TWI411697B - Sputtering bracket and sputtering device using the same - Google Patents
Sputtering bracket and sputtering device using the same Download PDFInfo
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- TWI411697B TWI411697B TW97120083A TW97120083A TWI411697B TW I411697 B TWI411697 B TW I411697B TW 97120083 A TW97120083 A TW 97120083A TW 97120083 A TW97120083 A TW 97120083A TW I411697 B TWI411697 B TW I411697B
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Abstract
Description
本發明涉及一種鍍膜裝置,尤其涉及一種鍍膜支架及鍍膜機。The invention relates to a coating device, in particular to a coating stent and a coating machine.
通常,照相機、數位相機、照相手機鏡頭模組等光學產品之各種光學鏡片(Lens)、濾光片等光學元件,因為要避免入射光於經過每個元件時,部分入射光反射而導致之光能損耗,需要於每一個光學鏡片之兩面鍍抗反射膜,或是於濾光片之一面鍍上可濾掉某區段光之薄膜(如紅外濾光片,紫外濾光片),而於另一面鍍上抗反射膜,通過這些光學薄膜以增加光學元件之抗反射性能,防止光能損耗。Generally, optical components such as Lens and filters of optical products such as cameras, digital cameras, and camera lens modules are required to prevent incident light from being reflected by partial incident light when passing through each component. Loss of energy, it is necessary to plate anti-reflection film on both sides of each optical lens, or to coat one side of the filter with a film that can filter out a certain section of light (such as infrared filter, ultraviolet filter), and The other side is coated with an anti-reflection film, and these optical films are used to increase the anti-reflection performance of the optical element and prevent loss of optical energy.
該光學薄膜之鍍膜方式多以熱蒸鍍或濺鍍方式進行。當光學元件兩面都需鍍上光學薄膜時,其鍍膜過程中通常包括:抽真空、加熱、一面鍍膜、冷卻、破真空、手動翻轉光學元件夾具、抽真空、加熱、另一面鍍膜、冷卻、破真空、取出光學元件等步驟(參見蘇成彬等人發表於1980年第2期之《儀鍍技術與感測器》上之《空心圓柱面鍍膜用旋轉支架》一文,介紹了一種用於圓柱形光學零件之鍍膜用支架及其使用方法)。該鍍膜過程中包括兩次抽真空、加熱、鍍膜、冷卻以及破真空過程,占去相當多之製程時間,所以如何避免該過程之重複進行,降低製程之時間,對於兩面鍍膜之元件量產來講是極為重要之課題。The coating method of the optical film is usually carried out by thermal evaporation or sputtering. When optical films are coated on both sides of the optical component, the coating process usually includes: vacuuming, heating, coating, cooling, vacuum breaking, manual flipping of the optical component fixture, vacuuming, heating, coating on the other side, cooling, breaking Vacuum, removal of optical components, etc. (see "Spinning brackets for hollow cylindrical coatings" by Su Chengbin et al., "Iron Plating Technology and Sensors", No. 2, 1980, for a cylindrical A bracket for coating optical parts and a method of using the same). The coating process includes two vacuuming, heating, coating, cooling and vacuum breaking processes, which take up a considerable amount of process time, so how to avoid the process repeating and reduce the process time, mass production of the two-sided coating components Speaking is an extremely important topic.
有鑑於此,提供一種用於鍍膜設備中,可實現對鍍膜基片夾具自動翻面之鍍膜支架及鍍膜機實為必要。In view of the above, it is necessary to provide a coating holder and a coating machine for automatically turning the coated substrate holder in a coating apparatus.
一種鍍膜支架,其包括:一個支架本體,該支架本體具有一中心轉軸,該支架本體可繞該中心轉軸旋轉,該支架本體上設置有複數容置通孔;至少一基片夾具,該每個基片夾具對應設置於每個容置通孔中,該基片夾具和該支架本體之間通過轉軸連接,該每個基片夾具相連之轉軸處設有一翻面導向槽;及一個翻面控制裝置,該翻面控制裝置包括至少一翻面桿及一控制元件,該控制元件用於控制該翻面桿移動至與該基片夾具之翻面導向槽接近之位置,以使該支架本體繞該中心轉軸旋轉時,該翻面桿於該翻面導向槽之導引下,帶動該基片夾具翻面。A coated stent comprises: a bracket body having a central rotating shaft, the bracket body is rotatable about the central rotating shaft, the bracket body is provided with a plurality of receiving through holes; at least one substrate clamp, each of the a substrate holder correspondingly disposed in each of the receiving through holes, the substrate holder and the bracket body being connected by a rotating shaft, wherein each of the substrate clamps is connected with a turning guide groove at a rotating shaft; and a turning surface control The device includes: at least one flipping rod and a control element, wherein the control element is configured to control the flipping rod to move to a position close to the turning guide groove of the substrate holder, so that the bracket body is wound When the center shaft rotates, the flip lever is guided by the turning guide groove to drive the substrate holder to turn over.
一種鍍膜機,其包括:一個真空容器;設置於所述真空容器內之至少一個靶;及與靶相對設置之鍍膜支架,該鍍膜支架包括:一個支架本體,該支架本體具有一中心轉軸,該支架本體可繞該中心轉軸旋轉,該支架本體上設置有複數個容置通孔;至少一基片夾具,該每個基片夾具對應設置於每個容置通孔中,該基片夾具和該支架本體之間通過轉軸連接,該每個基片夾具相連之轉軸處設有一翻面導向槽;及一個翻面控制裝置,該翻面控制裝置包括至少一翻面桿及一控制元件,該控制元件用於控制該翻面桿移動至與該基片夾具之翻面導向槽接近之位置,以使該支架本體繞該中心轉軸旋轉時,該翻面桿在該翻面導向槽之導引下,帶動該基片夾具翻面。A coating machine comprising: a vacuum container; at least one target disposed in the vacuum container; and a coating bracket disposed opposite the target, the coating bracket comprising: a bracket body having a central rotating shaft, the bracket body The bracket body is rotatable about the central rotating shaft, and the bracket body is provided with a plurality of receiving through holes; at least one substrate holder, wherein each of the substrate holders is correspondingly disposed in each of the receiving through holes, the substrate holder and The bracket bodies are connected by a rotating shaft, wherein each of the substrate clamps is connected with a turning guide groove at a rotating shaft; and a turning surface control device comprising at least one turning rod and a control element, The control element is configured to control the position of the flipping rod to be close to the turning guide groove of the substrate holder, so that the turning rod is guided by the turning guide groove when the bracket body rotates around the central rotating shaft Next, the substrate fixture is turned over.
相較於先前技術,該鍍膜支架及鍍膜機可實現對鍍膜基片夾具自動翻面,可省去兩次抽真空、破真空之時間,從而大量節省製程時間之優點。Compared with the prior art, the coating holder and the coating machine can automatically flip the coated substrate fixture, which can save the time of vacuuming and vacuuming, thereby greatly saving the advantages of the processing time.
下面將結合附圖,對本發明作進一步之詳細說明。The invention will be further described in detail below with reference to the accompanying drawings.
如圖1所示,其為本發明實施例提供之鍍膜支架100。該鍍膜支架100包括:一支架本體110、複數基片夾具120及一個翻面控制裝置130,該翻面控制裝置130用於控制該基片夾具120翻轉。As shown in FIG. 1 , it is a coated stent 100 provided by an embodiment of the present invention. The coating holder 100 includes a holder body 110, a plurality of substrate holders 120, and a turning surface control device 130 for controlling the substrate holder 120 to be inverted.
該支架本體110用導熱性能良好之金屬製成,其形狀呈半圓球面狀,其材料可為銅、鋁或不銹鋼等金屬中之一種或幾種。於本實施例中,該支架本體110為不銹鋼半圓球。該支架本體110具有一中心轉軸101,該支架本體110可繞該中心轉軸101旋轉。該支架本體110上設置有複數容置通孔112,該複數容置通孔112之形狀為方形。當然,其形狀亦可設置為扇形、圓形等形狀。該複數容置通孔112呈行列排布於該支架本體110上,每一行上之複數容置通孔112位於同一條水準線上。The bracket body 110 is made of a metal having good thermal conductivity and has a semi-spherical shape, and the material thereof may be one or more of metals such as copper, aluminum or stainless steel. In this embodiment, the bracket body 110 is a stainless steel semi-spherical ball. The bracket body 110 has a central rotating shaft 101 about which the bracket body 110 can rotate. The bracket body 110 is provided with a plurality of receiving through holes 112, and the plurality of receiving through holes 112 are square in shape. Of course, the shape can also be set to a shape such as a fan shape or a circle shape. The plurality of receiving through holes 112 are arranged in a row on the bracket body 110, and the plurality of receiving through holes 112 on each row are on the same level line.
該每個基片夾具120對應設置於每個容置通孔112中。該基片夾具120採用導熱性能良好之金屬製成,其材料可為銅、鋁或不銹鋼等金屬中之一種或幾種。當然,該基片夾具120之材料還可為塑膠,例如:PC(聚碳酸脂)加ABS(丙稀腈-丁二烯-苯乙烯共聚物)之合成材料,或PC加玻璃纖維之合成材料等。該基片夾具120之形狀可為 扇形、圓形或方形等形狀,其原則是只要滿足可裝置於支架本體110之容置通孔112內,且翻轉時不會與支架本體110碰撞即可。於本實施例中,該基片夾具120為方形。該複數基片夾具120大小相同且對稱分佈於該支架本體110上。Each of the substrate holders 120 is disposed in each of the receiving through holes 112. The substrate holder 120 is made of a metal having good thermal conductivity, and the material thereof may be one or more of metals such as copper, aluminum or stainless steel. Of course, the material of the substrate holder 120 may also be a plastic material, for example, a synthetic material of PC (polycarbonate) plus ABS (acrylonitrile-butadiene-styrene copolymer), or a composite material of PC and glass fiber. Wait. The shape of the substrate fixture 120 can be The shape of the fan, the circle, the square, or the like is such that it can be installed in the receiving through hole 112 of the bracket body 110 and does not collide with the bracket body 110 when flipped. In the embodiment, the substrate holder 120 is square. The plurality of substrate holders 120 are the same size and symmetrically distributed on the holder body 110.
該每個基片夾具120設置有至少一個通孔122,用以收容待鍍膜工件並暴露該待鍍膜工件之兩相對之待鍍表面。該待鍍膜工件為玻璃鏡片或塑膠鏡片等。Each of the substrate holders 120 is provided with at least one through hole 122 for receiving the workpiece to be coated and exposing the opposite surfaces to be plated of the workpiece to be coated. The workpiece to be coated is a glass lens or a plastic lens.
請一併參閱圖2,該每個基片夾具120和該支架本體110之間通過轉軸124連接。本實施例中,轉軸124設於基片夾具120之軸線位置。該每個容置通孔112相對設置有兩個凹槽(圖未示),該每個基片夾具120之轉軸124可卡置於對應之凹槽中從而固定於該容置通孔112內。該每個基片夾具120對應之轉軸124上設有一翻面導向槽126。該翻面導向槽126設置於每一基片夾具120之轉軸124末端之外側。Referring to FIG. 2 together, each of the substrate holders 120 and the holder body 110 are connected by a rotating shaft 124. In this embodiment, the rotating shaft 124 is disposed at the axial position of the substrate holder 120. Each of the receiving through holes 112 is oppositely disposed with two grooves (not shown). The rotating shaft 124 of each of the substrate holders 120 can be locked in the corresponding groove to be fixed in the receiving through hole 112. . Each of the substrate holders 120 is provided with a turning guide groove 126 corresponding to the rotating shaft 124. The turning guide groove 126 is provided on the outer side of the end of the rotating shaft 124 of each of the substrate holders 120.
該翻面導向槽126為半月形,其由一第一擋塊1261及一第二擋塊1262共同配合形成。該第一擋塊1261為半月形,該第二擋塊1262一端為圓弧形一端為方形,該第二擋塊1262設置於該第一擋塊1261之半月形內部,且圓弧形之一端靠裏,以使該第一擋塊1261與該第二擋塊1262配合形成該翻面導向槽126。當然,該翻面導向槽126亦可為圓弧形、U形、馬蹄形等形狀,只要可實現導引基片夾具120翻轉之結構即可。The turning guide groove 126 is a half moon shape, and is formed by a first block 1261 and a second block 1262 cooperating. The first block 1261 has a half moon shape, and the second block 1262 has a circular arc end and a square end. The second block 1262 is disposed inside the half moon of the first block 1261, and one end of the circular arc The first stop 1261 and the second stop 1262 cooperate to form the turning guide groove 126. Of course, the turning guide groove 126 may also have a circular arc shape, a U shape, a horseshoe shape, or the like, as long as the structure for guiding the substrate clamp 120 to be reversed can be realized.
該翻面控制裝置130包括至少一翻面桿132及一控制元件134,該控制元件134用於控制該翻面桿132下移並相對移至該基片夾具之翻面導向槽126中,從而當該支架本體110轉動時,該基片夾具120會隨之翻轉。該控制元件134為電動馬達、電磁泵或磁流電動機。The flip control device 130 includes at least one flip lever 132 and a control member 134 for controlling the flip lever 132 to move downward and relatively move into the flip guide groove 126 of the substrate holder, thereby When the holder body 110 is rotated, the substrate holder 120 is flipped over. The control element 134 is an electric motor, an electromagnetic pump or a magnetic current motor.
該控制元件134可控制該翻面桿132下移或上升,從而使該翻面控制裝置130處於工作狀態或者非工作狀態。由於該鍍膜支架100於鍍膜時,該支架本體110會不停地旋轉,例如:以逆時針方向旋轉。而支架本體110逆時針旋轉就會使得固定於其上之每個基片夾具120從左向右地於水準方向上移動。而此翻面控制裝置130正是利用這一現象來實現基片夾具120之翻轉。The control element 134 can control the flip lever 132 to move down or up, thereby causing the flip control device 130 to be in an active or inactive state. Since the coating holder 100 is coated, the holder body 110 is continuously rotated, for example, in a counterclockwise direction. Rotating the bracket body 110 counterclockwise causes each of the substrate holders 120 fixed thereto to move from left to right in the horizontal direction. This flip control device 130 utilizes this phenomenon to effect the flipping of the substrate holder 120.
請一併參閱圖2至圖5,其為本發明實施例所提供之鍍膜支架100之其中一個基片夾具120於翻轉時之一系列立體示意圖。每一個圖裏之基片夾具120及翻面桿132分別處於不同之狀態。Please refer to FIG. 2 to FIG. 5 , which are schematic perspective views of one of the substrate holders 120 of the coating holder 100 according to the embodiment of the present invention. Each of the substrate holder 120 and the flip lever 132 are in different states.
請參閱圖2,其為該基片夾具120於未開始翻轉時之狀態。由於該支架本體110逆時針旋轉會使得該基片夾具120相對地從左向右移動。因此,該翻面桿132會相對地移動到翻面導向槽126內,如圖3所示。Please refer to FIG. 2, which is a state in which the substrate jig 120 is not turned over. Since the bracket body 110 rotates counterclockwise, the substrate holder 120 is relatively moved from left to right. Therefore, the flip lever 132 will relatively move into the flip guide groove 126 as shown in FIG.
該翻面導向槽126之第一擋塊1261為半月形,其內側為圓弧狀。當該基片夾具120相對地移動時,由於翻面桿132之抵觸,會使圓弧處存於一定擠壓力,而這種擠壓力會使得基片夾具120開始翻轉,如圖4所示。The first stopper 1261 of the turning guide groove 126 has a half moon shape and an inner side thereof has an arc shape. When the substrate jig 120 is relatively moved, due to the resistance of the flip bar 132, a certain pressing force is generated in the arc, and the pressing force causes the substrate jig 120 to start to flip, as shown in FIG. Show.
該基片夾具120翻轉到近似90度之位置時,該翻面桿132亦相對地移動到了翻面導向槽126之最裏面。基片夾具120於支架本體110之旋轉之帶動下繼續移動,使得翻面桿132不會停留於翻面導向槽126裏面,而是帶動基片夾具120翻轉,如圖5所示。When the substrate holder 120 is turned over to a position of approximately 90 degrees, the flip lever 132 is also relatively moved to the rearmost face of the flip guide groove 126. The substrate holder 120 continues to move under the rotation of the holder body 110, so that the flip lever 132 does not stay on the face of the flip guide groove 126, but drives the substrate holder 120 to flip, as shown in FIG.
該基片夾具120已經翻轉了180度,而翻面桿132亦相對於基片夾具120之位置正要離開翻面導向槽126。從而該基片夾具120實現了自動翻面功能,而同一水平方向上之下一個經過此翻面桿132之基片夾具將會移動到翻面桿132之位置,從而實現對另一個基片夾具進行翻面。The substrate holder 120 has been flipped 180 degrees, and the flip lever 132 is also about to leave the flip guide slot 126 relative to the position of the substrate holder 120. Thus, the substrate holder 120 realizes an automatic flip function, and the substrate holder passing through the flip lever 132 in the same horizontal direction will move to the position of the flip lever 132, thereby realizing the other substrate holder. Turn over.
每一排基片夾具120都可相應設置一個翻面桿132,從而由一個翻面桿132來帶動此一排之基片夾具120翻面。於本實施例中,該支架本體110上設置有兩排基片夾具120,而該翻面桿132亦相應地設置有兩個,從而實現對兩排之基片夾具120進行翻面。Each row of substrate holders 120 can be provided with a flip bar 132 correspondingly, so that a row of substrate holders 120 can be turned by a flip bar 132. In this embodiment, the bracket body 110 is provided with two rows of substrate fixtures 120, and the flipping rods 132 are correspondingly disposed two, thereby realizing the flipping of the two rows of the substrate fixtures 120.
當所有之基片夾具120都翻面結束後,則可設定讓支架本體110暫停轉動,並使用該控制元件134將該翻面桿132向上提起,從而遠離該基片夾具120。然後,再啟動鍍膜裝置,對待鍍膜工件進行另一面之鍍膜。When all of the substrate holders 120 have been turned over, the holder body 110 can be set to pause and the flip member 132 can be lifted up using the control member 134 to move away from the substrate holder 120. Then, the coating device is restarted, and the coated workpiece is coated on the other side.
本發明還提供一個使用上述鍍膜支架100之鍍膜機(圖未示)包括:一個真空容器(圖未示);設置於該真空容器內之至少一個靶(圖未示);及與靶相對設置之鍍膜支架100。The present invention further provides a coating machine (not shown) using the above-mentioned coating stent 100, comprising: a vacuum container (not shown); at least one target (not shown) disposed in the vacuum container; and opposite to the target The coated stent 100.
該鍍膜機於使用時,首先對待鍍膜基片進行一面鍍 膜,當一面鍍完後,只需使用該鍍膜支架100上之翻面控制裝置130控制每一基片夾具120翻轉180度後,即可對另一面進行鍍膜。由於翻面控制裝置130可採用電控或遙控之裝置來控制其動作,故此基片夾具120之翻面動作可自動進行。When the coating machine is used, firstly, one side of the coated substrate is plated. After the one surface is plated, the flipping control device 130 on the coating holder 100 is used to control each substrate holder 120 to be flipped by 180 degrees, and then the other surface can be coated. Since the flip control device 130 can be controlled by an electronically controlled or remotely controlled device, the flipping action of the substrate holder 120 can be automatically performed.
相較於先前技術,該鍍膜支架及鍍膜機可實現對鍍膜基片夾具自動翻面,可省去兩次抽真空、破真空之時間,從而大量節省製程時間之優點。Compared with the prior art, the coating holder and the coating machine can automatically flip the coated substrate fixture, which can save the time of vacuuming and vacuuming, thereby greatly saving the advantages of the processing time.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
鍍膜支架‧‧‧100Coated stent ‧‧100
支架本體‧‧‧110Bracket body ‧‧‧110
基片夾具‧‧‧120Substrate fixture ‧‧120
翻面控制裝置‧‧‧130Flip control device ‧‧‧130
中心轉軸‧‧‧101Center shaft ‧ ‧ 101
容置通孔‧‧‧112Having a through hole ‧‧112
通孔‧‧‧122Through hole ‧‧122
轉軸‧‧‧124Rotary ‧‧‧124
導向槽‧‧‧126Guide slot ‧‧‧126
第一擋塊‧‧‧1261First stop ‧‧1126
第二擋塊‧‧‧1262Second block ‧‧1126
翻面桿‧‧‧132Flip ‧ ‧ ‧ 132
控制元件‧‧‧134Control element ‧‧‧134
圖1係本發明實施例提供之鍍膜支架之立體示意圖。FIG. 1 is a schematic perspective view of a coated stent according to an embodiment of the invention.
圖2至圖5係圖1中之鍍膜支架之基片夾具於翻轉時位於不同角度之立體示意圖。2 to FIG. 5 are perspective views of the substrate holder of the coated stent of FIG. 1 at different angles when flipped.
鍍膜支架‧‧‧100Coated stent ‧‧100
支架本體‧‧‧110Bracket body ‧‧‧110
基片夾具‧‧‧120Substrate fixture ‧‧120
翻面控制裝置‧‧‧130Flip control device ‧‧‧130
中心轉軸‧‧‧101Center shaft ‧ ‧ 101
容置通孔‧‧‧112Having a through hole ‧‧112
通孔‧‧‧122Through hole ‧‧122
轉軸‧‧‧124Rotary ‧‧‧124
翻面桿‧‧‧132Flip ‧ ‧ ‧ 132
控制元件‧‧‧134Control element ‧‧‧134
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW97120083A TWI411697B (en) | 2008-05-30 | 2008-05-30 | Sputtering bracket and sputtering device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97120083A TWI411697B (en) | 2008-05-30 | 2008-05-30 | Sputtering bracket and sputtering device using the same |
Publications (2)
Publication Number | Publication Date |
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TW200948994A TW200948994A (en) | 2009-12-01 |
TWI411697B true TWI411697B (en) | 2013-10-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW97120083A TWI411697B (en) | 2008-05-30 | 2008-05-30 | Sputtering bracket and sputtering device using the same |
Country Status (1)
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TW (1) | TWI411697B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI480403B (en) * | 2010-10-26 | 2015-04-11 | Hon Hai Prec Ind Co Ltd | Deposition device |
TWI513842B (en) * | 2011-11-22 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | Support mechanism and vacuum coating machine using the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200535263A (en) * | 2004-04-30 | 2005-11-01 | Hon Hai Prec Ind Co Ltd | Vacumm vapor deposition apparatus |
TW200607877A (en) * | 2004-08-18 | 2006-03-01 | Hantek Technology Co Ltd | Chip coating jig |
-
2008
- 2008-05-30 TW TW97120083A patent/TWI411697B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200535263A (en) * | 2004-04-30 | 2005-11-01 | Hon Hai Prec Ind Co Ltd | Vacumm vapor deposition apparatus |
TW200607877A (en) * | 2004-08-18 | 2006-03-01 | Hantek Technology Co Ltd | Chip coating jig |
Also Published As
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TW200948994A (en) | 2009-12-01 |
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