TWI608774B - resistance identification method - Google Patents
resistance identification method Download PDFInfo
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- TWI608774B TWI608774B TW106100406A TW106100406A TWI608774B TW I608774 B TWI608774 B TW I608774B TW 106100406 A TW106100406 A TW 106100406A TW 106100406 A TW106100406 A TW 106100406A TW I608774 B TWI608774 B TW I608774B
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- Prior art keywords
- circuit board
- resistance
- copper foil
- circuit
- identification
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- 238000000034 method Methods 0.000 title claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 59
- 239000011889 copper foil Substances 0.000 claims description 57
- 238000004519 manufacturing process Methods 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
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- Structure Of Printed Boards (AREA)
Description
一種使用於自動化電路板生產設備之電路板電阻辨識方法，尤指電路板之預留區域設置有辨識銅箔，讓自動化生產設備以辨識銅箔之電阻值對電路板進行加工。A method for identifying a circuit board resistance used in an automated circuit board production device, in particular, a reserved copper foil is disposed in a reserved area of the circuit board, so that the automated production equipment processes the circuit board by identifying the resistance value of the copper foil.
按，一般自動化電路板生產設備於生產電路板時，係藉由於電路板上所設置之條碼辨識該電路板，讓自動化電路板生產設備依據條碼進行相對應的加工程序，但條碼在電路板加工過程中，容易因高溫高壓之熱壓合製程而損壞，導致自動化電路板生產設備無法辨識電路板，因此，為解決條碼設置所產生之問題，即有相關業者於電路板未使用之區域上，以複數個孔洞排列成標示符號，或是於電路板內嵌入射頻辨識標籤，如：中華民國專利公告第I381780號、第I336513號，雖上述方法可解決條碼設置所產生之問題，但同時也增加了製程上的複雜，且孔洞以及射頻辨識標籤之設置，皆與印刷電路板的製程不同，因此，在設置孔洞或射頻辨識標籤時，容易因操作人員的不慎，而發生孔洞或射頻辨識標籤錯置問題。According to the general automated circuit board production equipment, when the circuit board is produced, the circuit board is identified by the bar code set on the circuit board, so that the automatic circuit board production equipment performs the corresponding processing procedure according to the barcode, but the barcode is processed on the circuit board. In the process, it is easy to be damaged by the high temperature and high pressure thermal compression process, which causes the automatic circuit board production equipment to be unable to recognize the circuit board. Therefore, in order to solve the problem caused by the barcode setting, the relevant industry is in the unused area of the circuit board. The plurality of holes are arranged in the symbol, or the RFID tag is embedded in the circuit board, such as: Republic of China Patent Publication No. I381780, No. I336513, although the above method can solve the problem caused by the bar code setting, but also increases The complexity of the process, and the setting of the hole and the RFID tag are different from the manufacturing process of the printed circuit board. Therefore, when the hole or the RFID tag is set, it is easy to cause a hole or an RFID tag due to inadvertent operation of the operator. Misplaced question.
是以，要如何解決上述習知之問題與缺失，即為相關業者所亟欲研發之課題所在。Therefore, how to solve the above-mentioned problems and shortcomings is the subject of research and development that the relevant industry is eager to develop.
本發明之主要目的乃在於，利用電路板於預留區域所設置之辨識銅箔，藉由辨識銅箔之電阻值，讓自動化生產設備依據電阻值相對應的電路板生產資料對電路板進行加工，且辨識銅箔不會於電路板進行加工時損壞。The main purpose of the present invention is to use the identification copper foil provided in the reserved area of the circuit board, and by identifying the resistance value of the copper foil, the automated production equipment processes the circuit board according to the circuit board production data corresponding to the resistance value. And the identification of the copper foil will not be damaged when the board is processed.
本發明之次要目的在於，辨識銅箔係於電路板進行印刷電路的製作過程中同時形成於電路板之預留區域，而不需額外增加製程，且不會產生辨識銅箔錯置的問題。The secondary object of the present invention is to identify that the copper foil is formed on the circuit board during the manufacturing process of the printed circuit and simultaneously formed in the reserved area of the circuit board without additional processing, and the problem of misidentification of the copper foil is not generated. .
為達上述目的，本發明之使用於自動化電路板生產設備之電路板電阻辨識方法，該電路板係具有預留區域以及用以設置電路之電路區域，且預留區域上設置有辨識銅箔，當電路板進入自動化生產設備進行生產加工時，自動化生產設備會先偵測辨識銅箔之電阻值，並依照辨識銅箔之電阻值對電路板進行加工。In order to achieve the above object, the present invention relates to a circuit board resistance identification method for an automated circuit board manufacturing apparatus, the circuit board having a reserved area and a circuit area for setting a circuit, and the identification area is provided with an identification copper foil. When the board enters the automated production equipment for production and processing, the automated production equipment first detects the resistance value of the copper foil and processes the board according to the resistance value of the identified copper foil.
前述使用於自動化電路板生產設備之電路板電阻辨識方法，其中該辨識銅箔具有二導電部，以及連接於二導電部之阻值部。The foregoing method for identifying a circuit board resistance of an automated circuit board manufacturing apparatus, wherein the identification copper foil has two conductive portions, and a resistance portion connected to the two conductive portions.
前述使用於自動化電路板生產設備之電路板電阻辨識方法，其中該辨識銅箔係於電路板之電路區域進行電路加工時同時產生。The foregoing method for identifying a circuit board resistance of an automated circuit board manufacturing apparatus, wherein the identification copper foil is generated simultaneously in a circuit area of a circuit board for circuit processing.
前述使用於自動化電路板生產設備之電路板電阻辨識方法，其中該電路板之電路區域係為複數設置，每一電路區域設置有相對應之辨識銅箔。The foregoing method for identifying a circuit board resistance of an automatic circuit board manufacturing device, wherein a circuit area of the circuit board is a plurality of sets, and each circuit area is provided with a corresponding identification copper foil.
前述使用於自動化電路板生產設備之電路板電阻辨識方法，其中該辨識銅箔具有二導電部，以及連接於二導電部之阻值部。The foregoing method for identifying a circuit board resistance of an automated circuit board manufacturing apparatus, wherein the identification copper foil has two conductive portions, and a resistance portion connected to the two conductive portions.
前述使用於自動化電路板生產設備之電路板電阻辨識方法，其中該辨識銅箔係於電路板之電路區域進行電路加工時同時產生。The foregoing method for identifying a circuit board resistance of an automated circuit board manufacturing apparatus, wherein the identification copper foil is generated simultaneously in a circuit area of a circuit board for circuit processing.
前述使用於自動化電路板生產設備之電路板電阻辨識方法，其中該自動化生產設備設置有微處理器，以及微處理器所連接之電阻偵測裝置及電路板資料庫，電路板資料庫內儲存有多種電路板生產資料，當電路板進入自動化生產設備進行生產加工時，電阻偵測裝置會偵測辨識銅箔之電阻值，並將電阻值傳送至微處理器，微處理器會比對出該電阻值於電路板資料庫內所對應之電路板生產資料，讓自動化生產設備依據該電路板生產資料對電路板進行生產加工。The foregoing method for identifying a circuit board resistance of an automated circuit board manufacturing device, wherein the automated production device is provided with a microprocessor, and a resistance detecting device and a circuit board database connected to the microprocessor, and the circuit board database stores A variety of circuit board production materials, when the circuit board enters the automated production equipment for production and processing, the resistance detection device will detect the resistance value of the identification copper foil, and transmit the resistance value to the microprocessor, the microprocessor will compare the The resistance value is the circuit board production data corresponding to the circuit board database, so that the automated production equipment can process and process the circuit board according to the circuit board production data.
前述使用於自動化電路板生產設備之電路板電阻辨識方法，其中該電路板之辨識銅箔具有二導電部，以及連接於二導電部之阻值部，且電路板於二導電部處設置有貫穿上下表面穿孔，且辨識銅箔於穿孔內設置有連接部，俾使多個電路板上下層疊時，上下相對之辨識銅箔藉由連接部導電連接。The circuit board resistance identification method used in the automatic circuit board manufacturing device, wherein the identification copper foil of the circuit board has two conductive portions, and a resistance portion connected to the two conductive portions, and the circuit board is disposed at the two conductive portions. The upper and lower surfaces are perforated, and the identification copper foil is provided with a connecting portion in the through hole. When the plurality of circuit boards are stacked on the upper and lower sides, the upper and lower opposite copper foils are electrically connected by the connecting portion.
請參閱第一圖及第二圖所示，由圖中可清楚看出，本發明係於電路板(1、1’)之預留區域(11、11’)上設置有辨識銅箔(13、13’)，辨識銅箔(13、13’)具有二導電部(131、131’)，以及連接於二導電部(131、131’)之阻值部(132、132’)，且辨識銅箔(13、13’)係於電路板(1、1’)之電路區域(12、12’)進行電路加工時同時產生，而阻值部(132、132’)之電阻值，係相對應於電路區域(12、12’)，即不同的電路區域(12、12’)會有不同電阻值的辨識銅箔(13、13’)代表。Referring to the first and second figures, it can be clearly seen from the figure that the present invention is provided with an identification copper foil (13) on the reserved area (11, 11') of the circuit board (1, 1'). , 13'), the identification copper foil (13, 13') has two conductive portions (131, 131'), and the resistance portions (132, 132') connected to the two conductive portions (131, 131'), and identified The copper foil (13, 13') is generated simultaneously in the circuit region (12, 12') of the circuit board (1, 1') for circuit processing, and the resistance value of the resistance portion (132, 132') is phased. Corresponding to the circuit regions (12, 12'), that is, different circuit regions (12, 12') are represented by identification copper foils (13, 13') having different resistance values.
藉上，請參閱第一圖至第四圖所示，當電路板(1、1’) 進行自動化生產時，自動化生產設備4之機械手臂44會帶動電阻偵測裝置42移動至設置有辨識銅箔(13、13’)之電路板(1、1’)上方，利用設置於電阻偵測裝置42周緣之吸嘴421吸取電路板(1、1’)，使設置於電阻偵測裝置42下表面之二探針422分別電性連接於辨識銅箔(13、13’)之二導電部(131、131’)，進而偵測阻值部(132、132’)之電阻值，藉由阻值部(132、132’)之電阻值不同，將所測得之電阻值傳送至微處理器41，微處理器41會比對出該電阻值於電路板資料庫43內所對應之電路板生產資料431，讓自動化生產設備4依據該電路板生產資料431對電路板(1、1’)之電路區域(12、12’)進行生產加工。Referring to the first to fourth figures, when the circuit board (1, 1') is automatically produced, the robot arm 44 of the automated production equipment 4 will drive the resistance detecting device 42 to move to the identification copper. Above the circuit board (1, 1') of the foil (13, 13'), the circuit board (1, 1') is sucked by the nozzle 421 disposed on the periphery of the resistance detecting device 42 to be disposed under the resistance detecting device 42. The second probe 422 of the surface is electrically connected to the two conductive portions (131, 131') of the identification copper foil (13, 13'), thereby detecting the resistance value of the resistance portion (132, 132'), by blocking The resistance values of the value portions (132, 132') are different, and the measured resistance values are transmitted to the microprocessor 41, and the microprocessor 41 compares the resistance values to the corresponding circuit boards in the circuit board database 43. The production data 431 allows the automated production equipment 4 to produce and process the circuit areas (12, 12') of the circuit board (1, 1') in accordance with the circuit board production data 431.
請參閱第五圖所示，由圖中可清楚看出，當電路板2具有複數個電路區域22時，係於預留區域21上設置相對每一電路區域22之辨識銅箔23，同樣的，辨識銅箔23具有二導電部231，以及連接於二導電部231之阻值部232，依據阻值部232之電阻值不同，來代表不同的電路區域22。Referring to the fifth figure, it can be clearly seen from the figure that when the circuit board 2 has a plurality of circuit regions 22, the identification copper foil 23 is disposed on the reserved area 21 with respect to each circuit region 22, the same. The identification copper foil 23 has two conductive portions 231 and a resistance portion 232 connected to the two conductive portions 231, and different circuit regions 22 are represented according to the resistance values of the resistance portions 232.
請參閱第六圖至第九圖所示，由圖中可清楚看出，當多個電路板3需要層疊設置時，各電路板3之辨識銅箔33具有二導電部331，以及連接於二導電部331之阻值部332，且電路板3於二導電部331處設置有貫穿上下表面之穿孔34，且辨識銅箔33於穿孔34內設置有連接部333，俾使多個電路板3上下層疊時，上下相對之辨識銅箔33可藉由連接部333導電連接，而改變最上層電路板3之辨識銅箔33的電阻值。Referring to FIG. 6 to FIG. 9 , it can be clearly seen from the figure that when a plurality of circuit boards 3 need to be stacked, the identification copper foil 33 of each circuit board 3 has two conductive portions 331 and is connected to two. The resistance portion 332 of the conductive portion 331, and the circuit board 3 is provided with a through hole 34 penetrating the upper and lower surfaces at the two conductive portions 331, and the identification copper foil 33 is provided with a connecting portion 333 in the through hole 34 to enable the plurality of circuit boards 3 When stacked up and down, the upper and lower opposing copper foils 33 can be electrically connected by the connecting portion 333 to change the resistance value of the identification copper foil 33 of the uppermost circuit board 3.
是以，本發明為可解決習知技術之不足與缺失，並可增進功效，其關鍵技術在於:Therefore, the present invention can solve the deficiencies and shortcomings of the prior art, and can improve the efficiency. The key technologies are:
(一)本發明利用辨識銅箔設置於電路板之預留區域，藉由辨識銅箔之電阻值代表該電路板之電路區域，讓自動化生產設備可依據辨識銅箔之電阻值對該代表之電路區域進行加工，且辨識銅箔於電路板進行印刷電路的製作過程中同時形成於電路板之預留區域，而不需額外增加製程，且不會產生錯置之問題。(1) The invention uses the identification copper foil to be disposed in a reserved area of the circuit board, and by identifying the resistance value of the copper foil, represents the circuit area of the circuit board, so that the automated production equipment can represent the resistance of the copper foil according to the resistance value. The circuit area is processed, and the identification copper foil is formed in the reserved area of the circuit board during the manufacturing process of the printed circuit board, without additional processing, and the problem of misplacement is not generated.
(二)由於辨識銅箔即為印刷電路，故，辨識銅箔不易於電路板製程中，因接觸之高溫或高壓而損壞。(2) Since the identification of the copper foil is a printed circuit, the identification of the copper foil is not easy to be damaged in the process of the circuit board due to the high temperature or high pressure of the contact.
1、1’‧‧‧電路板1, 1'‧‧‧ boards
11、11’‧‧‧預留區域11, 11' ‧ ‧ reserved area
12、12’‧‧‧電路區域12, 12’‧‧‧ circuit area
13、13’‧‧‧辨識銅箔13, 13'‧‧‧identified copper foil
131、131’‧‧‧導電部131, 131'‧‧‧Electrical Department
132、132’‧‧‧阻值部132, 132’‧‧‧ Resistance Department
2‧‧‧電路板2‧‧‧ boards
21‧‧‧預留區域21‧‧‧ Reserved area
22‧‧‧電路區域22‧‧‧Circuit area
23‧‧‧辨識銅箔23‧‧‧ Identification copper foil
231‧‧‧導電部231‧‧‧Electrical Department
232‧‧‧阻值部232‧‧‧ Resistance Department
3‧‧‧電路板3‧‧‧Circuit board
31‧‧‧預留區域31‧‧‧ Reserved area
32‧‧‧電路區域32‧‧‧Circuit area
33‧‧‧辨識銅箔33‧‧‧ Identification copper foil
331‧‧‧導電部331‧‧‧Electrical Department
332‧‧‧阻值部332‧‧‧ Resistance Department
333‧‧‧連接部333‧‧‧Connecting Department
34‧‧‧穿孔34‧‧‧Perforation
4‧‧‧自動化生產設備4‧‧‧Automated production equipment
41‧‧‧微處理器41‧‧‧Microprocessor
42‧‧‧電阻偵測裝置42‧‧‧Resistance detection device
421‧‧‧吸嘴421‧‧ ‧ nozzle
422‧‧‧探針422‧‧‧ probe
43‧‧‧電路板資料庫43‧‧‧Board database
431‧‧‧電路板生產資料431‧‧‧Board production materials
44‧‧‧機械手臂44‧‧‧ Robotic arm
第一圖係為本發明辨識銅箔設置於電路板之示意圖。 第二圖係為本發明另一辨識銅箔設置於電路板之示意圖。 第三圖係為自動化生產設備之方塊圖。 第四圖係為本發明辨識銅箔設置於電路板進入自動化生產設備進行偵測之示意圖。 第五圖係為本發明電路板上設置有多個加工區域以及相對於加工區域的辨識銅箔之示意圖。 第六圖係為本發明具有連接部的辨識銅箔設置於電路板之示意圖。 第七圖係為本發明具有連接部的辨識銅箔設置於電路板之剖面圖。 第八圖係為本發明具有連接部的辨識銅箔於多個電路板層疊時之示意圖。 第九圖係為本發明具有連接部的辨識銅箔於多個電路板層疊時之剖面圖。The first figure is a schematic diagram of the identification copper foil disposed on the circuit board of the present invention. The second figure is a schematic diagram of another identification copper foil disposed on the circuit board of the present invention. The third diagram is a block diagram of an automated production facility. The fourth figure is a schematic diagram of the identification of the copper foil disposed on the circuit board into the automated production equipment for detection. The fifth figure is a schematic diagram of a plurality of processing regions and an identification copper foil with respect to the processing region on the circuit board of the present invention. The sixth figure is a schematic view of the identification copper foil having the connecting portion of the present invention disposed on the circuit board. The seventh figure is a cross-sectional view of the identification copper foil having the connection portion of the present invention disposed on the circuit board. The eighth figure is a schematic view of the identification copper foil having the connecting portion when the plurality of circuit boards are stacked. The ninth drawing is a cross-sectional view of the identification copper foil having the connection portion of the present invention when a plurality of circuit boards are stacked.
1‧‧‧電路板 1‧‧‧ boards
11‧‧‧預留區域 11‧‧‧ Reserved area
12‧‧‧電路區域 12‧‧‧Circuit area
13‧‧‧辨識銅箔 13‧‧‧ Identification copper foil
131‧‧‧導電部 131‧‧‧Electrical Department
132‧‧‧阻值部 132‧‧‧ Resistance Department
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106100406A TWI608774B (en) | 2017-01-06 | 2017-01-06 | resistance identification method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106100406A TWI608774B (en) | 2017-01-06 | 2017-01-06 | resistance identification method |
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| Publication Number | Publication Date |
|---|---|
| TWI608774B true TWI608774B (en) | 2017-12-11 |
| TW201826894A TW201826894A (en) | 2018-07-16 |
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|---|---|---|---|
| TW106100406A TWI608774B (en) | 2017-01-06 | 2017-01-06 | resistance identification method |
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| TW (1) | TWI608774B (en) |
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|---|---|---|---|---|
| US20080042701A1 (en) * | 2006-07-24 | 2008-02-21 | Raphael Weiss | Resistor/Capacitor Based Identification Detection |
| TW201017199A (en) * | 2008-10-30 | 2010-05-01 | Pegatron Corp | Testing system for circuit board with light-emitting element and testing method thereof |
| TW201314439A (en) * | 2011-09-21 | 2013-04-01 | Giga Byte Tech Co Ltd | Inspection method of circuit board and inspection system thereof |
| CN203414559U (en) * | 2013-09-05 | 2014-01-29 | 天津东海理化汽车部件有限公司 | Integrated circuit board recognizer |
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2017
- 2017-01-06 TW TW106100406A patent/TWI608774B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080042701A1 (en) * | 2006-07-24 | 2008-02-21 | Raphael Weiss | Resistor/Capacitor Based Identification Detection |
| TW201017199A (en) * | 2008-10-30 | 2010-05-01 | Pegatron Corp | Testing system for circuit board with light-emitting element and testing method thereof |
| TW201314439A (en) * | 2011-09-21 | 2013-04-01 | Giga Byte Tech Co Ltd | Inspection method of circuit board and inspection system thereof |
| CN203414559U (en) * | 2013-09-05 | 2014-01-29 | 天津东海理化汽车部件有限公司 | Integrated circuit board recognizer |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201826894A (en) | 2018-07-16 |
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