TWI523186B - Module ic package structure with electrical shielding function and method of making the same - Google Patents

Description

Module integrated circuit package structure with electric shielding function and manufacturing method thereof

The invention relates to a module integrated circuit package structure and a manufacturing method thereof, in particular to a module integrated circuit package structure with an electrical shielding function and a manufacturing method thereof.

In recent years, the rapid growth of technology has led to a variety of products that are oriented towards the application of technology, and are constantly evolving. In addition, due to the increasing functionality of the products, most of the current products are modularized to integrate the design. However, the integration of a variety of modules with different functions in the product has greatly increased the functionality of the product. However, under the demand of miniaturization and exquisite appearance of the product, how to design a small and versatile product. Products are the goal that all walks of life are trying to study.

In semiconductor manufacturing, it is constantly evolving process technology to produce smaller wafers or components with higher and higher-order technologies, so that the module manufacturers of the application can relatively design smaller functional modules. In turn, the terminal products can be used more effectively and matched. In view of the current conventional technology, most of the application modules are still the main carrier of the module, such as a printed circuit board, an epoxy substrate or a BT (Bismaleimide Triazine) substrate, and all the chips are used. Parts such as components are then adhered to the surface of the carrier by means of surface mount technology (SMT). Therefore, the carrier board is purely used for forming a circuit connection as a carrier, and the structure therein is only used as a layered structure of the line layout.

Furthermore, with the development of radio frequency communication technology, it means that the wireless communication components must be more rigorous and optimized in circuit design. Most wireless communication products require light weight, small size, high quality, low price, low power consumption and high reliability. These features promote the technical development and market growth of RF/microwave integrated circuits. The electromagnetic shielding function and quality requirements of wireless modules in wireless communication products are relatively important to ensure that signals do not interfere with each other and affect communication quality.

Conventional wireless modules or other circuit modules that require electromagnetic shielding must be provided with an electromagnetic shielding structure according to the required application, such as an electromagnetic shielding metal cover design. The size of the electromagnetic shielding structure must be matched with different modules so that the signal source in the line can be isolated and isolated. However, such a conventional electromagnetic shielding metal cover must be designed and manufactured for different modules or devices, so that the conventional electromagnetic shielding metal cover requires a lot of man-hours, labor and cost.

In addition, another disadvantage of the above-mentioned conventional electromagnetic shielding metal cover is that the size, shape and block of the electronic circuit or device requiring electromagnetic shielding are different, and it is required for each module of different size, shape and block. The production of manual molds, stamping processing and step-by-step component packaging make the production of electromagnetic shielding metal covers difficult and cannot be applied to production lines for rapid production, but the economic benefits and industrial utilization of the conventional electromagnetic shielding metal cover production. reduce.

An embodiment of the present invention provides a module integrated circuit package structure having an electrical shielding function and a manufacturing method thereof, which can effectively solve the "definition of using an electromagnetic shielding metal cover".

One embodiment of the present invention provides a module integrated circuit package structure having an electrical shielding function, comprising: a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having an outer circumference, a ground layer disposed inside the circuit substrate and completely covered by the circuit substrate, and a metal substrate disposed inside the circuit substrate and electrically connected to the substrate An inner conductive structure of the ground layer, wherein the inner conductive structure includes a plurality of inner conductive layers, and each One of the inner conductive layers has a first end directly contacting the ground layer and a second end opposite the first end and exposed from the outer surrounding of the circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the plurality of electronic components are electrically connected to the ground layer through the circuit substrate. The package unit includes an encapsulant disposed on the circuit substrate and covering a plurality of the electronic components. The shielding unit includes a metal shielding layer coated on an outer surface of the encapsulant and on the outer circumference of the circuit substrate, wherein the metal shielding layer directly contacts each of the inner conductive layers The second end, and the ground layer is electrically connected to the metal shielding layer directly through the inner conductive structure.

According to another embodiment of the present invention, a module integrated circuit package structure having an electrical shielding function includes: a substrate unit, an electronic unit, a package unit, and a shielding unit. The substrate unit includes a circuit substrate having an outer circumference and a ground layer disposed inside the circuit substrate, wherein the ground layer is exposed from the outer circumference of the circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the plurality of electronic components are electrically connected to the ground layer through the circuit substrate. The package unit includes an encapsulant disposed on the circuit substrate and covering a plurality of the electronic components. The shielding unit includes a metal shielding layer overlying an outer surface of the encapsulant and surrounding the outer circumference of the circuit substrate, wherein the metal shielding layer directly contacts the substrate from the circuit substrate The ground layer exposed around the periphery is externally surrounded such that a plurality of the electronic components are electrically connected to the metal shield layer directly through the ground layer.

A method for fabricating a module integrated circuit package structure having an electrical shielding function according to another embodiment of the present invention includes the steps of: providing an initial substrate, the initial substrate comprising a plurality of connected to each other and forming a matrix An array of substrate units, wherein each of the substrate units includes a circuit substrate, a ground layer disposed inside the circuit substrate and completely covered by the circuit substrate, and a ground layer disposed thereon An inner conductive structure electrically connected to the ground layer, wherein the inner conductive structure includes a plurality of inner conductive layers, and each of the inner conductive layers has a first end directly contacting the ground layer And a second end opposite to the first end; a plurality of electronic units are respectively disposed on the plurality of the circuit substrates of the plurality of substrate units, wherein each of the electronic units includes a plurality of disposed phases Corresponding on the circuit substrate and electrically connected to the corresponding electronic components of the circuit substrate, and a plurality of the electronic components of each of the electronic units are electrically connected to each other through the corresponding circuit substrate Corresponding to the ground layer; forming an initial package unit on the initial substrate to cover a plurality of the electronic units, wherein the initial package unit comprises a plurality of package colloids connected to each other, and each of the packages a colloid disposed on the corresponding circuit substrate and covering a plurality of corresponding electronic components; forming a plurality of simultaneously through the initial substrate and the initial package unit a through hole for exposing the second end of each of the inner conductive layers; cutting the initial substrate and the initial package unit along the plurality of through holes to separate a plurality of the substrate units and separating a plurality of the encapsulants; and forming a plurality of metal shielding layers, wherein each of the metal shielding layers is coated on an outer surface of the corresponding encapsulant and an outer circumference of the corresponding circuit substrate Surrounding, and each of the metal shielding layers directly contacts the second end of the corresponding inner conductive layer of the substrate unit.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

Z‧‧‧ package structure

1'‧‧‧Shielding unit initial substrate

1‧‧‧Substrate unit

10‧‧‧ circuit board

100‧‧‧outer surround

11‧‧‧ Grounding layer

12’‧‧‧through holes

121‧‧‧First half perforation

122‧‧‧Second half perforation

13‧‧‧Inner conductive structure

130‧‧‧Inner conductive layer

1301‧‧‧ first end

1302‧‧‧second end

2‧‧‧Electronic unit

20‧‧‧Electronic components

3'‧‧‧Initial packaging unit

3‧‧‧Package unit

30‧‧‧Package colloid

300‧‧‧outer surround

4‧‧‧Shielding unit

40‧‧‧Metal shield

A-A‧‧‧ cut line

B-B‧‧‧ cut line

X-X‧‧‧ cutting line

1 is a flow chart of a method for fabricating a module integrated circuit package structure with an electrical shielding function according to a first embodiment of the present invention.

2 is a top plan view showing a step S100 of a method of fabricating a module integrated circuit package structure according to a first embodiment of the present invention.

3 is a schematic cross-sectional view of the A-A cut line of FIG. 2.

4 is a cross-sectional view showing the step S102 of the method for fabricating the module integrated circuit package structure according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing the step S104 of the method for fabricating the module integrated circuit package structure according to the first embodiment of the present invention.

FIG. 6 is a top plan view of step S106 of the method for fabricating the module integrated circuit package structure according to the first embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view showing the line B-B of Fig. 6;

FIG. 8 is a cross-sectional view showing the step S108 of the method of fabricating the module integrated circuit package structure according to the first embodiment of the present invention.

FIG. 9 is a cross-sectional view showing the step S110 of the method for fabricating the module integrated circuit package structure and the module integrated circuit package structure according to the first embodiment of the present invention.

FIG. 10 is a top plan view showing the step S110 of the method for fabricating the module integrated circuit package structure and the module integrated circuit package structure according to the first embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a package integrated circuit package structure according to a second embodiment of the present invention.

[First Embodiment]

Referring to FIG. 1 to FIG. 10, a first embodiment of the present invention provides a method for fabricating a module integrated circuit package structure Z having an electrical shielding function, which includes the following steps: First, step S100 is as follows: FIG. As shown in FIG. 2 and FIG. 3, an initial substrate 1' is provided. The initial substrate 1' includes a plurality of substrate units 1 connected to each other and arranged in a matrix. Each of the substrate units 1 includes a circuit substrate 10 and a circuit. a ground layer 11 (for example, a sheet-like ground layer 11) inside the substrate 10 and completely covered by the circuit substrate 10, and an inner conductive structure 13 disposed inside the circuit substrate 10 and electrically connected to the ground layer 11, wherein the inner conductive layer The structure 13 includes a plurality of inner conductive layers 130 (eg, strip-shaped inner conductive layers 130), and each inner conductive layer 130 has a first end 1301 that directly contacts the ground layer 10 and a second opposite the first end 1301. End 1302. For example, the substrate unit 1 can be a multi-layer circuit board structure, and the ground layer 11 is one of the layers of the multi-layer circuit board structure. Of course, the ground layer 11 can also be the uppermost layer of the multi-layer circuit board structure, and the uppermost layer The ground layer 11 is disposed directly on the top surface of the circuit substrate 10, but the present invention is not limited to this example.

Next, in step S102, as shown in FIG. 1, FIG. 3 and FIG. 4, a plurality of electronic units 2 are respectively disposed on the plurality of circuit substrates 10 of the plurality of substrate units 1, wherein each of the electronic units 2 includes a plurality of settings. On the corresponding circuit substrate 10 and electrically connected to the electronic component 20 of the corresponding circuit substrate 10, and the plurality of electronic components 20 of each electronic unit 2 are electrically connected to the phase through the corresponding circuit substrate 10. Corresponding ground layer 11. For example, the circuit substrate 10 as a multi-layer circuit board structure has at least one conductive structure designed to be electrically connected between the electronic component 20 and the ground layer 11 so that the plurality of electronic components 20 of each electronic unit 2 can pass. The corresponding circuit substrate 10 is electrically connected to the corresponding ground layer 11.

Then, step S104 is to form an initial package unit 3' on the initial substrate 1' to cover the plurality of electronic units 2, wherein the initial package unit 3' includes a plurality of each other, as shown in FIG. 1, FIG. 4 and FIG. The encapsulating colloids 30 are connected, and each encapsulant 30 is disposed on the corresponding circuit substrate 10 and covers a plurality of corresponding electronic components 20. For example, the encapsulant 30 can be a non-transparent gel made of silicone or epoxy.

Next, in step S106, a plurality of through holes 12' are formed through the initial substrate 1' and the initial package unit 3' at the same time as shown in FIG. 1, FIG. 5, FIG. 6, and FIG. 7, to expose each inner conductive layer. The second end 1302 of the 130. For example, the plurality of through holes 12' may be formed via a borehole, such as a laser drilled hole.

Next, step S108 is to cut the initial substrate 1' and the initial package unit 3 along the plurality of through holes 12' (that is, along the XX cutting line of FIG. 7) as shown in FIG. 1, FIG. 7, and FIG. ', to separate the plurality of substrate units 1 and separate the plurality of encapsulants 30. Furthermore, as shown in FIG. 8, the substrate unit 1 includes a plurality of first semi-perforations disposed on an outer circumference 100 of the circuit substrate 10 and extending through the circuit substrate 10. 121. The encapsulant 30 includes a plurality of second semi-perforations 122 extending through the encapsulant 30 and respectively communicating with the plurality of first semi-perforations 121, and the second end 1302 of each of the inner conductive layers 130 is corresponding to the first semi-perforated 121 is bare. In addition, the encapsulant 30 has an outer surrounding circumference 300. The outer surrounding circumference 300 of the encapsulant 30 and the outer surrounding circumference 100 of the circuit substrate 10 are both cutting surfaces, and the outer surrounding circumference 300 of the encapsulant 30 and the outer circumference of the circuit substrate 10 The surrounding 100 can be flush with each other.

Finally, in step S110, a plurality of metal shielding layers 40 are formed, as shown in FIG. 1, FIG. 8, FIG. 9 and FIG. 10, wherein each metal shielding layer 40 is coated on the outer surface of the corresponding encapsulant 30 and The corresponding circuit substrate 10 is surrounded by the surrounding 100, and each of the metal shield layers 40 directly contacts the second end 1302 of the inner conductive layer 130 of the corresponding substrate unit 1 such that the ground layer 11 of each of the substrate units 1 The plurality of corresponding inner conductive layers 130 may be directly connected to the corresponding metal shield layer 40. Furthermore, the inner surfaces of the plurality of first semi-perforations 121 and the inner surfaces of the plurality of second semi-perforations 122 are covered by the metal shielding layer 40.

As shown in FIG. 9 and FIG. 10, according to the manufacturing method provided above, the first embodiment of the present invention can provide a module integrated circuit package structure Z having an electrical shielding function, which includes: The substrate unit 1, an electronic unit 2, a package unit 3 and a shielding unit 4.

First, the substrate unit 1 includes a circuit substrate 10 having an outer circumference 100, a ground layer 11 disposed inside the circuit substrate 10 and completely covered by the circuit substrate 10, and an electrical connection disposed inside the circuit substrate 10. The inner conductive structure 13 of the ground layer 11, wherein the inner conductive structure 13 includes a plurality of inner conductive layers 130, and each inner conductive layer 130 has a first end 1301 directly contacting the ground layer 11 and a first end 1301 opposite to the first end 1301 And the second end 1302 exposed from the periphery of the circuit substrate 10 is surrounded by the second end 1302.

Furthermore, the electronic unit 2 includes a plurality of electronic components 20 disposed on the circuit substrate 10 and electrically connected to the circuit substrate 10 , wherein the plurality of electronic components 20 are electrically connected to the ground layer 11 through the circuit substrate 10 . For example, a plurality of electronic components 20 can It is a resistor, a capacitor, an inductor, or a semiconductor wafer having a predetermined function, etc., but the invention is not limited thereto.

In addition, the package unit 3 includes an encapsulant 30 disposed on the circuit substrate 10 and covering the plurality of electronic components 20, and the shielding unit 4 includes an outer surface surrounding the encapsulant 30 and an outer circumference of the circuit substrate 100. Metal shield 40 on top. Thereby, the metal shielding layer 40 can directly contact the second end 1302 of each inner conductive layer 130 such that the ground layer 11 can be electrically connected to the metal shielding layer 40 directly through the plurality of inner conductive layers 130 of the inner conductive structure 13 . . For example, according to different design requirements, the metal shielding layer 40 can be a conductive spraying layer formed by spray coating, a conductive sputtering layer formed by sputtering, and a through-printing method ( Printing) a conductive printed layer formed, or a conductive plating layer formed by electroplating, etc., but the invention is not limited thereto.

Further, the substrate unit 1 includes a plurality of first semi-perforations 121 disposed on the outer surrounding circumference 100 of the circuit substrate 10 and penetrating the circuit substrate 10, and the package unit 3 includes a plurality of penetrating encapsulants 30 and is respectively connected to each other. The second semi-perforation 122 of the first semi-perforation 121. The second end 1302 of each inner conductive layer 130 is exposed by the corresponding first semi-perforation 121, and the inner surfaces of the plurality of first semi-perforations 121 and the inner surfaces of the plurality of second semi-perforations 122 are all shielded by metal. 40 covered. In addition, the encapsulant 30 has an outer surrounding circumference 300, and the outer surrounding circumference 300 of the encapsulant 30 and the outer surrounding circumference 100 of the circuit substrate 10 are both cutting surfaces, and the outer surrounding circumference 300 of the encapsulant 30 and the outer circumference of the circuit substrate 10 The surrounding 100 can be flush with each other.

[Second embodiment]

Referring to FIG. 11 , a second embodiment of the present invention can provide a module integrated circuit package structure Z having an electrical shielding function, including: a substrate unit 1 , an electronic unit 2 , a package unit 3 , and a Shield unit 4. It can be seen from the comparison between FIG. 11 and FIG. 9 that the biggest difference between the second embodiment of the present invention and the first embodiment is that: In the second embodiment, the substrate unit 1 includes a circuit substrate 10 having an outer circumference 100 and a ground layer 11 disposed inside the circuit substrate 10. The end of the ground layer 11 is directly exposed from the outer circumference 100 of the circuit substrate 10. (further, the end of the ground layer 11 is directly exposed by the plurality of first semi-perforations 121), so the metal shield layer 40 can directly contact the ground layer 11 exposed from the outer circumference 100 of the circuit substrate 10, so that The plurality of electronic components 20 can be electrically connected to the metal shield layer 40 directly through the ground layer 11.

Therefore, in the first embodiment, as shown in FIG. 9, the ground layer 11 needs to pass through the plurality of inner conductive layers 130 of the inner conductive structure 13, so that it can be electrically connected to the metal shield layer 40; however, in the second embodiment As shown in FIG. 11, the ground layer 11 may directly contact the metal shield layer 40 to be directly electrically connected to the metal shield layer 40 without passing through other conductive media.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by the present invention and the contents of the drawings are included in the scope of the present invention.

Z‧‧‧ package structure

1‧‧‧Substrate unit

10‧‧‧ circuit board

100‧‧‧outer surround

11‧‧‧ Grounding layer

121‧‧‧First half perforation

122‧‧‧Second half perforation

2‧‧‧Electronic unit

20‧‧‧Electronic components

3‧‧‧Package unit

30‧‧‧Package colloid

300‧‧‧outer surround

4‧‧‧Shielding unit

40‧‧‧Metal shield

Claims (8)

A modular integrated circuit package structure having an electrical shielding function, comprising: a substrate unit, the substrate unit comprising a circuit substrate having an outer surrounding circumference, a circuit disposed inside the circuit substrate, and the circuit a ground layer substantially covered by the substrate, and an inner conductive structure disposed inside the circuit substrate and electrically connected to the ground layer, wherein the inner conductive structure includes a plurality of inner conductive layers, and each of the inner conductive layers The conductive layer has a first end directly contacting the ground layer and a second end opposite to the first end and exposed from the outer surrounding of the circuit substrate; an electronic unit, the electronic unit including a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the plurality of electronic components are electrically connected to the ground layer through the circuit substrate; The package unit includes an encapsulant disposed on the circuit substrate and covering the plurality of the electronic components; and a shielding unit including a covering layer a metal shielding layer on the outer surface of the colloid and on the outer circumference of the circuit substrate, wherein the metal shielding layer directly contacts the second end of each of the inner conductive layers, and the ground layer Directly passing through the inner conductive structure to be electrically connected to the metal shield layer; wherein the substrate unit includes a plurality of first half disposed on the outer circumference of the circuit substrate and penetrating through the circuit board Perforating, the package unit includes a plurality of second semi-perforations penetrating the encapsulant and respectively communicating with the plurality of first semi-perforations, and the second end of each of the inner conductive layers is correspondingly The first semi-perforation is exposed, and the inner surfaces of the plurality of first semi-perforations and the inner surfaces of the plurality of second semi-perforations are covered by the metal shielding layer. A module integrated circuit package structure having the electrical shielding function of claim 1 The encapsulant has an outer circumference, the outer circumference of the encapsulant and the outer circumference of the circuit substrate are both cut surfaces, and the outer circumference of the encapsulant is The outer circumferences of the circuit substrate are flush with each other. A modular integrated circuit package structure having an electrical shielding function, comprising: a substrate unit, the substrate unit comprising a circuit substrate having an outer circumference surrounding and a ground layer disposed inside the circuit substrate, wherein The grounding layer is exposed from the outer circumference of the circuit substrate; an electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate, wherein The electronic component is electrically connected to the ground layer through the circuit substrate; a package unit, the package unit includes an encapsulant disposed on the circuit substrate and covering a plurality of the electronic components; a shielding unit comprising a metal shielding layer overlying an outer surface of the encapsulant and surrounding the outer circumference of the circuit substrate, wherein the metal shielding layer directly contacts the circuit The outer layer of the substrate is surrounded by the exposed ground layer such that a plurality of the electronic components are electrically connected to the ground through the ground layer a shielding layer; wherein the substrate unit includes a plurality of first semi-perforations disposed on the outer circumference of the circuit substrate and penetrating the circuit substrate, the package unit including a plurality of through the encapsulant And respectively connected to the plurality of first semi-perforated second semi-perforations, the ground layer is exposed by the plurality of first semi-perforations, and the inner surfaces of the plurality of first semi-perforations and the plurality of The inner surface of the second semi-perforated is covered by the metal shielding layer. The module integrated circuit package structure of claim 3, wherein the encapsulant has an outer circumference, and the outer circumference of the encapsulant and the outer circumference of the circuit substrate All around are cutting faces, and the outer surrounding circumference of the encapsulant and the outer circumference of the circuit substrate They are flush with each other. A method for fabricating a module integrated circuit package structure having an electrical shielding function, comprising the steps of: providing an initial substrate, wherein the initial substrate comprises a plurality of substrate units connected to each other and arranged in a matrix, wherein each of the The substrate unit includes a circuit substrate, a ground layer disposed inside the circuit substrate and completely covered by the circuit substrate, and an inner conductive structure disposed inside the circuit substrate and electrically connected to the ground layer. Wherein the inner conductive structure comprises a plurality of inner conductive layers, and each of the inner conductive layers has a first end directly contacting the ground layer and a second end opposite to the first end; The electronic units are respectively disposed on the plurality of the circuit substrates of the plurality of the substrate units, wherein each of the electronic units includes a plurality of the circuit boards disposed on the corresponding ones and electrically connected to the corresponding ones An electronic component of the circuit substrate, and a plurality of the electronic components of each of the electronic components are electrically connected to the corresponding ones through the corresponding circuit substrates a grounding layer; forming an initial packaging unit on the initial substrate to cover a plurality of the electronic units, wherein the initial packaging unit comprises a plurality of encapsulants connected to each other, and each of the encapsulants is disposed in a phase Corresponding on the circuit substrate and covering a plurality of corresponding electronic components; forming a plurality of through holes penetrating through the initial substrate and the initial package unit to expose each of the inner conductive layers a second end; cutting the initial substrate and the initial package unit along the plurality of through holes to separate a plurality of the substrate units and separating a plurality of the encapsulants; and forming a plurality of metal shield layers, Each of the metal shielding layers is coated on an outer surface of the corresponding encapsulant and on an outer circumference of the corresponding circuit substrate, and each of the metal shielding layers is in direct contact with each other. The second end of the inner conductive layer of the substrate unit. A method of fabricating a module integrated circuit package structure having an electrical shielding function according to claim 5, wherein the plurality of through holes are formed by drilling. The method of fabricating a module integrated circuit package structure having an electrical shielding function according to claim 5, wherein the substrate unit comprises a plurality of disposed on the outer circumference of the circuit substrate and penetrating the circuit substrate a first half of the through hole, the encapsulant comprises a plurality of second semi-perforations penetrating the encapsulant and respectively communicating with the plurality of first semi-perforations, and the second end of each of the inner conductive layers is phased The corresponding first semi-perforation is exposed, and the inner surfaces of the plurality of first semi-perforations and the inner surfaces of the plurality of second semi-perforations are covered by the metal shielding layer. The method of fabricating a module integrated circuit package structure having an electrical shielding function according to claim 7, wherein the encapsulant has an outer circumference, and the outer circumference of the encapsulant and the circuit substrate are The outer circumference is a cutting surface, and the outer circumference of the encapsulant and the outer circumference of the circuit substrate are flush with each other.