1363357 九、發明說明： 【發明所屬之技術領域】 特別係有 本發明係有關於一種導電粒子之製作方法 關於一種複合金屬導電粒子之製作方法。 【先前技術】 習知晶片與基板係以錫球或錫凸塊進行電性連接，其 係在晶片上形成錫凸塊或錫球以結合於電路板，然曰 8白 片上形成錫凸塊或錫球之製程（如電鍍、無電鍍製程）製程 •複雜，且製作成本相對較高，再者，習知錫球之尺寸較大， • 無法應用於高密度或細間距之封裝產品的電性連接。 【發明内容】 — 本發明之主要目的係在於提供一種複合金屬導電粒 子之製作方法，其係包含下列步驟：提供一鍍槽裝置該 鍍槽裝置係包含有一第一槽體、一設置於該第一槽體内之 第二槽體及一可驅動該第二槽體之旋轉器，該第二槽體係 φ 具有複數個濾孔；置入複數個銅粒子於該第二槽體内；加 入一酸性溶液於該第一槽體内，該酸性溶液係通過該第二 槽體之5亥些濾孔接觸該些銅粒子，且藉由該旋轉器驅動該 第一槽體轉動’使得該酸性溶液微触該些銅粒子表面以 去除該些銅粒子之表面氧化物，其中去除表面氧化物後之 該些銅粒子之粒徑係不小於該些濾孔之孔徑；以及加入一 含錫酸性溶液於該第一槽體内，該些銅粒子係與該含錫酸 性溶液進行一錫銅置換反應以形成複數個複合金屬導電 粒子。本發明係藉由控制製程參數，例如：在該酸性溶液 1363357 微蝕該些銅粒子表面，以去除該些銅粒子之表面氧化物之 步驟中’以控制該酸性溶液微㈣些銅粒子表面之時間， 達到控制該些複合金屬導電粒子之尺寸之目的，其係具有 製程簡[降低製作成本及高量產性之功效。 【實施方式】 。月參閱第1及2A至2E圖，依據本發明之一具體實施 例係揭示-種複合金屬導電粒子之 列步驟:首先，請參閱第丨圖之步㈣及第2::= -鍍槽裝i ΗΜ)’該鍍槽裝置⑽係包含有—第一槽體 110、一設置於該第一槽體110内之第二槽體12〇及一可 驅動該第二㈣120之旋轉器130,該第二槽體12〇係具 有複數個濾孔121 ;接著，請參閱第i圖之步驟12及第 2B圖’置入複數個銅粒子21〇於該第二槽體12〇内，藉由 該第二槽體120初步篩選該些銅粒子21〇，使得該些銅粒 子21〇粒徑大於該些據孔121孔徑之該些銅粒子21〇被保 留於該第二槽冑120中’在本實施例中，被保留於該第二 槽體120中之該些銅粒子21〇之平均粒徑係介於】微米至 100微米之間，之後，請參閱第i圖之步驟13及第2C圖， 加入一酸性溶液A於該第一槽體11〇内，該酸性溶液A係 通過該第二槽體120之該些濾孔121接觸該些銅粒子 210,且藉由該旋轉器13〇驅動該第二槽體12〇轉動使 得該酸性溶液A微蝕該些銅粒子21〇表面，以去除該些銅 粒子210之表面氧化物，其中去除表面氧化物後之該些銅 粒子2 1 0之粒徑係不小於該些濾孔} 2丨之孔徑，在本實施 1363357 二，二除表面氧化物後之該些銅粒子21°之粒徑係介於 〇.1微未至30微米之間。 :著，請參閱第i圖之步驟14，移除該酸性溶液A， 在本實施例中，該鍍槽裝置刚係另包含有· :移除該酸性溶液以後’請參閱帛1圖之步驟15及 第2D圖，進行一第一次清洗步驟，其係加入一清洗液工 於該第—槽體110内，該清洗液I係可為去離子水’鮮 由錢轉器13〇驅動該第二槽體12〇轉動，以清洗該些銅1363357 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for producing a conductive particle. A method for producing a composite metal conductive particle. [Prior Art] The conventional wafer and the substrate are electrically connected by solder balls or tin bumps, which are formed by forming tin bumps or solder balls on the wafer to be bonded to the circuit board, and then forming tin bumps on the white sheets or The process of solder ball (such as electroplating, electroless plating process) is complicated, and the production cost is relatively high. Moreover, the size of the solder ball is large, and it cannot be applied to the electrical properties of high-density or fine-pitch package products. connection. SUMMARY OF THE INVENTION The present invention is directed to a method for fabricating a composite metal conductive particle, comprising the steps of: providing a plating tank device, the plating tank device comprising a first tank body, and a a second tank body in a tank body and a rotator capable of driving the second tank body, the second tank system φ has a plurality of filter holes; a plurality of copper particles are disposed in the second tank; An acidic solution is in the first tank, the acidic solution contacts the copper particles through the filter holes of the second tank, and the first tank is rotated by the rotator to make the acidic solution Micro-touching the surface of the copper particles to remove surface oxides of the copper particles, wherein the particle diameter of the copper particles after removing the surface oxide is not less than the pore diameter of the filter holes; and adding a tin-containing acidic solution to In the first tank, the copper particles are subjected to a tin-copper displacement reaction with the tin-containing acidic solution to form a plurality of composite metal conductive particles. The invention controls the process parameters, for example, in the step of micro-etching the surface of the copper particles in the acidic solution 1363357 to remove the surface oxides of the copper particles to control the surface of the copper particles. Time, to achieve the purpose of controlling the size of the composite metal conductive particles, which has the process of simplifying the production cost and high productivity. [Embodiment] Referring to Figures 1 and 2A to 2E, in accordance with an embodiment of the present invention, a step of forming a composite metal conductive particle is disclosed. First, please refer to step (4) of the figure and 2:: = - plating tank The plating device (10) includes a first tank body 110, a second tank body 12 disposed in the first tank body 110, and a rotator 130 that can drive the second (four) 120. The second tank body 12 has a plurality of filter holes 121; then, refer to step 12 and FIG. 2B of FIG. 1 'putting a plurality of copper particles 21 in the second tank body 12, by the The second tank body 120 initially screens the copper particles 21〇 so that the copper particles 21 having a larger particle diameter than the pores of the pores 121 are retained in the second tank 120. In the embodiment, the average particle diameter of the copper particles 21 保留 retained in the second tank 120 is between μm and 100 μm. Thereafter, refer to step 13 and 2C of FIG. An acidic solution A is added to the first tank body 11 , and the acidic solution A contacts the copper particles 210 through the filter holes 121 of the second tank 120 . The rotator 13 〇 drives the second tank 12 to rotate, so that the acidic solution A micro-etches the surface of the copper particles 21 to remove surface oxides of the copper particles 210, wherein the surface oxide is removed. The particle size of the copper particles 210 is not less than the pore diameter of the pores. In the present embodiment, 1363357, the particle size of the copper particles after the surface oxide is removed is between 〇. 1 micro to less than 30 microns. : Please refer to step 14 of the figure i to remove the acidic solution A. In the embodiment, the plating device just contains another: after removing the acidic solution, please refer to the step of FIG. 15 and 2D, performing a first cleaning step, which is performed by adding a cleaning liquid to the first tank body 110, and the cleaning liquid I can be driven by deionized water. The second trough 12 turns to clean the copper
直0或者，在另一個實施例中，係可以該清洗液I 該些銅粒子⑽，該清洗液1係可藉由㈣水閥 該第一槽體110;接著’請參閱第1圖之步驟16 圖’加人—含錫酸性溶液SA於該第-槽體11〇 内，該些銅粒子210係與該含錫酸性溶液SA進行一錫銅 置換反應以形成複數個複合金屬導電粒子2〇〇，該些金屬 導電粒子200係為該些銅粒子21〇表面形成有一錫包覆層 在本實施例中，該含錫酸性溶液从係為硫酸亞錫溶 液（snS〇4) ’該含錫酸性溶液SA之溫度係介於机至峨 之間，該些錫包覆層22〇之平均厚度係介於〇 微米至2 微米之間。 此外，請參閱第i圖之步驟17，對該些複合金屬導電 =子200進行一第二次清洗步驟，其係先移除該含錫酸性 液=再利用該清洗液1清洗該些複合金屬導電粒子 200;最後，請參間第i圖之步驟18，對該些複合金屬導 電粒子200進行一乾燥步驟’以去除殘留水分，其係可採 1363357 用自然乾燥法或將該些複合金屬導電粒子200置於烘箱内 進行乾燥步騾。由於本發明之該些複合金屬導電粒子2〇〇 係可利用控制製程參數，例如：在該酸性溶液A微蝕該些 銅粒子210表面，以去除該些銅粒子21〇之表面氧化物之 步驟中，藉由控制該酸性溶液八微蝕該些銅粒子21〇表面 之時間，以達到控制該些複合金屬導電粒子2〇〇之尺寸之 目的’且本發明之製作方法係具有製程簡單、降低製作成 本及高量產性之功效。Straight 0 or, in another embodiment, the cleaning liquid I may be the copper particles (10), and the cleaning liquid 1 may be the first tank 110 by the (4) water valve; then 'please refer to the steps of FIG. 16 Figure 'Adding human-tin-containing acidic solution SA in the first tank 11〇, the copper particles 210 are subjected to a tin-copper displacement reaction with the tin-containing acidic solution SA to form a plurality of composite metal conductive particles. In the present embodiment, the metal conductive particles 200 are formed with a tin coating layer on the surface of the copper particles 21. In the present embodiment, the tin-containing acidic solution is a stannous sulfate solution (snS〇4). The temperature of the acidic solution SA is between machine and crucible, and the average thickness of the tin coating layer 22 is between 〇 micrometers and 2 micrometers. In addition, please refer to step 17 of the figure i, and perform a second cleaning step on the composite metal conduction=sub-200, which first removes the tin-containing acidic liquid=reuse the cleaning liquid 1 to clean the composite metal Conductive particles 200; Finally, in step 18 of Figure i, the composite metal conductive particles 200 are subjected to a drying step to remove residual moisture, which can be used for natural drying or conductive materials. The particles 200 are placed in an oven for drying steps. Since the composite metal conductive particles 2 of the present invention can utilize the control process parameters, for example, the step of microetching the surface of the copper particles 210 in the acidic solution A to remove the surface oxide of the copper particles 21 In the process of controlling the surface of the copper particles 21 by slightly controlling the acidic solution to achieve the purpose of controlling the size of the composite metal conductive particles 2, and the manufacturing method of the present invention has a simple process and a low process. Production cost and high productivity.
本發明之保護範圍當視德糾夕由< * &田田优便附之申請專利範圍所界定 者為準’任何熟知此項技藝者 卜 w ^在不脫離本發明之精神和 範圍内所作之任何變化與修改， 勺屬於本發明之保護範 圍。 【圖式簡單說明】 第 1 圖：依據本發明之—且體眘#办, 遐貫鉍例，一種複合金 屬導電粒子之製作方法流㈣。 第2A至2E圖：依據本發明之—且 八體實施例，該複合金屬 導電粒子之製作方法 【主要元件符號說明】 去之截面-意圖。 U提供-鍵槽裝置，該錄槽裝置係包含有_第一The scope of protection of the present invention is subject to the definition of the patent application scope of <* &Tian Tian You's attached to the patent application. Anyone skilled in the art will be able to do so without departing from the spirit and scope of the present invention. Any changes and modifications made by the spoons are within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart of a method for producing a composite metal conductive particle according to the present invention, and a method for producing a composite metal conductive particle (4). 2A to 2E: a method for producing the composite metal conductive particles according to the present invention - and an eight-body embodiment. [Main element symbol description] The cross-section is intended. U provides a keyway device, the recording device includes _first
一設置於該第一槽體内之第二 B 糟體及一可驅$ 二槽體之旋轉器 ^動该第 12置入複數個銅粒子於該第二槽體内 13 加入一酸性溶液於該第一槽體内 14 移除該酸性溶液 9 進行—第一次清洗步驟，复係 槽體内 ，、係加入一清洗液於該第一 加入一含錫酸性溶液於該 複合金屬導電粒+ 槽體内’以形成複數個 金屬導電粒子進行-第二次清洗步驟 :::r金屬導電粒子進行-乾燥步驟 第—槽體 120 ® -战 r ^ 第一槽體 121濾孔 140茂水閥 複合金屬導電粒子 鋼粒子 220錫包覆層 酸性溶液1清洗液 SA含錫酸性溶液a second B body disposed in the first tank body and a rotator capable of driving the two tanks to move the 12th copper particles into the second tank 13 to add an acidic solution The first tank 14 removes the acidic solution 9 for the first cleaning step, and the complex is filled with a cleaning liquid to add a tin-containing acidic solution to the composite metal conductive particles + The tank body is formed by forming a plurality of metal conductive particles - the second cleaning step:::r metal conductive particles are carried out - drying step - the tank body 120 ® - war r ^ first tank body 121 filter hole 140 water valve Composite metal conductive particle steel particles 220 tin coating acidic solution 1 cleaning solution SA tin-containing acidic solution