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TWI485820B - Resin sealing forming device - Google Patents

Resin sealing forming device Download PDF

Info

Publication number
TWI485820B
TWI485820B TW101148612A TW101148612A TWI485820B TW I485820 B TWI485820 B TW I485820B TW 101148612 A TW101148612 A TW 101148612A TW 101148612 A TW101148612 A TW 101148612A TW I485820 B TWI485820 B TW I485820B
Authority
TW
Taiwan
Prior art keywords
resin sealing
resin
molding apparatus
frame member
mold
Prior art date
Application number
TW101148612A
Other languages
English (en)
Chinese (zh)
Other versions
TW201349401A (zh
Inventor
Shinji Takase
Takeaki Taka
Takashi Tamura
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW201349401A publication Critical patent/TW201349401A/zh
Application granted granted Critical
Publication of TWI485820B publication Critical patent/TWI485820B/zh

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW101148612A 2012-05-29 2012-12-20 Resin sealing forming device TWI485820B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012121587A JP5774545B2 (ja) 2012-05-29 2012-05-29 樹脂封止成形装置

Publications (2)

Publication Number Publication Date
TW201349401A TW201349401A (zh) 2013-12-01
TWI485820B true TWI485820B (zh) 2015-05-21

Family

ID=49731219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101148612A TWI485820B (zh) 2012-05-29 2012-12-20 Resin sealing forming device

Country Status (4)

Country Link
JP (1) JP5774545B2 (ja)
KR (1) KR101440218B1 (ja)
CN (1) CN103448187B (ja)
TW (1) TWI485820B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI711520B (zh) * 2019-09-11 2020-12-01 日商朝日科技股份有限公司 樹脂密封成形裝置及樹脂密封成形方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
JP6143711B2 (ja) * 2014-06-02 2017-06-07 Ｔｏｗａ株式会社 半導体圧縮樹脂封止方法及び半導体圧縮樹脂封止装置
JP6349181B2 (ja) * 2014-07-18 2018-06-27 Ｔｏｗａ株式会社 クリーニング方法及びクリーニング機構
JP6491464B2 (ja) 2014-11-28 2019-03-27 Ｔｏｗａ株式会社 成形品製造装置及び成形品製造方法
JP6491508B2 (ja) * 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂成形品の製造方法
JP2016213240A (ja) * 2015-04-30 2016-12-15 Ｔｏｗａ株式会社 製造装置及び製造方法
JP2017051972A (ja) * 2015-09-09 2017-03-16 Ｔｏｗａ株式会社 プレス機構、プレス方法、圧縮成形装置および圧縮成形方法
JP6649752B2 (ja) * 2015-11-19 2020-02-19 アピックヤマダ株式会社 圧縮成形方法及び圧縮成形装置
JP6580519B2 (ja) * 2016-05-24 2019-09-25 Ｔｏｗａ株式会社 圧縮成形装置、樹脂封止品製造装置、圧縮成形方法、及び樹脂封止品の製造方法
JP6710107B2 (ja) * 2016-06-10 2020-06-17 アサヒ・エンジニアリング株式会社 樹脂封止装置
JP6886341B2 (ja) * 2017-05-10 2021-06-16 Ｔｏｗａ株式会社 樹脂成形用成形型、樹脂成形装置、樹脂成形用成形型調整方法、及び樹脂成形品製造方法
JP6886416B2 (ja) * 2018-03-09 2021-06-16 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
CN112171990A (zh) * 2020-09-03 2021-01-05 孙喜杰 一种防翘曲变形的塑料压制成型工艺
CN119489544B (zh) * 2025-01-17 2025-04-04 成都正西智能装备集团股份有限公司 一种复合材料制品热成型伺服液压机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235366A (ja) * 2007-03-16 2008-10-02 Fujitsu Ltd 電子部品の樹脂封止方法及び樹脂封止装置
JP2008283111A (ja) * 2007-05-14 2008-11-20 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
TW201219182A (en) * 2010-09-16 2012-05-16 Towa Corp capable of performing compression forming without using a mold release film and having a simple structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4373059B2 (ja) * 2002-08-08 2009-11-25 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法
JP2008001045A (ja) 2006-06-26 2008-01-10 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5143617B2 (ja) 2008-04-08 2013-02-13 住友重機械工業株式会社 圧縮成形方法
JP5153536B2 (ja) 2008-09-17 2013-02-27 Ｔｏｗａ株式会社 半導体チップの圧縮成形用金型

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235366A (ja) * 2007-03-16 2008-10-02 Fujitsu Ltd 電子部品の樹脂封止方法及び樹脂封止装置
JP2008283111A (ja) * 2007-05-14 2008-11-20 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
TW201219182A (en) * 2010-09-16 2012-05-16 Towa Corp capable of performing compression forming without using a mold release film and having a simple structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI711520B (zh) * 2019-09-11 2020-12-01 日商朝日科技股份有限公司 樹脂密封成形裝置及樹脂密封成形方法

Also Published As

Publication number Publication date
TW201349401A (zh) 2013-12-01
CN103448187A (zh) 2013-12-18
JP5774545B2 (ja) 2015-09-09
JP2013247315A (ja) 2013-12-09
KR20130133658A (ko) 2013-12-09
CN103448187B (zh) 2016-05-18
KR101440218B1 (ko) 2014-09-12

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