CN203015276U - HDI printed circuit board having blind-hole deviation detecting structure - Google Patents
HDI printed circuit board having blind-hole deviation detecting structure Download PDFInfo
- Publication number
- CN203015276U CN203015276U CN 201220724507 CN201220724507U CN203015276U CN 203015276 U CN203015276 U CN 203015276U CN 201220724507 CN201220724507 CN 201220724507 CN 201220724507 U CN201220724507 U CN 201220724507U CN 203015276 U CN203015276 U CN 203015276U
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- blind hole
- normal detection
- circuit board
- detection module
- printed circuit
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- 238000001514 detection method Methods 0.000 claims abstract description 69
- 239000000203 mixture Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
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Abstract
The utility model discloses an HDI printed circuit board having a blind-hole deviation detecting structure. The HDI printed circuit board contains a circuit board body with blind holes which are intervally overlapped up and down at four corners respectively, and a first deviation detecting module and a second deviation detecting module which are arranged respectively corresponding to each layer of the blind holes. The first deviation detecting module and the second deviation detecting module are both composed of pads arranged at two ends of the top of the blind holes, pads disposed at the bottom of the blind holes, a first detection via hole connected with the pads on the top of the blind holes and a second detection via hole connected with the pads on the bottom of the blind holes. The HDI printed circuit board provided by the utility model is designed simply, is very convenient in production and actual application, and can be used to detect deviation of the blind holes for via-filling plating and the pads on the top in any direction and in arbitrary order and rapidly and efficiently obtain the maximum deviation in the whole batch of boards. Therefore, products with unqualified registration are effectively prevented from entering the market.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB), particularly relates to a kind of HDI printed circuit board (PCB) with blind hole off normal detection architecture.
Background technology
The development of existing miniaturization along with electronic product, high performance, multifunction and high-frequency high-speed, promoted to promote rapidly with densification, the meticulous HDI manufacturing technology that turns to characteristics, cause the blind hole exponent number of PCB design more and more higher, the off normal of high-order HDI printed circuit board (PCB) " blind hole and its top pads " is controlled more and more important.The conventional slicing mode of general employing detects HDI printed circuit board (PCB) off normal now, quantity of sampling quantity is limited, efficient is low owing to cutting into slices, its testing result is often representative relatively poor, be difficult to realize the off normal situation of plate is by the gross detected or adds up, thereby can't obtain fast and efficiently by the gross " blind hole and top pads " off normal maximum in plate, cause like this " blind hole and the top pads " of some product Aligning degree is defective but still coming into the market, bring serious hidden danger for the aspects such as reliability, signal integrity of HDI plate.
The utility model content
Based on this, for the problems referred to above, the utility model proposes a kind of HDI printed circuit board (PCB) with blind hole off normal detection architecture.
The technical solution of the utility model is: a kind of HDI printed circuit board (PCB) with blind hole off normal detection architecture, comprise four jiaos of circuit board bodies that are respectively equipped with up and down interval overlapping blind hole, also comprise corresponding every layer of the first off normal detection module and second off normal detection module that blind hole arranges respectively, the first off normal detection module with the second off normal detection module by the pad of being located at two ends, blind hole top, be located at the pad of blind hole bottom, the first the second detection via composition that detects via and be connected with the blind hole bottom land that is connected with the blind hole top pads.
When carrying out the detection of blind hole off normal, pad and the blind hole of two ends, the blind hole top design on the circuit board body are overlapping, overlapping size can be 0.4mil, 0.8mil, 1.2mil, 1.6mil, 1.8mil, 2.2mil, 2.6mil, 3mil, use universal instrument or electric logging equipment, one end connects first and detects via, the other end connects second and detects via, by as signal, measuring the situation of blind hole and top pads off normal take " open circuit or short circuit ".
In a preferred embodiment, described the first off normal detection module and the second off normal detection module are and are set up in parallel.
In a preferred embodiment, the pad of being located at two ends, blind hole top of described the first off normal detection module and the second off normal detection module all is fixed on described circuit board body.
In a preferred embodiment, the pad of being located at two ends, blind hole top of described the first off normal detection module and the second off normal detection module is oblong pad or semicircular ring pad.
In a preferred embodiment, the pad of being located at two ends, blind hole top of described the first off normal detection module and the second off normal detection module and the overlapping 0.4mil-4mil of blind hole.
In a preferred embodiment, the distance at described the first off normal detection module and the second off normal detection module described circuit board body of distance edge is 5mm-10mm.
The beneficial effects of the utility model are: the simplicity of design of off normal detection architecture, more convenient in the production practical application, can detect any direction, arbitrary order " blind hole and the top pads of plating filling perforation " off normal, also can obtain quickly and efficiently the maximum of its off normal in plate by the gross, effectively avoid the underproof product of Aligning degree to come into the market.
Description of drawings
Fig. 1 is the structural representation of the described HDI printed circuit board (PCB) of the utility model embodiment;
Fig. 2 is the overlay structure schematic diagram of blind hole and pad in the utility model embodiment;
Fig. 3 is the cutaway view of the first off normal detection module in the utility model embodiment;
Fig. 4 is the vertical view of the first off normal detection module in the utility model embodiment;
Fig. 5 is the cutaway view of the second off normal detection module in the utility model embodiment;
Fig. 6 is the vertical view of the second off normal detection module in the utility model embodiment;
Description of reference numerals:
10-circuit board body, the 20-blind hole, 30-the first off normal detection module, 40-the second off normal detection module, the 50-pad, 60-first detects via, and 70-second detects via.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated.
Embodiment:
Arrive shown in Figure 6 as Fig. 1, a kind of HDI printed circuit board (PCB) with blind hole off normal detection architecture comprises that four jiaos are respectively equipped with the circuit board body 10 of up and down interval overlapping blind hole 20, corresponding every layer of the first off normal detection module 30 and second off normal detection module 40 that blind hole 20 arranges respectively.The first off normal detection module 30 and the second off normal detection module 40 by the pad 50 of being located at blind hole 20 two ends, top, be located at blind hole 20 bottoms pad 50, be connected with blind hole 20 top pads 50 first detect via 60 and be connected with blind hole 20 bottom land 50 second detect via 70 compositions.
In the present embodiment, described the first off normal detection module 30 and the second off normal detection module 40 are and are set up in parallel.The pad 50 of being located at blind hole 20 two ends, top of described the first off normal detection module 30 and the second off normal detection module 40 all is fixed on described circuit board body 10.The pad 50 of being located at blind hole 20 two ends, top of described the first off normal detection module 30 and the second off normal detection module 40 is oblong pad 50 or semicircular ring pad 50.The pad 50 and the overlapping 0.4mil-4mil of blind hole 20 of being located at blind hole 20 two ends, top of described the first off normal detection module 30 and the second off normal detection module 40.Described the first off normal detection module 30 and the second off normal detection module 40 are 5mm-10mm apart from the distance at described circuit board body 10 edges.
In the present embodiment, the blind hole 20 of certain layer is overlapping with top pads 50, and is connected with the first detection via 60 and the second detection via 70 respectively, forms the design module that detects " blind hole 20 and top pads 50 " off normal; By the tie point of the different via of electrical measurement, open circuit or short circuit are signal, determine the size and Orientation of " blind hole 20 and top pads 50 " off normal.Can design with overlapping top pads 50 parts of blind hole 20 is oblong pad 50 and 50 two kinds of shapes of semicircular ring pad.The off normal detection design that the HDI printed circuit board (PCB) " is electroplated the blind hole 20 and top pads 50 of filling perforation ", the module of design is any single blind hole 20 and the overlapping 0.4mil-3mil of top pads 50, or 1 rank, any two blind hole 20(two blind hole 20 interval do not make blind hole 20) and the overlapping 0.4mil-4mil of top pads 50.
When carrying out blind hole 20 off normals detection, the pad 50 of blind hole 20 two ends, the top designs on circuit board body 10 is overlapping with blind hole 20, overlapping size can be 0.4mil, 0.8mil, 1.2mil, 1.6mil, 1.8mil, 2.2mil, 2.6mil, 3mil, use universal instrument or electric logging equipment, one end connects first and detects via 60, the other end connects second and detects via 70, by take " open circuit or short circuit " as signal, just can measure the blind hole 20 of certain layer and the situation of top pads 50 off normals.
The above embodiment has only expressed embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.Should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (6)
1. HDI printed circuit board (PCB) with blind hole off normal detection architecture, comprise four jiaos of circuit board bodies that are respectively equipped with up and down interval overlapping blind hole, it is characterized in that, also comprise corresponding every layer of the first off normal detection module and second off normal detection module that blind hole arranges respectively, the first off normal detection module with the second off normal detection module by the pad of being located at two ends, blind hole top, be located at the pad of blind hole bottom, the first the second detection via composition that detects via and be connected with the blind hole bottom land that is connected with the blind hole top pads.
2. the HDI printed circuit board (PCB) with blind hole off normal detection architecture according to claim 1, is characterized in that, described the first off normal detection module and the second off normal detection module are and are set up in parallel.
3. the HDI printed circuit board (PCB) with blind hole off normal detection architecture according to claim 1, is characterized in that, the pad of being located at two ends, blind hole top of described the first off normal detection module and the second off normal detection module all is fixed on described circuit board body.
4. the HDI printed circuit board (PCB) with blind hole off normal detection architecture according to claim 3, is characterized in that, the pad of being located at two ends, blind hole top of described the first off normal detection module and the second off normal detection module is oblong pad or semicircular ring pad.
5. according to claim 1 or 4 described HDI printed circuit board (PCB)s with blind hole off normal detection architecture, is characterized in that, the pad of being located at two ends, blind hole top of described the first off normal detection module and the second off normal detection module and the overlapping 0.4mil-4mil of blind hole.
6. the HDI printed circuit board (PCB) with blind hole off normal detection architecture according to claim 1, is characterized in that, described the first off normal detection module and the second off normal detection module are 5mm-10mm apart from the distance at described circuit board body edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220724507 CN203015276U (en) | 2012-12-25 | 2012-12-25 | HDI printed circuit board having blind-hole deviation detecting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220724507 CN203015276U (en) | 2012-12-25 | 2012-12-25 | HDI printed circuit board having blind-hole deviation detecting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203015276U true CN203015276U (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220724507 Expired - Fee Related CN203015276U (en) | 2012-12-25 | 2012-12-25 | HDI printed circuit board having blind-hole deviation detecting structure |
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| CN (1) | CN203015276U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244590A (en) * | 2014-08-28 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Control method of outer layer deviation of circuit boards |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN105430945A (en) * | 2015-11-24 | 2016-03-23 | 梅州市志浩电子科技有限公司 | HDI circuit board blind hole deviation fool-proof testing method |
| CN113163591A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | HDI blind hole board test structure and HDI blind hole board |
| CN113163592A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | Visual blind hole deviation detection structure and printed circuit board |
| CN114190016A (en) * | 2022-02-16 | 2022-03-15 | 四川英创力电子科技股份有限公司 | System for finely detecting multilayer circuit board layer deviation and detection method thereof |
| CN114599171A (en) * | 2022-03-16 | 2022-06-07 | 湖南金康电路板有限公司 | Laser blind hole deviation testing method for high-order HDI |
| CN114755557A (en) * | 2022-03-31 | 2022-07-15 | 金禄电子科技股份有限公司 | HDI circuit board, tool and check out test set that detect HDI circuit board |
-
2012
- 2012-12-25 CN CN 201220724507 patent/CN203015276U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244590A (en) * | 2014-08-28 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Control method of outer layer deviation of circuit boards |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN105430945A (en) * | 2015-11-24 | 2016-03-23 | 梅州市志浩电子科技有限公司 | HDI circuit board blind hole deviation fool-proof testing method |
| CN105430945B (en) * | 2015-11-24 | 2018-11-20 | 梅州市志浩电子科技有限公司 | HDI blind holes of circuit board deviation fool proof test method |
| CN113163592B (en) * | 2021-04-25 | 2023-08-22 | 东莞市五株电子科技有限公司 | Blind hole deviation detection structure capable of being visualized and printed circuit board |
| CN113163591A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | HDI blind hole board test structure and HDI blind hole board |
| CN113163592A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | Visual blind hole deviation detection structure and printed circuit board |
| CN113163591B (en) * | 2021-04-25 | 2023-08-22 | 东莞市五株电子科技有限公司 | HDI blind hole board test structure and HDI blind hole board |
| CN114190016A (en) * | 2022-02-16 | 2022-03-15 | 四川英创力电子科技股份有限公司 | System for finely detecting multilayer circuit board layer deviation and detection method thereof |
| CN114190016B (en) * | 2022-02-16 | 2022-04-22 | 四川英创力电子科技股份有限公司 | System for finely detecting multilayer circuit board layer deviation and detection method thereof |
| CN114599171A (en) * | 2022-03-16 | 2022-06-07 | 湖南金康电路板有限公司 | Laser blind hole deviation testing method for high-order HDI |
| CN114599171B (en) * | 2022-03-16 | 2024-08-06 | 湖南金康电路板有限公司 | High-order HDI laser blind hole deviation testing method |
| CN114755557A (en) * | 2022-03-31 | 2022-07-15 | 金禄电子科技股份有限公司 | HDI circuit board, tool and check out test set that detect HDI circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20201225 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |