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TWI369339B - - Google Patents

Info

Publication number
TWI369339B
TWI369339B TW098118157A TW98118157A TWI369339B TW I369339 B TWI369339 B TW I369339B TW 098118157 A TW098118157 A TW 098118157A TW 98118157 A TW98118157 A TW 98118157A TW I369339 B TWI369339 B TW I369339B
Authority
TW
Taiwan
Application number
TW098118157A
Other languages
Chinese (zh)
Other versions
TW201008887A (en
Inventor
Akira Ejimatani
Tatsuo Kiyatake
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201008887A publication Critical patent/TW201008887A/en
Application granted granted Critical
Publication of TWI369339B publication Critical patent/TWI369339B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B28D1/226Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles with plural scoring tools
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076Laminated glass comprising interlayers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
TW098118157A 2008-06-25 2009-06-02 Scribing apparatus TW201008887A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008166612 2008-06-25

Publications (2)

Publication Number Publication Date
TW201008887A TW201008887A (en) 2010-03-01
TWI369339B true TWI369339B (en) 2012-08-01

Family

ID=41444506

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098118157A TW201008887A (en) 2008-06-25 2009-06-02 Scribing apparatus

Country Status (5)

Country Link
JP (1) JP5280442B2 (en)
KR (1) KR101220859B1 (en)
CN (1) CN102083760B (en)
TW (1) TW201008887A (en)
WO (1) WO2009157440A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101730553B1 (en) * 2010-09-29 2017-04-27 엘지디스플레이 주식회사 Apparatus for conveying substrate
JP5161952B2 (en) * 2010-12-13 2013-03-13 三星ダイヤモンド工業株式会社 Method for dividing bonded substrates
JP5160628B2 (en) * 2010-12-13 2013-03-13 三星ダイヤモンド工業株式会社 Method for dividing bonded substrates
TWI462885B (en) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
JP5156085B2 (en) * 2010-12-13 2013-03-06 三星ダイヤモンド工業株式会社 Method for dividing bonded substrates
JP5348430B2 (en) * 2011-05-24 2013-11-20 三星ダイヤモンド工業株式会社 Scribing equipment
JP2013159540A (en) * 2012-02-08 2013-08-19 Mitsuboshi Diamond Industrial Co Ltd Scribing device
JP5639634B2 (en) * 2012-12-11 2014-12-10 三星ダイヤモンド工業株式会社 Substrate cutting system
JP2013189020A (en) * 2013-06-17 2013-09-26 Mitsuboshi Diamond Industrial Co Ltd Scribing apparatus
JP6364789B2 (en) * 2014-01-29 2018-08-01 三星ダイヤモンド工業株式会社 Scribing equipment
JP6251061B2 (en) * 2014-01-29 2017-12-20 三星ダイヤモンド工業株式会社 Scribing device for brittle material substrate
KR102310157B1 (en) * 2015-03-16 2021-10-12 주식회사 탑 엔지니어링 Scribing apparatus
KR102496370B1 (en) 2016-03-07 2023-02-06 삼성전자주식회사 Rail device and refrigerator having the smae
CN108218213A (en) * 2016-12-14 2018-06-29 塔工程有限公司 Cutter for substrate
CN108218212A (en) * 2016-12-14 2018-06-29 塔工程有限公司 Substrate dividing apparatus
KR102067987B1 (en) * 2017-11-23 2020-01-20 주식회사 탑 엔지니어링 Apparatus for cutting substrate
CN108202420B (en) * 2017-12-29 2019-07-23 廊坊京磁精密材料有限公司 Save the multi-line cutting method of material
CN109065470B (en) * 2018-06-20 2024-03-19 常州瑞赛环保科技有限公司 Photovoltaic panel grinding and separation device
JP2020175518A (en) 2019-04-15 2020-10-29 三星ダイヤモンド工業株式会社 Holding jig, positioning device and scribe device
JP2020175517A (en) 2019-04-15 2020-10-29 三星ダイヤモンド工業株式会社 Positioning device and scribe device
KR20210021194A (en) * 2019-08-14 2021-02-25 주식회사 탑 엔지니어링 Method of controlling scribing apparatus
JP7647107B2 (en) 2021-01-12 2025-03-18 日本電気硝子株式会社 Glass film manufacturing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312656A (en) * 1998-04-28 1999-11-09 Hitachi Cable Ltd Substrate cutting method and apparatus
JP2000317891A (en) * 1999-05-10 2000-11-21 Ricoh Co Ltd Method and device for setting cutting form during cutting of film-shaped substrate
JP4509316B2 (en) * 2000-07-03 2010-07-21 三星ダイヤモンド工業株式会社 Scribing method and scriber with multi-scribe head
WO2002057192A1 (en) 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separator and separating system
US20070214925A1 (en) * 2003-09-24 2007-09-20 Mitsubishi Diamond Industrial Co., Ltd Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method
US20080190981A1 (en) * 2003-12-04 2008-08-14 Yasutomo Okajima Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate
WO2005087458A1 (en) 2004-03-15 2005-09-22 Mitsuboshi Diamond Industrial Co., Ltd. Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
ITMI20041250A1 (en) * 2004-06-22 2004-09-22 Bavelloni Z Spa LOADING AND CUTTING PROCEDURE OF GLASS SLABS ON CUTTING TABLES
CN100546004C (en) * 2005-01-05 2009-09-30 Thk株式会社 Cutting method and device for workpiece, marking and cutting method, and marking device with cutting function
KR100972512B1 (en) * 2005-12-29 2010-07-26 엘지디스플레이 주식회사 Cutting Method of Liquid Crystal Display Panel and Manufacturing Method of Liquid Crystal Display Panel Using the Same

Also Published As

Publication number Publication date
CN102083760B (en) 2014-01-08
TW201008887A (en) 2010-03-01
JP5280442B2 (en) 2013-09-04
CN102083760A (en) 2011-06-01
JPWO2009157440A1 (en) 2011-12-15
KR20110031340A (en) 2011-03-25
WO2009157440A1 (en) 2009-12-30
KR101220859B1 (en) 2013-01-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees