TWI673113B - Glue dispensing apparatus - Google Patents

Abstract

The dispensing device of the present invention includes a conveying device; at least one substrate is moved along a predetermined direction by the conveying device; a dispensing platform is located below the conveying device; and an antifouling device is coupled to the dispensing platform For providing an isolation paper between the substrate and the dispensing platform. The substrate is a lead frame type substrate. The dispensing device further includes a colloidal spray head, which is located above the conveying device, and is used to apply a fluid colloidal material to the substrate.

Description

Dispensing device

The invention relates to the technical field of semiconductor back-end packaging processes, and in particular to a dispensing device, which can avoid the problem of pollution caused by colloid remaining on a dispensing platform.

In the semiconductor back-end packaging process, after the bonding wire between the wafer and the substrate is completed, subsequent sealing treatment is required, and the wafer and the substrate are molded with a resin molding compound so that they are bonded to the substrate. The external environment is isolated to achieve the purpose of protecting the chip.

However, during the sealing process, mold wire molds often cause mold wire sweeps, abnormal open circuits, or short circuits, which reduces the yield. Therefore, a dispensing process is usually introduced between the welding line and the sealing process. The colloid is first placed on the welding line, and the subsequent sealing process is performed after the colloid is cured.

In the past, when the dispensing equipment was applied to a leadframe type substrate, the gel often remained on the dispensing platform and contaminated the next substrate. It can be seen that there is still a need for an improved dispensing equipment in the technical field to solve the above-mentioned shortcomings of the prior art.

The main purpose of the present invention is to provide an improved dispensing device, which can avoid the problem of pollution caused by colloid remaining on the dispensing platform.

According to an embodiment of the present invention, the dispensing device of the present invention includes a conveying device; at least one substrate is moved along a predetermined direction by the conveying device; a dispensing platform is located below the conveying device; and an antifouling Device coupled to the dispensing platform for providing an isolation paper between the substrate and the substrate As described in the dispensing platform. According to an embodiment of the present invention, the substrate is a lead frame type substrate. The dispensing device further includes a colloidal spray head, which is located above the conveying device, and is used to apply a fluid colloidal material to the substrate. For example, the release paper is a dust-free paper.

According to an embodiment of the present invention, the conveying device includes a parallel dual-track structure with a gap in between, the substrate is in contact with the parallel dual-track structure only on both side edges, and the middle portion of the substrate is suspended . The dispensing platform rises, supports the substrate through the gap, and lifts the substrate out of contact with the parallel dual-track structure, and fixes the substrate with a clip above the substrate to facilitate Positioning.

According to an embodiment of the present invention, the anti-fouling device includes a release paper storage and conveying unit coupled to one side of the dispensing platform, and the release paper is placed in the release paper storage and conveying unit and transmitted through The roller and the guide mechanism are transmitted to the upper surface of the dispensing platform. A transitional connection platform is provided between the release paper storage and conveying unit and the dispensing platform, so that the release paper can smoothly slide to the upper surface of the dispensing platform without paper jams. The antifouling device further includes a replacement unit for removing the release paper from the upper surface of the dispensing platform.

According to another embodiment of the present invention, the antifouling device includes a first roller, a sleeve of insulation paper is sleeved on one end, and a second roller is connected to one end thereof. The first roller and the second roller are operated at the same rotation speed and the same rotation direction, so that the release paper is rolled in a predetermined direction. When dispensing, the dispensing platform first supports the release paper between the first roller and the second roller, and then lifts the substrate. Since the upper surface of the dispensing platform is covered by the release paper, an antifouling effect can be achieved.

In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, the preferred embodiments are hereinafter described in detail with reference to the accompanying drawings. However, the following preferred embodiments and drawings are for reference and description only, and are not intended to limit the present invention.

1,1a‧‧‧dispensing device

10‧‧‧ Casting space

11‧‧‧Control computer

12‧‧‧ Lifting mechanism

100‧‧‧ Equipment body

101, 101a ~ 101c‧‧‧ substrate

102‧‧‧Feeding Station

104‧‧‧ track

105‧‧‧ scheduled direction

106‧‧‧ colloidal nozzle

107‧‧‧ fluid colloidal material

108‧‧‧Discharging station

110‧‧‧feed box

120‧‧‧ Dispensing Platform

120a‧‧‧upper surface

121‧‧‧Vacuum air hole

122‧‧‧Card Firmware

123‧‧‧Transitional connection platform

200‧‧‧Anti-fouling device

210‧‧‧Isolated paper storage and conveying unit

211‧‧‧Isolation paper

212‧‧‧roller

220‧‧‧ Replacement Unit

301‧‧‧ Wafer Mat

310a‧‧‧ surface

302‧‧‧pin

310‧‧‧Chip

312‧‧‧welding wire

400‧‧‧Anti-fouling device

410‧‧‧The first roller

411‧‧‧Isolation paper

420‧‧‧Second Roller

The drawings are provided to facilitate a further understanding of the present invention and constitute a part of this specification. The embodiments of the present invention described in the drawings and the description are helpful for explaining the principle and principle of the present invention. In the drawings: FIG. 1 is a schematic diagram of a dispensing device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a dispensing device according to another embodiment of the present invention.

FIG. 3 is a schematic side view of the substrate during the dispensing process.

In the following, the details will be described with reference to the drawings, and the contents of these drawings also form a part of the detailed description of the description, and are shown in a special case description manner in which this embodiment can be implemented. The following examples have been described in sufficient detail to enable those of ordinary skill in the art to implement them. Of course, other embodiments may be adopted, or any structural, logical, and electrical changes may be made without departing from the embodiments described in the text. Therefore, the following detailed description should not be considered as a limitation. On the contrary, the embodiments contained therein will be defined by the scope of the accompanying patent application.

The invention discloses an automatic dispensing device and system for a semiconductor back-end packaging process, which is particularly suitable for being applied to a lead frame type substrate, and can effectively prevent gel from remaining on the dispensing platform and contaminating the next substrate.

FIG. 1 is a schematic diagram of a dispensing device according to an embodiment of the present invention. As shown in FIG. 1, the dispensing device 1 of the present invention may include a device body 100 which defines a closed application space 10. According to an embodiment of the present invention, the dispensing process may be performed in the application space 10 of the device body 100, but is not limited thereto. According to an embodiment of the present invention, the dispensing process refers to a dispensing process between a bonding wire and a sealing process of a semiconductor back-end packaging process, but is not limited thereto.

According to an embodiment of the present invention, the dispensing device 1 may include a A feeding station 102, and a magazine 110 containing a plurality of parts to be processed or the substrate 101 is first loaded into the feeding station 102, and then the substrate 101 is transferred to a conveying device by a robot arm (not shown), For example, it moves on the track 104 and moves horizontally along a predetermined direction 105 on the track 104. After the dispensing process, it finally enters the discharge station 108 and is ready to enter the next processing step, such as curing or sealing.

According to an embodiment of the present invention, the substrate 101 may be a lead frame type substrate, but is not limited thereto. For example, the leadframe-type substrate 101 may include, but is not limited to, a die pad 301, a lead 302, and bonding wires connecting the pins 302 and the wafer 310 for carrying the wafer 310. 312. The wafer pad 301 may include a concave structure, but is not limited thereto. According to the embodiment of the present invention, the surface 301a of the wafer pad 301 may also be subjected to a surface roughening treatment, so that the subsequently applied colloid can be more closely bonded to the substrate 101.

In FIG. 1, for the sake of simplicity, only three leadframe substrates 101 a to 101 c are exemplified on the track 104, wherein the substrate 101 c has completed the dispensing process, the substrate 101 b is preparing to perform the dispensing process, and the substrate 101 a has not yet been performed. Dispensing. According to an embodiment of the present invention, the track 104 may be a parallel dual-track structure with a gap in the middle. Therefore, the substrates 101a to 101c are in contact with the track 104 only on both side edges, and the middle portions of the substrates 101a to 101c may be suspended.

When the substrate 101b to be dispensed reaches the predetermined position, the dispensing platform 120 located directly below the substrate 101b will be raised by the lifting mechanism 12 to support the substrate 101b through the gap in the middle of the track 104, and the substrate 101b can be lifted. Slightly lift up and release from contact with the track 104, and fix the substrate 101b with the fixing member 122 above the substrate 101b to facilitate mechanical and visual positioning.

After the substrate 101b is fixed, the colloidal spray head 106 located above the substrate 101b and the track 104 can apply a fluid colloidal material 107, such as resin or UV glue, to a predetermined position on the substrate 101b, for example, the wafer pad 301 The recessed structure can cover a part of the bonding wire 312. However, since the wafer pad 301 and the lead 302 may have a small hollow area, when the colloidal nozzle 106 sprays resin on the substrate 101b, it is likely to splash onto the upper surface 120a of the dispensing platform 120 below, and contaminate the next substrate. 101a.

In order to solve such a problem, the dispensing device 1 of the present invention further includes an anti-stain device 200 including an isolation paper storage and conveying unit 210 coupled to one side of the dispensing platform 120. A plurality of sheets of release paper 211 are stored in the release paper storage and conveying unit 210, and are conveyed to the point through the roller 212 and the guide mechanism in the release paper storage and conveying unit 210 at a time interval set by the control computer 11. The upper surface 120 a of the rubber platform 120. A transition linking platform 123 can be provided on one side of the isolation paper storage and conveying unit 210 and the dispensing platform 120, so that the isolation paper 211 can smoothly slide to the upper surface 120a of the dispensing platform 120 without paper jams.

According to an embodiment of the present invention, the separation paper 211 may be a dust-free paper at a front end or a front station for separating the substrates stacked together. Originally, these dust-free papers will be discarded after the substrate is taken out and placed in the receiving box 110, but in the present invention, these dust-free papers can be recycled and reused to achieve the effect of improving the process and reducing costs.

According to an embodiment of the present invention, the dispensing platform 120 may be provided with a plurality of vacuum air holes 121. After the release paper 211 is slid to the upper surface 120a of the dispensing platform 120, the vacuum paper can be evacuated through the vacuum air holes 121 to adsorb the release paper 211 on The upper surface 120a of the dispensing platform 120 is then raised. The dispensing platform 120 located directly below the substrate 101b is raised to support the substrate 101b through the gap in the middle of the track 104, and the substrate 101b is slightly lifted out of contact with the track 104. In addition, the base plate 101b is fixed with the fixing member 122 above the base plate 101b to achieve positioning.

After the substrate 101b is fixed, the colloidal spray head 106 located above the substrate 101b can apply a fluid colloid material 107, such as resin or UV glue, to a predetermined position on the substrate 101b, for example, the recessed structure of the wafer pad 301 Inside and can cover part of the bonding wire 312. Since the bottom of the substrate 101b is only in contact with the release paper 211, the splashed colloid will not contact the upper surface 120a of the dispensing platform 120 below, thus achieving the anti-fouling effect.

After the substrate 101b is finished with the dispensing process, the dispensing platform 120 is lowered, and the substrate 101b is again on the track. The channel 104 is in contact, and the release paper 211 located on the upper surface 120 a of the dispensing platform 120 at this time will also descend with the dispensing platform 120 because of the relationship of vacuum suction. After the vacuum is removed, the contaminated release paper 211 is removed from the upper surface 120 a of the dispensing platform 120 through a replacement unit 220. The removed release paper 211 can be placed in a recycling area. According to the embodiment of the present invention, the replacement unit 220 may be a throwing jaw device or a robot arm, but is not limited thereto. Then, the release paper storage and conveying unit 210 reloads a new release paper 211 to the upper surface 120a of the dispensing platform 120, and performs the dispensing process for the next substrate 101a.

Please refer to FIG. 2 and FIG. 3, wherein FIG. 2 is a schematic view of a dispensing device according to another embodiment of the present invention, in which the same regions, components or materials are still represented by the same symbols, and FIG. 3 A schematic side view of a substrate when dispensing is performed. As shown in FIG. 2, the dispensing device 1 a may also include a device body 100, which defines a closed application space 10. According to an embodiment of the present invention, the dispensing process may be performed in the application space 10 of the device body 100, but is not limited thereto. According to an embodiment of the present invention, the dispensing process refers to a dispensing process between a bonding wire and a sealing process of a semiconductor back-end packaging process, but is not limited thereto.

According to an embodiment of the present invention, the dispensing device 1a may include a feeding station 102 connected to the device body 100, and a feeding box 110 containing a plurality of parts or substrates 101 to be processed is first loaded into the feeding station 102, and then The robot 101 (not shown) transfers the substrate 101 to a conveying device, such as a track 104, and horizontally conveys and moves along a predetermined direction 105 on the track 104. After the dispensing process, it finally enters the discharge station 108. Ready for the next processing step, such as curing or sealing.

According to an embodiment of the present invention, the substrate 101 may be a lead frame type substrate, but is not limited thereto. For example, the leadframe-type substrate 101 may include, but is not limited to, a wafer pad 301, a pin 302, and a bonding wire 312 that connects the pin 302 and the wafer 310 to the wafer 310. The wafer pad 301 may include a concave structure, but is not limited thereto. According to an embodiment of the present invention, the surface 301a of the wafer pad 301 may also be subjected to a surface roughening treatment, so that the subsequently applied colloid can be more closely bonded to the substrate 101.

In FIG. 2, for the sake of simplicity, only three leadframe-type substrates 101 a to 101 c are exemplified on the track 104. The substrate 101 c has completed the dispensing process, the substrate 101 b is preparing to perform the dispensing process, and the substrate 101 a has not yet been processed. Dispensing. According to an embodiment of the present invention, the track 104 may be a parallel dual-track structure with a gap in the middle, so the substrates 101a to 101c are in contact with the track 104 only on the two side edges, and the middle portions of the substrates 101a to 101c are suspended.

According to an embodiment of the present invention, the dispensing device 1a further includes an antifouling device 400, including a first roller 410, a sleeve of paper 411 covered, and one end of which is connected to a second roller 420, so that the paper 411 is located on the substrate 101b and Dispensing platform 120. According to an embodiment of the present invention, the first roller 410 and the second roller 420 may be connected to a transmission motor (not shown). The first roller 410 and the second roller 420 are operated at the same rotation speed and the same rotation direction set by the control computer 11 (for example, both rotate clockwise or counterclockwise), so that the release paper 411 can be rolled in a predetermined direction.

As shown in FIGS. 2 and 3, when the substrate 101b to be subjected to the dispensing process reaches a predetermined position, the dispensing platform 120 located directly below the substrate 101b will be raised by the lifting mechanism 12 and passed through the middle of the track 104. The gap supports the substrate 101b, and the substrate 101b can be slightly lifted out of contact with the track 104, and the substrate 101b is fixed with the latch 122 above the substrate 101b to facilitate mechanical and visual positioning. At this time, the first roller 410 and the second roller 420 do not rotate temporarily, and the dispensing platform 120 first presses against the release paper 411 between the first roller 410 and the second roller 420, and then lifts the substrate 101b.

After the substrate 101b is fixed, the colloidal shower head 106 located above the substrate 101b can apply a fluid colloid material 107, such as resin or UV glue, to a predetermined position on the substrate 101b, for example, in the recessed structure of the wafer pad 301. And can cover part of the bonding wire 312. Since the bottom of the substrate 101b is only in contact with the release paper 211, the splashed colloid will not contact the upper surface 120a of the dispensing platform 120 below, thus achieving the anti-fouling effect.

After the substrate 101b finishes the dispensing process, the dispensing platform 120 descends, the substrate 101b comes into contact with the track 104 again, and the part of the contaminated release paper 411 passes through the first roller 410 and the second roller 420 to control The computer 11 is set to operate at the same rotation speed and rotation direction, remove from the upper surface 120a of the dispensing platform 120, and move a new release paper 411 to the upper surface 120a of the dispensing platform 120, and then perform the next substrate 101a. Dispensing.

It can be known from the above detailed description that the dispensing device of the present invention includes a conveying device; at least one substrate is moved along a predetermined direction by the conveying device; a dispensing platform is located below the conveying device; and an antifouling device Is coupled to the dispensing platform for providing an isolation paper between the substrate and the dispensing platform. According to an embodiment of the present invention, the substrate is a lead frame type substrate. The dispensing device further includes a colloidal spray head, which is located above the conveying device, and is used to apply a fluid colloidal material to the substrate. For example, the release paper is a dust-free paper.

According to an embodiment of the present invention, the conveying device includes a parallel dual-track structure with a gap in between, the substrate is in contact with the parallel dual-track structure only on both side edges, and the middle portion of the substrate is suspended . The dispensing platform rises, supports the substrate through the gap, and lifts the substrate out of contact with the parallel dual-track structure, and fixes the substrate with a clip above the substrate to facilitate Positioning.

According to an embodiment of the present invention, the anti-fouling device includes a release paper storage and conveying unit coupled to one side of the dispensing platform, and the release paper is placed in the release paper storage and conveying unit and transmitted through The roller and the guide mechanism are transmitted to the upper surface of the dispensing platform. A transitional connection platform is provided between the release paper storage and conveying unit and the dispensing platform, so that the release paper can smoothly slide to the upper surface of the dispensing platform without paper jams. The antifouling device further includes a replacement unit for removing the release paper from the upper surface of the dispensing platform.

According to another embodiment of the present invention, the antifouling device includes a first roller, a sleeve of insulation paper is sleeved on one end, and a second roller is connected to one end thereof. The first roller and the second roller are operated at the same rotation speed and the same rotation direction, so that the release paper is rolled in a predetermined direction. When dispensing, the dispensing platform first abuts the release paper between the first roller and the second roller, and then lifts up the Substrate. Since the upper surface of the dispensing platform is covered by the release paper, an antifouling effect can be achieved.

The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the scope of the present invention.

Claims (15)

A dispensing device includes: a conveying device; a colloidal spray head located above the conveying device; at least one substrate moved by the conveying device in a predetermined direction; a dispensing platform located below the conveying device And an antifouling device coupled to the dispensing platform for providing an isolation paper between the substrate and the dispensing platform. The dispensing device according to claim 1, wherein the substrate is a lead frame type substrate. The dispensing device according to claim 2, wherein the substrate of the lead frame type includes a wafer pad, a wafer, provided on the wafer pad, a pin, and a bonding wire connecting the pin and the wafer. The dispensing apparatus according to claim 3, wherein the wafer pad includes a concave structure. The dispensing apparatus according to claim 3, wherein the wafer pad has a roughened surface. The dispensing device according to claim 4, wherein the colloidal spray head applies a fluid colloidal material into the recessed structure and covers the welding line of the fluid colloidal material. The dispensing device according to claim 1, wherein the conveying device includes a parallel dual-track structure with a gap in between, and the substrate is in contact with the parallel dual-track structure only on two side edges, and the middle of the substrate The part is suspended. The dispensing device according to claim 7, wherein the dispensing platform is raised, supports the substrate via the gap, and lifts the substrate away from contact with the parallel dual-track structure to cooperate with the The substrate is fixed by a clip above the substrate to facilitate positioning. The dispensing device according to claim 1, wherein the antifouling device includes a release paper storage and conveying unit coupled to one side of the dispensing platform, and the release paper is placed in the release paper storage and The conveying unit is conveyed to the upper surface of the dispensing platform through a roller and a guide mechanism. The dispensing device according to claim 9, wherein a transition platform is provided between the release paper storage and conveying unit and the dispensing platform, so that the release paper can smoothly slide to the dispensing platform The top surface without paper jams. The dispensing device according to claim 9, wherein the anti-fouling device further comprises a replacement unit for removing the release paper from the upper surface of the dispensing platform. The dispensing device according to claim 1, wherein the release paper is a dust-free paper. The dispensing device according to claim 1, wherein the dispensing platform is provided with a plurality of vacuum air holes. The dispensing device according to claim 1, wherein the anti-fouling device comprises a first roller, a sleeve of insulation paper is sleeved on one end, and a second roller is connected to one end thereof. The dispensing device according to claim 14, wherein the first roller and the second roller system are operated at the same rotation speed and the same rotation direction, so that the release paper is rolled in a predetermined direction.