JP2017175093A5

JP2017175093A5 -

Info

Publication number: JP2017175093A5
Application number: JP2016062870A
Authority: JP
Filing date: 2016-03-25
Publication date: 2019-04-18

Description

また、本技術に係る電子部品の設計方法は、基板と、上記基板の一面側に設けられ、複数の電極が配列された電極領域と、上記電極が形成されていない非電極領域とを備え、上記非電極領域に、一又は複数の窪みを形成するものである。
また、本技術に係る接続体の製造方法は、第１の電子部品と第２の電子部品とを異方性導電接着剤を介して接続する接続体の製造方法において、上記第１の電子部品と上記第２の電子部品の少なくとも一方は、上記記載の電子部品である。 Further, a method of designing an electronic component according to the present technology includes a substrate, an electrode region provided on one surface side of the substrate, in which a plurality of electrodes are arranged, and a non-electrode region in which the electrodes are not formed. One or more depressions are formed in the non-electrode area.
Further, a method of manufacturing a connector according to the present technology is a method of manufacturing a connector in which a first electronic component and a second electronic component are connected via an anisotropic conductive adhesive. And at least one of the second electronic component is the electronic component described above.

Claims

A substrate, an electrode region provided on one surface side of the substrate, in which a plurality of electrodes are arranged, and a non-electrode region in which the electrode is not formed.
The electronic component by which one or several hollow is formed in the said non-electrode area | region.

In the electrode region, the electrodes are arranged along one side and the other side of a pair of opposing side edges of the substrate,
The electronic component according to claim 1, wherein the recess is formed in parallel with a pair of opposing side edges of the substrate.

The electronic component according to claim 1, wherein the recess is formed in a groove shape.

The electronic component according to claim 3, wherein the recess is a linear groove.

The substrate is formed in a rectangular shape,
The electronic component according to any one of claims 1 to 4, wherein the recess is present along the longitudinal direction of the substrate.

The electronic component according to any one of claims 1 to 5, wherein the electronic component is an IC chip.

The electronic component according to claim 6, wherein the recess faces a side surface of the substrate.

In a connection body in which a first electronic component and a second electronic component are connected via an anisotropic conductive adhesive,
At least one of the electronic components is
A substrate, an electrode region provided on one surface side of the substrate connected to the circuit substrate, in which a plurality of electrodes are arranged, and a non-electrode region in which the electrode is not formed.
A connection body in which one or more depressions into which the anisotropic conductive adhesive flows are formed in the non-electrode area.

The connector according to claim 8, wherein the anisotropic conductive adhesive is a binder resin in which conductive particles are independently present without contact with each other.

In the anisotropic conductive adhesive, a conductive adhesive layer containing conductive particles and an insulating adhesive layer not containing the conductive particles are laminated, and the conductive adhesive layer side is the above. The connector according to claim 8, which is attached to one surface of the substrate.

The connection body according to claim 10, wherein the conductive adhesive layer is arranged independently of the conductive particles.

In a method of designing an electronic component, comprising: a substrate, an electrode region provided on one surface side of the substrate, in which a plurality of electrodes are arranged, and a non-electrode region in which the electrodes are not formed,
The design method of the electronic component which forms one or several hollow in the said non-electrode area | region.

In a method of manufacturing a connection body in which a first electronic component and a second electronic component are connected via an anisotropic conductive adhesive,
The method of manufacturing a connector, wherein at least one of the first electronic component and the second electronic component is the electronic component according to any one of claims 1 to 7.