TWI643275B - Electronic structure process - Google Patents

Abstract

An electronic structure process that includes the following steps. Provide redundant wiring structure and carrier board. A plurality of first joint protrusions and a first support structure are formed on the redistribution line structure. Forming a first sealant between the first opening and the first joint protrusion. Remove the carrier board. A plurality of second joint protrusions and a second support structure are formed on the redistribution line structure. Forming a second sealant between the second opening and the second joint protrusion.

Description

Electronic structure process

This invention relates to an electronic structure process and, more particularly, to an electronic structure process for use in the field of wafer packaging.

In the field of semiconductor packaging technology, a chip carrier is an electronic component for connecting an integrated circuit chip (IC chip) to a next level, such as a motherboard or a module board. A circuit board having a high wiring density is often used as a wafer carrier of a high number of contacts. The circuit substrate is mainly formed by alternately stacking a plurality of patterned conductive layers and a plurality of dielectric layers, and the two patterned conductor layers are electrically connected to each other through a conductive via. Sexual connection. However, in today's circuit substrates and wafer packaging processes, there are problems of warpage that is likely to occur during the process and insufficient structural strength of the finished product.

The invention provides an electronic structure process, which can improve the structural strength and reduce the production cost of the process.

The present invention provides an electronic structure process that includes the following steps. A redistribution line structure and a carrier board are provided, wherein the redistribution line structure is disposed on the carrier board. A plurality of first joint protrusions and a first support structure are formed on the redistribution line structure. The first support structure has a plurality of first openings, and the first engagement protrusions are located in the first openings. Forming the first sealant. The first glue is filled between the first opening and the first engaging convex portion. Remove the carrier board. A plurality of second joint protrusions and a second support structure are formed on the redistribution line structure. The second support structure has a plurality of second openings, and the second engagement protrusions are located in the second openings. The redistribution line structure is located between the first support structure and the second support structure. Form a second sealant. The second sealant is filled between the second opening and the second joint protrusion.

Based on the above, in the electronic structure process of the present invention, since the peripheral regions of the respective electronic structures of the electronic structure array are provided with the support structure, the warpage occurring in the process can be improved, and the structural strength of the electronic structure array can be improved and Reduce the production cost of the process, thereby increasing the output of the electronic structure. In addition to this, the configuration of the support structure can also improve the overall structural strength of the individual electronic structures.

The above described features and advantages of the invention will be apparent from the following description.

Please refer to FIG. 1A, FIG. 2A and FIG. 4A, wherein the complete state of the structure of FIG. 1A and FIG. 2A is as shown in FIG. 4A, that is, the structure of FIG. 4A is partially shown in FIG. 1A and FIG. 2A. In the electronic structure process of the present embodiment, the carrier board 110 and the redistribution line structure 120 are provided. The redistribution line structure 120 has a first surface S1 and a second surface S2. The redistribution line structure 120 is disposed on the carrier board 110. on. In detail, the second side S2 of the redistribution line structure 120 is connected to the carrier board 110. The redistribution line structure 120 can be directly fabricated on the carrier board 110 by a build-up process, and the detailed production method can obtain sufficient teaching, suggestion and implementation instructions from the general knowledge in the related field. I will not repeat them here. For convenience of explanation, FIGS. 1A and 4A only depict a partially patterned line on the first side S1 of FIG. 2A.

Please refer to FIG. 1B and FIG. 2B. After the above steps, a plurality of first bonding protrusions 130 are formed on the redistribution line structure 120. In detail, after the redistribution line structure 120 is formed, the conductive pillars are continuously electroplated on the partially patterned lines of the first surface S1 of the redistribution line structure 120. The material of the conductive pillars is, for example, copper or other kinds of metals. The arrangement of the plurality of first bonding protrusions 130 is, for example, an array arrangement as shown in FIG. 1B. However, in other embodiments, different patterns may be plated according to electrical requirements, and the invention is not limited thereto.

Please refer to FIG. 1C, FIG. 2C and FIG. 4B, wherein the complete state of the structure of FIG. 1C and FIG. 2C is as shown in FIG. 4B, that is, the structure of FIG. 4B is partially shown in FIG. 1C and FIG. 2C. After the above steps, the first support structure 150A is formed on the redistribution line structure 120, wherein the first support structure 150A has a plurality of first openings Q1, and the plurality of first joint protrusions 130 are located in the first openings Q1. . In this embodiment, the step further includes attaching the first support structure 150A to the redistribution line structure 120 via the first adhesive layer 140 to fix the first support structure 150A on the redistribution line structure 120. In detail, the first adhesive layer 140 is disposed between the redistribution line structure 120 and the first support structure 150A. The first support structure 120 is a mesh structure, such as a mesh reinforcement support. In this way, the warpage occurring in the packaging process can be improved by the support structure and the carrier plate having a plurality of openings, especially for the larger-sized package body, and the overall thickness is thinner, and the improvement effect is more obvious. In addition, the first support structure 150A having the plurality of first openings Q1 can enhance the structural strength of the electronic structure array 50 (see FIG. 4E) and reduce the production cost of the process, thereby increasing the electronic structure 100 (see FIGS. 1I and 2I). And the yield of Figure 3B).

Please refer to FIG. 1D and FIG. 2D. After the above steps, the first sealant 160 is formed to cover the first support structure 150A and the first joint protrusion 130, and the first sealant 160 is filled between the first opening Q1 and the first joint protrusion 130. In other words, in this step, the first sealant 160 is filled on the first support structure 150A and completely covers the first support structure 150 A and the first joint protrusion 130 so that the first support structure 150A Each of the first openings Q1 is filled with the first sealant 160 to fix the first support structure 150A and the first joint protrusions 130. In other embodiments, the first sealant 160 may be filled between the first opening Q1 and the first joint protrusion 130 without covering the first support structure 150A and the first joint protrusion 130. Limited.

Please refer to FIG. 1E, FIG. 2E and FIG. 4C. The complete state of the structure of FIG. 1E and FIG. 2E is shown in FIG. 4C, that is, the structure of FIG. 4C is partially shown in FIG. 1E and FIG. 2E. After the above steps, the carrier board 110 is removed. Since the first sealant 160 is filled in each of the first openings Q1, the first support structure 150A and the redistribution line structure 120 are fixedly connected to each other by the first sealant 160 without being separated. For convenience of explanation, FIG. 1E only depicts a portion of the patterned line on the second side S2 of FIG. 2E.

Please refer to FIG. 1F, FIG. 2F and FIG. 4D, wherein the complete state of the structure of FIG. 1F and FIG. 2F is as shown in FIG. 4D, that is, the structure of FIG. 4D is partially shown in FIG. 1F and FIG. 2F. After the above steps, a plurality of second bonding protrusions 132 and second support structures 152B are formed on the redistribution line structure 120, wherein the second support structure 152B has a plurality of second openings Q2, and the second bonding protrusions 132 are located at the second In the two openings Q2, wherein the redistribution line structure 120 is located between the first support structure 150A and the second support structure 152B. In detail, after the above steps, the conductive pillars are continuously electroplated on the partially patterned lines of the second side S2 of the redistribution line structure 120. In this embodiment, the material and arrangement of the conductive pillars may be the same or different from the first joint protrusions 130 according to electrical requirements, and the invention is not limited thereto. At the same time, in the step of electroplating the conductive pillars, the second support structure 152B is also plated. In other words, in the present embodiment, the second supporting structure 15B2 can be formed on the redistribution line structure 120 by electroplating simultaneously with the plurality of second bonding protrusions 132, that is, the second supporting structure 152B and the second bonding The convex portion 132 is integrally formed. As a result, the material for fabricating the second support structure 152B can be saved. The second support structure 152B is the same as the first support structure 150A in a mesh structure, such as a mesh-shaped reinforcing support. As a result, warpage occurring during the packaging process can be improved, particularly where the thickness of the redistribution wiring structure 120 is thin (see FIG. 2E). In addition, the second support structure 152B having a plurality of second openings Q2 can enhance the structural strength of the electronic structure array 50 (see FIG. 4E) and reduce the production cost of the process, thereby increasing the electronic structure 100 (see FIGS. 1I and 2I). And the yield of Figure 3B).

Please refer to FIG. 1G and FIG. 2G. After the above steps, the second sealant 162 is formed to cover the second support structure 152B and the second joint protrusion 132, and the second sealant 162 is filled between the second opening Q2 and the second joint protrusion 132. In other words, in this step, the second sealant 162 is filled on the second support structure 152B and completely covers the second support structure 152B and the second joint protrusion 132 so that the second support structure 152B Each of the second openings Q2 is filled with the second sealant 162 to fix the second support structure 152B and the second joint protrusion 132. In other embodiments, the second sealant 162 may be filled between the second opening Q2 and the second joint protrusion 132 without covering the second support structure 152B and the second joint protrusion 132. limit.

Please refer to FIG. 1H, FIG. 2H, FIG. 3A and FIG. 4E. The complete state of the structure of FIG. 1H, FIG. 2H and FIG. 3A is as shown in FIG. 4E, that is, the structure of FIG. 4E is partially shown in FIG. 1H and FIG. Figure 3A. After the above steps, a portion of the first sealant 160 and a portion of the second sealant 162 may also be removed to expose the first support structure 150A and the first joint protrusion 130 to the first sealant 160, and second The support structure 152B and the second joint protrusion 132 are exposed to the second sealant 162, thereby allowing the first joint protrusion 130 and the second joint protrusion 132 to be subsequently joined to other components or devices. In detail, in the embodiment, the first sealant 160 protrudes from a portion of the first joint protrusion 130 and the second sealant 162 protrudes from the second portion by, for example, etching, sandblasting, polishing, or the like. A portion of the engagement protrusion 132 is removed such that the first engagement protrusion 130 and the second engagement protrusion 132 may expose the first sealant 160 and the second sealant 162, respectively. In addition, in the embodiment, the area of the second bonding protrusion 132 exposed to the second sealing 162 is smaller than the area of the first bonding protrusion 130 exposed to the first sealing 160 to achieve a fan-out signal. The purpose of the circuit to the subsequent target to be joined. In addition, the exposed portions of the first bonding protrusions 130 and the second bonding protrusions 132 protruding from the first encapsulant 160 and the second encapsulant 162 may be determined according to the target to be joined, and the present invention does not This is limited to this. To this end, the electronic structure array 50 is completed, which includes a plurality of electronic structures 100 that have not been cut, as shown in FIG. 4E.

Please refer to FIG. 1I, FIG. 2I and FIG. 3B. After the above steps, the first support structure 150A, the second support structure 152B, and the redistribution line structure are cut along a plurality of cutting lines L (see FIGS. 1H, 2H, 3A, and 4E) between the first openings Q1. 120 to form a plurality of electronic structures 100. In other words, each of the electronic structure 100 formed by cutting the first support structure 150A and the second support structure 152B along the cutting line L has a portion of the first support structure 150A and a portion of the second support structure 152B, and this A portion of a support structure 150A and a second support structure 152B are two annular reinforcing supports for a single electronic structure 100, which can enhance the overall structural strength of the electronic structure 100, particularly where the overall structure thickness is thin. . Furthermore, since the two annular reinforcing supports are formed by cutting along the cutting line L, both reinforcing supports are exposed to the side 102 of the single electronic structure 100, thus for the peripheral area of the electronic structure 100. Said that provides a strong protection. Likewise, the redistribution line structure 120 is also aligned with the cutting line L such that a portion of the redistribution line structure 120 is exposed to the side 102 of the single electronic structure 100.

Referring again to FIG. 1H, FIG. 2H, FIG. 3A and FIG. 4E, in particular, in the present embodiment, the electronic structure array 50 includes a plurality of electronic structures 100, and the electronic structures 100 are adapted to be arrayed to form an electronic structure array 50. As shown in Figure 4E. Each of the electronic structures 100 includes a redistribution line structure 120, a first support structure 150A, a second support structure 152B, a plurality of first joint protrusions 130, a plurality of second joint protrusions 132, a first sealant 160, and a second Sealing 162. The first support structure 150A has a first opening Q1 and is disposed on the first surface S1 of the redistribution line structure 120. The second support structure 152B has a second opening Q2 disposed on the second surface S2 of the redistribution line structure 120 with respect to the first surface S1. The plurality of first bonding protrusions 130 are disposed on the first surface S1 of the redistribution line structure 120 and are located in the first opening Q1. The plurality of second bonding protrusions 132 are disposed on the second surface S2 of the redistribution line structure 120 and are located in the second opening Q2. The first adhesive 160 is filled between the first opening Q1 and the first engaging projection 130. The second sealant 162 is filled between the second opening Q2 and the second joint protrusion 132. In other words, the electronic structure 100 is cut from the electronic structure array 50, and thus the redistribution wiring structure 120, the first support structure 150A, and the second support structure 152B are also cut and formed in the respective electronic structures 100. Since the peripheral regions of the respective electronic structures 100 of the electronic structure array 50 are provided with the first supporting structure 150A and the second supporting structure 152B, the warpage occurring during the packaging process of the electronic structure array 50 can be improved, and the electronic structure array can be improved. The structural strength of 50 reduces the production cost of the process, thereby increasing the yield of electronic structure 100. In addition, the configuration of the first support structure 150A and the second support structure 152B can also improve the overall structural strength of the respective electronic structure 100.

Referring to FIG. 1I, FIG. 2I and FIG. 3B, in particular, in the embodiment, the electronic structure 100 includes a redistribution line structure 120, a first support structure 150A, a second support structure 152B, and a plurality of first joint protrusions. The portion 130, the plurality of second engaging protrusions 132, the first sealant 160, and the second sealant 162. The first support structure 150A has a first opening Q1 and is disposed on the first surface S1 of the redistribution line structure 120. The second support structure 152B has a second opening Q2 and is disposed on the second surface S2 of the redistribution line structure 120 with respect to the first surface S1. The plurality of first bonding protrusions 130 are disposed on the first surface S1 of the redistribution line structure 120 and are located in the first opening Q1. The plurality of second bonding protrusions 132 are disposed on the second surface S2 of the redistribution line structure 120 and are located in the second opening Q2. The first adhesive 160 is filled between the first opening Q1 and the first engaging projection 130. The second sealant 162 is filled between the second opening Q2 and the second joint protrusion 132. The electronic structure 100 is cut by the electronic structure array 50 (see FIG. 4E), and thus the redistribution line structure 120, the first support structure 150A, and the second support structure 152B are also cut and formed in each electronic structure 100. Since the peripheral region of the electronic structure 100 is provided with the first support structure 150A and the second support structure 152B, the overall structural strength of the electronic structure 100 can be improved, particularly where the overall structure thickness is thin.

Referring to FIG. 5, the electronic structure 100A of the present embodiment is similar to the electronic structure 100 of FIG. 2I, but the main difference between the two is that in the step of forming the plurality of first bonding protrusions 130 in the redistribution line structure 120 ( 2B), the first support structure 150B and the first bonding protrusion 130 are simultaneously formed on the redistribution wiring structure 120 by electroplating, that is, the first support structure 150B is integrally formed with the first bonding protrusion 130. In this way, the material for fabricating the first support structure 150B can be saved.

Referring to FIG. 6, the electronic structure 100B of the present embodiment is similar to the electronic structure 100A of FIG. 5, but the main difference between the two is that in the step of forming the plurality of second bonding protrusions 132 in the redistribution line structure 120, The second support structure 152A is adhered to the redistribution line structure 120 via the second adhesive layer 142 to fix the second support structure 152A to the redistribution line structure 120. In detail, the second adhesive layer 142 is disposed between the redistribution line structure 120 and the second support structure 152A. In this way, the warpage occurring during the packaging process can be improved by the support structure having a plurality of openings, in particular, the thickness of the overall structure is thin.

Referring to FIG. 7, the electronic structure 100C of the present embodiment is similar to the electronic structure 100 of FIG. 2I, but the main difference between the two is that in the step of forming the plurality of second bonding protrusions 132 in the redistribution line structure 120 ( 2F), the second support structure 152A is adhered to the redistribution line structure 120 via the second adhesive layer 142 to secure the second support structure 152A to the redistribution line structure 120. In detail, the second adhesive layer 142 is disposed between the redistribution line structure 120 and the second support structure 152A. In this way, the warpage occurring during the packaging process can be improved by the support structure having a plurality of openings, in particular, the thickness of the overall structure is thin.

Please refer to FIG. 8A and FIG. 9A. After the step of removing a portion of the first sealant 160 and a portion of the second seal 162, a third support structure 154A is formed on the second support structure 152A, and the second support structure 152A is located at the first support structure 150B and the third Between the support structures 154A, the third support structure 154A has a plurality of third openings Q3. In the step of forming the third support structure 154A in the second support structure 152A, the third support structure 154A is adhered to the second support structure 152A via the third adhesive layer 144, wherein the third support structure 154A is a mesh structure, for example It is a mesh reinforcement support. In this way, the warpage that occurs during the packaging process can be improved and the overall structural strength can be improved for the target to be joined to the second bonding protrusion 132, and the thickness of the overall structure is thinner.

Please refer to FIG. 8B and FIG. 9B. After the above steps, the wafer 170 is disposed in each of the third openings Q3, and the wafer 170 is connected to the plurality of second bonding protrusions 132 in the corresponding second opening Q2. In other words, one wafer 170 is disposed on the plurality of second bonding protrusions 132 in each of the second openings Q2. However, in other embodiments, more than two wafers may be disposed, and the invention is not limited thereto. In detail, the wafer 170 is disposed and directly connected to the second bonding protrusion 132. By repeating the configuration of the wiring structure 120, the signal on the wafer 170 can be fan-out to the wafer of the redistribution line structure 120. Outside the 170 projection area, the flexibility of the signal configuration of the wafer 170 is increased. In addition, the second bonding protrusions 132 can be electrically connected directly to the pads 170a on the wafer 170 without additionally requiring additional bumps. In addition, a plurality of solder balls (not shown) may be disposed on the first bonding protrusions 130, and the redistribution line structure 120 is located between the wafer 170 and the solder balls.

Please refer to FIG. 8C and FIG. 9C. After the above steps, a third sealant 164A is formed on the second sealant 162, and the third sealant 164A is filled between the second sealant 162 and the corresponding wafer 170 to complete the wafer package array 50A. In other words, in this step, the third sealant 164A is filled on the second sealant 162 and completely covers the third support structure 154A and the wafer 170 such that each of the third support structures 154A is third. The opening Q3 is filled with the third sealant 164A to fix the third support structure 154A and the wafer 170.

Please refer to FIG. 10A and FIG. 10B. The electronic structure process steps of this embodiment are similar to the electronic structure process steps of FIGS. 8C and 9C, but the main difference between the two is the configuration of the third sealant 164B. In detail, in the above steps, the third sealant 164B may be filled only between the second sealant 162 and the corresponding wafer 170, or the third sealant 164A may be removed (see FIGS. 8C and 9C). A portion of the film is formed to form a third sealant 164B to expose the wafer 170, thereby completing the wafer package array 50B. As such, the wafer 170 can be exposed outside the array of electronic structures 50B to contact the heat dissipating conductors, thereby providing better heat dissipation for the subsequently cut single electronic structure.

In summary, in the electronic structure process of the present invention, since the peripheral structure of the individual electronic structures of the electronic structure array is provided with the support structure, the warpage occurring in the process can be improved, especially where the thickness of the overall structure is thin. Moreover, the structural strength of the electronic structure array can be improved and the production cost of the process can be reduced, thereby increasing the output of the electronic structure. In addition to this, the configuration of the support structure can also improve the overall structural strength of the individual electronic structures.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

50, 50A, 50B‧‧‧ electronic structure array

100, 100A, 100B, 100C‧‧‧ electronic structure

120‧‧‧Re-distribution line structure

130‧‧‧First joint projection

132‧‧‧Second joint projection

140‧‧‧First adhesive layer

142‧‧‧Second Adhesive Layer

144‧‧‧ third adhesive layer

150A, 150B‧‧‧ first support structure

152A, 152B‧‧‧second support structure

154A‧‧‧3rd support structure

160‧‧‧First sealant

162‧‧‧Second sealant

164A, 164B‧‧‧ third sealant

170‧‧‧ wafer

170a‧‧‧ pads

L‧‧‧ cutting line

Q1‧‧‧ first opening

Q2‧‧‧ second opening

Q3‧‧‧ third opening

S1‧‧‧ first side

S2‧‧‧ second side

1A to 1D are schematic plan views of an electronic structure process according to an embodiment of the present invention. 1E to FIG. 1G are schematic bottom views of the subsequent process of the electronic structure process of FIG. 1D. 1H to FIG. 1I are schematic plan views of the subsequent process of the electronic structure process of FIG. 1G. 2A to 2I are schematic cross-sectional views of the structure of Figs. 1A to 1I taken along line A-A' of Fig. 1A, respectively. 3A and 3B are bottom views showing the structure of Figs. 2H and 2I, respectively. 4A is a schematic perspective view of the structure of FIGS. 1A and 2A in a complete state. 4B is a schematic perspective view of the structure of FIGS. 1C and 2C in a complete state. 4C is a schematic perspective view of the structure of FIGS. 1E and 2E in a complete state. 4D is a schematic perspective view of the structure of FIGS. 1F and 2F in a complete state. 4E is a schematic perspective view of the structure of FIGS. 1H, 2H, and 3A in a complete state. Figure 5 is a cross-sectional view showing an electronic structure in accordance with another embodiment of the present invention. Figure 6 is a cross-sectional view showing an electronic structure according to still another embodiment of the present invention. Figure 7 is a cross-sectional view showing an electronic structure in accordance with still another embodiment of the present invention. 8A to 8C are schematic bottom views of the subsequent process of the electronic structure process of FIG. 2H. 9A to 9C are schematic cross-sectional views of the structure of Figs. 8A to 8C taken along line A-A' of Fig. 1A, respectively. FIG. 10A is a bottom plan view showing another embodiment of the electronic structure process of FIG. 8B. Figure 10B is a cross-sectional view of the structure of Figure 10A taken along line A-A' of Figure 1A.

Claims (14)

An electronic structure process includes: providing a redistribution line structure and a carrier board, wherein the redistribution line structure is disposed on the carrier board; forming a plurality of first bonding protrusions and a first supporting structure on the redistributing line structure The first support structure has a plurality of first openings, and the first joint protrusions are located in the first openings; forming a first sealant, wherein the first sealant is filled in the first openings Between the first joint protrusions; removing the carrier plate; forming a plurality of second joint protrusions and a second support structure on the redistribution line structure, wherein the second support structure has a plurality of second An opening, the second engaging protrusions are located in the second openings, the redistributing line structure is located between the first supporting structure and the second supporting structure; forming a second sealing material, wherein the second sealing material Filling between the second openings and the second engaging protrusions. The electronic structure process of claim 1, further comprising: cutting the first support structure, the second support structure, and the redistribution line structure along a plurality of cutting lines between the first openings A plurality of electronic structures are formed. The electronic structure process of claim 2, wherein a portion of the first support structure and a portion of the second support structure are exposed to the redistribution line structure. The electronic structure process of claim 1, wherein the first support structure and the second support structure are mesh structures. The electronic structure process of claim 1, further comprising: removing a portion of the first sealant and a portion of the second sealant to make the first support structure and the first joint protrusions Exposed to the first sealant, and the second support structure and the second joint protrusions are exposed to the second sealant. The electronic structure process of claim 5, wherein the first bonding protrusions and the second bonding protrusions are formed by electroplating, and the second bonding protrusions are exposed to the second sealing The area of the glue is smaller than the area where the first joint protrusions are exposed to the first sealant. The electronic structure process of claim 1, wherein the first support structure and the first joint protrusions are simultaneously formed by electroplating. The electronic structure process of claim 1, wherein the second support structure and the second bonding protrusions are simultaneously formed by electroplating. The electronic structure process of claim 1, wherein the step of forming the first support structure on the redistribution line structure further comprises: bonding the first support structure to the redistribution line via a first adhesive layer Structurally. The electronic structure process of claim 1, wherein the step of forming the second support structure on the redistribution line structure further comprises: bonding the second support structure to the redistribution line via a second adhesive layer Structurally. The electronic structure process of claim 1, further comprising: forming a third support structure on the second support structure, the second support structure being located between the first support structure and the third support structure The third supporting structure has a plurality of third openings; at least one wafer is disposed in each of the third openings, and the at least one wafer is connected to the second engaging protrusions in the corresponding second opening; and forming A third sealant is applied to the second sealant, and the third sealant is filled between the second sealant and the corresponding at least one wafer. The electronic structure process of claim 11, wherein the third support structure is a mesh structure. The electronic structure process of claim 11, wherein the step of forming the third support structure in the second support structure further comprises: bonding the third support structure to the second support via a third adhesive layer Structurally. The electronic structure process of claim 11, wherein the third sealant covers the third support structure and the at least one wafer.