CN205249636U - To accuracy detection module between multilayer PCB layer - Google Patents

Abstract

The utility model provides a multi-layer PCB inter-layer alignment detection module, which includes a plurality of circuit groups, and the plurality of circuit groups are respectively printed on the same position on each layer of the core board in the multi-layer PCB board. After overlapping; each line group includes 4 line modules, and the 4 line modules are respectively printed on the edge of the positioning holes at the four corners of the PCB core board process side, and each line module includes an adjacent horizontal line group and A group of vertical lines, the group of horizontal lines includes a plurality of parallel horizontal lines, and the group of vertical lines includes a plurality of parallel vertical lines. The utility model has a simple structure and is easy to implement. After the PCB is laminated, the detection module is micro-sliced and sampled, and the alignment value between layers can be accurately read through a microscope.

Description

A multilayer PCB interlayer alignment detection module

technical field

The utility model relates to the field of multilayer PCB board detection, in particular to a multilayer PCB interlayer alignment detection module.

Background technique

Multi-layer PCB consists of multi-layer lines and dielectric layers. The number of layers ≥ 4L is a multi-layer board. When the number of layers ≥ 6L, it is a combination of multiple core boards and PP. The alignment between the lines of each layer is generally required to be within Within 4mil, if it exceeds, the problem of inner opening or inner short will occur and the PCB will be scrapped.

For the detection of interlayer alignment, the commonly used detection methods are frontal concentric ring X-Ray measurement and micro-section detection method, and a conductive detection module is also designed. The existing problems are as follows:

1. X-Ray detection method: the result of the concentric circle test is inaccurate, which may easily lead to misjudgment;

2. Micro-section detection method: The result of micro-section detection is accurate, but it is difficult to find the position where sampling is required in the PCB board;

3. Conductivity detection module:

a. The more layers there are, the larger the edge space needs to be occupied;

b. It can detect the stratum of stratum deviation, and the measured data can only be used as a reference, but the actual stratum deviation value cannot be known.

Utility model content

In order to solve the above problems, the utility model provides a multilayer PCB interlayer alignment detection module, including a plurality of circuit groups, and the plurality of circuit groups are respectively printed on the same position on each core board of the multilayer PCB board , overlapping after the core board is laminated; each line group includes 4 line modules, and the 4 line modules are respectively printed on the positioning holes at the four corners of the PCB core board process side, and each line module includes adjacent A group of horizontal lines and a group of vertical lines, the group of horizontal lines includes a plurality of parallel horizontal lines, and the group of vertical lines includes a plurality of parallel vertical lines.

Preferably, the lengths of the horizontal lines and the vertical lines are 8 to 12 mm.

Preferably, the horizontal and vertical lines have a width of 0.08 to 0.12 mm.

Preferably, the group of horizontal lines includes 3 to 5 horizontal lines, and the group of vertical lines includes 3 to 5 vertical lines.

The utility model has a simple structure and is easy to implement. After the PCB is pressed and bonded, the detection module is micro-sliced and sampled, and the alignment value between layers can be accurately read through a microscope.

Description of drawings

FIG. 1 is a schematic diagram of a multilayer PCB interlayer alignment detection module.

Fig. 2 is a schematic diagram of circuit groups on a single-layer core board.

detailed description

In order to facilitate the understanding of those skilled in the art, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments.

As shown in Figure 1, a multilayer PCB interlayer alignment detection module provided by the utility model includes 4 circuit groups 2, and the 4 circuit groups 2 are respectively printed on a multilayer PCB board with 4 layers The same position on the core board 1 of each layer overlaps after the core board 1 is laminated; as shown in Figure 2, on the core board 1, the line group 2 includes 4 line modules 21, and the 4 line modules 21 are Printed on the positioning holes 13 at the four corners of the process side 12 around the molding area 11 of the core board 1, each line module 21 includes an adjacent horizontal line group 22 and a vertical line group 23, the horizontal line group 22 includes 3 parallel horizontal lines, and the vertical line group 23 includes 3 parallel vertical lines, the length of the horizontal lines and the vertical lines is 10 mm, and the width is 0.1 mm.

The above is the specific implementation of the utility model, and its description is more specific and detailed, but it should not be understood as a limitation of the patent scope of the utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present utility model, and these obvious replacement forms all belong to the protection scope of the present utility model.

Claims (4)

1. a multi-layer PCB level to level alignment degree detection module, is characterized in that: comprise multiple sets of lines, described multiple sets of lines are printed in respectively the same position on every layer of central layer in multi-layer PCB board, overlapping after central layer pressing; Each sets of lines comprises 4 line modules, described 4 line modules are printed in respectively on the locating hole limit at four angles of PCB central layer technique edges, each line module comprises adjacent a horizontal line group and a vertical line group, described horizontal line group comprises many parallel horizontal lines, and described vertical line group comprises many parallel vertical lines.

2. according to multi-layer PCB level to level alignment degree detection module described in claim 1, it is characterized in that: the length of described horizontal line and vertical line is 8 to 12 millimeters.

3. according to multi-layer PCB level to level alignment degree detection module described in claim 1, it is characterized in that: the width of described horizontal line and vertical line is 0.08 to 0.12 millimeter.

4. according to multi-layer PCB level to level alignment degree detection module described in claim 1, it is characterized in that: described horizontal line group comprises 3 to 5 horizontal lines, described vertical line group comprises 3 to 5 vertical lines.