is the side view for representing to have using prism-shaped and at an angle line of the diamond cutter of two reamers.
Fig. 2 be the top view of manufacturing process of the diamond cutter for representing the first embodiment of the present invention, side view and
Front view.
Fig. 3 is the top view, side view and front view of the diamond cutter of first embodiment.
Fig. 4 is to represent to be provided with front view and the side view of the scribe head of the diamond cutter of the first embodiment of the present invention
Figure.
Fig. 5 is the front view (its 1) of the line for the diamond cutter for representing the first embodiment using the present invention.
Fig. 6 is the front view (its 2) of the line for the diamond cutter for representing the first embodiment using the present invention.
Fig. 7 is the front view (its 3) of the line for the diamond cutter for representing the first embodiment using the present invention.
Fig. 8 is the front view (its 4) of the line for the diamond cutter for representing the first embodiment using the present invention.
Fig. 9 be present embodiment start line before reamer P enlarged drawing.
Figure 10 is the enlarged drawing on reamer P when starting to rule of present embodiment periphery.
Figure 11 is top view, side view and the main view of the diamond cutter of the variation of the first embodiment of the present invention
Figure.
Figure 12 is the side view and front view of the diamond cutter of the manufacturing process of second embodiment of the present invention.
Figure 13 is the side view and front view of the diamond cutter of second embodiment of the present invention.
Figure 14 is the top view, side view and front view of the diamond cutter of third embodiment of the present invention.
Description of reference numerals
10th, 50,60 diamond cutter
11st, 51,61 matrix
11a, 11b, 51a, 51b, 61a, 61b side
12a, 12b, 52a~52d, 62a, 62b, 62c outer peripheral face
13a, 13b, 15a~15d, 16a~16d, 53a~53d, 54a~54d, 55a~55d, 56a~56d, 63a,
63b, 64a, 64b inclined plane
14th, 16,57a~57d, 67a, 67b crest line
17th, 58a~58d, 68a, 68b top surface
P, P1~P4 reamers
Embodiment
Then, the first embodiment of the present invention is illustrated.Fig. 2 is the gold for representing the first embodiment of the present invention
The manufacturing process of diamond cutter 10, Fig. 3 are top view, side view and the front view for representing the diamond cutter after the completion of manufacturing.
The sheet material of certain thickness and the single-crystal diamond of isosceles triangle is set to matrix 11 by the diamond cutter 10.As shown in Fig. 2
For matrix 11, when in terms of front, V-arrangement is ground to from the both sides of the angle part on a summit.That is, from a side 11a court
More than 1/2 of the thickness to matrix 11 is cut off to two outer peripheral faces 12a, 12b of matrix 11, so as to form inclined plane 13a.This
When, it is preferred that cut off, with cause two of inclined plane 13a and matrix 11 adjacent outer peripheral face 12a, 12b respectively institute into
Angle be equal to each other.Then, from the another side 11b of matrix 11 similarly two adjacent outer peripheral face 12a towards matrix 11,
12b cuts off 1/2 or so of the thickness to matrix 11, so as to be formed into trapezoidal inclined plane 13b.The friendship of inclined plane 13a, 13b
Line is crest line 14.
Then, as shown in figure 3, relative to inclined plane 13a, rolled tiltedly from side 11a to outer peripheral face 12b and form inclined plane
15a, relative to inclined plane 13b, rolled tiltedly from side 11b to outer peripheral face 12b and form inclined plane 15b.Thus, positioned at original
First inclined plane 15a of outer peripheral face 12b positions intersects with the second inclined plane 15b, in the centre of the thickness direction of matrix 11, preferably
Middle position shown in (a) in Fig. 3, form the crest line 16 parallel with side 11a, 11b of matrix.It should be noted that
This, can by the way that the first inclined plane 15a is formed as into the face different with inclined plane 13a, inclined plane 13b from the second inclined plane 15b
Reduce the working (finishing) area for carrying out the precise finiss for forming crest line 16, so as to improve processing efficiency.
Then, top surface 17 is formed from outer peripheral face 12b towards inclined plane 15a, 15b.Here, top surface refers to, crest line 16 is shared
One end face.Crest line 16 is set to reamer P with the end that top surface 17 connects.Top surface is to act on the substrate rule
Face, if it is more than 0.05mm to act on the scope of substrate in the side elevation of (b) from Fig. 3, effectively risen as top surface
Effect, such as it is set to 0.05~0.1mm or so.As long as in addition, crest line 16 act on the scope of substrate when in line from
The side elevation of Fig. 3 (b) is more than 5 μm and just worked.
By forming reamer P in this wise, as shown in figure 3, under side view, can be on the top of the diamond cutter 10 of triangle
Point forms a reamer P.Such inclined plane, top surface can be readily formed by Laser Processing.Alternatively, it is also possible in laser
After processing, mechanical lapping is further carried out, the part for forming crest line is set to more accurate abradant surface.
Fig. 4 is the front view and side view for representing diamond cutter 10 being installed on the state of line head unit 30.Such as Fig. 4
Shown, diamond cutter 10 is held in toolframe 20.Toolframe 20 is the part of rectangular-shape, in its lower end so that diamond tool
The mode that the reamer P of tool 10 turns into lower end is obliquely kept.Toolframe 20 is provided with screwed hole at two, is thus fixed on line
First 30.
Line head unit 30 is configured to, and the head plate 31 of tabular itself is integrally moved up and down using sliding equipment (not shown).
Also, it is fixed with the pneumatic cylinder 32 of line load in the head plate 31.The lower end of pneumatic cylinder 32 is protruded in a manner of retractile
There is bar 32a.Then, as shown in Fig. 4 (b), guiding mechanism 33 and sliding part 34 are provided with below the bar 32a of head plate 31,
Sliding part 34 is pressed downwards using predetermined load.Guiding mechanism 33 keeps sliding part 34 in a manner of moving up and down freely.
Sliding part 34 is provided with the plate 35 of L-shaped.Plate 35 is moved up and down together with sliding part 34, and lower limit is limited by limited part 36.Also,
Toolframe 20, which is threadably secured, is along inclined direction fixed on the plate 35.Also, by making line head unit 30 along arrow A directions
It is mobile, it can be rule.
Using Fig. 5~Fig. 8, situation about being rule to the diamond cutter 10 using present embodiment illustrates.
When starting line, first, as shown in figure 5, making the reamer P of diamond cutter 10 make under line head unit 30 close to substrate 40
Drop.Now, as shown in the enlarged drawing on Fig. 9 reamer P peripheries, outer peripheral face 12a is preferably with brittle substrate angulation θ
15~20 °, push line head unit 30, to cause the reamer P of diamond cutter 10 lower than the upper surface of substrate 40, difference in height D
It is 0.05~0.2mm or so according to the thickness of substrate 40.Then, line head unit 30 is made to be moved to right from the left surface direction of substrate 40
It is dynamic.Thus, as shown in fig. 6, the outer peripheral face 12b of diamond cutter 10 and substrate 40 upper left ends contact.That is, outer peripheral face 12b
At least a portion or all worked as reamer P guide surface is guided on the substrate 40.Now, such as Figure 10 enlarged drawing
Shown, the interval F between reamer P and substrate 40 is determined by angle, θ and difference in height D, such as under θ=15 °, D=0.2mm, F is
0.78mm.Therefore, guide surface 12b preferably has more than 1.0mm length in the circumference of diamond cutter 10.Also, if make
Diamond cutter moves along arrow A directions, then as shown in fig. 7, substrate 40 overcome the pressure of pneumatic cylinder 32 by sliding part 34 slightly
Elect, plate 35 itself rises.If line head unit 30 further moves to the right, guide surface 12b is slided relative to substrate 40
While dynamic, the peripheral part of the reamer P comprising top surface 17 enters substrate 40, can be rule since the end of substrate 40, i.e.
Start circumscribed line, line stria is formed from the end of substrate 40.If line head unit 30 is set further to be moved to arrow A directions
Move and rule, then can be so that the top surface 17 of diamond cutter 10 be front, the mode that makes crest line 16 be rear is drawn
Line.As described above, when starting circumscribed line, first, outer peripheral face (guide surface) 12b of diamond cutter 10 and a left side for substrate 40
Upper end contacts, and the reamer comprising its rear top surface 17 is directed to guide towards substrate 40 and is in contact with it, so as to even with outer
Line of beginning is cut, can also prevent the damage of reamer.Moreover, by making the wide top surface of width be front, crest line is in rear and substrate
Contact, so as to which stress will not concentrate on the end of substrate 40, it can also suppress to start base ends damage during line.
Moreover, as shown in figure 8, rule (circumscribed line), the end until leaving substrate 40.Now, diamond tool
A part for the crest line 16 of tool 10 presses the end of substrate while leaving substrate slightly on one side.In the case where terminating to rule, by
Top surface opposite side near the reamer P in diamond cutter 10, i.e. with crest line is without other reamers, so can not examine
Terminate to rule with circumscribed in the case of considering the damage of other reamers.Other, in line stria terminal, the part pressing of crest line 16
Substrate, thus, it is possible to be reliably formed vertical crack below line stria.It should be noted that if the length of crest line 16 is
More than 20 μm, then crest line 16 can more reliably press substrate.
It should be noted that in the first embodiment, as shown in Fig. 2 (a), in side 11a, 11b shape from both sides
Into after inclined plane 13a, 13b, first, second inclined plane is additionally formed, but in the thickness of thin of matrix, and working (finishing) area is enough
In the case of small grade, as shown in figure 11, inclined plane 13a, 13b can be set to first, second inclined plane.In the situation
Under, top surface 17 is formed from outer peripheral face 12b towards inclined plane 13a, 13b, crest line 14 and top as the intersection of inclined plane 13a, 13b
The end that face 17 connects is reamer P.
Then, second embodiment of the present invention is illustrated using Figure 12 and Figure 13.In above-mentioned first embodiment
In, using the matrix of isosceles triangle, but the diamond cutter 50 of present embodiment is at each angle of the matrix of square point
Reamer that Xing Cheng be shown in Fig. 3.The diamond cutter 50 of present embodiment uses single-crystal diamond shape as shown in Figure 12
Into square and certain thickness tabular matrix 51.Also, from a side 51a four outer peripheral faces of direction of matrix 51
52a~52d intersection point forms inclined plane 53a~53d.Similarly, inclined plane 54a is formed from another side 51b towards four angles
~54d.
Then, (a) such as Figure 13, Figure 13 (b) shown in, relative to inclined plane 53a, from side 51a towards outer peripheral face 52a
Roll tiltedly and form inclined plane 55a, relative to inclined plane 54a, rolled tiltedly from side 51b towards outer peripheral face 52a and formed and tilted
Face 56a.Thus, the first inclined plane 55a in original outer peripheral face 52a positions intersects with the second inclined plane 56a, in matrix 51
Thickness direction centre, preferably in the middle position shown in (a) such as Figure 13, formed parallel with side 51a, 51b of matrix
Crest line 57a.
Then, relative to inclined plane 53b, rolled tiltedly from side 51a towards outer peripheral face 52b and form inclined plane 55b, relatively
In inclined plane 54b, rolled tiltedly from side 51b towards outer peripheral face 52b and form inclined plane 56b.Thus, in original outer peripheral face
First inclined plane 55b of 52b positions intersects with the second inclined plane 56b, in the centre of the thickness direction of matrix 51, preferably in Figure 13
(a) shown in middle position, form the crest line 57b parallel with side 51a, 51b of matrix.
Then, relative to inclined plane 53c, rolled tiltedly from side 51a towards outer peripheral face 52c and form inclined plane 55c, relatively
In inclined plane 54c, rolled tiltedly from side 51b towards outer peripheral face 52c and form inclined plane 56c.Thus, in original outer peripheral face
First inclined plane 55c of 52c positions intersects with the second inclined plane 56c, in the centre of the thickness direction of matrix 51, preferably in Figure 13
(a) shown in middle position, form the crest line 57c parallel with side 51a, 51b of matrix.
Moreover, relative to inclined plane 53d, rolled tiltedly from side 51a towards outer peripheral face 52d and form inclined plane 55d, relatively
In inclined plane 54d, rolled tiltedly from side 51b towards outer peripheral face 52d and form inclined plane 56d.Thus, in original outer peripheral face
First inclined plane 55d of 52d positions intersects with the second inclined plane 56d, in the centre of the thickness direction of matrix 51, preferably in Figure 13
(a) shown in middle position, form the crest line 57d parallel with side 51a, 51b of matrix.
Then, top surface 58a is formed from outer peripheral face 52a towards inclined plane 55a, 56a.Similarly, incline from outer peripheral face 52b directions
Inclined-plane 55b, 56b forms top surface 58b, and top surface 58c is formed from outer peripheral face 52c towards inclined plane 55c, 56c, and from outer peripheral face
52d forms top surface 58d towards inclined plane 55d, 56d.Crest line 57a~57d is set with top surface 58a~58d ends to connect respectively
For reamer P1~P4.
In the present embodiment, also because respectively constituting a reamer P1~P4 on four summits of matrix 51, i.e.,
Line of beginning is cut beyond making, and terminates to rule with circumscribed, influence will not be also brought on other reamers.Further, since at each angle
Reamer is formed in the position of rotational symmetry, so in the case where a reamer wears, it is pre- by rotating diamond cutter 50
Determine angle, other reamers can be used.Under the present embodiment, can be by being rotated by 90 ° because matrix 51 is square
And use other reamers.
Then, third embodiment of the present invention is illustrated using Figure 14.In the above-described 2nd embodiment, just
Each angle of square matrix forms a reamer respectively, but in the present embodiment, sharing rectangular matrix short side
Two neighboring angle forms a reamer respectively.As shown in figure 14, the use of diamond cutter 60 of present embodiment is by single crystal diamond
The rectangle and the matrix 61 of certain thickness tabular that stone is formed.Also, from a side 61a of matrix 61 towards outer peripheral face
62a, 62b intersection point and outer peripheral face 62b, 62c intersection point form first, second inclined plane 63a, 63b.In addition, from matrix 61
Another side 61b forms first, second inclined plane towards outer peripheral face 62a, 62b intersection point and outer peripheral face 62b, 62c intersection point
64a、64b.Thus, inclined plane 63a, 64a, 63b, 64b intersects respectively, in the centre of the thickness direction of matrix 61, is preferably scheming
Middle position shown in 14 (a), form crest line 67a, the 67b parallel with side 61a, 61b of matrix.
Then, top surface 68a is formed from outer peripheral face 62b towards inclined plane 63a, 64a.Similarly, incline from outer peripheral face 62b directions
Inclined-plane 63b, 64b form top surface 68b, and crest line 67a, 67b are set into reamer P1, P2 with top surface 68a, 68b end to connect respectively.
In the present embodiment, also because reamer P1, a P2 are respectively constituted on two summits of matrix 61, even if cutting in addition
Begin to rule, and terminate to rule with circumscribed, influence will not be also brought on other reamers.In addition, because in rectangular adjacent angular,
The symmetrical position of line forms reamer, so in the case where a reamer wears, by inverting diamond cutter 60 and can
Use other reamers.
It should be noted that in the present embodiment, inclined plane 63a, 64a and inclined plane 63b, 64b are formed, by their phases
The crest line of friendship and the intersection point of top surface are set to reamer, but can also identically with first embodiment, relative to these inclined planes,
Also first, second inclined plane is formed in outer peripheral face 62b sides.
In addition, in the respective embodiments described above, matrix is integrally made up of single-crystal diamond, as long as but because with fragility material
The surface portion for expecting substrate contact is diamond can, so can also be in the shape using superhard alloy, sintered diamond system
Into the outer peripheral face of matrix and the surface of crest line form polycrystalline diamond layer, its further is carried out by accurate grinding and form hinge
Knife.Alternatively, it is also possible to use impurity and the conductive monocrystalline or polycrystalline diamond such as doping boron.By using with conduction
The diamond of property, can be readily formed inclined plane using electro-discharge machining.
In addition, in the above-described embodiment, make the crest line direction of diamond cutter to each reamer mobile and rule, but
It is that can also be rule to the top surface direction movement of each reamer.
Industrial utilization possibility
Diamond cutter of the invention can be appropriately adapted for use in being cut beyond brittle substrate beyond line simultaneously of beginning
Cut the chalker for terminating line.
Claims (6)
1. a kind of diamond cutter, possesses：
The matrix of polygon, there is side and multiple outer peripheral faces；
First inclined plane and the second inclined plane, relative to an angle of described matrix, from the two sides of described matrix towards one
The outer peripheral face and formed；
Crest line, it is the intersection of first inclined plane and second inclined plane；And
Top surface, from one outer peripheral face towards the crest line,
At least described crest line and the top surface are formed by diamond,
The intersection point of the crest line and the top surface as reamer,
Press section of the part for the crest line as the end for pressing substrate.
2. diamond cutter according to claim 1, wherein,
There is a reamer at an angle of the polygon.
3. diamond cutter according to claim 1 or 2, wherein,
Described matrix is the matrix of isosceles triangle.
4. diamond cutter according to claim 1 or 2, wherein,
Described matrix is square matrix.
5. diamond cutter according to claim 1 or 2, wherein,
Described matrix is rectangular matrix.
6. a kind of scribble method, the diamond cutter any one of usage right requirement 1 to 5,
The diamond cutter is held in scribe head in a manner of the reamer of the diamond cutter is in lowermost position,
In the outside of substrate, line is pushed in a manner of upper surface of the reamer in than the substrate is located more on the lower
Head,
Moved in parallel by making the scribe head on the face of substrate, the circumscribed line since the end of substrate,
Line to the end of the substrate, make the crest line a part press the substrate end while with the base
The end separation of plate, so as to terminate to rule.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016168325 | 2016-08-30 | ||
| JP2016-168325 | 2016-08-30 | ||
| JP2016253268A JP2018034493A (en) | 2016-08-30 | 2016-12-27 | Diamond tool and scribing method thereof |
| JP2016-253268 | 2016-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107775825A true CN107775825A (en) | 2018-03-09 |
Family
ID=61437749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710670374.8A Withdrawn CN107775825A (en) | 2016-08-30 | 2017-08-08 | Diamond cutter and its scribble method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107775825A (en) |
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| JP2002134437A (en) * | 2000-10-20 | 2002-05-10 | Beldex Corp | Scribing cutter and scriber using the same |
| CN1668431A (en) * | 2002-07-18 | 2005-09-14 | 三星钻石工业股份有限公司 | Method of scribing on brittle matetrial, scribe head, and scribing apparatus with the scribe head |
| JP2010207945A (en) * | 2009-03-09 | 2010-09-24 | Mitsuboshi Diamond Industrial Co Ltd | Groove machining tool for thin film solar battery |
| CN102807316A (en) * | 2011-05-31 | 2012-12-05 | 三星钻石工业股份有限公司 | Marking method, diamond point, and marking device |
| CN105799073A (en) * | 2015-01-16 | 2016-07-27 | 三星钻石工业股份有限公司 | Multi-Flute Diamond Tool |
-
2017
- 2017-08-08 CN CN201710670374.8A patent/CN107775825A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134437A (en) * | 2000-10-20 | 2002-05-10 | Beldex Corp | Scribing cutter and scriber using the same |
| CN1668431A (en) * | 2002-07-18 | 2005-09-14 | 三星钻石工业股份有限公司 | Method of scribing on brittle matetrial, scribe head, and scribing apparatus with the scribe head |
| JP2010207945A (en) * | 2009-03-09 | 2010-09-24 | Mitsuboshi Diamond Industrial Co Ltd | Groove machining tool for thin film solar battery |
| CN102807316A (en) * | 2011-05-31 | 2012-12-05 | 三星钻石工业股份有限公司 | Marking method, diamond point, and marking device |
| CN105799073A (en) * | 2015-01-16 | 2016-07-27 | 三星钻石工业股份有限公司 | Multi-Flute Diamond Tool |
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