Claims (1)
1374238 替換頁 、該周緣間具有 七、申請專利範圍： 1· 一種發熱源之散熱裝置，其包括有 一絕緣板，該絕緣板具有至少一周緣 一第一面及一第二面；1374238 Replacement page, there is a patent between the circumferences. 7. Patent application scope: 1. A heat sink for a heat source, comprising an insulation plate having at least one peripheral edge, a first surface and a second surface;
至>、二導性貼片，該導性貼片係—導熱性及導電性仓 的可繞性薄片，該二導性貼片係貼設於該絕緣板的第一s 或第二面的至少一面上，且該二導性貼片係不相導通，驾 至少-導性貼片係由該絕緣板的周緣延伸出俾 立 伸變形部，藉以擴大散熱的面積； 至少一發熱源，係結合於該絕緣板上，該發熱源具有 二導通極，該二導通極係分別與該二導性貼片導通，唁一 導性貼片並電性連接電源，俾供應給該發熱源電源。' 2. —種發熱源之散熱裝置，其包括有： 一絕緣板，該絕緣板具有至少一周緣、該周緣間具有 第面及一第一面，且該第一面或該第二面的至少一面 上設有至少二導電層；To a <, two-conducting patch, the conductive patch is a flexible sheet of a thermally conductive and conductive cartridge, the bi-conductive patch being attached to the first s or second side of the insulating sheet On at least one side, and the two-conducting patch is not electrically connected, and the at least-conductive patch extends from the periphery of the insulating plate to extend the deformation portion, thereby expanding the heat dissipation area; at least one heat source, The heat source has two conductive poles, and the two conductive poles are respectively electrically connected to the two-conducting patch, and the conductive patch is electrically connected to the power source, and the heat source is supplied to the heat source. . 2. A heat sink for a heat source, comprising: an insulating plate having at least one peripheral edge, a first surface and a first surface between the circumferences, and the first surface or the second surface Having at least two conductive layers on at least one side;
^至少一導性貼片，該導性貼片係一導熱性佳的可繞性 薄片，該導性貼片係貼設於該絕緣板的第一面或第二面的 至少一面上，該至少一導性貼片係由該絕緣板的周緣延伸 出， 至少一發熱源，係結合於該絕緣板上，該發熱源具有 二導通極，且該二導通極係分別接設於該二不相導通的導 電層上，該二導電層並電性連接電源，俾供應給該發熱源 電源； ...... 1374238 ... ，年：月修正替換頁 料性貼4係與該導祕朗導電層連接*導通 以導引並吸附該發熱源連接電源所產生的熱。 g 3·如申請專利範圍第1或2項所述發熱i之散熱裝置， 其中’該導性貼片上設置黏膠’該導性貼片以黏夥黏貼於 該絕緣板。 4. 如申靖專利範圍第1或2項所述發熱源之散熱裝置， 其中，該導性貼片貼設於該絕緣板，係利用螺絲貫穿該導 • 性貼片方式與該絕緣板貼設固定。 5. 如申猜專利範圍第1或2項所述發熱源之散熱裝置， 其中，該發熱源係發光二極體。 6. 如申請專利範圍第1或2項所述發熱源之散熱裝置， 其中’該絕緣板係導熱性的材質，該材質係為FR4玻纖環氧 基板、FR1紙質基板、CEM-1複合基板、CEM-3複合基板、聚 脂樹脂（Polyester(PET))、聚亞醯胺（p〇lyimide(PI))、電 木、塑膠、鋁基板、石墨、陶瓷、矽膠、氧化鋁或氧化後 φ 絕緣之金屬。 7. 如申請專利範圍第1或2項所述發熱源之散熱裝置’ 其中，該導性貼片係銅箔、鋁箔、錫箔、金箔、銀箔、導 電布、導電泡棉或導電膠。 8. 如申請專利範圍第2項所述發熱源之散熱裝置，其中 ，該各導電層上各設有至少一銲墊，該發熱源的二導通極 係接設於該銲墊，該絕緣板上避開銲墊位置，設有一具絕 緣的隔離層，該隔離層係覆蓋該導電層，該導性貼片係經 由該隔離層貼設在該絕緣板，以及該隔離層内開設有複數 1374238 年j 日修正替換頁 99.合· 2 8 .· L---- -- 散熱孔，且該散熱孔内填充有導熱膠、導熱膏或導熱油’ 以該導熱膠、導熱膏或導熱油連接該導性貼片與該導電層 〇 9. 如申請專利範圍第2項所述發熱源之散熱裝置，其中 ’該使用二導性貼片，該二導性貼片各與該導通極或該導 電層連接，且該二導性貼片係不相導通。 10. 如申請專利範圍第1或2項所述發熱源之散熱裝置 ’其中’該絕緣板與該導性貼片係結合於一散熱鰭片上。At least one conductive patch, the conductive patch is a heat conductive wrapable sheet, and the conductive patch is attached to at least one side of the first side or the second side of the insulating board, At least one conductive patch extends from a periphery of the insulating plate, and at least one heat source is coupled to the insulating plate, the heat source has two conductive poles, and the two conductive poles are respectively connected to the two On the conductive layer that is turned on, the two conductive layers are electrically connected to the power source, and the 俾 is supplied to the heat source power source; ...... 1374238 ... , year: month correction replacement page material stickers 4 series and the guide The secret conductive layer connection* is turned on to guide and adsorb the heat generated by the heat source connected to the power source. g 3. The heat sink of the heat generation according to claim 1 or 2, wherein the adhesive is disposed on the conductive patch, and the conductive patch is adhered to the insulating plate. 4. The heat sink of the heat source according to claim 1 or 2, wherein the conductive patch is attached to the insulating plate, and the insulating sheet is attached by means of a screw through the conductive patch Set to fixed. 5. The heat sink of the heat source according to claim 1 or 2, wherein the heat source is a light emitting diode. 6. The heat sink of the heat source according to claim 1 or 2, wherein the insulating plate is a heat conductive material, the material is FR4 glass fiber epoxy substrate, FR1 paper substrate, CEM-1 composite substrate , CEM-3 composite substrate, Polyester (PET), polyplyimide (PI), bakelite, plastic, aluminum substrate, graphite, ceramic, tannin, alumina or oxidized φ Insulating metal. 7. The heat sink of the heat source according to claim 1 or 2, wherein the conductive patch is a copper foil, an aluminum foil, a tin foil, a gold foil, a silver foil, a conductive cloth, a conductive foam or a conductive paste. 8. The heat sink of the heat source according to claim 2, wherein each of the conductive layers is provided with at least one solder pad, and the two conductive poles of the heat source are connected to the solder pad, the insulating plate The insulating pad is disposed on the insulating pad, and the insulating layer is disposed on the insulating plate through the insulating layer, and the insulating layer is provided with a plurality of 1374238 Year j correction replacement page 99. 合·· 2 8 .· L---- -- vent hole, and the vent hole is filled with thermal conductive paste, thermal paste or heat transfer oil 'to the thermal paste, thermal paste or heat transfer oil Connecting the conductive patch and the conductive layer 〇9. The heat sink of the heat source according to claim 2, wherein 'the two conductive patches are used, and the two conductive patches are respectively connected to the conductive pole or The conductive layer is connected, and the two-conductive patch is not electrically conductive. 10. The heat sink of the heat source according to claim 1 or 2, wherein the insulating plate and the conductive patch are bonded to a heat sink fin.
12 1374238 年月曰修i替換頁 * 丨g 好_ 四、指定代表圖： (一) 本案指定代表圖為：第（1 )圖。 (二) 本代表圖之元件符號簡單說明： 絕緣板10 周緣11 第一面12 第二面13 導電層14 導性貼片20 散熱延伸變形部21 發熱源3012 1374238 月曰修i replacement page * 丨g 好_ IV. Designated representative map: (1) The representative representative of the case is: (1). (2) The symbol of the symbol of the representative figure is briefly described: the periphery of the insulating plate 10 11 the first surface 12 the second surface 13 the conductive layer 14 the conductive patch 20 the heat dissipation extension portion 21 the heat source 30
導通極31 五、本案若有化學式時，請揭示最能顯示發明特徵的化學式：Conduction pole 31 5. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention:
、發明說明： 【發明所屬之技術領域】 本發明係有關於一種發熱源之散熱裝置，尤指一種藉[Technical Field] The present invention relates to a heat sink for a heat source, and more particularly to a borrowing