TW201622098A - Method of manufacturing a semiconductor package having a small gate clip and clip frame - Google Patents

Abstract

A method of manufacturing a semiconductor package having a small gate clip is disclosed. A first and second semiconductor chips, each of which includes a source electrode and a gate electrode at a top surface, are attached on two adjacent lead frame units of a lead frame such that the lead frame unit with the first chip formed thereon is rotated 180 degrees in relation to the other lead frame unit with the second semiconductor chip formed thereon. A first and second clip sets are mounted on the first and second semiconductor chips, wherein the first clip set is connected to the gate electrode of the first chip, the source electrode of the second chip, and their corresponding leads and the second clip set is connected to the gate electrode of the second chip, the source electrode of the first chip and their corresponding leads.

Description

Packaging method based on small gate metal piece and metal sheet frame

The present invention relates to a semiconductor package technology, and more particularly to a package method based on a small gate metal piece and a metal sheet frame.

In the semiconductor component fabrication process, in order to increase current and reduce impedance, a metal foil is widely used in power devices, and a metal foil is generally used as a metal foil such as a copper foil.

As shown in FIG. 1, the circuit connection manner on the semiconductor device includes two methods, namely, metal bond bonding and wire bonding, wherein the metal plate 1' (clip) bonding is commonly used in a semiconductor device. The circuit connection of the pole 3' (source), and the wire 2' (wire) is commonly used for the circuit connection of the gate 4' (gate) in the semiconductor element. However, in practical applications, the metal wire 2' and the metal piece 1' are simultaneously used for circuit connection on the same semiconductor element, and the process thereof is complicated and the production efficiency is low. Moreover, the circuit connection of the semiconductor element by the wire bonding method has the following disadvantages, and it is not possible to conduct a large current, and the uneven length of the wire metal wire affects the inductance characteristics of the semiconductor component at a high frequency.

As shown in Fig. 2, it has been developed that only a metal piece 1' is required to bond a circuit to complete the circuit connection of the source 3' and the gate 4' in the same semiconductor element. However, in order to support this preparation method, the end of the metal piece 1' connected to the gate 4' needs to be enlarged in area for soldering, so that it is necessary to enlarge the area of the gate opening in order to facilitate soldering; The flux overflows, and since the flux is difficult to clean, the wiring process between the layers in which the semiconductor elements are stacked on each other is affected in the manufacturing process of the semiconductor device.

The invention provides a packaging method based on a small gate metal piece and a metal sheet frame, which reduces the area of the gate metal piece and the gate window.

The invention provides a packaging method based on a small gate metal piece, characterized in that the method comprises:

The first wafer and the second wafer are respectively soldered to each other on the prefabricated one pair of connected lead frames; the source of the first wafer corresponds to the gate of the second wafer, and the gate of the first wafer corresponds to the second wafer Source setting

Soldering the first metal sheet frame and the second metal sheet frame; the first metal sheet frame is electrically connected to the gate of the first wafer, the source of the second wafer, and the gate of the first wafer and the second wafer on the lead frame a source corresponding to the pin; the second metal frame is electrically connected to the gate of the second chip, the source of the first chip, and the gate of the second chip on the lead frame respectively corresponds to the source of the first chip Pin.

Preferably, preparing the lead frame may comprise:

Forming, in each set of lead frames, first frame units and second frame units that are connected to each other and inverted to each other;

a first stage unit and a second frame unit respectively prepare a carrier and a pin surrounding the carrier; the carrier of the first frame unit and the pins and the carrier of the second frame unit and the pins Inverted.

Preferably, soldering the first wafer and the second wafer on the lead frame may include:

The first wafer is mounted on one of the lead frames;

After the second wafer having the same structure and the same direction as the first wafer is rotated by 180 degrees with respect to the first wafer, it is mounted on the other stage of the lead frame.

Preferably, after the metal sheet is welded, a plastic sealing layer is coated, and the plastic sealing layer covers the first wafer, the second wafer, the lead frame, the first metal sheet frame and the second metal sheet frame.

Preferably, after the plastic coating layer coating and packaging process is completed, the first metal sheet frame, the second metal sheet frame and the lead frame connected between the first wafer and the second wafer are separated by a pair of lead frames. The joint is separated.

Preferably, the first wafer and the second wafer may be wafers of the same circuit structure.

The invention provides a metal sheet frame, characterized in that the metal sheet frame comprises:

a first metal piece module comprising a separated first gate metal piece and a first source metal piece;

a second metal piece module comprising a separated second gate metal piece and a second source metal piece;

a connection module connecting the first metal piece module and the second metal piece module;

The first metal piece module is flipped relative to the second metal piece module.

Preferably, the connection module may include: a connection strip connecting the first gate metal piece and the second source metal piece; a connection bar connecting the second source metal piece and the first source metal piece; and connecting the first A connecting strip of the source metal piece and the second gate metal piece.

Preferably, the connection module may include: a connection strip connecting the first gate metal piece and the second source metal piece; and a connection bar connecting the first source metal piece and the second gate metal piece.

Preferably, the first gate metal piece or the second gate metal piece is connected to one end of the connection module and may be provided with a pin groove for connecting the lead frame pin; the other end may be provided with a chip gate for connecting Gate groove.

Preferably, one end of the first source metal piece or the second source metal piece connected to the connection module may be provided with a pin groove for connecting the lead frame pin; the other end may be provided with a source for connecting the chip. Source groove.

Preferably, the first gate metal piece or the second gate metal piece can be set to any curved shape, and the curved shape is set according to the process requirements.

A package structure based on a package method of a small gate metal piece, characterized in that the package structure comprises:

a prefabricated lead frame comprising a carrier and a plurality of pins disposed around the carrier;

a wafer disposed on a stage of the lead frame;

a source metal piece having one end connected to the source of the chip and the other end connected to the corresponding pin;

The gate metal piece has one end connected to the gate of the chip and the other end connected to the corresponding pin.

Preferably, adjacent lead frames are inverted from each other.

Preferably, the wafers that can be placed on adjacent lead frames are identical and inverted from each other.

Preferably, the source and gate windows of the wafer can be located on top of it.

Preferably, the pin and the stage can be connected or not connected.

Preferably, the lead portion of the lead frame and the edge portion of the stage may have a plurality of protruding structures for connecting with adjacent lead frames.

Preferably, in the lead frame, a pin connected to the source or gate of the wafer by a metal piece can be separated from the stage.

Preferably, the lead frame, the wafer, the source metal piece and the gate metal piece may be coated with a plastic sealing layer.

The invention is based on the packaging method of the small gate metal piece and the metal sheet frame compared with the packaging technology of the prior art, which has the advantages that the invention reduces the area of the gate metal piece and the gate window, and reduces the gap between the gate and the lead The impedance of the circuit connection is used to increase the current and facilitate the implementation of the gate metal bonding process.

Specific embodiments of the present invention are further described below in conjunction with the drawings.

As shown in Fig. 3, it is a first embodiment of a metal sheet frame of the present invention. The sheet metal frame is made of a metal foil such as a copper sheet. The metal sheet frame comprises: a first metal sheet module located in the left half of FIG. 3, a second metal sheet module located in the right half of FIG. 3, and a middle metal sheet mold in the middle of FIG. The connection module of the group and the second metal piece module. The first metal piece module is used for connecting the source, the gate and the corresponding pin of the first chip; the second metal piece module is used for connecting the source, the gate and the corresponding pin of the second chip.

The first module includes a metal plate located between the first gate electrode on the upper left portion of FIG. 3 the metal sheet 301 (1 ^st set gate clip) and a first source of the third lower-left portion of the electrode metal piece 302 (1 ^st set source clip) . The first gate metal piece 301 and the first source metal piece 302 are parallel to each other and spaced apart from each other, and are electrically connected to the connection module. The top corners of the first source metal piece 302 not connected to one of the connection modules are rounded.

The second metal piece module includes a second source metal piece 303 (2 ^nd set source clip) located at the upper right portion of FIG. 3 and a second gate metal piece 304 (2 ^nd set gate clip) located at the lower right portion of FIG. . The second gate metal piece 304 and the second source metal piece 303 are parallel and spaced apart from each other, and are respectively electrically connected to the connection module. The second source metal piece 303 is not rounded with the two corners on one side of the connection of the connection module.

In the first embodiment, the connection module includes three tie bars 305. The tie bars 305 are not too thick, and the width thereof is less than or equal to the width of the metal piece. The first gate metal piece 301 is electrically connected to the second source metal piece 303 by the first connecting strip 305. The second source metal piece 303 is electrically connected to the first source metal piece by the second connecting strip 305. The first source metal piece 302 is electrically connected to the second gate metal piece 304 by a third connecting strip 305. The metal sheet frame has an overall shape of an S-shaped or inverted S-shaped structure by a connecting strip 305.

It can be seen from the above that in the first embodiment, the first metal piece module and the second metal piece module are arranged in a flip-chip arrangement, that is, two-stage rotation (180 degrees) symmetry. The gate metal piece of the first metal piece module, that is, the first gate metal piece 301, is corresponding to the source metal piece of the second metal piece module, that is, the second source metal piece 303, and is located in FIG. The upper half of the metal sheet frame; and the source metal piece of the first metal piece module, that is, the first source metal piece 302, and the gate metal piece of the second metal piece module, that is, the second gate metal The sheet 304 is correspondingly located in the lower half of the entire sheet metal frame in Fig. 3.

In addition, one side of the first gate metal piece 301 and the first source metal piece 302 are provided with protrusions. In the mass production process of the metal sheet frame, the protrusion is the connection point between the adjacent two metal sheet frames. Similarly, one side of the second source metal piece 303 and the second gate metal piece 304 are also provided with protrusions as a connection point between adjacent two metal piece frames during mass production of the metal piece frame.

As shown in FIG. 4 and in conjunction with FIG. 3, the first source metal piece 302 is electrically connected to the second gate metal piece 304 by a connecting strip 305.

A first source pin recess 309 for connecting the lead frame pins is provided at one end of the first source metal strip 302 and the connecting strip 305. As can be seen from FIG. 3, the first source lead recess 309 It is disposed along one side of the first source metal piece 302 and the connecting strip 305. A first source recess 308 for connecting a source of the first wafer is disposed at one end of the first source metal strip 302 opposite the strap 305. As also shown in FIG. 3, the first source recess 308 is disposed along the opposite side of the first source metal piece 302 from the connecting strip 305.

A second gate pin recess 312 for connecting the lead frame pins is provided at one end of the second gate metal piece 304 and the connecting strip 305. As seen in FIG. 3, the second gate pin recess 312 is visible. It is disposed along one side of the second gate metal piece 304 and the connecting strip 305. A second gate recess 313 for connecting a gate of the second wafer is provided at one end of the second gate metal piece 304 opposite the connection strip 305. As also shown in FIG. 3, the second gate recess 313 is disposed along one of the opposite sides of the second gate metal piece 304 and the connecting strip 305.

Wherein, the first source recess 308 and the second gate recess 313 have the same horizontal level, and the first source pin recess 309 and the second gate lead recess 312 have the same horizontal level, the first source The level of the groove 308 and the second gate groove 313 is higher than the level of the first source pin groove 309 and the second gate pin groove 312. The first source recess 308 and the first source lead recess 309 respectively provide a bottom of the recess as a contact area with a source of the first chip and a source pin of the first chip of the lead frame, and the second gate is concave The groove 313 and the second gate pin groove 312 respectively provide the bottom of the groove as a contact area with the gate of the second wafer and the gate pin of the second wafer of the lead frame.

The structural features of the first source metal piece 302 and the second source metal piece 303 are as follows:

One end of the first gate metal piece 301 and the connecting strip 305 is connected with a first gate pin groove 307 for connecting the lead frame pins. As can be seen from FIG. 3, the first gate pin groove 307 It is disposed along one side of the first gate metal piece 301 and the connecting strip 305. A first gate recess 306 for connecting a gate of the first wafer is provided at one end of the first gate metal piece 301 opposite the connection strip 305. As also shown in FIG. 3, the first gate recess 306 is disposed along the opposite side of the first gate metal piece 301 and the connecting strip 305.

A second source pin recess 310 for connecting the lead frame pins is disposed at one end of the connection of the second source metal piece 303 and the connecting strip 305. As can be seen from FIG. 3, the second source pin recess 310 It is disposed along one side of the second source metal piece 303 and the connecting strip 305. A second source recess 311 for connecting a source of the second wafer is provided at one end of the second source metal piece 303 opposite to the connecting strip 305. As also shown in FIG. 3, the second source recess 311 is disposed along one of the opposite sides of the second source metal piece 303 and the connecting strip 305. The second source recess 311 and the second source lead recess 310 respectively provide a bottom portion of the recess as a contact area with a source of the second wafer and a source pin of the second wafer of the lead frame, the first gate recess The trench 306 and the first gate pin recess 307 respectively provide the bottom of the recess as a contact area with the gate of the first wafer and the gate pin of the first wafer of the lead frame.

As shown in Fig. 5, it is a second embodiment of a metal sheet frame of the present invention. The sheet metal frame is made of a metal foil such as a copper sheet. The metal sheet frame comprises: a first metal sheet module located in the left half of FIG. 5, a second metal sheet module located in the right half of FIG. 5, and a middle metal sheet mold in the middle of FIG. The connection module of the group and the second metal piece module. The first metal piece module is used for connecting the source, the gate and the corresponding pin of the first chip; the second metal piece module is used for connecting the source, the gate and the corresponding lead of the second chip. foot.

The first module comprises a first sheet metal gate metal sheet 501 (1 ^st set gate clip) located on the upper left of FIG. 5 and FIG. 5 of the first source electrode lower left portion of the metal sheet 502 (1 ^st set source clip) . The first gate metal piece 501 and the first source metal piece 502 are parallel to each other and spaced apart from each other, and are electrically connected to the connection module. The first gate metal piece 501 has a strip shape; and the first source metal piece 502 has a square shape, and the first source metal piece 502 is not rounded with two corners on one side of the connection of the connection module.

The second metal piece module includes a second source metal piece 503 (2 ^nd set source clip) located at the upper right portion of FIG. 5 and a second ^nd set gate clip 504 (2 ^nd set gate clip) located at the lower right portion of FIG. . The second gate metal piece 504 and the second source metal piece 503 are parallel to each other and spaced apart from each other, and are electrically connected to the connection module. The second gate metal piece 504 has a strip shape; and the second source metal piece 503 has a square shape, and the second source metal piece 503 is not rounded with the two corners on one side of the connection of the connection module.

The body of the first gate metal piece 501 or the second gate metal piece 504 is formed in an arbitrary curved shape, and the curved shape is set according to a process requirement.

In the actual semiconductor device fabrication process, any other circuit components may be laid on the wafer, and the circuit components may be located on the path of the metal piece, so that the metal piece needs to bypass the circuit components, so according to the laid circuit components At the location, the metal piece is set to an arbitrary curved shape structure according to the process requirements. In this embodiment, the first gate metal piece 501 or the second gate metal piece 504 is respectively provided with two notches so as to form an S-shaped structure, and the circuit components required for the process can be installed in the two notches.

Similarly, depending on the process requirements, the source metal piece can also be set to any structure that specifies a curved shape.

In the second embodiment, the connection module includes three tie bars 505, and the connection bar 505 is not too thick, and its width needs to be less than or equal to the width of the clip. The first gate metal piece 501 is electrically connected to the second source metal piece 503 by the first connecting strip 505. The second source metal piece 503 is electrically connected to the first source metal piece by the second connecting strip 505. The first source metal piece 502 is electrically connected to the second gate metal piece 504 by a third connecting strip 505. The metal sheet frame has an overall shape of an S-shaped or inverted S-shaped structure by a connecting strip 505.

It can be seen from the above that in the second embodiment, the first metal piece module and the second metal piece module are arranged in a flip-flop manner, that is, two-stage rotation (180 degrees) symmetry. The gate metal piece of the first metal piece module, that is, the first gate metal piece 501, corresponds to the source metal piece of the second metal piece module, that is, the second source metal piece 503, corresponding to the fifth figure. The upper half of the middle metal sheet frame; and the source metal piece of the first metal piece module, that is, the first source metal piece 502, and the gate metal piece of the second metal piece module, that is, the second gate The metal piece 504 is correspondingly located in the lower half of the metal sheet frame in Fig. 5.

In addition, one side of the first gate metal piece 501 and the first source metal piece 502 are respectively provided with protrusions. In the mass production process of the metal sheet frame, the protrusion is the connection point between the adjacent two metal sheet frames. Similarly, one side of the second source metal piece 503 and the second gate metal piece 504 are also provided with protrusions as a connection point between adjacent two metal piece frames during mass production of the metal piece frame.

As shown in FIG. 6 and in conjunction with FIG. 5, the first source metal piece 502 is electrically connected to the second gate metal piece 504 by a connecting strip 505.

A first source pin recess 509 for connecting the leads of the lead frame is provided at one end of the connection of the first source metal piece 502 and the connecting strip 505. As can be seen from FIG. 5, the first source pin groove 509 It is disposed along one side of the first source metal piece 502 and the connecting strip 505. A first source recess 508 for connecting a source of the first wafer is provided at one end of the first source metal strip 502 opposite the strap 505. As also shown in FIG. 5, the first source recess 508 is disposed along the opposite side of the first source metal piece 502 from the connecting strip 505.

A second gate pin recess 512 for connecting the leads of the lead frame is provided at one end of the connection of the second gate metal piece 504 and the connecting strip 505. As can be seen from FIG. 5, the second gate pin groove 512 is visible. It is disposed along one side of the second gate metal piece 504 and the connecting strip 505. A second gate recess 513 for connecting a gate of the second wafer is provided at one end of the second gate metal piece 504 opposite the connecting strip 505. As also shown in FIG. 5, the second gate recess 513 is disposed along one of the opposite sides of the second gate metal piece 504 and the connecting strip 505.

Wherein, the first source recess 508 and the second gate recess 513 have the same horizontal level, and the first source pin recess 509 and the second gate lead recess 512 have the same horizontal level, the first source The level of the recess 508 and the second gate recess 513 is higher than the level of the first source pin recess 509 and the second gate pin recess 512.

The structural features of the first gate metal piece 501 and the second source metal piece 503 are as follows:

A first gate pin recess 507 for connecting the lead frame pins is provided at one end of the first gate metal piece 501 and the connecting strip 505. As can be seen from FIG. 5, the first gate pin groove 507 is visible. It is disposed along one side of the first gate metal piece 501 and the connecting bar 505. A first gate recess 506 for connecting a gate of the first wafer is provided at one end of the first gate metal piece 501 opposite the connection strip 505. As also shown in FIG. 5, the first gate recess 506 is disposed along the opposite side of the first gate metal piece 501 and the connecting strip 505.

A second source pin groove 510 for connecting the lead frame pins is disposed at one end of the connection of the second source metal piece 503 and the connecting strip 505. As can be seen from FIG. 5, the second source pin groove 510 is visible. A strip side is disposed along the second source metal piece 503 and the connecting strip 505. A second source recess 511 for connecting a source of the second wafer is provided at one end of the second source metal piece 503 opposite the connecting strip 505. As also shown in FIG. 5, the second source recess 511 is disposed along one of the opposite sides of the second source metal piece 503 and the connecting strip 505.

As shown in Fig. 7, it is a third embodiment of a metal sheet frame of the present invention. The sheet metal frame is made of a metal foil such as a copper sheet. The metal sheet frame specifically includes: a first metal piece module located in a left half of the seventh figure, a second metal piece module located in a right half of the seventh figure, and a middle metal piece mode in the middle of the seventh figure The connection module of the group and the second metal piece module. The first metal piece module is used for connecting the source, the gate and the corresponding pin of the first chip; the second metal piece module is used for connecting the source, the gate and the corresponding lead of the second chip. foot.

The first module includes a metal plate located between the first gate electrode on the upper left in FIG. 7 the metal sheet 701 (1 ^st set gate clip) is located in a first source and a lower left portion of FIG. 7, the metal electrode pieces 702 (1 ^st set source clip) . The first gate metal piece 701 and the first source metal piece 702 are parallel to each other and spaced apart from each other, and are electrically connected to the connection module. The top corners of the first source metal piece 702 not connected to one of the connection modules are rounded.

The second metal piece module includes a second source metal piece 703 (2 ^nd set source clip) located at the upper right portion of FIG. 7 and a second ^nd set gate clip 704 (2 ^nd set gate clip) located at the lower right portion of FIG. . The second gate metal piece 704 and the second source metal piece 703 are parallel to each other and spaced apart from each other, and are electrically connected to the connection module. The second source metal piece 703 is rounded at two corners on one side of the connection with the connection module.

In the third embodiment, the connection module includes two tie bars 705. The tie bars 505 are not too thick, and the width thereof is less than or equal to the width of the clip. The first gate metal piece 701 is electrically connected to the second source metal piece 703 by the first connecting strip 705; the first source metal piece 702 is electrically connected to the second gate metal piece by the second connecting strip 705 704. The overall shape of the metal sheet frame is formed by two connecting strips 705 into two L-shaped structures which are inverted corresponding to each other.

As can be seen from the above, in the third embodiment, the first metal piece module and the second metal piece module are arranged to be flip-chip mounted, that is, two-stage rotation (180 degrees) symmetry. The gate metal piece of the first metal piece module, that is, the first gate metal piece 701, corresponds to the source metal piece of the second metal piece module, that is, the second source metal piece 703, corresponding to the seventh figure. The upper half of the middle metal sheet frame; and the source metal piece of the first metal piece module, that is, the first source metal piece 702, and the gate metal piece of the second metal piece module, that is, the second gate The metal piece 704 is correspondingly located in the lower half of the metal sheet frame in Fig. 7.

In addition, one side of the first gate metal piece 701 and the first source metal piece 702 are respectively provided with protrusions. In the mass production process of the metal sheet frame, the protrusion is the connection point between the adjacent two metal sheet frames. Similarly, the second source metal piece 703 and the second gate metal piece 704 are respectively provided with protrusions on one side of the second gate metal piece 704 as a connection point between adjacent two metal piece frames during mass production of the metal piece frame.

As shown in FIG. 8 and in conjunction with FIG. 7, the first source metal piece 702 is electrically connected to the second gate metal piece 704 by a connecting strip 705.

A first source pin recess 709 for connecting the lead frame pins is provided at one end of the connection of the first source metal piece 702 and the connecting strip 705. As can be seen from FIG. 7, the first source pin groove 709 It is disposed along one side of the first source metal piece 702 and the connecting strip 705. A first source recess 708 for connecting a source of the first wafer is disposed at one end of the first source metal strip 702 opposite the strap 705. As also shown in FIG. 7, the first source recess 708 is disposed along the opposite side of the first source metal strip 702 from the strap 705.

A second gate pin recess 712 for connecting the lead frame pins is provided at one end of the second gate metal piece 704 and the connecting strip 705. As seen in FIG. 7, the second gate pin recess 712 A strip is provided along the second gate metal piece 704 and the connecting strip 705. A second gate recess 713 for connecting a gate of the second wafer is disposed at one end of the second gate metal piece 704 opposite the connection strip 705. As also shown in FIG. 7, the second gate recess 713 is disposed along one of the opposite sides of the second gate metal piece 704 and the connecting strip 705.

The first source pin groove 708 and the second gate pin groove 713 have the same horizontal level, and the first source pin groove 709 and the second gate pin groove 712 have the same level, the first source. The level of the groove 708 and the second gate groove 713 is higher than the level of the first source pin groove 709 and the second gate pin groove 712.

The structural features of the first source metal piece 701 and the second source metal piece 703 are as follows:

A first gate pin groove 707 for connecting the lead frame pins is provided at one end of the first gate metal piece 701 and the connection bar 705. As seen in FIG. 7, the first gate pin groove 707 It is disposed along one side of the first gate metal piece 701 and the connecting strip 705. A first gate recess 706 for connecting a gate of the first wafer is provided at one end of the first gate metal piece 701 opposite to the connection strip 705. As also shown in FIG. 7, the first gate recess 706 is disposed along the opposite side of the first gate metal piece 701 and the connecting strip 705.

A second source pin recess 710 for connecting the lead frame pins is disposed at one end of the second source metal strip 703 and the connecting strip 705. As seen in FIG. 7, the second source lead recess 710 It is disposed along one side of the second source metal piece 703 and the connecting strip 705. A second source recess 711 for connecting a source of the second wafer is provided at one end of the second source metal piece 703 opposite to the connecting strip 705. As also shown in FIG. 7, the second source recess 711 is disposed along one of the opposite sides of the second source metal piece 703 and the connecting strip 705.

The invention discloses a packaging method based on a small gate metal sheet, the method comprising the following steps:

Step 1. Prepare a lead frame. In the mass production process, a plurality of sets of lead frames connected to each other can be prepared. The lead frame is made of copper and the surface can be nickel plated, silver plated or gold plated.

As shown in FIG. 9, each of the lead frames 900 is provided with a first frame unit 901 and a second frame unit 902 that are connected to each other and inverted to each other.

A first stage 903 and a plurality of pins disposed around the first stage 903 are prepared in the first frame unit 901. A part of the pins are connected to the first stage 903 as a whole; a part of the pins are separated from the first stage 903; and some of the pins separated from the first stage 903 are actually applied. The requirements can be connected to each other.

A second stage 904 and a plurality of pins disposed around the second stage 904 are also prepared in the second frame unit 902. A part of the pins are connected to the second stage 904 as a whole; a part of the pins are separated from the second stage 904; and some of the pins separated from the second stage 904 are actually applied. The requirements can be connected to each other.

The first stage 903 or the second stage 904 and the edge portion around the lead thereof are further provided with a plurality of protruding structures for connecting with the adjacent set of lead frames when the lead frame is mass-produced, and the protruding structures are phases The connection point between adjacent lead frames.

As shown in FIG. 9, it can be seen that the first stage 903 of the first frame unit 901 and its pins and the second stage 904 of the second frame unit 902 and their pins are flip-chip disposed with each other.

Step 2: As shown in FIG. 10, the first wafer 1001 and the second wafer 1002 are wafers of the same circuit structure. The first wafer 1001 and the second wafer 1002 may be the same vertical type metal oxide semiconductor field effect transistor (MOSFET) or insulated gate bipolar transistor (IGBT).

The robot arm first picks up the first wafer 1001 and solders it to the first stage 903 of the first frame unit 901. The gate 1003 and the source 1004 of the first wafer 1001 are disposed on the top of the wafer, and the bottom of the wafer and the first load. The chip 903 is electrically connected. The gate 1003 of the first wafer 1001 is disposed on the upper portion of the first wafer 1001 in FIG. 10; the source 1004 is disposed on the lower portion of the first wafer 1001.

Then, the robot arm picks up the second wafer 1002. The relative position of the source 1006 and the gate 1005 on the second wafer 1002 is the same as that of the first wafer 1001. Before the second wafer 1002 is mounted on the second stage 904 of the second frame unit 902, the mechanical arm drives the second wafer 1002 to rotate 180 degrees, and the positions of the source 1006 and the gate 1005 are reversed and then soldered. On the second stage 904, the first wafer 1001 and the second wafer 1002 are flipped on each other, that is, symmetrically arranged in two stages (180 degrees). The source 1006 and the gate 1005 of the second wafer 1002 are located at the top thereof, and the bottom of the wafer is electrically connected to the second stage 904. As can be seen from FIG. 10, the source 1006 of the second wafer 1002 is located above the second wafer 1002 in the figure with respect to the gate 1005, and the gate 1005 is located below the second wafer 1002. The source 1004 of the first wafer 1001 is disposed corresponding to the gate 1005 of the second wafer 1002, and the gate 1003 of the first wafer 1001 is disposed corresponding to the source 1006 of the second wafer 1002.

Step 3: As shown in FIG. 11 , a clip frame is welded, and the sheet metal frame includes a first metal piece module and a second metal piece module that are inverted with each other.

The first metal piece module includes a first gate metal piece 1101 located at the upper left portion of FIG. 11 and a first source metal piece 1102 located at the lower left portion of FIG. The first gate metal piece 1101 and the first source metal piece 1102 are parallel to each other and spaced apart from each other.

The second metal piece module includes a second source metal piece 1103 located at the upper right portion of FIG. 11 and a second gate metal piece 1104 located at the lower right portion of FIG. The second gate metal piece 1104 and the second source metal piece 1103 are parallel to each other and spaced apart from each other.

The first gate metal piece 1101 is electrically connected to the second source metal piece 1103 by the first (above the eleventh) connecting strip 1105; the second source metal piece 1103 is connected by the second root (the middle of the 11th figure) The connecting strip 1105 is electrically connected to the first source metal piece 1102; the first source metal piece 1102 is electrically connected to the second gate metal piece 1104 by a third (lower FIG. 11) connecting strip 1105.

A first gate pin recess 1107 is provided at a junction between the first gate metal piece 1101 and the connecting strip 1105, and the first gate pin groove 1107 is soldered to the first gate pin of the lead frame. 1114 is electrically connected. The first gate metal plate 1101 is disposed on the opposite side of the connecting strip 1105 with a first gate recess 1106. The first gate recess 1106 is soldered to the gate 1003 of the first wafer and electrically connected.

A first source pin recess 1109 is provided at a junction between the first source metal piece 1102 and the connecting strip 1105, and the first source lead groove 1109 is soldered to the first source pin of the lead frame. 1115 is electrically connected. The first source metal plate 1102 is provided on the opposite side of the connecting strip 1105 with a first source recess 1108. The first source recess 1108 is soldered to the source 1004 of the first wafer and electrically connected.

A second source pin recess 1110 is provided at a junction between the second source metal piece 1103 and the connecting strip 1105, and the second source pin recess 1110 is soldered to the second source pin of the lead frame. 1116 is electrically connected. The second source metal plate 1103 is disposed on the opposite side of the connecting strip 1105 with a second source recess 1111. The second source recess 1111 is soldered to the source 1006 of the second wafer and electrically connected.

A second gate pin recess 1112 is provided at a junction between the second gate metal piece 1104 and the connecting strip 1105, and the second gate pin recess 1112 is soldered to the second gate pin of the lead frame. 1117 is electrically connected. The second gate metal piece 1104 is disposed on the opposite side of the connecting strip 1105 with a second gate recess 1113. The second gate recess 1113 is soldered to the gate 1005 of the second wafer and electrically connected.

After the welding of the above metal sheet frame is completed, the plastic sealing layer is laid, and the metal sheet frame is molded with the first wafer, the second wafer and the lead frame, and the respective welded portions thereof.

Step 4: As shown in FIG. 12, after the molding process is completed, the entire semiconductor component of the metal piece frame, the first wafer, the second wafer, and the lead frame is encapsulated by the encapsulation layer 1201.

Step 5. As shown in FIG. 13, after the packaging process is completed, the metal piece frame and the lead frame connecting the first wafer and the second wafer are separated by a joint between the pair of lead frames.

In the specific operation, the position of the connecting strip in the metal sheet frame is cut, and each connecting strip is cut off. If the lead frame is also connected, the lead frame where the connecting strip is located is also cut. Thereby, the two wafers and the lead frame in which they are located are separated from the connected metal sheets.

As shown in FIG. 14 , the present invention also discloses a package structure based on a small gate metal piece prepared by the above metal sheet frame and a small gate metal plate-based packaging method, the package structure includes several identical A package in which two adjacent packages are inverted from each other.

Each package includes a prefabricated leadframe 1401 that utilizes a copper sheet that is nickel plated, silver plated or gold plated and includes a wafer stage and a plurality of pins disposed around the wafer stage. The lead frame 1401 has a plurality of protruding structures for connecting the adjacent lead frames to the edge portions of the stage.

A wafer 1402 is soldered to the stage of the lead frame 1401. A source opening 1403 and a gate opening 1404 of the wafer 1402 are disposed on top of the wafer 1402.

The source window 1403 of the wafer 1402 solders the source metal plate 1405, and the other end of the source metal plate 1405 is soldered to the source pin 1406 of the prefabricated lead frame 1401.

The gate window 1404 of the wafer 1402 is soldered with a gate metal 1407, and the other end of the gate metal 1407 is soldered to the gate pin 1408 of the prefabricated leadframe 1401.

The source pin 1406 and the gate pin 1408 are both separated from the carrier of the lead frame 1401.

A lead frame 1401, a wafer 1402, a source metal piece 1405, and a gate metal piece 1407 are coated with a mold layer. The encapsulation layer is also coated with an encapsulation layer as the outermost layer of the semiconductor structure as a whole.

In each of the above preferred embodiments, the first and second source pins and the gate pins of the lead frame are disposed between the first and second stage stages. Alternatively, the first and second stage stages may be disposed between the first and second source pins and the gate pins of the lead frame.

Although the present invention has been described in detail by the preferred embodiments thereof, it should be understood that the description Various modifications and alterations of the present invention will be apparent to those of ordinary skill in the art. Therefore, the scope of the invention should be limited by the scope of the appended claims.

1'‧‧‧metal piece
2'‧‧‧metal wire
3'‧‧‧ source
4'‧‧‧ gate
301, 501, 701, 1101‧‧‧ first gate metal piece
302, 502, 702, 1102‧‧‧ first source metal piece
303, 503, 703, 1103‧‧‧ second source metal sheet
304, 504, 704, 1104‧‧‧ second gate metal piece
305, 505, 705, 1105‧‧‧ connecting strips
306, 506, 706, 1106‧‧‧ first gate groove
307, 507, 707, 1107‧‧‧ first gate pin groove
308, 508, 708, 1108‧‧‧ first source groove
309, 509, 709, 1109‧‧‧ first source pin groove
310, 510, 710, 1110‧‧‧ second source pin groove
311, 511, 711, 1111‧‧‧ second source groove
312, 512, 712, 1112‧‧‧ second gate pin groove
313, 513, 713, 1113‧‧‧ second gate groove
900, 1401‧‧‧ lead frame
901‧‧‧First frame unit
902‧‧‧ second frame unit
903‧‧‧First stage
904‧‧‧Second stage
1001‧‧‧First chip
1002‧‧‧second chip
1003, 1005‧‧‧ gate
1004, 1006‧‧‧ source
1114‧‧‧First gate pin
1115‧‧‧First source pin
1116‧‧‧Second source pin
1117‧‧‧Second gate pin
1201‧‧‧Encapsulation layer
1402‧‧‧ wafer
1403‧‧‧Source window
1404‧‧‧gate window
1405‧‧‧Source metal sheet
1406‧‧‧Source pin
1407‧‧‧Gate metal sheet
1408‧‧‧gate pin

1 is a schematic view showing a package structure in which a metal sheet is bonded and wired in a conventional technique;

Figure 2 is a schematic view showing a package structure in which only a metal sheet is bonded in the prior art;

Figure 3 is a plan view of the first embodiment of the metal sheet frame of the present invention;

Figure 4 is a cross-sectional view of the A-A plane in Figure 3;

Figure 5 is a plan view of the second embodiment of the metal sheet frame of the present invention;

Figure 6 is a cross-sectional view of the A-A plane in Figure 5;

Figure 7 is a plan view showing a third embodiment of the metal sheet frame of the present invention;

Figure 8 is a cross-sectional view of the A-A plane in Figure 7;

Figure 9 is a schematic view of the preparation of the lead frame;

Figure 10 is a schematic view showing the mounting of a wafer on a lead frame;

Figure 11 is a schematic view of the mounting of the metal sheet frame;

Figure 12 is a schematic diagram of a packaging process;

Figure 13 is a schematic diagram of the component cutting process;

Figure 14 is a schematic view of a package structure based on a small gate metal piece according to the present invention.

1003, 1005‧‧‧ gate

1004, 1006‧‧‧ source

1101‧‧‧First gate metal piece

1102‧‧‧First source metal sheet

1103‧‧‧Second source metal sheet

1104‧‧‧Second gate metal piece

1105‧‧‧Connecting strip

1106‧‧‧First gate groove

1107‧‧‧First gate pin groove

1108‧‧‧First source groove

1109‧‧‧First source pin groove

1110‧‧‧Second source pin groove

1111‧‧‧Second source groove

1112‧‧‧Second gate pin groove

1113‧‧‧Second gate groove

1114‧‧‧First gate pin

1115‧‧‧First source pin

1116‧‧‧Second source pin

1117‧‧‧Second gate pin

Claims (12)

A packaging method based on a small gate metal sheet, the package method comprising: a first wafer and a second wafer are respectively soldered to each other on a pre-fabricated pair of lead frames; the source of the first wafer corresponds to a gate of the second wafer is disposed, and a gate of the first wafer is disposed opposite to a source of the second wafer; and a first metal sheet frame and a second metal sheet frame are soldered; the first metal sheet frame is electrically a gate of the first chip, a source of the second chip, and a gate of the first chip and a source of the second chip on the lead frame respectively; the second metal frame The gate of the second chip, the source of the first chip, and the gate of the second chip on the lead frame respectively correspond to one of the sources of the first chip. The method of packaging a small gate metal sheet according to claim 1, wherein the preparing the lead frame comprises: preparing one of the first frame units and one of the interconnecting and inverting one another in each set of the lead frames a second frame unit; and the first frame unit and the second frame unit respectively prepare a carrier and the pin surrounding the carrier; the carrier of the first frame unit and the pin and The stage of the second frame unit and the pin are inverted from each other. The method of packaging a small gate metal sheet according to claim 1 or 2, wherein the soldering the first wafer and the second wafer on the lead frame comprises: mounting the first wafer on the lead One of the frames is mounted on the stage; and the second wafer having the same shape and direction as the first wafer is rotated 180 degrees with respect to the first wafer, and mounted on the other stage of the lead frame. The method of encapsulating a small gate metal sheet according to the first aspect of the invention, wherein a metal sealing layer is disposed after the metal sheet is welded, the plastic sealing layer covering the first wafer, the second wafer, the lead frame, The first sheet metal frame and the second sheet metal frame. The method of encapsulating a small gate metal sheet according to claim 4, wherein the first connection between the first wafer and the second wafer is completed after the encapsulation and packaging process is completed. The sheet metal frame, the second sheet metal frame, and the lead frame are separated by a joint between the pair of lead frames. The method of encapsulating a small gate metal sheet according to claim 1, wherein the first wafer and the second wafer are wafers of the same circuit structure. A metal sheet frame comprising: a first metal sheet module including a first first gate metal piece and a first source metal piece; and a second metal piece module including a separation a second gate metal piece and a second source metal piece; and a connection module connecting the first metal piece module and the second metal piece module; wherein the first metal piece module is opposite to the The second metal piece module is flipped. The metal sheet frame of claim 7, wherein the connection module comprises: a connecting strip connecting the first gate metal piece and the second source metal piece; and connecting the second source metal piece a connecting strip with the first source metal piece; and a connecting strip connecting the first source metal piece and the second gate metal piece. The metal sheet frame of claim 7, wherein the connection module comprises: a connection strip connecting the first gate metal piece and the second source metal piece; and connecting the first source metal a strip of the sheet and the second gate metal piece. The sheet metal frame of claim 7, wherein the first gate metal piece or the second gate metal piece is connected to one end of the connection module for connection. One of the pins of the lead frame has a pin groove; the other end is provided with a gate groove for connecting the gate of the wafer. The metal sheet frame of claim 7, wherein the first source metal piece or the second source metal piece is connected to one end of the connection module for connection. One of the pins of the lead frame has a pin groove; the other end is provided with a source recess for connecting the source of the wafer. The sheet metal frame of claim 7, wherein the first gate metal piece or the second gate metal piece is set to an arbitrary curved shape, and the curved shape is according to a process requirement. Settings.