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TWI560845B - Method of manufacturing a semiconductor package having a small gate clip and clip frame - Google Patents

Method of manufacturing a semiconductor package having a small gate clip and clip frame

Info

Publication number
TWI560845B
TWI560845B TW103142092A TW103142092A TWI560845B TW I560845 B TWI560845 B TW I560845B TW 103142092 A TW103142092 A TW 103142092A TW 103142092 A TW103142092 A TW 103142092A TW I560845 B TWI560845 B TW I560845B
Authority
TW
Taiwan
Prior art keywords
clip
manufacturing
semiconductor package
small gate
frame
Prior art date
Application number
TW103142092A
Other languages
Chinese (zh)
Other versions
TW201622098A (en
Inventor
Yan Xun Xue
Hamza Yilmaz
Yueh-Se Ho
Jun Lu
Ming-Chen Lu
Hongtao Gao
Original Assignee
Alpha & Omega Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha & Omega Semiconductor filed Critical Alpha & Omega Semiconductor
Priority to TW103142092A priority Critical patent/TWI560845B/en
Publication of TW201622098A publication Critical patent/TW201622098A/en
Application granted granted Critical
Publication of TWI560845B publication Critical patent/TWI560845B/en

Links

TW103142092A 2014-12-04 2014-12-04 Method of manufacturing a semiconductor package having a small gate clip and clip frame TWI560845B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103142092A TWI560845B (en) 2014-12-04 2014-12-04 Method of manufacturing a semiconductor package having a small gate clip and clip frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103142092A TWI560845B (en) 2014-12-04 2014-12-04 Method of manufacturing a semiconductor package having a small gate clip and clip frame

Publications (2)

Publication Number Publication Date
TW201622098A TW201622098A (en) 2016-06-16
TWI560845B true TWI560845B (en) 2016-12-01

Family

ID=56755592

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103142092A TWI560845B (en) 2014-12-04 2014-12-04 Method of manufacturing a semiconductor package having a small gate clip and clip frame

Country Status (1)

Country Link
TW (1) TWI560845B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040201081A1 (en) * 2003-04-11 2004-10-14 Rajeev Joshi Lead frame structure with aperture or groove for flip chip in a leaded molded package
US20080224315A1 (en) * 2007-03-14 2008-09-18 Sanyo Electric Co., Ltd. Semiconductor device and manufacturing method thereof
US20100072585A1 (en) * 2008-09-25 2010-03-25 Alpha & Omega Semiconductor Incorporated Top exposed clip with window array

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040201081A1 (en) * 2003-04-11 2004-10-14 Rajeev Joshi Lead frame structure with aperture or groove for flip chip in a leaded molded package
US20080224315A1 (en) * 2007-03-14 2008-09-18 Sanyo Electric Co., Ltd. Semiconductor device and manufacturing method thereof
US20100072585A1 (en) * 2008-09-25 2010-03-25 Alpha & Omega Semiconductor Incorporated Top exposed clip with window array

Also Published As

Publication number Publication date
TW201622098A (en) 2016-06-16

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