TWI569653B - Composite device and electronic device having the same - Google Patents

Description

Composite device and electronic device having the same

The present invention relates to a complex device, and more particularly to a composite device including a piezoelectric speaker to assemble a multifunction in one module and an electronic device having the composite device.

Compact portable electronic devices that can be used by users while being portable are increasingly focused on miniaturization, slenderness, and light weight. Moreover, multi-purpose functions and simple communication functions used in various multimedia environments or Internet environments can be added to electronic devices. Therefore, electronic devices are widely used as so-called smart phones. In particular, this smart phone includes a wider screen for more adequate use in a multimedia environment. Here, for the convenience of the user, a touch screen that is operated in a touch manner is generally employed for the screen. Moreover, payment methods using near field communication (NFC) in portable electronic devices are widely used. In recent years, a wireless power charge (WPC) method using electromagnetic induction has been adopted instead of the cable charging method. Electronic devices are emerging.

The portable electronic device capable of playing a multimedia source may not include its own speaker due to its miniaturization, or may include a mono speaker for providing the least sound for even the portable electronic device Power consumption is also reduced in the case of speakers. Therefore, in order to allow the user to enjoy the multimedia source that will be played in the stereophonic sound, a separate speaker must be connected to the portable electronic device.

However, since the conventional speaker has a large volume, it is difficult for the user to carry the speaker. That is to say, existing speakers require a diaphragm. Moreover, the more the diaphragm size is increased, the more the sound amplification increases. Since the quality of sound caused by vibration is affected by the magnitude and magnitude of the permanent magnet used to vibrate the diaphragm, the volume of the portable speaker is increased. Moreover, since a separate connection line is required to connect the conventional speaker to the portable electronic device, and power must be supplied to the portable electronic device, it is necessary to simultaneously carry the speaker body to the connection line. In addition, the speakers can only be used at locations where power is supplied.

Korean Patent Registration No. 10-119861 discloses a speaker for a smart phone that does not require separate power.

The present invention provides a composite device including a small-sized and easily portable piezoelectric speaker to assemble a multi-function in one module, and an electronic device having the composite device.

The present invention also provides a composite device that can be coupled to and separated from the portable electronic device, and an electronic device having the composite device.

According to an exemplary embodiment, a composite device includes: a piezoelectric device; a wireless charging (WPC) antenna disposed on one surface of the piezoelectric device, the WPC antenna being connected to two antenna patterns vertically spaced apart from each other And a near field communication (NFC) antenna disposed outside of the WPC antenna.

The composite device may further include a vibration transmitting body that contacts at least one region of the stacked structure of the piezoelectric device, the WPC antenna, and the NFC antenna, the vibration transmitting body configured to Is spaced apart from a surface of the stacked structure.

The WPC antenna may include a first WPC antenna pattern disposed on the first sheet and a second WPC antenna pattern disposed on the second sheet, the first sheet being provided on one surface of the piezoelectric device, A second sheet is provided on the first sheet.

The composite device may further include: a first connection hole defined in the second sheet to connect the first and second WPC antennas to each other; and a first withdrawal pattern disposed on the first On the sheet, the first withdrawal pattern is connected to the first WPC antenna and is withdrawn to the outside.

The NFC antenna can be disposed on the second sheet outside the second WPC antenna, and at least a portion of the NFC antenna can be cut.

The composite device may further include: at least one connection pattern disposed on the first sheet; at least one second connection hole defined in the second Connecting the NFC antenna to the connection pattern; and a second withdrawal pattern disposed on the first sheet, the second withdrawal pattern being connected to the NFC antenna and being withdrawn to the outside .

The first sheet may comprise a magnetic sheet and the second sheet comprises a non-magnetic sheet.

The piezoelectric device and the first and second sheets may be co-fired.

Each of the first and second sheets may be formed from a polymer.

The composite device may further include a cover sheet disposed on the second sheet and a magnetic sheet spaced apart from another surface of the piezoelectric device.

The composite device can further include: a frame configured to secure an edge of the stacked structure including the first and second sheets; and a cover disposed on at least one side of the frame.

In accordance with another exemplary embodiment, a composite device includes: a body coupled to a rear surface of the electronic device separately; and a composite device module coupled to a predetermined region of the body, wherein the composite device module is It is composed of a coupled piezoelectric speaker, a WPC antenna, and an NFC antenna.

The composite device module may include: a piezoelectric device; the WPC antenna disposed on one surface of the piezoelectric device, the WPC antenna being connected to two antenna patterns vertically spaced apart from each other; and the An NFC antenna is disposed outside of the WPC antenna.

The composite device may further include a vibration transmitting body, the vibration transmission The body contacts at least one region of the stacked structure of the piezoelectric device, the WPC antenna, and the NFC antenna, the vibration transmitting body being configured to be spaced apart from one surface of the stacked structure.

The WPC antenna may include: a first WPC antenna pattern disposed on a first sheet, the first sheet being provided on one surface of the piezoelectric device; and a second WPC antenna pattern disposed on the second sheet The second sheet is provided on the first sheet; a first connection hole defined in the second sheet to connect the first and second WPC antennas to each other; and a first withdrawal pattern Disposed on the first sheet, the first withdrawal pattern is connected to the first WPC antenna and withdrawn to the outside.

The NFC antenna may include: an NFC antenna pattern disposed on the second sheet outside the second WPC antenna and at least one portion being cut; at least one connection pattern disposed on the first sheet At least one second connection hole defined in the second sheet to connect the NFC antenna to the connection pattern; and a second withdrawal pattern disposed on the first sheet, the A second withdrawal pattern is connected to the NFC antenna and withdrawn to the outside.

The first sheet may comprise a magnetic sheet, and the second sheet comprises a non-magnetic sheet, and the piezoelectric device and the first and second sheets are co-fired.

Each of the first and second sheets may be formed of a polymer, and the composite device may further comprise a cover sheet disposed on the second sheet and spaced apart from another surface of the piezoelectric device Magnetic sheet.

The body may have the same shape as the back cover of the electronic device, and Coupling may be performed after the back cover of the electronic device is separated.

An opening may be defined in a predetermined area of the body, and the composite device module may be inserted into the opening.

The body may have a predetermined area that protrudes outward to define an accommodation space therein such that the composite device module is inserted into the accommodation space.

The composite device module may include: a first connection terminal connected to the piezoelectric device on one side and exposed to the outside on the other side, the first connection terminal being connected to a rear surface disposed on the electronic device a sound output terminal; and a second connection terminal having one side connected to the WPC antenna and the NFC antenna and the other side exposed to the outside, the second connection terminal being connected to the one disposed on the electronic device WPC terminal and NFC terminal on the rear surface.

The composite device may further include a flip cover disposed on one side surface of the main body to cover a front surface of the electronic device.

In accordance with still another exemplary embodiment, an electronic device, a composite device module coupled to a rear surface of the electronic device, the electronic device including: a body coupled to the rear surface of the electronic device separately; A composite device module coupled to a predetermined area of the body, wherein the composite device module is comprised of a piezoelectric speaker, a WPC antenna, and an NFC antenna coupled to each other.

The composite device module may include: a piezoelectric device; the WPC antenna disposed on one surface of the piezoelectric device, the WPC antenna being connected to two antenna patterns vertically spaced apart from each other; the NFC An antenna disposed on the WPC And a vibration transmitting body contacting at least one region of the stacked structure of the piezoelectric device, the WPC antenna, and the NFC antenna, the vibration transmitting body being configured to be One surface is spaced apart.

The vibration transmitting body may be away from or close to the piezoelectric device from its edge toward its central portion, or may maintain a distance with respect to the piezoelectric device.

The vibration transmitting body of the composite device module may contact a vibration amplifying object to amplify sound pressure and output output from the piezoelectric speaker.

Exemplary embodiments may be understood in more detail from the following description in conjunction with the drawings.

10‧‧‧Electronic devices

100‧‧‧ Piezoelectric device

110a, 110b‧‧‧ electrode pattern

200‧‧‧ first sheet

210‧‧‧First antenna pattern

220a‧‧‧first withdrawal pattern

220b‧‧‧second withdrawal pattern

231, 232, 233, 321, 322, 323‧‧‧ connection patterns

240a‧‧‧ Third withdrawal pattern

240b‧‧‧ fourth withdrawal pattern

250a, 250b, 341a, 341b, 342‧‧‧ through holes

300‧‧‧Second sheet

310‧‧‧second antenna pattern

320‧‧‧third antenna pattern

331-338, 339a, 339b‧‧‧ holes

400‧‧‧Vibration transfer board

410‧‧‧First vibration transmission board

420‧‧‧Second vibration transmission board

430‧‧‧ pattern

500‧‧ ‧ cover sheet

550‧‧‧Magnetic Sheet

600‧‧‧Frame

610‧‧‧ Cover

700, 710, 720‧‧‧ connection terminals

800‧‧‧Bottom vibration transmission shell

810‧‧‧Base

820‧‧‧Coupling section

900‧‧‧Top cover

1000‧‧‧ Subject

1000a‧‧‧First area

1000b‧‧‧Second area

1000c‧‧‧ middle wall

1100‧‧‧ first opening

1200‧‧‧ second opening

1300‧‧‧ cushion

1310‧‧‧First groove

1320‧‧‧second groove

1330‧‧‧ third groove

1400‧‧‧Upper cover

2000‧‧‧Composite device module

3000‧‧‧Flip

4000‧‧‧Power section

4100‧‧‧Battery

4200‧‧‧Circuit board

4210‧‧‧Connecting line

4300‧‧‧First connector

4400‧‧‧Second connector

4500‧‧‧ lower cover

5000‧‧‧Sound amplification box

5100‧‧‧ Subject

5100a‧‧‧Resonance hole

5110‧‧‧ upper board

5120‧‧‧lower board

5130‧‧‧ Sidewall panels

5200‧‧‧Vibration transmission part

5300‧‧‧Support section

1 through 3 are schematic views of a composite device module in accordance with an exemplary embodiment.

4 through 6 are schematic diagrams illustrating modified examples of a composite device module, according to an exemplary embodiment.

7 through 9 are schematic views of a composite device module in accordance with another exemplary embodiment.

10 to 14B are schematic views of a composite device, according to an exemplary embodiment.

15 to 17 are schematic views of a composite device in accordance with another exemplary embodiment.

18 to 20 are schematic views of a sound amplification box according to an exemplary embodiment.

21 is a graph illustrating data measured by using a sound amplification box according to an exemplary embodiment.

Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete.

1 through 3 are schematic views of a composite device module in accordance with an exemplary embodiment. Here, FIG. 1 is an exploded perspective view of the composite device module, and FIGS. 2 and 3 are perspective views illustrating a coupled state of the composite device module. That is, FIG. 2 is a perspective view illustrating a partially coupled state of the composite device module, and FIG. 3 is a perspective view illustrating a fully coupled state of the composite device module.

Referring to FIGS. 1 through 3, a composite device module according to an exemplary embodiment may include a piezoelectric device 100, a first sheet 200 disposed on one surface of the piezoelectric device 100 and having a first antenna pattern 210, and disposed on The second sheet 300 on the first sheet 200 and having the second antenna pattern 310 and the third antenna pattern 320. Moreover, the composite device module may include a vibration transfer plate 400 that is a vibration transmitting body and is spaced apart from at least two side surfaces of the piezoelectric device 100 from one surface of the piezoelectric device 100. That is, the vibration transmitting plate 400 can contact both side surfaces of the piezoelectric device 100. In detail, the vibration transmitting plate 400 may contact both side surfaces of a stacked structure in which the piezoelectric device 100 and the first sheet 200 and the second sheet 300 are stacked. Here, the first antenna pattern 210 of the first sheet 200 and the second antenna pattern 310 of the second sheet 300 are connected to each other to constitute a wireless charging (WPC) antenna. The third antenna pattern 320 of the second sheet 300 It may be disposed outside of the second antenna pattern 310 to form a near field communication (NFC) antenna. Moreover, the piezoelectric device 100 and the vibration transmitting plate 400 can constitute a piezoelectric speaker. The sound can be amplified in the space between the piezoelectric device 100 and the vibration transmitting plate 400, and then output. Therefore, the composite device module according to an exemplary embodiment can be manufactured by integrating a piezoelectric speaker, a WPC antenna, and an NFC antenna while plasticizing the piezoelectric device 100, the first sheet 200, and the second sheet 300.

The piezoelectric device 100 may be in the shape of a rectangular plate having a predetermined thickness. That is, the piezoelectric device 100 has two surfaces facing each other, that is, a top surface and a bottom surface. Moreover, the piezoelectric device 100 can have four side surfaces along the edges of the top and bottom surfaces. Alternatively, the piezoelectric device 100 may have various shapes other than a rectangular shape, such as a square shape, a circular shape, an elliptical shape, a polygonal shape, and the like. Piezoelectric device 100 can include a board and a piezoelectric layer disposed on at least one surface of the board. For example, the piezoelectric device 100 may be provided as a bimorph type piezoelectric device in which piezoelectric layers are formed on both surfaces of a board, or a single sheet in which a piezoelectric layer is formed on one surface of a board A unimorph type piezoelectric device. At least one layer may be stacked to form a piezoelectric layer. Preferably, the plurality of layers may be stacked on each other to form a piezoelectric layer. Moreover, electrodes may be disposed on each of the upper and lower portions of the piezoelectric layer. Here, the piezoelectric layer may be formed of, for example, a piezoelectric material based on PZT (Pb, Zr, Ti), NKN (Na, K, Nb) or BNT (Bi, Na, Ti). Moreover, the piezoelectric layers can be polarized in different directions and then stacked on each other. That is, when the plurality of piezoelectric layers are formed on one surface of the board, the polarization of each of the piezoelectric layers may be alternately disposed in different directions. Board can have The formation of a material in which the piezoelectric layers are stacked while vibrating, such as metal or plastic. However, the piezoelectric device 100 cannot use a plate formed of a material different from that of the piezoelectric layer. That is, the unpolarized piezoelectric layer may be disposed on the central portion of the piezoelectric device 100, and the plurality of piezoelectric layers polarized in directions different from each other may be disposed on the upper portion of the piezoelectric device 100. And on the lower part. The electrode patterns 110a and 110b to which the driving voltage is applied may be disposed on a predetermined region on one short side of the piezoelectric device 100. The electrode patterns 110a and 110b may be connected to a connection terminal (not shown) and then connected to the electronic device 10 through the connection terminal.

The first sheet 200 is disposed on one surface of the piezoelectric device 100, and the first antenna pattern 210 is disposed on the first sheet 200. Moreover, a first withdrawal pattern 220a and a second withdrawal pattern 220b connected to the first antenna pattern 210 and subsequently withdrawn to the outside, connected to the third antenna pattern 320 disposed on the second sheet 300 A plurality of connection patterns 231, 232, and 233 and a third withdrawal pattern 240a and a fourth withdrawal pattern 240b connected to the third antenna pattern 320 through the plurality of holes 339a and 339b and then withdrawn to the outside may be disposed on the sheet 200 on. The first sheet 200 may have the same shape as the piezoelectric device 100. That is, the first sheet 200 may have an approximately rectangular plate shape. Here, the first sheet 200 may have the same thickness as the piezoelectric device 100 or have a thickness different from that of the piezoelectric device 100. The first antenna pattern 210 may be rotated in one direction from a central portion of the first sheet 200. Therefore, the first antenna pattern 210 may have a predetermined turn number. For example, the first antenna pattern 210 may have a predetermined width and distance and a spiral shape that rotates outward in the counterclockwise direction. Here, the first antenna patterns 210 may have the same line width and distance or have different line widths and distances from each other. That is, the first antenna pattern 210 may have a line width greater than the distance therebetween. Moreover, the first antenna pattern 210 has one end connected to the first evacuation pattern 220a. The first withdrawal pattern 220a has a predetermined width and is exposed to one side of the first sheet 200. For example, the first withdrawal pattern 220a extends in the direction of the long side of the first sheet 200 and is exposed to one short side of the first sheet 200. That is, the first withdrawal pattern 220a is exposed to the side on which the electrode patterns 110a and 110b of the piezoelectric device 100 are disposed. Here, the first evacuation pattern 220a may be spaced apart from the electrode patterns 110a and 110b. Moreover, the second withdrawal pattern 220b is spaced apart from the first withdrawal pattern 220a and disposed in the same direction as the first withdrawal pattern 220a. The second withdrawal pattern 220b is connected to the second antenna pattern 310 disposed on the second sheet 300. Here, the second withdrawal pattern 220b may be longer than the first withdrawal pattern 220a. Moreover, a plurality of connection patterns 231, 232, and 233 may be provided to connect the third antenna patterns 320 disposed on the second sheet 300. That is, the third antenna pattern 320 may have a semicircular shape that is cut into, for example, at least two regions. Here, in order to connect the cut regions to each other, a plurality of connection patterns 321, 322, and 323 may be disposed on the first sheet 200. The connection pattern 321 may have a predetermined width and length in a short side direction on a region between the electrode patterns 110a and 110b of the piezoelectric device 100 and the first evacuation pattern 220a. The connection patterns 322 and 323 are disposed at positions facing the connection pattern 321 on the long side direction, that is, on the other side where the first withdrawal pattern 220a and the second withdrawal pattern 220b are not disposed. Moreover, each of the connection patterns 322 and 323 is not exposed to the other short side and has a predetermined width and length along the other short side. Moreover, the connection patterns 322 and 323 are spaced apart from each other. Moreover, the third withdrawal pattern 240a and the fourth withdrawal pattern 240b are spaced apart from the second withdrawal pattern 220b and exposed to one short side. The through holes 250a and 250b spaced apart from each other are defined in the region where the side of the withdrawal patterns 220 and 240 are not disposed, on the regions where the withdrawal patterns 220 and 240 are disposed, that is, the electrode patterns 110a corresponding to the piezoelectric device 100, respectively. The area of 110b. Moreover, the withdrawal patterns 220 and 240 may be connected to a connection terminal (not shown) and then connected to the electronic device 10 through the connection terminal. The first sheet 200 may be formed of a magnetic ceramic. For example, the first sheet 200 may be formed by using a magnetic material based on NiZnCu or NiZn. In particular, Fe ₂ O ₃ , ZnO, NiO, and CuO as magnetic materials may be mixed with NiZnCu-based magnetic flakes. Here, Fe ₂ O ₃ , ZnO, NiO, and CuO may be mixed in a ratio of 5:2:2:1. Since the first sheet 200 is formed of magnetic ceramic, electromagnetic waves generated from the WPC antenna and the NFC antenna can be shielded or absorbed to limit the interference of electromagnetic waves.

The second sheet 300 is disposed on the first sheet 200, and the second antenna pattern 310 and the third antenna pattern 320 are disposed on the second sheet 300 in a state in which the second antenna pattern 310 and the third antenna pattern 320 are spaced apart from each other . Moreover, a plurality of holes 331, 332, 333, 334, 335, 336, 337 and 338 are defined in the second sheet 300. The second sheet 300 may have the same shape as that of each of the piezoelectric device 100 and the first sheet 200. That is, the second sheet 300 may have an approximately rectangular plate shape. Here, the second sheet 300 may have the same thickness as each of the piezoelectric device 100 and the first sheet 200, or have a thickness different from that of each of the piezoelectric device 100 and the first sheet 200. . That is, the second sheet 300 may have a thickness smaller than the thickness of the piezoelectric device 100 and equal to the thickness of the first sheet 200. the next day The line pattern 310 is rotatable in one direction from a central portion of the second sheet 300. Therefore, the second antenna pattern 210 may have a predetermined number of turns. For example, the second antenna pattern 310 may have a predetermined width and distance and a spiral shape that rotates outward in a clockwise direction. That is, the second antenna pattern 310 may have a spiral shape that rotates in the clockwise direction from the same region as the first antenna pattern 210 disposed on the first sheet 200. Moreover, the second antenna pattern 310 may be formed up to a region overlapping the second evacuation pattern 220b disposed on the first sheet 200. Here, the second antenna pattern 310 may have the same line width and distance as the first antenna pattern 210, and the second antenna pattern 310 and the first antenna pattern 210 may overlap each other. Holes 331 and 332 are defined in the start and end points of the second antenna pattern 310, respectively. A conductive material is filled into the holes 331 and 332. A starting point of the second antenna pattern 310 may be connected to a starting point of the first antenna pattern 210 through the hole 331 , and an ending point of the second antenna pattern 310 may be connected to a predetermined area of the second evacuation pattern 220 through the hole 332 . The third antenna pattern 320 is spaced apart from the second antenna pattern and has a plurality of turns along the edge of the second sheet 300. That is, the third antenna pattern 320 may be disposed outside the second antenna pattern 310 to surround the second antenna pattern 310. Here, the third antenna pattern has a shape in which a predetermined area on the second sheet 300 is cut. That is, the third antenna pattern 320 may not have a plurality of turns connected to each other, but have a shape cut into at least two regions that are not electrically connected to each other on the second sheet 300. The plurality of holes 333, 334, 335, 336, 337 and 338 are defined between the cut third antenna patterns 320. Moreover, the plurality of holes 333, 334, 335, 336, 337, and 338 are filled with a conductive material, and thus electrically connected to the connection patterns 231, 232, and 233 of the first sheet 200. therefore, Although the third antenna pattern 320 is cut into at least two regions, the cut third antenna pattern 320 may pass through the plurality of holes 333, 334, 335, 336, 337, and 338 and the connection pattern 231 of the first sheet 200, 232 and 233 are electrically connected to each other. Moreover, a plurality of through holes 341 and 342 for exposing the through holes 250a and 250b of the first sheet 200 and the plurality of withdrawal patterns 220 and 240 are defined in the second sheet 300. That is, the two through holes 341a and 341b are defined at positions corresponding to the through holes 250a and 250b of the first sheet 200 to expose the electrode patterns 110a and 110b of the piezoelectric device 100, respectively. Moreover, the fourth through holes 342 are defined to respectively expose the plurality of withdrawal patterns, that is, the four withdrawal patterns of the first sheet 200. The second sheet 300 may be formed of a material different from that of the first sheet 200. For example, the second sheet 300 may be formed of a non-magnetic ceramic. That is, the second sheet 300 may be formed of a low temperature co-fired ceramic (LTCC).

The vibration transmitting plate 400 may be spaced apart from at least one surface of the second sheet 300 by a predetermined distance. For example, the edge of the vibration transmitting plate 400 may be attached to at least two side surfaces of the piezoelectric device 100 facing each other, and the remaining region of the vibration transmitting plate 400 may be spaced apart from the second sheet 300. That is, the vibration transmitting plate 400 can contact the side surface of the piezoelectric device 100. In detail, the vibration transmitting plate 400 may contact a side surface of the stacked structure in which the piezoelectric device 100 and the first sheet 200 and the second sheet 300 are stacked. Here, the vibration transmitting plate 400 may have a shape that gradually moves away from the second sheet 300 from the edge of the second sheet 300 toward the central portion of the second sheet 300, such as a dome shape. All four edges of the vibration transmitting plate 400 may be attached to at least a side surface of the piezoelectric device 100 to form a dome shape. For this purpose, vibration transmission The board 400 may be disposed along the piezoelectric device 100 to have a larger size than the piezoelectric device 100. That is, the vibration transmitting plate 400 may have a rectangular shape to match the shape of the piezoelectric device 100. Moreover, the vibration transmitting plate 400 may have a larger size than the piezoelectric device 100 in consideration of the width of the region attached to at least the side surface of the piezoelectric device 100 and the distance spaced apart from one surface of the second sheet 300. The space between the second sheet 300 and the vibration transmitting plate 400 may be a resonance space of the piezoelectric speaker. The vibration transmitting plate 400 can transmit vibration and resonance of the piezoelectric device 100. In addition, the vibration transmitting plate 400 together with the piezoelectric device 100 can function as a piezoelectric speaker for amplifying the sound of the electronic device. Moreover, when one side of the vibration transmitting plate 400 contacts a vibration amplifying object such as a table, a box, and the like, the output and sound pressure can be further amplified to output the amplified output and sound pressure. Here, the vibration transmitting plate 400 may be formed of metal or plastic. Alternatively, materials different from each other may be stacked to form at least a double structure. For example, the vibration transmitting plate 400 may be formed of a resin such as PET having a flexible property. The space between the second sheet 300 and the vibration transmitting plate 400 may vary depending on the size of the piezoelectric device 100, the electronic device accommodating space for accommodating the composite device module, and the desired output and sound pressure.

The antenna patterns 210, 310, and 320, the withdrawal patterns 220 and 240, and the connection patterns 231, 232, and 233 may be formed of a copper film or a conductive paste. In the case of a conductive paste, a conductive paste can be printed on a sheet by using various printing methods. The conductive particles of the conductive paste may include metal particles of Au, Ag, Ni, Cu, Pd, Ag coated with Ag, Ni coated with Ag, Cu coated with Ni, and graphite coated with Ni, carbon nanotubes, carbon black , graphite and Ag coated graphite. Conductive paste can be A material that is evenly dispersed in a fluid organic binder. The conductive paste can be applied to the sheet by using, for example, printing or the like and then subjected to heat treatment such as drying, curing, and plasticization. Therefore, the conductive paste can have electrical conductivity. Moreover, the printing method may include lithographic printing such as screen printing, roll-to-roll printing such as gravure printing, and inject printing.

As described above, the composite device module according to an exemplary embodiment can be fabricated by assembling a piezoelectric speaker, a WPC antenna, and an NFC antenna. Therefore, the sound of the electronic device can be amplified by using one module. Moreover, the electronic device can be wirelessly charged and capable of performing near field communication. Moreover, since the multifunction is realized by using the one module, the area required for the multifunction can be reduced when compared with the structure in which each function is separately provided.

The composite device module according to an exemplary embodiment may have various shapes. Hereinafter, a modified example of the composite device module will be described with reference to Figs.

As illustrated in FIG. 4, the composite device module includes: a piezoelectric device 100; a first vibration transmitting plate 410 serving as a dome-shaped vibration transmitting body, and a stacked structure stacked from the first sheet 200 and the second sheet 300 Two side surfaces are spaced apart from a top surface of the stacked structure; and a second vibration transmitting plate 420 serving as a dome-shaped vibration transmitting body, and from both side surfaces of the stacked structure and the stacked structure The bottom surfaces are spaced apart. That is, the composite device module according to an exemplary embodiment may include the piezoelectric device 100 and the first vibration transmitting plate spaced apart from the top surface and the bottom surface of the stacked structure of the first sheet 200 and the second sheet 300 by a predetermined distance, respectively. 410 And a second vibration transmitting plate 420. Here, the first vibration transmitting plate 410 and the second vibration transmitting plate 420 may be attached to the same side surface of the stacked structure or attached to different side surfaces of the stacked structure. That is, the edge of the second vibration transmitting plate 420 may be attached to both side surfaces perpendicular to both side surfaces of the stacked structure to which the first vibration transmitting plate 410 is attached. Alternatively, the edges of the first vibration transmitting plate 410 and the second vibration transmitting plate 420 may be attached to all side surfaces of the stacked structure.

As illustrated in FIG. 5, the composite device module may include: a piezoelectric device 100; a vibration transmission plate 400 having a dome shape and from at least two side surfaces of the stacked structure of the first sheet 200 and the second sheet 300 The top surfaces of the stacked structures are spaced apart; and at least one pattern 430 disposed on a predetermined area of the vibration transmitting plate 400. The pattern 430 may be formed by cutting or removing at least one region of the vibration transmitting plate 400. Alternatively, the same material or different material as the vibration transmitting plate 400 may be attached to the vibration transmitting plate 400 to form the pattern 430. The pattern 430 can have a predetermined length upward from the area where it contacts the stacked structure. Moreover, the pattern 430 may be disposed on at least one side of the vibration transmitting plate 400.

As illustrated in FIG. 6, the composite device module may include a piezoelectric device 100 and a vibration transmitting plate 400 spaced from the at least two side surfaces of the stacked structure of the first sheet 200 and the second sheet 300. At least one surface of the stacked structure is the same distance. That is, although the vibration transmission plate 400 of the composite device module in the exemplary embodiment and the modified example described with reference to FIGS. 1 to 4 has a dome shape that gradually moves away from the center portion from the edge on at least one surface of the stacked structure However, the composite device module of FIG. 6 can have a phase between the stacked structure and the vibration transmitting plate 400. Same distance. Although not shown, the distance between the stacked structure and the vibration transmitting plate 400 may gradually increase from the two edges of the stacked structure to the predetermined area, and then the remaining areas may be maintained at the same distance. Thus, in the composite device module, the vibration transmitting plate 400 can be spaced apart from at least one surface of the stacked structure by a predetermined distance. Although the edge of the vibration transmitting plate 400 contacts the side surface of the stacked structure, the edge of the vibration transmitting plate 400 may also contact the edge of one surface of the stacked structure.

Although in the exemplary embodiment described with reference to FIGS. 1 through 6, the vibration transmitting plate 400 is away from the two edges toward the central portion of the stacked structure, the vibration transmitting plate 400 may also be close to the center from the two edges of the stacked structure. section. Moreover, the distance between the stacked structure and the vibration transmitting plate 400 may be different from each other in at least one region and at least another region. That is, the vibration transmitting plate 400 may have a predetermined curvature and adhere to the edge of the stacked structure.

A composite device module according to an exemplary embodiment and a modified example includes a vibration transmitting body 400 on which a first sheet 200 and a second sheet 300 on which a WPC antenna and an NFC antenna are disposed and stacked on a piezoelectric device 100 are stacked The vibration transmitting body 400 is disposed on a side surface of the stacked structure such that the vibration transmitting body 400 is spaced apart from one surface of the stacked structure (for example, the second sheet 300). However, the composite device module can be realized in various shapes by stacking the piezoelectric device 100, the WPC antenna, and the NFC antenna. This case will be described with reference to FIGS. 7 to 9.

7 through 9 are schematic views of a composite device module in accordance with another exemplary embodiment. Here, FIG. 7 is an exploded perspective view of the composite device module, FIG. 8 is a perspective view illustrating a coupled state of the composite device module, and FIG. 9 is a view illustrating the composite device module A cross-sectional view of the coupled state.

Referring to FIGS. 7 through 9, a composite device module according to another exemplary embodiment may include a piezoelectric device 100, a first sheet 200 disposed on one surface of the piezoelectric device 100 and having a first antenna pattern 210, and A second sheet 300 disposed on the first sheet 200 and having the second antenna pattern 310 and the third antenna pattern 320. Moreover, the composite device module may further include a cover sheet 500 disposed on the second sheet 300, a magnetic sheet 550 disposed under the piezoelectric device 100, and a stack of the first sheet 200 and the second sheet 300 and the cover sheet 500. The frame 600 on the edge of the stacked structure. Here, the piezoelectric device 100 may be smaller in size than each of the first sheet 200 and the second sheet 300. Each of the first sheet 200 and the second sheet 300 may be formed of a polymer material. Also, each of the first sheet 200 and the second sheet 300 may function as a diaphragm for amplifying the sound of the piezoelectric device 100. That is, each of the first sheet 200 and the second sheet 300 can function as a WPC antenna and an NFC antenna as well as a diaphragm. Here, since the content other than the above-described contents (ie, the shape of the pattern, the withdrawal pattern, and the connection pattern) is the same as that of the foregoing embodiment, a detailed description thereof will be omitted.

Each of the first sheet 200 and the second sheet 300 may be formed from a polymer-based or pulp-based material. For example, each of the first sheet 200 and the second sheet 300 may be formed of a resin film. That is, each of the first sheet 200 and the second sheet 300 may be formed of a material having a large loss coefficient of a Young's ratio of about 1 MPa to about 10 MPa, for example, based on ethylene propylene rubber. (ethylene propylene rubber) material And materials based on styrene butadiene rubber. As illustrated in FIG. 9, the edges of the first sheet 200 and the second sheet 300 may be fastened to the frame 600.

The cover sheet 500 is disposed on the second sheet 300 to cover the second antenna pattern 310 and the third antenna pattern 320 disposed on the second sheet 300. The cover sheet 500 can be formed from a polymer based or pulp based material. For example, the cover sheet 500 may be formed of a resin film. That is, the cover sheet 500 may be formed of a material having a large loss factor with a Young's ratio of about 1 MPa to about 10 MPa, such as an ethylene propylene rubber-based material and a styrene-butadiene rubber-based material. The cover sheet 500 may be formed of the same material as the first sheet 200 and the second sheet 300. As illustrated in FIG. 9, the cover sheet 500 may have the same size as the first sheet 200 and the second sheet 300, and the edge of the cover sheet 500 may be fastened to the frame 600. An adhesive may be disposed between the second sheet 300 and the cover sheet 500 to allow the cover sheet 500 to adhere to the second sheet 300. Moreover, an adhesive may be disposed between the first sheet 200 and the second sheet 300 to be attached to each other. The adhesive may comprise an adhesive tape using an adhesive material such as a rubber-based material, an acrylic-based material, and a enamel-based material. When an adhesive tape is used, the adhesive tape may have the same shape and size as the cover sheet 500. Since the adhesive tape has the same size as the cover sheet 500, the edge of the adhesive tape can be fastened to the frame 600 together with the cover sheet 500.

The magnetic sheet 550 can be disposed under the piezoelectric device 100 and spaced apart from the piezoelectric device 100. Here, the magnetic sheet 550 may face one side of the electronic device. Since the magnetic sheet 550 is provided, the magnetic sheet 550 can shield or absorb the WPC antenna And electromagnetic waves generated by the NFC antenna to limit the interference of electromagnetic waves.

The frame 600 can fasten the edges of the first sheet 200 and the second sheet 300, the cover sheet 500, and the magnetic sheet 550 to accommodate the composite device module. Moreover, a cover 610 may be further provided that is spaced apart from the top surface of the cover sheet 500 by a predetermined distance to cover the cover sheet 500. That is, the frame 600 can be used alone, or the cover 610 can be placed on the frame 600. The cover 610 defines a predetermined space between the composite device module and the cover 610. The space may be a vibration space for a piezoelectric speaker.

The composite device module can be in contact with an electronic device such as a smart phone. Here, one side of the piezoelectric device 100 may be in contact with the body of the electronic device. Moreover, the composite device module can be separately coupled to the electronic device 10. For example, a body having the same shape as the battery cover for covering the rear surface of the electronic device 10 may be provided, and the composite device module may be coupled to a predetermined area of the body to allow the body to be mounted behind the electronic device On the surface. Moreover, a predetermined groove may be defined in a predetermined area of the rear surface of the electronic device, and the composite device module may be installed in the groove. A composite device having the above structure according to an exemplary embodiment will be described below.

10 to 14B are schematic diagrams of a composite device, that is, a schematic view of a composite device of a back cover assembly of an electronic device, according to an exemplary embodiment. That is, FIG. 10 is a front perspective view of a composite device according to an exemplary embodiment, and FIG. 11 is a schematic diagram for explaining a coupling method between the composite device and the composite device module. Moreover, FIG. 12 is an exploded perspective view of the composite device module, and FIGS. 13 to 14B are schematic views illustrating modified examples of the composite device according to an exemplary embodiment.

Referring to Figures 10 and 12, a composite device according to an exemplary embodiment may include a coupling The main body 1000 is coupled to the rear surface of the electronic device 10, and the composite device module 2000 is disposed on an area of the main body 1000 and connected to the electronic device 10. The body 1000 on which the composite device module 2000 is disposed may be coupled after separating the back cover for covering the rear surface of the electronic device 10. Alternatively, the body 1000 may be provided as a back cover to cover the rear surface of the electronic device 10. Moreover, as illustrated in FIG. 13, the composite device may further include a flip cover 3000 disposed on one side surface of the main body 1000 and having a size sufficient to cover the front surface of the electronic device 10 to cover the front surface of the electronic device 10.

The electronic device 10 to which the present invention is applied may include a portable terminal such as a tablet PC, a smart phone, and the like. In the present embodiment, a smart phone can be described as an example. The electronic device 10 may be in a rectangular shape having a predetermined thickness. A display unit, a receiving unit, a button may be disposed on a front surface of the electronic device 10, and a circuit device may be provided in the electronic device 10. In the electronic device 10, a back cover for covering the rear surface of the electronic device 10 may be separately coupled. When the back cover is removed, the battery can be coupled to a predetermined area of the rear surface of the electronic device 10. Here, the NFC terminal and the WPC terminal can be exposed, and a camera can be provided.

The body 1000 can be separately coupled to the electronic device 10. That is, the body 1000 may have the same shape as the back cover for covering the rear surface of the electronic device 10. Moreover, the body 1000 can be portable and coupled to the rear surface of the electronic device 10 after the back cover is separated. Alternatively, the body 1000 itself may be provided as a back cover. Here, the electronic device 10 may be manufactured in a state where the main body 1000 is coupled to the rear surface of the electronic device 10. In order to separately couple the body 1000 to the electronic device 10, at least one coupling groove (not shown) may be defined in an edge of the rear surface of the electronic device 10, and may be in the main At least one coupling protrusion (not shown) is disposed on a region of the body 1000 corresponding to the coupling groove. Accordingly, the coupling protrusion of the body 1000 can be inserted into the coupling groove of the electronic device 10 to allow the body 1000 to be coupled to the electronic device 10. The body 1000 can be flexible such that the body 1000 can be deformed, such as within a predetermined range. To this end, the body 1000 may be formed of polyimide (PI) or polycarbonate (PC). Alternatively, the body 1000 may be formed of a metal. The body 1000 may be formed of the same material as the back cover of the electronic device 10. Polyimine (PI) can be a polymer that is a thermally conductive plastic and has excellent mechanical strength as well as thermal and chemical stability. Polycarbonate (PC) can be a thermoplastic resin and has excellent heat resistance, impact resistance, and optical properties, and thus has excellent workability. A first opening 1100 having a predetermined size may be defined in the body 1000. The composite device module 2000 can be inserted into the first opening 1100. The second opening 1200 may be further defined in the body 1000 to allow a camera (not shown) exposed to the rear surface of the electronic device 10 to be exposed. That is, the piezoelectric speaker module 2000 can be inserted into the first opening 1100, and the camera can be exposed to the outside through the second opening 1200.

The composite device module 2000 can be inserted into the first opening 1100 of the body 1000 and then secured to a predetermined area of the body 1000. The composite device module 2000 can include the piezoelectric device 100 described with reference to FIGS. 1 through 7, a first sheet 200 on which a portion of a WPC antenna is disposed, and a second sheet 300 on which a WPC antenna and a portion of the NFC antenna are disposed. In more detail, as illustrated in FIG. 12, the composite device module 2000 may include a piezoelectric device 100, a stacked structure of the first sheet 200 and the second sheet 300, and connection terminals 710 and 720 disposed on predetermined regions of the stacked structure. Placement A bottom vibration transmitting shell 800 is used below the stacked structure to serve as a vibration transmitting body, and a top cover 900 disposed above the stacked structure. That is, the first sheet 200 and the second sheet 300 are disposed between one surface of the piezoelectric device 100 and the bottom vibration transmitting shell 800, and the top cover 900 is disposed on the other surface of the piezoelectric device 100. Moreover, the composite device module 2000 may further include: a first adhesive tape (not shown) for allowing the stacked structure including the piezoelectric device 100 to be attached to the bottom vibration transmitting casing 800; and a second adhesive tape (not shown) Shown) for allowing the piezoelectric device 100 to be attached to the top cover 900. Here, the bottom vibration transmitting casing 800 may be spaced apart from one surface of the second sheet 300 by a predetermined distance to serve as a vibration transmitting plate of the piezoelectric device 100. Here, the bottom vibration transmitting casing 800 may have a structure different from that of the vibration transmitting plate, and is different in position from the top cover 900.

The connection terminals 710 and 720 may be disposed on a predetermined area of the stacked structure and exposed to the outside of the composite device module 2000. The connection terminal 710 can connect the piezoelectric device 100 to the electronic device 10, and the connection terminal 720 can connect the WPC antenna and the NFC antenna to the electronic device 10. That is, the connection terminal 710 may be connected to an output terminal of the electronic device 10 to supply predetermined electric power and sound source into the piezoelectric device 100, and the connection terminal 720 may be connected to an NFC terminal exposed to a rear surface of the electronic device 10 ( Not shown) and WPC terminals (not shown). Therefore, the piezoelectric speaker can be operated by receiving power and a sound source from the electronic device 10 via the connection terminal 710. Moreover, the electronic device 10 can be charged by using a WPC antenna via the connection terminal 710 and connected to the NFC antenna to perform near field communication. For example, the connection terminals 710 and 720 can be obtained by using a flexible printed circuit board (FPCB). Manufacturing. The connection terminal 700 may be attached close to and fixed to a predetermined area of the body 1000 exposed to the outside of the composite device module 2000. Here, the receiving groove may be defined in one region of the body 1000, and each of the connection terminals 710 and 720 may be attached and fixed to the receiving groove.

The bottom vibration transmitting housing 800 can house a stacked structure including the piezoelectric device 100 and is inserted and coupled to the first opening 1100 of the body 1000. The bottom vibration transmitting housing 800 includes a base 810 and a coupling portion 820 that protrudes upward from one surface of the base 810. The pedestal 810 may be sized larger than the first opening 1100 of the body 1000 and exposed to the rear surface of the body 1000. Therefore, the base 810 can be disposed on the rear surface of the body 1000 to protrude from the rear surface of the body 1000. Moreover, the base 810 can have various shapes such as a rectangular shape, a circular shape, a polygonal shape, and the like. For example, as illustrated in Figure 12, the base 810 can have an oblong shape. The pedestal 810 may be formed of the same material as the body 1000. Moreover, the base 810 may have a flat inner surface or an inner surface having a predetermined curvature. That is, the inner surface of the base 810 facing the second sheet 300 may be spaced apart from the second sheet 300 by a predetermined distance. Moreover, the inner surface of the base 810 may have a predetermined curvature such that the separation distance between the inner surface and the second sheet 300 gradually increases from the edge of the inner surface toward the central portion. The coupling portion 820 may protrude from the base 810 in a predetermined shape to accommodate the stacked structure. To this end, the coupling portion 820 may have the same shape as the stacked structure and protrude upward from the base 810. Therefore, the side surface of the stacked structure can fixedly contact the inner surface of the coupling portion 820. Moreover, the bottom vibration transmitting housing 800 can include a stepped portion that is higher in the coupling portion 820 than the base 810. For example, the step The points may be disposed at a height lower than the height of one side surface in the two side surfaces facing each other, and the edge of the stacked structure may be attached to the stepped portion by the first adhesive tape. Moreover, since the stacked structure is disposed on the stepped portion, a predetermined space is defined between one surface of the stacked structure and the bottom vibration transmitting casing 800 facing the one surface of the stacked structure (ie, the inner plane of the pedestal 810).

The top cover 900 can protect the stacked structure from physical forces applied from the outside and cover one surface of the piezoelectric device 100. That is, the top cover 900 can be attached to the edge of one surface of the piezoelectric device 100 by using the second adhesive tape. The top cover 900 can be manufactured by using a thin plate that is not easily bent due to high strength and hardness. For example, the top cover 900 can be formed from stainless steel. Moreover, in the case where the top cover 900 contacts one surface of the piezoelectric device 100, when the piezoelectric device 100 vibrates, the piezoelectric device 100 can collide with the top cover 900 to transmit the vibration of the piezoelectric device 100 through the top cover 900 to In the electronic device 10. Therefore, the vibration of the piezoelectric device 100 can be reduced. To prevent this, a spacer (not shown) may be placed between the piezoelectric device 100 and the top cover 900. That is, the pads may be disposed on both edges of the piezoelectric device 100 to maintain a predetermined distance between the top cover 900 and the piezoelectric device 100.

As illustrated in Figures 14A-14B, a liner 1300 surrounding the composite device module 2000 can be disposed on an interior surface of the body 1000. Since the gasket 1300 is provided, the volume of the composite device module 2000 can be provided to reduce the noise of the electronic device 10 due to the vibration of the composite device module 2000. Here, the gasket 1300 may be formed of, for example, a tantalum material. Moreover, the gasket 1300 may have various shapes such as a circular shape and a rectangular shape to surround the composite device module 2000. Moreover, the pad 1300 can be attached The body 1000 is inserted into a predetermined accommodation space 1310 defined in the body 1000. That is, the first and second partition walls have a predetermined distance therebetween to surround the composite device module 2000. Here, the gasket 1300 may be inserted between the first and second partition walls. Here, the gasket 1300 may contact the rear surface of the electronic device 10. If the liner 1300 has a height that is too high, the body 1000 cannot be coupled to the electronic device 10. Accordingly, the gasket 1300 can have a height that enables the body 1000 to be coupled to the electronic device 10.

15 to 17 are schematic views of a portable piezoelectric speaker according to another exemplary embodiment. That is, FIGS. 15 and 16 are schematic and exploded perspective views of a portable piezoelectric speaker according to another exemplary embodiment, and FIG. 17 is a schematic view illustrating a modified example of the portable piezoelectric speaker.

15 and 16, a portable piezoelectric speaker according to another exemplary embodiment may include a main body 1000 coupled to a rear surface of the electronic device 10, a composite disposed on an area of the main body 1000 and connected to the electronic device 10 The device module 2000 is disposed on an area of the body 1000 to supply power to the power supply portion 4000 in the composite device module 2000. Moreover, as illustrated in FIG. 17, the portable piezoelectric speaker may further include a flip cover 3000 that covers the front surface of the electronic device 10 from one side surface of the main body 1000.

The body may include a first region 1000a corresponding to a rear surface of the electronic device 10 and a second region 1000b disposed below the first region 1000a and on which the power source portion 4000 is disposed. That is, the first region 1000a of the body 1000 may have the same size as the electronic device 10 and thus be coupled to the rear surface of the electronic device 10. Moreover, the second region 1000b may be further disposed under the first region 1000a Corresponding to the lower side of the electronic device 10. Here, the electronic device 10 may be coupled to the first region 1000a of the body 1000 in a state in which the back cover is removed. That is, similar to the foregoing embodiment, the back cover of the electronic device 10 is removed, and then, the main body 1000 is coupled to the rear surface of the electronic device 10. Moreover, the intermediate wall 1000c higher than the bottom surface of the body 1000 may be disposed between the first region 1000a and the second region 1000b. The intermediate wall 1000c may have a height corresponding to a lower portion of the electronic device 10 on which the connector is disposed. That is, a plurality of coupling protrusions (not shown) may be disposed on the edge of the first region 1000a of the body 1000. Each of the plurality of coupling protrusions can be inserted and coupled to a coupling groove (not shown) of the electronic device 10. Moreover, the intermediate wall 1000c may have the same height as the lower surface of the electronic device 10 to contact the lower surface. Here, the central portion of the intermediate wall 1000c corresponding to the connector of the electronic device 10 is removed to form a first groove 1310 in the intermediate wall 1000c corresponding to the size of the connector. Moreover, a predetermined area of the intermediate wall 1000c spaced apart from the central portion thereof in one direction may be removed to form the second groove 1320 in the intermediate wall 1000c. A first opening 1100 having a predetermined size is defined in the first region 1000a of the body 1000, and the piezoelectric speaker module 2000 is inserted into the first opening 1100. Moreover, a space for mounting a DMB antenna, a Bluetooth antenna, and the like may be defined in a predetermined area of the first region 1000a of the main body 1000, for example, under the first opening 1100 in which the speaker module 2000 is inserted. The space for mounting the antenna may correspond to a space for mounting a battery of the electronic device 10. An upper cover 1400 attached to the first region 1000a to cover the first region 1000a may be provided. That is, the composite device module 2000 and the antenna can be disposed on the first region 1000a of the body 1000 and subsequently exposed to external. Here, the upper cover 1400 may cover the composite device module 2000 and the antenna to prevent the composite device module 2000 and the antenna from being exposed to the outside. The upper cover 1400 may have a size corresponding to the size of at least the first region 1000a.

The power supply portion 4000 may be disposed on an area of the main body 1000 corresponding to the lower side of the electronic device 10. That is, the power supply portion 4000 may be disposed on the second region 1000b extending from the first region 1000a of the main body. The power supply section 4000 can supply power into the composite device module 2000 (ie, the piezoelectric speaker). That is, the power supply portion 4000 can generate and supply the power required to operate the piezoelectric speaker. The power supply section 4000 can be connected to an external power supply terminal or a data supply terminal. Moreover, the power supply portion 4000 can be connected to the electronic device 10. That is, the external power supply terminal or the data supply terminal can be connected to one side of the power supply portion 4000, and the electronic device 10 can be connected to the other side of the power supply portion 4000. The power supply portion 4000 can include a battery 4100, a circuit board 4200, a first connector 4300, and a second connector 4400, and a lower cover 4500. The battery 4100 can be charged by power supplied via a power terminal connected to the first connector 4300. The circuit board 4200 may have an upper portion on which the first connector 4300 and the second connector 4400 are disposed and a lower portion connected to the battery 4100. Moreover, the first connector 4300 can be connected to an external power supply terminal or a data supply terminal, and the second connector 4400 can be connected to the electronic device 10. The power supply section 4000 will now be described in more detail. A portion of the second region 1000b corresponding to the first groove 1310 of the intermediate wall 1000c may be reduced to form the third groove 1330. The first connector 4300 can be configured to correspond to the third groove 1330 and the second connector 4400 can be configured to correspond to the first groove 1310. Here, the first connector 4300 can be buried in the power supply portion 4000, The first connector 4300 is made not to be exposed to the outside. The second connector 4400 can be exposed to the first region 1000a. That is, the battery 4100, the circuit board 4200, the first connector 4300, and the second connector 4400 are disposed on the second region 1000b. When the lower cover covers the upper side of the second region 1000b, the recess in which the first connector 4300 is buried may be exposed to the lower side of the power supply portion 400, and the second connector 4400 protrudes to the upper side of the power supply portion 4000. Moreover, the first connector 4300 may be sized to allow a power terminal or a data supply terminal to be inserted therein. The second connector 4400 may be sized to allow the connector of the electronic device 10 to be inserted therein. That is, the power terminal or the data supply terminal is inserted into the first connector 4300, and the second connector 4400 is inserted into the connector of the electronic device 10. The first connector 4300 and the second connector 4400 are connected to a circuit board 4200 disposed therebelow. Moreover, the battery 4100 can be disposed below the circuit board 4200, and the connection line 4210 can extend from a region of the circuit board 4200. Accordingly, the circuit board 4200 can charge the battery 4100 by using the power supplied via the first connector 4200. Moreover, the power of the battery 4100 can be supplied to the piezoelectric speaker module 2000 through the connection line 4210. Here, a power amplifying circuit may be disposed on the circuit board 4200 to amplify power supplied to the piezoelectric speaker. That is, the piezoelectric speaker can operate at a power higher than the driving power of the electronic device 10. Here, the power supply portion 4000 can generate and supply the driving power of the piezoelectric speaker. Moreover, the connecting wire 4210 disposed on one side of the circuit board 4200 is connected to the piezoelectric speaker module 2000 disposed on the first region 1000a through the second recess 1320 of the intermediate wall 100c. Since the second connector 4400 is connected to the electronic device, power or material can be supplied to the electronic device 10 through the first connector 4300 and the second connector 4400. So by making The portable device can be used to charge the electronic device 10 by amplifying the sound. Here, when the electronic device 10 is charged, the battery 4100 of the power supply portion 4000 can also be charged. Therefore, the piezoelectric speaker can be operated by the battery 4100.

The body 1000 to which the composite device 200 is coupled in the exemplary embodiment may contact the rear surface of the electronic device 10 to primarily amplify the sound output from the electronic device 10. Subsequently, the electronic device 10 to which the body 1000 is coupled may contact a predetermined object to secondary amplify the primary amplified sound. In order to amplify the sound of the electronic device 10, a sound amplification box having a predetermined shape may be used. The sound amplification box will be described with reference to Figs.

Figure 18 is a perspective view of the sound amplification box, Figure 19 is a rear view of the sound amplification box, and Figure 20 is a cross-sectional view of the sound amplification box. Fig. 21 is a graph illustrating the results obtained by comparing the frequency characteristics of the sound amplification box with the frequency characteristics of the dynamic speaker.

Referring to FIGS. 18 to 20, the sound amplification box 5000 may include a main body 5100 having a predetermined space therein. Moreover, the sound amplification box 5000 may further include a vibration transmitting portion 5200 disposed on one surface of the main body 5100 and a support portion 5300 disposed on the other surface of the main body 5100. That is, the sound amplification box 5000 according to an exemplary embodiment may be constituted only by the main body 5100 having an internal space without providing the vibration transmitting portion 5200 and the support portion 5300.

The main body 5100 includes an upper plate 5110 and a lower plate 5120 each having an approximately rectangular shape, and a plurality of side wall plates 5130 having an approximately rectangular shape and disposed on an edge between the upper plate 5110 and the lower plate 5120. That is, the upper plate 5110 And the lower plate 5120 are configured to face each other. Moreover, four side wall panels 5130 may be disposed on the edges between the upper panel 5110 and the lower panel 5120, respectively. Therefore, the body 5100 can have an approximately hexahedral shape. The upper panel 5110 can be defined as a surface on which the electronic device 10 including a portable terminal (eg, a smart phone) is placed, and the lower panel 5120 can be defined as a surface facing the ground facing the upper panel 5110. Here, the size of the upper plate 5110 may be larger than the size of the electronic device 10. Therefore, one surface of the electronic device 10 can contact the top surface of the upper plate 5110 and rest on the top surface. Moreover, the lower plate 5120 can have the same size and shape as the upper plate 5110. Since the body 5100 has an approximately hexahedral shape, a predetermined resonance space can be defined in the body 5100. Alternatively, body 5100 can have various solid structures, such as cylindrical shapes, polyhedral shapes, and the like. For example, each of the upper plate 5110 and the lower plate 5120 may have a circular shape, and the side wall plate 5130 may be disposed in a band shape on an edge between the upper plate 5110 and the lower plate 5120. Therefore, the body 5100 can have a cylindrical shape. Moreover, the resonance hole 5100a having a predetermined size may be defined in a predetermined region of the lower plate 5120. Since the resonance hole 5100a is provided, the air inside the main body 5100 can be discharged to the outside. Therefore, even if the electronic device 10 has a low output, the sound can be sufficiently amplified. Therefore, the low-pitched sound can be clearly heard. For example, the resonant hole 5100a may have a circular shape, but the present invention is not limited to the shape of the resonant hole 5100a. That is, the resonance hole 5100a may have a polygonal shape such as an elliptical shape, a square shape, a pentagonal shape, and the like. Moreover, at least one resonant hole 5100a may be provided. For example, a resonant aperture 5100a can be defined in the central region of the lower plate 5120 and can be under At least two resonant holes 5100a are defined in at least two regions of the plate 5120. Moreover, at least one resonant aperture 5100a can be defined in at least one of the side wall panels 5130 and the lower panel 5120. Here, the resonance hole 5100a may have a size that can be adjusted according to the volume of the body 5100 and the degree of amplification of the sound. For example, when the resonant hole 5100a is defined in the lower plate 5120, the resonant hole 5100a may have an area of about 10% to about 80% of the total area of the lower plate 5120. Here, the more the area of the resonance hole 5100a is reduced, the more the frequency band to be amplified is reduced. On the other hand, the more the area of the resonance hole 5100a is increased, the more the frequency band to be amplified is increased. For example, when the resonant hole 5100a having the first surface area is provided, a frequency of about 1 KHz to about 1.5 KHz can be amplified. When a resonant aperture 5100a having a second surface area greater than the first surface area is provided, a frequency of about 800 Hz to about 2 KHz can be amplified. Moreover, when the surface area of the resonance hole 5100a is increased, the sound pressure can be relatively increased. That is, when the resonance hole 5100a having the second surface area larger than the first surface area is provided, the sound pressure can be relatively increased when compared with the resonance hole 5100a having the first surface area. The body 5100 may be formed of a material that is hard and has excellent vibration transmitting properties. However, if the body 5100 is too light, the body 5100 may be excessively vibrated, and thus the sound may be unclear. On the other hand, if the main body 5100 is too hard and heavy, it is possible to output an unnatural sound. Therefore, the material of the body can be selected in consideration of the volume of the body 5100. In the same volume, the body 5100 can be formed from a relatively heavy material. For example, body 5100 can be formed from hardwood, glue laminate wood, pulp, paper, medium density fiberboard (MDF), metal, plastic, and the like.

The vibration transmitting portion 5200 may be disposed on the upper plate 5110 of the main body 5100 On the predetermined area. For example, the vibration transmitting portion 5200 can contact the electronic device 10 disposed on the central portion of the upper plate 5110. The vibration transmitting portion 5200 may be formed of a material different from that of the body 5100 to transmit the vibration output from the electronic device 10 into the vibration space within the body 5100. Of course, even if the vibration transmitting portion 5200 is not provided, the sound (ie, vibration) of the electronic device 10 can be transmitted to the main body 5100. However, since the vibration transmitting portion 5200 is provided, the vibration transmission efficiency can be more improved. Moreover, since the vibration transmitting portion 5200 is provided, secondary noise can be reduced, and the electronic device 10 can also be fixed. In order to achieve the above properties, the vibration transmitting portion 5200 may be formed of, for example, ruthenium, ethylene-vinyl acetate copolymer (EVA) or the like having high elasticity. Therefore, the adhesive force of the electronic device 10 can be improved to efficiently transmit the vibration of the electronic device 10 into the main body 5100. In addition, the sliding of the main body 5100 can be reduced to stably mount the electronic device 10. The vibration transmitting portion 5200 may have a surface disposed at a height higher than the upper plate 5110 of the main body 5100. That is, the vibration transmitting portion 5200 may be disposed on the top surface of the upper plate 5100 to protrude from the upper plate 5110. Alternatively, the upper plate 5110 may have a groove having a predetermined depth, and the vibration transmitting portion 5200 may be buried in the groove.

The support portion may be disposed on a predetermined area of the lower plate 5120. For example, the support portion 5300 can be disposed on each of the four corners of the lower plate 5120. That is, the support portion 5300 can be disposed in a region contacting the side wall panel 5130. Since the support portion 5300 is provided, the lower plate 5120 does not contact the ground. That is, a space can be defined between the lower plate 5120 and the ground through the support portion 5300. The air is allowed to flow smoothly through the resonance hole 5100a and also provides a secondary resonance space. The support portion 5300 may be formed of rubber, foam, or the like to prevent the body 5100 from shaking or sliding.

In the main body 5100 of the sound amplification box 5000, at least the upper plate 5110 may be formed of a material having sufficient elasticity. That is, since the upper plate 5110 directly contacts the electronic device 10 to serve as a diaphragm for transmitting the vibration of the electronic device 10, the upper plate 5110 can be formed sufficiently elastic. In order to obtain a high output by changing the material of the upper plate 5110, a high Young's ratio is required. However, in order to produce flat frequency characteristics, a low elastic modulus is required. If the modulus of elasticity is higher, the sound pressure increases. However, a particular frequency can be added (emphasized) in the output to prevent flat frequency characteristics. Therefore, in order to achieve high sound pressure and high sound quality, the elastic modulus of the upper plate 5110 may be within a sufficient range according to the transmission structure of the vibration source (i.e., the electronic device 10). Moreover, the upper plate 5110 can have a light quality due to smooth vibration. However, if the quality of the upper plate 5110 is reduced, the resonance frequency may be increased to deteriorate the sound quality. Therefore, a specific elastic coefficient (=elastic coefficient/density) can be adjusted to manufacture an upper plate 5110 having an optimum combination of speaker efficiency and resonant frequency. Moreover, the sound amplification box can contact the electronic device 10 including the contact type speaker to amplify the sound. Therefore, the upper plate 5110 must be exposed in a predetermined area (ratio) in the direction of at least one side surface of the electronic device 10. That is, the size of the upper plate 5110 must be larger than the size of the electronic device 10. In order to satisfy the above conditions, a sandwich-type plate can be used at least as the upper plate 5110. For example, a sandwich panel can be formed from a polymer-based material having a density of from about 10.0 kg/m ² to about 20.0 kg/m ² and from about 2500×10 ⁶ N/m ² to about 3500×10 ⁶ The elastic modulus of N/m ² . In order to improve the impedance matching property with air, a pulp having a density of about 100 kg/m ² to about 300 kg/m ² and an elastic modulus of about 100×10 ⁶ N/m ² to about 200×10 ⁶ N/m ² is attached to A sandwich panel of each of its two surfaces can be used as the upper panel 5110. For example, the upper plate 5110 can be fabricated by using a plate in which the pulp is attached to each of the two surfaces of the polystyrene. Of course, in addition to the upper plate 5110, the lower plate 120 and the plurality of side wall plates 5130 can also be manufactured by using a sandwich type plate.

Fig. 21 is a graph illustrating the results obtained by comparing the frequency characteristic A of the sound amplification box with the frequency characteristic B of the dynamic speaker. Table 1 illustrates the results obtained.

As described above, when a sound amplification box manufactured by using a sandwich type panel is used, the resonance frequency can be reduced when compared with the resonance frequency of the dynamic speaker, and the frequency characteristic can be at all when compared with the frequency characteristic of the dynamic speaker. Improved in the frequency band.

According to an exemplary embodiment, the piezoelectric speaker, the WPC antenna, and the NFC antenna may be assembled into one module to manufacture a multifunctional composite device. Moreover, a body having the same shape as the back cover of the portable electronic device can be provided, and the piezoelectric speaker is assembled therein The composite device module of the WPC antenna and the NFC antenna can be coupled to a predetermined area of the body.

Accordingly, the body of the portable composite device can be coupled to the rear surface of the electronic device to amplify the sound level of the portable electronic device by using the piezoelectric speaker, wirelessly charge the electronic device through the WPC antenna, and perform by using the NFC antenna. Near field communication.

In addition, since the multifunctional composite device is manufactured in an ultra-thin shape, the composite device can be reduced in size and easily carried.

Although the composite device and the electronic device having the composite device have been described with reference to specific embodiments, they are not limited thereto. It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as defined by the appended claims.

100‧‧‧ Piezoelectric device

110a, 110b‧‧‧ electrode pattern

200‧‧‧ first sheet

210‧‧‧First antenna pattern

220a‧‧‧first withdrawal pattern

220b‧‧‧second withdrawal pattern

231, 232, 233‧‧‧ connection pattern

240a‧‧‧ Third withdrawal pattern

240b‧‧‧ fourth withdrawal pattern

250a, 250b, 341a, 341b, 342‧‧‧ through holes

300‧‧‧Second sheet

310‧‧‧second antenna pattern

320‧‧‧third antenna pattern

331-338, 339a, 339b‧‧‧ holes

400‧‧‧Vibration transfer board

Claims (22)

A composite device comprising: a stacked structure, wherein a piezoelectric device, a first sheet and a second sheet are stacked in the stacked structure; a first wireless charging antenna pattern disposed on one surface of the first sheet; a wireless charging antenna pattern disposed on one surface of the second sheet and coupled to the first wireless charging antenna pattern; a near field communication antenna pattern disposed on one surface of the second sheet and located at a second wireless charging antenna pattern; and a vibration transmitting body contacting at least one region of the stacked structure in which the piezoelectric device, the first sheet, and the second sheet are stacked, and the vibration transmitting body And being disposed to be spaced apart from a surface of the stacked structure; wherein the first wireless charging antenna pattern and the second wireless charging antenna pattern are connected to each other to constitute a wireless charging antenna. The composite device of claim 1, further comprising: a first connection hole defined in the second sheet to connect the first and second wireless charging antenna patterns to each other; and a first withdrawal And a pattern disposed on the first sheet, the first withdrawal pattern being coupled to the first wireless charging antenna pattern and evacuated to the outside. The composite device of claim 2, wherein the near field communication antenna is disposed on the second sheet and the second wireless charging antenna pattern Externally, and at least a portion of the near field communication antenna is cut. The composite device of claim 3, further comprising: at least one connection pattern disposed on the first sheet; at least one second connection hole defined in the second sheet to be A near field communication antenna is coupled to the connection pattern; and a second withdrawal pattern is disposed on the first sheet, the second withdrawal pattern being coupled to the near field communication antenna and evacuated to the outside. The composite device of claim 4, wherein the first sheet comprises a magnetic sheet and the second sheet comprises a non-magnetic sheet. The composite device of claim 5, wherein the piezoelectric device and the first and second sheets are co-fired. The composite device of claim 4, wherein each of the first and second sheets is formed of a polymer. The composite device of claim 7, further comprising a cover sheet disposed on the second sheet and a magnetic sheet spaced apart from another surface of the piezoelectric device. The composite device of claim 8, further comprising: a frame configured to fasten an edge of the stacked structure including the first and second sheets; and a cover disposed on the frame On at least one side. A composite device comprising: a body separately coupled to a rear surface of the electronic device; a composite device module coupled to a predetermined area of the main body, wherein the composite device module is composed of a piezoelectric device coupled to each other, a wireless charging antenna, and a near field communication antenna, wherein the composite device module includes: a stacked structure, Wherein the piezoelectric device, the first sheet and the second sheet are stacked in the stacked structure; a first wireless charging antenna pattern disposed on one surface of the first sheet; and a second wireless charging antenna pattern disposed in the a surface of the second sheet and connected to the first wireless charging antenna pattern; a near field communication antenna pattern disposed on one surface of the second sheet and outside the second wireless charging antenna pattern; And a vibration transmitting body contacting at least one region of the stacked structure in which the piezoelectric device, the first sheet, and the second sheet are stacked, and the vibration transmitting body is configured to be one of the stacked structures The surfaces are spaced apart; wherein the first wireless charging antenna pattern and the second wireless charging antenna pattern are connected to each other to constitute the wireless charging Line. The composite device of claim 10, wherein the wireless charging antenna further comprises: a first connection hole defined in the second sheet to pattern the first and second wireless charging antennas from each other Connecting; and a first withdrawal pattern disposed on the first sheet, the first withdrawal map The case is connected to the first wireless charging antenna pattern and is withdrawn to the outside. The composite device of claim 11, wherein the near field communication antenna comprises: a near field communication antenna pattern disposed on the second sheet and outside the second wireless charging antenna pattern and At least one portion is cut; at least one connection pattern disposed on the first sheet; at least one second connection hole defined in the second sheet to connect the near field communication antenna to the connection a pattern; and a second withdrawal pattern disposed on the first sheet, the second withdrawal pattern being coupled to the near field communication antenna and evacuated to the outside. The composite device of claim 12, wherein the first sheet comprises a magnetic sheet, and the second sheet comprises a non-magnetic sheet, and the piezoelectric device and the first and second sheets are Co-fired. The composite device of claim 12, wherein each of the first and second sheets is formed of a polymer, and the composite device further comprises a cover sheet disposed on the second sheet And a magnetic sheet spaced apart from the other surface of the piezoelectric device. The composite device of claim 10, wherein the body has the same shape as the back cover of the electronic device and is coupled after the back cover of the electronic device is separated. The composite device of claim 15, wherein the opening is defined in a predetermined area of the body, and The composite device module is inserted into the opening. The composite device of claim 15, wherein the body has a predetermined area that protrudes outward to define an accommodation space therein such that the composite device module is inserted into the accommodation space. The composite device of claim 15, wherein the composite device module comprises: a first connection terminal, one side of which is connected to the piezoelectric device and the other side of which is exposed to the outside, the first connection a terminal connected to a sound output terminal disposed on a rear surface of the electronic device; and a second connection terminal connected to the wireless charging antenna and the near field communication antenna on one side and exposed to the outside on the other side The second connection terminal is connected to a wireless charging terminal and a near field communication terminal disposed on the rear surface of the electronic device. The composite device of claim 15, further comprising a flip cover disposed on one side surface of the main body to cover a front surface of the electronic device. An electronic device, a composite module coupled to a rear surface of the electronic device, wherein the electronic device includes: a body coupled to the rear surface of the electronic device separately; and a composite device module coupled to the a predetermined area of the main body, wherein the composite device module is composed of a piezoelectric device coupled to each other, a wireless charging antenna, and a near field communication antenna, wherein the composite device module includes: a stacked structure in which a piezoelectric device, a first sheet, and a second sheet are stacked in the stacked structure; a first wireless charging antenna pattern disposed on one surface of the first sheet; and a second wireless charging antenna pattern And disposed on a surface of the second sheet and connected to the first wireless charging antenna pattern; a near field communication antenna pattern disposed on one surface of the second sheet and located in the second wireless charging antenna pattern And a vibration transmitting body contacting at least one region of the stacked structure in which the piezoelectric device, the first sheet, and the second sheet are stacked, and the vibration transmitting body is configured to be stacked with the stack One surface of the structure is spaced apart; wherein the first wireless charging antenna pattern and the second wireless charging antenna pattern are connected to each other to constitute the wireless charging antenna. The electronic device of claim 20, wherein the vibration transmitting body is away from or close to the piezoelectric device from an edge thereof toward a central portion thereof, or maintains a distance with respect to the piezoelectric device. The electronic device of claim 21, wherein the vibration transmitting body of the composite device module contacts a vibration amplifying object to amplify sound pressure and output output from the piezoelectric device.