TWI582799B - Metal plate micro resistance - Google Patents

Description

Metal plate micro resistance

The invention relates to a metal plate micro-resistor, in particular to a process process which is simpler, can reduce manufacturing cost, has better heat dissipation effect, and can provide a metal plate micro-resistor with more accurate stable resistance value and higher load power.

Metal plate metal resistors are often used in electronic devices as current sensing resistors, so they must have low resistance, low temperature coefficient and high stability; only when the metal plate micro-resistor is used In a high current environment, the surface temperature is easily increased, so that the resistance value is easily changed to drift, and it is impossible to provide an accurate and stable resistance value, and the load power cannot be increased.

The certificate number I434299 discloses a metal plate micro-resistor having a heat dissipation effect, and the metal plate micro-resistor 10 (shown in FIG. 1) comprises a metal plate resistance body 11 having a predetermined resistance value, and a metal plate resistance body 11 An electrode 12 is formed by electroforming copper, and a conductive buffer layer 13 is formed on the metal plate resistor body 11 and an insulating wall 14 is formed on the end, and then the conductive buffer layer 13 on both sides of the insulating wall 14 is respectively The heat-conducting layer 15 is formed by electroforming into a thermally conductive layer 15 , and the two heat-conducting layers 15 are respectively connected to the adjacent electrodes 12 , and the two heat-conducting layers 15 and the two electrodes 12 are respectively formed. The heat conduction path is such that the surface temperature of the metal plate resistor body 11 can be respectively transmitted to the copper foil circuit 21 of the PCB circuit board 20 through the two heat conducting layers 15 and the two electrodes 12 to achieve heat dissipation.

Although the metal plate micro-resistor 10 of the above patent can achieve the heat dissipation effect, before the metal heat conduction layer 15 is electroformed, a conductive buffer layer 13 and an insulating wall 14 must be formed on the metal plate resistance body 11 before The two heat conductive layers 15 are formed on the conductive buffer layer 13 by electroforming copper, so that the manufacturing process is rather cumbersome and the manufacturing cost is increased. Further, the conductive buffer layer 13 is only a film shape, and is easily formed in the electroforming. The heat-conducting layer 15 is damaged during the process, and the product defect rate is increased. In particular, the surface temperature of the metal plate resistor body 11 must be conducted to the electrode 12 via the heat conducting layer 15, and then conducted to the copper foil circuit 21 of the PCB circuit board 20 by the electrode 12, so that it is obviously not directly direct in the heat conduction path, and cannot be efficiently provided. The heat dissipation of the metal plate micro-resistance makes it impossible to provide a more accurate and stable resistance value and higher load power.

The object of the present invention is to improve the defects of the above-mentioned metal plate micro-resistance, to provide a metal plate micro-microscopic which is easier to manufacture, can reduce manufacturing cost, has better heat dissipation effect, and can provide more accurate and stable resistance value and higher load power. resistance.

In order to achieve the above object, the metal plate micro-resistor of the present invention comprises a metal plate resistor body, two electrodes and at least one heat conducting sheet; wherein: the metal plate resistor body is a metal plate resistor body having a predetermined resistance value; The electroformed copper is respectively formed on the two ends of the metal plate resistor body; the heat conductive sheet is a thermal conductive metal sheet which is adhered to the bottom surface of the metal plate resistor body by a thermal conductive adhesive lamination; The heat conductive sheet can be soldered to the copper foil circuit while being soldered to the PCB circuit board with the micro-resistance of the metal plate, so that the surface temperature of the metal plate resistor body can be directly passed through the heat conductive sheet Connect the copper foil circuit to the PCB board for good heat dissipation.

<Utility Part>

10‧‧‧Metal plate micro-resistance

11‧‧‧Metal plate resistance body

12‧‧‧ electrodes

13‧‧‧buffer layer

14‧‧‧Insulated wall

15‧‧‧thermal layer

20‧‧‧PCB circuit board

21‧‧‧copper circuit

<present invention>

30‧‧‧Metal plate micro-resistance

31‧‧‧Metal plate resistance body

32‧‧‧ electrodes

33‧‧‧ Thermal sheet

34‧‧‧Adhesive layer

35‧‧‧Protective layer

40‧‧‧PCB circuit board

41‧‧‧copper circuit

Figure 1 is a cross-sectional view of a micro-resistive element disclosed in the '434 patent.

Figure 2 is a cross-sectional view showing a first embodiment of the present invention.

Figure 3 is a cross-sectional view showing a second embodiment of the present invention.

In order to more clearly understand the technical means and construction of the present invention for achieving the object, the following description of the first embodiment shown in FIG. 2 and the second embodiment shown in FIG. 3 will be further described as follows:

As shown in FIG. 2, in the first embodiment of the present invention, the metal plate micro-resistor 30 of the embodiment comprises a metal plate resistor body 31, two electrodes 32 and two heat conducting sheets 33; wherein:

The metal plate resistor body 31 (shown in Fig. 2) is a metal plate resistor body having a predetermined resistance value.

The two electrodes 32 (shown in FIG. 2) are respectively formed by electroformed copper on both ends 31 of the metal plate resistor body.

The two heat conductive sheets 33 (shown in FIG. 2) are heat conductive sheets made of a heat conductive metal material, and the two heat conductive sheets 33 are respectively pressed and adhered to the metal by an adhesive layer 34 of insulating and thermal conductivity. The board resistor body 31 has a bottom surface.

Further, (refer to FIG. 2), the two heat conducting sheets 33 and their adjacent electrodes 32 may or may not be connected together, and the two heat conducting sheets 33 must be kept at a spacing and not connected together. To avoid causing a short circuit.

Preferably, the two thermally conductive sheets 33 are selected from the group consisting of copper, tin or a metal sheet coated with a solderable material.

The metal plate micro-resistor 30 is preferably a protective layer 35 formed by coating an insulating material on the metal plate resistor body 31.

As shown in FIG. 2, when the metal plate micro-resistor 30 is implemented, it must cooperate with the soldering points of the two electrodes 32 corresponding to the copper foil circuit 41 of the PCB circuit board 40 to extend under the two heat conducting sheets 33, so that the two heat conduction The sheet 33 can be soldered to the copper foil circuit 41 while the metal plate micro-resistor 30 is soldered to the PCB circuit board 40; therefore, the surface temperature of the metal plate resistor body 31 can be directly conducted to the copper foil circuit of the PCB circuit board 40 via the heat conductive sheet 33. 41, in order to achieve good heat dissipation.

As shown in FIG. 3, in the second embodiment of the present invention, the metal plate micro-resistor 30 of the embodiment comprises a metal plate resistor body 31, two electrodes 32 and a heat conducting sheet 33; wherein:

The metal plate resistor body 31 (shown in Fig. 3) is a metal plate resistor body having a predetermined resistance value.

The two electrodes 32 (shown in FIG. 3) are respectively formed of electroformed copper on both ends 31 of the metal plate resistor body.

The heat conductive sheet 33 (shown in FIG. 3) is a heat conductive sheet made of a heat conductive metal material, and the heat conductive sheet 33 is pressed against the metal plate resistor body by an adhesive layer 34 having an insulating and thermal conductivity. 31 bottom.

Further, (refer to FIG. 3), the heat conducting sheet 33 and one of the electrodes 32 may or may not be connected together, and the other electrode 32 must be kept at a distance from each other. Avoid short circuits.

The preferred embodiment of the thermally conductive sheet 33 is selected from the group consisting of copper, tin or a surface layer package. A metal sheet covered with a solderable material.

The metal plate micro-resistor 30 is preferably a protective layer 35 formed by coating an insulating material on the metal plate resistor body 31.

As shown in FIG. 3, when the metal plate micro-resistor 30 is implemented, it must cooperate with the solder joints of the two electrodes 32 corresponding to the copper foil circuit 41 of the PCB circuit board 40 to extend under the heat conductive sheet 33, so that the heat conductive sheet 33 The metal plate micro-resistor 30 can be soldered to the copper foil circuit 41 while being soldered to the PCB circuit board 40; therefore, the surface temperature of the metal plate resistor body 31 can be directly transmitted to the copper foil circuit 41 of the PCB circuit board 40 via the heat conductive sheet 33. To achieve good heat dissipation.

As can be seen from the above description and the embodiment of the drawings, the present invention can directly conduct the surface temperature of the metal plate resistor body 30 to the copper foil circuit 41 of the PCB circuit board 40 by the heat conductive sheet 33, so as to achieve better heat dissipation. In addition, since the heat conductive sheet 33 is pressed against the bottom surface of the metal plate resistor body 31 by an adhesive layer 34, the process is relatively simple and can be reduced. The rate of non-performing occurs and the manufacturing cost is reduced. Therefore, the present invention does have significant progress, and its construction is indeed unprecedented. Cheng has already met the requirements of the invention patent, and filed a patent application according to law, and prayed for a patent for prayer.

The above descriptions are merely illustrative of the possible embodiments of the present invention, and thus the scope of the present invention should not be construed as limiting the scope of the present invention. It is still within the scope of protection covered by the present invention.

30‧‧‧Metal plate micro-resistance

31‧‧‧Metal plate resistance body

32‧‧‧ electrodes

33‧‧‧ Thermal sheet

34‧‧‧Adhesive layer

35‧‧‧Protective layer

40‧‧‧PCB circuit board

41‧‧‧copper circuit

Claims (3)

A metal plate micro-resistor comprising a metal plate resistor body, two electrodes and at least one heat conducting sheet; wherein: the metal plate resistor body is a metal plate resistor body having a predetermined resistance value; and the two electrodes are respectively electroformed copper Formed on the two ends of the metal plate resistor body; the heat conductive sheet is a thermal conductive metal sheet, which is adhered to the bottom surface of the metal plate resistor body by an adhesive lamination, and at least one end of the heat conducting sheet is kept at a gap from one of the electrodes. With the above configuration, the metal plate micro-resistor must be implemented to extend the solder joints of the two electrodes corresponding to the copper foil circuit of the PCB circuit board to the underside of the heat conductive sheet, so that the heat conductive sheet can be soldered to the PCB circuit with the micro-resistance of the metal plate. The board is soldered to the copper foil circuit at the same time. The metal plate micro-resist according to claim 1, wherein the thermal conductive sheet is selected from the group consisting of copper, tin or a metal sheet coated with a solderable material. The metal plate micro-resist according to claim 1, wherein the metal plate resistor body is coated with a protective layer formed of an insulating material.