TWI610244B - Smart card holder, mobile device system with smart card holder, and smart card access system - Google Patents

Abstract

A wafer card access system includes a mobile device system with a wafer card carrier and a reading device. A mobile device system with a wafer card carrier includes a mobile device and a wafer card carrier. An application is stored inside the mobile device. The wafer card carrier includes a plurality of slots, a read interface, a communication interface, and a control circuit. A plurality of slots are used to insert at least one wafer card. The read interface is used to externally transfer the wafer data in the wafer card. The communication interface is connected to the mobile device. The control circuit is electrically connected to the slot, the read interface and the communication interface to receive the selection signal generated by the mobile device according to the application, and then switch one of the slots to electrically connect with the read interface. The reading device is configured to receive and read the wafer data in the wafer card.

Description

Chip card carrier, mobile device system with wafer card carrier and wafer card access system System

The present invention relates to a wafer card carrier and related mobile device, and more particularly to a chip capable of carrying a plurality of wafer cards and capable of transmitting wafer data by selecting one of a plurality of wafer cards according to a selection signal transmitted by the mobile device. Card carrier.

In recent years, based on the consideration of security or diversified applications, traditional magnetic stripe cards have been gradually replaced by chip cards because of their small data capacity and easy to be forged or copied. The chip cards are also called IC cards. (Integrated Circuit Card) or Smart Card. Compared with magnetic stripe cards, chip cards have the advantages of large memory capacity and password protection, and are not easily forged. They have been widely used in daily life, such as SIM cards in mobile phones, natural person certificates, wafer credit cards, and chips. Bank card, phone card and health insurance card.

Generally speaking, according to the way of transferring data between the chip card and the card reader, the chip card is mainly divided into a contact card and a contactless card. In the case of a contactless chip card, an RFID tag is mainly packaged in a card by using an IC package technology. When the contactless chip card approaches the card reading device, the magnetic field line generated by the card reading device passes through the non-contact chip card. The contact chip card can induce current to drive the non-contact wafer card to transfer the wafer data, and the card reading device can read the wafer data in the non-contact wafer card, so the user does not need to use the non-contact wafer card Direct contact with the card reading device, but only to be disconnected The touch wafer card is placed in the sensing range of the card reading device, and various transactions can be performed to improve the convenience of use. However, it is worth noting that if a fraudulent person places the card reader device within the sensing range of the contactless chip card, there is a risk of stolen or personal data being stolen.

On the other hand, in the case of a contact wafer card, the wafer is embedded in the card, and the contact electrode sheet for reading is exposed on the surface of the card. The contact electrode sheet has a plurality of contacts respectively connected to the chip pins embedded in the card, so when the contact wafer card is placed in the card reading device, the card reading device contacts the contact electrode pads The direct access to the wafer data in the contact wafer card can be read. Therefore, compared to non-contact wafer cards, contact wafer cards are less convenient to use, but are not easily stolen or stolen by unscrupulous people.

However, based on security considerations, the use of contactless chip cards is a better choice, but as the living standards of Chinese people improve, each person will hold more and more wafer cards. However, the use of each wafer card may be different, which will enable the user to carry a variety of wafer cards with them in order to prepare for the occasion, but the wafer cards have different specifications, which is not only inconvenient for storage, but also In use, it is also necessary to select an appropriate card from a plurality of cards for the transaction, and then insert the removed card into the wallet, thereby causing inconvenience in use.

Embodiments of the present invention provide a wafer card carrier for mating with a mobile device, the chip card carrier including a plurality of slots, a read interface, a communication interface, and a control circuit. A plurality of slots are used to insert at least one wafer card. The read interface is configured to externally transfer the wafer material in the wafer card, and the read interface is disposed on a surface of the wafer card carrier. The communication interface is connected to the mobile device. The control circuit is electrically connected to the slot, the reading interface and the communication interface, and the control circuit receives the selection signal generated by the mobile device through the communication interface, so that the control circuit switches one of the slots and the read interface electrical property. connection.

The embodiment of the invention further provides a mobile device system with a wafer card carrier, the mobile device system with a wafer card carrier comprising a mobile device and a wafer card carrier. An application is stored inside the mobile device. The chip card carrier is configured to be mated with a mobile device, and the chip card carrier includes a plurality of slots, a reading interface, a communication interface, and a control circuit. The slot is for inserting at least one wafer card. The read interface is configured to externally transfer the wafer material in the wafer card, and the read interface is disposed on a surface of the wafer card carrier. The communication interface is connected to the mobile device. The control circuit is electrically connected to the slot, the read interface and the communication interface, and the control circuit is configured to receive a selection signal. According to the application, the mobile device generates a selection signal and transmits the selection signal to the control circuit through the communication interface, so that the control circuit switches one of the slots to electrically connect with the read interface.

Embodiments of the present invention further provide a wafer card access system including a mobile device system having a wafer card carrier and a reading device. The mobile device system with a wafer card carrier includes a mobile device and a wafer card carrier. An application is stored inside the mobile device. The chip card carrier is configured to be mated with a mobile device, and the chip card carrier includes a plurality of slots, a reading interface, a communication interface, and a control circuit. The slot is for inserting at least one wafer card. The read interface is configured to externally transfer the wafer material in the wafer card, and the read interface is disposed on a surface of the wafer card carrier. The communication interface is connected to the mobile device. The control circuit is electrically connected to the slot, the read interface and the communication interface, and the control circuit is configured to receive a selection signal. The reading device is configured to receive and read the wafer data in the wafer card. According to the application, the mobile device generates a selection signal and transmits the selection signal to the control circuit through the communication interface, so that the control circuit switches one of the slots to electrically connect with the read interface.

In summary, the chip card carrier, the mobile device system with the chip card carrier and the chip card access system of the embodiment of the present invention insert at least one chip card and the communication interface through a plurality of slots of the chip card carrier. After the mobile device is connected, the chip card carrier can receive the selection signal transmitted by the mobile device, and according to the selection signal, The control circuit switches one of the slots to be electrically connected to the read interface, so that the wafer data in the wafer card in the switched slot can be read by the reading device through the reading interface, thereby the user Multiple wafer cards can be integrated into the chip card carrier, and the application device installed by the mobile device can select which chip card to be read by the reading device for accessing the wafer card data, thereby improving The convenience and security of the use of the wafer card.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

10‧‧‧wafer card access system

100, 300, 400, 600‧‧‧ mobile device systems with wafer card carriers

110, 210, 310, 410, 510, 610, 810 ‧ ‧ wafer card carrier

111, 411‧‧‧ reading interface

112‧‧‧Control circuit

113, 114, 115, 116, 741, 742, 743, 744, 813 ‧ ‧ slots

117, 217‧‧‧ communication interface

118‧‧‧ Strap

120‧‧‧Mobile devices

121‧‧‧Processing circuit

122‧‧‧Display unit

123‧‧‧ headset jack

130‧‧‧Reading device

131‧‧‧ 容部

132‧‧‧ drive circuit

133‧‧‧Mobile reading interface

318‧‧‧Electronic label sensing unit

518‧‧‧ Identification points

619‧‧‧Certificate Module

740‧‧‧ cover

750‧‧‧Connecting parts

813‧‧‧Multi-card socket

813a~813c‧‧‧Feet set

817‧‧‧ external socket

818‧‧‧ card reader module

1121‧‧‧Control unit

1122‧‧‧Switch unit

1321‧‧‧ comparison table

4111‧‧‧Finger sensor

4112‧‧‧ Finger Sliding Detection Unit

A, B, C, D, L, Z‧‧‧ wafer cards

C1~C8‧‧‧ touch points

C9‧‧‧ remaining area

D1‧‧‧ fingerprint sensing signal

D2‧‧‧Fingerprint information

D3‧‧‧Sliding sensing signal

D1‧‧‧first distance

D2‧‧‧Second distance

E‧‧‧wafer card identification signal

F‧‧‧ certification signal

G1, G2‧‧‧ side

Q1~Q4‧‧‧Connection port

R‧‧‧wafer card switching signal

S‧‧‧Select signal

S1‧‧‧ wake up signal

S2‧‧‧Enable signal

S3‧‧‧Specification indication signal

T‧‧‧ special signal

y, y’‧‧‧ direction

Z1, Z2‧‧‧ open circuit points

RS‧‧‧Return signal

1A is a schematic diagram of a wafer card access system in accordance with an embodiment of the present invention.

1B is a rear elevational view of a wafer card carrier in accordance with an embodiment of the present invention.

1C is a front elevational view of a wafer card carrier in accordance with an embodiment of the present invention.

1D is a block diagram of a mobile device system with a wafer card carrier in accordance with an embodiment of the present invention.

1E is a schematic diagram of a read interface in accordance with an embodiment of the present invention.

2A is a front elevational view of a wafer card carrier in accordance with another embodiment of the present invention.

2B is a front elevational view of a wafer card carrier in accordance with another embodiment of the present invention.

3A is a rear elevational view of a wafer card carrier in accordance with another embodiment of the present invention.

3B is a block diagram of a mobile device system with a wafer card carrier in accordance with another embodiment of the present invention.

3C is a schematic diagram of wireless communication between a wafer card carrier and a reading device in accordance with another embodiment of the present invention.

3D is a block diagram of a reading device in accordance with another embodiment of the present invention.

4A is a rear elevational view of a wafer card carrier in accordance with another embodiment of the present invention.

4B is a block diagram of a mobile device system with a wafer card carrier in accordance with another embodiment of the present invention.

Figure 5 is a rear elevational view of a wafer card carrier in accordance with another embodiment of the present invention.

6 is a block diagram of a mobile device system with a wafer card carrier in accordance with another embodiment of the present invention.

Figure 7 is a front elevational view of a wafer card carrier in accordance with another embodiment of the present invention.

Figure 8 is a front elevational view of a wafer card carrier in accordance with another embodiment of the present invention.

Various illustrative embodiments are described more fully hereinafter with reference to the accompanying drawings. However, the inventive concept may be embodied in many different forms and should not be construed as being limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this invention will be in the In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Similar numbers always indicate similar components.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, such elements are not limited by the terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of the inventive concept. As used herein, the term "and/or" includes any of the associated listed items and all combinations of one or more.

[Example of wafer card access system]

Please refer to FIG. 1A. FIG. 1A is a schematic diagram of a wafer card access system according to an embodiment of the invention. As shown in FIG. 1A, the wafer card access system 10 includes a mobile device system 100 having a wafer card carrier, the mobile device system 100 having a wafer card carrier including a wafer card carrier 110 and a mobile device 120, and the wafer card access system 10 The reading device 130 and the host device (not shown) are included. In this embodiment, the wafer card carrier 110 is configured to be mated with the mobile device 120 and can carry a plurality of wafer cards. In this embodiment, the mobile device 120 is, for example, a smart phone, and an application (Application, referred to as App) is installed. The reading device 130 is, for example, a card reader, and is electrically connected. Connected to the host device, and the reading device 130 is configured to read the wafer data in the wafer card carried by the wafer card carrier 110 to transfer the wafer data to the connected host device, wherein the reading device 130 has a receiving portion 131. A program for accommodating the mobile device 120 for wafer card reading. By executing the application, the mobile device 120 can select a wafer card in the wafer card to cause the reading device 130 to read the data of the wafer card.

It should be noted that, in addition to being a smart phone with a USB jack, the mobile device 120 can also be a tablet with a USB jack, a handheld electronic device with communication functions, or other portable, wearable electronic devices. The device (eg, a smart watch), and the wafer card carrier 110 can be a casing or a back shell of the mobile device 120, and the host device can be a computer device, a point of sale terminal, or an automated teller machine (automated) The host of the teller machine (ATM), this embodiment does not limit the physical architecture and/or implementation of the mobile device 120, the chip card carrier 110, and the host device.

In detail, please refer to FIG. 1A, FIG. 1B and FIG. 1C simultaneously, FIG. 1B is a rear view of the wafer card carrier according to an embodiment of the present invention. 1C is a front elevational view of a wafer card carrier in accordance with an embodiment of the present invention. As shown in FIG. 1B, the back surface of the wafer card carrier 110 is provided with a read interface 111 and a control circuit 112 is embedded therein, and the read interface 111 is disposed on the surface of the wafer card carrier 110. However, this embodiment is not limited. The read interface 111 is a surface that is attached, protruded, or recessed to the wafer card carrier 110. As shown in FIG. 1C, the front side of the wafer card carrier 110 is provided with a plurality of slots 113-116 and a communication interface 117. In this embodiment, the read interface 111 is implemented by a plurality of conductive electrode sheets for externally transferring the wafer data in the plurality of wafer cards to enable the reading device 130 to read the interface 111 via the electrical contacts. Read the wafer data. The slots 113-116 are respectively inserted into the chip cards A to D (that is, the plurality of wafer cards carried by the wafer card carrier 110), and the conductive pins are respectively disposed in the slots 113-116 (not For example, the pin group may be a plurality of metal pins or other non-metal pins having conductive characteristics, so when the chip cards A to D are respectively inserted into the slots 113-116, the slots are The pins in 113-116 can each be in electrical contact with a plurality of metal contacts on the wafer cards A~D. The communication interface 117 is selectively electrically coupled to the mobile device 120 for data transfer and obtains the operational power required by the wafer card carrier 110 via the mobile device 120. It should be noted that in other embodiments, the chip card carrier 110 further has a battery slot for plugging at least one battery to obtain a required working power. In summary, the embodiment does not limit the wafer card carrier 110 to obtain the working power. Possible way. In the embodiment, the wafer card carrier 110 is provided with only four chip card slots, such as the slots 113-116. However, this embodiment does not limit the number of slots of the chip card carrier 110. Can be changed according to their actual needs.

In addition, it is worth noting that the size and specifications of the chip card are numerous; generally common wafer cards (such as those conforming to or compatible with the ISO7816 series of international standards) have plastic sheets for packaging (about 8.5cm x 5.4cm). An integrated circuit chip module having the capability of storing, encrypting and processing data is embedded in the plastic sheet, and a metal foil area for reading is exposed on the surface of the plastic sheet, that is, the metal foil region includes the metal contact. For transferring the wafer data to the outside, in the embodiment, the wafer card A~D is, for example, a card of 25 mm×15 mm, 15 mm×12 mm or 8.8 mm×12.3 mm, so as to save most of the plastic sheet area and keep only as much as possible. A portion of the metal foil to facilitate integration of the plurality of wafer cards A to D into the wafer card carrier 110. In addition, it should be noted that the embodiment does not limit the size of the wafer cards A to D, and those skilled in the art can make changes according to their actual needs.

What follows is taught to further illustrate the working principle of the wafer card access system 10.

1A to 1D, FIG. 1D is a block diagram of a mobile device system with a wafer card carrier according to an embodiment of the invention. As shown in FIG. 1D, the chip card carrier 110 includes the aforementioned read interface 111, the control circuit 112, the slots 113-116, and the communication interface 117, and the control circuit 112 is electrically connected to the slots 113-116, the read interface 111, and Communication interface 117. The mobile device 120 includes a processing circuit 121, a display unit 122, and a headset jack 123 (also referred to as a composite plug for microphone or earphone plugging) hole). The processing circuit 121 is electrically connected to the display unit 122 and the headset jack 123, respectively. In this embodiment, the processing circuit 121 may further include a memory unit (not shown), such as an external memory card or built-in memory, and the memory unit is configured to store the application. The display unit 122 is a display screen of the mobile device 120.

In the implementation of the chip card access system, the control circuit 112 is electrically connected to the headset jack 123 of the mobile device 120 via the communication interface 117, and the control circuit 112 receives the mobile device 120 through the communication interface 117 according to the application. The signal S is selected such that the control circuit 112 switches one of the slots 113-116 to be electrically connected to the read interface 111, so that the reading device 130 can read the switched slot through the reading interface 111. Wafer data in the wafer card. Therefore, the above-mentioned fitting manner is that the wafer card carrier 110 covers or engages the mobile device 120 and is electrically connected to the headset jack 123 through the communication interface 117, but the embodiment does not limit the wafer card carrier 110 and the action. Possible fitting means between the devices 120.

Specifically, as shown in FIG. 1D, the control circuit 112 includes a control unit 1121, a switching unit 1122, and connection ports Q1 to Q4. The control unit 1121 is electrically connected to the reading interface 111, the slots 113-116, the communication interface 117 and the switching unit 1122, and the switching unit 1122 is electrically connected to the reading interface 111, and the connection ports Q1 to Q4 are respectively electrically connected to the slots. Pins in 113~116. In this embodiment, the control unit 1121 is configured to receive and process the selection signal S to output the wafer card switching signal R to the switching unit 1122, and then the switching unit 1122 switches to the connection port Q1 to Q4 according to the wafer card switching signal R. One of the switching units 1122 is electrically connected to one of the slots 113-116 according to the chip card switching signal R, and the chip card in the switched slot is electrically connected to the reading interface 111, and can be externally connected. The wafer data is transferred for reading by the reading device 130, wherein the switching unit 1122 can be implemented by a plurality of switching elements.

More specifically, in the embodiment, each of the slots 113-116 has a trigger switch (not shown). When the slots 113-116 are respectively inserted with the chip cards A~D, the trigger switch is turned on. Generating a plurality of trigger signals to cause the control unit 1121 Corresponding to receiving a plurality of trigger signals. The control unit 1121 generates a reward signal RS according to the received trigger signal, and the control unit 1121 transmits the reward signal RS to the mobile device 120 through the communication interface 117 and the headset jack 123, and when the user operates the mobile device 120 to perform the In the application, the processing circuit 121 displays an operation interface (not shown) on the display unit 122 according to the report signal RS, and displays a wafer card selection list on the operation interface, and the wafer card selection list includes the wafer. Cards A to D, for the user to select which wafer card to transfer data for the wafer card, such as a wafer card for identity verification or a wafer card for financial transactions. It is worth mentioning that if the slot 113 is not inserted with any of the chip cards A, the control unit 1121 does not receive the reward signal RS corresponding to the slot 113, and thus the wafer card selection list displayed by the display unit 122 does not include There is a chip card A.

For example, if the user selects the wafer card A, the mobile device 120 transmits the selection signal S indicating the wafer card A to the control unit 1121 through the communication interface 117. Next, the control unit 1121 processes the selection signal S to output the wafer card switching signal R to the switching unit 1122, and the switching unit 1122 switches to the connection port Q1 to electrically connect the slot 113 with the switching unit 1122, thereby enabling the wafer card A. It is electrically connected to the reading interface 111. Thus, the reading device 130 can read the wafer data in the wafer card A by reading the interface 111 to transfer the wafer data to the connected host device.

Preferably, in an embodiment, the memory unit of the mobile device 120 further stores identity identification information (such as fingerprint feature comparison information or account number and password) for verification. In detail, after the user operates the mobile device 120 to execute the application, the display unit 122 first displays an identity verification window for the identity verification process. After the display unit 122 displays the identity verification window, the user must input identity identification information such as a personal account number and password or transmit fingerprint feature information, and if the entered personal account number and password are used for verification of the internal storage of the memory unit of the mobile device 120. If the account number matches the password, or if the transmitted fingerprint feature information matches the fingerprint feature comparison information stored in the memory unit of the mobile device 120, the display unit 122 displays the operation interface for the user to operate. Conversely, if you enter The personal account number and password do not match the account number and password used for verification in the memory unit of the mobile device 120, or the transmitted fingerprint feature information does not match the fingerprint feature information stored in the memory unit of the mobile device 120. Then, the mobile device 120 sends a warning signal to inform the user that the identity verification fails, and the user will not be able to successfully enable the chip cards A~D. As such, the security performance of the use of the wafer card is further improved by the above-described identity verification program. It should be noted that the general knowledge in the field can be determined by the actual knowledge to determine whether to add the above identity verification procedure. Details regarding the identity verification of the mobile device system of the present invention by fingerprint feature information transmitted by the user will be further described in the following embodiment of the present invention.

In addition, further, please refer to FIG. 1E at the same time, and FIG. 1E is a schematic diagram of a read interface according to an embodiment of the present invention. As shown in FIG. 1E, the read interface 111 has a plurality of contact points C1 C C8 and a remaining area C9, and at least one of the contact points C1 C C8 (for example, the contact point C4 or C8) is designed to be used. A chip card identification signal E is transmitted externally, wherein the chip card identification signal E is used to indicate the number and definition of metal contacts of the chip cards A to D. In detail, since the number of metal contacts of the wafer cards A to D may be different (for example, if the wafer card A is a telephone card, the metal foil area includes 6 contacts, and if the wafer card B is a health insurance card, the metal foil is on the metal foil. There are 8 contacts), so after the user selects a specific wafer card (assumed to be the wafer card A), the switching unit 1122 switches to the wafer card A to electrically connect the foil on the wafer card A to the reading interface. 111. Then, the control unit 1121 determines the number of metal contacts of the wafer card A and the metal contact definition to generate the wafer card identification signal E. Next, the control unit 1121 transmits the wafer card identification signal E to the contact point C4 or C8, so that the reading device 130 receives the wafer card identification signal E through the reading interface 111, and determines the metal contact of the wafer card A. The number and definition, and the wafer data in the wafer card A can be correctly read. It should be noted that the size and relative position of the plurality of contact points C1 C C8 of the reading interface 111 can be configured by referring to the international standard ISO7816-2, but the embodiment does not limit the reading interface 111 and the plurality thereof. The implementation of contact points C1~C8.

For example, assume that the chip card B and the chip card C are respectively a health insurance card and a credit card, and that the host device is a computer device. When the user wants to use the chip card B and the chip card C to pay for the medical examination, the user can first select the wafer card B by the mobile device 120, and then the doctor reads the wafer data in the wafer card B by using the reading device 130, that is, The reading device 130 can receive the chip card identification signal E transmitted by the integrated circuit chip module of the chip card B through the contact point C4 or C8, and can determine the number and definition of the metal contacts of the wafer card B, thereby reading The fetching device 130 transfers the wafer data in the chip card B to the computer device, so that the doctor can view and view the personal identification data and the health care business data stored in the chip card B on the screen of the host device. Next, after the doctor diagnoses the user's related condition, the user can select the wafer card C by the mobile device 120 to allow the counter person to use the same or another reading device 130 to read the wafer data in the wafer card C. That is, the reading device 130 can receive the chip card identification signal E transmitted by the integrated circuit chip module of the wafer card C through the contact point C4 or C8, and can determine the number and definition of the metal contacts of the wafer card C. Thereafter, the reading device 130 can transfer the wafer data in the wafer card C to the computer device, so that the counter personnel can operate the host device to perform the credit card payment deduction procedure.

Also, for example, assume that the wafer card D is a cash card and that the host device is an automated teller machine. When the user wants to use the wafer card D to perform a credit transaction such as withdrawal or transfer, the user can first select the wafer card D by the mobile device 120, and then use the reading device 130 to read the wafer data in the wafer card D, so that The wafer data in the wafer card D is transferred to the ATM so that the user can withdraw the money.

In addition, as mentioned in the foregoing embodiments, the chip card carrier 110 is, for example, an external device such as a protective device cover or a mobile phone back case, but in practice, the wafer card carrier 110 can also be integrated into the action. This embodiment does not limit the implementation of the wafer card carrier 110 on the motherboard of the device 120 or within the mobile device 120.

Moreover, it should be noted that the slots 113-116 of the chip card carrier 110 can also be used to respectively insert a chip card with a wireless transmission function. As shown in FIG. 1C, the wafer card with wireless transmission function is, for example, a wafer card Z. In this embodiment, the wafer card Z With an open circuit point Z1 and an open circuit point Z2, the open circuit point Z1 and the open circuit point Z2 are, for example, electrically conductive metal contacts and are electrically connected to the wafer integrated circuit module (not shown) in the wafer card Z, wherein the open circuit point Z1 and the open circuit point Z2 are exposed on the surface of the wafer card Z. When the open circuit point Z1 and the open circuit point Z2 form a path, if the user brings the wafer card Z close to a commercially available card reader (not shown) that can be used to read the non-contact wafer card, the magnetic field line is passed through the wafer card. Z, thus being magnetically induced to form a current to drive the wafer card Z to transfer the wafer material to the card reader to achieve the function of a generally non-contact wafer card.

Furthermore, in practice, when the user removes any of the wafer cards A to D (assuming the wafer card D is removed), the wafer card Z is inserted into a slot (such as the slot 116). When the open circuit point Z1 and the open circuit point Z2 are respectively electrically connected to the two conductive pins in the slot 116 (the two conductive pins are in a state of being electrically connected). Next, when the user executes the application through the mobile device 120 and selects the chip card Z, the switching unit 1122 will correspondingly receive the switching signal R transmitted by the control unit 1121 to drive a switching element therein to be turned on. The state makes the two conductive pins connected to the open circuit point Z1 and the open circuit point Z2 electrically connected, so that the open circuit point Z1 and the open circuit point Z2 form a path. At this time, the wafer card Z has the function of a general non-contact type wafer card, and the user can hold the mobile device 120 with the wafer card carrier 110 in proximity to the general card reader or read which can be used to read the non-contact wafer card. The device 130 is taken to allow the card reader or reading device 130 to read the wafer data in the wafer card Z.

It can be seen from the above that the mobile device system 100 with the wafer card carrier proposed by the present invention can not transmit the wafer data to the external chip Z1 and the open circuit point Z2 on the wafer card Z. The safety of contact chip cards is used to avoid theft of wafer data.

In order to explain in more detail the operational flow of the wafer card access system 10 of the present invention, at least one of the various embodiments will be further described below.

In the following various embodiments, a part different from the above embodiment will be described The remaining portions are the same as those of the above-described FIGS. 1A to 1E. In addition, for the sake of convenience, like reference numerals or numerals indicate similar elements.

[Another embodiment of a wafer card access system]

Please refer to FIG. 2A. FIG. 2A is a front view of a wafer card carrier according to another embodiment of the present invention. In this embodiment, unlike the wafer card carrier 110 in the embodiment of FIG. 1A to FIG. 1E, the communication between the chip card carrier 110 and the mobile device 120 is not through the headset jack 123 and the communication interface 117, but The communication interface 217 (which is a USB plug) of the chip card carrier 210 is connected to a USB jack of the mobile device 120 (not shown) to enable the wafer card carrier 210 to communicate with the mobile device 120.

In addition, please refer to FIG. 2B, which is a front view of a wafer card carrier according to another embodiment of the present invention. In this embodiment, the wafer card carrier 210 is additionally provided with a watchband 118 in addition to the communication interface 217, and the above-mentioned reading interface is different from the above-described wafer card carrier 110 in the embodiment of FIGS. 1A to 1E. 111 is not disposed on the surface of the wafer card carrier 120, but is disposed on the surface of the band 118. In this way, the user can wear the wafer card carrier 210 on the wrist through the strap 118 to facilitate the external transfer of the wafer data.

In the present embodiment, the details of the relevant implementation of the wafer card carrier 210 shown in FIG. 2A and FIG. 2B will be inferred from the above-described embodiments of FIG. 1A to FIG. 1E, and will not be described herein.

It should be noted that, in relation to the communication interface, in one embodiment, the manufacturer of the mobile device 120 may also change the specifications of the mobile device 120 such that the mobile device 120 is provided with a dedicated jack, connector or socket. The communication interface of the chip card carrier is inserted, whereby the wafer card carrier can communicate with the mobile device 120. The details of the relevant implementation of the wafer card carrier can be inferred from the above-mentioned embodiments of FIG. 1A to FIG. 1E, and will not be described herein.

In addition, in other embodiments, the chip card carrier 110 may use other communication methods to communicate with the mobile device 120 instead of using the communication interface 117 or the communication interface 217. The embodiment does not limit the crystal The data communication between the card carrier 110 and the mobile device 120 is performed in a wired or wireless manner. The general knowledge in the art can be changed according to the general knowledge and the prior art in the field, so the embodiment will not be described herein. .

[Another embodiment of a wafer card access system]

3A and 3B, FIG. 3A is a rear view of a wafer card carrier according to another embodiment of the present invention. 3B is a block diagram of a mobile device system with a wafer card carrier in accordance with another embodiment of the present invention. In this embodiment, unlike the above-described wafer card carrier 110 in the embodiment of FIGS. 1A to 1E, the wafer card carrier 310 of the mobile device system 300 having the wafer card carrier further includes an electronic tag sensing unit 318, and the electronic device. The tag sensing unit 318 is, for example, an NFC module or other module having a wireless communication function. This embodiment does not limit the possible aspects of the electronic tag sensing unit. The electronic tag sensing unit 318 is configured to provide a wake-up signal S1 for reading by the control circuit 112. In practice, the control circuit 112 processes the wake-up signal S1 to generate the consistent signal S2, and the control circuit 112 transmits the enable signal S2 to the mobile device 120 via the communication interface 117, causing the mobile device 120 to execute the application. In addition, in the embodiment, the reading device 130 further has a wireless communication module (not shown) for wirelessly communicating with the mobile device 120 or the chip card carrier 110, wherein the wireless communication module is, for example, NFC. Modules or other modules with wireless communication functions, this embodiment does not limit the possible aspects of the wireless communication module.

Further, after the communication interface 117 of the wafer card carrier 310 is inserted into the headset jack 123 of the mobile device 120, the user senses by the mobile device 120 that is fitted with the wafer card carrier 310 and the reading device 130 (handheld action) The device 120 is located in the radio frequency field generated by the wireless communication module of the reading device 130, and causes the electronic tag sensing unit 318 to provide the wake-up signal S1 for reading by the control circuit 112. Next, the control circuit 112 processes the wake-up signal S1 to output the enable signal S2, and transmits the enable signal S2 to the processing circuit 121 of the mobile device 120 through the communication interface 117. Thereafter, the processing circuit 121 executes the application according to the enable signal S2, and displays the foregoing operation interface on the display unit 122 for the user to select which wafer card to perform the wafer card. Data transfer. In this way, the user can quickly execute the application, and the steps of pressing the power button of the mobile phone, sliding the unlocking, and clicking the quick icon of the application are omitted.

Preferably, please refer to FIG. 3C. FIG. 3C is a schematic diagram of wireless communication between the wafer card carrier and the reading device according to another embodiment of the present invention. After the user senses the reading device 130 by holding the mobile device 120 that has been engaged with the wafer card carrier 310, the reading device 130 also generates a preferential signal T to the mobile device 120 to inform the user of the location. Related offers. For example, when the user performs the consumption in a restaurant outlet, the handheld mobile device 120 receives the preferential signal T transmitted by the reading device 130 when the user senses the handheld mobile device 120 and the reading device 130. Further, the display unit 122 of the mobile device 120 correspondingly displays a special credit card merchant with the store and the preferential activity information window between the credit card merchant and the store for reference by the user. After the user closes the window, the control circuit 112 generates the enable signal S2 according to the wake-up signal S1, and transmits the enable signal S2 to the mobile device 120 through the communication interface 117 and the headset jack 123, so that the mobile device 120 executes the The application.

In addition, in the embodiment, the reading device 130 can be used to read the wafer card in the wafer card inserted by the wafer card carrier 110, and can also be used to write the wafer card to change the wafer card. The wafer data in the middle. For example, if the user wants to use the wafer card Z for the financial deduction action, after the user executes the application through the mobile device 120 and selects the wafer card Z, the user holds the action of the chip card carrier 310. When the device 120 is close to the reading device 130, the reading device 130 generates a deduction signal, and wirelessly transmits the deduction signal to the wafer card Z through the wireless communication module to change the wafer data in the wafer card Z. This completes the writing process. On the other hand, if the user selects any of the wafer cards A to D that do not have the wireless transmission function (assuming the wafer card A) to perform the financial deduction action, the action of the wafer card carrier 110 is fitted. After the device 120 is inserted into the reading device 130, the reading device 130 generates a deduction signal and wirelessly transmits the deduction signal to the electronic tag sensing unit 318 through the wireless communication module, and then the electronic tag sensing unit 318 transmits the deduction signal to the control. The unit 1121, or the reading device 130, transmits the deduction signal to the control unit 1121 through the reading interface 111. Next, after the control unit 1121 receives the deduction signal, the control unit 1121 transmits the received deduction signal to the wafer card A connected to the switching unit 1122 through the switching unit 1122, thereby changing the wafer in the wafer card A. Data to complete the writing process.

Furthermore, please refer to FIG. 3A, FIG. 3B and FIG. 3C and FIG. 3D simultaneously. FIG. 3D is a block diagram of a reading device according to another embodiment of the present invention. In this embodiment, the wafer card carrier 310 has been inserted with the wafer cards A to D. As shown in FIG. 3D, the reading device 130 includes a driving circuit 132 (containing a microprocessor) and a mobile reading interface 133. . In addition, the electronic tag sensing unit 318 further describes a specification indication signal S3 for reading by the driving circuit 132. The driving circuit 132 is electrically connected to the mobile reading interface 133. The drive circuit 132 is used to drive the movement of the mobile reading interface 133. The mobile read interface 133 is for making electrical contact with the read interface 111 in the wafer card carrier 310 to read the wafer data in the wafer cards A to D. In this embodiment, when the user inserts the mobile device 120 to which the wafer card carrier 310 has been inserted into the accommodating portion 131 of the reading device 130, the driving circuit 132 of the reading device 130 reads the electronic tag sensing unit. The specification indication signal S3 described in 318, and then the drive circuit 132 processes the specification indication signal S3 to drive the mobile read interface 133 to move correspondingly to electrically contact the read interface 111.

In more detail, the driving circuit 132 stores a comparison table 1321 (the driving circuit 132 includes a memory unit for storing the comparison table 1321), and the comparison table 1321 stores a plurality of identification codes and control commands, wherein the identification code The wafer card carrier 310 is used to indicate different specifications (the chip card carrier 310 also has different specifications for use with the mobile device 120 of different sizes) because different mobile devices 120 have different sizes, and each identification code corresponds to In a control command. In this embodiment, when the user places the mobile device 120 with the wafer card carrier 310 into the receiving portion 131 of the reading device 130, the electronic tag sensing unit 318 provides the specification indication signal S3 for the driving circuit. 132 is read. According to the specification indication signal S3, the driving circuit 132 Determining the specification of the wafer card carrier 310 to take out the corresponding identification code from the comparison table 1321, and the driving circuit 132 fetches the corresponding control command according to the identification code, that is, the microprocessor in the reading device 130 processes the specification. The indication signal S3 is used to retrieve the corresponding identification code, and then the corresponding control command is taken out according to the identification code. Next, the driving circuit 132 moves correspondingly to drive the mobile reading interface 133 according to the extracted control command, so that the mobile reading interface 133 electrically contacts the reading interface 111. In this manner, even if the read interface 111 of the different specifications of the wafer card carrier 310 has different installation positions, the reading device 130 can control the movement of the mobile reading interface 133 according to the specification indication signal S3 provided by the electronic tag sensing unit 318. The wafer data is read by moving it to an appropriate position.

In addition, in this embodiment, the communication interface 117 of the chip card carrier 310 can also be implemented by a USB plug, and the relevant details of the wafer card access system can be used by those in the field. The above-mentioned embodiments of FIGS. 1A to 3D are inferred and will not be described herein.

[Another embodiment of a wafer card access system]

4A and 4B, FIG. 4A is a rear view of a wafer card carrier according to another embodiment of the present invention. 4B is a block diagram of a mobile device system with a wafer card carrier in accordance with another embodiment of the present invention. In the present embodiment, unlike the above-described wafer card carrier 110 in the embodiment of FIGS. 1A to 1E, the setting position of the reading interface 411 of the wafer card carrier 410 of the mobile device system 400 having the wafer card carrier is clockwise. 90 degrees, and the reading interface 411 further includes a fingerprint sensor 4111, that is, the reading interface 411 is integrated with the fingerprint sensor 4111, and the fingerprint sensor 4111 is disposed on the conductive electrode sheets not contacting the points C1 to C8. The surface (i.e., the surface of the remaining area C9, see Fig. 1E), and the memory unit (not shown) in the processing circuit 121 also have a fingerprint feature comparison information. The fingerprint sensor 4111 is electrically connected to the control unit 1121 of the control circuit 112, and the fingerprint sensor 4111 is configured to sense the finger fingerprint of the user to correspondingly generate the fingerprint sensing signal D1 to the control unit 1121. It is worth noting that the setting of the reading interface 411 can be based on the needs of those skilled in the art. The embodiment is not limited, and the manner of setting the read interface 411 shown in FIG. 4A is only one embodiment of the embodiment of the present invention.

In detail, when the finger of the user touches the fingerprint sensor 4111 and slides on the surface of the fingerprint sensor 4111 in a specific direction, the fingerprint sensor 4111 continuously generates a plurality of fingerprint sensing signals D1 to the control unit 1121. Then, the control unit 1121 processes the plurality of fingerprint sensing signals D1 to generate a fingerprint feature information D2. Through the communication interface 117, the control unit 1121 transmits the fingerprint feature information D2 to the processing circuit 121 of the mobile device 120, so that the processing circuit 121 compares the fingerprint feature information D2 with the internally stored fingerprint feature comparison information. If the comparison result is met, the processing circuit 121 executes the aforementioned application program, so that the user can select one of the wafer cards A to D to perform data transfer of the wafer card through the operation interface displayed by the display unit 122. On the other hand, if the comparison result does not match, the processing circuit 121 controls the display unit 122 to display a warning message to inform the user that the identity verification failed and lock the mobile device 120 to avoid misappropriation by the mobile phone holder. In this way, since the fingerprint pattern of each person is unique in the world, the user's identity verification program is performed by the fingerprint sensor 4111, and the security of the use of the wafer card can be further improved.

In addition, in an embodiment, the wafer card carrier 410 can also be integrated with a finger sliding detecting unit 4112, and the finger sliding detecting unit 4112 is electrically connected to the control unit 1121, wherein the finger sliding detecting unit 4112 is set. The surface of the conductive electrode sheet which is not the contact point C1~C8 (ie, the surface of the remaining area C9, see FIG. 1E) is adjacent to the fingerprint sensor 4111, or the fingerprint sensor 4111 is disposed at least at least one of the contact points C1~C8. One of the parts (such as the contact point C4 or / and C8) can be changed by the person skilled in the art with actual needs. This embodiment does not limit the setting position of the finger slip detecting unit 4112. In this embodiment, the finger slip detecting unit 4112 includes a plurality of electrodes for sensing a change in capacitance generated when the finger touches the surface of the finger slip detecting unit 4112 to generate a sliding sensing signal. D3 to the control unit 1121, and then the control unit 1121 processes the sliding sensing signal D3 to simply control the operation of the mobile device 120.

For example, when the user touches the finger slip detecting unit 4112 and moves the finger to slide in the direction y during the call, the finger slip detecting unit 4112 will correspondingly generate the sliding sensing signal D3 to the control unit 1121. Next, the control unit 1121 processes the received sliding sensing signal D3 to transmit the volume-increased control signal to the mobile device 120 through the communication interface 117, thereby controlling the mobile device 120 to increase the call volume. On the other hand, when the user touches the finger slip detecting unit 4112 and slides in the direction y' during the call, the finger slip detecting unit 4112 will correspondingly generate the sliding sensing signal D3 to the control unit 1121. Next, the control unit 1121 processes the sliding sensing signal D3 to transmit the volume-reduced control signal to the mobile device 120 through the communication interface 117, thereby controlling the mobile device 120 to reduce the call volume correspondingly.

For example, when the user uses the mobile device 120 to perform music playback, if the user touches the finger slip detecting unit 4112 and slides in the direction y' or the direction y, the sound size of the music can be adjusted accordingly.

For example, when the user does not use the mobile device 120 to make a call or a music play, if the user touches the finger slip detecting unit 4112 and slides in the direction y' or the direction y, the control unit 1121 is based on the received The sliding sensing signal D3 correspondingly generates a control signal to the mobile device 120 to control the mobile device 120 to execute the application, and the mobile device 120 displays the operating interface according to the display unit 122 for the user to select the chip. Card A~D. In this way, the user can quickly execute the application, and the steps of pressing the power button of the mobile phone, sliding the unlocking, and clicking the quick icon of the application are omitted.

It should be noted that the finger slip detecting unit 4112 can also be replaced by a scroll wheel or a direction detector for the user to perform volume adjustment during the call, that is, the embodiment does not limit finger sliding. A possible implementation of the detection unit 4112.

In addition, please refer to FIG. 5, which is a rear view of a wafer card carrier according to another embodiment of the present invention. In the present embodiment, unlike the above-described embodiment of FIG. 4A, the wafer card carrier 510 is provided with an identification point 518. The identification point 518 is set in the reading interface 411 Below, and the identification point 518 is, for example, a bump or a pit, which is used to indicate the set position of the fingerprint sensor 4111 or the finger slip detecting unit 4112. However, it should be noted that the embodiment does not limit the setting position of the identification point 518, that is, the identification point 518 can be disposed in the vicinity of the fingerprint sensor 4111 to reach the fingerprint sensor for the general user or the blind person. 4111 or the effect of the set position of the finger slip detecting unit 4112.

It should be noted that the above description is only a possible embodiment of the present invention, and is not limited to the scope of the patent of the present invention. Those skilled in the art may also set the electronic tag sensing unit 318 in the embodiment of FIG. 3A to The wafer card carrier 410 or the wafer card carrier 510 is intended to achieve the effects of the above-described embodiments, that is, equivalent technical changes that are made using the specification and the drawings of the present invention are included in the scope of the present invention.

In addition, in this embodiment, the communication interface 117 of the chip card carrier 410 or the chip card carrier 510 can also be implemented by a USB plug, and the related implementation details of the chip card access system are Generally, the knowledge person can be inferred according to the above-mentioned embodiments of FIG. 1A to FIG. 5, and will not be described here.

[Another embodiment of a wafer card access system]

Please refer to FIG. 6. FIG. 6 is a block diagram of a mobile device system with a wafer card carrier according to another embodiment of the present invention. In the present embodiment, unlike the wafer card carrier 110 of the embodiment of FIGS. 1A to 1E described above, the wafer card carrier 610 of the mobile device system 600 having the wafer card carrier further includes an authentication module 619, and the mobile device 120 The memory unit of the processing circuit 121 stores a verification code. The authentication module 619 is electrically connected to the communication interface 117, and the authentication module 619 is configured to generate an authentication signal F to the mobile device 120 for authentication with the mobile device 120.

In detail, when the communication interface 117 is plugged into the headset jack 123 of the mobile device 120, the authentication module 619 generates the authentication signal F, and the authentication module 619 transmits the authentication signal through the communication interface 117 and the headset jack 123. F to the processing circuit 121 of the mobile device 120. After the processing circuit 121 receives the authentication signal F, the processing circuit 121 processes the authentication signal F to generate an authentication code, and then the processing circuit 121 will The authentication code is compared with the internally stored verification code. If the comparison results are consistent, the wafer card carrier 610 is authenticated and can be recognized by the mobile device 120. The user can use the wafer card carrier 610 to execute the aforementioned application. On the other hand, if the comparison result does not match, the wafer card carrier 610 cannot be recognized by the mobile device 120, and the user cannot use the wafer card carrier 610 to execute the aforementioned application. Preferably, after the authentication fails, the processing circuit 121 controls the display unit 122 to display a warning signal, that is, to inform the user that the inserted wafer card carrier is a non-factory accessory, to remind the user that the chip card carrier 610 is not It is recognized by the mobile device 120 that the user cannot use the wafer card carrier 610 in combination with the mobile device 120.

It should be noted that the above description is only a possible embodiment of the present invention, and is not limited to the scope of the patent of the present invention. Those skilled in the art may also set the electronic tag sensing unit 318 in the embodiment of FIG. 3A on the chip. The equivalents of the above-described embodiments of the card carrier 610, that is, the equivalent technical changes made by the description of the present invention and the contents of the drawings, are included in the scope of the present invention.

In addition, in this embodiment, the communication interface 117 of the chip card carrier 610 can also be implemented by a USB plug, and the relevant details of the wafer card access system can be It is inferred from the above-mentioned embodiments of Figs. 1A to 6 and will not be described here.

[Another embodiment of a wafer card access system]

Please refer to FIG. 7. FIG. 7 is a front view of a wafer card carrier according to another embodiment of the present invention. In the present embodiment, the wafer card carrier 110 is connected to the cover 740 through the connector 750, and the cover 740 is used to cover the display unit 122 of the mobile device 120. To avoid scratching of the display unit 122. In this embodiment, in addition to the wafer card carrier 110 being provided with slots 113-114, the cover 740 is also provided with slots 741-744 for inserting a plurality of wafer cards respectively. Further, a circuit (not shown) is embedded in the cover body 740 to allow the control circuit 112 to switch between the slots 113-114 and the slots 741-744 to be electrically connected to the read interface 111. In turn, the reading device 130 can read the wafer data. take.

It should be noted that the relevant details regarding the wafer card access system have been described in detail in the above-described embodiments of Figs. 1 to 1E, and therefore those having ordinary skill in the art should be able to infer how to add the connector 750 and the cover according to the above embodiment. The body 740, in which Danone can integrate more wafer cards into the mobile device 120, will not be described here.

It should be noted that the above description is only a possible embodiment of the present invention, and is not limited to the scope of the patent of the present invention. Those skilled in the art may also use the wafer card carrier 210 and the wafer card carrier 310 in the foregoing embodiments. The wafer card carrier 410, the wafer card carrier 510 or the wafer card carrier 610 is combined with the connector 750 and the cover 740 to achieve the effects of the above embodiments, that is, the equivalent of using the specification and the drawings of the present invention. Technological changes are included in the scope of the invention.

[Another embodiment of a wafer card access system]

Please refer to FIG. 8. FIG. 8 is a front view of a wafer card carrier according to another embodiment of the present invention. In this embodiment, different from the above-mentioned embodiments of FIG. 1A to FIG. 1E, the chip card carrier 810 includes a multi-card socket 813, an external socket 817 (for example, a USB slot), and a card reading module 818, and in the present embodiment. In the example, the read interface 111 is disposed on the front side of the wafer card carrier 810.

First, regarding the multi-card socket 813, there are a plurality of slots. Each of the slots is provided with a set of conductive pins (for example, pin groups 813a-813c). Therefore, the multi-card socket 813 can be inserted into a plurality of chip cards, that is, the pin groups 813a-813c respectively correspond to a wafer card. In addition, the multi-card socket 813 can also be used to insert a wafer card L (for example, a current wafer card such as a credit card or a health insurance card, having a size of about 85.60 mm X 53.98 mm). When the wafer card L is inserted into the multi-card socket 813, The pin set 813b in the card socket 813 can be in electrical contact with the metal contacts on the wafer card L, whereby when the user selects the wafer card L through the mobile device 120, the reading device 130 can perform the wafer in the wafer card L. Reading of data. Since the wafer card carrier 810 can be inserted into the wafer card L through the multi-card socket 813, when the user is in a store or a merchant that is not provided with the reading device 130, the user can remove the wafer card L to read the old one. The machine reads.

Further, regarding the read interface 111, which is disposed on the front side of the wafer card carrier 810, and the number and size of the contact points of the read interface 111 and the side G1 of the read interface 111 with respect to the wafer card carrier 810 (for example, the right side) And the setting position of the side G2 (for example, the lower side) is set according to the specification of the international standard ISO7816-2. In detail, according to the specification of ISO7816-2, it has been specified that the number of contact points provided on the exposed metal contact surface on the wafer card should be eight, and each contact point size is at least about 2 mm X 1.7 mm, and The metal contact surface of the wafer card is about 10.25 mm from the left side of the wafer card and about 19.23 mm from the upper side of the wafer card. Accordingly, in practice, the number of contact points of the read interface 111 of the wafer card carrier 810 is eight (eg, contact points C1 to C8), and each contact point has a size of 2 mm X 1.7 mm, and the read interface 111 is relatively The first distance d1 of the side edge G1 of the wafer card carrier 810 can be set to 10.25 mm and the second distance d2 of the reading interface 111 relative to the side edge G2 of the wafer card carrier 810 can be set to 19.23 mm, thereby having a uniform The distance between the reading interface on the wafer card carrier of the specification relative to the adjacent two sides of the wafer card carrier and the number and size of the contact points on the unified reading interface facilitates the reading device 130 to read the wafer data.

It should be noted that in other embodiments, the side G1 and the side G2 of the wafer card carrier 810 may not be the right side and the lower side of the wafer card carrier 810. FIG. 8 is only one embodiment of the present invention. The position of the read interface 11 relative to the side edge G1 of the wafer card carrier 810 may not be 10.25 mm, and the read interface 11 may be opposite. The second distance d2 of the side edge G2 of the wafer card carrier 810 may not be 19.23 mm, which may be modified by a person skilled in the art according to actual needs, and the embodiment of the present invention is not limited thereto.

In addition, the card reading module 818 is electrically connected to the switching unit 1122 and the external socket 817, and the card reading module 818 can be used to read the selected chip card. Wafer information. In detail, after the mobile device 120 is mated with the wafer card carrier 810 through the communication interface 217, the user can select a wafer card through the mobile device 120 for reading. Device 130 performs a reading of the wafer data. However, if the reading device 130 is damaged, the user can electrically connect the wafer card carrier 810 with the mobile device 120 and a computer device, that is, the USB adapter cable, by using a USB cable. One end of the chip card carrier 810 is connected to the external jack 817 and the other end of the USB patch cord is connected to the computer device. Thus, through the USB adapter cable, the card reader module 818 can transfer the read wafer data to the computer device.

In addition, in an embodiment, the card reading module 818 is also electrically connected to the communication interface 217, and the mobile device 120 is further equipped with a shopping APP. In detail, when the user wants to make a online shopping, the user must execute the aforementioned application to select a wafer card (for example, a credit card), and then execute the shopping application to drive the card reading module 818 to read. The wafer data in the selected wafer card is transferred to the mobile device 120 through the communication interface 217, and then the mobile device 120 transmits the received wafer data to a remote server, thereby completing the credit card deduction action. It should be noted that, in an embodiment, the communication interface 217 of the chip card carrier 810 can also be replaced by the foregoing communication interface 117 for connecting with the headset jack 123 of the mobile device 120 to enable the chip card carrier 810 and the action. Device 120 can establish communication.

In addition, it should be noted that the above description is only a possible embodiment of the present invention, and is not limited to the patent scope of the present invention. For the wafer card carrier 310, the wafer card carrier 410, the wafer card carrier 510 or the wafer of the foregoing embodiment, The reading interface of the card carrier 610, which is generally known in the art, can also be used to set the reading interface of the wafer card carrier 310, the wafer card carrier 410, the wafer card carrier 510 or the wafer card carrier 610 on the front side of the wafer card carrier. And the setting position of the wafer card carrier can also refer to the specification of the international standard ISO7816-2 to determine the setting position of the reading interface of the wafer card carrier 310, the wafer card carrier 410, the wafer card carrier 510 or the wafer card carrier 610 (ie, reading The distance between the interface and the adjacent side edges of the wafer card carrier and the size and number of contact points on the read interface. In addition, it should be noted that those skilled in the art can also provide the card reading module 818 and the external socket 817 in the embodiment of FIG. 8 on the wafer card carrier 310, the wafer card carrier 410, the wafer card carrier 510 or the wafer. Card carrier 610 to achieve the work of the above embodiment The equivalent technical changes that are made by using the specification and the drawings of the present invention are included in the scope of the present invention.

[Effects of possible examples]

In summary, the chip card carrier, the mobile device system with the chip card carrier and the chip card access system provided by the embodiments of the present invention insert a plurality of chip cards and communication interface through a plurality of slots of the chip card carrier. After the mobile device is connected, the chip card carrier can receive the selection signal transmitted by the mobile device, and according to the selection signal, the control circuit switches one of the slots to electrically connect with the reading interface, thereby switching the slot. The wafer data in the wafer card can be read by the reading device through the reading interface, whereby the user can integrate the plurality of wafer cards onto the wafer card carrier and can use the application installed by the mobile device. Which wafer card is selected for reading by the reading device for accessing the wafer card data, thereby improving the security of the use of the wafer card.

The drawings and the descriptions of the present invention are only examples of the present invention, and are not intended to limit the present invention. Anyone skilled in the art can make various changes and refinements according to the above description. The simple equivalent changes and modifications made by the scope of the invention and the description of the invention are still within the scope of the invention.

10‧‧‧wafer card access system

100‧‧‧Mobile device system with chip card carrier

110‧‧‧ wafer card carrier

120‧‧‧Mobile devices

130‧‧‧Reading device

131‧‧‧ 容部

Claims (29)

A wafer card carrier for mating with a mobile device, the wafer card carrier comprising: a plurality of slots for inserting at least one wafer card; and a reading interface for externally transmitting the at least one wafer card Chip data, and the read interface is disposed on a surface of the wafer card carrier; a communication interface is connected to the mobile device; and a control circuit electrically connects the slots, the read interface and the communication interface, and The control circuit receives a selection signal generated by the mobile device through the communication interface, so that the control circuit switches one of the slots to electrically connect to the read interface. The chip card carrier of claim 1, wherein the control circuit comprises: a control unit electrically connected to the read interface and the communication interface, and the control unit is configured to receive the selection signal to output a chip a switching signal; and a switching unit electrically connected to the control unit and the reading interface, and the switching unit is configured to receive the chip card switching signal to switch one of the slots, thereby enabling the switching The chip card in the slot is electrically connected to the read interface to externally transfer the wafer data in the wafer card. The wafer card carrier of claim 1, wherein the communication interface is connected to a headset jack or a USB jack of the mobile device. The wafer card carrier of claim 1, wherein the read interface has a plurality of contact points, and at least one of the contact points is for transmitting a chip card identification signal, wherein the chip card identification The signal is used to indicate the number and definition of the metal contacts of the at least one wafer card. The wafer card carrier as claimed in claim 1, further comprising: An electronic tag sensing unit is configured to provide a wake-up signal, wherein the control circuit receives and processes the wake-up signal to generate a consistent signal, and the control circuit transmits the enable signal to the mobile device through the communication interface, so that The mobile device executes an application to generate the selection signal. The chip card carrier of claim 5, wherein the electronic tag sensing unit further describes a specification indication signal, wherein the specification indication signal is used to indicate the specification of the wafer card carrier. The wafer card carrier of claim 1, wherein the reading interface comprises a fingerprint sensor electrically connected to the control circuit, and the fingerprint sensor is configured to sense a finger fingerprint, wherein the control circuit is configured according to the The sensing result of the fingerprint sensor generates a fingerprint feature information, and the control circuit transmits the fingerprint feature information to the mobile device through the communication interface, so that the mobile device compares the fingerprint feature information. The chip card carrier of claim 1, wherein the read interface further comprises a finger sliding detecting unit electrically connected to the control circuit, and the finger sliding detecting unit is configured to detect a finger sliding direction to generate a sliding sensing signal to the control unit, wherein the control circuit processes the sliding sensing signal to generate a control signal and transmit the control signal to the mobile device through the communication interface, so that the mobile device adjusts the call time correspondingly The volume level or correspondingly executes an application to generate the selection signal. The wafer card carrier of claim 7, further comprising an identification point for indicating a location of the fingerprint sensor. The chip card carrier of claim 8 further includes an identification point for indicating a set position of the finger slip detecting unit. The chip card carrier of claim 1, further comprising: an authentication module electrically connected to the communication interface, and the authentication module is configured to generate An authentication signal is sent to the mobile device for authentication with the mobile device. The wafer card carrier of claim 1, wherein the wafer card carrier has a first side and a second side, and the reading interface has a first distance from the first side and the reading The interface has a second distance from the second side. The wafer card carrier of claim 1, further comprising a multi-card socket having a plurality of slots for inserting a plurality of first wafer cards or having a size larger than the first A second wafer card of the wafer card. A mobile device system with a chip card carrier, comprising: a mobile device having an application stored therein; and a chip card carrier for mating with the mobile device, the chip card carrier comprising: a plurality of slots for Inserting at least one wafer card; a reading interface for externally transferring the wafer material in the at least one wafer card, and the reading interface is disposed on a surface of the wafer card carrier; a communication interface connecting the mobile device; And a control circuit electrically connecting the slots, the read interface and the communication interface, and the control circuit is configured to receive a selection signal; wherein, according to the application, the mobile device generates the selection signal and passes the The communication interface transmits the selection signal to the control circuit, so that the control circuit switches one of the slots to electrically connect to the read interface. The mobile device system with a chip card carrier according to claim 14, wherein the control circuit comprises: a control unit electrically connected to the reading interface and the communication interface, and the control unit is configured to receive the selection signal To output a wafer card switching signal; a switching unit electrically connecting the control unit and the reading interface, and the switching unit is configured to receive the chip card switching signal to switch one of the slots, thereby enabling the switched slot The chip card is electrically connected to the read interface to externally transfer the wafer data in the wafer card. The mobile device system with a chip card carrier according to claim 14, wherein the read interface has a plurality of contact points, and at least one of the contact points is used for externally transmitting a chip card identification signal. The chip card identification signal is used to indicate the number and definition of metal contacts of the at least one wafer card. The mobile device system of the chip card carrier of claim 14, wherein the chip card carrier further comprises: an electronic tag sensing unit for providing a wake-up signal; wherein the control circuit receives and processes the wake-up signal To generate a consistent energy signal, and the control circuit transmits the enable signal to the mobile device through the communication interface, so that the mobile device executes the application. The mobile device system with a chip card carrier according to claim 17, wherein the electronic tag sensing unit further records a specification indication signal, wherein the specification indication signal is used to indicate the specification of the wafer card carrier. The mobile device system with a wafer card carrier according to claim 14, wherein the reading interface comprises a fingerprint sensor electrically connected to the control circuit, and the fingerprint sensor is configured to sense a finger fingerprint, wherein The control circuit generates a fingerprint feature information according to the sensing result of the fingerprint sensor, and the control circuit transmits the fingerprint feature information to the mobile device through the communication interface, and the mobile device stores the fingerprint feature information and the internal storage device A fingerprint feature is compared to the information. The mobile device system with a chip card carrier according to claim 19, further comprising an identification point for indicating a setting position of the fingerprint sensor. A mobile device system having a wafer card carrier as described in claim 14 The authentication module is electrically connected to the communication interface, and the authentication module is configured to generate an authentication signal to the mobile device for authentication with the mobile device; wherein, after the mobile device receives the authentication signal, The mobile device processes the authentication signal to generate an authentication code, and the mobile device compares the authentication code with one of the internal storage verification codes to identify the wafer card carrier. A wafer card access system comprising: a mobile device system with a chip card carrier, comprising: a mobile device having an application stored therein; and a wafer card carrier for mating with the mobile device The carrier includes: a plurality of slots for inserting at least one wafer card; a reading interface for externally transferring the wafer material in the at least one wafer card, and the reading interface is disposed on a surface of the wafer card carrier; a communication interface for connecting the mobile device; and a control circuit electrically connecting the slots, the read interface and the communication interface, and the control circuit is configured to receive a selection signal; and a reading device for Receiving and reading the chip data recorded by the at least one chip card; wherein, according to the application, the mobile device generates the selection signal, and the mobile device transmits the selection signal to the control circuit through the communication interface, so that the The control circuit switches one of the slots to electrically connect to the read interface. The wafer card access system of claim 22, wherein the control circuit package The control unit is electrically connected to the read interface and the communication interface, and the control unit is configured to receive the selection signal to output a wafer card switching signal; and a switching unit electrically connected to the control unit and the Reading the interface, and the switching unit is configured to receive the chip card switching signal to switch one of the slots, so that the wafer card in the switched slot is electrically connected to the read interface, The reading device reads the wafer material in the wafer card via the reading interface. The wafer card access system of claim 22, wherein the read interface has a plurality of contact points, and at least one of the contact points is used to transmit a wafer card identification signal to the reading device So that the reading device determines the number and definition of the metal contacts of the at least one wafer card. The chip card access system of claim 22, wherein the chip card carrier further comprises an electronic tag sensing unit for providing a wake-up signal, wherein the control circuit receives and processes the wake-up signal to generate a consistent signal. And the control circuit transmits the enable signal to the mobile device through the communication interface, so that the mobile device executes the application. The wafer card access system of claim 22 or 25, wherein the reading device comprises: a mobile reading interface for making electrical contact with the reading interface for reading the wafer card And a driving circuit electrically connected to the mobile reading interface, and the driving circuit is configured to drive the movement of the mobile reading interface. The chip card access system of claim 26, wherein the electronic tag sensing unit is further configured to provide a specification indication signal to the driving circuit, the driving circuit The specification indicator signal is processed to drive the mobile reading interface to move to electrically contact the reading interface. The chip card access system of claim 27, wherein the drive circuit internally stores a look-up table, and the look-up table records a plurality of control commands, wherein the drive circuit indicates the signals according to the specification to select the One of the control instructions. The wafer card access system of claim 22, wherein the chip card access system further comprises a host device electrically connected to the reading device, and the host device is configured to receive the reading device The chip device, wherein the host device is a computer device, a point of sale terminal or a host of an automated teller machine.