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TWI471428B - Conductive and stress relief characteristics of excellent copper alloy plate - Google Patents

Conductive and stress relief characteristics of excellent copper alloy plate Download PDF

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Publication number
TWI471428B
TWI471428B TW102121874A TW102121874A TWI471428B TW I471428 B TWI471428 B TW I471428B TW 102121874 A TW102121874 A TW 102121874A TW 102121874 A TW102121874 A TW 102121874A TW I471428 B TWI471428 B TW I471428B
Authority
TW
Taiwan
Prior art keywords
copper alloy
alloy plate
annealing
less
stress
Prior art date
Application number
TW102121874A
Other languages
English (en)
Chinese (zh)
Other versions
TW201416463A (zh
Inventor
Takaaki Hatano
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201416463A publication Critical patent/TW201416463A/zh
Application granted granted Critical
Publication of TWI471428B publication Critical patent/TWI471428B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Contacts (AREA)
TW102121874A 2012-10-22 2013-06-20 Conductive and stress relief characteristics of excellent copper alloy plate TWI471428B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012233005 2012-10-22
JP2013090390A JP5470483B1 (ja) 2012-10-22 2013-04-23 導電性及び応力緩和特性に優れる銅合金板

Publications (2)

Publication Number Publication Date
TW201416463A TW201416463A (zh) 2014-05-01
TWI471428B true TWI471428B (zh) 2015-02-01

Family

ID=50544342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102121874A TWI471428B (zh) 2012-10-22 2013-06-20 Conductive and stress relief characteristics of excellent copper alloy plate

Country Status (5)

Country Link
JP (1) JP5470483B1 (ja)
KR (1) KR101716991B1 (ja)
CN (1) CN104718302B (ja)
TW (1) TWI471428B (ja)
WO (1) WO2014064961A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626323B (zh) * 2016-03-31 2018-06-11 Jx Nippon Mining & Metals Corp 電子材料用銅合金

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6749122B2 (ja) * 2016-03-30 2020-09-02 Ｊｘ金属株式会社 強度及び導電性に優れる銅合金板
JP6749121B2 (ja) * 2016-03-30 2020-09-02 Ｊｘ金属株式会社 強度及び導電性に優れる銅合金板
JP6283048B2 (ja) * 2016-03-31 2018-02-21 株式会社神戸製鋼所 電気電子部品用銅合金条
TWI592946B (zh) * 2016-11-11 2017-07-21 Metal Ind Res & Dev Ct Copper alloy wire and its manufacturing method
JP7213086B2 (ja) * 2018-12-26 2023-01-26 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
TW202035722A (zh) * 2019-03-25 2020-10-01 日商Ｊｘ金屬股份有限公司 銅合金板、通電用電子零件及散熱用電子零件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101001965A (zh) * 2004-08-17 2007-07-18 株式会社神户制钢所 具有弯曲加工性的电气电子部件用铜合金板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6749699B2 (en) * 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
JP2004256902A (ja) * 2003-02-27 2004-09-16 Nikko Metal Manufacturing Co Ltd Ｃｕ−Ｃｒ−Ｚｒ合金およびその製造方法
JP3731600B2 (ja) * 2003-09-19 2006-01-05 住友金属工業株式会社 銅合金およびその製造方法
JP4191159B2 (ja) * 2005-03-14 2008-12-03 日鉱金属株式会社 プレス加工性に優れたチタン銅
JP5135496B2 (ja) * 2007-06-01 2013-02-06 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｂｅ系銅合金板材およびその製造法
EP2695958B1 (en) * 2007-08-07 2018-12-26 Kabushiki Kaisha Kobe Seiko Sho Copper alloy sheet
JP4968533B2 (ja) * 2007-11-30 2012-07-04 日立電線株式会社 電気・電子部品用銅合金材
JP5411679B2 (ja) 2009-12-07 2014-02-12 株式会社Ｓｈカッパープロダクツ 銅合金材
JP5590990B2 (ja) * 2010-06-30 2014-09-17 株式会社Ｓｈカッパープロダクツ 銅合金
EP2610359A4 (en) * 2010-08-27 2017-08-02 Furukawa Electric Co., Ltd. Copper alloy sheet and method for producing same
JP5060625B2 (ja) * 2011-02-18 2012-10-31 三菱伸銅株式会社 Ｃｕ−Ｚｒ系銅合金板及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101001965A (zh) * 2004-08-17 2007-07-18 株式会社神户制钢所 具有弯曲加工性的电气电子部件用铜合金板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626323B (zh) * 2016-03-31 2018-06-11 Jx Nippon Mining & Metals Corp 電子材料用銅合金

Also Published As

Publication number Publication date
WO2014064961A1 (ja) 2014-05-01
CN104718302A (zh) 2015-06-17
JP5470483B1 (ja) 2014-04-16
KR20150047624A (ko) 2015-05-04
CN104718302B (zh) 2017-06-23
KR101716991B1 (ko) 2017-03-15
JP2014101574A (ja) 2014-06-05
TW201416463A (zh) 2014-05-01

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