TWI547358B - Drilling cover - Google Patents
Drilling cover Download PDFInfo
- Publication number
- TWI547358B TWI547358B TW100149246A TW100149246A TWI547358B TW I547358 B TWI547358 B TW I547358B TW 100149246 A TW100149246 A TW 100149246A TW 100149246 A TW100149246 A TW 100149246A TW I547358 B TWI547358 B TW I547358B
- Authority
- TW
- Taiwan
- Prior art keywords
- drilling
- solid lubricant
- weight
- resin composition
- cover plate
- Prior art date
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- 238000005553 drilling Methods 0.000 title claims description 66
- 239000007787 solid Substances 0.000 claims description 81
- 239000000314 lubricant Substances 0.000 claims description 78
- 239000002245 particle Substances 0.000 claims description 51
- 229920005989 resin Polymers 0.000 claims description 49
- 239000011347 resin Substances 0.000 claims description 49
- 239000011342 resin composition Substances 0.000 claims description 49
- 239000011888 foil Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 36
- 238000005520 cutting process Methods 0.000 description 18
- -1 polypropylene decylamine Polymers 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 238000002156 mixing Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229920001223 polyethylene glycol Polymers 0.000 description 9
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 8
- 239000002202 Polyethylene glycol Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- 238000009835 boiling Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 230000001050 lubricating effect Effects 0.000 description 5
- 239000010445 mica Substances 0.000 description 5
- 229910052618 mica group Inorganic materials 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 4
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920002538 Polyethylene Glycol 20000 Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002522 swelling effect Effects 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- CMCBDXRRFKYBDG-UHFFFAOYSA-N 1-dodecoxydodecane Chemical compound CCCCCCCCCCCCOCCCCCCCCCCCC CMCBDXRRFKYBDG-UHFFFAOYSA-N 0.000 description 1
- CTXGTHVAWRBISV-UHFFFAOYSA-N 2-hydroxyethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCO CTXGTHVAWRBISV-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- MMQZBEXYFLXHEN-UHFFFAOYSA-N OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O Chemical compound OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O MMQZBEXYFLXHEN-UHFFFAOYSA-N 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229920000831 ionic polymer Polymers 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- NWZZFAQUBMRYNU-UHFFFAOYSA-N n-octadecylnonadec-18-en-1-amine Chemical compound CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC=C NWZZFAQUBMRYNU-UHFFFAOYSA-N 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- SSZBUIDZHHWXNJ-UHFFFAOYSA-N palmityl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCCCCCCCCCCC SSZBUIDZHHWXNJ-UHFFFAOYSA-N 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laminated Bodies (AREA)
- Lubricants (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Description
本發明係關於包銅疊層基板或多層板之鑽孔加工時使用之鑽孔用蓋板。The present invention relates to a drilling cover plate for use in drilling a copper-clad laminate substrate or a multilayer board.
作為使用於印刷電路板材料之包銅疊層基板或多層板之鑽孔加工方法,一般係採用:取1片包銅疊層基板或多層板或是將複數片重疊,並將在鋁等金屬箔單體或金屬箔表面形成樹脂組成物層之薄片(以下,在本說明書中,通常將此薄片稱為「鑽孔用蓋板」)配置作為抵住其最上部之板,然後進行鑽孔加工之方法。As a method for drilling a copper-clad laminate substrate or a multi-layer board used for a printed circuit board material, generally, a copper-clad laminate substrate or a multi-layer board is used or a plurality of sheets are overlapped, and a metal such as aluminum is used. A sheet of a resin composition layer formed on the surface of a foil or a metal foil (hereinafter, this sheet is generally referred to as a "hole for drilling" in the present specification) is disposed as a plate against the uppermost portion, and then drilled The method of processing.
近年來,對於屬於印刷電路板材料之包銅疊層基板或多層板的要求,包含高密度化發展、生產性提升、成本降低與信賴性提升,並要求使孔位置精確度提升之高品質的鑽孔加工。為了對應這些要求,例如在專利文獻1中提出一種使用聚乙二醇等水溶性樹脂所構成之薄片的鑽孔加工法。又,在專利文獻2中提出一種在金屬箔上形成水溶性樹脂層之鑽孔用滑劑薄片。甚至,在專利文獻3中提出一種於形成有熱硬化性樹脂薄膜之鋁箔上形成水溶性樹脂層之鑽孔用蓋板。而且加上,在專利文獻4~5中提出一種摻合奈米粉末延長鑽頭刃部壽命之輔助材料。In recent years, the requirements for copper-clad laminate substrates or multilayer boards belonging to printed circuit board materials include high density development, productivity improvement, cost reduction and reliability improvement, and high quality of hole position accuracy is required. Drilling processing. In order to cope with these requirements, for example, Patent Document 1 proposes a drilling method using a sheet made of a water-soluble resin such as polyethylene glycol. Further, Patent Document 2 proposes a lubricant sheet for drilling a water-soluble resin layer on a metal foil. Further, Patent Document 3 proposes a drilling cover plate in which a water-soluble resin layer is formed on an aluminum foil on which a thermosetting resin film is formed. Further, in Patent Documents 4 to 5, an auxiliary material which blends the nano powder to extend the life of the drill blade is proposed.
然而,相較於半導體技術之進展,印刷電路板技術的進展緩慢,與半導體技術有所偏離。為此,對於印刷電路板高密度化與信賴性提升的要求,越來越高。舉例而言,在量產中最小鑽頭刃部直徑,從0.2 mmΦ開始,經0.18mmΦ、0.15mmΦ,正往0.105mmΦ推移。又,有極少的一部分,在對抗雷射開孔技術下嘗試了0.08mmΦ、0.075mmΦ、0.05mmΦ的鑽頭開孔。並且,因為全球化造成的競爭與新興國家需求的關係,生產性提升與成本降低之需求亦無止境。因此,因應如此要求開發之新型鑽孔用蓋板是受到殷切期盼的。However, compared to the advancement of semiconductor technology, the progress of printed circuit board technology is slow and deviates from semiconductor technology. For this reason, the requirements for higher density and reliability of printed circuit boards are increasing. For example, the smallest drill blade diameter in mass production, starting from 0.2 mm Φ, 0.18mmΦ, 0.15mmΦ, going to 0.105mmΦ. Moreover, there is a very small part that attempts to drill holes of 0.08 mm Φ, 0.075 mm Φ, and 0.05 mm Φ under the anti-laser opening technique. Moreover, because of the relationship between competition caused by globalization and the needs of emerging countries, the need for productivity improvement and cost reduction is endless. Therefore, the new type of drilling cover plate developed in response to such requirements is highly anticipated.
[先前技術文獻][Previous Technical Literature]
[專利文獻][Patent Literature]
專利文獻1:日本特開平4-92494號公報Patent Document 1: Japanese Patent Laid-Open No. Hei 4-92494
專利文獻2:日本特開平5-169400號公報Patent Document 2: Japanese Patent Laid-Open No. Hei 5-169400
專利文獻3:日本特開2003-136485號公報Patent Document 3: Japanese Patent Laid-Open Publication No. 2003-136485
專利文獻4:日本實用新案3134128號公報Patent Document 4: Japanese Utility New Case No. 3134128
專利文獻5:日本特開2007-281404號公報Patent Document 5: Japanese Laid-Open Patent Publication No. 2007-281404
本發明之目的在於:鑑於這樣的現況,提供與以往的鑽孔用蓋板相比,孔位置精度優異之鑽孔用蓋板。因為有助於高密度化、高信賴性、生產性提升及成本降低,那樣的鑽孔用蓋板之開發是受到殷切期盼的。An object of the present invention is to provide a drilling cover plate which is superior in hole position accuracy to a conventional drilling cover plate in view of such a situation. The development of such a drilling cover plate is eagerly awaited because it contributes to high density, high reliability, productivity improvement, and cost reduction.
本發明人,為解決上述問題進行種種檢討之結果,發現:在鑽孔用蓋板之樹脂組成物中摻合鉬酸鋅及三氧化鉬至少其中之一作為固體潤滑劑(B),並最佳化其摻合量。藉此,發現鑽頭刃部咬合更容易,而因為鑽頭刃部的向心性提升使孔位置精度提升。並且,發現由於鉬酸鋅及三氧化鉬的固體潤滑作用增加了潤滑性,因此切割屑的排出變得順利,藉此可防止切割屑結成塊落下,並防止因為鑽頭刃部鑽到塊狀的切割屑造成鑽頭刃部的折損問題。As a result of various reviews to solve the above problems, the present inventors have found that at least one of zinc molybdate and molybdenum trioxide is blended as a solid lubricant (B) in the resin composition of the cover plate for drilling. Better the amount of blending. Thereby, it is found that the bit edge portion is easier to bite, and the hole position accuracy is improved because the centripetality of the drill bit portion is improved. Further, it has been found that since the solid lubricating action of zinc molybdate and molybdenum trioxide increases the lubricity, the discharge of the cutting chips becomes smooth, thereby preventing the cutting chips from falling into pieces and preventing the cutting of the cutting edge into a block shape. Cutting debris causes breakage of the drill bit.
這裡所述向心性係指切削時切削方向之前進性。例如:在鑽頭刃部與鑽孔用蓋板之樹脂組成物層接觸之點,旋轉的鑽頭刃部前端之利刃,會一邊滑動一邊咬入樹脂組成物層表面。若單單只是提高潤滑性,鑽頭刃部前端之利刃容易橫向滑動而損及向心性,並導致孔位置精度惡化。The centripetality referred to herein refers to the advancement of the cutting direction during cutting. For example, when the drill blade portion comes into contact with the resin composition layer of the drilling cover plate, the sharp edge of the tip end of the rotating drill blade edge bites into the surface of the resin composition layer while sliding. If the lubricity is merely improved, the sharp edge of the tip end of the drill blade is likely to slide laterally to impair the centripetality, and the hole position accuracy is deteriorated.
本發明係基於這樣的知識所製作出來,其要旨如以下所述。The present invention has been made based on such knowledge, and the gist thereof is as follows.
1.一種鑽孔用蓋板,係於金屬支撐箔的至少單面上形成有由樹脂組成物構成之層,其特徵為:該樹脂組成物含有當做固體潤滑劑(B)之鉬酸鋅及三氧化鉬至少其中之一,且該樹脂組成物層之厚度為0.02至0.3mm之範圍。A cover plate for drilling, wherein a layer composed of a resin composition is formed on at least one surface of a metal supporting foil, characterized in that the resin composition contains zinc molybdate as a solid lubricant (B) At least one of molybdenum trioxide, and the thickness of the resin composition layer is in the range of 0.02 to 0.3 mm.
2.如上述第1項之鑽孔用蓋板,其中,該樹脂組成物含有水溶性樹脂(A)。2. The entry sheet for drilling according to the above item 1, wherein the resin composition contains a water-soluble resin (A).
3.如上述第1項之鑽孔用蓋板,其中,該樹脂組成物相對於該樹脂成分100重量份,摻合該固體潤滑劑(B)合計1重量份至40重量份。3. The cover sheet for drilling according to the above item 1, wherein the resin composition is blended in an amount of from 1 part by weight to 40 parts by weight based on 100 parts by weight of the resin component.
4.如上述第1項之鑽孔用蓋板,其中,該鉬酸鋅平均粒徑為1~7μm。4. The casing for drilling according to the above item 1, wherein the zinc molybdate has an average particle diameter of from 1 to 7 μm.
5.如上述第1項之鑽孔用蓋板,其中,該三氧化鉬平均粒徑為3~35μm。5. The entry sheet for drilling according to the above item 1, wherein the molybdenum trioxide has an average particle diameter of from 3 to 35 μm.
6.如上述第1項之鑽孔用蓋板,其適用於直徑0.2mmΦ以下之鑽頭刃部。6. The drilling cover according to the above item 1, which is suitable for a drill blade having a diameter of 0.2 mm or less.
7.如上述第1項之鑽孔用蓋板,其中,該金屬支撐箔厚度為0.05~0.5mm之範圍。7. The drilling cover according to the above item 1, wherein the metal supporting foil has a thickness of 0.05 to 0.5 mm.
8.如上述第1項之鑽孔用蓋板,其中,於該金屬支撐箔之上具有做為樹脂皮膜之底漆層。8. The drilling cover according to the above item 1, wherein the metal supporting foil has a primer layer as a resin film.
9.如上述第8項之鑽孔用蓋板,其中,該底漆層含有該固體潤滑劑(B)。9. The drilling cover according to item 8 above, wherein the primer layer contains the solid lubricant (B).
10.如上述第9項之鑽孔用蓋板,其中,該固體潤滑劑(B)於底漆層之摻合量,相對於該底漆之組成物100重量份為1重量份~20重量份。10. The cover sheet for drilling according to the above item 9, wherein the amount of the solid lubricant (B) blended in the primer layer is from 1 part by weight to 20 parts by weight based on 100 parts by weight of the composition of the primer. Share.
11.如上述第1項之鑽孔用蓋板,其係使用於包銅疊層基板或多層板之加工。11. The drilling cover according to item 1 above, which is used for processing a copper-clad laminate substrate or a multilayer board.
使用本發明之鑽孔用蓋板時,由於鑽孔加工時優異的孔位置精度及樹脂組成物層優異的潤滑性,可減少於鑽孔加工時鑽頭刃部的折損。因此,更加高密度設計,高品質且生產性優異的鑽孔加工成為可能。而且,鑽孔加工時可增加單次堆疊片數,有助於提升生產性及降低成本。When the drilling cover plate of the present invention is used, the excellent hole positional accuracy during the drilling process and the excellent lubricity of the resin composition layer can reduce the breakage of the drill blade portion during the drilling process. Therefore, drilling processing with higher density and high quality and excellent productivity is possible. Moreover, the number of stacked sheets can be increased during drilling, which helps to improve productivity and reduce costs.
[實施發明之形態][Formation of the Invention]
本發明之鑽孔用蓋板,係於金屬支撐箔的至少單面上形成有由樹脂組成物構成之層(以下,稱為「樹脂組成物層」)之鑽孔用蓋板。本發明之鑽孔用蓋板其特徵為樹脂組成物含有固體潤滑劑(B)。The drilling cover plate of the present invention is a drilling cover plate in which a layer composed of a resin composition (hereinafter referred to as a "resin composition layer") is formed on at least one surface of a metal supporting foil. The entry sheet for drilling according to the present invention is characterized in that the resin composition contains a solid lubricant (B).
在本發明中,固體潤滑劑(B)係指為了保護表面不受相對運動的損害,並減少摩擦與磨耗,而做為薄膜或是粉末使用的某些固體,其熔點為300℃以上,放置在比本發明使用溫度更高的溫度200℃之空氣中可維持熱安定而不會融化。In the present invention, the solid lubricant (B) refers to some solids used as a film or a powder for protecting the surface from relative movement and reducing friction and abrasion, and having a melting point of 300 ° C or more. Thermal stability can be maintained without melting in air at a temperature 200 ° C higher than the temperature at which the present invention is used.
然後,最佳化鉬酸鋅及三氧化鉬至少其中之一之摻合量做為固體潤滑劑(B)。據此,鑽頭刃部咬合變得容易,因鑽頭刃部之向心性提升,孔位置精度也提升,並且,因為潤滑性的增加使切割屑的排出變得順利,防止切割屑結成塊落下,有助於防止因為鑽頭刃部鑽到塊狀的切割屑造成鑽頭刃部的折損問題。Then, the blending amount of at least one of zinc molybdate and molybdenum trioxide is optimized as a solid lubricant (B). According to this, the bit edge of the drill bit becomes easy to be engaged, the centripetality of the drill blade portion is improved, the hole position accuracy is also improved, and the discharge of the cutting chips is smoothed by the increase in the lubricity, and the cutting chips are prevented from falling into pieces. Helps prevent the breakage of the drill bit due to the cutting of the cutting edge of the drill bit.
又,本發明之樹脂組成物係以含有水溶性樹脂(A)之組成物為宜。在此,上述水溶性樹脂(A),係指水溶性樹脂、非固體潤滑劑(B)的水溶性潤滑劑。Further, the resin composition of the present invention is preferably a composition containing the water-soluble resin (A). Here, the water-soluble resin (A) means a water-soluble resin of a water-soluble resin or a non-solid lubricant (B).
當然,上述樹脂組成物,亦可含有廣為周知的熱可塑性的非水溶性樹脂、非固體潤滑劑(B)的非水溶性潤滑劑、其他添加劑,例如:核劑、著色劑、熱安定化劑等。Of course, the above resin composition may also contain a well-known thermoplastic water-insoluble resin, a water-insoluble lubricant of the non-solid lubricant (B), and other additives such as a nucleating agent, a coloring agent, and thermal stabilization. Agents, etc.
作為上述樹脂組成物之樹脂部份,係指水溶性樹脂(A)、非固體潤滑劑(B)之非水溶性潤滑劑、熱可塑性的非水溶性樹脂。樹脂組成物之樹脂部份除了本身的用途以外,也實現作為將固體潤滑劑(B)運至鑽頭刃部與印刷電路板材料之載體的用途。The resin portion of the above resin composition means a water-soluble resin (A), a water-insoluble lubricant of the non-solid lubricant (B), and a thermoplastic water-insoluble resin. The resin portion of the resin composition is used as a carrier for transporting the solid lubricant (B) to the drill blade portion and the printed circuit board material in addition to its own use.
上述固體潤滑劑(B),相對於樹脂組成物之樹脂部份100重量份,合計共摻合1重量份~40重量份,以摻合1重量份~30重量份為佳,摻合5重量份~20重量份較佳,摻合10重量份~20重量份更佳。固體潤滑劑(B)在未滿1重量份的情況看不出效果。固體潤滑劑(B)在超過40重量份的情況,沒有經濟的合理性,且固體潤滑劑(B)變得容易凝集。因而,產生製造上的困難,結果有時會導致孔位置精度惡化的情況。The solid lubricant (B) is blended in a total amount of 1 part by weight to 40 parts by weight based on 100 parts by weight of the resin portion of the resin composition, preferably 1 part by weight to 30 parts by weight, preferably 5 parts by weight. It is preferably from ~20 parts by weight, more preferably from 10 parts by weight to 20 parts by weight. The solid lubricant (B) did not show an effect in the case of less than 1 part by weight. In the case where the solid lubricant (B) exceeds 40 parts by weight, there is no economic rationality, and the solid lubricant (B) becomes easy to aggregate. Therefore, manufacturing difficulties occur, and as a result, the hole position accuracy may be deteriorated.
於本發明的固體潤滑劑(B),係為鉬酸鋅(MoO4Zn,熔點900℃),及三氧化鉬(MoO3,熔點795℃)之至少其中一種。三氧化鉬過去雖被指出無法發揮固體潤滑性,但發現摻合作為鑽孔用蓋板的固體潤滑劑(B)是有用的。固體潤滑劑(B)只要含有這些物質之中至少一種以上即可。The solid lubricant (B) of the present invention is at least one of zinc molybdate (MoO 4 Zn, melting point: 900 ° C) and molybdenum trioxide (MoO 3 , melting point: 795 ° C). Although molybdenum trioxide has been pointed out in the past that solid lubricity cannot be exhibited, it has been found to be useful to incorporate a solid lubricant (B) which is a cover plate for drilling. The solid lubricant (B) may contain at least one of these substances.
上述之固體潤滑劑(B),因發現與二硫化鉬、雲母等固體潤滑劑相比,少量的摻合即有顯著的作用效果而令人滿意。發現少量而有顯著的作用效果,在擴大樹脂組成物之樹脂的選項這點而言亦令人滿意。The solid lubricant (B) described above is found to be satisfactory in that a small amount of blending has a remarkable effect as compared with a solid lubricant such as molybdenum disulfide or mica. A small amount was found to have a remarkable effect, and it was also satisfactory in terms of expanding the option of the resin of the resin composition.
固體潤滑劑(B)之作用機制,目前認為大致如以下所述。第一,潤滑劑層中含有適當硬度的固體,鑽頭刃部的前端接觸到固體潤滑劑(B)並咬合。因此,初期的孔位置精度良好。第二,因為潤滑劑層中摻合了固體潤滑劑(B),鑽頭刃部的表面與溝槽,以及印刷電路板材料之孔壁中附著著固體潤滑劑(B)。因固體潤滑劑(B)為固體而有體積與硬度,持續存在於包銅疊層基板或多層板與鑽頭刃部之間提高潤滑性,抑制鑽頭刃部的磨耗。第三,由於鑽頭刃部溝槽中附著著固體潤滑劑(B),因該固體潤滑作用使得潤滑性提高,切割屑的排出變得順利,故可抑制切割屑集結成塊。The mechanism of action of the solid lubricant (B) is currently considered to be substantially as described below. First, the lubricant layer contains solids of appropriate hardness, and the front end of the drill blade portion comes into contact with the solid lubricant (B) and is engaged. Therefore, the initial hole position accuracy is good. Second, since the solid lubricant (B) is blended in the lubricant layer, the surface of the drill blade and the groove, and the solid lubricant (B) are adhered to the wall of the printed circuit board material. Since the solid lubricant (B) is solid and has a volume and hardness, it continues to exist between the copper-clad laminate substrate or the multilayer plate and the drill blade portion to improve lubricity and suppress wear of the drill blade portion. Third, since the solid lubricant (B) is adhered to the groove of the drill blade portion, the lubricity is improved by the solid lubricating action, and the discharge of the cutting chips is smoothly performed, so that the cutting chips can be prevented from being aggregated into pieces.
另外,鑽頭刃部的磨耗可分類成2種。第1,初期磨耗。亦即,鑽頭刃部在開始使用時,遭受衝擊的部份會破損。因為前述的固體潤滑劑(B)有特有顯著之潤滑效果,鑽頭刃部的初期磨耗,在與不含固體潤滑劑(B)的情況相比,是有受到抑制的。第2,常態磨耗。亦即,鑽頭刃部伴隨著鑽孔數的累積而磨耗。但是,由於固體潤滑劑(B)有特有的潤滑效果,與不含固體潤滑劑(B)的情況相比,常態磨耗亦受到抑制。因此,孔位置精度在不含固體潤滑劑(B)的情況,惡化狀況與累積鑽孔數成正比,然而在含固體潤滑劑(B)的情況下,則可逐漸地受到抑制。In addition, the wear of the drill blade can be classified into two types. First, initial wear. That is, the portion of the drill blade that is subjected to the impact at the beginning of use may be damaged. Since the aforementioned solid lubricant (B) has a particularly remarkable lubricating effect, the initial wear of the drill blade portion is suppressed as compared with the case where the solid lubricant (B) is not contained. Second, normal wear. That is, the drill blade portion is worn with the accumulation of the number of drill holes. However, since the solid lubricant (B) has a specific lubricating effect, normal wear is also suppressed as compared with the case where the solid lubricant (B) is not contained. Therefore, the hole positional accuracy is in the absence of the solid lubricant (B), and the deterioration condition is proportional to the cumulative number of drilled holes, whereas in the case of the solid lubricant (B), it can be gradually suppressed.
固體潤滑劑(B)也可與設置於金屬支撐箔上的樹脂皮膜(以下稱之為底漆層)摻合。底漆層是與鋁箔接觸的界面,因此細密填充於底漆層對孔位置精度是有幫助的。前述固體潤滑劑(B),相對於底漆層之組成物100重量份,合計摻合1重量份~20重量份,而以摻合5重量份~10重量份為佳。固體潤滑劑(B)的摻合量在未滿1重量份的情況看不出效果。固體潤滑劑(B)的摻合量在超過20重量份的情況,沒有經濟的合理性,並有妨害薄厚不同的底漆層與金屬支持箔之間的黏著性的情況。摻合固體潤滑劑(B)的底漆層之樹脂,熱硬化性樹脂或熱可塑性樹脂任一種皆可適用。底漆層之樹脂為熱硬化性樹脂時,孔位置精度則較佳。The solid lubricant (B) may also be blended with a resin film (hereinafter referred to as a primer layer) provided on the metal supporting foil. The primer layer is the interface with the aluminum foil, so fine filling of the primer layer is helpful for hole position accuracy. The solid lubricant (B) is preferably blended in an amount of from 1 part by weight to 20 parts by weight per 100 parts by weight of the composition of the primer layer, and more preferably from 5 parts by weight to 10 parts by weight. When the blending amount of the solid lubricant (B) is less than 1 part by weight, no effect is observed. When the blending amount of the solid lubricant (B) is more than 20 parts by weight, there is no economic rationality and the adhesion between the thinner and different primer layers and the metal supporting foil is impaired. Any of a resin blended with a primer layer of the solid lubricant (B), a thermosetting resin or a thermoplastic resin may be applied. When the resin of the primer layer is a thermosetting resin, the hole positional accuracy is preferable.
對應包銅疊層基板或多層板的規格,選擇最適合的種類、粒徑、以及摻合量之固體潤滑劑(B)更為理想。It is more preferable to select the most suitable type, particle size, and blending amount of the solid lubricant (B) in accordance with the specifications of the copper-clad laminate substrate or the multilayer board.
例如以鉬酸鋅作為固體潤滑劑(B)時,效果奏效之理由如以下所述。鉬酸鋅係為層狀構造、粒徑為0.2μm~15μm之範圍,平均粒徑為1~7μm,擁有體積及適當硬度的固體。較佳的平均粒徑為2~6μm。更佳的平均粒徑為3~5μm。因為該特性,對於孔位置精度重要的小徑鑽頭刃部而言,可使鑽頭刃部易於咬合。又,鉬酸鋅因層狀構造而較薄,在鑽頭刃部旋轉時易被捲入其溝槽,故有助於切割屑的排出。For example, when zinc molybdate is used as the solid lubricant (B), the reason for the effect is as follows. The zinc molybdate has a layered structure, a particle diameter of 0.2 μm to 15 μm, an average particle diameter of 1 to 7 μm, and a solid having a volume and an appropriate hardness. A preferred average particle diameter is 2 to 6 μm. More preferably, the average particle diameter is from 3 to 5 μm. Because of this characteristic, the cutting edge of the drill can be easily engaged for the small-diameter drill blade whose hole position accuracy is important. Further, since the zinc molybdate is thin due to the layered structure and is easily caught in the groove when the drill blade is rotated, it contributes to the discharge of the cutting chips.
三氧化鉬作用效果奏效之理由如以下所述。三氧化鉬為二硫化鉬氧化而成,係柱狀構造,粒徑為0.7μm~55μm之範圍,平均粒徑為3~35μm,擁有體積及適當硬度的固體。較佳的平均粒徑為5~20μm。更佳的平均粒徑為10~18μm。因為該特性,對於孔位置精度重要的小徑鑽頭刃部而言,可使鑽頭刃部易於咬合。又,三氧化鉬因為平均粒徑與鑽頭刃部之溝槽相比較小,在鑽頭刃部旋轉時易被捲入其溝槽,故有助於切割屑的排出。The reason why the effect of molybdenum trioxide is effective is as follows. Molybdenum trioxide is oxidized by molybdenum disulfide, and has a columnar structure, a particle diameter of 0.7 μm to 55 μm, an average particle diameter of 3 to 35 μm, and a solid having a volume and an appropriate hardness. A preferred average particle size is 5 to 20 μm. More preferably, the average particle diameter is from 10 to 18 μm. Because of this characteristic, the cutting edge of the drill can be easily engaged for the small-diameter drill blade whose hole position accuracy is important. Further, since the molybdenum trioxide has a smaller average particle diameter than the groove of the drill blade portion, it is easily caught in the groove when the drill blade portion rotates, thereby contributing to the discharge of the cutting chips.
關於固體潤滑劑(B)的粒徑,比起最大粒徑值,平均粒徑值較為重要。原因在於,樹脂組成物中佔有比例高的固體潤滑劑之粒徑,對於鑽孔用蓋板特性的孔位置精度、潤滑性會有影響。因此,為了提升鑽孔用蓋板之性能,管理固體潤滑劑(B)的平均粒徑變得重要。所以,在固體潤滑劑(B)的粒度分佈中所佔之最大粒徑的比例太高,使得平均粒徑值大幅提高,有時會降低原本期望的固體潤滑性,故比較不理想。固體潤滑劑(B)的粒度測定法係為,將樣品分散於由0.2%的六偏磷酸溶液與數滴10%的環丙嘧啶醇(Thritone)所組成的溶液中,使用雷射繞射式粒度分布測量裝置(型號:SALD-2100,島津製作所(股)公司製),測定各自投影出來的固體潤滑劑(B)粒子之最大長度。接著算出粒度分布曲線。將該曲線的範圍作為固體潤滑劑(B)的粒徑,並將曲線之含有量尖峰最大時之粒徑當作平均粒徑。Regarding the particle diameter of the solid lubricant (B), the average particle diameter value is more important than the maximum particle diameter value. The reason is that the particle diameter of the solid lubricant which accounts for a high proportion in the resin composition has an influence on the hole position accuracy and lubricity of the characteristics of the cover plate for drilling. Therefore, in order to improve the performance of the cover plate for drilling, it is important to manage the average particle diameter of the solid lubricant (B). Therefore, the ratio of the largest particle diameter in the particle size distribution of the solid lubricant (B) is too high, so that the average particle diameter value is greatly increased, and the originally desired solid lubricity is sometimes lowered, which is not preferable. The particle size determination method of the solid lubricant (B) is to disperse the sample in a solution consisting of a 0.2% solution of hexametaphosphoric acid and a few drops of 10% of a cyclopropylpyritol (Thritone), using a laser diffraction type. A particle size distribution measuring device (model: SALD-2100, manufactured by Shimadzu Corporation) was used to measure the maximum length of the solid lubricant (B) particles projected by each. Next, the particle size distribution curve was calculated. The range of the curve is taken as the particle diameter of the solid lubricant (B), and the particle diameter at which the peak of the curve content is the largest is taken as the average particle diameter.
特別是,固體潤滑劑(B)為鉬酸鋅與三氧化鉬的情況,並不能說完全不溶於水但有非膨潤性。因此,並無如膨潤性的固體潤滑劑必須嚴密管理保濕程度的必要,在工業上是有利的。在這裡,非膨潤性的定義係為,將在90重量份的水中摻合10重量份的固體潤滑劑的水溶液充分混合攪拌,靜置1小時後,測量固體潤滑劑的沉澱高度,沉澱高度比90%以上定義為分散或膨潤,沉澱高度比50%以上未達90%定義為膨潤,沉澱高度比未達50%定義為非膨潤。本發明之鉬酸鋅,至液面的高度為66mm,至鉬酸鋅之沉澱部頂面為21mm,沉澱高度比為32%,是明顯分離成兩層的例子。同樣地,本發明之三氧化鉬,至液面的高度為35mm,至三氧化鉬之沉澱部頂面為5mm,沉澱高度比為14%,係三氧化鉬的沉澱部頂面到液面為止為白濁的例子。In particular, when the solid lubricant (B) is zinc molybdate and molybdenum trioxide, it cannot be said that it is completely insoluble in water but has non-swelling property. Therefore, there is no need for a swellable solid lubricant to strictly manage the degree of hydration, which is industrially advantageous. Here, the definition of non-swelling property is that an aqueous solution in which 10 parts by weight of a solid lubricant is blended in 90 parts by weight of water is thoroughly mixed and stirred, and after standing for 1 hour, the precipitation height of the solid lubricant and the sedimentation height ratio are measured. More than 90% is defined as dispersion or swelling, and the precipitation height is defined as swelling at a ratio of more than 50% to less than 90%, and non-swelling is defined as a precipitation height ratio of less than 50%. The zinc molybdate of the present invention has a height of 66 mm to the liquid surface, a top surface of the precipitate portion of the zinc molybdate of 21 mm, and a sedimentation height ratio of 32%, which is an example in which the separation is apparently two layers. Similarly, the molybdenum trioxide of the present invention has a height of 35 mm to the liquid surface, a top surface of the precipitation portion of the molybdenum trioxide of 5 mm, and a sedimentation height ratio of 14%, which is the top surface of the precipitation portion of the molybdenum trioxide to the liquid surface. It is an example of white turbidity.
如此這樣的特性,在製造水溶性樹脂(A)之溶液時,有下面的優點。容易均勻地分散,不易凝集。在鑽孔加工後,當鉬酸鋅或三氧化鉬殘留在孔內時,比較容易清洗。但是,在製造水溶性樹脂(A)之溶液時,因為固體潤滑劑(B)會產生濃度梯度,故必須攪拌。Such a property has the following advantages in the production of a solution of the water-soluble resin (A). It is easy to disperse evenly and is not easy to aggregate. After the drilling process, when zinc molybdate or molybdenum trioxide remains in the pores, it is easier to clean. However, in the case of producing a solution of the water-soluble resin (A), since the solid lubricant (B) generates a concentration gradient, it is necessary to stir.
固體潤滑劑(B)的硬度,超過例如摩氏硬度5的範圍就會變成研磨劑而比較不適合。固體潤滑劑(B)最佳摻合量,依鑽孔加工的印刷電路板的規格而不同。與不含無機填料的印刷電路板材料相比,含有無機填料的印刷電路板材料,因為相對地鑽頭刃部的摩耗較大,故摻合多一些固體潤滑劑(B)是比較好的。When the hardness of the solid lubricant (B) exceeds, for example, the range of Mohs's hardness of 5, it becomes an abrasive and it is unsuitable. The optimum blending amount of the solid lubricant (B) varies depending on the specifications of the printed circuit board to be drilled. Compared with a printed circuit board material containing no inorganic filler, a printed circuit board material containing an inorganic filler is preferable because a relatively large amount of solid lubricant (B) is blended because the wear of the drill bit is relatively large.
上述水溶性樹脂(A)的種類,作為水溶性樹脂,並沒有特別限定,例如:由聚環氧乙烷、聚環氧丙烷、聚丙烯酸鈉、聚丙烯醯胺、聚乙烯四氫咯酮、羧基甲基纖維素、聚丁二醇及聚烯烴乙二醇之聚酯所組成的群組中選擇1種或是2種以上為佳。聚烯烴乙二醇之聚酯係聚烯烴乙二醇與二元酸反應而得之縮合物。關於聚烯烴乙二醇,例如:聚乙二醇、聚丙二醇、聚丁二醇或這些共聚合物所例示的乙二醇類,又以二元酸來說宜從苯二甲酸、間苯二甲酸、對苯二甲酸、癸二酸及苯均四酸等的多價羧酸之部分酯、酸酐等選擇為佳。就非固體潤滑劑(B)之水溶性潤滑劑來說,例如:聚乙二醇、聚丙二醇;聚氧乙烯油基醚、聚氧乙烯鯨蠟醚、聚氧乙烯硬脂醚、聚氧乙烯月桂醚、聚氧乙烯壬基苯基醚、聚氧乙烯辛基苯基醚等所例示的聚氧乙烯的單醚類;聚氧乙烯單硬脂酸酯、聚氧乙烯去水山梨醇單硬脂酸酯;六聚甘油單硬脂酸酯、十六聚甘油單硬脂酸酯等所例示的聚甘油單硬脂酸酯類;聚氧乙烯丙烯共聚合物等,宜使用1種或2種以上適當地摻合為佳。The type of the water-soluble resin (A) is not particularly limited as the water-soluble resin, and examples thereof include polyethylene oxide, polypropylene oxide, sodium polyacrylate, polypropylene decylamine, and polyethylene tetrahydro ketone. One or two or more types of the group consisting of carboxymethylcellulose, polytetramethylene glycol, and polyolefin of polyolefin glycol are preferred. The polyester of polyolefin ethylene glycol is a condensate obtained by reacting a polyolefin glycol with a dibasic acid. Regarding polyolefin ethylene glycol, for example, polyethylene glycol, polypropylene glycol, polytetramethylene glycol or ethylene glycols exemplified by these copolymers, and in the case of dibasic acids, it is preferable to use phthalic acid and isophthalic acid. A partial ester, an acid anhydride or the like of a polyvalent carboxylic acid such as formic acid, terephthalic acid, azelaic acid or pyromellitic acid is preferably selected. For the water-soluble lubricant of the non-solid lubricant (B), for example: polyethylene glycol, polypropylene glycol; polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene Monoethers of polyoxyethylene exemplified by lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, etc.; polyoxyethylene monostearate, polyoxyethylene sorbitan monohard a polyglycerol monostearate such as hexaglycerol monostearate or hexadecanol monostearate; a polyoxyethylene propylene copolymer, etc., preferably 1 or 2 It is preferred that the above is appropriately blended.
以熱可塑性之非水溶性樹脂而言,並沒有特別限定,廣為周知之物質也能適用。例如:醯胺系的橡膠、丁二烯系的橡膠、酯系的橡膠、烯烴系的橡膠、胺甲酸乙酯系的橡膠、苯乙烯系的橡膠、聚丁烯、低密度聚乙烯、氯化聚乙烯、二茂金屬系的聚烯烴樹脂、乙烯‧丙烯酸酯‧順丁烯二酸酐共聚合物、乙烯‧(甲基)丙烯酸缩水甘油酯共聚合物、乙烯‧乙酸乙烯酯共聚合樹脂、變性乙烯‧乙酸乙烯酯共聚合樹脂、乙烯‧(甲基)丙烯酸共聚合樹脂、多離子聚合物樹脂、乙烯‧(甲基)丙烯酸酯共聚合樹脂等。The water-insoluble resin which is thermoplastic is not particularly limited, and a widely known substance can also be applied. For example, amide-based rubber, butadiene-based rubber, ester-based rubber, olefin-based rubber, urethane-based rubber, styrene-based rubber, polybutene, low-density polyethylene, and chlorinated Polyethylene, metallocene-based polyolefin resin, ethylene ‧ acrylate ‧ maleic anhydride copolymer, ethylene ‧ (meth) acrylate glycidyl ester copolymer, ethylene ‧ vinyl acetate copolymer resin, denaturation Ethylene/vinyl acetate copolymer resin, ethylene ‧ (meth)acrylic copolymer resin, polyionic polymer resin, ethylene ‧ (meth) acrylate copolymer resin, and the like.
以非固體潤滑劑(B)之非水溶性潤滑劑而言,並沒有特別限定,廣為周知之物質也能適用。例如:乙烯雙硬脂醯胺、油酸醯胺、硬脂醯胺、亞甲基雙硬脂醯胺等所例示的醯胺系化合物,月桂酸、硬脂酸、棕櫚酸、油酸等所例示的脂肪酸系化合物,硬脂酸丁酯、油酸丁酯、月桂酸乙二醇酯等所例示的脂肪酸酯系化合物,流動石蠟、聚乙烯蠟等所例示的脂肪族碳化氫系化合物,油酸醇等所例示的高級脂肪族醇。The water-insoluble lubricant of the non-solid lubricant (B) is not particularly limited, and a widely known substance can also be applied. For example, an amide-based compound such as ethylene bis-lipidamine, oleic acid amide, stearylamine or methylenebisstearylamine, lauric acid, stearic acid, palmitic acid, oleic acid, etc. The fatty acid ester compound exemplified by the fatty acid compound, butyl oleate, butyl oleate, and ethylene glycol laurate, and an aliphatic hydrocarbon-based compound exemplified by a liquid paraffin or a polyethylene wax. A higher aliphatic alcohol exemplified by oleic acid alcohol or the like.
關於上述樹脂組成物層之厚度,雖依鑽孔加工時使用之鑽頭刃部直徑、及加工之包銅疊層基板或多層板的構成等而有不同,然而通常係在0.02~0.3mm的範圍內,宜在0.02~0.2mm的範圍內適當選擇為佳。樹脂組成物層之厚度,若未滿0.02mm則得不到充分的潤滑效果,鑽頭刃部的負荷增大導致引起鑽頭刃部的折損。另一方面,樹脂組成物層之厚度超過0.3mm時,會增加發生上述樹脂組成物捲入鑽頭刃部的情況。The thickness of the resin composition layer differs depending on the diameter of the drill blade portion used in the drilling process, the configuration of the copper-clad laminate substrate to be processed, or the multilayer plate, but is usually in the range of 0.02 to 0.3 mm. It is preferred to suitably select within the range of 0.02 to 0.2 mm. When the thickness of the resin composition layer is less than 0.02 mm, a sufficient lubricating effect is not obtained, and the load on the drill blade portion is increased to cause breakage of the drill blade portion. On the other hand, when the thickness of the resin composition layer exceeds 0.3 mm, the occurrence of the above-described resin composition being caught in the drill blade portion increases.
又,就上述樹脂組成物層形成方法而言,例如:在上述金屬支撐箔上,直接將樹脂組成物的熱溶解物或溶液依塗佈法等的塗佈、乾燥方法,或是預先製作樹脂組成物的薄膜,並與上述金屬支撐箔貼合的熱熔法等。此時,由於在金屬支撐箔上預先形成樹脂皮膜(底漆層)可使金屬支撐箔與樹脂組成物之層疊合成一體化,故較為理想。細節於後面敘述。Further, in the method for forming the resin composition layer, for example, a coating or drying method of directly applying a hot solution or solution of the resin composition to the metal supporting foil according to a coating method or a resin is prepared in advance. A film of the composition and a hot-melt method in which the metal supporting foil is bonded to the metal supporting foil. In this case, it is preferable to form a resin film (primer layer) on the metal supporting foil in advance so that the metal supporting foil and the resin composition can be laminated and integrated. Details will be described later.
並且,依塗佈法等,採用將樹脂組成物的溶液直接於金屬支撐箔上塗佈、乾燥方法的情況,所使用的溶液為含有水與沸點低於水的溶劑之溶液較為理想。有關沸點低於水的溶劑,並沒有特別限定,例如:醇類等的乙醇、甲醇或異丙醇,也可以使用甲基乙基酮或丙酮等的低沸點溶劑。就其他的溶劑而言,可以使用將對樹脂組成物互溶性高的四氫呋喃或乙腈部份混合於水或是醇類而成溶劑。水,及沸點低於水的溶劑之摻合比,係必須在90/10~50/50的範圍,在80/20~50/50的範圍為佳,在70/30~50/50的範圍更佳,在60/40~50/50的範圍尤佳。沸點低於水的溶劑之摻合比未滿10的情況,上述水溶性樹脂(A)會不容易生成緻密的球晶。沸點低於水的溶劑之摻合比超過50的情況,會有工業安定生產的障礙之虞。Further, in the case where the solution of the resin composition is directly applied to the metal supporting foil and dried by a coating method or the like, the solution to be used is preferably a solution containing water and a solvent having a boiling point lower than water. The solvent having a boiling point lower than water is not particularly limited. For example, ethanol such as alcohol, methanol or isopropyl alcohol may be used, and a low boiling point solvent such as methyl ethyl ketone or acetone may be used. As the other solvent, a solvent obtained by mixing a portion of tetrahydrofuran or acetonitrile having a high mutual solubility with a resin composition in water or an alcohol can be used. The blending ratio of water and solvent with a boiling point lower than water must be in the range of 90/10~50/50, preferably in the range of 80/20~50/50, in the range of 70/30~50/50. More preferably, it is particularly good in the range of 60/40~50/50. When the blending ratio of the solvent having a boiling point lower than water is less than 10, the water-soluble resin (A) may not easily form dense spherulites. In the case where the blending ratio of the solvent having a boiling point lower than water exceeds 50, there is a hindrance to industrial stability production.
又,對塗佈法或熱熔法等來說,採用將樹脂組成物的溶液直接於金屬支持箔上施予塗佈、加熱乾燥方法的情況,上述鑽孔用蓋板的溫度,必須在5~30秒內從120℃~160℃降到常溫。超過160℃的高乾燥溫度,會有工業安定生產的障礙之虞,並不理想。又,相較於常溫在低冷卻溫度,會在後步驟發生結露的情況,並不理想。Further, in the case of a coating method, a hot-melt method, or the like, a solution in which a solution of a resin composition is applied directly to a metal supporting foil, and a heating and drying method is used, the temperature of the above-mentioned drilling cover plate must be 5 Decrease from 120 ° C to 160 ° C to room temperature in ~30 seconds. A high drying temperature of more than 160 ° C has an obstacle to industrial stability and is not ideal. Further, it is not preferable that condensation occurs in the subsequent step as compared with the normal temperature at a low cooling temperature.
有關使用於本發明之鑽孔用蓋板的金屬支撐箔,只要是與上述樹脂組成物間的密合性高,能承受來自鑽頭刃部衝擊的金屬材料即可,其他並無特別限定。金屬支撐箔的厚度通常為0.05~0.5mm,較佳為0.05~0.3 mm。該金屬支撐箔的厚度未滿0.05mm時鑽孔加工時疊層基板容易發生垂陷毛邊,超過0.5mm時,鑽孔加工時有發生切割屑的排出變得困難之虞。就金屬支撐箔的金屬種來說,例如可以使用鋁。就鋁箔的材質來說,純度95%以上的鋁為佳,例如:JIS(日本工業規格)-H4160中規定的5052、3004、3003、1N30、1N99、1050、1070、1085、8021等。金屬支撐箔中由於使用高純度的鋁,故可緩和來自鑽頭刃部的衝擊,並提高鑽頭刃部前端部的咬合性,因為上述樹脂組成物與鑽頭刃部的潤滑效果之交互作用,可提高加工孔之孔位置精度。又,與樹脂組成物密合性這點上,使用預先於表面形成厚度0.002~0.02mm的樹脂皮膜(底漆層)的金屬支撐箔較為理想。在將固體潤滑劑(B)與該樹脂皮膜摻合的情況下,可對應固體潤滑劑(B)的粒徑適宜地選擇樹脂皮膜的厚度。有關使用於該樹脂皮膜之樹脂,只要是可提升與上述樹脂組成物密合性的物質即可,其他並無特別限定,亦可使用熱可塑性樹脂,熱硬化性樹脂中任一種。熱可塑性樹脂例如:胺甲酸乙酯系聚合體、乙酸乙烯酯系聚合體、氯乙烯系聚合體、聚酯系聚合體、丙烯醯基系聚合體及該等物質的共聚合體。熱硬化性樹脂例如:環氧基系樹脂、氰酸酯系樹脂等的樹脂。The metal supporting foil used in the drilling cover plate of the present invention is not particularly limited as long as it has high adhesion to the resin composition and can withstand the impact from the drill blade. The thickness of the metal supporting foil is usually 0.05 to 0.5 mm, preferably 0.05 to 0.3 mm. When the thickness of the metal supporting foil is less than 0.05 mm, the laminated substrate is likely to be burred at the time of drilling, and when it exceeds 0.5 mm, it is difficult to discharge the cutting chips during the drilling. As the metal species of the metal supporting foil, for example, aluminum can be used. As the material of the aluminum foil, aluminum having a purity of 95% or more is preferable, and for example, 5052, 3004, 3003, 1N30, 1N99, 1050, 1070, 1085, 8021, and the like specified in JIS (Japanese Industrial Standard)-H4160. Since high-purity aluminum is used in the metal supporting foil, the impact from the drill blade portion can be alleviated, and the nip property of the tip end portion of the drill blade portion can be improved, because the interaction between the resin composition and the lubrication effect of the drill blade portion can be improved. The hole position accuracy of the machined hole. Further, it is preferable to use a metal supporting foil having a resin film (primer layer) having a thickness of 0.002 to 0.02 mm formed on the surface in advance in order to adhere to the resin composition. When the solid lubricant (B) is blended with the resin film, the thickness of the resin film can be appropriately selected in accordance with the particle diameter of the solid lubricant (B). The resin to be used for the resin film is not particularly limited as long as it can improve the adhesion to the resin composition, and any of a thermoplastic resin and a thermosetting resin can be used. The thermoplastic resin is, for example, an urethane-based polymer, a vinyl acetate-based polymer, a vinyl chloride-based polymer, a polyester-based polymer, an acryl-based polymer, or a copolymer of these. The thermosetting resin is, for example, a resin such as an epoxy-based resin or a cyanate-based resin.
本發明之鑽孔用蓋板,係對印刷電路板材料,例如包銅疊層基板或多層板進行鑽孔加工時使用。具體而言,可在包銅疊層基板或多層板1片或複數片重疊的最上部,以將上述金屬支撐箔該側與印刷電路板材料接觸的方式配置鑽孔用蓋板,並從樹脂組成物層的那面進行鑽孔加工。The drilling cover plate of the present invention is used for drilling a printed circuit board material such as a copper-clad laminate substrate or a multilayer board. Specifically, the cover plate for drilling may be disposed on the uppermost portion of the copper-clad laminate substrate or the multi-layer board or the uppermost portion of the plurality of sheets, and the side of the metal supporting foil may be in contact with the printed circuit board material, and the resin may be The side of the composition layer is drilled.
上述僅為本案發明之實施型態之一例,可在專利申請範圍所記載的範圍內加上種種的變更。The above is only an example of the embodiment of the present invention, and various modifications can be added within the scope of the patent application.
[實施例][Examples]
以下,將本發明的實施例之效果,與本發明範圍之外的比較例作比較並說明。另外,將「聚乙二醇」略記為「PEG」,「聚環氧乙烷」略記為「PEO」。Hereinafter, the effects of the examples of the present invention will be compared with the comparative examples outside the scope of the present invention. In addition, "polyethylene glycol" is abbreviated as "PEG", and "polyethylene oxide" is abbreviated as "PEO".
<實施例1><Example 1>
將重量平均分子量150,000的聚環氧乙烷(明成化學工業(股)公司製ALTOP MG-150)30重量份,與重量平均分子量20,000的聚乙二醇(三洋化成工業(股)公司製PEG20000)70重量份,以樹脂固形份成為30%的狀態,溶解於水/MeOH(甲醇)混合溶液中。此時水與MeOH的比率為60/40。並且,此水溶性樹脂組成物之溶液中以鉬酸鋅(日本無機化學工業(股)公司製,粒徑0.4μm~13μm,平均粒徑3μm)作為固體潤滑劑(B),相對於水溶性樹脂組成物100重量份,以5重量份摻合並充分地分散。將此水溶性樹脂組成物之溶液,用塗佈棒塗佈於單面已形成厚度0.01mm的環氧基樹脂皮膜之鋁箔(使用鋁箔:1N30,厚度0.1mm,MITSUBISHI ALUMINUM(股)公司製)上,使乾燥後之水溶性樹脂組成物層厚度成為0.05mm,於乾燥機以120℃乾燥5分鐘後,冷卻至常溫,製得鑽孔用蓋板。30 parts by weight of polyethylene oxide (ALTOP MG-150 manufactured by Mingsei Chemical Co., Ltd.) having a weight average molecular weight of 150,000, and polyethylene glycol having a weight average molecular weight of 20,000 (PEG 20000 manufactured by Sanyo Chemical Industries Co., Ltd.) 70 parts by weight was dissolved in a water/MeOH (methanol) mixed solution in a state where the resin solid content became 30%. The ratio of water to MeOH at this time was 60/40. Further, in the solution of the water-soluble resin composition, zinc molybdate (manufactured by Nippon Inorganic Chemicals Co., Ltd., particle size: 0.4 μm to 13 μm, average particle diameter: 3 μm) is used as the solid lubricant (B), relative to water solubility. 100 parts by weight of the resin composition was blended in an amount of 5 parts by weight to be sufficiently dispersed. A solution of the water-soluble resin composition was applied to an aluminum foil having an epoxy resin film having a thickness of 0.01 mm on one side (using aluminum foil: 1N30, thickness 0.1 mm, manufactured by MITSUBISHI ALUMINUM Co., Ltd.). The thickness of the water-soluble resin composition layer after drying was set to 0.05 mm, dried in a dryer at 120 ° C for 5 minutes, and then cooled to room temperature to obtain a cover plate for drilling.
<實施例2~14><Examples 2 to 14>
依照實施例1,調配表1所示水溶性樹脂組成物,製作乾燥後之水溶性樹脂組成物厚度為0.05mm之鑽孔用蓋板。According to Example 1, the water-soluble resin composition shown in Table 1 was prepared, and a water-repellent resin composition having a thickness of 0.05 mm after drying was prepared.
<比較例1~11><Comparative Examples 1 to 11>
依照實施例1,調配表1所示水溶性樹脂組成物,製作乾燥後之水溶性樹脂組成物厚度為0.05mm之鑽孔用蓋板。According to Example 1, the water-soluble resin composition shown in Table 1 was prepared, and a water-repellent resin composition having a thickness of 0.05 mm after drying was prepared.
<評價方法><Evaluation method>
有關依實施例及比較例製作之鑽孔用蓋板的各項樣品,進行以下之評價。The following evaluations were performed on each sample of the drilling cover sheets produced in the examples and the comparative examples.
(1)孔位置精度(1) Hole position accuracy
將鑽孔用蓋板於重疊的包銅疊層基板上方,以樹脂組成物層朝上配置,進行鑽孔加工。每一支鑽頭刃部鑽孔加工6,000hits,使用四支鑽頭刃部重複進行。每1支份鑽頭刃部的每個1~1,500、1~6,000hits之孔,使用穴位置座標測定器(型號:HA-1AM,Hitachi Via Mechanics(股)公司製)測定於重疊的包銅疊層基板之最下板的背面的孔位置與指定座標之偏差,計算平均值及標準偏差(σ),算出「平均值+3σ」。接著算出4支份鑽頭刃部「平均值+3σ」的平均值,結果如表1所示。The hole for drilling is placed over the overlapping copper-clad laminate substrate, and the resin composition layer is placed upward to perform drilling. Each drill bit is drilled with 6,000 hits and repeated using four drill tips. Holes of 1 to 1,500 and 1 to 6,000 hits per 1 part of the drill blade are measured by overlapping hole gauges using a hole position coordinate measuring device (Model: HA-1AM, manufactured by Hitachi Via Mechanics Co., Ltd.) The deviation between the hole position on the back surface of the lowermost plate of the layer substrate and the specified coordinates was calculated, and the average value and the standard deviation (σ) were calculated to calculate "average value + 3σ". Next, the average value of the "average value + 3 σ" of the four-part drill blade portion was calculated, and the results are shown in Table 1.
判定未進行鑽頭刃部磨耗1~1,500 hits之孔位置精度,及進行鑽頭刃部磨耗1~6,000 hits之孔位置精度,作為孔位置精度的判定基準。當1~1,500 hits及1~6,000 hits判定為「○」時,總合評價為「○」。It is determined that the hole position accuracy of 1 to 1,500 hits is not worn by the drill blade portion, and the hole position accuracy of the drill blade portion is 1 to 6,000 hits, which is used as a criterion for determining the hole position accuracy. When 1 to 1,500 hits and 1 to 6,000 hits are judged as "○", the total evaluation is "○".
(2)固體潤滑劑(B)的粒度測定法(2) Particle size determination method of solid lubricant (B)
固體潤滑劑(B)的粒度測定法為,將樣品分散於由0.2%六偏磷酸溶液與數滴10%環丙嘧啶醇(Thritone)所組成的溶液中,使用雷射繞射式粒度分布測量裝置(型號:SALD-2100,島津製作所股份公司製),測定各自投影出來的固體潤滑劑(B)粒子之最大長度。然後算出粒度分布曲線。將該曲線的範圍作為固體潤滑劑(B)的粒徑,並將曲線的含有量尖峰最大時之粒徑作為平均粒徑。The particle size of the solid lubricant (B) is determined by dispersing the sample in a solution consisting of 0.2% hexametaphosphoric acid solution and a few drops of 10% cyclopropylpyr (Thritone), using a laser diffraction particle size distribution measurement. The device (model: SALD-2100, manufactured by Shimadzu Corporation) was used to measure the maximum length of the solid lubricant (B) particles projected by each. The particle size distribution curve is then calculated. The range of the curve is taken as the particle diameter of the solid lubricant (B), and the particle diameter at which the peak of the curve content is the largest is taken as the average particle diameter.
水溶性樹脂(A)之組成:Composition of water-soluble resin (A):
(1)聚環氧乙烷(明成化學工業(股)公司製ALTOP MG-150,Mw=150,000)30重量份、聚乙二醇(三洋化成工業股份公司製PEG20000,Mw=200,000)70重量份,合計100重量份。(1) 30 parts by weight of polyethylene oxide (ALTOP MG-150, Mw = 150,000) manufactured by Mingcheng Chemical Industry Co., Ltd., and polyethylene glycol (PEG 20000, Mw = 200,000 manufactured by Sanyo Chemical Industries Co., Ltd.) 70 parts by weight , a total of 100 parts by weight.
(2)聚醚酯(第一工業製藥(股)公司製PAOGEN PP-15,Mw=100,000)20重量份、聚乙二醇(三洋化成工業(股)公司製PEG4000S,Mw=4,000)80重量份,合計100重量份。(2) Polyether ester (PAOGEN PP-15, manufactured by Daiichi Kogyo Co., Ltd., Mw = 100,000) 20 parts by weight, polyethylene glycol (PEG 4000S manufactured by Sanyo Chemical Industries Co., Ltd., Mw = 4,000) 80 weight Parts, a total of 100 parts by weight.
固體潤滑劑(B)之種類:Type of solid lubricant (B):
(3)鉬酸鋅(日本無機化學工業(股)公司製,粒徑0.4μm~13μm,平均粒徑3μm,層狀構造)(3) Zinc molybdate (manufactured by Nippon Inorganic Chemical Industry Co., Ltd., particle size 0.4μm~13μm, average particle size 3μm, layered structure)
(4)三氧化鉬(日本無機化學工業(股)公司製,粒徑0.7μm~55μm,平均粒徑16μm,柱狀構造)(4) Molybdenum trioxide (manufactured by Nippon Inorganic Chemicals Co., Ltd., particle size 0.7μm to 55μm, average particle size 16μm, columnar structure)
(5)二硫化鉬(DAIZO(股)公司製M-5 Powder,粒徑0.5~29μm,平均粒徑5μm,層狀構造)(5) Molybdenum disulfide (M-5 Powder manufactured by DAIZO Co., Ltd., particle size 0.5 to 29 μm, average particle diameter 5 μm, layered structure)
(6)膨潤性雲母(Co-op Chemical製ME-100,粒徑5~7μm,層狀構造)(6) Swellable mica (ME-100 manufactured by Co-op Chemical, particle size 5 to 7 μm, layered structure)
(7)非膨潤性雲母(Co-op Chemical製MK-200,粒徑5~8μm,層狀構造)(7) Non-swelling mica (MK-200 manufactured by Co-op Chemical, particle size 5 to 8 μm, layered structure)
(8)未摻合固體潤滑劑(B)(8) Unblended solid lubricant (B)
固體潤滑劑(B)之摻合量:The amount of solid lubricant (B) blended:
相對於樹脂組成物的樹脂份為100重量份,固體潤滑劑(B)以0、5、10、20、40、60、80重量份的任何一項摻合。The solid lubricant (B) is blended in any one of 0, 5, 10, 20, 40, 60, and 80 parts by weight with respect to 100 parts by weight of the resin component of the resin composition.
鑽孔加工條件:Drilling processing conditions:
(1)鑽頭刃部直徑:0.2mmΦ(Tungaloy股份公司製C-CFU020S),轉速:200,000rpm,進給速度20μm/rev.,上升速度:25.4m/min,加工基材為不含無機充填材的HL832 0.2mmt,Cu 12μ,重疊5片(1) Drill blade diameter: 0.2 mm Φ (C-CFU020S manufactured by Tungaloy Co., Ltd.), rotation speed: 200,000 rpm, feed rate 20 μm/rev., rising speed: 25.4 m/min, processing substrate is free of inorganic filler HL832 0.2mmt, Cu 12μ, overlap 5
(2)鑽頭刃部直徑:0.2mmΦ(Tungaloy股份公司製C-CFU020S),轉速:200,000rpm,進給速度20μm/rev.,上升速度:25.4m/min,加工基材為加入無機充填材的HL832HS 0.2mmt,Cu 12μ,重疊5片(2) Drill blade diameter: 0.2 mm Φ (C-CFU020S manufactured by Tungaloy Co., Ltd.), rotation speed: 200,000 rpm, feed rate 20 μm/rev., rising speed: 25.4 m/min, and the processing substrate is added with inorganic filler. HL832HS 0.2mmt, Cu 12μ, overlap 5
根據表1之結果,實施例1~14的樣品與比較例1~11的樣品相比,得知未進行鑽頭刃部磨耗階段及進行鑽頭刃部磨耗階段,孔位置精度皆較優異。亦即,本發明之鉬酸鋅及三氧化鉬,與以往技術使用之二硫化鉬、膨潤性雲母、非膨潤性雲母相比,孔位置精度顯著較為優異。According to the results of Table 1, the samples of Examples 1 to 14 were found to be superior to the samples of Comparative Examples 1 to 11 in that the drill blade edge wear stage and the drill blade edge wear stage were not performed, and the hole position accuracy was excellent. That is, the zinc molybdate and the molybdenum trioxide of the present invention are remarkably excellent in hole positional accuracy as compared with the molybdenum disulfide, the swellable mica, and the non-swellable mica used in the prior art.
[產業上利用性][Industrial use]
依據本發明,可提供與以往的鑽孔用蓋板相比,孔位置精度優異,減少鑽頭刃部的折損之鑽孔用蓋板。According to the present invention, it is possible to provide a drilling cover plate which is excellent in hole position accuracy and which reduces breakage of the drill blade portion as compared with the conventional drilling cover plate.
圖1係鉬酸鋅之掃描式電子顯微鏡照片(×10000)(日本無機化學工業(股)公司製,粒徑0.4μm~13μm,平均粒徑3μm,層狀構造)。Fig. 1 is a scanning electron micrograph (x 10000) of zinc molybdate (manufactured by Nippon Inorganic Chemicals Co., Ltd., particle diameter: 0.4 μm to 13 μm, average particle diameter: 3 μm, layered structure).
圖2係三氧化鉬之掃描式電子顯微鏡照片(×10000)(日本無機化學工業(股)公司,粒徑0.7μm~55μm,平均粒徑16μm,柱狀構造)。Fig. 2 is a scanning electron micrograph (×10000) of molybdenum trioxide (Nippon Inorganic Chemical Industry Co., Ltd., particle diameter: 0.7 μm to 55 μm, average particle diameter: 16 μm, columnar structure).
圖3係以鑽孔加工條件1加工後實施例及比較例之孔位置精度比較圖。Fig. 3 is a comparison diagram of the hole positional accuracy of the examples and comparative examples after the drilling processing condition 1.
圖4係以鑽孔加工條件2加工後實施例及比較例之孔位置精度比較圖。Fig. 4 is a graph showing the comparison of the hole positional accuracy of the examples and the comparative examples after the drilling processing condition 2.
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KR102066302B1 (en) * | 2012-03-27 | 2020-01-14 | 미츠비시 가스 가가쿠 가부시키가이샤 | Entry sheet for drilling |
TW201402804A (en) * | 2012-07-12 | 2014-01-16 | Scope Engineering & Trading Co Ltd | Lubricant entry sheet for drilling and method for producing the same |
KR102182769B1 (en) * | 2013-03-27 | 2020-11-25 | 미츠비시 가스 가가쿠 가부시키가이샤 | Entry sheet for cutting fiber reinforced composite material or metal and cutting method |
CN106132646B (en) * | 2014-03-31 | 2019-01-22 | 三菱瓦斯化学株式会社 | Cover plate for drilling hole |
SG11201800878TA (en) | 2015-09-02 | 2018-03-28 | Mitsubishi Gas Chemical Co | Entry sheet for drilling and method for drilling processing using same |
CN105537090A (en) * | 2016-02-01 | 2016-05-04 | 深圳市宏宇辉科技有限公司 | Coating aluminum sheet and technological process for manufacturing same |
KR20180115666A (en) | 2016-02-17 | 2018-10-23 | 미츠비시 가스 가가쿠 가부시키가이샤 | Cutting method and manufacturing method of cutting material |
EP3539697B1 (en) | 2016-11-14 | 2024-12-18 | Mitsubishi Gas Chemical Company, Inc. | Material for built-up edge formation and built-up edge formation method |
WO2018102719A2 (en) * | 2016-12-02 | 2018-06-07 | Saint-Gobain Abrasives, Inc. | Core drill bit assembly |
WO2018216756A1 (en) | 2017-05-25 | 2018-11-29 | 三菱瓦斯化学株式会社 | Cutting work assisting lubricating material, cutting work assisting lubricating sheet, and cutting method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4828729A (en) * | 1988-04-13 | 1989-05-09 | The United States Of America As Represented By The Secretary Of The Air Force | Molybdenum disulfide - molybdenum oxide lubricants |
TW200417303A (en) * | 2003-01-28 | 2004-09-01 | Mitsubishi Gas Chemical Co | Lubricant sheet for drilling and method of drilling |
TW201043362A (en) * | 2009-06-01 | 2010-12-16 | Mitsubishi Gas Chemical Co | Entry sheet for drilling |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04122506A (en) * | 1990-09-10 | 1992-04-23 | Nippon Kemu Tec Kk | Drilling presser plate and drilling method |
JP2005159116A (en) * | 2003-11-27 | 2005-06-16 | Hitachi Chem Co Ltd | Method for manufacturing printed wiring board |
JP2005179136A (en) * | 2003-12-22 | 2005-07-07 | Japan Science & Technology Agency | Super-lubrication system and method of construction thereof, and flake-mediated friction force microscope |
RU2302100C2 (en) * | 2005-07-12 | 2007-07-10 | Государственное научное учреждение Всероссийский научно-исследовательский институт виноградарства и виноделия им. Я.И. Потапенко | Method of perforating of mulching roll polymeric film |
JP4797690B2 (en) * | 2006-01-27 | 2011-10-19 | 三菱瓦斯化学株式会社 | Method of manufacturing entry sheet for drilling |
JP4688161B2 (en) * | 2006-03-30 | 2011-05-25 | 大同メタル工業株式会社 | Sliding member and coating layer forming method thereof |
JP5198809B2 (en) * | 2007-07-12 | 2013-05-15 | 三菱瓦斯化学株式会社 | Entry sheet for drilling |
JP2010540260A (en) * | 2007-09-28 | 2010-12-24 | トライ−スター ラミネーツ、 インク. | Improved system and method for drilling holes in a printed circuit board |
JP5682110B2 (en) * | 2009-12-25 | 2015-03-11 | 日立化成株式会社 | Thermosetting resin composition, prepreg and laminate using the same |
JP5067519B2 (en) * | 2010-06-18 | 2012-11-07 | 三菱瓦斯化学株式会社 | Entry sheet for drilling holes |
KR101098011B1 (en) | 2011-05-03 | 2011-12-23 | (주)상아프론테크 | Entry sheet for perforation of printed circuit board and its manufacturing method |
-
2011
- 2011-12-28 TW TW100149246A patent/TWI547358B/en not_active IP Right Cessation
- 2011-12-28 RU RU2013119473/02A patent/RU2526652C1/en active
- 2011-12-28 MY MYPI2013001469A patent/MY163108A/en unknown
- 2011-12-28 BR BR112013016599A patent/BR112013016599A8/en not_active Application Discontinuation
- 2011-12-28 PH PH1/2013/501076A patent/PH12013501076A1/en unknown
- 2011-12-28 JP JP2012551069A patent/JP5842828B2/en not_active Expired - Fee Related
- 2011-12-28 WO PCT/JP2011/080605 patent/WO2012091179A1/en active Application Filing
- 2011-12-28 KR KR1020137016684A patent/KR101852334B1/en active IP Right Grant
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4828729A (en) * | 1988-04-13 | 1989-05-09 | The United States Of America As Represented By The Secretary Of The Air Force | Molybdenum disulfide - molybdenum oxide lubricants |
TW200417303A (en) * | 2003-01-28 | 2004-09-01 | Mitsubishi Gas Chemical Co | Lubricant sheet for drilling and method of drilling |
TW201043362A (en) * | 2009-06-01 | 2010-12-16 | Mitsubishi Gas Chemical Co | Entry sheet for drilling |
Also Published As
Publication number | Publication date |
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RU2526652C1 (en) | 2014-08-27 |
JP5842828B2 (en) | 2016-01-13 |
PH12013501076A1 (en) | 2024-06-03 |
BR112013016599A2 (en) | 2016-09-27 |
CN103282168B (en) | 2015-09-30 |
CN103282168A (en) | 2013-09-04 |
WO2012091179A1 (en) | 2012-07-05 |
KR101852334B1 (en) | 2018-04-26 |
KR20140022781A (en) | 2014-02-25 |
MY163108A (en) | 2017-08-15 |
BR112013016599A8 (en) | 2018-07-03 |
TW201235169A (en) | 2012-09-01 |
JPWO2012091179A1 (en) | 2014-06-09 |
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