TWI559839B - Electronic device - Google Patents
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- TWI559839B TWI559839B TW103123168A TW103123168A TWI559839B TW I559839 B TWI559839 B TW I559839B TW 103123168 A TW103123168 A TW 103123168A TW 103123168 A TW103123168 A TW 103123168A TW I559839 B TWI559839 B TW I559839B
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Description
本發明是有關於一種電子裝置，且特別是有關於一種具有較低的光軸偏移機率的電子裝置。 The present invention relates to an electronic device, and more particularly to an electronic device having a lower probability of optical axis shift.
近年來，隨著科技產業日益發達，電子裝置，例如智慧型手機(smart phone)或平板電腦(tablet computer)等產品，已頻繁地出現在日常生活中。這些電子裝置除了本身具有的功能之外，通常還會搭配額外的功能組件，以具備額外的功能。舉例而言，電子裝置可以配置相機等組件。 In recent years, with the development of the technology industry, electronic devices, such as smart phones or tablet computers, have frequently appeared in daily life. In addition to their own functions, these electronic devices often have additional functional components to provide additional functionality. For example, the electronic device can configure components such as a camera.
目前，電子裝置通常會透過固定結構將相機的上、下兩側固定住，周圍側用底盤結構(chassis)限位。然而，當電子裝置受到衝擊時，相機會隨著這些固定結構變形而發生光軸偏移的狀況。隨著科技的進步，部分的電子裝置更具有雙相機的設計。由於具有雙相機的電子裝置是運用兩個相機進行三角運算，以計算出物件與相機之間的距離，此類電子裝置對於光軸平行度的要求更高，若發生光軸偏移，所算出來的距離誤差也會越大，而未能得到符合需求的照相效果。 At present, electronic devices usually fix the upper and lower sides of the camera through a fixed structure, and the surrounding side is limited by a chassis structure. However, when the electronic device is subjected to an impact, the camera may be displaced with the optical structure as the fixed structure is deformed. With the advancement of technology, some electronic devices have a dual camera design. Since the electronic device with dual cameras uses two cameras to perform trigonometric calculation to calculate the distance between the object and the camera, such electronic devices have higher requirements on the parallelism of the optical axis, and if the optical axis shift occurs, the calculation is performed. The distance error will be larger, and the photographic effect that meets the demand cannot be obtained.
本發明提供一種電子裝置，其具有電子元件支撐座，電子元件支撐座受到碰撞時，較不會受到殼體擠壓，而使得所承載的這些電子元件具有較低的偏移機率。 The present invention provides an electronic device having an electronic component support seat that is less likely to be squeezed by the housing when the electronic component support is impacted, so that the electronic components carried have a lower probability of being displaced.
本發明的一種電子裝置，包括一殼體、一電路板、一框架、一電子元件支撐座及多個電子元件。電路板及框架配置於殼體內。電子元件支撐座位於框架內且包括一固定部及一承載部。固定部固定至框架以作為電子元件支撐座的一支點。這些電子元件分別設置於這些承載部且電性耦接於電路板，且承載部與框架之間以及承載部與電路板之間各自存在一間隙。 An electronic device of the present invention includes a housing, a circuit board, a frame, an electronic component support base, and a plurality of electronic components. The circuit board and the frame are disposed in the housing. The electronic component support seat is located in the frame and includes a fixing portion and a bearing portion. The fixing portion is fixed to the frame as a point of the electronic component support. The electronic components are respectively disposed on the carrying portions and electrically coupled to the circuit board, and a gap exists between the carrying portion and the frame and between the carrying portion and the circuit board.
基於上述，本發明的電子裝置的電子元件支撐座透過固定部以支點的方式固定於框架，且承載部與框架之間以及承載部與電路板之間存在間隙，當電子裝置受到碰撞時，電子元件支撐座的懸浮設計可使得承載部在與框架及電路板之間的間隙中略為震盪，不會直接受框架或電路板擠壓變形，而降低位在電子元件支撐座上的這些電子元件的位置發生偏移的機率。 Based on the above, the electronic component support of the electronic device of the present invention is fixed to the frame by a fixing portion through a fixing portion, and a gap exists between the bearing portion and the frame and between the bearing portion and the circuit board. When the electronic device is collided, the electronic device The suspension design of the component support seat can make the load-bearing portion slightly oscillate in the gap between the frame and the circuit board, and is not directly deformed by the frame or the circuit board, and reduces the electronic components located on the electronic component support base. The probability of a position offset.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
I、I1、I2‧‧‧間隙 I, I 1 , I 2 ‧ ‧ gap
100、200‧‧‧電子裝置 100, 200‧‧‧ electronic devices
110‧‧‧殼體 110‧‧‧shell
120、220‧‧‧電路板 120, 220‧‧‧ circuit board
122‧‧‧第二定位部 122‧‧‧Second Positioning Department
125、225‧‧‧框架 125, 225‧‧‧ framework
125a‧‧‧第四定位部 125a‧‧‧Four Positioning Department
130、230‧‧‧電子元件支撐座 130, 230‧‧‧Electronic component support
132‧‧‧固定部 132‧‧‧ Fixed Department
134、234‧‧‧承載部 134, 234‧‧ ‧ Carrying Department
136‧‧‧第一定位部 136‧‧‧First Positioning Department
138‧‧‧第三定位部 138‧‧‧ Third Positioning Department
139、239‧‧‧容置槽 139, 239‧‧‧ accommodating slots
139a‧‧‧第一容置槽 139a‧‧‧First accommodating slot
139b‧‧‧第二容置槽 139b‧‧‧Second accommodating slot
140、240‧‧‧電子元件 140, 240‧‧‧ Electronic components
142‧‧‧第一相機模組 142‧‧‧First camera module
144‧‧‧第二相機模組 144‧‧‧Second camera module
150‧‧‧螢幕 150‧‧‧ screen
160‧‧‧透鏡 160‧‧‧ lens
170‧‧‧螺絲 170‧‧‧ screws
280‧‧‧緩衝材 280‧‧‧ cushioning material
圖1是依照本發明的一實施例的一種電子裝置的局部剖面示 意圖。 1 is a partial cross-sectional view of an electronic device in accordance with an embodiment of the present invention. intention.
圖2是圖1的電子裝置的局部爆炸示意圖。 2 is a partial exploded view of the electronic device of FIG. 1.
圖3是圖1的電子裝置移除背蓋且隱藏電子元件的局部示意圖。 3 is a partial schematic view of the electronic device of FIG. 1 with the back cover removed and the electronic components hidden.
圖4是依照本發明的另一實施例的一種電子裝置的局部剖面示意圖。 4 is a partial cross-sectional view of an electronic device in accordance with another embodiment of the present invention.
圖1是依照本發明的一實施例的一種電子裝置的局部剖面示意圖。圖2是圖1的電子裝置的局部爆炸示意圖。圖3是圖1的電子裝置移除背蓋且隱藏電子元件的局部示意圖。請參閱圖1至圖3，本實施例的電子裝置100包括一殼體110、一電路板120、一框架125、一電子元件支撐座130、多個電子元件140、一螢幕150、多個透鏡160及一螺絲170。 1 is a partial cross-sectional view of an electronic device in accordance with an embodiment of the present invention. 2 is a partial exploded view of the electronic device of FIG. 1. 3 is a partial schematic view of the electronic device of FIG. 1 with the back cover removed and the electronic components hidden. Referring to FIG. 1 to FIG. 3 , the electronic device 100 of the present embodiment includes a housing 110 , a circuit board 120 , a frame 125 , an electronic component support 130 , a plurality of electronic components 140 , a screen 150 , and a plurality of lenses. 160 and a screw 170.
電路板120、框架125、電子元件支撐座130及電子元件140位於殼體110的此空間內，螢幕150外露於殼體110，透鏡160則穿設於與螢幕150相對的殼體110。 The circuit board 120, the frame 125, the electronic component support 130 and the electronic component 140 are located in the space of the housing 110. The screen 150 is exposed to the housing 110, and the lens 160 is disposed through the housing 110 opposite to the screen 150.
電子元件支撐座130包括一固定部132及一承載部134。固定部132位於電子元件支撐座130的一側且固定至框架125。在本實施例中，固定部132為一通孔，螺絲170可穿過固定部132後螺接至框架125以將電子元件支撐座130固定至框架125。承載部134用以承載電子元件140，也就是說，電子元件140透過電子 元件支撐座130固定於框架125。承載部134具有複數個容置槽139，用以容置這些電子元件140。在本實施例中，容置槽139的數量為兩個，包括一第一容置槽139a與一第二容置槽139b，但容置槽139的數量不以此為限制。電子元件140設置於容置槽139、電性耦接於電路板120並靠設於透鏡160。在本實施例中，電子元件140的數量對應於容置槽139的數量為兩個，但在其他實施例中，電子元件140的數量可隨容置槽139的數量而增減，不以此為限制。電子元件140可為一感測器，感測器例如包括相機模組、光學感測模組、溫度感測模組、距離感測模組、磁性感測模組等。舉例而言，在本實施例中，兩電子元件140包括一第一相機模組142與一第二相機模組144。第一相機模組142的底部固定於第一容置槽139a，第二相機模組144的底部固定於第二容置槽139b。電子裝置100可透過雙相機來拍出類3D照片或是支援先拍照後對焦的功能。 The electronic component support base 130 includes a fixing portion 132 and a bearing portion 134. The fixing portion 132 is located at one side of the electronic component support base 130 and is fixed to the frame 125. In the present embodiment, the fixing portion 132 is a through hole, and the screw 170 can pass through the fixing portion 132 and be screwed to the frame 125 to fix the electronic component supporting base 130 to the frame 125. The carrying portion 134 is used to carry the electronic component 140, that is, the electronic component 140 transmits electrons. The component support base 130 is fixed to the frame 125. The receiving portion 134 has a plurality of receiving slots 139 for receiving the electronic components 140. In this embodiment, the number of the receiving slots 139 is two, including a first receiving slot 139a and a second receiving slot 139b, but the number of the receiving slots 139 is not limited thereto. The electronic component 140 is disposed in the receiving slot 139 , electrically coupled to the circuit board 120 , and disposed on the lens 160 . In this embodiment, the number of the electronic components 140 corresponds to the number of the receiving slots 139, but in other embodiments, the number of the electronic components 140 may increase or decrease with the number of the receiving slots 139. For the limit. The electronic component 140 can be a sensor, and the sensor includes, for example, a camera module, an optical sensing module, a temperature sensing module, a distance sensing module, a magnetic sensing module, and the like. For example, in the embodiment, the two electronic components 140 include a first camera module 142 and a second camera module 144. The bottom of the first camera module 142 is fixed to the first receiving groove 139a, and the bottom of the second camera module 144 is fixed to the second receiving groove 139b. The electronic device 100 can capture a 3D-like photo through a dual camera or support the function of taking a picture first and then focusing.
由於雙相機的電子裝置100對於光軸平行度的要求相當高，為了避免電子裝置100受到碰撞而使雙相機發生光軸偏移的狀況，在本實施例中，承載電子元件140的電子元件支撐座130透過固定部132固定至框架125，以固定部132作為電子元件支撐座130的一支點，且電子元件支撐座130與框架125之間以及電子元件支撐座130與電路板120之間各自存在一間隙I。也就是說，電子元件支撐座130透過固定部132固定與框架125之間的相對位置，且電子元件支撐座130在固定部132以外的大部分的 部位(也就是承載部134)基本上是懸浮狀態。當電子裝置100受到碰撞時，電子元件支撐座130的懸浮設計可使得承載部134在與框架125及電路板120之間的間隙I中能夠沿著垂直方向(Z方向)略為上下震盪，不會直接受框架125或電路板120擠壓變形，而降低位在電子元件支撐座130上的這些電子元件140發生偏移的機率。 Since the dual-camera electronic device 100 has a relatively high requirement for the parallelism of the optical axis, in order to prevent the electronic device 100 from colliding, the optical axis of the dual camera is shifted. In the present embodiment, the electronic component supporting the electronic component 140 is supported. The holder 130 is fixed to the frame 125 through the fixing portion 132, and the fixing portion 132 serves as a point of the electronic component supporting base 130, and the electronic component supporting base 130 and the frame 125 and the electronic component supporting base 130 and the circuit board 120 respectively exist. A gap I. That is, the electronic component supporting base 130 is fixed to the relative position between the frame 125 through the fixing portion 132, and most of the electronic component supporting base 130 is outside the fixing portion 132. The portion (i.e., the load bearing portion 134) is substantially in a suspended state. When the electronic device 100 is subjected to a collision, the suspension design of the electronic component supporting base 130 can cause the carrying portion 134 to be slightly oscillated in the vertical direction (Z direction) in the gap I between the frame 125 and the circuit board 120, and will not Directly deformed by the frame 125 or the circuit board 120, the probability of deflection of the electronic components 140 positioned on the electronic component support 130 is reduced.
此外，在本實施例中，第一相機模組142的側緣與第一容置槽139a之間的間隙I1小於第二相機模組144的側緣與第二容置槽139b之間的間隙I2。第一相機模組142與第二相機模組144需要精準對位，在本實施例中，第一容置槽139a的形狀會較符合第一相機模組142的輪廓，而第二容置槽139b的形狀會較第二相機模組144的輪廓略大。當第一相機模組142固定在第一容置槽139a內之後，使第二相機模組144可以在第二容置槽139b內進行位置上的微調，待對位完之後再固定，而達到第一相機模組142與第二相機模組144能夠被精準對位的效果。 In addition, in the embodiment, the gap I1 between the side edge of the first camera module 142 and the first receiving groove 139a is smaller than the gap between the side edge of the second camera module 144 and the second receiving groove 139b. I2. The first camera module 142 and the second camera module 144 need to be accurately aligned. In this embodiment, the shape of the first receiving slot 139a is more in line with the contour of the first camera module 142, and the second receiving slot The shape of 139b will be slightly larger than the outline of the second camera module 144. After the first camera module 142 is fixed in the first accommodating groove 139a, the second camera module 144 can be finely adjusted in the second accommodating groove 139b, and then fixed after the alignment is completed. The first camera module 142 and the second camera module 144 can be accurately aligned.
在其他實施例中，電子裝置100的電子元件140也可以是一個相機模組搭配一個光學感測模組、溫度感測模組、距離感測模組或是磁性感測模組的配置。當然，上述僅是提供數種電子裝置100的電子元件140可能的種類以作為參考，數種電子裝置100的電子元件140的種類並不以此為限制。 In other embodiments, the electronic component 140 of the electronic device 100 can also be a camera module configured with an optical sensing module, a temperature sensing module, a distance sensing module, or a magnetic sensing module. Of course, the above is only a possible type of electronic components 140 of the plurality of electronic devices 100 for reference. The types of the electronic components 140 of the plurality of electronic devices 100 are not limited thereto.
值得一提的是，在本實施例中，固定部132位於電子元件支撐座130的一端，以使電子元件支撐座130以懸臂的方式固 定至殼體110。但在其他實施例中，固定部132也可位於電子元件支撐座130的中央，且承載部134的兩容置槽139位於固定部132的兩側，電子元件支撐座130的兩端可類似以翹翹板的形式沿垂直方向(Z方向)震動，當然，固定部132在電子元件支撐座130上的相對位置不以此為上述為限制。 It should be noted that, in this embodiment, the fixing portion 132 is located at one end of the electronic component supporting base 130, so that the electronic component supporting base 130 is fixed in a cantilever manner. Set to the housing 110. In other embodiments, the fixing portion 132 can also be located at the center of the electronic component supporting base 130, and the two receiving grooves 139 of the receiving portion 134 are located at two sides of the fixing portion 132, and the two ends of the electronic component supporting base 130 can be similarly The form of the seesaw is vibrated in the vertical direction (Z direction). Of course, the relative position of the fixing portion 132 on the electronic component supporting base 130 is not limited thereto.
此外，為了避免電子元件支撐座130相對電子裝置100之間存在水平方向(X-Y方向)的移動，如圖2所示，電子元件支撐座130包括一第一定位部136及一第三定位部138，電路板120包括對應於第一定位部136的一第二定位部122，且框架125包括對應於第三定位部138的一第四定位部125a。第一定位部136與第二定位部122用以使電子元件支撐座130對位於電路板120，且第三定位部138與第四定位部125a用以使電子元件支撐座130對位於框架125。 In addition, in order to avoid the horizontal direction (XY direction) movement between the electronic component supporting base 130 and the electronic device 100, as shown in FIG. 2, the electronic component supporting base 130 includes a first positioning portion 136 and a third positioning portion 138. The circuit board 120 includes a second positioning portion 122 corresponding to the first positioning portion 136, and the frame 125 includes a fourth positioning portion 125a corresponding to the third positioning portion 138. The first positioning portion 136 and the second positioning portion 122 are used to position the electronic component supporting base 130 on the circuit board 120, and the third positioning portion 138 and the fourth positioning portion 125a are used to position the electronic component supporting base 130 in the frame 125.
在本實施例中，第一定位部136位於電子元件支撐座130的遠離固定部132的一端，第三定位部138位於電子元件支撐座130靠近固定部132的一端。電子元件支撐座130的第一定位部136為一凸柱，電路板120的第二定位部122為一孔洞。電子元件支撐座130的第三定位部138為一孔洞，且框架125的第四定位部125a為一凸柱。電子元件支撐座130透過第一定位部136及第三定位部138與電路板120的第二定位部122與框架125的第四定位部125a對位，而限制了電子元件支撐座130相對於電路板120與殼體110在水平方向上的移動。 In the embodiment, the first positioning portion 136 is located at one end of the electronic component supporting base 130 away from the fixing portion 132 , and the third positioning portion 138 is located at one end of the electronic component supporting base 130 adjacent to the fixing portion 132 . The first positioning portion 136 of the electronic component support base 130 is a protrusion, and the second positioning portion 122 of the circuit board 120 is a hole. The third positioning portion 138 of the electronic component support base 130 is a hole, and the fourth positioning portion 125a of the frame 125 is a protrusion. The electronic component support 130 is aligned with the second positioning portion 122 of the circuit board 120 and the fourth positioning portion 125a of the frame 125 through the first positioning portion 136 and the third positioning portion 138, thereby limiting the electronic component support 130 relative to the circuit. The movement of the plate 120 and the housing 110 in the horizontal direction.
圖4是依照本發明的另一實施例的一種電子裝置的局部剖面示意圖。請參閱圖4，圖4的電子裝置200與圖1的電子裝置100的主要差異在於，在圖1的電子裝置100中，電子元件支撐座130在固定部132、第一定位部136及第三定位部138以外的部位基本上是懸浮的而未與框架125與電路板120接觸。在圖4中，電子裝置200更包括一緩衝材280，配置於承載部234與框架225之間的間隙I或是承載部234與電路板220之間的間隙I中的至少一者。 4 is a partial cross-sectional view of an electronic device in accordance with another embodiment of the present invention. Referring to FIG. 4 , the main difference between the electronic device 200 of FIG. 4 and the electronic device 100 of FIG. 1 is that, in the electronic device 100 of FIG. 1 , the electronic component supporting base 130 is at the fixing portion 132 , the first positioning portion 136 , and the third portion . The portion other than the positioning portion 138 is substantially suspended without being in contact with the frame 125 and the circuit board 120. In FIG. 4 , the electronic device 200 further includes a buffer material 280 disposed at a gap I between the carrier portion 234 and the frame 225 or at least one of the gaps I between the carrier portion 234 and the circuit board 220 .
如圖4所示，一部分的緩衝材280配置在承載部234與框架225之間的間隙I的其中一部分，另一部分的緩衝材280配置在承載部234與電路板220之間的間隙。更詳細地說，承載部234在兩容置槽239之間的部位的下方與框架225之間夾有緩衝材280，也就是說，承載部234在兩容置槽239之間的部位的下方承靠在緩衝材280上。相同地，承載部234在兩容置槽239之間的部位的上方也與電路板220(也就是電路板)之間夾有緩衝材。 As shown in FIG. 4, a part of the cushioning material 280 is disposed in a part of the gap I between the carrying portion 234 and the frame 225, and the other portion of the cushioning material 280 is disposed in a gap between the carrying portion 234 and the circuit board 220. In more detail, the load-bearing portion 234 sandwiches the cushioning material 280 between the portion between the two receiving grooves 239 and the frame 225, that is, the bearing portion 234 is below the portion between the two receiving grooves 239. Rely on the cushioning material 280. Similarly, the carrier portion 234 is also sandwiched between the circuit board 220 (that is, the circuit board) above the portion between the two receiving grooves 239.
緩衝材280例如是海綿、矽膠、橡膠等可壓縮的軟質材料，在一般狀態下，緩衝材280可提供電子元件支撐座230些許的固定與支撐效果。當電子裝置200受到撞擊時，框架225可能會在瞬間略為變形，此時，由於承載部234並未與框架225與電路板220接觸，不會直接受到框架225與電路板220撞擊而變形，且可利用電子元件支撐座230在懸浮的部分能夠在垂直方向(Z方向)上略為移動的特性，以消耗所受到的撞擊能量。此外，位 於承載部234與框架225與電路板220之間的緩衝材也可以吸收框架225與電路板220的衝擊力道，而達到使電子元件支撐座230上的這些電子元件240之間不會產生偏移的保護功效。 The cushioning material 280 is, for example, a compressible soft material such as sponge, silicone rubber or rubber. Under normal conditions, the cushioning material 280 can provide a slight fixing and supporting effect of the electronic component supporting base 230. When the electronic device 200 is impacted, the frame 225 may be slightly deformed in an instant. At this time, since the bearing portion 234 is not in contact with the circuit board 220 with the frame 225, it is not directly deformed by the frame 225 colliding with the circuit board 220, and The characteristic that the electronic component support base 230 can move slightly in the vertical direction (Z direction) in the suspended portion can be utilized to consume the impact energy received. In addition, bit The buffer material between the carrier portion 234 and the frame 225 and the circuit board 220 can also absorb the impact force of the frame 225 and the circuit board 220, so that there is no offset between the electronic components 240 on the electronic component support base 230. Protection effect.
綜上所述，本發明的電子裝置的電子元件支撐座透過固定部以支點的方式固定於框架，且承載部與框架之間以及承載部與電路板之間存在間隙，當電子裝置受到碰撞時，電子元件支撐座的懸浮設計可使得承載部在與框架及電路板之間的間隙中略為震盪，不會直接受框架或電路板擠壓變形，而降低位在電子元件支撐座上的這些電子元件的位置發生偏移的機率。此外，本發明的電子裝置透過電子元件支撐座的第一定位部與第三定位部分別與電路板的第二定位部與框架的第四定位部對位，而使得電子元件支撐座能夠對位於電路板與框架，以確保電子元件支撐座在水平方向不會移動，而僅能在垂直方向震盪，以避免受碰撞時在水平方向上與其他元件干涉而變形。另外，本發明的電子裝置更透過將緩衝材配置於承載部與框架之間的間隙或是承載部與電路板之間的間隙，以進一部地提供支撐及緩衝的效果。 In summary, the electronic component support of the electronic device of the present invention is fixed to the frame by a fixing portion through a fixing portion, and a gap exists between the bearing portion and the frame and between the bearing portion and the circuit board, when the electronic device is collided. The suspension design of the electronic component support seat can make the load-bearing portion slightly oscillate in the gap between the frame and the circuit board, and is not directly deformed by the frame or the circuit board, and reduces the electrons located on the support portion of the electronic component. The probability that the position of the component will be offset. In addition, the electronic device of the present invention is aligned with the second positioning portion of the electronic component supporting seat and the second positioning portion of the circuit board and the fourth positioning portion of the frame, so that the electronic component support can be located oppositely. The board and the frame are used to ensure that the electronic component support does not move in the horizontal direction, but can only oscillate in the vertical direction to avoid deformation in the horizontal direction interfered with other components in the horizontal direction. In addition, the electronic device of the present invention further provides support and buffering effect by disposing the cushioning material in a gap between the carrying portion and the frame or a gap between the carrying portion and the circuit board.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
I、I1、I2‧‧‧間隙 I, I 1 , I 2 ‧ ‧ gap
100‧‧‧電子裝置 100‧‧‧Electronic devices
110‧‧‧殼體 110‧‧‧shell
120‧‧‧電路板 120‧‧‧ boards
125‧‧‧框架 125‧‧‧Frame
130‧‧‧電子元件支撐座 130‧‧‧Electronic component support
132‧‧‧固定部 132‧‧‧ Fixed Department
134‧‧‧承載部 134‧‧‧Loading Department
139‧‧‧容置槽 139‧‧‧ accommodating slots
139a‧‧‧第一容置槽 139a‧‧‧First accommodating slot
139b‧‧‧第二容置槽 139b‧‧‧Second accommodating slot
140‧‧‧電子元件 140‧‧‧Electronic components
142‧‧‧第一相機模組 142‧‧‧First camera module
144‧‧‧第二相機模組 144‧‧‧Second camera module
150‧‧‧螢幕 150‧‧‧ screen
160‧‧‧透鏡 160‧‧‧ lens
170‧‧‧螺絲 170‧‧‧ screws
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461947403P | 2014-03-03 | 2014-03-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201536152A TW201536152A (en) | 2015-09-16 |
| TWI559839B true TWI559839B (en) | 2016-11-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103123168A TWI559839B (en) | 2014-03-03 | 2014-07-04 | Electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104902723B (en) |
| TW (1) | TWI559839B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106534655B (en) | 2017-01-11 | 2019-04-16 | Oppo广东移动通信有限公司 | Camera module and mobile terminal |
| CN106941582B (en) * | 2017-02-07 | 2020-09-11 | 奇鋐科技股份有限公司 | Camera module protection structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006154345A (en) * | 2004-11-30 | 2006-06-15 | Konica Minolta Holdings Inc | Camera shake correcting unit and imaging apparatus |
| TW201025990A (en) * | 2008-12-26 | 2010-07-01 | Fih Hong Kong Ltd | Portable electronic device |
| CN101785296A (en) * | 2007-08-24 | 2010-07-21 | 索尼爱立信移动通讯有限公司 | Optical device stabilizer |
| TW201039622A (en) * | 2009-04-30 | 2010-11-01 | Fih Hong Kong Ltd | Camera device and portable electronic device with camera device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006060396A (en) * | 2004-08-18 | 2006-03-02 | Fujitsu Ltd | Mobile terminal device |
| KR100723149B1 (en) * | 2005-11-09 | 2007-05-30 | 삼성전기주식회사 | Camera module with improved structure of housing and PCC |
| CN2916697Y (en) * | 2006-06-15 | 2007-06-27 | 华晶科技股份有限公司 | buffer structure |
-
2014
- 2014-07-04 TW TW103123168A patent/TWI559839B/en active
- 2014-07-04 CN CN201410316879.0A patent/CN104902723B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006154345A (en) * | 2004-11-30 | 2006-06-15 | Konica Minolta Holdings Inc | Camera shake correcting unit and imaging apparatus |
| CN101785296A (en) * | 2007-08-24 | 2010-07-21 | 索尼爱立信移动通讯有限公司 | Optical device stabilizer |
| TW201025990A (en) * | 2008-12-26 | 2010-07-01 | Fih Hong Kong Ltd | Portable electronic device |
| TW201039622A (en) * | 2009-04-30 | 2010-11-01 | Fih Hong Kong Ltd | Camera device and portable electronic device with camera device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104902723B (en) | 2018-03-06 |
| TW201536152A (en) | 2015-09-16 |
| CN104902723A (en) | 2015-09-09 |
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