CN110942133A - Packaging structure of user identification module card and manufacturing method thereof - Google Patents
Packaging structure of user identification module card and manufacturing method thereof Download PDFInfo
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- CN110942133A CN110942133A CN201811242310.9A CN201811242310A CN110942133A CN 110942133 A CN110942133 A CN 110942133A CN 201811242310 A CN201811242310 A CN 201811242310A CN 110942133 A CN110942133 A CN 110942133A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
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- 238000004891 communication Methods 0.000 claims abstract description 102
- 238000000034 method Methods 0.000 claims description 33
- 238000010295 mobile communication Methods 0.000 claims description 20
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- 238000012360 testing method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 229910000859 α-Fe Inorganic materials 0.000 claims description 6
- 238000012858 packaging process Methods 0.000 claims description 4
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- Microelectronics & Electronic Packaging (AREA)
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- Credit Cards Or The Like (AREA)
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Abstract
The embodiment of the invention discloses a packaging structure of a subscriber identity module card and a manufacturing method thereof, wherein a Bluetooth communication chip is arranged in the subscriber identity module card to achieve richer functions and applications, and the circuit substrate area occupied by the Bluetooth communication chip is saved by the electric connection between the Bluetooth communication chip and a circuit substrate through connecting points uniformly arranged at the bottom of the Bluetooth communication chip and special configuration relations of the connecting points; furthermore, the SIM card quality detection with high efficiency is realized by arranging the contact window on the SIM card, so that the SIM card can meet the size requirement of a miniaturized SIM card and can be provided with more elements, and the multifunctional SIM card is favorable for achieving richer user experience.
Description
Technical Field
The present invention relates to a package structure of a sim card and a method for manufacturing the same, and more particularly, to a structure arrangement in a sim card and a method for manufacturing the same.
Background
With the development of mobile communication devices, a thin device body and a large display screen are the pursued targets.
Based on the requirement of the mobile communication device manufacturer for a light and thin body, various elements in the mobile communication device are continuously miniaturized, and the various elements are continuously compacted, so that the mobile communication device has more functions, and even has a large-capacity battery with better power storage capacity and larger occupied volume so as to achieve longer power continuation time.
Among them, Subscriber Identity Module (SIM) cards are constantly being required to be reduced, proceeding from a standard SIM card 15mm by 25mm square to a Micro-SIM card 12mm by 15mm square, and then to a Nano-SIM card 8.8mm by 12.3mm square, the size of which is constantly being reduced, and the thickness of which is also proceeding from a thickness of about 0.76mm to a Nano-SIM card of about 0.67 mm.
To achieve a richer mobile communication experience, it is necessary to embed more functional components in the SIM card, however, in the case of a Nano-SIM card with 8.8mm × 12.3mm and a thickness of only about 0.67mm, how to embed the required components in a limited space and how to configure the fitting relationship between the components determines whether more components can be placed in the miniaturized SIM card size.
Disclosure of Invention
One object of the present invention is to incorporate the required components within a limited size subscriber identity module card.
It is another object of the present invention to provide a sim card that is limited in size yet versatile.
It is still another object of the present invention to enable a subscriber identity module card having multiple functions to be efficiently quality tested.
To achieve the above and other objects, the present invention provides a package structure for a sim card, comprising: circuit substrate, bluetooth communication chip, and packaging body. The Bluetooth communication chip is arranged on the first side of the circuit substrate and forms a projection area on the circuit substrate, the Bluetooth communication chip is electrically connected with the circuit substrate, and the Bluetooth communication chip is electrically connected with a plurality of first electric connection units of the circuit substrate, and the first electric connection units are all located in the projection area. The package body is used for coating the circuit substrate and the Bluetooth communication chip, and a second side of the circuit substrate, which is opposite to the first side, is provided with a plurality of contact windows, wherein the thickness of each first electric connection unit positioned between the Bluetooth communication chip and the circuit substrate is 0.07-0.10 mm.
In an embodiment of the present invention, the thickness of the bluetooth communication chip may be between 0.215 mm and 0.235 mm.
In an embodiment of the present invention, the method further includes: and the near field communication antenna is arranged on the first side of the circuit substrate. The near field communication antenna has: the chip and the antenna loop spirally surround the chip, the chip is made of ferrite materials, two end points of the antenna loop are respectively located at the bottom of the near field communication antenna, the two end points of the antenna loop are respectively and electrically connected with the circuit substrate through corresponding second electric connection units for signal conduction, and the thickness of the near field communication antenna is 0.33-0.43 mm.
In an embodiment of the present invention, the bottom of the nfc antenna may further include at least one third electrical connection unit, and the at least one third electrical connection unit is not used for signal transmission.
In an embodiment of the present invention, the method further includes: the memory is arranged on the first side of the circuit substrate and is electrically connected with the Bluetooth communication chip by the circuit substrate, and the memory is used for storing or modifying the name of the SIM card when the SIM card externally carries out Bluetooth broadcasting.
In an embodiment of the present invention, the first side of the circuit substrate may have a plurality of pads corresponding to the electrical contacts at the bottom of the bluetooth communication chip, and the plurality of pads are uniformly distributed in the projection area.
In an embodiment of the invention, the circuit substrate is a multi-layer substrate, the first side of the circuit substrate is a top surface of the multi-layer substrate, and the size of the SIM card conforms to the Nano-SIM specification.
In an embodiment of the invention, the plurality of contact windows may be opened on the package body and adjacent to a lowest layer of the multi-layer substrate in the circuit substrate, the plurality of contact windows are used for exposing a plurality of first type terminals and a plurality of second type terminals arranged on a surface of the lowest layer of the multi-layer substrate, the plurality of first type terminals are used for a mobile communication device, and the plurality of second type terminals are used for an additional function characteristic test of the subscriber identity module card.
In an embodiment of the present invention, the bluetooth communication chip is not connected to a bluetooth antenna circuit outside the bluetooth communication chip.
To achieve the above and other objects, the present invention further provides a package structure of a SIM card, the size of the SIM card conforming to the Nano-SIM specification, the package structure comprising: the circuit substrate, the bluetooth communication chip, near field communication antenna and first secure element chip. The near field communication antenna is arranged on the first side of the circuit substrate and is electrically connected with the circuit substrate through a plurality of second electric connection units. The first safety element chip is arranged on the first side of the circuit substrate and is electrically connected with the circuit substrate through a plurality of first lead units.
In an embodiment of the present invention, the circuit substrate may be a multi-layer substrate, the first side of the circuit substrate is a top surface of the multi-layer substrate, and the package structure further includes: the Bluetooth antenna circuit is arranged in the middle layer of the multilayer substrate, the Bluetooth antenna circuit and the near field communication antenna are partially overlapped in the vertical direction of the circuit substrate, the Bluetooth antenna circuit and the near field communication antenna are arranged close to the edge of the circuit substrate, and the near field communication antenna is a ferrite antenna.
In an embodiment of the invention, the electronic device further includes a second secure element chip stacked on the first secure element chip in a staggered manner, and electrically connected to the circuit substrate through a plurality of second lead units, wherein the second secure element chip does not shield the plurality of electrical connection contacts on the surface of the first secure element chip.
To achieve the above and other objects, the present invention further provides a method for manufacturing the SIM card, in which a plurality of first type components and a plurality of second type components are disposed on a circuit substrate conforming to a Nano-SIM specification, the method comprising: (1) a surface mounting step of mounting the plurality of first type devices on the circuit substrate by a surface mounting process; (2) a chip setting step of fixing the plurality of second-type components on the circuit substrate by a lead process and a packaging process; (3) and a gluing and curing step, wherein a packaging body for packaging the circuit substrate is formed by filling and baking the plastic material. Wherein the first type of element comprises: a Bluetooth communication chip, a Bluetooth oscillator, a near field communication antenna, and at least one passive component. The second type of element includes: the device comprises a near field communication chip, a memory and at least one secure element chip.
In an embodiment of the invention, in the surface mounting step, a plurality of solders for electrical connection may be provided between the circuit substrate and the first type element, and the thickness of each solder between the bluetooth communication chip and the circuit substrate is in a range of 0.07-0.10 mm in the surface mounting step.
In an embodiment of the invention, the method further includes a testing step, wherein the testing step tests additional functional characteristics of the sim card through a plurality of contact windows formed in the bottom of the package.
Therefore, the Bluetooth communication chip is arranged in the SIM card, so that more abundant functions and applications can be achieved (for example, an access mechanism and a verification mechanism are formed on an online payment process by virtue of a Bluetooth communication pipeline), and by virtue of a special configuration relation between the Bluetooth communication chip and a circuit substrate, the circuit substrate area occupied by the Bluetooth communication chip can be saved, and the Nano-SIM card thickness specification can be favorably met; furthermore, the SIM card quality detection with high efficiency can be realized by arranging the contact window on the SIM card, so that the SIM card can meet the size requirement of a miniaturized SIM card and can be provided with more elements, and the multifunctional SIM card is favorable for achieving richer user experience.
Drawings
FIG. 1 is a partial cross-sectional view of a package structure within a subscriber identity module card in accordance with one embodiment of the present invention;
FIG. 2 is a partial top view of a circuit substrate within the SIM card of the embodiment of FIG. 1;
FIG. 3 is a top view of a circuit substrate within a SIM card in accordance with an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a near field communication antenna portion of a package structure within the SIM card of the embodiment of FIG. 3;
FIG. 5 is a schematic partial cross-sectional view of a circuit substrate according to an embodiment of the invention;
FIG. 6 is a diagram illustrating the configuration of the NFC antenna and the Bluetooth antenna according to an embodiment of the present invention;
FIG. 7 is a top view of a circuit substrate within a SIM card in accordance with another embodiment of the present invention;
FIG. 8 is a method of manufacturing a SIM card in accordance with an embodiment of the invention;
FIG. 9 is a bottom view of a SIM card according to an embodiment of the invention.
Detailed Description
For a fuller understanding of the objects, features and advantages of the present invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings, in which:
as used herein, the terms "comprises," "comprising," "includes," "including," "has," "having" or any other similar language, are intended to cover a non-exclusive inclusion, such that a term includes a non-exclusive inclusion, but does not include other elements or steps that are not expressly listed or inherent to a module card, chip, component, structure, device or method.
In the present disclosure, the terms "electrical connection" and "electrical connection" are used to describe the connection relationship between the described elements, chips, devices, etc., which can represent the direct connection or the indirect connection between the two. Other components, chips, devices, and other elements or objects for describing functions may be included between the two, and the functions or actions required to be achieved by the two in a connected relationship may be achieved simultaneously. Moreover, the sizes of the blocks in the figures are merely illustrative and are not intended to be limiting unless otherwise indicated herein.
As used herein, the terms "first" or "second," and the like, are used to distinguish or refer to the same or similar elements, components, or structures, and do not necessarily imply a spatial order to such elements, components, or structures. It should be understood that in some cases or configurations, ordinal words may be used interchangeably without affecting the practice of the invention.
The embodiment of the invention is used for illustrating the configuration of related elements in the subscriber identity module card, and by means of the configuration, more space can be saved in the subscriber identity module card which is narrow and narrow, so that more functional elements, chips and the like can be accommodated, the subscriber identity module card has more functions, and a user can experience more mobile communication experience.
The exemplary configurations of the embodiments of the present invention are applicable to various sizes of sim cards, such as: standard SIM cards, Micro-SIM cards, Nano-SIM cards or even smaller sized SIM cards are applicable. The embodiment of the present invention uses a Nano-SIM card as an example, and uses the specification of the Nano-SIM card (8.8mm × 12.3mm, thickness is about 0.76mm) as a requirement, so that each configuration illustrated in the embodiment of the present invention can be configured to conform to the specification of the Nano-SIM card, and thus be embedded in the Nano-SIM card.
Referring to fig. 1 and 2, fig. 1 is a partial cross-sectional view of a package structure in a sim card according to an embodiment of the invention, and fig. 2 is a partial top view of a circuit substrate in the sim card of fig. 1. The packaging structure comprises: a circuit substrate 100, a bluetooth communication chip 200, and a package 300.
The circuit substrate 100 is used to carry various electronic components in the sim card, such as: the circuit substrate 100 preferably includes multiple layers of substrates, and the area of each layer of substrate is fully utilized by the design of multiple layers of stacked substrates, so that specific devices or circuits can be disposed on specific layers to fully utilize the space or achieve other effects, which will be described in detail later.
As shown in fig. 1, the package 300 encapsulates the circuit substrate 100 and the bluetooth communication chip 200, and the package 300 may be made of plastic material, for example: polyvinyl chloride (PVC), Acrylonitrile (ABS), or combinations thereof, or other materials suitable for use in configuring a SIM card. After the package 300 is cured and cut, each sheet-shaped sim card can be completed. The package 300 may have a plurality of contact windows 310 formed at a position adjacent to the second side 120 of the circuit substrate 100, and the contact windows 310 expose two types of contact terminals on the second side 120 of the circuit substrate 100: first type terminals 130, second type terminals 140.
The first type of terminal 130 can be defined for contact connection with the mobile communication device after the sim card is mounted on the mobile communication device, for example, when the sim card is mounted in a card slot of the mobile communication device, the first type of terminal 130 is electrically connected to the mobile communication device in a contact manner. These first type terminals 130 may be, for example: a VCC terminal, an RST terminal, a CLK terminal, an I/O terminal, and a GND terminal.
The second type of terminals 140 may be defined for use when the subscriber identity module card is subjected to additional functional characteristic tests, such as: bluetooth communication function, near field communication function, etc., in other words, the second type terminal 140 is not used for contact connection of the mobile communication device, and when the sim card is installed in the card slot of the mobile communication device, the second type terminal 140 is not electrically connected to the mobile communication device in a contact manner. The second type of terminal 140 is directly exposed outside the sim card through the contact window 310, so that the function detection of the sim card becomes efficient, and defective components are easily determined, thereby facilitating the determination and handling in the subsequent quality management.
As shown in fig. 1, the bluetooth communication chip 200 is disposed on the first side 110 of the circuit substrate 100, and further, the bluetooth communication chip 200 is fixed on the circuit substrate 100 by a plurality of first electrical connection units 151, and at the same time, the bluetooth communication chip 200 can form a projection area 105 on the first side 110 of the circuit substrate 100 (see fig. 2). As illustrated in fig. 2, a dashed box represents the range of the bluetooth communication chip 200 on the circuit substrate 100 after being configured, the first electrical connection units 151 are all located in the projection area 105, and the first electrical connection units 151 may be, for example: tin or other conductive material.
In the projection area 105 on the first side 110 of the circuit substrate 100, a plurality of pads 104 corresponding to electrical contacts on the bottom of the bluetooth communication chip 200 may be disposed, such as by using a Surface Mount Technology (SMT) process to attach the bluetooth communication chip 200 on the first side 110 of the circuit substrate 100, and electrically connect the pads 104, so that the bluetooth communication chip 200 is fixed on the circuit substrate 100.
The bluetooth communication chip 200 may be redistributed or otherwise configured such that the electrical contacts of the bluetooth communication chip 200 are all located at the bottom of the bluetooth communication chip 200, and the pads 104 on the circuit substrate 100 in the projection area 105 may be distributed substantially uniformly as shown in fig. 2, rather than being distributed only around or on one side, so that the substrate area around the outside of the projection area 105 may not be used. The Bluetooth communication chip 200 has a thickness of 0.215-0.235 mm, preferably 0.225 mm.
In addition, based on the requirement of thin thickness, the thickness of the electrical contact under the bluetooth communication chip 200 with a thickness of 0.215-0.235 mm must be controlled to avoid the occurrence of solder joint or other electrical defects, so that the thickness of the first electrical connection unit 151 is too thin, which is likely to cause solder joint or other electrical defects, and too thick, which is not likely to meet the requirement of thin thickness or cause incorrect electrical conduction (e.g., improper electrical connection with adjacent contacts). Therefore, in the embodiment of the present invention, the thickness of the first electrical connection unit 151 below the bluetooth communication chip 200 is controlled within 0.11mm, preferably within 0.07-0.10 mm, so that the packaged subscriber identity module card can conform to the specification of a Nano-SIM card and maintain good electrical connection.
Regarding the arrangement of the bluetooth communication chip 200, for example, a solder ball may be disposed on each electrical contact at the bottom of the bluetooth communication chip 200, so that only a small portion of solder paste needs to be coated on the solder pad 104, and after the bluetooth communication chip 200 is placed on the circuit substrate 100 through a component-making process and passes through a high-temperature tin furnace, the thickness formed by the first electrical connection unit 151 is controlled within 0.11 mm.
Referring to fig. 3, fig. 3 is a top view of a circuit substrate in a sim card according to an embodiment of the invention. The bluetooth communication chip 200 may further be configured with a memory 210, and the memory 210 is disposed on the first side 110 of the circuit substrate 100 (see fig. 1), and is electrically connected to the bluetooth communication chip 200 through a conductive line of the circuit substrate 100. The memory 210 is used to store the name of the sim card during bluetooth broadcasting, and can be modified to correspond to the card issuer of the sim card, so that the sim card is not limited by the name of the bluetooth broadcast bound in the bluetooth communication chip 200 when being mass-produced. That is, although the bluetooth communication chip 200 usually has a storage unit therein, the embodiment of the present invention does not use the storage unit, but uses a plug-in memory 210 to achieve the multi-functional effect. In the embodiment of the present invention, an additional memory 210 may be provided, which is also due to the further advantage of saving the circuit substrate area occupied by the bluetooth communication chip.
As shown in fig. 3, the bluetooth communication chip 200 also needs to be matched with an oscillator 220 to further provide the time information required for bluetooth communication. In one embodiment, the bluetooth communication chip 200 can operate only by matching with a 16MHz oscillator.
Referring to fig. 3 and 4, fig. 4 is a cross-sectional view of a near field communication antenna portion of a package structure in the sim card of fig. 3. As shown in fig. 3, a nfc chip 400 and a nfc antenna 410 may be further disposed on the circuit substrate 100. The nfc antenna 410 is disposed on the first side 110 of the circuit substrate 100, and the nfc antenna 410 is electrically connected to the circuit substrate 100 through a plurality of second electrical connection units 152.
The near field communication antenna 410 may have: a chip 411 and an antenna loop 412 spirally wound around the chip 411. The chip 411 is made of ferrite material, two end points of the antenna loop 412 are respectively located at the bottom of the nfc antenna 410, and the two end points are respectively electrically connected to the circuit substrate 100 through the corresponding second electrical connection units 152 (such as the two second electrical connection units 152 marked in fig. 4) for signal transmission. In addition, the thickness of the NFC antenna 410 is between 0.33 and 0.43 mm. Furthermore, the bottom of the NFC antenna 410 may further have at least one third electrical connection unit 153, and the third electrical connection unit 153 is not used for signal transmission, but is used for securing the NFC antenna 410 on the circuit substrate 100 and preventing the NFC antenna 410 from warping, and the configuration of the NFC antenna 410 may be completed in the same process (e.g., SMT process).
Referring to fig. 5, fig. 5 is a partial cross-sectional view of a circuit substrate according to an embodiment of the invention. The circuit substrate 100 illustrated in fig. 5 is a multi-layer substrate, and the first side 110 of the circuit substrate 100 is the uppermost surface of the multi-layer substrate, and the second side 120 is the lowermost surface of the multi-layer substrate. The multi-layer substrate can be divided into an upper layer 101, a middle layer 102 and a lower layer 103, for example, and for the illustration of fig. 5, two layers of substrates are combined into four surface layers, including: a first side 110, an opposite side 111 of the first side, a second side 120, an opposite side 121 of the second side. Therefore, partial conducting circuits can be arranged on each layer, for example, a grounding lead or a power supply lead is arranged on the surface or inner layer of the multilayer substrate, the conducting holes are arranged in the grounding lead or the power supply lead and are electrically isolated from the grounding lead or the power supply lead, and the conducting holes are respectively communicated with the circuits of different layers of the multilayer circuit board.
Referring to fig. 6, fig. 6 is a configuration diagram of the nfc antenna 410 and the bluetooth antenna 230 according to an embodiment of the present invention. The bluetooth antenna line 230 is shown by a dotted line, which means that the bluetooth antenna line 230 is not disposed on the first side 110 of the circuit substrate 100, but disposed on an intermediate layer of the multi-layer substrate, and by forming other metal lines and forming the bluetooth antenna line 230, not only the occupied area on the first side 110 of the circuit substrate 100 but also the process steps can be saved. In addition, the nfc antenna 410 is covered by the ferrite material and can be disposed to overlap with the bluetooth antenna line 230 in the vertical direction (or the normal direction) of the circuit substrate 100, so as to increase the flexibility of the disposed lines in the circuit substrate 100.
However, in other embodiments of the present invention, the bluetooth communication chip 200 may only communicate with the bluetooth module in the installed mobile communication device without being collocated with or connected to or disconnected from the bluetooth antenna line 230.
As shown in fig. 3, the first secure element chip 510 is disposed on the first side 110 of the circuit substrate 100, the first secure element chip 510 is electrically connected to the circuit substrate 100 through the first lead unit 161, and is coupled to the baseband chip of the mounted mobile communication device through the first type of terminals 130 (such as VCC terminal, RST terminal, CLK terminal, I/O terminal, and GND terminal) disposed on the second side 120 of the circuit substrate 100, so as to form the connection of ISO7816 channels.
Referring to fig. 7, fig. 7 is a top view of a circuit substrate in a sim card according to another embodiment of the present invention. The difference from fig. 3 is that in the present embodiment, the secure element chip is divided into a second secure element chip 521 and a third secure element chip 522, for example: a payment secure element and a telecommunications secure element. The second secure device chip 521 and the third secure device chip 522 are stacked in a staggered manner, so that the underlying secure chip can expose the electrical contacts on the surface thereof for electrical connection of the lead unit. In addition, the blank spaces in fig. 3 and 7 where no element is labeled are only schematic representations where other elements are located, and do not mean that there is no element there.
The second secure element chip 521 is electrically connected to the circuit substrate 100 through the second lead unit 162, and the third secure element chip 522 is electrically connected to the circuit substrate 100 through the third lead unit 163. For example, the payment security element is respectively coupled with the bluetooth communication chip and the near field communication chip through different interfaces; the telecom security element is coupled with the baseband chip of the mounted mobile communication device, so as to form the connection of an ISO7816 channel.
Referring to fig. 8, fig. 8 is a method for manufacturing a subscriber identity module card according to an embodiment of the invention. The method is used for arranging a plurality of first-type elements and a plurality of second-type elements on a circuit substrate conforming to the Nano-SIM specification. Comprises the following steps: step S1, providing the multi-layered circuit substrate; step S2, a surface mounting step; step S3, chip setting step; step S4, gluing and curing; and step S5, a test step, which may be performed or not, as necessary.
In step S2, the first type device is bonded on the circuit substrate by a surface mount process. The first type of element comprises: the Bluetooth module comprises a Bluetooth communication chip, a Bluetooth oscillator, a near field communication antenna and at least one passive element.
In step S3, the second type device is fixed on the circuit substrate by the lead process and the package process. The second class of elements comprises: near field communication chip, memorizer and at least one secure element chip.
In step S4, a package body for packaging the circuit board is formed by filling and baking plastic material, the first type terminal 130 and the second type terminal 140 are exposed at the bottom of the package body, and a user identification module card is formed after cutting.
Referring to fig. 3 and 7, the area a is the smt area, the area B is the lead process and package process area, and the area range outlined in fig. 3 and 7 is only an example, which mainly illustrates the feature that two types of processes are performed on the same substrate, and the area range outlined in fig. 3 and 7 is not limited to the area range outlined in fig. 3 and 7. The embodiment of the invention discloses an arrangement mode of a first type element and a second type element, wherein a Bluetooth communication chip belongs to the first type element, and a surface mount process is adopted instead of a lead process and a packaging process, so that the circuit substrate area occupied by the Bluetooth communication chip can be saved.
Referring to fig. 9, fig. 9 is a schematic bottom view of a sim card according to an embodiment of the present invention. As shown in fig. 9, the bottom surface of the sim card is divided into a first type terminal 130 (for contact connection of the mobile communication device) and a second type terminal 140 (for function test), and both are directly exposed to the electrical contacts, especially the second type terminal 140, and these second type terminals 140 are helpful for convenience of various tests of additional functions in the sim card with multi-function integration.
While the invention has been described in terms of preferred embodiments, it will be understood by those skilled in the art that the embodiments are illustrative only and should not be taken as limiting the scope of the invention. It is noted that equivalent variations and substitutions for the described embodiments are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention is defined by the claims.
[ notation ] to show
100 circuit board
101 upper layer
102 middle layer
103 lower layer
104 corresponding to the welding pad of the Bluetooth communication chip
105 projection area
110 first side of the circuit substrate
111 opposite to the first side of the circuit board
120 second side of the circuit substrate
121 opposite the second side of the circuit substrate
130 first type terminal (for mobile communication device contact connection)
140 second type terminal (for function test)
151 first electric connection unit
152 second electrical connection unit
153 third electric connection unit
161 first lead element
162 second lead unit
163 third lead element
200 Bluetooth communication chip
210 memory
220 oscillator
230 bluetooth antenna circuit
300 package
310 contact window
400 near field communication chip
410 near field communication antenna
411 chip
412 antenna loop
510 first secure element chip
521 second secure element chip
522 third secure element chip
A surface mount process area
B lead process and packaging process area.
Claims (15)
1. A package structure of a subscriber identity module card, comprising:
a circuit substrate;
the Bluetooth communication chip is arranged on the first side of the circuit substrate and forms a projection area on the circuit substrate, a plurality of first electric connection units for electrically connecting the Bluetooth communication chip and the circuit substrate are arranged between the Bluetooth communication chip and the circuit substrate, and the first electric connection units are all positioned in the projection area; and
a package body for wrapping the circuit substrate and the Bluetooth communication chip and having a plurality of contact windows on a second side of the circuit substrate opposite to the first side,
the thickness of each first electric connection unit between the Bluetooth communication chip and the circuit substrate is 0.07-0.10 mm.
2. The package structure of claim 1, wherein the thickness of the Bluetooth communication chip is between 0.215 mm and 0.235 mm.
3. The package structure of claim 1, further comprising: a near field communication antenna disposed on the first side of the circuit substrate, the near field communication antenna having: the chip and an antenna loop spirally surrounding the chip are made of ferrite materials, two end points of the antenna loop are respectively located at the bottom of the near field communication antenna, two end points of the antenna loop are respectively electrically connected with the circuit substrate through corresponding second electric connection units for signal conduction, and the thickness of the near field communication antenna is 0.33-0.43 mm.
4. The package structure of claim 3, wherein the bottom of the NFC antenna further comprises at least one third electrical connection unit, and the at least one third electrical connection unit is not used for signal transmission.
5. The package structure of claim 1, further comprising: and the memory is arranged on the first side of the circuit substrate and is electrically connected with the Bluetooth communication chip by the circuit substrate, and is used for storing or modifying the name of the SIM card during the external Bluetooth broadcasting.
6. The package structure of claim 1, wherein the first side of the circuit substrate has a plurality of pads corresponding to the electrical contacts at the bottom of the bluetooth communication chip, and the plurality of pads are distributed in the projection region.
7. The package structure of any one of claims 1-6, wherein the circuit substrate is a multi-layer substrate, the first side of the circuit substrate is a surface of an uppermost layer of the multi-layer substrate, and the subscriber identity module card is sized to conform to a Nano-SIM specification.
8. The package structure of claim 7, wherein the plurality of contact windows are formed on the package body and adjacent to a lowermost layer of the multi-layer substrate of the circuit substrate, the plurality of contact windows are configured to expose a plurality of first type terminals and a plurality of second type terminals disposed on a surface of the lowermost layer of the multi-layer substrate, the plurality of first type terminals are configured for use in a mobile communication device, and the plurality of second type terminals are configured for use in testing additional functional characteristics of the SIM card.
9. The package structure of claim 7, wherein the Bluetooth communication chip is not connected to a Bluetooth antenna line outside the Bluetooth communication chip.
10. A package structure of a subscriber identity module card having a size conforming to a Nano-SIM specification, the package structure comprising:
a circuit substrate;
the Bluetooth communication chip is arranged on the first side of the circuit substrate and forms a projection area on the circuit substrate, a plurality of first electric connection units for electrically connecting the Bluetooth communication chip and the circuit substrate are arranged between the Bluetooth communication chip and the circuit substrate, and the first electric connection units are all positioned in the projection area;
the near-field communication antenna is arranged on the first side of the circuit substrate and is electrically connected with the circuit substrate through a plurality of second electric connection units; and
the first safety element chip is arranged on the first side of the circuit substrate and is electrically connected with the circuit substrate through a plurality of first lead units.
11. The package structure of claim 10, wherein the circuit substrate is a multi-layer substrate, the first side of the circuit substrate being a surface of an uppermost layer of the multi-layer substrate, the package structure further comprising:
a bluetooth antenna circuit, set up in multilayer substrate's intermediate level, just bluetooth antenna circuit with near field communication antenna is in partial overlapping on circuit substrate's the vertical direction, bluetooth antenna circuit reaches near field communication antenna all sets up near circuit substrate's edge, near field communication antenna is the ferrite antenna.
12. The package structure of claim 10, further comprising a second security device chip stacked in offset relation to the first security device chipComponentOn the chip, the circuit substrate is electrically connected by a plurality of second lead units, and the second safety element chip does not shield the first safety element chipComponentAnd a plurality of electrical connection contacts on the surface of the chip.
13. A method of manufacturing a subscriber identity module card according to any of claims 1 to 12, the method comprising disposing a plurality of first type components and a plurality of second type components on a circuit substrate conforming to a Nano-SIM specification, the method comprising:
a surface mounting step of mounting the first type devices on the circuit substrate by a surface mounting process;
a chip setting step, fixing the second type elements on the circuit substrate by a lead process and a packaging process; and
a gluing and curing step, wherein a package body for packaging the circuit substrate is formed by filling and baking plastic materials,
wherein the first type of element comprises: the Bluetooth communication device comprises a Bluetooth communication chip, a Bluetooth oscillator, a near-field communication antenna and at least one passive element;
wherein the second type of element comprises: the device comprises a near field communication chip, a memory and at least one secure element chip.
14. The manufacturing method according to claim 13, wherein in the surface mounting step, a plurality of solders for electrical connection are provided between the circuit substrate and the first type component, and the thickness of each solder between the bluetooth communication chip and the circuit substrate is 0.07-0.10 mm in the surface mounting step.
15. The method of claim 13, further comprising a testing step of performing additional functional characteristic tests on the SIM card through a plurality of contact holes formed in a bottom of the package.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107133696 | 2018-09-25 | ||
| TW107133696A TWI672635B (en) | 2018-09-25 | 2018-09-25 | User identification module card packaging structure and manufacturing method thereof |
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| CN110942133A true CN110942133A (en) | 2020-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811242310.9A Pending CN110942133A (en) | 2018-09-25 | 2018-10-24 | Packaging structure of user identification module card and manufacturing method thereof |
| CN201821733016.3U Active CN208834339U (en) | 2018-09-25 | 2018-10-24 | Packaging structure of user identification module card |
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| CN201821733016.3U Active CN208834339U (en) | 2018-09-25 | 2018-10-24 | Packaging structure of user identification module card |
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| TWI672635B (en) * | 2018-09-25 | 2019-09-21 | 鴻驊科技股份有限公司 | User identification module card packaging structure and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI672635B (en) | 2019-09-21 |
| CN208834339U (en) | 2019-05-07 |
| TW202013257A (en) | 2020-04-01 |
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