TWI672635B - User identification module card packaging structure and manufacturing method thereof - Google Patents

Abstract

Embodiments of the present invention disclose a package structure of a user identification module card and a manufacturing method thereof, which are provided in a user identification module card by a Bluetooth communication chip to achieve richer functions and applications, and communicated by Bluetooth communication. The electrical connection between the chip and the circuit substrate is a connection point uniformly arranged through the bottom of the Bluetooth communication chip and a special configuration relationship thereof, thereby saving the circuit board area required for the Bluetooth communication chip; further, in the user identification module The contact window on the card enables high-efficiency SIM card quality detection, allowing the user identification module card to meet the requirements of the miniaturized SIM card size, and more components can be set to facilitate multi-functional user identification. The module card achieves a richer user experience.

Description

User identification module card packaging structure and manufacturing method thereof

The invention relates to a package structure of a user identification module card and a manufacturing method thereof, and more particularly to a structure arrangement in a user identification module card and a manufacturing method thereof.

With the development of mobile communication devices, the thin and light device body and the large display screen have become the pursuit goals.

Based on the requirements of mobile communication device manufacturers for thin and light bodies, the components in the mobile communication device are constantly being miniaturized, and the components are continuously compacted to allow the mobile communication device to have more functions and even It is a large-capacity battery with better storage capacity and larger volume for longer battery life.

Among them, the Subscriber Identity Module (SIM) is constantly being reduced, from a standard SIM card of 15mm*25mm square to a Micro-SIM card of 12mm*15mm square, and then evolved to 8.8mm*12.3mm. The square Nano-SIM card is continuously reduced in size, and the card thickness has also evolved from a thickness of about 0.76 mm to a Nano-SIM card of about 0.67 mm.

In order to achieve a richer mobile communication experience, it is necessary to have more functional components built into this SIM card. However, how to use a Nano-SIM card with a thickness of 8.8mm*12.3mm and a thickness of only about 0.67mm? By incorporating the required components in a limited space and how to configure the adaptation relationship between the components, it is determined whether more components can be set in the size of the miniaturized SIM card.

One of the objects of the present invention is to place the required components in a user identification module card of limited size.

Another object of the present invention is to provide a versatile user identification module card that is limited in size.

Still another object of the present invention is to enable a multi-functional user identification module card to be efficiently quality tested.

To achieve the above and other objects, the present invention provides a package structure for a subscriber identity module card, including: a circuit substrate, a Bluetooth communication chip, and a package. The Bluetooth communication chip is disposed on the first side of the circuit substrate and forms a projection area on the circuit substrate. The Bluetooth communication chip and the circuit substrate are electrically connected to the Bluetooth communication chip and the circuit substrate. And a plurality of first electrical connection units, wherein the first electrical connection units are all located in the projection area. The package is used to cover the circuit substrate and the Bluetooth communication chip, and a plurality of contact windows are opened on a second side of the circuit substrate opposite to the first side, wherein the Bluetooth communication chip is located The thickness of each of the first electrical connection units between the circuit boards is between 0.07 and 0.10 mm.

In an embodiment of the invention, the thickness of the Bluetooth communication chip may range from 0.215 to 0.235 mm.

In an embodiment of the present invention, the method further includes: a near field communication antenna disposed on the first side of the circuit substrate. The near field communication antenna has a chip and an antenna loop spirally wound around the chip, the chip is a ferrite material, and the two ends of the antenna loop are respectively located at the bottom of the near field communication antenna, and the antenna loop The two end points are electrically connected to the circuit substrate through the corresponding second electrical connection unit for signal transmission, and the thickness of the near field communication antenna is between 0.33 and 0.43 mm.

In an embodiment of the present invention, the bottom of the near field communication antenna may further have at least one third electrical connection unit, and the at least one third electrical connection unit is not used for signal transmission.

In an embodiment of the present invention, the memory may be disposed on the first side of the circuit substrate and electrically connected to the Bluetooth communication chip by the circuit substrate for storing or modifying the user identification module card. The name of the Bluetooth broadcast when it is external.

In an embodiment of the invention, the first side of the circuit substrate may have a plurality of pads corresponding to the electrical contacts at the bottom of the Bluetooth communication chip, and the pads are evenly distributed in the projection area.

In an embodiment of the invention, the circuit substrate is a multi-layer substrate, and the first side of the circuit substrate is the uppermost surface of the multi-layer substrate, and the size of the user identification module card conforms to the Nano-SIM specification.

In an embodiment of the present invention, the contact windows may be opened on the package and adjacent to a lowermost layer of the multilayer substrate in the circuit substrate, the contact windows being used to expose a lowermost layer disposed on the multilayer substrate a plurality of first type terminals and a plurality of second type terminals on the surface, the first type of terminals being used by the mobile communication device, and the second type of terminals are used for testing the additional functional characteristics of the user identification module card .

In one embodiment of the invention, the Bluetooth communication chip is not connected to the Bluetooth antenna line outside the Bluetooth communication chip.

To achieve the above and other objects, the present invention further provides a package structure of a subscriber identity module card, the subscriber identity module card being sized to conform to a Nano-SIM specification, the package structure comprising: a circuit board, the aforementioned Bluetooth Communication chip, near field communication antenna and first safety element chip. The near field communication antenna is disposed on the first side of the circuit substrate, and is electrically connected to the circuit substrate by a plurality of second electrical connection units. The first security element chip is disposed on the first side of the circuit substrate, and is electrically connected to the circuit substrate by a plurality of first lead units.

In one embodiment of the present invention, the circuit substrate may be a multi-layer substrate, and the first side of the circuit substrate is the uppermost surface of the multi-layer substrate, and the package structure further includes: a Bluetooth antenna circuit disposed on the multi-layer substrate An intermediate layer, wherein the Bluetooth antenna line and the near field communication antenna partially overlap in a vertical direction of the circuit substrate, the Bluetooth antenna line and the near field communication antenna are disposed adjacent to an edge of the circuit substrate, The near field communication antenna is a ferrite antenna.

In an embodiment of the present invention, a second security element chip may be further disposed on the first security wafer, and the circuit board is electrically connected to the circuit board by using a plurality of second lead units. The plurality of electrical connection contacts of the first security wafer surface are not shielded.

In order to achieve the above and other objects, the present invention further provides a manufacturing method for manufacturing the user identification module card, wherein a plurality of first type components and a plurality of second type components are disposed on a circuit substrate conforming to a Nano-SIM specification, The manufacturing method comprises: (1) a surface adhesion step of adhering the first type of components to the circuit substrate by a surface adhesion process; and (2) a wafer setting step of the second type by a lead process and a packaging process The component is fixed on the circuit substrate; (3) a glue curing step of forming a package encapsulating the circuit substrate by filling and baking the plastic glue. The first type of components include: a Bluetooth communication chip, a Bluetooth oscillating device, a near field communication antenna, and at least one passive component. The second type of component includes: an incoming communication chip, a memory, and at least one security component chip.

In an embodiment of the present invention, in the surface bonding step, the circuit substrate and the first type of component may have a plurality of solders for electrically connecting, the surface bonding step is to enable the Bluetooth communication chip and the The thickness of each of the solders between the circuit boards is between 0.07 and 0.10 mm.

In an embodiment of the present invention, a test step is further included, and the test step performs additional functional characteristic testing on the user identification module card by using a plurality of contact windows opened at the bottom of the package.

In this way, the Bluetooth communication chip is set in the user identification module card to achieve more functions and applications (for example, through the Bluetooth communication pipeline, forming an access mechanism and an authentication mechanism on the online payment process), and borrowing The special configuration relationship between the Bluetooth communication chip and the circuit substrate can save the circuit board area required for the Bluetooth communication chip, and also helps to conform to the thickness specification of the Nano-SIM card; further, in the user identification module card The contact window can also achieve high-efficiency SIM card quality detection, allowing the user identification module card to meet the requirements of the miniaturized SIM card size and more components can be set to facilitate multi-functional user identification. The module card achieves a richer user experience.

In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.

As used herein, the terms "include, include, have" or any other similar terms are not limited to the elements listed herein, but may include, but not explicitly listed, but Other elements or steps that are typically inherent in a wafer, component, structure, device, or method.

As used herein, the term "electrical connection, electrical connection" is used to describe the connection between the described elements, wafers, devices, and other described functional elements or the like, which may represent a direct connection between the two or Indirect connection. Other components, wafers, devices, and the like for describing functions or the like may be included between the two, and the functions or actions required to be achieved in the connection relationship between the two may be simultaneously achieved. In addition, the size and size of the blocks in the various figures are merely illustrative and are not intended to be limiting unless otherwise indicated herein.

In this document, the words "first" or "second" and the like are used to distinguish or refer to the same or similar elements, elements or structures, and do not necessarily imply such units or elements. Or the order of the structures in space. It will be appreciated that in certain instances or configurations, ordinal words are used interchangeably without affecting the practice of the invention.

The embodiment of the present invention is used to exemplify the configuration of related components in the user identification module card. With this configuration, more space can be saved in the narrowly-defined user identification module card for accommodating More functional components, chips, etc., so that the user identification module card has more functions, so that users can experience a richer mobile communication experience.

The configurations exemplified in the embodiments of the present invention are applicable to user identification module cards of various sizes, such as a standard SIM card, a Micro-SIM card, a Nano-SIM card, or even a SIM card having a smaller size. . Embodiments of the present invention take the Nano-SIM card as an example, and the specifications of the Nano-SIM card (8.8 mm * 12.3 mm, thickness about 0.76 mm) are taken as essential elements, so that the configurations exemplified in the embodiments of the present invention are met. The specification of the Nano-SIM card is placed in the Nano-SIM card.

1 and FIG. 2, FIG. 1 is a partial cross-sectional view showing a package structure in a subscriber identity module card according to an embodiment of the present invention, and FIG. 2 is a portion of a circuit board in a subscriber identity module card in the embodiment of FIG. 1. Top view. The package structure includes a circuit substrate 100, a Bluetooth communication chip 200, and a package 300.

The circuit substrate 100 is used to carry various electronic components in the user identification module card, such as active components, passive components, conductive lines, etc. The circuit substrate 100 preferably uses a multi-layer substrate, and is designed by multi-layer lamination. Make full use of the area of each layer of the substrate, and then arrange specific components or lines in a specific layer to achieve full use of space or other effects, which will be detailed later.

As shown in FIG. 1 , the package 300 covers the circuit substrate 100 and the Bluetooth communication chip 200 . The package 300 can be a plastic glue. For example, it can be: polyvinyl chloride (PVC) or acrylonitrile (ABS). Or a combination of plastics, or other materials suitable for configuring a SIM card. After the package 300 is cured and cut, each sheet-shaped user identification module card can be completed. Wherein, the package body 300 can be opened with a plurality of contact windows 310 at a portion adjacent to the second side 120 of the circuit substrate 100. The contact windows 310 expose two types of contact terminals on the second side 120 of the circuit substrate 100: The first type of terminal 130 and the second type of terminal 140.

The first type of terminal 130 can be defined as a contact for the mobile communication device after the user identification module card is installed to the mobile communication device. For example, when the user identification module card is installed in the card slot of the mobile communication device, One type of terminal 130 produces a contact electrical connection with the mobile communication device. These first type terminals 130 may be, for example, a VCC terminal, an RST terminal, a CLK terminal, an I/O terminal, a GND terminal, or the like.

The second type of terminal 140 can be defined to be used when the user identification module card is tested for additional functional characteristics, such as a Bluetooth communication function, a near field communication function, etc., in other words, the second type of terminal 140 is not for a mobile communication device. For contact connection, when the subscriber identity module card is installed in the card slot of the mobile communication device, the second type of terminal 140 does not make a contact electrical connection with the mobile communication device. The second type of terminal 140 is directly exposed through the contact window 310 to the user identification module card, so that the function detection of the user identification module card becomes efficient, and it is easy to determine the defective component, thereby facilitating the subsequent quality management judgment. And disposal.

As shown in FIG. 1, the Bluetooth communication chip 200 is disposed on the first side 110 of the circuit substrate 100. Further, the Bluetooth communication chip 200 is fixed on the circuit substrate 100 by the plurality of first electrical connection units 151. At the same time, the Bluetooth communication chip 200 can form a projection area 105 on the first side 110 of the circuit substrate 100 (see FIG. 2). In the example shown in FIG. 2, the size of the range presented on the circuit substrate 100 after the blue-ray communication chip 200 is disposed is shown by a dashed box. The first electrical connection units 151 are all located in the projection area 105. The connection unit 151 can be, for example, tin or other conductive material.

In the projection area 105 on the first side 110 of the circuit substrate 100, a plurality of pads 104 corresponding to the electrical contacts at the bottom of the Bluetooth communication chip 200 may be disposed, and the blue is made by, for example, Surface Mount Technology (SMT). The bud communication chip 200 is adhered to the first side 110 of the circuit substrate 100, and electrically connected to the pads 104, thereby also allowing the Bluetooth communication chip 200 to be fixed on the circuit substrate 100.

The Bluetooth communication chip 200 can make the electrical contacts of the Bluetooth communication chip 200 at the bottom of the Bluetooth communication chip 200 by redistributing layers or other means, and the circuit substrate 100 can be made by an evenly distributed configuration. The pads 104 above the projection area 105 can be evenly distributed as shown in FIG. 2, rather than being distributed only around or on one side, so that the area of the substrate around the outside of the projection area 105 can be eliminated. The Bluetooth communication wafer 200 has a thickness of 0.215 to 0.235 mm, preferably maintained at 0.225 mm.

In addition, based on the thin thickness requirement, the electrical contacts under the Bluetooth communication chip 200 having a thickness of 0.215 to 0.235 mm, in order to avoid the occurrence of air soldering or other electrical defects, must control the first electrical connection unit. The thickness formed by 151 is too thin to cause void welding or other electrical defects. It is too thick and difficult to reach the requirement of thin thickness or cause electrical conduction to be incorrect (for example, occurs between adjacent contacts). Appropriate electrical connection). Therefore, the thickness of the first electrical connection unit 151 under the Bluetooth communication chip 200 is exemplified in the embodiment of the present invention, and is controlled within 0.11 mm, preferably between 0.07 and 0.10 mm, so that after the package is completed. The subscriber identity module card can conform to the specifications of the Nano-SIM card and maintain a good electrical connection.

Regarding the setting of the Bluetooth communication chip 200, for example, the bottom of the Bluetooth communication chip 200 can be provided with a solder ball on each of the electrical contacts, so that only a small portion of the solder paste needs to be coated on the bonding pad 104. After the Bluetooth communication chip 200 is placed on the circuit substrate 100 through the punching process and passed through the high temperature tin furnace, the thickness of the first electrical connection unit 151 can be controlled to be within 0.11 mm.

Please refer to FIG. 3. FIG. 3 is a top plan view of a circuit board in a subscriber identity module card according to an embodiment of the present invention. The Bluetooth communication chip 200 can be further coupled to the memory 210. The memory 210 is disposed on the first side 110 of the circuit substrate 100 (see FIG. 1 at the same time), and is electrically connected to the Bluetooth communication through the conductive line of the circuit substrate 100. Wafer 200. The memory 210 is used to store the name of the user identification module card when the Bluetooth broadcast is externally broadcasted, and then can be modified to correspond to the card issuer of the user identification module card, and then when the user identification module card is mass-produced, It is not limited to the Bluetooth broadcast name that is bound within the Bluetooth communication chip 200. That is, although the Bluetooth communication chip 200 is usually provided with a storage unit, it is not used in this embodiment of the present invention, but a method of plugging a memory 210 to achieve a multi-functional effect. In the embodiment of the present invention, an additional memory 210 can be provided, which can also be attributed to the further benefits of saving the circuit board area required for the Bluetooth communication chip.

As shown in FIG. 3, the Bluetooth communication chip 200 must also be equipped with an oscillator 220 to further provide time information required for Bluetooth communication work. In one embodiment, the Bluetooth communication chip 200 can be operated with only a 16 MHz oscillator.

Please refer to FIG. 3 and FIG. 4. FIG. 4 is a cross-sectional view of the near field communication antenna portion of the package structure in the user identification module card in the embodiment of FIG. As shown in FIG. 3, the near field communication chip 400 and the near field communication antenna 410 can be further disposed on the circuit substrate 100. The near field communication antenna 410 is disposed on the first side 110 of the circuit substrate 100, and the near field communication antenna 410 is electrically connected to the circuit substrate 100 by a plurality of second electrical connection units 152.

The near field communication antenna 410 may have a chip 411 and an antenna loop 412 spirally wound around the chip 411. The chip 411 is a ferrite material, and the two ends of the antenna loop 412 are respectively located at the bottom of the near field communication antenna 410, and the two ends are respectively transmitted through the corresponding second electrical connection unit 152 (as shown in FIG. The two electrical connection unit 152) is electrically connected to the circuit substrate 100 for signal transmission. In addition, the near field communication antenna 410 has a thickness of 0.33 to 0.43 mm. Further, the bottom of the near field communication antenna 410 may further have at least one third electrical connection unit 153. The third electrical connection unit 153 is not used for signal transmission, but achieves stabilization of the near field communication antenna 410 on the circuit substrate 100. The above action and the phenomenon of preventing warpage of the near field communication antenna 410, in addition, the configuration of the near field communication antenna 410 can be completed under the same process (for example, SMT process).

Please refer to FIG. 5. FIG. 5 is a partial cross-sectional view showing a circuit board according to an embodiment of the present invention. The circuit substrate 100 illustrated in FIG. 5 is a multilayer substrate, the first side 110 of the circuit substrate 100 is the uppermost surface of the multilayer substrate, and the second side 120 is the lowermost surface of the multilayer substrate. The multi-layer substrate can be divided into an upper layer 101, a middle layer 102, and a lower layer 103 by way of example. In the example of FIG. 5, the two layers of the substrate are combined into four surface layers, including: the first side 110, the opposite of the first side Side 111, second side 120, opposite side 121 of the second side. Thereby, part of the conductive line can be arranged in each layer, for example, the grounding wire or the power wire is disposed on the surface or the inner layer of the multilayer substrate, the conductive hole is disposed in the grounding wire or the power wire, and is electrically isolated from the grounding wire or the power wire, respectively The conductive holes respectively conduct the different layers of the multi-layer circuit board. Under such a configuration, the user identification module card with limited upper area can be configured with more functional components.

Please refer to FIG. 6. FIG. 6 is a configuration diagram of a near field communication antenna 410 and a Bluetooth antenna line 230 according to an embodiment of the present invention. The Bluetooth antenna line 230 is indicated by a broken line, meaning that the Bluetooth antenna line 230 is not disposed on the first side 110 of the circuit substrate 100, but is disposed on the intermediate layer of the multilayer substrate by forming other metal lines. The Bluetooth antenna line 230 is also formed, and in addition to saving the occupied area on the first side 110 of the circuit substrate 100, the process steps can be saved. In addition, the near field communication antenna 410 may be overlapped with the Bluetooth antenna line 230 in the vertical direction (or the normal direction) of the circuit substrate 100 under the cladding of the ferrite material, thereby increasing the circuit substrate 100. The degree of flexibility of the configured line.

However, in other embodiments of the present invention, the Bluetooth antenna circuit 230 may not be connected or disconnected, and the Bluetooth communication chip 200 may only communicate with the Bluetooth module in the installed mobile communication device.

As shown in FIG. 3, the first security element wafer 510 is disposed on the first side 110 of the circuit substrate 100. The first security element wafer 510 is electrically connected to the circuit substrate 100 by the first lead unit 161, and is further disposed by A first type of terminal 130 (eg, a VCC terminal, an RST terminal, a CLK terminal, an I/O terminal, and a GND terminal) on the second side 120 of the circuit substrate 100 is coupled to a baseband chip of the installed mobile communication device, and further Forms an ISO7816 channel connection.

Please refer to FIG. 7. FIG. 7 is a top plan view of a circuit board in a subscriber identity module card according to another embodiment of the present invention. The difference from FIG. 3 is that in the present embodiment, the security element wafer is divided into a second security element wafer 521 and a third security element wafer 522, such as a payment security element and a telecommunications security element. The second security element wafer 521 and the third security element wafer 522 are misaligned stacks to allow the underlying security wafer to expose electrical contacts on its surface for electrical connection of the lead elements. In addition, the blanks in the components of FIGS. 3 and 7 that are not labeled are merely schematic representations of other components, and do not mean that there are no components at all.

The second security element wafer 521 is electrically connected to the circuit substrate 100 by the second lead unit 162 , and the third security element wafer 522 is electrically connected to the circuit substrate 100 by the third lead unit 163 . For example, the payment security component is individually coupled to the Bluetooth communication chip and the near field communication chip by different interfaces; the telecommunication security component is coupled to the baseband chip of the installed mobile communication device to form an ISO7816 channel connection.

Please refer to FIG. 8. FIG. 8 is a diagram of a method for manufacturing a subscriber identity module card according to an embodiment of the present invention. This method is used to place a plurality of first type elements and a plurality of second type elements on a circuit board conforming to the Nano-SIM standard. The method includes the following steps: Step S1, providing the foregoing multilayer circuit substrate; Step S2, surface adhesion step; Step S3, wafer setting step; Step S4, glue curing step; and Step S5, which is required to be performed.

In step S2, the first type of component is adhered to the circuit substrate by a surface adhesion process. The first type of components include: a Bluetooth communication chip, a Bluetooth oscillating device, a near field communication antenna, and at least one passive component.

In step S3, the second type of component is fixed on the circuit substrate by a lead process and a packaging process. The second type of components include: an incoming communication chip, a memory, and at least one security element chip.

In step S4, a package body of the package circuit substrate is formed by filling and baking of the plastic glue material, and the package body exposes the first type terminal 130 and the second type terminal 140 at the bottom, and subsequently cuts. Form a piece of user identification module card.

As shown in FIG. 3 and FIG. 7, the area A is the surface adhesion process area, and the area B is the lead process and the package process area. The area ranged in FIG. 3 and FIG. 7 is only an example, mainly indicating that the two types of processes are Features performed on the same substrate do not limit the range of regions in which each process is only framed in Figures 3 and 7. In the embodiment of the present invention, the arrangement of the first type component and the second type component is disclosed, wherein the Bluetooth communication chip belongs to the first type component, and the surface adhesion process is adopted instead of the lead process and the packaging process, thereby saving blue. The area of the circuit board that the bud communication chip needs to occupy.

Please refer to FIG. 9. FIG. 9 is a schematic diagram of a bottom surface of a user identification module card according to an embodiment of the present invention. As shown in FIG. 9, the bottom surface of the subscriber identity module card is divided into a first type of terminal 130 (for mobile communication device contact connection) and a second type of terminal 140 (for functional testing), and both are directly exposed electrical contacts. In particular, the second type of terminal 140, the user identification module card under multi-functional integration, these second type of terminals 140 contribute to the convenience of various tests for additional functions.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

100‧‧‧ circuit board

101‧‧‧Upper

102‧‧‧ Middle

103‧‧‧Under

104‧‧‧Material pads for Bluetooth communication chips

105‧‧‧Projection area

110‧‧‧ first side of the circuit board

111‧‧‧The opposite side of the first side of the circuit board

120‧‧‧ second side of the circuit board

121‧‧‧The opposite side of the second side of the circuit board

130‧‧‧First type terminals (for contact connection of mobile communication devices)

140‧‧‧Second type terminals (for functional testing)

151‧‧‧First electrical connection unit

152‧‧‧Second electrical connection unit

153‧‧‧ Third electrical connection unit

161‧‧‧First lead unit

162‧‧‧Second lead unit

163‧‧‧third lead unit

200‧‧‧Bluetooth Communication Chip

210‧‧‧ memory

220‧‧‧Oscillator

230‧‧‧Blue Antenna Circuit

300‧‧‧Package

310‧‧‧Contact window

400‧‧‧ Near Field Communication Chip

410‧‧‧ Near Field Communication Antenna

411‧‧‧chip

412‧‧‧Antenna loop

510‧‧‧First Secure Element Wafer

521‧‧‧Second security component chip

522‧‧‧ Third Security Component Wafer

A‧‧‧ surface adhesion process area

B‧‧‧ lead process and package process area

1 is a partial cross-sectional view showing a package structure in a subscriber identity module card in an embodiment of the present invention. Fig. 2 is a partial plan view showing a circuit board in a subscriber identity module card in the embodiment of Fig. 1. Fig. 3 is a plan view showing a circuit board in a subscriber identity module card according to an embodiment of the present invention. 4 is a cross-sectional view showing a near field communication antenna portion of a package structure in a subscriber identity module card in the embodiment of FIG. 3. Fig. 5 is a partial cross-sectional view showing a circuit board in an embodiment of the present invention. Fig. 6 is a configuration diagram of a near field communication antenna and a Bluetooth antenna line in an embodiment of the present invention. Fig. 7 is a plan view showing a circuit board in a subscriber identity module card in another embodiment of the present invention. Fig. 8 is a diagram showing a method of manufacturing a subscriber identity module card in accordance with an embodiment of the present invention. 9 is a schematic bottom view of a user identification module card in an embodiment of the present invention.

Claims (15)

A package structure for a subscriber identity module card, comprising: a circuit substrate; a Bluetooth communication chip disposed on a first side of the circuit substrate and forming a projection area on the circuit substrate, the Bluetooth communication chip and the a plurality of first electrical connection units electrically connected to the Bluetooth communication chip and the circuit substrate, wherein the first electrical connection units are located in the projection area; and a package covering the circuit And a plurality of contact windows on the second side of the circuit substrate opposite to the first side, wherein the first electricity is located between the Bluetooth communication chip and the circuit substrate The thickness of the connecting unit is between 0.07 and 0.10 mm. The package structure of claim 1, wherein the thickness of the Bluetooth communication chip is between 0.215 and 0.235 mm. The package structure of claim 1, further comprising: a near field communication antenna disposed on the first side of the circuit substrate, the near field communication antenna having: a chip and a spiral around the chip for one day a line circuit, the chip is a ferrite material, and the two ends of the antenna circuit are respectively located at the bottom of the near field communication antenna, and the two ends of the antenna circuit are electrically connected to the corresponding second electrical connection unit respectively. The circuit substrate is used for signal transmission, and the thickness of the near field communication antenna is between 0.33 and 0.43 mm. The package structure of claim 3, wherein the bottom of the near field communication antenna further has at least one third electrical connection unit, and the at least one third electrical connection unit is not used for signal transmission. The package structure of claim 1, further comprising: a memory disposed on the first side of the circuit substrate and electrically connected to the Bluetooth communication chip by the circuit substrate for storing or modifying the user identification mode The name of the group card when it is broadcasted to the outside. The package structure of claim 1, wherein the first side of the circuit substrate has a plurality of pads corresponding to the electrical contacts at the bottom of the Bluetooth communication chip, and the pads are evenly distributed in the projection area. . The package structure according to any one of claims 1 to 6, wherein the circuit substrate is a multi-layer substrate, the first side of the circuit substrate is the uppermost surface of the multi-layer substrate, and the user identification module card is The size is in accordance with the Nano-SIM specification. The package structure of claim 7, wherein the contact windows are formed on the package and adjacent to a lowermost layer of the multilayer substrate in the circuit substrate, the contact windows being used to expose the most disposed on the multilayer substrate a plurality of first type terminals and a plurality of second type terminals on the surface of the lower layer, the first type of terminals being used for a mobile communication device, and the second type of terminals are for testing the additional functional characteristics of the user identification module card use. The package structure of claim 7, wherein the Bluetooth communication chip is not connected to a Bluetooth antenna line outside the Bluetooth communication chip. A package structure of a user identification module card, the size of the user identification module card conforming to the Nano-SIM specification, the package structure comprising: a circuit substrate; a Bluetooth communication chip, the first set on the circuit substrate Forming a projection area on the side of the circuit board, and the first electrical connection unit electrically connecting the Bluetooth communication chip and the circuit board between the Bluetooth communication chip and the circuit substrate, the first electrical connection The unit is located in the projection area; a near field communication antenna is disposed on the first side of the circuit substrate, electrically connected to the circuit substrate by a plurality of second electrical connection units; and a first security element chip The first side of the circuit substrate is electrically connected to the circuit substrate by a plurality of first lead units. The package structure of claim 10, wherein the circuit substrate is a multi-layer substrate, the first side of the circuit substrate is the uppermost surface of the multi-layer substrate, and the package structure further comprises: a Bluetooth antenna circuit An intermediate layer of the multi-layer substrate is disposed, and the Bluetooth antenna line and the near field communication antenna partially overlap in a vertical direction of the circuit substrate, and the Bluetooth antenna line and the near field communication antenna are disposed adjacent to the circuit. At the edge of the substrate, the near field communication antenna is a ferrite antenna. The package structure of claim 10, further comprising a second security element chip stacked on the first security chip, electrically connected to the circuit substrate by a plurality of second lead units, the second security The component wafer does not shield the plurality of electrical connection contacts of the first security wafer surface. A method for manufacturing a user identification module card according to any one of claims 1 to 12, wherein the plurality of first type components and the plurality of second type components are disposed on a circuit substrate conforming to the Nano-SIM specification. The manufacturing method comprises: a surface adhesion step of adhering the first type of components to the circuit substrate by a surface adhesion process; and a wafer setting step of the second type of components by a lead process and a packaging process Fixed on the circuit substrate; and a glue curing step is to form a package encapsulating the circuit substrate by filling and baking the plastic glue, wherein the first type component comprises: a Bluetooth communication chip, a Bluetooth oscillating device, a near field communication antenna, and at least one passive component; wherein the second component comprises: an incoming communication chip, a memory, and at least one security component chip. The manufacturing method of claim 13, wherein in the surface bonding step, the circuit substrate and the first type of component have a plurality of solders for electrically connecting, and the surface bonding step is to cause the Bluetooth communication chip to The thickness of each of the solders between the circuit boards is between 0.07 and 0.10 mm. The manufacturing method of claim 13, further comprising a testing step of performing an additional functional characteristic test on the user identification module card by using a plurality of contact windows opened at the bottom of the package.