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TWI484510B - Inductance element - Google Patents

Inductance element Download PDF

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Publication number
TWI484510B
TWI484510B TW103101035A TW103101035A TWI484510B TW I484510 B TWI484510 B TW I484510B TW 103101035 A TW103101035 A TW 103101035A TW 103101035 A TW103101035 A TW 103101035A TW I484510 B TWI484510 B TW I484510B
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Taiwan
Prior art keywords
magnetic core
terminal
insulating layer
gap
resin layer
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TW103101035A
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Chinese (zh)
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TW201440089A (en
Inventor
Kazuhiko Matsui
Kyoichi Kawase
Akinori Kojima
Keiichi Araki
Eiichiro Matsuyama
Seisaku Imai
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Alps Green Devices Co Ltd
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Publication of TW201440089A publication Critical patent/TW201440089A/en
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Publication of TWI484510B publication Critical patent/TWI484510B/en

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  • Microelectronics & Electronic Packaging (AREA)

Description

電感元件Inductive component

本發明係關於一種於磁芯埋入有線圈之電感元件,尤其是關於端子部與磁芯間之絕緣耐壓。The present invention relates to an inductive component in which a coil is embedded in a magnetic core, and more particularly to an insulation withstand voltage between a terminal portion and a magnetic core.

於專利文獻1中揭示有關於下述電感器之發明,該電感器係在外部電極與線圈用導體之間配置低介電常數樹脂膜,從而抑制在外部電極與線圈用導體之間產生之雜散電容。Patent Document 1 discloses an invention in which a low dielectric constant resin film is disposed between an external electrode and a coil conductor to suppress generation of impurities between the external electrode and the coil conductor. Bulk capacitor.

於專利文獻2中,將由強磁性金屬粉末與樹脂構成之複合構件形成為長方體,使樹脂含浸於複合構件之表面,在複合構件之內部形成貫通孔,且於該貫通孔內形成有信號線用導體。而且,自含浸有樹脂之複合構件之表面至露出之信號用導體之表面形成有端子導體。In Patent Document 2, a composite member made of a ferromagnetic metal powder and a resin is formed into a rectangular parallelepiped, a resin is impregnated on the surface of the composite member, a through hole is formed in the composite member, and a signal line is formed in the through hole. conductor. Further, a terminal conductor is formed from the surface of the composite member impregnated with the resin to the surface of the exposed signal conductor.

又,於專利文獻3中揭示有關於下述線圈零件之發明,該線圈零件係將來自線圈之端子引出至芯體之背面,且使絕緣片材介於芯體與端子之間。Further, Patent Document 3 discloses an invention of a coil component that leads a terminal from a coil to a back surface of a core and places an insulating sheet between a core and a terminal.

又,於專利文獻4中揭示有關於下述電感器之發明,該電感器係將來自線圈之端子引出至芯體之背面,且將端子之絕緣層去除。Further, Patent Document 4 discloses an invention of an inductor which leads a terminal from a coil to a back surface of a core and removes an insulating layer of the terminal.

[先前技術文獻][Previous Technical Literature] [專利文獻][Patent Literature]

[專利文獻1]日本專利特開平9-246046號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 9-246046

[專利文獻2]日本專利特開平9-82528號公報[Patent Document 2] Japanese Patent Laid-Open No. Hei 9-82528

[專利文獻3]日本專利特開平10-223450號公報[Patent Document 3] Japanese Patent Laid-Open No. Hei 10-223450

[專利文獻4]日本專利特開2006-13066號公報[Patent Document 4] Japanese Patent Laid-Open Publication No. 2006-13066

然而,自線圈延伸至磁芯之背面之端子部之前端為切斷面,未設置絕緣被膜,從而導體成為露出之狀態。因此,存在端子部之前端與和前端對向之磁芯之間之絕緣耐壓下降之問題。However, the front end of the terminal portion extending from the coil to the back surface of the magnetic core is a cut surface, and an insulating film is not provided, so that the conductor is exposed. Therefore, there is a problem that the insulation withstand voltage between the front end of the terminal portion and the magnetic core opposed to the front end is lowered.

於上述各專利文獻中未對端子部之前端與磁芯之間之絕緣耐壓進行任何記載。In each of the above patent documents, the insulation withstand voltage between the front end of the terminal portion and the magnetic core is not described.

因此,本發明係解決上述先前之問題者,其目的在於提供一種尤其與先前相比能夠提高端子部之前端與磁芯間之絕緣耐壓的電感元件。Accordingly, the present invention has been made in view of the above problems, and an object thereof is to provide an inductance element capable of improving the insulation withstand voltage between the front end of the terminal portion and the magnetic core, in particular, compared with the prior art.

本發明提供一種電感元件,其係於磁芯之內部埋入有線圈者,其特徵在於:將自上述線圈延伸之一對導電性帶體之端部彎折,而於上述磁芯之外表面形成一對端子部;上述導電性帶體之表面除上述端子部之前端以外由第1絕緣層覆蓋;在上述端子部之前端與和上述前端對向之上述磁芯之間設置間隙,且於上述間隙填充有第2絕緣層。藉此,與先前相比可有效地提高端子部之前端與磁芯之間之絕緣耐壓。於本發明中,較佳為,上述第2絕緣層與上述間隙一併形成於上述磁芯之表面、及上述第1絕緣層之表面,貫通上述第1絕緣層及上述第2絕緣層之一部分之積層部分而形成有使上述端子部之上述導電性帶體之表面露出之貫通孔,自上述第2絕緣層之表面至上述貫通孔形成有一對端子導通部, 上述端子部與上述端子導通部之間經由上述貫通孔而導通。藉此,可提高端子導通部與磁芯間之絕緣耐壓,並且能夠使端子部與端子導通部之間適當地導通。The invention provides an inductive component which is embedded in a coil inside a magnetic core, and is characterized in that one end extending from the coil is bent on an end portion of the conductive strip body, and the outer surface of the magnetic core is bent Forming a pair of terminal portions; the surface of the conductive tape body is covered by the first insulating layer except for the front end of the terminal portion; and a gap is provided between the front end of the terminal portion and the magnetic core facing the front end, and The gap is filled with a second insulating layer. Thereby, the insulation withstand voltage between the front end of the terminal portion and the magnetic core can be effectively improved as compared with the prior art. In the present invention, it is preferable that the second insulating layer is formed on the surface of the magnetic core and the surface of the first insulating layer together with the gap, and penetrates one of the first insulating layer and the second insulating layer. a through hole for exposing a surface of the conductive strip body of the terminal portion is formed in the laminated portion, and a pair of terminal conducting portions are formed from a surface of the second insulating layer to the through hole. The terminal portion and the terminal conduction portion are electrically connected to each other through the through hole. Thereby, the insulation withstand voltage between the terminal conducting portion and the magnetic core can be improved, and the terminal portion and the terminal conducting portion can be appropriately electrically connected.

於本發明中,較佳為,上述第1絕緣層係被覆上述導電性帶體之表面之電絕緣性之被覆樹脂層,上述第2絕緣層係作為對於上述磁芯之外表面之絕緣塗佈材料的電絕緣性之保護樹脂層。藉此,能夠不使製造繁雜化而以低成本穩定地獲得高絕緣耐壓。In the above aspect of the invention, preferably, the first insulating layer covers an electrically insulating coating resin layer on a surface of the conductive tape, and the second insulating layer serves as an insulating coating on a surface of the magnetic core. A protective resin layer of electrical insulation of the material. Thereby, it is possible to stably obtain high insulation withstand voltage at low cost without making the manufacturing complicated.

又,於本發明中,較佳為,至少於上述端子部之前端面未設置上述第1絕緣層,且至少在上述前端面與和上述前端面對向之上述磁芯之側壁之間形成有上述間隙。由於端子部之前端面為被覆導線之切斷面,故而成為於前端面露出導電性帶體之狀態。因此,藉由在端子部之前端面與磁芯之側壁之間設置間隙,且於上述間隙埋設第2絕緣層,而能夠適當地提高絕緣耐壓。Further, in the invention, it is preferable that at least the first insulating layer is not provided on the front end surface of the terminal portion, and at least the front end surface and the side wall of the magnetic core facing the front end are formed. gap. Since the front end surface of the terminal portion is the cut surface of the covered wire, the conductive tape body is exposed on the front end surface. Therefore, by providing a gap between the front end surface of the terminal portion and the side wall of the magnetic core, and embedding the second insulating layer in the gap, the insulation withstand voltage can be appropriately increased.

根據本發明之電感元件,與先前相比可有效地提高端子部之前端與磁芯之間之絕緣耐壓。According to the inductance element of the present invention, the insulation withstand voltage between the front end of the terminal portion and the magnetic core can be effectively improved as compared with the prior art.

1‧‧‧電感元件1‧‧‧Inductive components

10‧‧‧線圈10‧‧‧ coil

11‧‧‧導電性帶體11‧‧‧Electrical belt

11a‧‧‧板面11a‧‧‧ board

11b‧‧‧側端面11b‧‧‧ side end face

12‧‧‧被覆樹脂層(第1絕緣層)12‧‧‧coated resin layer (first insulating layer)

13‧‧‧第1端部13‧‧‧1st end

14a、17a‧‧‧第1摺線14a, 17a‧‧‧1st line

14b、17b‧‧‧第2摺線14b, 17b‧‧‧ 2nd fold line

14c、17c‧‧‧第3摺線14c, 17c‧‧‧3rd line

14d、17d‧‧‧第4摺線14d, 17d‧‧‧ 4th line

15‧‧‧第1端子部15‧‧‧1st terminal part

16‧‧‧第2端部16‧‧‧2nd end

18‧‧‧第2端子部18‧‧‧2nd terminal section

20‧‧‧磁芯20‧‧‧ magnetic core

20a‧‧‧凹部20a‧‧‧ recess

20b、20c‧‧‧磁芯20之側壁20b, 20c‧‧‧ sidewall of magnetic core 20

21‧‧‧上表面21‧‧‧ upper surface

22‧‧‧下表面(背面)22‧‧‧Lower surface (back)

23‧‧‧側面23‧‧‧ side

24‧‧‧前端面24‧‧‧ front end

25、45、δ‧‧‧間隙25, 45, δ‧‧‧ gap

26‧‧‧前端26‧‧‧ front end

30‧‧‧加壓機30‧‧‧ Pressing machine

31‧‧‧模具本體31‧‧‧Mold body

32‧‧‧下模32‧‧‧Down

33‧‧‧上模33‧‧‧上模

34‧‧‧空腔34‧‧‧ cavity

40‧‧‧突起部40‧‧‧Protruding

41‧‧‧保護樹脂層(第2絕緣層)41‧‧‧Protective resin layer (2nd insulating layer)

42‧‧‧端子導通部42‧‧‧Terminal Conduction

43‧‧‧貫通孔43‧‧‧through holes

A‧‧‧寬度方向之尺寸A‧‧‧Size in the width direction

B‧‧‧厚度方向之尺寸B‧‧‧Dimensions in the thickness direction

C‧‧‧箭頭C‧‧‧ arrow

D‧‧‧面對面區域D‧‧‧ face to face area

E‧‧‧前端26與凹部20a之高度方向(厚度方向)之對向面間E‧‧‧ between the front end 26 and the opposite direction of the height direction (thickness direction) of the recess 20a

F‧‧‧加壓力F‧‧‧Adding pressure

O‧‧‧捲繞中心線O‧‧‧ winding centerline

圖1係表示剛將本發明之實施形態之電感元件所使用之線圈捲繞成形後之狀態之立體圖。Fig. 1 is a perspective view showing a state in which a coil used in an inductance element according to an embodiment of the present invention is wound and formed.

圖2係表示於線圈彎折成形有端子部之狀態之立體圖。Fig. 2 is a perspective view showing a state in which a terminal portion is bent and formed in a coil.

圖3係電感元件之後視圖。Figure 3 is a rear view of the inductive component.

圖4係電感元件之剖面圖,且係圖2之IV-IV線剖面圖。4 is a cross-sectional view of the inductor element, and is a cross-sectional view taken along line IV-IV of FIG. 2.

圖5係將圖4之一部分放大後之局部放大剖面圖。Fig. 5 is a partially enlarged cross-sectional view showing a portion of Fig. 4 in an enlarged manner.

圖6係一部分與圖5不同之局部放大縱剖面圖。Fig. 6 is a partially enlarged longitudinal sectional view showing a portion different from Fig. 5.

圖7係一部分與圖5不同之局部放大縱剖面圖。Fig. 7 is a partially enlarged longitudinal sectional view showing a portion different from Fig. 5.

圖8係表示比較例之局部放大縱剖面圖。Fig. 8 is a partially enlarged longitudinal sectional view showing a comparative example.

圖9係表示未形成端子導通部之狀態之電感元件之後視圖。Fig. 9 is a rear view showing the inductance element in a state where the terminal conducting portion is not formed.

圖10係一部分與圖9不同之電感元件之後視圖。Figure 10 is a rear elevational view of a portion of the inductive component that is different from Figure 9.

圖11係表示對磁芯進行粉末壓製成形之過程之側視圖。Figure 11 is a side view showing the process of powder press forming a magnetic core.

圖12係將對圖11所示之磁芯進行粉末壓製成形時之端子部附近放大表示之局部放大縱剖面圖。Fig. 12 is a partially enlarged longitudinal sectional view showing the vicinity of a terminal portion when the magnetic core shown in Fig. 11 is subjected to powder press molding.

本發明之實施形態之電感元件1於作為粉末壓製成形體之磁芯20埋入有線圈10。於圖2中,以實線表示埋設於磁芯20內之線圈10,以虛線表示磁芯20之外表面。In the inductance element 1 of the embodiment of the present invention, the coil 10 is embedded in the magnetic core 20 as a powder press molded body. In FIG. 2, the coil 10 embedded in the magnetic core 20 is indicated by a solid line, and the outer surface of the magnetic core 20 is indicated by a broken line.

如圖1及圖2所示,線圈10係將導電性帶體11捲繞而形成。如圖1及圖2等所示,導電性帶體11具有對向之板面11a、11a與對向之側端面11b、11b,且係剖面呈長方形之帶狀體。如圖2所示,寬度方向之尺寸A充分大於厚度方向之尺寸B,尺寸A為尺寸B之2倍以上,較佳為6倍以上。As shown in FIGS. 1 and 2, the coil 10 is formed by winding a conductive tape body 11. As shown in Fig. 1 and Fig. 2 and the like, the conductive tape body 11 has a strip-shaped body having a rectangular cross section in the opposing plate faces 11a and 11a and the opposite side end faces 11b and 11b. As shown in FIG. 2, the dimension A in the width direction is sufficiently larger than the dimension B in the thickness direction, and the dimension A is twice or more, preferably 6 times or more, the dimension B.

導電性帶體11係由銅形成,如下述圖5等所示,於導電性帶體11之表面形成有被覆樹脂層12。The conductive tape body 11 is made of copper, and the coating resin layer 12 is formed on the surface of the conductive tape body 11 as shown in FIG. 5 and the like below.

於圖1、圖2中表示線圈10之捲繞中心線O。線圈10係以如下方式捲繞:以導電性帶體11之板面11a與捲繞中心線O大致垂直、決定厚度方向之側端面11b與捲繞中心線O平行之朝向,板面11a彼此沿著捲繞中心線O重疊。如圖1、圖2、圖3所示,線圈10以導電性帶體11成為橢圓形之方式被捲繞。再者,雖然於圖1~圖3中線圈10成為橢圓形,但亦可為正圓形,可由業者適當地選擇。The winding center line O of the coil 10 is shown in Figs. The coil 10 is wound in such a manner that the plate surface 11a of the conductive strip 11 is substantially perpendicular to the winding center line O, and the direction in which the side end surface 11b in the thickness direction is parallel to the winding center line O is determined, and the plate faces 11a are along each other. The winding center line O overlaps. As shown in FIGS. 1, 2, and 3, the coil 10 is wound such that the conductive strip 11 is elliptical. Further, although the coil 10 is elliptical in FIGS. 1 to 3, it may be a perfect circle and may be appropriately selected by the manufacturer.

如圖1所示,在將線圈10捲繞成橢圓狀之狀態下,導電性帶體11之第1端部13與第2端部16自線圈10突出。此處,所謂端部13、16係指導電性帶體11中之未被捲繞成線圈10之兩端部分。As shown in FIG. 1, in a state in which the coil 10 is wound in an elliptical shape, the first end portion 13 and the second end portion 16 of the conductive tape body 11 protrude from the coil 10. Here, the end portions 13 and 16 guide the both end portions of the electrical tape body 11 that are not wound into the coil 10.

如圖2所示,第1端部13係藉由第1摺線14a而向谷折方向彎折成大 致直角,藉由第2摺線14b而向山折方向彎折成大致直角,並在第3摺線14c與第4摺線14d之各者處向谷折方向彎折成大致直角。第2端部16係在第1摺線17a處向山折方向彎折成大致直角,在第2摺線17b、第3摺線17c及第4摺線17d處向谷折方向彎折成大致直角。As shown in Fig. 2, the first end portion 13 is bent in the valley direction by the first fold line 14a. The right angle is bent at a substantially right angle in the direction of the mountain by the second folding line 14b, and is bent at a substantially right angle in the valley folding direction at each of the third folding line 14c and the fourth folding line 14d. The second end portion 16 is bent at a substantially right angle in the direction of the mountain fold at the first fold line 17a, and is bent at a substantially right angle in the valley folding direction at the second fold line 17b, the third fold line 17c, and the fourth fold line 17d.

第1端部13之較第4摺線14d更靠端部之部分為第1端子部15,第2端部16之較第4摺線17d更靠端部之部分為第2端子部18。The portion of the first end portion 13 closer to the end than the fourth folding line 14d is the first terminal portion 15, and the portion of the second end portion 16 closer to the end than the fourth folding line 17d is the second terminal portion 18.

如圖2及圖4所示,第1端子部15位於略微遠離被捲繞成線圈10之導電性帶體11之板面11a之位置,形成第1端子部15之導電性帶體11之板面11a與構成線圈10之導電性帶體11之板面11a大致平行地對向。As shown in FIG. 2 and FIG. 4, the first terminal portion 15 is located slightly away from the plate surface 11a of the conductive strip 11 wound around the coil 10, and the plate of the conductive strip 11 of the first terminal portion 15 is formed. The surface 11a faces the plate surface 11a of the conductive strip 11 constituting the coil 10 substantially in parallel.

如圖2所示,第2端子部18亦位於略微遠離被捲繞成線圈10之導電性帶體11之板面11a之位置,形成有第2端子部18之導電性帶體11之板面11a與構成線圈10之導電性帶體11之板面11a大致平行地對向。As shown in FIG. 2, the second terminal portion 18 is also located slightly away from the plate surface 11a of the conductive strip 11 wound around the coil 10, and the surface of the conductive strip 11 of the second terminal portion 18 is formed. 11a is opposed to the plate surface 11a of the conductive strip 11 constituting the coil 10 substantially in parallel.

而且,第1端子部15之於圖2中朝上之板面11a與第2端子部18之於圖2中朝上之板面11a位於大致同一面,該面係與捲繞中心線O垂直之面。Further, the upper end surface 11a of the first terminal portion 15 in FIG. 2 and the second terminal portion 18 are substantially flush with the upper surface 11a of FIG. 2, and the surface is perpendicular to the winding center line O. The face.

再者,於將電感元件1設置於未圖示之印刷基板上之情形時,將端子部15、18朝向下側,因此朝向圖2、圖4、圖5~圖8之各圖之上側之面係在設置於印刷基板上之狀態下相當於下表面(背面)之面。In the case where the inductance element 1 is provided on a printed circuit board (not shown), the terminal portions 15 and 18 are directed downward, and thus the upper side of each of FIGS. 2, 4, and 5 to 8 is formed. The surface corresponds to the surface of the lower surface (back surface) in a state of being placed on the printed substrate.

如圖2、圖3所示,作為粉末壓製成形體之磁芯20係具有上表面21及下表面(背面)22且進而具有四個側面之立方體形狀。如圖2、圖3、圖4所示,由自線圈10延伸之導電性帶體11之端部13、16形成之第1端子部15與第2端子部18之表面之板面11a(於圖2、圖4中為朝向上側之板面11a)於磁芯20之下表面22露出,各個端子部15、18之表面側之板面11a與磁芯20之下表面22成為大致同一面。As shown in FIGS. 2 and 3, the magnetic core 20 as a powder press molded body has a top surface 21 and a lower surface (back surface) 22 and further has a cubic shape of four side faces. As shown in FIG. 2, FIG. 3, and FIG. 4, the first terminal portion 15 formed by the end portions 13 and 16 of the conductive strip 11 extending from the coil 10 and the surface 11a of the surface of the second terminal portion 18 are formed. In FIG. 2 and FIG. 4, the upper surface 11a) is exposed on the lower surface 22 of the core 20, and the surface 11a on the surface side of each of the terminal portions 15, 18 is substantially flush with the lower surface 22 of the core 20.

又,如圖2所示,導電性帶體11之第1端部13之摺線14c與摺線14d之間之部分之板面11a於磁芯20之1個側面23顯露。又,第2端部16之 摺線17c與摺線17d之間之部分之板面11a亦於磁芯20之側面23顯露。各個板面11a與側面23為大致同一面。Further, as shown in FIG. 2, the plate surface 11a of the portion between the fold line 14c of the first end portion 13 of the conductive strip 11 and the fold line 14d is exposed on one side surface 23 of the magnetic core 20. Moreover, the second end portion 16 The plate surface 11a of the portion between the fold line 17c and the fold line 17d is also exposed on the side surface 23 of the magnetic core 20. Each of the plate faces 11a and the side faces 23 are substantially flush with each other.

如圖4、圖9(圖9係自圖3中去除端子導通部42後之後視圖)所示,各端子部15、18係配置在形成於磁芯20之下表面22之由與端子部形狀大致相同之形狀構成之凹部20a內。如下述圖11所示,該凹部20a係於在空腔34之內部配置有線圈10及各端子部15、18之狀態下,以加壓力F對供給至上述空腔34之內部之磁芯材料進行加壓時而形成者。即,於成形體之形成時,除位於各端子部15、18之表面側之板面11a以外,由磁芯材料包圍各端子部15、18之周圍,藉此形成凹部20a。或者,亦可在端子部15、18之形成前於磁芯20之下表面22預先形成凹部20a,將自線圈10延伸之各端部13、16彎折而將端子部15、18配置於凹部20a內。4 and 9 (FIG. 9 is a rear view in which the terminal conducting portion 42 is removed from FIG. 3), the terminal portions 15, 18 are disposed on the lower surface 22 of the magnetic core 20 and the shape of the terminal portion. The recess 20a is formed in substantially the same shape. As shown in FIG. 11 below, the concave portion 20a is a magnetic core material that is supplied to the inside of the cavity 34 by a pressing force F in a state in which the coil 10 and the terminal portions 15, 18 are disposed inside the cavity 34. Formed when pressurized. In other words, in the formation of the molded body, the periphery of each of the terminal portions 15, 18 is surrounded by the core material in addition to the plate surface 11a on the surface side of each of the terminal portions 15, 18, thereby forming the concave portion 20a. Alternatively, the concave portion 20a may be formed in advance on the lower surface 22 of the magnetic core 20 before the formation of the terminal portions 15, 18, and the end portions 13 and 16 extending from the coil 10 may be bent to arrange the terminal portions 15 and 18 in the concave portion. Within 20a.

如圖5所示,一對端子部15、18(於圖5中雖未圖示第2端子部18,但由於該第2端子部18係與第1端子部15相同之剖面構造,因此以下表述為端子部15、18)係包含導電性帶體11、及形成於導電性帶體11之表面之被覆樹脂層(第1絕緣層)12而構成。被覆樹脂層12係例如在絕緣樹脂層之表面重疊尼龍等融合層而成之雙層構造。As shown in FIG. 5, the pair of terminal portions 15 and 18 (the second terminal portion 18 is not shown in FIG. 5, but the second terminal portion 18 has the same cross-sectional structure as the first terminal portion 15, so the following The terminal portions 15 and 18) are composed of a conductive tape body 11 and a coating resin layer (first insulating layer) 12 formed on the surface of the conductive tape body 11. The coating resin layer 12 is a two-layer structure in which a fusion layer such as nylon is laminated on the surface of the insulating resin layer, for example.

被覆樹脂層12係形成於圖5所示之導電性帶體11之上表面及下表面、即板面11a與側端面11b(參照圖9等)。雖未圖示,但被覆樹脂層12亦形成於圖1、圖2、圖4所示之線圈10之各導電性帶體11之表面,因此被覆樹脂層12介於構成線圈10之各導電性帶體11間。The coating resin layer 12 is formed on the upper surface and the lower surface of the conductive tape body 11 shown in Fig. 5, that is, the plate surface 11a and the side end surface 11b (see Fig. 9 and the like). Although not shown, the coating resin layer 12 is also formed on the surface of each of the conductive strips 11 of the coil 10 shown in Figs. 1, 2, and 4, so that the coating resin layer 12 is interposed between the respective constituents of the coil 10. The belt body 11 is.

如圖5所示,被覆樹脂層12未形成於各端子部15、18之前端面24。其原因在於,前端面24相當於切斷被覆導線時之切斷面。又,將前端面24至自其略微後退之區域定義為各端子部15、18之前端26,亦可設為於構成各端子部15、18之前端26之板面11a及側端面11b未形成被覆樹脂層12之構成。於本說明書中,所謂端子部15、18之前端26, 既可僅指前端面24,亦可設為包含自前端面24略微後退之位置在內之區域。端子部15、18之前端26相對於例如延出至圖9所示之磁芯20之背面22之端子部15、18之延出長度而設定為1/4以下之區域,較佳地設定為1/10以下之區域。As shown in FIG. 5, the coating resin layer 12 is not formed on the front end surface 24 of each of the terminal portions 15, 18. This is because the front end surface 24 corresponds to the cut surface when the covered wire is cut. Further, the front end surface 24 is defined as a region slightly retracted from the front end portion 26 of each of the terminal portions 15, 18, and the plate surface 11a and the side end surface 11b constituting the front end 26 of each of the terminal portions 15, 18 may not be formed. The structure of the resin layer 12 is covered. In the present specification, the front end portions 26 of the terminal portions 15, 18 are It may be referred to only as the front end surface 24, or may be an area including a position slightly retracted from the front end surface 24. The front end portions 26 of the terminal portions 15 and 18 are set to an area of 1/4 or less with respect to the extension length of the terminal portions 15 and 18 extending to the back surface 22 of the magnetic core 20 shown in Fig. 9, for example, and are preferably set to Areas below 1/10.

如圖5、圖9所示,在各端子部15、18之前端面24與在平面方向(相對於前端面24正交之面方向)上與上述前端面24對向之磁芯20之側壁20b之間形成有間隙25。間隙25係與凹部20a連續之空間區域。或者,間隙25亦可如圖10所示般自各端子部15、18之前端面24與磁芯20之側壁20b之間至各端子部15、18之側壁面11b與和上述側壁面11b對向之磁芯20之側壁20c之間形成。圖10之構造適用於如下構成,即,於各端子部15、18之前端面24至自其略微後退之區域之前端26未形成被覆樹脂層12之構成。再者,間隙25不僅可形成於各端子部15、18之前端26之位置,而且可自前端26至後端連續地形成。As shown in FIGS. 5 and 9, the front end surface 24 of each of the terminal portions 15 and 18 and the side wall 20b of the magnetic core 20 opposed to the front end surface 24 in the planar direction (the direction orthogonal to the front end surface 24) A gap 25 is formed therebetween. The gap 25 is a space region continuous with the recess 20a. Alternatively, as shown in FIG. 10, the gap 25 may be opposed to the side wall surface 11b of each of the terminal portions 15, 18 from the front end surface 24 of each of the terminal portions 15, 18 and the side wall 20b of the magnetic core 20, and the side wall surface 11b. Formed between the side walls 20c of the magnetic core 20. The structure of Fig. 10 is applied to a configuration in which the coating resin layer 12 is not formed at the end 26 of the front end portion 24 of each of the terminal portions 15 and 18 to the region slightly retracted therefrom. Further, the gap 25 can be formed not only at the position of the front end 26 of each of the terminal portions 15, 18 but also continuously from the front end 26 to the rear end.

如圖4、圖5所示,於間隙25填充保護樹脂層41(第2絕緣層)。保護樹脂層41係塗佈於磁芯20之外表面之整個區域。保護樹脂層41與被覆樹脂層12同樣地為電絕緣性之樹脂層。保護樹脂層41之材質並無特別限定,可例示聚醯亞胺或環氧樹脂等。又,保護樹脂層41較佳為可含浸於磁芯20之外表面之樹脂。As shown in FIGS. 4 and 5, the protective resin layer 41 (second insulating layer) is filled in the gap 25. The protective resin layer 41 is applied to the entire area of the outer surface of the magnetic core 20. Similarly to the coating resin layer 12, the protective resin layer 41 is an electrically insulating resin layer. The material of the protective resin layer 41 is not particularly limited, and examples thereof include polyimine or epoxy resin. Further, the protective resin layer 41 is preferably a resin which can be impregnated on the outer surface of the magnetic core 20.

又,如圖3、圖4、圖5所示,於磁芯20之下表面22(下表面側之表面)形成一對端子導通部42。如圖5所示,端子導通部42隔著保護樹脂層41與磁芯20對向。又,如圖5所示,端子導通部42與構成端子部15、18之導電性帶體11除一部分以外隔著被覆樹脂層12與保護樹脂層41之積層構造而對向。Further, as shown in FIGS. 3, 4, and 5, a pair of terminal conducting portions 42 are formed on the lower surface 22 (surface on the lower surface side) of the magnetic core 20. As shown in FIG. 5, the terminal conducting portion 42 faces the magnetic core 20 via the protective resin layer 41. Moreover, as shown in FIG. 5, the terminal conduction portion 42 and the conductive tape body 11 constituting the terminal portions 15 and 18 are opposed to each other except for a laminated structure of the coating resin layer 12 and the protective resin layer 41.

如圖3、圖5所示,在端子導通部42與構成端子部15、18之導電性帶體11之間形成有於厚度方向(高度方向)上貫通被覆樹脂層12及保護樹脂層41之貫通孔43。如此,於圖5中,保護樹脂層41與間隙25一 併形成於磁芯20之表面及被覆樹脂層12之表面,且形成貫通被覆樹脂層12及保護樹脂層41之一部分之積層部分的貫通孔43,導電性帶體11之表面(板面11a)自貫通孔43露出。而且,端子導通部42進入至貫通孔43內,從而端子導通部42與導電性帶體11相接。藉此,設為端子導通部42與構成端子部15、18之導電性帶體11電性連接之狀態。As shown in FIG. 3 and FIG. 5, between the terminal conducting portion 42 and the conductive strip 11 constituting the terminal portions 15 and 18, the coating resin layer 12 and the protective resin layer 41 are penetrated in the thickness direction (height direction). Through hole 43. Thus, in FIG. 5, the protective resin layer 41 and the gap 25 are The surface of the magnetic core 20 and the surface of the coating resin layer 12 are formed, and a through hole 43 penetrating through the laminated portion of the coating resin layer 12 and the protective resin layer 41 is formed, and the surface of the conductive tape 11 (plate surface 11a) is formed. The through hole 43 is exposed. Further, the terminal conducting portion 42 enters the through hole 43, and the terminal conducting portion 42 is in contact with the conductive tape body 11. Thereby, the terminal conduction portion 42 is electrically connected to the conductive tape body 11 constituting the terminal portions 15 and 18.

圖8係比較例,於圖8中,未在各端子部15、18之前端面24與和前端面24對向之磁芯20之側壁20b之間形成間隙,而使導電性帶體11與磁芯20在前端面24之位置處接觸。Fig. 8 is a comparative example. In Fig. 8, a gap is formed between the front end surface 24 of each of the terminal portions 15, 18 and the side wall 20b of the magnetic core 20 opposed to the front end surface 24, and the conductive strip 11 and the magnetic body are formed. The core 20 is in contact at the location of the front end face 24.

磁芯20例如為包含磁性粉末與黏合劑樹脂之粉末壓製成形體,於圖8之比較例中,成為在端子部15、18之前端面24與磁芯20間未保持高絕緣性之狀態。即,絕緣耐壓下降。相對於此,於圖5所示之實施形態中,在端子部15、18之前端面24與磁芯20之側壁20b之間形成間隙25,且於該間隙25填充電絕緣性之保護樹脂層41,因此與圖8所示之比較例相比能夠有效地提高導電性帶體11所露出之前端面24與磁芯20之側壁20b之間之絕緣耐壓。又,若設為圖10所示之構成,則由於在位於端子部15、18之前端26之側壁面11b與磁芯20之側壁20c之間亦形成間隙25,且於該間隙25內填充保護樹脂層41,因此即便為在前端面24至自其略微後退之區域之前端26未形成被覆樹脂層12之形態,亦能夠有效地提高絕緣耐壓。The magnetic core 20 is, for example, a powder-molded molded body comprising a magnetic powder and a binder resin. In the comparative example of FIG. 8, the insulating layer is not maintained between the end faces 24 and the magnetic core 20 before the terminal portions 15 and 18. That is, the insulation withstand voltage is lowered. On the other hand, in the embodiment shown in FIG. 5, a gap 25 is formed between the end surface 24 of the terminal portions 15, 18 and the side wall 20b of the magnetic core 20, and the gap 25 is filled with the electrically insulating protective resin layer 41. Therefore, the insulation withstand voltage between the front end surface 24 exposed by the conductive strip 11 and the side wall 20b of the magnetic core 20 can be effectively improved as compared with the comparative example shown in FIG. Further, if the configuration shown in Fig. 10 is adopted, a gap 25 is formed between the side wall surface 11b of the front end portion 26 of the terminal portions 15, 18 and the side wall 20c of the magnetic core 20, and the gap 25 is filled with protection. Since the resin layer 41 is in a form in which the coating resin layer 12 is not formed at the end 26 before the front end surface 24 is slightly retreated, the insulation withstand voltage can be effectively improved.

又,藉由使保護樹脂層41含浸於磁芯20之外表面及間隙25內,而樹脂利用毛細管現象浸透至間隙25內,從而可適當地利用保護樹脂層41埋入間隙25內。又,藉由使用與對於磁芯20之外表面之絕緣塗佈材料相同之樹脂埋入間隙25內,能以低成本且簡單之製造方法利用樹脂埋設間隙25內。Further, by impregnating the protective resin layer 41 with the outer surface of the magnetic core 20 and the gap 25, the resin penetrates into the gap 25 by capillary action, and the protective resin layer 41 can be appropriately buried in the gap 25. Further, by using the same resin embedded in the gap 25 as the insulating coating material on the outer surface of the magnetic core 20, the inside of the gap 25 can be buried by the resin in a low-cost and simple manufacturing method.

又,如圖5所示,藉由使保護樹脂層41介於磁芯20與端子導通部42之間,可提高磁芯20與端子導通部42之間之絕緣耐壓。又,如圖5 所示,雖然保護樹脂層41亦重疊形成於各端子部15、18之表面,但於端子部15、18與端子導通部42之間之導通部分形成有貫通被覆樹脂層12與保護樹脂層41之積層構造之貫通孔43,可經由貫通孔43使構成端子部15、18之導電性帶體11與端子導通部42適當地導通連接。貫通孔43係以特定之大小形成於自各端子部15、18之前端面24向後方後退之位置。由此,在貫通孔43與各端子部15、18之前端面24之間、以及較貫通孔43更靠後方之位置殘留有被覆樹脂層12與保護樹脂層41之積層構造。如圖3所示,貫通孔43小於端子部15、18之寬度尺寸,在圖3之箭視下,貫通孔43係以收納於端子部15、18之區域內之大小形成。因此,可經由貫通孔43使端子部15、18與端子導通部42適當地導通連接,並且可利用在貫通孔43之周圍擴展之絕緣性之樹脂層適當地確保端子導通部42與磁芯20間之絕緣性。Further, as shown in FIG. 5, by interposing the protective resin layer 41 between the magnetic core 20 and the terminal conducting portion 42, the withstand voltage between the magnetic core 20 and the terminal conducting portion 42 can be improved. Again, as shown in Figure 5. As shown in the figure, the protective resin layer 41 is formed on the surface of each of the terminal portions 15, 18, but the through-coating resin layer 12 and the protective resin layer 41 are formed in the conductive portion between the terminal portions 15, 18 and the terminal conducting portion 42. The through hole 43 having the laminated structure allows the conductive strip 11 constituting the terminal portions 15 and 18 to be appropriately electrically connected to the terminal conducting portion 42 via the through hole 43. The through hole 43 is formed at a position that is retracted rearward from the front end surface 24 of each of the terminal portions 15 and 18 by a specific size. Thereby, the laminated structure of the coating resin layer 12 and the protective resin layer 41 remains between the through hole 43 and the front end surface 24 of each of the terminal portions 15 and 18 and at a position further rearward than the through hole 43. As shown in FIG. 3, the through hole 43 is smaller than the width dimension of the terminal portions 15, 18, and the through hole 43 is formed in a size accommodated in the region of the terminal portions 15, 18 in the arrow of FIG. Therefore, the terminal portions 15 and 18 and the terminal conduction portion 42 can be appropriately electrically connected via the through hole 43 , and the terminal conduction portion 42 and the magnetic core 20 can be appropriately ensured by the insulating resin layer extending around the through hole 43 . Insulation between.

本實施形態並不限定間隙25之形成方法,例如可利用回彈(springback)形成間隙25。關於回彈,以下使用圖11進行說明。This embodiment does not limit the method of forming the gap 25, and for example, the gap 25 can be formed by springback. The rebound will be described below using FIG.

於圖11中表示將磁芯20成形為粉末壓製成形體之步驟。The step of forming the magnetic core 20 into a powder press-formed body is shown in FIG.

圖11所示之加壓機30係於模具本體31之內部設置下模32,且於其上方形成有空腔34。將圖2所示之線圈10插入至空腔34之內部,以第1端子部15之表面之板面11a與第2端子部18之表面之板面11a抵接於下模32之上表面之方式進行定位。The press machine 30 shown in Fig. 11 is provided with a lower mold 32 inside the mold body 31, and a cavity 34 is formed thereover. The coil 10 shown in FIG. 2 is inserted into the cavity 34, and the plate surface 11a of the surface of the first terminal portion 15 and the plate surface 11a of the surface of the second terminal portion 18 abut against the upper surface of the lower mold 32. Way to locate.

其後,將包含磁性粉末與黏合劑樹脂之芯體材料供給至空腔34之內部。磁性粉末係磁性合金粉末,例如係以Fe為主體且含有Ni、Sn、Cr、P、C、B、Si等各種金屬之Fe基非晶合金之粉末,利用水霧法進行粉末化而成。黏合劑樹脂係聚矽氧樹脂或環氧樹脂等。Thereafter, a core material containing a magnetic powder and a binder resin is supplied to the inside of the cavity 34. The magnetic powder-based magnetic alloy powder is, for example, a powder of a Fe-based amorphous alloy containing Fe, which is mainly composed of various metals such as Ni, Sn, Cr, P, C, B, and Si, and is powdered by a water mist method. The binder resin is a polysiloxane resin or an epoxy resin.

上述芯體材料係上述磁性粉末由上述黏合劑樹脂進行塗佈所得之混合粉末。或者,亦可為磁性粉末與粉末狀之黏合劑樹脂單純混合而成者。又,芯體材料亦可預先暫時成形,在與線圈10組合之後插入 至空腔內。The core material is a mixed powder obtained by coating the magnetic powder with the binder resin. Alternatively, it may be a simple mixture of a magnetic powder and a powdery binder resin. Further, the core material may be temporarily formed in advance and inserted after being combined with the coil 10. Inside the cavity.

當將芯體材料填充至空腔34內時,自空腔34之上方插入上模33,並對空腔34進行加熱,藉由下模32與上模33以加壓力F對芯體材料進行加壓,從而形成作為粉末壓製成形體之磁芯20。該粉末壓製成形中,黏合劑樹脂作為用以結合磁性粉末彼此之結合劑而發揮功能。再者,於該加壓時不一定需要加熱,亦可在室溫下進行加壓。When the core material is filled into the cavity 34, the upper mold 33 is inserted from above the cavity 34, and the cavity 34 is heated, and the core material is subjected to the pressing force F by the lower mold 32 and the upper mold 33. The pressure is applied to form a magnetic core 20 as a powder press molded body. In the powder press molding, the binder resin functions as a binder for binding magnetic powders to each other. Further, heating is not necessarily required at the time of pressurization, and pressurization may be performed at room temperature.

如圖11所示,在空腔34內,在下模32與上模33之間以加壓力F對包含磁性粉末與黏合劑樹脂之芯體材料進行加壓,同時線圈10以及第1端子部15與第2端子部18亦受到加壓力F而被加壓。As shown in FIG. 11, in the cavity 34, a core material containing a magnetic powder and a binder resin is pressurized between the lower mold 32 and the upper mold 33 by a pressing force F, and the coil 10 and the first terminal portion 15 are simultaneously pressed. The second terminal portion 18 is also pressurized by the pressing force F.

如圖3、圖4所示,第1端子部15與第2端子部18具有一部分與形成有線圈10之導電性帶體11之板面11a面對面之面對面區域D。如圖4所示,於面對面區域D中,端子部15、18與線圈10之間隙δ變窄,於加壓成形後,在欲使端子部15、18與線圈10分離之回彈力之作用下,在位於間隙δ狹窄之區域之磁芯20容易產生內部應力。藉此,如圖9所示般在各端子部15、18之前端面24與磁芯20之側壁20b之間、或如圖10所示般在各端子部15、18之前端26與磁芯20之側壁20c之間容易形成基於回彈之間隙25。As shown in FIGS. 3 and 4, the first terminal portion 15 and the second terminal portion 18 have a face-to-face area D in which a part of the first terminal portion 15 faces the plate surface 11a of the conductive strip 11 on which the coil 10 is formed. As shown in Fig. 4, in the face-to-face area D, the gap δ between the terminal portions 15, 18 and the coil 10 is narrowed, and after the press forming, under the action of the resilience to separate the terminal portions 15, 18 from the coil 10 The magnetic core 20 in the region where the gap δ is narrow is liable to generate internal stress. Thereby, as shown in FIG. 9, between the end faces 24 of the respective terminal portions 15, 18 and the side walls 20b of the magnetic core 20, or as shown in FIG. 10, the front ends 26 of the respective terminal portions 15, 18 and the magnetic core 20 A rebound-based gap 25 is easily formed between the side walls 20c.

藉由調整加壓力F或調整加熱溫度(退火溫度)等,而適度地產生回彈力,藉此能夠形成適度大小之間隙25。此處,關於間隙25之大小,只要藉由介置保護樹脂層41而確保端子部15、18之前端26與磁芯20之側壁之間之絕緣性,則並無特別限定,但當間隙25形成得過大時,磁芯20之強度會下降,因此間隙25之寬度較佳得設為約100μm以下(電感元件1之縱橫之寬度尺寸為數十mm)。例如作為芯體材料而使用Fe基非晶合金之粉末與黏合劑樹脂之混合材料,將加壓力F設為780~1180MPa左右,將加熱溫度設為350℃~450℃左右。By adjusting the pressing force F or adjusting the heating temperature (annealing temperature) or the like, a repulsive force is appropriately generated, whereby a gap 25 of a moderate size can be formed. Here, the size of the gap 25 is not particularly limited as long as the insulation between the front end 26 of the terminal portions 15 and 18 and the side wall of the magnetic core 20 is ensured by interposing the protective resin layer 41, but the gap 25 is formed. When the thickness is too large, the strength of the magnetic core 20 is lowered. Therefore, the width of the gap 25 is preferably set to be about 100 μm or less (the width dimension of the longitudinal direction of the inductance element 1 is several tens of mm). For example, a mixed material of a powder of a Fe-based amorphous alloy and a binder resin is used as the core material, and the pressing force F is set to about 780 to 1180 MPa, and the heating temperature is set to about 350 to 450 °C.

又,如圖12所示,亦可使用例如於表面具有突起部40之下模 32。如圖12所示,突起部40剛好位於端子部15、18之前端面24之前方,能夠以突起部40之位置不被芯體材料掩埋之方式在各端子部15、18之前端面24與磁芯20之間形成間隙25。又,亦可將突起部40設為包圍端子部15、18之前端26之周圍之形狀,而如圖10所示般形成包圍端子部15、18之前端26之周圍之間隙25。Further, as shown in FIG. 12, for example, a mold having a projection 40 under the surface may be used. 32. As shown in FIG. 12, the protruding portion 40 is located just before the front end surface 24 of the terminal portions 15, 18, and the front end portion 24 and the magnetic core can be formed in front of the respective terminal portions 15, 18 without the position of the protruding portion 40 being buried by the core material. A gap 25 is formed between 20. Further, the protrusion 40 may be formed to surround the periphery of the front end 26 of the terminal portions 15, 18, and a gap 25 surrounding the front end 26 of the terminal portions 15, 18 may be formed as shown in FIG.

或者,亦可於對磁芯20進行粉末壓製成形之後利用雷射等削除端子部15、18之前端面24之前方或端子部15、18之前端26之周圍之磁芯20而形成間隙25。Alternatively, after the magnetic core 20 is subjected to powder press molding, the magnetic core 20 around the front end 24 of the terminal portions 15 and 18 or the front end 26 of the terminal portions 15 and 18 may be removed by laser or the like to form the gap 25.

圖6、圖7係一部分與圖5不同之局部放大剖面圖。於圖6中,各端子部15、18之前端26成為向自磁芯20之凹部20a內分離之方向浮起之狀態。與圖5相比,由於各端子部15、18之前端26與磁芯20隔開距離,因此能夠更有效地提高各端子部15、18之前端26與磁芯20之間之絕緣耐壓。6 and 7 are partial enlarged cross-sectional views of a portion different from Fig. 5. In FIG. 6, the front end 26 of each of the terminal portions 15, 18 is in a state of being floated in a direction separating from the inside of the concave portion 20a of the magnetic core 20. Compared with FIG. 5, since the front end 26 of each of the terminal portions 15, 18 is spaced apart from the magnetic core 20, the insulation withstand voltage between the front end 26 of each of the terminal portions 15, 18 and the magnetic core 20 can be more effectively improved.

於圖6之形態中,在自相對於平面垂直之方向觀察之箭視C下,端子部15、18之前端面24與磁芯20之側壁20b亦處於對向之位置關係。In the form of Fig. 6, the front end face 24 of the terminal portions 15, 18 and the side wall 20b of the magnetic core 20 are also in an opposing positional relationship in the arrow C viewed from a direction perpendicular to the plane.

又,如圖6所示,於在自端子部15、18之前端面24朝向後方之前端26未形成被覆樹脂層12之形態之情形時,如圖6般使前端26彎曲而於凹部20a中浮起,藉此可使被覆樹脂層41亦介於前端26與凹部20a之高度方向(厚度方向)之對向面間E。由此,能夠更有效地提高前端26與磁芯20間之絕緣耐壓。Further, as shown in FIG. 6, when the front end portion 24 of the terminal portions 15 and 18 faces the rear end portion 26 without forming the resin layer 12, the front end 26 is bent and floated in the concave portion 20a as shown in FIG. Thereby, the coating resin layer 41 can also be interposed between the opposing faces E in the height direction (thickness direction) of the front end 26 and the concave portion 20a. Thereby, the insulation withstand voltage between the tip end 26 and the magnetic core 20 can be more effectively improved.

又,如圖7所示,亦可形成以各端子部15、18之前端面24與磁芯20之側壁20b之間隔朝向靠近端子導通部42之高度方向逐漸變大之方式使側壁20b傾斜之間隙45。再者,能夠在位於各端子部15、18之前端26之側端面11b與磁芯20之側壁20c(參照圖10)之間亦形成與圖7相同之間隙45。若將圖7所示之間隙45以與圖5所示之間隙25相同之體積 形成,則圖7之間隙45可較圖5之間隙25擴大橫寬,從而能夠適當地以保護樹脂層41埋設間隙45內。Further, as shown in FIG. 7, a gap in which the side wall 20b is inclined such that the front end surface 24 of each of the terminal portions 15 and 18 and the side wall 20b of the magnetic core 20 gradually become larger toward the height direction of the terminal conducting portion 42 may be formed. 45. Further, a gap 45 similar to that of FIG. 7 can be formed between the side end surface 11b of the front end 26 of each of the terminal portions 15, 18 and the side wall 20c of the magnetic core 20 (see FIG. 10). If the gap 45 shown in FIG. 7 is the same volume as the gap 25 shown in FIG. When formed, the gap 45 of FIG. 7 can be enlarged laterally with respect to the gap 25 of FIG. 5, so that the inside of the gap 45 can be appropriately buried in the protective resin layer 41.

於圖2、圖3等所示之電感元件1中,將一對端子部15、18設置於磁芯20之下表面(背面)22,但關於將端子部15、18配置於磁芯20之外表面中之哪一個面並無特別限定。In the inductance element 1 shown in FIG. 2, FIG. 3, and the like, the pair of terminal portions 15 and 18 are provided on the lower surface (back surface) 22 of the magnetic core 20, but the terminal portions 15 and 18 are disposed on the magnetic core 20. Which one of the outer surfaces is not particularly limited.

又,如圖3、圖4等所示般設置有與一對端子部15、18電性連接之一對端子導通部42,但並非必須形成端子導通部42。然而,藉由設置端子導通部42,能夠使電感元件1與印刷基板之間之電性連接性穩定且良好。Further, as shown in FIGS. 3 and 4, a pair of terminal conductive portions 42 are electrically connected to the pair of terminal portions 15 and 18, but the terminal conductive portion 42 is not necessarily formed. However, by providing the terminal conducting portion 42, the electrical connection between the inductor element 1 and the printed circuit board can be stabilized and good.

於上述說明中,雖然將形成於導電性帶體11之表面之第1絕緣層設為電絕緣性之被覆樹脂層12,將掩埋間隙25之第2絕緣層設為電絕緣性之保護樹脂層41,但各絕緣層之材質並不限定於樹脂。然而,於使用被覆導線時,第1絕緣層較佳為被覆樹脂層12。作為第2絕緣層,可利用濺鍍或蒸鍍法等將樹脂以外之絕緣材料埋設於間隙25內。然而,在第2絕緣層使用磁芯20之外表面之絕緣塗佈材料即保護樹脂層41,並藉由含浸使其掩埋間隙25,藉此能夠適當地掩埋間隙25,並且製造步驟亦不會繁雜化而能夠抑制製造成本。In the above description, the first insulating layer formed on the surface of the conductive tape 11 is made of the electrically insulating coating resin layer 12, and the second insulating layer of the buried gap 25 is made of an electrically insulating protective resin layer. 41, but the material of each insulating layer is not limited to the resin. However, when the coated wire is used, the first insulating layer is preferably coated with the resin layer 12. As the second insulating layer, an insulating material other than the resin can be buried in the gap 25 by sputtering or vapor deposition. However, the protective resin layer 41, which is an insulating coating material on the outer surface of the magnetic core 20, is used in the second insulating layer, and the gap 25 is buried by impregnation, whereby the gap 25 can be appropriately buried, and the manufacturing steps are not It is complicated and can suppress manufacturing costs.

11‧‧‧導電性帶體11‧‧‧Electrical belt

11a‧‧‧板面11a‧‧‧ board

12‧‧‧被覆樹脂層(第1絕緣層)12‧‧‧coated resin layer (first insulating layer)

15‧‧‧第1端子部15‧‧‧1st terminal part

20‧‧‧磁芯20‧‧‧ magnetic core

20a‧‧‧凹部20a‧‧‧ recess

20b‧‧‧磁芯20之側壁20b‧‧‧ sidewall of magnetic core 20

22‧‧‧下表面(背面)22‧‧‧Lower surface (back)

24‧‧‧前端面24‧‧‧ front end

25‧‧‧間隙25‧‧‧ gap

26‧‧‧前端26‧‧‧ front end

41‧‧‧保護樹脂層(第2絕緣層)41‧‧‧Protective resin layer (2nd insulating layer)

42‧‧‧端子導通部42‧‧‧Terminal Conduction

43‧‧‧貫通孔43‧‧‧through holes

Claims (4)

一種電感元件,其係於磁芯之內部埋入有線圈者,其特徵在於:將自上述線圈延伸之一對導電性帶體之端部彎折,而於上述磁芯之外表面形成一對端子部;上述導電性帶體之表面除上述端子部之前端以外由第1絕緣層覆蓋;在上述端子部之前端與和上述前端對向之上述磁芯之間設置間隙,且於上述間隙填充有第2絕緣層。An inductor element in which a coil is embedded in a magnetic core, wherein one end extending from the coil bends an end portion of the conductive strip body to form a pair on the outer surface of the magnetic core a terminal portion; a surface of the conductive tape body covered by a first insulating layer except for a front end of the terminal portion; a gap is formed between the front end of the terminal portion and the magnetic core facing the front end, and is filled in the gap There is a second insulating layer. 如請求項1之電感元件,其中上述第2絕緣層與上述間隙一併形成於上述磁芯之表面、及上述第1絕緣層之表面;貫通上述第1絕緣層及上述第2絕緣層之一部分之積層部分而形成使上述端子部之上述導電性帶體之表面露出之貫通孔;自上述第2絕緣層之表面至上述貫通孔形成一對端子導通部;上述端子部與上述端子導通部之間經由上述貫通孔而導通。The inductance element according to claim 1, wherein the second insulating layer is formed on the surface of the magnetic core and the surface of the first insulating layer together with the gap; and penetrates one of the first insulating layer and the second insulating layer a through hole for exposing a surface of the conductive strip body of the terminal portion; a pair of terminal conducting portions formed from a surface of the second insulating layer to the through hole; and the terminal portion and the terminal conducting portion The conduction is conducted through the through hole. 如請求項1或2之電感元件,其中上述第1絕緣層係被覆上述導電性帶體之表面的電絕緣性之被覆樹脂層,上述第2絕緣層係作為對於上述磁芯之外表面之絕緣塗佈材料的電絕緣性之保護樹脂層。The inductance element according to claim 1 or 2, wherein the first insulating layer covers an electrically insulating coating resin layer on a surface of the conductive tape, and the second insulating layer serves as an insulating layer on a surface of the magnetic core An electrically insulating protective resin layer of the coating material. 如請求項1或2之電感元件,其中至少於上述端子部之前端面未設置上述第1絕緣層,且至少在上述前端面與和上述前端面對向之上述磁芯之側壁之間形成上述間隙。The inductance element according to claim 1 or 2, wherein the first insulating layer is not provided on at least the front end surface of the terminal portion, and the gap is formed at least between the front end surface and a side wall of the magnetic core facing the front end .
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