TWI580724B - Composition for etching mask and pattern forming method - Google Patents
Composition for etching mask and pattern forming method Download PDFInfo
- Publication number
- TWI580724B TWI580724B TW101143091A TW101143091A TWI580724B TW I580724 B TWI580724 B TW I580724B TW 101143091 A TW101143091 A TW 101143091A TW 101143091 A TW101143091 A TW 101143091A TW I580724 B TWI580724 B TW I580724B
- Authority
- TW
- Taiwan
- Prior art keywords
- mask
- composition
- pattern
- etching
- printing
- Prior art date
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011267390 | 2011-12-06 | ||
JP2012230129A JP6068085B2 (ja) | 2011-12-06 | 2012-10-17 | エッチングマスク用組成物およびパターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201339236A TW201339236A (zh) | 2013-10-01 |
TWI580724B true TWI580724B (zh) | 2017-05-01 |
Family
ID=49038116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101143091A TWI580724B (zh) | 2011-12-06 | 2012-11-19 | Composition for etching mask and pattern forming method |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6068085B2 (ja) |
TW (1) | TWI580724B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116426170B (zh) * | 2022-01-04 | 2024-12-27 | 新应材股份有限公司 | 树脂组成物、抗蚀刻层以及蚀刻方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200937127A (en) * | 2007-11-12 | 2009-09-01 | Rohm & Haas Elect Mat | Coating compositions for use with an overcoated photoresist |
TW201042384A (en) * | 2009-04-24 | 2010-12-01 | Nippon Steel Chemical Co | Photosensitive resin composition, cured film, and seperator |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH063802B2 (ja) * | 1986-02-24 | 1994-01-12 | 富士写真フイルム株式会社 | 半導体基板表面保護剤 |
JP2507936B2 (ja) * | 1986-09-18 | 1996-06-19 | 日本合成ゴム株式会社 | 集積回路の製造方法 |
JPH0813948B2 (ja) * | 1988-05-18 | 1996-02-14 | 東洋インキ製造株式会社 | 印刷インキ |
JP3214175B2 (ja) * | 1993-07-19 | 2001-10-02 | ジェイエスアール株式会社 | 保護膜材料溶液 |
JP2004029840A (ja) * | 2003-07-24 | 2004-01-29 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト組成物、感光性膜付基板およびレジストパターンの形成方法 |
JP2007505487A (ja) * | 2003-09-09 | 2007-03-08 | シーエスジー ソーラー アクチェンゲゼルシャフト | 有機樹脂材料に開口部を形成する方法の改良 |
DE102005039479B3 (de) * | 2005-08-18 | 2007-03-29 | Infineon Technologies Ag | Halbleiterbauteil mit gedünntem Halbleiterchip und Verfahren zur Herstellung des gedünnten Halbleiterbauteils |
JP2008034543A (ja) * | 2006-07-27 | 2008-02-14 | Kyocera Corp | 光電変換素子およびその製造方法 |
JP5507039B2 (ja) * | 2007-05-28 | 2014-05-28 | AzエレクトロニックマテリアルズIp株式会社 | 高精細印刷用光硬化性インキ組成物、およびそれを用いた電子部品の製造法 |
JP2010254917A (ja) * | 2009-04-28 | 2010-11-11 | Hitachi Chem Co Ltd | レジストインキおよびそれを用いたレジストパターンの形成方法 |
MY163052A (en) * | 2009-10-30 | 2017-08-15 | Merck Patent Gmbh | Process For The Production Of Solar Cells Comprising A Selective Emitter |
-
2012
- 2012-10-17 JP JP2012230129A patent/JP6068085B2/ja not_active Expired - Fee Related
- 2012-11-19 TW TW101143091A patent/TWI580724B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200937127A (en) * | 2007-11-12 | 2009-09-01 | Rohm & Haas Elect Mat | Coating compositions for use with an overcoated photoresist |
TW201042384A (en) * | 2009-04-24 | 2010-12-01 | Nippon Steel Chemical Co | Photosensitive resin composition, cured film, and seperator |
Also Published As
Publication number | Publication date |
---|---|
JP6068085B2 (ja) | 2017-01-25 |
TW201339236A (zh) | 2013-10-01 |
JP2013140943A (ja) | 2013-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |