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TWI560834B - Flip chip package and chip - Google Patents

Flip chip package and chip

Info

Publication number
TWI560834B
TWI560834B TW104117465A TW104117465A TWI560834B TW I560834 B TWI560834 B TW I560834B TW 104117465 A TW104117465 A TW 104117465A TW 104117465 A TW104117465 A TW 104117465A TW I560834 B TWI560834 B TW I560834B
Authority
TW
Taiwan
Prior art keywords
chip
package
flip
flip chip
chip package
Prior art date
Application number
TW104117465A
Other languages
English (en)
Other versions
TW201642422A (zh
Inventor
Tzu Sheng Wu
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW104117465A priority Critical patent/TWI560834B/zh
Priority to CN201510669880.6A priority patent/CN106206464A/zh
Application granted granted Critical
Publication of TWI560834B publication Critical patent/TWI560834B/zh
Publication of TW201642422A publication Critical patent/TW201642422A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
TW104117465A 2015-05-29 2015-05-29 Flip chip package and chip TWI560834B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104117465A TWI560834B (en) 2015-05-29 2015-05-29 Flip chip package and chip
CN201510669880.6A CN106206464A (zh) 2015-05-29 2015-10-13 覆晶封装结构与芯片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104117465A TWI560834B (en) 2015-05-29 2015-05-29 Flip chip package and chip

Publications (2)

Publication Number Publication Date
TWI560834B true TWI560834B (en) 2016-12-01
TW201642422A TW201642422A (zh) 2016-12-01

Family

ID=57453086

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104117465A TWI560834B (en) 2015-05-29 2015-05-29 Flip chip package and chip

Country Status (2)

Country Link
CN (1) CN106206464A (zh)
TW (1) TWI560834B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108122794B (zh) * 2017-12-18 2019-11-05 中电科技集团重庆声光电有限公司 焦平面阵列探测器倒装焊对接方法
TWI688017B (zh) * 2019-03-15 2020-03-11 南茂科技股份有限公司 晶片封裝結構及其製造方法
CN110911432B (zh) * 2019-11-21 2023-01-06 中国电子科技集团公司第十一研究所 甚高分辨率红外探测器芯片与读出电路芯片倒装互连方法
CN112614821A (zh) * 2020-12-15 2021-04-06 Oppo广东移动通信有限公司 封装结构及其制备方法、电子设备
CN118541797A (zh) * 2022-12-23 2024-08-23 鹏鼎控股(深圳)股份有限公司 芯片的封装方法以及芯片封装结构
TWI863458B (zh) * 2023-07-25 2024-11-21 頎邦科技股份有限公司 覆晶晶片
CN116666363B (zh) * 2023-08-01 2023-09-19 无锡兴华衡辉科技有限公司 一种卡槽式对位标记及防止铟柱滑移的互连方法
CN116864468B (zh) * 2023-09-01 2023-12-08 青岛泰睿思微电子有限公司 芯片的多功能封装结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201117499A (en) * 2009-11-13 2011-05-16 Unimicron Technology Corp Electric connector

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI292614B (en) * 2006-01-20 2008-01-11 Advanced Semiconductor Eng Flip chip on leadframe package and method of making the same
CN101026141A (zh) * 2006-02-20 2007-08-29 日月光半导体制造股份有限公司 具有防浮机构的覆晶封装构造
US9040348B2 (en) * 2011-09-16 2015-05-26 Altera Corporation Electronic assembly apparatus and associated methods

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201117499A (en) * 2009-11-13 2011-05-16 Unimicron Technology Corp Electric connector

Also Published As

Publication number Publication date
CN106206464A (zh) 2016-12-07
TW201642422A (zh) 2016-12-01

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