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TWI578123B - Detection and repairing device of additive manufacturing technology and method thereof - Google Patents

Detection and repairing device of additive manufacturing technology and method thereof Download PDF

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Publication number
TWI578123B
TWI578123B TW105126218A TW105126218A TWI578123B TW I578123 B TWI578123 B TW I578123B TW 105126218 A TW105126218 A TW 105126218A TW 105126218 A TW105126218 A TW 105126218A TW I578123 B TWI578123 B TW I578123B
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powder
detecting
repairing
workpiece
image data
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TW105126218A
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Chinese (zh)
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TW201809933A (en
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陳義諴
陳馨寶
嚴瑞雄
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東台精機股份有限公司
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Description

粉末積層製造之檢測修補裝置及其方法 Detection repairing device for powder laminate manufacturing and method thereof

本發明係關於一種檢測修補裝置及其方法,特別關於一種粉末積層製造之檢測修補裝置及其方法。 The present invention relates to a detecting and repairing apparatus and method thereof, and more particularly to a detecting and repairing apparatus for powdered layer manufacturing and a method thereof.

積層製造(Additive Manufacturing,AM)技術,也稱為加法式製造,該積層製造技術是透過從三維模型擷取出多個二維切層輪廓,並依據各個二維切層輪廓透過逐層堆積的方式加工出一工件。 Additive Manufacturing (AM) technology, also known as additive manufacturing, is a method of layer-by-layer stacking by extracting multiple 2D slice profiles from a 3D model and layering them according to each 2D slice profile. Machining a workpiece.

目前的積層製造技術主要以雷射積層製造技術為主,利用雷射熔融的方式,並根據三維模型的多個二維切層輪廓,以鋪粉機構鋪上一粉末層,再將雷射光束聚焦在該粉末層,接著熔融成形二維切層輪廓並逐層堆疊成該工件。 At present, the laminated manufacturing technology mainly focuses on the laser laminate manufacturing technology, and uses a laser melting method to deposit a powder layer with a powder coating mechanism according to a plurality of two-dimensional layer profiles of the three-dimensional model, and then the laser beam. Focusing on the powder layer, followed by melt forming a two-dimensional slice profile and stacking the workpiece layer by layer.

積層製造過程中,該工件的品質會受到雷射的功率、氣體的流場以及粉末的品質等因素的影響,導致該粉末層產生缺陷,例如鋪粉狀況不佳、工件翹曲,以及工件的表面形成凸起或凹陷等。然而,目前雷射積層製造技術的設備缺乏修正上述缺陷的機構,使得工件的良率,以及該工件的品質無法有效的提高。 In the laminated manufacturing process, the quality of the workpiece is affected by factors such as the power of the laser, the flow field of the gas, and the quality of the powder, resulting in defects in the powder layer, such as poor powdering, warpage of the workpiece, and workpiece The surface forms protrusions or depressions and the like. However, the current equipment for laser laminate manufacturing technology lacks a mechanism for correcting the above defects, so that the yield of the workpiece and the quality of the workpiece cannot be effectively improved.

故,有必要提供改良的一種粉末積層製造之檢測修補裝置 及其方法,以解決習用技術所存在的問題。 Therefore, it is necessary to provide an improved detection and repair device for powder lamination manufacturing. And its methods to solve the problems of conventional technology.

本發明主要之一目的在於提供一種粉末積層製造之檢測修補方法,利用對鋪粉後影像資料及熔融後影像資料進行檢測,可有效的判斷各種缺陷,並提高工件的品質。 One of the main objects of the present invention is to provide a method for detecting and repairing powdered layer manufacturing, which can effectively judge various defects and improve the quality of the workpiece by detecting the image data after the powdering and the image data after melting.

本發明之另一目的在於提供一種粉末積層製造之檢測修補裝置,利用攝影機對粉床平台的檢測以及修補單元對工件進行修補,可增加工件的良率。 Another object of the present invention is to provide a detection and repairing device for powder lamination manufacturing, which can increase the yield of a workpiece by detecting the powder bed platform by the camera and repairing the workpiece by the repairing unit.

為達上述之目的,本發明提供一種粉末積層製造之檢測修補方法,用以對積層製造的一工件進行檢測及修補,該檢測修補方法包含一鋪粉步驟、一熔融步驟、一熔融檢測步驟及一熔融修補步驟;其中該鋪粉步驟是利用一鋪粉機構將一粉末鋪設在一粉床平台上;該熔融步驟是利用一雷射熔融鋪設在該粉床平台上的粉末;該熔融檢測步驟是利用一攝影機拍攝該粉床平台的一熔融後影像資料,並傳送至該控制器進行檢測;在該熔融修補步驟中,該控制器依據該熔融後影像資料的一檢測結果判斷是否驅動一加工機構修補該工件的一表面。 In order to achieve the above object, the present invention provides a method for detecting and repairing a powder laminated layer for detecting and repairing a workpiece manufactured by lamination, the detecting and repairing method comprising a powder laying step, a melting step, a melting detecting step and a melting repairing step; wherein the powdering step is to use a powder laying mechanism to lay a powder on a powder bed platform; the melting step is a powder that is melted and laid on the powder bed platform by a laser; the melting detecting step Using a camera to capture a molten image data of the powder bed platform, and transmitting it to the controller for detection; in the melting repair step, the controller determines whether to drive a processing according to a detection result of the molten image data. The mechanism repairs a surface of the workpiece.

在本發明之一實施例中,該熔融檢測步驟具有一凸起區檢測子步驟,用以檢測該熔融後影像資料的凸起區,並計算該凸起區的一位置及一尺寸。 In an embodiment of the invention, the melting detecting step has a bump detecting sub-step for detecting a raised area of the molten image data, and calculating a position and a size of the raised area.

在本發明之一實施例中,該凸起區的一亮度為該熔融後影像資料的一切層輪廓區域的一平均亮度的110%以上。 In an embodiment of the invention, a brightness of the raised area is greater than 110% of an average brightness of the contour region of the layer of the melted image data.

在本發明之一實施例中,該熔融檢測步驟另具有一凸起區 加工路徑子步驟,在該凸起區檢測子步驟之後,根據一規劃加工路徑及該凸起區的位置及尺寸計算出一凸起區加工路徑。 In an embodiment of the invention, the melting detecting step further has a raised area The processing path substep, after the bump detecting substep, calculates a bump processing path according to a planned processing path and the position and size of the raised area.

在本發明之一實施例中,在該熔融修補步驟中,利用該加工機構的多個刀具依據該凸起區加工路徑對該工件的表面進行加工。 In an embodiment of the invention, in the smelting repair step, a plurality of knives of the processing mechanism are used to machine the surface of the workpiece in accordance with the processing path of the raised portion.

在本發明之一實施例中,該熔融檢測步驟具有一凹陷區檢測子步驟,檢測該熔融後影像資料的凹陷區,並計算該凹陷區的一位置及一尺寸。 In an embodiment of the invention, the melting detecting step has a recessed area detecting sub-step of detecting the recessed area of the molten image data, and calculating a position and a size of the recessed area.

在本發明之一實施例中,該凹陷區的一亮度為該熔融後影像資料的一切層輪廓區域的平均亮度的90%以下。 In an embodiment of the invention, a brightness of the recessed area is less than 90% of an average brightness of a contoured region of all layers of the fused image data.

在本發明之一實施例中,該熔融檢測步驟另具有一凹陷區加工路徑子步驟,在該凹陷區檢測子步驟之後,根據一規劃加工路徑及該凹陷區的位置及尺寸計算出一凹陷區加工路徑。 In an embodiment of the present invention, the melting detecting step further has a recessed region processing path substep, after the recessed region detecting substep, calculating a recessed region according to a planned processing path and the position and size of the recessed region Processing path.

在本發明之一實施例中,在該熔融修補步驟中,利用該加工機構的多個刀具依據該凹陷區加工路徑對該工件的表面進行擴孔,接著利用該加工機構的一雷射熔覆器對該工件的表面進行雷射熔覆。 In an embodiment of the present invention, in the melting repairing step, a plurality of tools of the processing mechanism are used to ream the surface of the workpiece according to the processing path of the recessed area, and then a laser cladding of the processing mechanism is utilized. The device performs laser cladding on the surface of the workpiece.

在本發明之一實施例中,在該鋪粉步驟之後另包含一鋪粉檢測步驟,該鋪粉檢測步驟是利用該攝影機拍攝該粉床平台的一鋪粉後影像資料,並傳送至該控制器進行檢測。 In an embodiment of the present invention, after the powdering step, a powder coating detecting step is further used to capture a post-powder image data of the powder bed platform by the camera, and transmit the image data to the control. The device is tested.

在本發明之一實施例中,該鋪粉檢測步驟具有:一鋪粉檢測子步驟,檢測該鋪粉後影像資料的一切層區域的一亮度;及一翹曲檢測子步驟,檢測該鋪粉後影像資料的一切層輪廓區域的一亮度。 In an embodiment of the present invention, the powdering detecting step has: a step of detecting a powdering test, detecting a brightness of all layer regions of the image data after the powdering; and a step of detecting a warping detecting step of detecting the powdering A brightness of the contour area of all layers of the post-image data.

在本發明之一實施例中,在該鋪粉檢測子步驟中,該鋪粉 後影像資料的一未鋪粉區為該切層區域的30%以上,則判斷鋪粉不佳。 In an embodiment of the invention, in the step of polluting the sub-step, the paving If an unpaved area of the post-image data is more than 30% of the area of the cut layer, the powdering is judged to be poor.

在本發明之一實施例中,在該翹曲檢測子步驟中,該鋪粉後影像資料的一翹曲區域為該切層輪廓區域的10%以上,則判斷該工件為翹曲。 In an embodiment of the present invention, in the warpage detecting substep, if a warped region of the image data after the powdering is 10% or more of the contour region of the layer, the workpiece is judged to be warped.

在本發明之一實施例中,在該鋪粉檢測步驟之後另包含一鋪粉修補步驟,該控制器依據該鋪粉後影像資料的一檢測結果判斷是否鋪粉或排除一鋪粉缺陷。 In an embodiment of the present invention, after the powdering detecting step, a powder coating repairing step is further included, and the controller determines whether to lay powder or exclude a powdering defect according to a detection result of the powdered image data.

為達上述之目的,本發明另提供一種粉末積層製造之檢測修補裝置,用以對積層製造的一工件進行檢測及修補,該檢測修補裝置包含一粉床單元、一修補單元及一檢測單元;其中該粉床單元具有一粉床平台、一鋪粉機構及一雷射,該粉床平台用以形成該工件,該鋪粉機構設置在該粉床平台上,用以將一粉末鋪設在該粉床平台上,該雷射設置在該粉床平台上方,用以熔融該粉末;該修補單元具有一移動機構及一加工機構,該移動機構設置在該粉床平台上方,該加工機構安裝在該移動機構上,用以修補該工件的一表面;該檢測單元具有一攝影機及一控制器,該攝影機設置在該粉床平台上方,用以拍攝該粉床平台的一影像資料,該控制器用以接收該影像資料,並依據該影像資料判斷是否鋪粉或排除該鋪粉缺陷,或驅動該加工機構修補該工件的表面。 In order to achieve the above object, the present invention further provides a detecting and repairing device for manufacturing a powder layer for detecting and repairing a workpiece manufactured by lamination, the detecting and repairing device comprising a powder bed unit, a repairing unit and a detecting unit; Wherein the powder bed unit has a powder bed platform, a powder laying mechanism and a laser, the powder bed platform is used to form the workpiece, and the powder laying mechanism is disposed on the powder bed platform for laying a powder on the The powder bed platform is disposed above the powder bed platform for melting the powder; the repairing unit has a moving mechanism and a processing mechanism, and the moving mechanism is disposed above the powder bed platform, and the processing mechanism is installed on the The moving mechanism is configured to repair a surface of the workpiece; the detecting unit has a camera and a controller, and the camera is disposed above the powder bed platform for capturing an image data of the powder bed platform, and the controller uses Receiving the image data, and determining whether to powder or remove the powdering defect according to the image data, or driving the processing mechanism to repair the surface of the workpiece.

在本發明之一實施例中,該移動機構具有一個二維移動平台及一個多軸並聯式機具,其中該二維移動平台設置在該粉床平台上方,該多軸並聯式機具設置在該二維移動平台上。 In an embodiment of the present invention, the moving mechanism has a two-dimensional mobile platform and a multi-axis parallel machine, wherein the two-dimensional mobile platform is disposed above the powder bed platform, and the multi-axis parallel device is disposed on the second On the mobile platform.

在本發明之一實施例中,該加工機構具有多個刀具及至少 一雷射熔覆器,其中該等刀具及雷射熔覆器可替換地安裝在該多軸並聯式機具上。 In an embodiment of the invention, the processing mechanism has a plurality of tools and at least A laser cladding, wherein the tool and laser cladding are alternatively mounted on the multi-axis parallel machine.

在本發明之一實施例中,該檢測單元另具有一雷射輪廓感測器,用以安裝在該多軸並聯式機具上,用以感測該粉床平台的一輪廓。 In an embodiment of the invention, the detecting unit further has a laser contour sensor for mounting on the multi-axis parallel machine for sensing a contour of the powder bed platform.

如上所述,透過該攝影機拍攝該鋪粉後影像資料及該熔融後影像資料,接著由該控制器對該鋪粉後影像資料及該熔融後影像資料進行檢測,並且判斷是否存在各種缺陷以及區分各種缺陷,最後再由該控制器判斷是否鋪粉或排除該鋪粉缺陷,或驅動該加工機構修補該工件的表面,藉此增加該工件的良率、縮短作業時間及提高該工件的品質。 As described above, the image data and the fused image data are captured by the camera, and then the controller scans the powdered image data and the fused image data, and determines whether there are various defects and distinctions. Various defects are finally determined by the controller to determine whether to lay out the powder or to eliminate the powder coating defect, or to drive the processing mechanism to repair the surface of the workpiece, thereby increasing the yield of the workpiece, shortening the working time, and improving the quality of the workpiece.

100‧‧‧檢測修補裝置 100‧‧‧Detection repairing device

101‧‧‧工件 101‧‧‧Workpiece

102‧‧‧刀具盒 102‧‧‧Tool box

2‧‧‧粉床單元 2‧‧‧Flour bed unit

21‧‧‧粉床平台 21‧‧‧Powder bed platform

22‧‧‧鋪粉機構 22‧‧‧Powdering mechanism

23‧‧‧雷射 23‧‧‧Laser

24‧‧‧供粉器 24‧‧‧Powder

3‧‧‧修補單元 3‧‧‧Repair unit

31‧‧‧移動機構 31‧‧‧Mobile agencies

311‧‧‧二維移動平台 311‧‧‧Two-dimensional mobile platform

312‧‧‧多軸並聯式機具 312‧‧‧Multi-axis parallel machine

313‧‧‧移動座 313‧‧‧Mobile seat

32‧‧‧加工機構 32‧‧‧Processing institutions

320‧‧‧主軸 320‧‧‧ Spindle

321‧‧‧刀具 321‧‧‧Tools

322‧‧‧雷射熔覆器 322‧‧‧Laser Cladding

323‧‧‧置換接頭 323‧‧‧ Replacement joint

4‧‧‧檢測單元 4‧‧‧Detection unit

41‧‧‧攝影機 41‧‧‧ camera

42‧‧‧控制器 42‧‧‧ Controller

43‧‧‧雷射輪廓感測器 43‧‧‧Laser contour sensor

5‧‧‧圖檔切層 5‧‧‧Map file layer

A1‧‧‧切層區域 A1‧‧‧Cleaved area

A2‧‧‧切層輪廓區域 A2‧‧‧Cleaved contour area

C1‧‧‧規劃加工路徑 C1‧‧‧ Planning processing path

C2‧‧‧加工區域 C2‧‧‧Processing area

X‧‧‧X軸方向 X‧‧‧X-axis direction

Y‧‧‧Y軸方向 Y‧‧‧Y-axis direction

S201‧‧‧鋪粉步驟 S201‧‧‧Powdering steps

S202‧‧‧鋪粉檢測步驟 S202‧‧‧Powder testing steps

S202a‧‧‧鋪粉檢測子步驟 S202a‧‧‧Powder detection substep

S202b‧‧‧翹曲檢測子步驟 S202b‧‧‧ warpage detection substep

S203‧‧‧鋪粉修補步驟 S203‧‧‧Powder repairing steps

S204‧‧‧熔融步驟 S204‧‧‧ Melting step

S205‧‧‧熔融檢測步驟 S205‧‧‧ Melting test step

S205a‧‧‧凸起區檢測子步驟 S205a‧‧‧ raised area detection substep

S205b‧‧‧凹陷區檢測子步驟 S205b‧‧‧Recessed area detection substep

S205c‧‧‧凸起區加工路徑子步驟 S205c‧‧‧ Raised area processing path substep

S205d‧‧‧凹陷區加工路徑子步驟 S205d‧‧‧ Sub-step of processing path in recessed area

S206‧‧‧熔融修補步驟 S206‧‧‧melting repair steps

第1圖是本發明粉末積層製造之檢測修補裝置的一較佳實施例的一立體圖;第2圖是本發明粉末積層製造之檢測修補裝置的一較佳實施例的一側視圖;第3圖是本發明粉末積層製造之檢測修補裝置的另一較佳實施例的一側視圖;第4圖是本發明粉末積層製造之檢測修補方法的一較佳實施例的一流程圖;第5圖是本發明粉末積層製造之檢測修補方法的一較佳實施例中的圖檔切層的一示意圖;第6圖是本發明粉末積層製造之檢測修補方法的一較佳實施例中定義 的切層區域及切層輪廓區域的一示意圖;第7圖是本發明粉末積層製造之檢測修補方法的一較佳實施例中的加工路徑規劃的一示意圖;及第8圖是本發明粉末積層製造之檢測修補方法的一較佳實施例中的加工區域的一示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a preferred embodiment of the detecting and repairing device for powder layer manufacturing of the present invention; and Fig. 2 is a side view showing a preferred embodiment of the detecting and repairing device for powder laminated manufacturing of the present invention; It is a side view of another preferred embodiment of the detecting and repairing device for powder laminated manufacturing of the present invention; and FIG. 4 is a flow chart of a preferred embodiment of the detecting and repairing method for powder laminated manufacturing of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 6 is a schematic view showing a cut layer of a pattern in a preferred embodiment of the method for detecting a repair of a powdered layer of the present invention; and FIG. 6 is a definition of a preferred embodiment of the method for detecting and repairing a powdered layer of the present invention. FIG. 7 is a schematic view showing a processing path plan in a preferred embodiment of the method for detecting and repairing a powder laminated layer of the present invention; and FIG. 8 is a powder layer of the present invention; A schematic representation of a processing region in a preferred embodiment of the method of detecting a repair.

為了讓本發明之上述及其他目的、特徵、優點能更明顯易懂,下文將特舉本發明較佳實施例,並配合所附圖式,作詳細說明如下。再者,本發明所提到的方向用語,例如上、下、頂、底、前、後、左、右、內、外、側面、周圍、中央、水平、橫向、垂直、縱向、軸向、徑向、最上層或最下層等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明及理解本發明,而非用以限制本發明。 The above and other objects, features and advantages of the present invention will become more <RTIgt; Furthermore, the directional terms mentioned in the present invention, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, side, surrounding, central, horizontal, horizontal, vertical, longitudinal, axial, Radial, uppermost or lowermost, etc., only refer to the direction of the additional schema. Therefore, the directional terminology used is for the purpose of illustration and understanding of the invention.

請參照第1、2圖所示,為本發明之粉末積層製造之檢測修補裝置的一較佳實施例,該檢測修補裝置100用以對積層製造的一工件101進行缺陷的檢測及修補,例如:鋪粉狀態不佳、工件翹曲、熔融表面凸起及熔融表面凹陷,其中該檢測修補裝置100包含一粉床單元2、一修補單元3及一檢測單元4。本發明將於下文詳細說明各元件的細部構造、組裝關係及其運作原理。 Referring to FIGS. 1 and 2, a preferred embodiment of the test repairing device for manufacturing a powder layer according to the present invention is used for detecting and repairing defects of a workpiece 101 manufactured by lamination, for example. The powder coating state is not good, the workpiece is warped, the molten surface is convex, and the molten surface is recessed. The detecting and repairing device 100 includes a powder bed unit 2, a repairing unit 3, and a detecting unit 4. The detailed construction, assembly relationship, and operation principle of each element will be described in detail below.

續參照第1、2圖所示,該粉床單元2具有一粉床平台21、一鋪粉機構22、一雷射23、一供粉器24,其中該粉床平台21被設置用以形成該工件101;該鋪粉機構22設置在該粉床平台21上,用以將一粉末鋪設在該粉床平台21上;該雷射23設置在該粉床平台21上方,用以熔融該粉末而形 成該工件101;以及該供粉器24設置在該粉床平台21上方,用以儲存該粉末,並將該粉末提供該鋪粉機構22鋪粉。 Referring to Figures 1 and 2, the powder bed unit 2 has a powder bed platform 21, a powder spreading mechanism 22, a laser 23, and a powder feeder 24, wherein the powder bed platform 21 is configured to form The workpiece 101 is disposed on the powder bed platform 21 for laying a powder on the powder bed platform 21; the laser 23 is disposed above the powder bed platform 21 for melting the powder Shape The workpiece 101 is disposed; and the powder feeder 24 is disposed above the powder bed platform 21 for storing the powder, and the powder is supplied to the powder spreading mechanism 22 for powdering.

續參照第1、2圖所示,該修補單元3具有一移動機構31及一加工機構32,且該加工機構32安裝在該移動機構31上,用以修補該工件101的一表面,其中該移動機構31具有一個二維移動平台311及一個多軸並聯式機具312,該二維移動平台311設置在該粉床平台21上方,而該多軸並聯式機具312設置在該二維移動平台311上,該二維移動平台311可利用一X軸方向X設置的一橫桿驅動該多軸並聯式機具312沿著該X軸方向移動,或利用一Y軸方向Y設置的一縱桿驅動該多軸並聯式機具312沿著該Y軸方向Y移動。另外,該加工機構32具有多個刀具321及至少一雷射熔覆器322,其中該等刀具321放置在一刀具盒102中,並透過將一主軸320安裝在一置換接頭323上,其中該置換接頭323設置在該多軸並聯式機具312的一移動座313的底部;而且該雷射熔覆器322也可以安裝在該置換接頭323上,使該等刀具321及該雷射熔覆器322可替換地安裝在該多軸並聯式機具312上進行使用。在本實施例中,該多軸並聯式機具312為三軸或五軸的並聯式機具,用以控制該移動座313朝3個或5個軸線方向移動,使該等刀具321及該雷射熔覆器322能夠在該工件101的表面的任何區域進行加工。 Referring to FIGS. 1 and 2, the repairing unit 3 has a moving mechanism 31 and a processing mechanism 32, and the processing mechanism 32 is mounted on the moving mechanism 31 for repairing a surface of the workpiece 101. The moving mechanism 31 has a two-dimensional mobile platform 311 and a multi-axis parallel machine 312. The two-dimensional mobile platform 311 is disposed above the powder bed platform 21, and the multi-axis parallel machine 312 is disposed on the two-dimensional mobile platform 311. The two-dimensional moving platform 311 can drive the multi-axis parallel implement 312 to move along the X-axis direction by using a crossbar disposed in an X-axis direction X, or drive the rod with a longitudinal rod disposed in the Y-axis direction Y. The multi-axis parallel machine 312 moves along the Y-axis direction Y. In addition, the processing mechanism 32 has a plurality of cutters 321 and at least one laser cladding 322, wherein the cutters 321 are placed in a cutter box 102 and mounted on a replacement joint 323 by mounting a spindle 320, wherein A replacement joint 323 is disposed at a bottom of a moving seat 313 of the multi-axis parallel machine 312; and the laser cladding 322 can also be mounted on the replacement joint 323 to enable the cutter 321 and the laser cladding A 322 is alternatively mounted for use on the multi-axis parallel implement 312. In this embodiment, the multi-axis parallel machine 312 is a three-axis or five-axis parallel machine for controlling the movement of the movable seat 313 toward three or five axes, so that the cutters 321 and the laser The cladding 322 can be machined in any area of the surface of the workpiece 101.

續參照第1、2圖所示,該檢測單元4具有一攝影機41及一控制器42,該攝影機41設置在該粉床平台21上方,用以拍攝該粉床平台21的一影像資料;而該控制器42用以接收該影像資料,並依據該影像資料判斷是否鋪粉或排除鋪粉缺陷,或驅動該加工機構32修補該工件101的表面。 With reference to the first and second figures, the detecting unit 4 has a camera 41 and a controller 42. The camera 41 is disposed above the powder bed platform 21 for capturing an image data of the powder bed platform 21; The controller 42 is configured to receive the image data, determine whether to lay out powder or exclude the powdering defect according to the image data, or drive the processing mechanism 32 to repair the surface of the workpiece 101.

依據上述的結構,在鋪粉檢測的過程中,透過該供粉器24 補充該粉末至該鋪粉機構22上,接著該鋪粉機構22再將該粉末鋪設在該粉床平台21上,再利用該攝影機41會拍攝該粉床平台21的一鋪粉後影像資料,並傳送至該控制器42進行檢測,以獲得該粉床平台21上的一鋪粉狀態及該工件101的一翹曲狀態,而該控制器42依據該鋪粉後影像資料的檢測結果判斷是否鋪粉或排除該鋪粉缺陷。另外,在熔融檢測的過程中,透過該雷射23熔融鋪設在該粉床平台21上的粉末,使該粉末熔融在該工件101上,再利用該攝影機41拍攝該粉床平台21的一熔融後影像資料,並傳送至該控制器42進行檢測,以獲得該工件101的一表面的一凸起狀態及一凹陷狀態,該控制器42再依據該熔融後影像資料的檢測結果,判斷是否驅動該加工機構32修補該工件101的表面。 According to the above structure, the powder feeder 24 is passed through during the dusting detection process. The powder is replenished to the dusting mechanism 22, and then the powder spreading mechanism 22 lays the powder on the powder bed platform 21, and the camera 41 is used to capture a post-powder image data of the powder bed platform 21. And transmitting to the controller 42 for detecting to obtain a powder-laying state on the powder bed platform 21 and a warping state of the workpiece 101, and the controller 42 determines whether or not according to the detection result of the image data after the powdering. Paving or eliminating the powder coating defects. Further, during the melt detection, the powder deposited on the powder bed platform 21 is melted through the laser 23, the powder is melted on the workpiece 101, and a melt of the powder bed platform 21 is photographed by the camera 41. The image data is sent to the controller 42 for detection to obtain a convex state and a concave state of a surface of the workpiece 101, and the controller 42 determines whether to drive according to the detection result of the melted image data. The processing mechanism 32 repairs the surface of the workpiece 101.

另外,如第3圖所示的另一實施例中,該檢測單元4另具有一雷射輪廓感測器43,也可以安裝在該置換接頭323上,用以感測該粉床平台21的一輪廓,並且依據該輪廓進行該凸起狀態及凹陷狀態的檢測,判斷是否驅動該加工機構32修補該工件101的表面。要說明的是,該檢測單元4可單獨利用該攝影機41進行檢測,例如感光耦合元件(Charge-coupled Device,CCD),也可以同時使用該攝影機41或雷射輪廓感測器43兩者進行檢測,並不以本實施例所侷限。 In addition, in another embodiment, as shown in FIG. 3, the detecting unit 4 further has a laser contour sensor 43 which can also be mounted on the replacement joint 323 for sensing the powder bed platform 21. A contour is detected, and the convex state and the concave state are detected according to the contour, and it is determined whether the processing mechanism 32 is driven to repair the surface of the workpiece 101. It should be noted that the detecting unit 4 can be detected by the camera 41 alone, such as a Charge-coupled Device (CCD), or both the camera 41 or the laser profile sensor 43 can be used for detection. It is not limited by this embodiment.

藉由上述之設計,透過該攝影機41拍攝該鋪粉後影像資料及該熔融後影像資料,接著由該控制器42對該鋪粉後影像資料及該熔融後影像資料進行檢測,並且判斷是否存在各種缺陷以及區分各種缺陷,例如鋪粉狀態、翹曲狀態、凸起狀態及凹陷狀態。最後,再由該控制器42判斷是否鋪粉或排除該鋪粉缺陷,或驅動該加工機構32修補該工件101的表面, 藉此增加該工件101的良率、縮短作業時間及提高該工件101的品質。 With the above design, the image data and the fused image data are captured by the camera 41, and then the controller 42 detects the powdered image data and the fused image data, and determines whether the image is present. Various defects and distinguishing various defects such as a powdering state, a warping state, a convex state, and a concave state. Finally, the controller 42 determines whether to powder or remove the powdering defect, or drives the processing mechanism 32 to repair the surface of the workpiece 101. Thereby, the yield of the workpiece 101 is increased, the working time is shortened, and the quality of the workpiece 101 is improved.

請參照第4圖並配合第1、2圖所示,本發明之粉末積層製造之檢測修補方法的一較佳實施例,係藉由上述粉末積層製造之檢測修補裝置100對積層製造的一工件101進行檢測及修補,該檢測修補方法包含一鋪粉步驟S201、一鋪粉檢測步驟S202、一鋪粉修補步驟S203、一熔融步驟S204、一熔融檢測步驟S205及一熔融修補步驟S206。 Referring to FIG. 4 and in conjunction with FIGS. 1 and 2, a preferred embodiment of the method for detecting and repairing a powder laminate according to the present invention is a workpiece manufactured by the above-described powder repairing repairing apparatus 100. The detecting and repairing method comprises a powdering step S201, a powdering detecting step S202, a powdering repairing step S203, a melting step S204, a melting detecting step S205, and a melting repairing step S206.

續參照第4圖並配合第1、2圖所示,在該鋪粉步驟S201中,是利用一供粉器24補充一粉末至一鋪粉機構22上,接著該鋪粉機構22將該粉末鋪設在一粉床平台21上。 With reference to Fig. 4 and in conjunction with Figs. 1 and 2, in the powder spreading step S201, a powder is supplied to a powder spreading mechanism 22 by a powder feeder 24, and then the powder spreading mechanism 22 applies the powder. Laying on a powder bed platform 21.

要說明的是,如第5、6圖所示,多個圖檔切層5堆疊出該工件101的一立體圖像,該工件101是依據該等圖檔切層5逐層堆積而成,其中每一圖檔切層5具有一切層區域A1及一切層輪廓區域A2。 It should be noted that, as shown in FIGS. 5 and 6, a plurality of image cut layers 5 are stacked to form a stereoscopic image of the workpiece 101, and the workpiece 101 is formed by layering layers 5 according to the pattern. Each of the image cut layers 5 has a layer area A1 and a layer area A2 of all layers.

請參照第4圖並配合第1、2圖所示,在該鋪粉檢測步驟S202中,是利用一攝影機41拍攝該粉床平台21的一鋪粉後影像資料,並傳送至該控制器42進行檢測;具體而言,該鋪粉檢測步驟S202具有一鋪粉檢測子步驟S202a及一翹曲檢測子步驟S202b,該鋪粉檢測子步驟S202a是檢測該鋪粉後影像資料的切層區域A1的一亮度,用以獲得該粉床平台21上的一鋪粉狀態,其中該切層區域A1的一尺寸對應該粉床平台21的一尺寸;另外,該翹曲檢測子步驟S202b是檢測該鋪粉後影像資料的切層輪廓區域A2的一亮度,用以獲得該工件101的一翹曲狀態,其中該切層輪廓區域A2的一尺寸對應該工件101的一截面的一尺寸。 Referring to FIG. 4 and in conjunction with FIGS. 1 and 2, in the dusting detecting step S202, a powdered image data of the powder bed platform 21 is captured by a camera 41 and transmitted to the controller 42. Specifically, the dusting detecting step S202 has a powdering detecting sub-step S202a and a warping detecting sub-step S202b, and the polling detecting sub-step S202a is detecting the sliced area A1 of the laid-up image data. a brightness for obtaining a powdered state on the powder bed platform 21, wherein a size of the layered area A1 corresponds to a size of the powder bed platform 21; in addition, the warpage detecting sub-step S202b detects the A brightness of the sliced contour area A2 of the post-powder image data is used to obtain a warped state of the workpiece 101, wherein a dimension of the cut layer outline area A2 corresponds to a dimension of a section of the workpiece 101.

續參照第4圖並配合第1、2圖所示,在該鋪粉修補步驟S203 中,該控制器42依據該鋪粉後影像資料的一檢測結果,判斷是否鋪粉或排除一鋪粉缺陷。例如:該粉床平台21上的鋪粉狀態不佳,將判斷停止鋪粉;或該工件101呈翹曲狀態,而判斷將排除該工件101的翹曲狀態。 Continuing to refer to FIG. 4 and matching the first and second figures, in the powdering repairing step S203 The controller 42 determines whether to lay a powder or exclude a powdering defect based on a detection result of the image data after the powdering. For example, the powdering state on the powder bed platform 21 is not good, and it is judged that the powdering is stopped; or the workpiece 101 is in a warped state, and it is judged that the warpage state of the workpiece 101 is excluded.

續參照第4圖並配合第1、2圖所示,在熔融步驟S204中,是利用一雷射23熔融鋪設在該粉床平台21上的粉末,使該粉末熔融在該工件101上。 Referring to Fig. 4 and in conjunction with Figs. 1 and 2, in the melting step S204, the powder deposited on the powder bed platform 21 by a laser 23 is melted, and the powder is melted on the workpiece 101.

續參照第4圖並配合第1、2圖所示,在熔融檢測步驟S205中,是利用該攝影機41拍攝該粉床平台21的一熔融後影像資料,並傳送至該控制器42進行檢測,其中,該熔融檢測步驟S205具有一凸起區檢測子步驟S205a、一凹陷區檢測子步驟S205b、一凸起區加工路徑子步驟S205c及一凹陷區加工路徑子步驟S205d。 Referring to FIG. 4 and in conjunction with FIGS. 1 and 2, in the melting detecting step S205, a molten image data of the powder bed platform 21 is imaged by the camera 41, and transmitted to the controller 42 for detection. The melting detecting step S205 has a bump detecting sub-step S205a, a recess detecting sub-step S205b, a bump processing path sub-step S205c, and a recess processing path sub-step S205d.

具體而言,該凸起區檢測子步驟S205a是檢測該熔融後影像資料的凸起區,並計算該凸起區的一位置及一尺寸用以獲得該工件101的一表面的一凸起狀態,在本實施例中,該凸起區的一亮度為該熔融後影像資料的該切層輸廓區域A2的一平均亮度的110%以上。而且,該凸起區加工路徑子步驟S205c是在該凸起區檢測子步驟S205a之後,如第7、8圖所示,根據一規劃加工路徑C1及該加工區域C2(凸起區)的位置及尺寸計算出一凸起區加工路徑。 Specifically, the raised area detecting sub-step S205a is a raised area for detecting the molten image data, and calculates a position and a size of the raised area to obtain a convex state of a surface of the workpiece 101. In this embodiment, a brightness of the raised area is greater than 110% of an average brightness of the sliced transport area A2 of the molten image data. Moreover, the raised area processing path sub-step S205c is after the raised area detecting sub-step S205a, as shown in FIGS. 7 and 8, according to a planned processing path C1 and the processed area C2 (raised area) And size to calculate a raised area processing path.

另外,該凹陷區檢測子步驟S205b是檢測該熔融後影像資料的凹陷區,並計算該凹陷區的一位置及一尺寸,用以獲得該工件101的一表面的一凹陷狀態;該凹陷區的一亮度為該切層輪廓區域A2的平均亮度的90%以下。而且,該凹陷區加工路徑子步驟S205d是在該凹陷區檢測子步驟 S205b之後,如第7、8圖所示,根據一規劃加工路徑C1及該加工區域C2(凹陷區)的位置及尺寸計算出一凹陷區加工路徑。 In addition, the recessed area detecting sub-step S205b is a recessed area for detecting the molten image data, and calculating a position and a size of the recessed area for obtaining a recessed state of a surface of the workpiece 101; One brightness is 90% or less of the average brightness of the sliced contour area A2. Moreover, the recessed area processing path sub-step S205d is a sub-step of detecting in the recessed area After S205b, as shown in Figs. 7 and 8, a recessed area processing path is calculated based on the position and size of a planned processing path C1 and the processed area C2 (recessed area).

另外,配合第3圖所示,也可以利用一雷射輪廓感測器43感測該粉床平台21的一輪廓,並計算該凸起區的位置及尺寸,或該凹陷區的位置及尺寸,其中該凸起區的一高度為二層的鋪粉厚度以上,該凹陷區的一深度為二層的鋪粉厚度以上。 In addition, as shown in FIG. 3, a contour of the powder bed platform 21 may be sensed by a laser contour sensor 43 and the position and size of the raised area or the position and size of the concave area may be calculated. The height of the raised area is greater than the thickness of the two layers, and the depth of the depressed area is greater than the thickness of the two layers.

續參照第3圖並配合第1、2圖所示,在熔融修補步驟S206中,該控制器42會依據該熔融後影像資料的一檢測結果,例如該工件101的表面的凸起狀態或凹陷狀態,而判斷是否驅動一加工機構32修補該工件101的表面;在本實施例中,在熔融修補步驟S206中,是先利用該加工機構32的多個刀具321對該工件101的表面進行加工擴孔,接著再利用該加工機構32的一雷射熔覆器322對該工件101的表面進行雷射熔覆。 Referring to FIG. 3 and in conjunction with FIGS. 1 and 2, in the melt repairing step S206, the controller 42 may perform a detection result of the molten image data, for example, a convex state or a depression of the surface of the workpiece 101. The state is determined whether a machining mechanism 32 is driven to repair the surface of the workpiece 101. In the present embodiment, in the melt repairing step S206, the surface of the workpiece 101 is first processed by the plurality of cutters 321 of the processing mechanism 32. The hole is reamed, and then the surface of the workpiece 101 is laser-clad by a laser cladding 322 of the processing mechanism 32.

如上所述,透過該攝影機41拍攝該鋪粉後影像資料及該熔融後影像資料,接著由該控制器42對該鋪粉後影像資料及該熔融後影像資料進行檢測,並且判斷是否存在各種缺陷以及區分各種缺陷,例如鋪粉狀態、翹曲狀態、凸起狀態及凹陷狀態,最後再由該控制器42判斷是否鋪粉或排除該鋪粉缺陷,或驅動該加工機構32修補該工件101的表面,藉此增加該工件101的良率、縮短作業時間及提高該工件101的品質。 As described above, the image data and the fused image data are captured by the camera 41, and then the controller 42 detects the powdered image data and the fused image data, and determines whether there are various defects. And distinguishing various defects, such as a powdering state, a warping state, a convex state, and a concave state, and finally determining, by the controller 42, whether to lay or remove the powdering defect, or driving the processing mechanism 32 to repair the workpiece 101. The surface thereby increases the yield of the workpiece 101, shortens the working time, and improves the quality of the workpiece 101.

雖然本發明已以較佳實施例揭露,然其並非用以限制本發明,任何熟習此項技藝之人士,在不脫離本發明之精神和範圍內,當可作各種更動與修飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

100‧‧‧檢測修補裝置 100‧‧‧Detection repairing device

101‧‧‧工件 101‧‧‧Workpiece

102‧‧‧刀具盒 102‧‧‧Tool box

2‧‧‧粉床單元 2‧‧‧Flour bed unit

21‧‧‧粉床平台 21‧‧‧Powder bed platform

22‧‧‧鋪粉機構 22‧‧‧Powdering mechanism

23‧‧‧雷射 23‧‧‧Laser

24‧‧‧供粉器 24‧‧‧Powder

3‧‧‧修補單元 3‧‧‧Repair unit

31‧‧‧移動機構 31‧‧‧Mobile agencies

311‧‧‧二維移動平台 311‧‧‧Two-dimensional mobile platform

312‧‧‧多軸並聯式機具 312‧‧‧Multi-axis parallel machine

313‧‧‧移動座 313‧‧‧Mobile seat

32‧‧‧加工機構 32‧‧‧Processing institutions

320‧‧‧主軸 320‧‧‧ Spindle

321‧‧‧刀具 321‧‧‧Tools

322‧‧‧雷射熔覆器 322‧‧‧Laser Cladding

323‧‧‧置換接頭 323‧‧‧ Replacement joint

4‧‧‧檢測單元 4‧‧‧Detection unit

41‧‧‧攝影機 41‧‧‧ camera

42‧‧‧控制器 42‧‧‧ Controller

Claims (18)

一種粉末積層製造之檢測修補方法,用以對積層製造的一工件進行檢測及修補,該檢測修補方法包含:一鋪粉步驟,利用一鋪粉機構將一粉末鋪設在一粉床平台上;一熔融步驟,利用一雷射熔融鋪設在該粉床平台上的粉末;一熔融檢測步驟,利用一攝影機拍攝該粉床平台的一熔融後影像資料,並傳送至一控制器進行檢測;及一熔融修補步驟,該控制器依據該熔融後影像資料的一檢測結果判斷是否驅動一加工機構修補該工件的一表面。 A method for detecting and repairing a powder layer manufacturing method for detecting and repairing a workpiece manufactured by lamination, the method for detecting and repairing comprises: a step of paving powder, using a powder laying mechanism to lay a powder on a platform of a powder bed; a melting step of melting a powder deposited on the platform of the powder bed by a laser; a melting detecting step of photographing a molten image of the powder bed platform by a camera and transmitting it to a controller for detection; and melting In the repairing step, the controller determines whether to drive a processing mechanism to repair a surface of the workpiece according to a detection result of the molten image data. 如申請專利範圍第1項所述之粉末積層製造之檢測修補方法,其中該熔融檢測步驟具有一凸起區檢測子步驟,用以檢測該熔融後影像資料的凸起區,並計算該凸起區的一位置及一尺寸。 The method for detecting and repairing a powder laminate according to the first aspect of the invention, wherein the melting detecting step has a convex region detecting substep for detecting a convex region of the molten image data, and calculating the convexity A location and a size of the zone. 如申請專利範圍第2項所述之粉末積層製造之檢測修補方法,其中該凸起區的一亮度為該熔融後影像資料的一切層輪廓區域的一平均亮度的110%以上。 The method for detecting and repairing a powder laminate according to the second aspect of the invention, wherein a brightness of the convex region is more than 110% of an average brightness of a contour region of the layer of the melted image data. 如申請專利範圍第2項所述之粉末積層製造之檢測修補方法,其中該熔融檢測步驟另具有一凸起區加工路徑子步驟,在該凸起區檢測子步驟之後,根據一規劃加工路徑及該凸起區的位置及尺寸計算出一凸起區加工路徑。 The method for detecting and repairing a powder laminate according to the second aspect of the invention, wherein the melting detecting step further comprises a processing step of a raised area, after the detecting sub-step of the raised area, according to a planned processing path and The position and size of the raised area calculate a processing path of the raised area. 如申請專利範圍第4項所述之粉末積層製造之檢測修補方法,其中在該熔融修補步驟中,利用該加工機構的多個刀具依據該凸起區加工路徑對該工件的表面進行加工。 The method for detecting and repairing a powder laminate according to the invention of claim 4, wherein in the melting repairing step, the surface of the workpiece is processed according to the processing path of the raised portion by a plurality of tools of the processing mechanism. 如申請專利範圍第1項所述之粉末積層製造之檢測修補方法,其中該熔融檢測步驟具有一凹陷區檢測子步驟,檢測該熔融後影像資料的凹陷區,並計算該凹陷區的一位置及一尺寸。 The method for detecting and repairing a powder laminated layer according to the first aspect of the invention, wherein the melting detecting step has a recessed area detecting substep, detecting a depressed area of the molten image data, and calculating a position of the depressed area and One size. 如申請專利範圍第6項所述之粉末積層製造之檢測修補方法,其中該凹陷區的一亮度為該熔融後影像資料的一切層輪廓區域的平均亮度的90%以下。 The method for detecting and repairing a powder laminate according to claim 6, wherein a brightness of the recessed area is less than 90% of an average brightness of a contour region of the layer of the melted image data. 如申請專利範圍第6項所述之粉末積層製造之檢測修補方法,其中該熔融檢測步驟另具有一凹陷區加工路徑子步驟,在該凹陷區檢測子步驟之後,根據一規劃加工路徑及該凹陷區的位置及尺寸計算出一凹陷區加工路徑。 The method for detecting and repairing a powder laminate according to the sixth aspect of the invention, wherein the melting detecting step further comprises a recessed region processing path substep, after the recessed region detecting substep, according to a planned processing path and the recess The location and size of the zone calculates a processing path for the recessed zone. 如申請專利範圍第8項所述之粉末積層製造之檢測修補方法,其中在該熔融修補步驟中,利用該加工機構的多個刀具依據該凹陷區加工路徑對該工件的表面進行擴孔,接著利用該加工機構的一雷射熔覆器對該工件的表面進行雷射熔覆。 The method for detecting and repairing a powder laminated layer according to claim 8, wherein in the melting repairing step, the surface of the workpiece is reamed according to the processing path of the recessed area by using a plurality of tools of the processing mechanism, and then The surface of the workpiece is laser cladding using a laser cladding of the processing mechanism. 如申請專利範圍第1項所述之粉末積層製造之檢測修補方法,其中在該鋪粉步驟之後另包含一鋪粉檢測步驟,該鋪粉檢測步驟是利用該攝影機拍攝該粉床平台的一鋪粉後影像資料,並傳送至該控制器進行檢測。 The method for detecting and repairing a powder laminate according to claim 1, wherein after the powdering step, a powder coating detecting step is adopted, wherein the powder detecting step is to use the camera to photograph a shop of the powder bed platform. The post-powder image data is transmitted to the controller for testing. 如申請專利範圍第10項所述之粉末積層製造之檢測修補方法,其中該鋪粉檢測步驟具有:一鋪粉檢測子步驟,檢測該鋪粉後影像資料的一切層區域的一亮度;及一翹曲檢測子步驟,檢測該鋪粉後影像資料的一切層輪廓區域的一亮度。 The method for detecting and repairing a powder laminate according to claim 10, wherein the step of detecting the powder has a step of detecting a powder, detecting a brightness of a layer of all layers of the image after the layering; and The warpage detecting substep detects a brightness of a contour region of all layers of the image after the spreading. 如申請專利範圍第11項所述之粉末積層製造之檢測修補方法,其中在該鋪粉檢測子步驟中,該鋪粉後影像資料的一未鋪粉區為該切層區域的30%以上,則判斷鋪粉不佳。 The method for detecting and repairing a powder laminate according to the invention of claim 11, wherein in the step of detecting the powder, an unpaved area of the image after the powdering is more than 30% of the area of the layer, Then judge the poor powdering. 如申請專利範圍第11項所述之粉末積層製造之檢測修補方法,其中在該翹曲檢測子步驟中,該鋪粉後影像資料的一翹曲區域為該切層輪廓區域的10%以上,則判斷該工件為翹曲。 The method for detecting and repairing a powder laminate according to the invention of claim 11, wherein in the warpage detecting substep, a warpage area of the image data after the layering is more than 10% of the contour area of the layer, Then the workpiece is judged to be warped. 如申請專利範圍第10項所述之粉末積層製造之檢測修補方法,其中在該鋪粉檢測步驟之後另包含一鋪粉修補步驟,該控制器依據該鋪粉後影像資料的一檢測結果判斷是否鋪粉或排除一鋪粉缺陷。 The method for detecting and repairing a powder laminate according to claim 10, wherein after the powdering detecting step, a powder cleaning step is further included, and the controller determines whether the film is based on the detection result of the image data after the powdering Plastering or eliminating a powder defect. 一種粉末積層製造之檢測修補裝置,用以對積層製造的一工件進行檢測及修補,該檢測修補裝置包含:一粉床單元,具有:一粉床平台,用以形成該工件;一鋪粉機構,設置在該粉床平台上,用以將一粉末鋪設在該粉床平台上;及一雷射,設置在該粉床平台上方,用以熔融該粉末;一修補單元,具有:一移動機構,設置在該粉床平台上方;及一加工機構,安裝在該移動機構上,用以修補該工件的一表面;及 一檢測單元,具有:一攝影機,設置在該粉床平台上方,用以拍攝該粉床平台的一影像資料;及一控制器,用以接收該影像資料,並依據該影像資料判斷是否鋪粉或排除一鋪粉缺陷,或驅動該加工機構修補該工件的表面。 A detecting and repairing device for manufacturing a powder layer for detecting and repairing a workpiece manufactured by lamination, the detecting and repairing device comprising: a powder bed unit having: a powder bed platform for forming the workpiece; and a powder laying mechanism And disposed on the powder bed platform for laying a powder on the powder bed platform; and a laser disposed above the powder bed platform for melting the powder; and a repairing unit having: a moving mechanism Provided above the powder bed platform; and a processing mechanism mounted on the moving mechanism for repairing a surface of the workpiece; and a detecting unit has: a camera disposed above the powder bed platform for capturing an image data of the powder bed platform; and a controller for receiving the image data, and determining whether to spread the powder according to the image data Or to eliminate a powder defect, or drive the processing mechanism to repair the surface of the workpiece. 如申請專利範圍第15項所述之粉末積層製造之檢測修補裝置,其中該移動機構具有:一個二維移動平台,設置在該粉床平台上方;及一個多軸並聯式機具,設置在該二維移動平台上。 The detecting and repairing device for powder lamination manufacturing according to claim 15, wherein the moving mechanism has: a two-dimensional mobile platform disposed above the powder bed platform; and a multi-axis parallel machine disposed on the second On the mobile platform. 如申請專利範圍第16項所述之粉末積層製造之檢測修補裝置,其中該加工機構具有多個刀具及至少一雷射熔覆器,該等刀具及雷射熔覆器可替換地安裝在該多軸並聯式機具上。 The detecting and repairing device for powder laminated manufacturing according to claim 16, wherein the processing mechanism has a plurality of cutters and at least one laser cladding, the cutters and the laser claddings are alternatively mounted on the Multi-axis parallel machine. 如申請專利範圍第16項所述之粉末積層製造之檢測修補裝置,其中該檢測單元另具有一雷射輪廓感測器,用以安裝在該多軸並聯式機具上,用以感測該粉床平台的一輪廓。 The detecting and repairing device for powder laminated manufacturing according to claim 16, wherein the detecting unit further has a laser contour sensor for mounting on the multi-axis parallel machine for sensing the powder A silhouette of the bed platform.
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