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CN104902723B - electronic device - Google Patents

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Publication number
CN104902723B
CN104902723B CN201410316879.0A CN201410316879A CN104902723B CN 104902723 B CN104902723 B CN 104902723B CN 201410316879 A CN201410316879 A CN 201410316879A CN 104902723 B CN104902723 B CN 104902723B
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Prior art keywords
frame
electronic device
electronic component
positioning portion
electronic
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CN104902723A (en
Inventor
陈易德
刘韦承
曾竣
许嘉元
赖仁正
庄政洁
孙金锴
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HTC Corp
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HTC Corp
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Abstract

The invention discloses an electronic device which comprises a shell, a circuit board, a frame, an electronic element supporting seat and a plurality of electronic elements. The circuit board and the frame are arranged in the shell. The electronic component support seat is positioned in the frame and comprises a fixing part and a bearing part. The fixing part is fixed to the frame to serve as a fulcrum of the electronic component support base. The electronic elements are respectively arranged on the bearing parts and electrically coupled to the circuit board, and gaps are respectively reserved between the bearing parts and the frame and between the bearing parts and the circuit board.

Description

电子装置electronic device

技术领域technical field

本发明涉及一种电子装置,且特别是涉及一种具有较低的光轴偏移机率的电子装置。The present invention relates to an electronic device, and in particular to an electronic device with a lower probability of optical axis deviation.

背景技术Background technique

近年来,随着科技产业日益发达,电子装置,例如智能型手机(smart phone)或平板电脑(tablet computer)等产品,已频繁地出现在日常生活中。这些电子装置除了本身具有的功能之外,通常还会搭配额外的功能组件,以具备额外的功能。举例而言,电子装置可以配置相机等组件。In recent years, with the development of the technology industry, electronic devices, such as smart phones or tablet computers, have frequently appeared in daily life. In addition to their own functions, these electronic devices are usually equipped with additional functional components to have additional functions. For example, an electronic device may be configured with components such as a camera.

目前,电子装置通常会通过固定结构将相机的上、下两侧固定住,周围侧用底盘结构(chassis)限位。然而,当电子装置受到冲击时,相机会随着这些固定结构变形而发生光轴偏移的状况。随着科技的进步,部分的电子装置更具有双相机的设计。由于具有双相机的电子装置是运用两个相机进行三角运算,以计算出物件与相机之间的距离,此类电子装置对于光轴平行度的要求更高,若发生光轴偏移,所算出来的距离误差也会越大,而未能得到符合需求的照相效果。At present, the electronic device usually fixes the upper and lower sides of the camera through a fixing structure, and the surrounding side is limited by a chassis structure (chassis). However, when the electronic device is impacted, the optical axis of the camera will deviate along with the deformation of these fixed structures. With the advancement of technology, some electronic devices have a dual-camera design. Since an electronic device with dual cameras uses two cameras for triangulation to calculate the distance between the object and the camera, this type of electronic device has higher requirements for the parallelism of the optical axis. If the optical axis shifts, the calculated The resulting distance error will also be larger, and the photographic effect that meets the requirements cannot be obtained.

发明内容Contents of the invention

本发明的目的在于提供一种电子装置,其具有电子元件支撑座,电子元件支撑座受到碰撞时,较不会受到壳体挤压,而使得所承载的这些电子元件具有较低的偏移机率。The object of the present invention is to provide an electronic device, which has an electronic component support seat, and when the electronic component support seat is hit, it is less likely to be squeezed by the casing, so that the electronic components carried have a lower probability of deflection .

为达上述目的,本发明的一种电子装置,包括壳体、电路板、框架、电子元件支撑座及多个电子元件。电路板及框架配置于壳体内。电子元件支撑座位于框架内且包括固定部及承载部。固定部固定至框架以作为电子元件支撑座的支点。这些电子元件分别设置于这些承载部且电性耦接于电路板,且承载部与框架之间以及承载部与电路板之间各自存在间隙。To achieve the above purpose, an electronic device of the present invention includes a housing, a circuit board, a frame, an electronic component support seat and a plurality of electronic components. The circuit board and the frame are arranged in the casing. The electronic component supporting seat is located in the frame and includes a fixing part and a bearing part. The fixing part is fixed to the frame to serve as a fulcrum of the supporting seat of the electronic component. The electronic components are respectively arranged on the carrying parts and electrically coupled to the circuit board, and gaps exist between the carrying parts and the frame and between the carrying parts and the circuit board.

基于上述,本发明的电子装置的电子元件支撑座通过固定部以支点的方式固定于框架,且承载部与框架之间以及承载部与电路板之间存在间隙,当电子装置受到碰撞时,电子元件支撑座的悬浮设计可使得承载部在与框架及电路板之间的间隙中略为震荡,不会直接受框架或电路板挤压变形,而降低位于电子元件支撑座上的这些电子元件的位置发生偏移的机率。Based on the above, the electronic component supporting base of the electronic device of the present invention is fixed to the frame by means of a fulcrum through the fixing part, and there are gaps between the carrying part and the frame and between the carrying part and the circuit board. When the electronic device is bumped, the electronic The suspension design of the component support seat can make the bearing part vibrate slightly in the gap between the frame and the circuit board, and will not be directly squeezed and deformed by the frame or circuit board, thereby reducing the position of these electronic components on the electronic component support seat Chances of offset occurring.

为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合所附的附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

附图说明Description of drawings

图1是本发明的一实施例的一种电子装置的局部剖面示意图;FIG. 1 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present invention;

图2是图1的电子装置的局部分解示意图;FIG. 2 is a partially exploded schematic diagram of the electronic device of FIG. 1;

图3是图1的电子装置移除背盖且隐藏电子元件的局部示意图;3 is a partial schematic view of the electronic device in FIG. 1 with the back cover removed and electronic components hidden;

图4是本发明的另一实施例的一种电子装置的局部剖面示意图。FIG. 4 is a schematic partial cross-sectional view of an electronic device according to another embodiment of the present invention.

符号说明Symbol Description

I、I1、I2:间隙I, I1, I2: Clearance

100、200:电子装置100, 200: electronic devices

110:壳体110: shell

120、220:电路板120, 220: circuit board

122:第二定位部122: The second positioning department

125、225:框架125, 225: frame

125a:第四定位部125a: The fourth positioning unit

130、230:电子元件支撑座130, 230: Electronic component support seat

132:固定部132: fixed part

134、234:承载部134, 234: carrying part

136:第一定位部136: First Positioning Department

138:第三定位部138: The third positioning department

139、239:容置槽139, 239: storage tank

139a:第一容置槽139a: the first storage tank

139b:第二容置槽139b: Second Storage Tank

140、240:电子元件140, 240: electronic components

142:第一相机模块142: The first camera module

144:第二相机模块144: Second camera module

150:荧幕150: screen

160:透镜160: lens

170:螺丝170: screw

280:缓冲材280: buffer material

具体实施方式Detailed ways

图1是依照本发明的一实施例的一种电子装置的局部剖面示意图。图2是图1的电子装置的局部分解示意图。图3是图1的电子装置移除背盖且隐藏电子元件的局部示意图。请参阅图1至图3,本实施例的电子装置100包括壳体110、电路板120、框架125、电子元件支撑座130、多个电子元件140、荧幕150、多个透镜160及螺丝170。FIG. 1 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present invention. FIG. 2 is a partial exploded view of the electronic device of FIG. 1 . FIG. 3 is a partial schematic diagram of the electronic device in FIG. 1 with the back cover removed and the electronic components hidden. 1 to 3, the electronic device 100 of this embodiment includes a housing 110, a circuit board 120, a frame 125, an electronic component support seat 130, a plurality of electronic components 140, a screen 150, a plurality of lenses 160 and screws 170 .

电路板120、框架125、电子元件支撑座130及电子元件140位于壳体110的此空间内,荧幕150外露于壳体110,透镜160则穿设于与荧幕150相对的壳体110。The circuit board 120 , the frame 125 , the electronic component support 130 and the electronic component 140 are located in the space of the housing 110 , the screen 150 is exposed from the housing 110 , and the lens 160 is penetrated through the housing 110 opposite to the screen 150 .

电子元件支撑座130包括固定部132及承载部134。固定部132位于电子元件支撑座130的一侧且固定至框架125。在本实施例中,固定部132为通孔,螺丝170可穿过固定部132后螺接至框架125以将电子元件支撑座130固定至框架125。承载部134用以承载电子元件140,也就是说,电子元件140通过电子元件支撑座130固定于框架125。承载部134具有多个容置槽139,用以容置这些电子元件140。在本实施例中,容置槽139的数量为两个,包括第一容置槽139a与第二容置槽139b,但容置槽139的数量不以此为限制。电子元件140设置于容置槽139、电性耦接于电路板120并靠设于透镜160。在本实施例中,电子元件140的数量对应于容置槽139的数量为两个,但在其他实施例中,电子元件140的数量可随容置槽139的数量而增减,不以此为限制。电子元件140可为感测器,感测器例如包括相机模块、光学感测模块、温度感测模块、距离感测模块、磁性感测模块等。举例而言,在本实施例中,两电子元件140包括第一相机模块142与第二相机模块144。第一相机模块142的底部固定于第一容置槽139a,第二相机模块144的底部固定于第二容置槽139b。电子装置100可通过双相机来拍出类3D照片或是支援先拍照后对焦的功能。The electronic component support base 130 includes a fixing portion 132 and a carrying portion 134 . The fixing portion 132 is located on one side of the electronic component supporting base 130 and fixed to the frame 125 . In this embodiment, the fixing portion 132 is a through hole, and the screw 170 can pass through the fixing portion 132 and be screwed to the frame 125 to fix the electronic component support base 130 to the frame 125 . The carrying portion 134 is used for carrying the electronic component 140 , that is, the electronic component 140 is fixed to the frame 125 through the electronic component supporting seat 130 . The carrying portion 134 has a plurality of accommodating slots 139 for accommodating the electronic components 140 . In this embodiment, the number of the accommodating grooves 139 is two, including the first accommodating groove 139 a and the second accommodating groove 139 b, but the number of the accommodating grooves 139 is not limited thereto. The electronic component 140 is disposed in the accommodating groove 139 , electrically coupled to the circuit board 120 and adjacent to the lens 160 . In this embodiment, the number of electronic components 140 is two corresponding to the number of accommodating grooves 139, but in other embodiments, the number of electronic components 140 can increase or decrease with the number of accommodating grooves 139, not based on this for the limit. The electronic component 140 can be a sensor, and the sensor includes, for example, a camera module, an optical sensing module, a temperature sensing module, a distance sensing module, a magnetic sensing module, and the like. For example, in this embodiment, the two electronic components 140 include a first camera module 142 and a second camera module 144 . The bottom of the first camera module 142 is fixed in the first accommodating groove 139a, and the bottom of the second camera module 144 is fixed in the second accommodating groove 139b. The electronic device 100 can take a 3D-like photo through dual cameras or support a function of first taking a photo and then focusing.

由于双相机的电子装置100对于光轴平行度的要求相当高,为了避免电子装置100受到碰撞而使双相机发生光轴偏移的状况,在本实施例中,承载电子元件140的电子元件支撑座130通过固定部132固定至框架125,以固定部132作为电子元件支撑座130的支点,且电子元件支撑座130与框架125之间以及电子元件支撑座130与电路板120之间各自存在间隙I。也就是说,电子元件支撑座130通过固定部132固定与框架125之间的相对位置,且电子元件支撑座130在固定部132以外的大部分的部位(也就是承载部134)基本上是悬浮状态。当电子装置100受到碰撞时,电子元件支撑座130的悬浮设计可使得承载部134在与框架125及电路板120之间的间隙I中能够沿着垂直方向(Z方向)略为上下震荡,不会直接受框架125或电路板120挤压变形,而降低位于电子元件支撑座130上的这些电子元件140发生偏移的机率。Since the dual-camera electronic device 100 has high requirements on the parallelism of the optical axes, in order to prevent the electronic device 100 from being bumped and causing the optical axes of the dual cameras to deviate, in this embodiment, the electronic component carrying the electronic component 140 supports The seat 130 is fixed to the frame 125 through the fixing portion 132, and the fixing portion 132 is used as the fulcrum of the electronic component support seat 130, and there is a gap between the electronic component support seat 130 and the frame 125 and between the electronic component support seat 130 and the circuit board 120 I. That is to say, the relative position between the electronic component supporting base 130 and the frame 125 is fixed by the fixing portion 132, and most of the positions (that is, the carrying portion 134) of the electronic component supporting base 130 other than the fixing portion 132 are basically suspended. state. When the electronic device 100 is bumped, the suspension design of the electronic component support base 130 can make the bearing part 134 slightly vibrate up and down along the vertical direction (Z direction) in the gap I between the frame 125 and the circuit board 120, without Directly deformed by the frame 125 or the circuit board 120 , the probability of deviation of the electronic components 140 on the electronic component support base 130 is reduced.

此外,在本实施例中,第一相机模块142的侧缘与第一容置槽139a之间的间隙I1小于第二相机模块144的侧缘与第二容置槽139b之间的间隙I2。第一相机模块142与第二相机模块144需要精准对位,在本实施例中,第一容置槽139a的形状会较符合第一相机模块142的轮廓,而第二容置槽139b的形状会较第二相机模块144的轮廓略大。当第一相机模块142固定在第一容置槽139a内之后,使第二相机模块144可以在第二容置槽139b内进行位置上的微调,待对位完之后再固定,而达到第一相机模块142与第二相机模块144能够被精准对位的效果。In addition, in this embodiment, the gap I1 between the side edge of the first camera module 142 and the first receiving groove 139a is smaller than the gap I2 between the side edge of the second camera module 144 and the second receiving groove 139b. The first camera module 142 and the second camera module 144 need to be precisely aligned. In this embodiment, the shape of the first accommodating groove 139a will conform to the outline of the first camera module 142, while the shape of the second accommodating groove 139b It will be slightly larger than the outline of the second camera module 144 . After the first camera module 142 is fixed in the first accommodating groove 139a, the second camera module 144 can be fine-tuned in position in the second accommodating groove 139b, and then fixed after the alignment is completed, so as to reach the first The camera module 142 and the second camera module 144 can be precisely aligned.

在其他实施例中,电子装置100的电子元件140也可以是一个相机模块搭配一个光学感测模块、温度感测模块、距离感测模块或是磁性感测模块的配置。当然,上述仅是提供数种电子装置100的电子元件140可能的种类以作为参考,数种电子装置100的电子元件140的种类并不以此为限制。In other embodiments, the electronic component 140 of the electronic device 100 may also be a configuration of a camera module combined with an optical sensing module, a temperature sensing module, a distance sensing module or a magnetic sensing module. Certainly, the above-mentioned only provides several possible types of the electronic components 140 of the electronic device 100 for reference, and the types of the electronic components 140 of the several electronic devices 100 are not limited thereto.

值得一提的是,在本实施例中,固定部132位于电子元件支撑座130的一端,以使电子元件支撑座130以悬臂的方式固定至壳体110。但在其他实施例中,固定部132也可位于电子元件支撑座130的中央,且承载部134的两容置槽139位于固定部132的两侧,电子元件支撑座130的两端可类似以翘翘板的形式沿垂直方向(Z方向)震动,当然,固定部134在电子元件支撑座130上的相对位置不以此为上述为限制。It is worth mentioning that, in this embodiment, the fixing portion 132 is located at one end of the electronic component support base 130 , so that the electronic component support base 130 is fixed to the casing 110 in a cantilever manner. But in other embodiments, the fixing part 132 can also be located in the center of the electronic component support base 130, and the two receiving grooves 139 of the carrying part 134 are located on both sides of the fixing part 132, and the two ends of the electronic component support base 130 can be similar to The form of the seesaw vibrates along the vertical direction (Z direction). Of course, the relative position of the fixing portion 134 on the electronic component support base 130 is not limited to the above.

此外,为了避免电子元件支撑座130相对电子装置100之间存在水平方向(X-Y方向)的移动,如图2所示,电子元件支撑座130包括第一定位部136及第三定位部138,电路板120包括对应于第一定位部136的第二定位部122,且框架125包括对应于第三定位部138的第四定位部125a。第一定位部136与第二定位部122用以使电子元件支撑座130对位于电路板120,且第三定位部138与第四定位部125a用以使电子元件支撑座130对位于框架125。In addition, in order to prevent the electronic component support base 130 from moving in the horizontal direction (X-Y direction) relative to the electronic device 100, as shown in FIG. The board 120 includes a second positioning portion 122 corresponding to the first positioning portion 136 , and the frame 125 includes a fourth positioning portion 125 a corresponding to the third positioning portion 138 . The first positioning portion 136 and the second positioning portion 122 are used to align the electronic component support base 130 on the circuit board 120 , and the third positioning portion 138 and the fourth positioning portion 125 a are used to align the electronic component support base 130 to the frame 125 .

在本实施例中,第一定位部136位于电子元件支撑座130的远离固定部132的一端,第三定位部138位于电子元件支撑座130靠近固定部132的一端。电子元件支撑座130的第一定位部136为凸柱,电路板120的第二定位部122为孔洞。电子元件支撑座130的第三定位部138为孔洞,且框架125的第四定位部125a为凸柱。电子元件支撑座130通过第一定位部136及第三定位部138与电路板120的第二定位部122与框架125的第四定位部125a对位,而限制了电子元件支撑座130相对于电路板120与壳体110在水平方向上的移动。In this embodiment, the first positioning portion 136 is located at an end of the electronic component supporting base 130 away from the fixing portion 132 , and the third positioning portion 138 is located at an end of the electronic component supporting base 130 close to the fixing portion 132 . The first positioning portion 136 of the electronic component support base 130 is a protrusion, and the second positioning portion 122 of the circuit board 120 is a hole. The third positioning portion 138 of the electronic component supporting seat 130 is a hole, and the fourth positioning portion 125a of the frame 125 is a protrusion. The electronic component support base 130 is aligned with the second positioning portion 122 of the circuit board 120 and the fourth positioning portion 125a of the frame 125 through the first positioning portion 136 and the third positioning portion 138, thereby limiting the electronic component support base 130 relative to the circuit. The movement of the plate 120 and the housing 110 in the horizontal direction.

图4是依照本发明的另一实施例的一种电子装置的局部剖面示意图。请参阅图4,图4的电子装置200与图1的电子装置100的主要差异在于,在图1的电子装置100中,电子元件支撑座130在固定部132、第一定位部136及第三定位部138以外的部位基本上是悬浮的而未与框架125与电路板120接触。在图4中,电子装置200还包括缓冲材280,配置于承载部234与框架225之间的间隙I或是承载部234与电路板220之间的间隙I中的至少一者。FIG. 4 is a schematic partial cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 4, the main difference between the electronic device 200 of FIG. 4 and the electronic device 100 of FIG. 1 is that in the electronic device 100 of FIG. The parts other than the positioning part 138 are basically suspended and not in contact with the frame 125 and the circuit board 120 . In FIG. 4 , the electronic device 200 further includes a buffer material 280 disposed at least one of the gap I between the carrying portion 234 and the frame 225 or the gap I between the carrying portion 234 and the circuit board 220 .

如图4所示,一部分的缓冲材280配置在承载部234与框架225之间的间隙I的其中一部分,另一部分的缓冲材280配置在承载部234与电路板220之间的间隙。更详细地说,承载部234在两容置槽239之间的部位的下方与框架225之间夹有缓冲材280,也就是说,承载部234在两容置槽239之间的部位的下方承靠在缓冲材280上。相同地,承载部234在两容置槽239之间的部位的上方也与电路板220(也就是电路板)之间夹有缓冲材。As shown in FIG. 4 , a part of the buffer material 280 is disposed in a part of the gap I between the supporting part 234 and the frame 225 , and another part of the buffer material 280 is disposed in the gap between the supporting part 234 and the circuit board 220 . In more detail, the bearing part 234 is sandwiched between the frame 225 and the buffer material 280 under the part between the two receiving grooves 239 , that is to say, the bearing part 234 is under the part between the two receiving grooves 239 It rests on the buffer material 280 . Similarly, a buffer material is sandwiched between the carrying portion 234 and the circuit board 220 (that is, the circuit board) above the portion between the two accommodating grooves 239 .

缓冲材280例如是海绵、硅胶、橡胶等可压缩的软质材料,在一般状态下,缓冲材280可提供电子元件支撑座230些许的固定与支撑效果。当电子装置200受到撞击时,框架225可能会在瞬间略为变形,此时,由于承载部234并未与框架225与电路板220接触,不会直接受到框架225与电路板220撞击而变形,且可利用电子元件支撑座230在悬浮的部分能够在垂直方向(Z方向)上略为移动的特性,以消耗所受到的撞击能量。此外,位于承载部234与框架225与电路板220之间的缓冲材也可以吸收框架225与电路板220的冲击力道,而达到使电子元件支撑座230上的这些电子元件240之间不会产生偏移的保护功效。The buffer material 280 is, for example, compressible soft material such as sponge, silica gel, rubber, etc. Under normal conditions, the buffer material 280 can provide a little fixing and supporting effect for the electronic component support seat 230 . When the electronic device 200 is hit, the frame 225 may be slightly deformed in an instant. At this time, since the bearing part 234 is not in contact with the frame 225 and the circuit board 220, it will not be directly deformed by the impact of the frame 225 and the circuit board 220, and The feature that the suspended part of the electronic component support base 230 can move slightly in the vertical direction (Z direction) can be used to dissipate the received impact energy. In addition, the buffer material between the bearing part 234 and the frame 225 and the circuit board 220 can also absorb the impact force of the frame 225 and the circuit board 220, so that there will be no impact between the electronic components 240 on the electronic component support seat 230. Offset protection.

综上所述,本发明的电子装置的电子元件支撑座通过固定部以支点的方式固定于框架,且承载部与框架之间以及承载部与电路板之间存在间隙,当电子装置受到碰撞时,电子元件支撑座的悬浮设计可使得承载部在与框架及电路板之间的间隙中略为震荡,不会直接受框架或电路板挤压变形,而降低位于电子元件支撑座上的这些电子元件的位置发生偏移的机率。此外,本发明的电子装置通过电子元件支撑座的第一定位部与第三定位部分别与电路板的第二定位部与框架的第四定位部对位,而使得电子元件支撑座能够对位于电路板与框架,以确保电子元件支撑座在水平方向不会移动,而仅能在垂直方向震荡,以避免受碰撞时在水平方向上与其他元件干涉而变形。另外,本发明的电子装置还通过将缓冲材配置于承载部与框架之间的间隙或是承载部与电路板之间的间隙,以进一部地提供支撑及缓冲的效果。To sum up, the electronic component supporting seat of the electronic device of the present invention is fixed to the frame by means of a fulcrum through the fixing part, and there are gaps between the carrying part and the frame and between the carrying part and the circuit board. When the electronic device is hit , the suspension design of the electronic component support seat can make the bearing part vibrate slightly in the gap between the frame and the circuit board, and will not be directly squeezed and deformed by the frame or circuit board, thereby lowering the electronic components on the electronic component support seat The probability that the position of . In addition, the electronic device of the present invention aligns the first positioning portion and the third positioning portion of the electronic component supporting base with the second positioning portion of the circuit board and the fourth positioning portion of the frame respectively, so that the electronic component supporting base can be aligned. The circuit board and the frame ensure that the electronic component support seat does not move in the horizontal direction, but can only vibrate in the vertical direction, so as to avoid deformation caused by interference with other components in the horizontal direction when being collided. In addition, the electronic device of the present invention further provides support and cushioning effects by arranging the cushioning material in the gap between the carrying part and the frame or between the carrying part and the circuit board.

虽然结合以上实施例公开了本发明,然而其并非用以限定本发明,任何所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,可作些许的更动与润饰,故本发明的保护范围应当以附上的权利要求所界定的为准。Although the present invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the appended claims.

Claims (9)

1.一种电子装置,其特征在于,包括:1. An electronic device, characterized in that, comprising: 壳体;case; 电路板,配置于该壳体内;a circuit board configured in the housing; 框架,设置于该壳体内;a frame arranged in the casing; 电子元件支撑座,位于该壳体内且包括固定部及承载部,其中该固定部固定至该框架以作为该电子元件支撑座的支点,且该承载部与该框架之间以及该承载部与该电路板之间各自存在间隙;以及The electronic component support seat is located in the housing and includes a fixing part and a bearing part, wherein the fixing part is fixed to the frame as a fulcrum of the electronic component support seat, and between the bearing part and the frame and between the bearing part and the There are respective gaps between the circuit boards; and 多个电子元件,分别设置于该些承载部且电性耦接于该电路板。A plurality of electronic components are respectively arranged on the carrying parts and electrically coupled to the circuit board. 2.如权利要求1所述的电子装置,其特征在于,其中该固定部位于该电子元件支撑座的一端,以使该电子元件支撑座以悬臂的方式固定至该框架。2 . The electronic device according to claim 1 , wherein the fixing portion is located at one end of the electronic component support base, so that the electronic component support base is fixed to the frame in a cantilever manner. 3 . 3.如权利要求1所述的电子装置,其特征在于,其中各该电子元件包括感测器。3. The electronic device according to claim 1, wherein each of the electronic components comprises a sensor. 4.如权利要求1所述的电子装置,其特征在于,其中该电子元件支撑座包括第一定位部,该电路板或该框架包括对应于该第一定位部的第二定位部,该第一定位部与该第二定位部用以使该电子元件支撑座对位于该电路板或该框架。4. The electronic device according to claim 1, wherein the electronic component support base comprises a first positioning portion, the circuit board or the frame comprises a second positioning portion corresponding to the first positioning portion, the first positioning portion A positioning portion and the second positioning portion are used to make the electronic component supporting seat correspond to the circuit board or the frame. 5.如权利要求4所述的电子装置,其特征在于,其中该第一定位部位于该电子元件支撑座的其中一端,该第一定位部与该第二定位部的其中之一为凸柱,且该第一定位部与该第二定位部的另一为孔洞。5. The electronic device according to claim 4, wherein the first positioning portion is located at one end of the electronic component support base, and one of the first positioning portion and the second positioning portion is a boss , and the other of the first positioning portion and the second positioning portion is a hole. 6.如权利要求1所述的电子装置,其特征在于,还包括多个透镜,其中该壳体包括背盖,该些透镜穿设于该背盖,且该些电子元件分别承靠于该些透镜。6. The electronic device according to claim 1, further comprising a plurality of lenses, wherein the casing includes a back cover, the lenses are passed through the back cover, and the electronic components are respectively supported on the back cover some lenses. 7.如权利要求1所述的电子装置,其特征在于,还包括缓冲材,配置于该承载部与该框架之间的该间隙或是该承载部与该电路板之间的该间隙中的至少一者。7. The electronic device according to claim 1, further comprising a buffer material disposed in the gap between the bearing portion and the frame or in the gap between the bearing portion and the circuit board at least one. 8.如权利要求1所述的电子装置,其特征在于,其中该承载部具有多个容置槽以容置该些电子元件。8. The electronic device as claimed in claim 1, wherein the carrying portion has a plurality of accommodating slots for accommodating the electronic components. 9.如权利要求8所述的电子装置,其特征在于,其中该多个容置槽包括第一容置槽与第二容置槽,该些电子元件包括第一相机模块与第二相机模块,其中该第一相机模块的底部固定于该第一容置槽,该第二相机模块的底部固定于该第二容置槽,且该第一相机模块的侧缘与该第一容置槽之间的间隙小于该第二相机模块的侧缘与该第二容置槽之间的间隙。9. The electronic device according to claim 8, wherein the plurality of accommodation slots comprise a first accommodation slot and a second accommodation slot, and the electronic components include a first camera module and a second camera module , wherein the bottom of the first camera module is fixed to the first accommodating groove, the bottom of the second camera module is fixed to the second accommodating groove, and the side edge of the first camera module is in contact with the first accommodating groove The gap therebetween is smaller than the gap between the side edge of the second camera module and the second accommodating groove.
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