1353327 2〇ii年8月yf日修正替換頁 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種晶圓承載裝置之承載盒，特別是有關於一種 可堆疊式的晶圓承載裝置之承載盒，用以確保複數個晶圓承載裝置之 承載盒相互堆疊時之穩固性，避免不必要的偏移導致承載盒内之容置 物受損。 【先前技術】 半導體晶圓在製造程序中會有許多的程序或步驟，而晶圓則會因 ^些程序或步驟，需要置放於不同的位置以及不同的機n中，因此於 製程中日a圓必須從-處運送至另―處，甚至必須儲存_段時間，以配 :/、要的程。其中，晶圓承載裝置(Cassette)同時具備儲存及運送功 月《〇亚且*朗於各麵式的運輪及傳送裝置，耻在半導體晶圓在 製造程序中扮演了極為重要的角色。 晶圓極為脆弱與昂#，因此在運送晶圓或將其置放於一般空 ^送^必須連同晶圓承載裝置i運送並儲存，而目前最為普遍 同搬運、奴2Γ81承舰置放置於承載盒當中，連_載盒一 而，為料免晶圓片裸露於外輕間中而受污染。然 因此確保堆間，通^縣承齡以堆㈣方式處理， 金内之物，並且避免不必要的偏移導致承載 又知’極為相當重要的課題之一。 【發明内容】 目的在於提供一種晶圓承載裝 疊式 為了解决上述問題，本發明之主要 置之承載盒，复 今知土I ------- 土日日_枣 皿、具有L型限制件以及L型腳邱，w^ 的晶圓承载裝置之承載盒。 i腳和以形成-種可堆 本發明之另— 要目的在於提供—種晶圓承載裝置之承栽盒，藉 4 =L魏__ L _敎配置，可用:^^替換承頁 載裝置之承載盒相互堆疊時之穩雌，避免不 :圓承 内之容置物受損。 ㈣偏料致承載盒 上^發Γ又—主要目的靖供—細承㈣之承載盒，其 體ίΓ 空間較τ蓋體之第二容置空間為大，因此可將下蓋 需佔用 之空間 一於上蓋體之容置空間中，以降低存放間置之承載盒時所， 本發明之再一主要目 具有一對把手設於上蓋體 本發明之還有一主要 其下蓋體具有一對限制墊 載盒内之容置物。 的在於提供-種晶圓承餘置之承載盒，其 ，以提供拿持承載盒之便利性。 目的在於提供一種晶圓承載裝置之承載盒， 、頂持結構以及爾墊’藉此可協助固定承 括_=上述目的’本發明提供—種晶圓承載裝置之承載盒，包 蓋體容置_之上蓋體及—具有第二容置空間之下蓋體，上 蕞* 各具有一外表面與一内表面，上蓋體之外表面具有-頂 成及I盍體之外表面具有-錢部分，上蓋體與下蓋體蓋合後形 二谷置空間，且上蓋體之頂蓋部分與下蓋體之底蓋部分為相對 :’其中承載盒之特徵在於：上蓋體之外表面之頂蓋部分具有至少一 八呈里限制件且㊉於頂蓋部分之肢，以及下蓋體之外表面之底蓋部 :具有至少_對L型腳部錢於底蓋部分之相對兩側邊，以形成一種 ^堆^的晶圓承餘置之承載盒^當複數個晶圓承載裝置之承載盒 ^隹且時’義L型限制件與l型腳部之配合’可用以確保承載盒 且時之穩m性’避免不必要的偏料致承載盒狀容置物受損。 【實施方式】 由於本發明係揭露—種晶圓承載裝置之承載盒，特別是一種可堆 且式的晶圓承截择^ Λ 秋段置之承載盒’用以確保複數個晶圓承載裝置之承载 1353327 2011年8月允日修正替換頁 盒相互堆S時之綱性。由於’本發明所利用到的—些晶圓或晶圓承 载裝置之詳細製造或處理過程，係利用現有技術來達成，故在下述說 明中’並不作完整描述。而且下述内文中之圖式，亦並未依據實際之 相關尺寸完整繪製，其作用僅在表達與本發明特徵有關之示意圖。 請參考第1A圖，其係根據本發明之晶圓承载裝置之承載盒之一較 佳貫施例不意圖。如第U圖所示，一種晶圓承載裝置之承載盒i，包 括”有第夺置工間之上蓋體1〇及一具有第二容置空間之下蓋體 20,上蓋體Π)與下蓋體20各具有—外表面内表面12 22, 如第2A圖與第2B圖所示，上蓋體外表面η具有-頂蓋部分13，下 盍體外表面21具有-底蓋部分23，請繼續參考第1Α圖，上蓋體1〇 與下，體20蓋合後形成—第三容置空間，且上蓋體1()之頂蓋部分η 與下盍體20之底蓋部分23為相對應，其中承載盒】之特徵在於：上 ^體外表面η之頂蓋部分13具有至少一對L型限制件14，且此對l 之轉13之肢，或者叫糾分丨3之角落為中 工’、可以及下蓋體外表面21之底蓋部分23具有至 二:對=其快物^L侧24，總_設於底蓋部 23 ^ I成-種可堆疊式的·減裝置之林盒i。 之第二ί置ΐ門^考第3圖’上蓋體10之第—容置空間較下蓋體20 於上蓋體ω:置不使用時，可將下蓋體20收納 空間；請參考第2A; a1時所需佔用之 於上蓋料表面h 承餘置之承妓1具有—她手15設 請繼續參料2AHW，哺供讀承处1之便利性； 13具有日日日晴版嫩1之上蓋_蓋部分 呆、、·。構16係由上蓋體外表面u向上蓋體内表面12 2011年8月日修正替換頁 ° Q入’因此可避免上下蓋體之蓋合方向之錯誤，又倘若於下蓋體 20 *之第二容置空間置人_晶圓承載裝置(如第5圖所示)後上下蓋體 〇蓋σ方向有誤’獅呆結構16會與配置於盒體内之晶圓承載裝置相 互牴觸’藉此可形成-防呆之機制；接著，請繼續參考第1Β圖，晶圓 ，載裝置之承載盒1上蓋體1G蓋緣之—側邊具有—咬合缺口 ％，下 篕體20魏之—侧邊具有_咬合㈣17b，且咬合細w與咬合凸 部17b為大致對應，因此亦可避免上下蓋體之蓋合方向錯誤形成一 防呆之機制；接著請參考第2B圖，晶圓承載裝置之承載盒i具有至少 一對限制墊25設於下蓋體内表面22之—相對側壁上，其中限制塾25 係從側壁延伸至底蓋部分23,此限制墊25大致為一多邊型立方體且且 有至少-斜面251，藉此可協_定承載盒丨内之容置物；請繼續辦 第2B圖’晶圓承載裝置之承載盒丨具有至少一對第一頂持片施同設 於下蓋體内表面22之-側壁上，且此對第一頂持片加之兩側邊分別 與側壁以及底蓋部分23相連接’此外，更可於每個第一頂持片％之 一侧邊增設-第二頂持片26b，且第二頂持片挪直交於第一頂持片 26a ’錯此可形成一頂持結構26以協助固定承載盒】内之容置物；請繼 續參考第2B圖’晶圓承載裝置之承载盒i具有至少一頂持塾27設於 下蓋體内表面22之-側壁上，並且與成對之頂持結構％相對應，亦 具有協助頂持並固定承載盒1内的容置物之效。 首先’明參考第4八圖，其係根據本發明之晶圓承載裝置之承載各 堆疊方式之-較佳實施例示意圖。如第4A _示，_ l型_件 示於圖中)配置於上蓋體1G之頂蓋部分13的喃㈣，_ l型聊部 24配置於下蓋體20之底蓋部分23的四個角落，且由四個l型腳部μ 所圍成之區域略大於四個L型限制件14所圍成之區域，藉此將複數個 晶圓承載裝置之承載盒丨相互堆疊時，L型腳部24會受l型限制件Μ 之限制，使得晶®承載裝置之承載盒丨不易產生偏移。此外，要強調 2011年8月γϊ-曰修正替換頁 的是’本發明係以”L型”作為限制件及腳部 ，然而，其僅為一實施例’ 並非用以限制本發明；故只要配置於上蓋體1()之頂蓋部分Η之限制 及配置於下蓋體2〇之底蓋部分23之腳部能夠配對地組合，而能使 '圓承載裝置之承載盒！不易產生偏移之功能者均為本發明之實 施方式’例如·限制件及卿可以是半卿之設計，其也可以是圓形 或方形柱狀體設計等。 、接著’凊參考第4B圖’其係根據本發明之晶圓承載裂置之承載盒 堆^:方式之另-較佳實施例示意圖。如第4B圖所示，四個l型限制件 ，於上蓋體之頂蓋部分13的四個肖落，四個L ^腳部24配置 ;了蓋體2G之底蓋部分23的四個角落，且由四個L型腳部24所圍成 品域略】於四個L型限制件14所圍成之區域，藉此將複數個晶圓承 載裝置之承載盒1相互雄疊時，L型腳部24會受L型限制件14之限 制’使得晶圓承载裝置之承載盒i不易產生偏移^此外，與前述之實 施例相同，在此要強調的是，本發明係以，，[型，，作為限制件及腳部，然 而’ f僅為—實施例，並非用以限制本發明；故只要配置於上蓋體10 之頂盍部分13之限制件及配置於下蓋體2()之底蓋部分23之腳部能夠 而能使得晶圓承載裝置之承載盒i不易產生偏移之功能 ▲者’均為本發明之實財式；例如：關件及腳部可叹半圓形之設 °十，其也可以是圓形或方形柱狀體設計等。 t之:參二!叫其係根據本發明之晶圓承載裝置之承載盒堆疊方 意圓°如第％瞭，上蓋㈣蓋部分13 配置四個L型限制件14，下蓋體2〇之四個卿上各 ㈣，且這些L型槽部28係以底蓋部分23之角落為 =槽 L中，错此L型_件14會與L型槽部μ相 使付晶@承餘置之承载盒丨不易產生偏移H要強糊是，本 發明位、” 2〇u年8B>r日修正替換頁 阼，〃、L型作為限制件及槽部，然而，其僅為一實施例，並非用以 :制亡發明；故只要配置於上蓋體丨。之頂蓋部分13之限制件及配置 =下=體2G之聊部之槽部能夠配對地組合，而能使得晶圓承載裝置之 不易產生偏移之功能者，均為本發明之實施方式；例如：限 ^件及槽部可以是半®形之設計’其也可以是圓形或方雜狀體設計 等。1353327 〇 8 8 y 修正 修正 修正 六 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六 六The carrying case of the device is used to ensure the stability of the stacking boxes of the plurality of wafer carrying devices when they are stacked on each other, and avoid unnecessary displacement to damage the contents in the carrying case. [Prior Art] There are many procedures or steps in the manufacturing process of a semiconductor wafer, and the wafers need to be placed in different locations and in different machines due to some programs or steps. The a circle must be transported from - to another, and even must be stored for a period of time to match: /, the required course. Among them, the wafer carrier (Cassette) also has the storage and transportation of the power of the "Yu Ya and * lang face" of the wheels and conveyors, shame in the semiconductor wafer plays a very important role in the manufacturing process. Wafers are extremely fragile and expensive. Therefore, when transporting wafers or placing them in general air, they must be transported and stored together with the wafer carrier i. At present, it is most common to carry and transport slaves. Among the boxes, even the _ cassette is used to prevent the wafer from being exposed to the outside light and contaminated. Therefore, it is therefore one of the most important topics to ensure that the piles are treated in a pile (fourth) manner, and that the contents of the gold are protected by unnecessary displacements. SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer carrier stacking type in order to solve the above problems, and the main carrier of the present invention, the present invention I------- soil day _ jujube dish, with L-shaped restrictions And the L-shaped foot Qiu, w^ the carrying case of the wafer carrier. i foot and to form a stack of the invention - the purpose of the invention is to provide a wafer carrier carrying box, by 4 = L Wei __ L _ 敎 configuration, available: ^ ^ replace the page carrier When the carrying boxes are stacked on each other, the female is stable, avoiding the damage of the contents of the round bearing. (4) The biasing material causes the bearing box to be Γ Γ — — 主要 主要 主要 主要 主要 主要 主要 主要 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四In the accommodating space of the upper cover body, in order to reduce the storage box of the storage compartment, another main object of the present invention is to have a pair of handles disposed on the upper cover body. Another aspect of the present invention is that the lower cover body has a pair of restrictions. The contents of the pad carrier. It is to provide a carrier-receiving carrying case for providing the convenience of holding the carrying case. The object of the present invention is to provide a carrying case for a wafer carrying device, a holding structure and a pad, thereby assisting in fixing the carrier _= the above purpose. The present invention provides a carrying case for a wafer carrying device, and the cover body is accommodated. The upper cover body and the cover body having the second accommodating space, the upper cymbals* each have an outer surface and an inner surface, and the outer surface of the upper cover body has a top portion and an outer surface of the 盍 body has a money portion The upper cover body and the lower cover body are combined to form a space for the two valleys, and the top cover portion of the upper cover body is opposite to the bottom cover portion of the lower cover body: 'where the carrying case is characterized by: a top cover of the outer surface of the upper cover body a bottom cover portion having at least one eight-inward restraining member and ten on the top cover portion, and an outer cover portion of the lower cover body having at least _ pairs of L-shaped feet on opposite sides of the bottom cover portion Forming a stack of wafer bearing housings, when a plurality of wafer carrying devices are carried, and the 'L-shaped limiting members and the l-shaped legs are matched' to ensure that the carrying case is timely The stability of the 'must' avoid unnecessary damage to the carrier-like contents. [Embodiment] Since the present invention discloses a carrier of a wafer carrier device, in particular, a stackable wafer carrier can be used to ensure a plurality of wafer carrier devices. Carrying 1353327 In August 2011, the date of the replacement of the page boxes to each other is corrected. Since the detailed fabrication or processing of the wafer or wafer carrier used in the present invention is achieved by the prior art, it is not fully described in the following description. Moreover, the drawings in the following texts are not completely drawn in accordance with actual relevant dimensions, and their function is only to show a schematic diagram relating to the features of the present invention. Please refer to Fig. 1A, which is a preferred embodiment of the carrier of the wafer carrying device according to the present invention. As shown in FIG. U, a carrying case i of a wafer carrying device includes: a first cover upper cover body 1 and a second receiving space lower cover body 20, an upper cover body) and a lower The cover bodies 20 each have an outer surface inner surface 1222. As shown in Figures 2A and 2B, the outer cover outer surface η has a top cover portion 13 and the lower outer surface 21 has a bottom cover portion 23, please continue to refer to In the first drawing, the upper cover body 1 〇 and the lower body 20 are closed to form a third accommodating space, and the top cover portion η of the upper cover body 1 () corresponds to the bottom cover portion 23 of the lower squat body 20, wherein The carrying case is characterized in that: the top cover portion 13 of the upper outer surface η has at least one pair of L-shaped restricting members 14, and the limb of the turn 13 of the pair l, or the corner of the entangled 丨 3 is a middle worker', The bottom cover portion 23 of the outer cover outer surface 21 may have two to two: right = its fast object ^L side 24, and the total _ is provided in the bottom cover portion 23 ^ I into a stackable type The second ΐ ΐ ^ ^ ^ 3rd drawing 'the upper cover 10' - the accommodating space is lower than the lower cover 20 in the upper cover ω: when not in use, the lower cover 20 can accommodate the space; please refer to 2 A; a1 need to occupy the surface of the upper cover h bearing the remaining bearing 具有 has - her hand 15 set please continue to feed 2AHW, feeding the convenience of reading the seat 1; 13 with the sun and the sun 1The upper cover_cover part is staying, and the structure 16 is made up of the outer surface of the upper cover u to the inner surface of the cover body. 12 August 2011 correction replacement page ° Q into 'so avoiding the error of the cover direction of the upper and lower covers, In addition, if the second accommodating space of the lower cover 20* is placed on the _ wafer carrying device (as shown in FIG. 5), the slanting direction of the upper and lower covers is incorrect. The lion stay structure 16 is disposed in the box. The inside of the wafer carrying device touches each other', thereby forming a mechanism of preventing the fool; then, referring to the first drawing, the wafer, the carrying case 1 of the carrying device 1 has a cover edge - the side has a occlusion The notch %, the lower body 20 Wei - the side has a _ occlusion (four) 17b, and the nip k is substantially corresponding to the nip convex portion 17b, so that the cover direction of the upper and lower covers can be prevented from erroneously forming a foolproof mechanism; Referring to FIG. 2B, the carrier cassette i of the wafer carrier has at least one pair of restriction pads 25 disposed on the inner surface of the lower cover 2 2 - on the opposite side wall, wherein the restriction 塾 25 extends from the side wall to the bottom cover portion 23, the restriction pad 25 is substantially a polygonal cube and has at least a slope 251, thereby being able to coordinate the carrying case容 容 容 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; The two sides are respectively connected to the side wall and the bottom cover portion 23. In addition, a second top piece 26b can be added to one side of each of the first top pieces, and the second top piece is straightened. In the first top holding piece 26a', a holding structure 26 can be formed to assist in fixing the contents of the carrying case; please refer to FIG. 2B. The carrying case of the wafer carrying device has at least one holding frame. It is disposed on the side wall of the inner surface 22 of the lower cover and corresponds to the paired holding structure %, and has the effect of assisting in holding and fixing the contents in the carrying case 1. First, reference is made to Fig. 4, which is a schematic view of a preferred embodiment of a stacking device for carrying a wafer carrier according to the present invention. 4A _, _ l type _ is shown in the figure) four (four) disposed on the top cover portion 13 of the upper cover 1G, and the _ l type chat portion 24 is disposed on the bottom cover portion 23 of the lower cover 20 The corner, and the area surrounded by the four l-shaped feet μ is slightly larger than the area surrounded by the four L-shaped limiting members 14, thereby stacking the carrier cassettes of the plurality of wafer carrying devices, L-shaped The foot 24 is limited by the type 1 restraint , such that the carrier cassette of the Crystal® carrier is less prone to offset. In addition, it is emphasized that the γ ϊ 曰 曰 替换 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 The restriction of the top cover portion 配置 disposed on the upper cover 1 () and the foot portion of the bottom cover portion 23 disposed on the lower cover 2 can be combined in a paired manner to enable the carrying case of the circular carrying device! The function that is less prone to offset is an embodiment of the present invention. For example, the restriction member and the clerk may be of a semi-clear design, and may be a circular or square columnar design or the like. And then, referring to FIG. 4B, which is a schematic view of another embodiment of the carrier carrying stack of the wafer carrying crack according to the present invention. As shown in Fig. 4B, four l-shaped limiting members are disposed on the four sides of the top cover portion 13 of the upper cover body, four L^foot portions 24; and four corners of the bottom cover portion 23 of the cover body 2G. And the area surrounded by the four L-shaped legs 24 is slightly in the area surrounded by the four L-shaped limiting members 14, thereby juxtaping the carrier boxes 1 of the plurality of wafer carrying devices with each other, L-shaped The leg portion 24 is limited by the L-shaped restriction member 14 so that the carrier case i of the wafer carrier device is less likely to be offset. Further, as in the previous embodiment, it is emphasized that the present invention is, [ Type, as a restriction member and a foot portion, however, 'f is only an embodiment, and is not intended to limit the present invention; therefore, it is only required to be disposed on the top cover portion 13 of the upper cover body 10 and disposed on the lower cover body 2 () The foot portion of the bottom cover portion 23 can make the carrying case of the wafer carrier device less prone to the offset function. The ones are all of the real financial formula of the present invention; for example, the closed part and the foot are sighed semicircular It is set to ten, which can also be a circular or square column design. t: 参二! It is said that the stacking of the carrying case of the wafer carrying device according to the present invention is as shown in the first part, and the upper cover (four) cover portion 13 is provided with four L-shaped limiting members 14, and the lower cover 2 is Each of the four L-shaped groove portions 28 has the corner of the bottom cover portion 23 as the groove L. In the wrong case, the L-shaped member 14 will be phased with the L-shaped groove portion μ. The carrying case 丨 is not easy to produce offset H. It is strong to paste, and the present invention is a "replacement" page, "〃2, L, L type as a limiting member and a groove portion, however, it is only one implementation. For example, it is not used for: the invention of the death; therefore, it can be arranged in the upper cover body. The restriction member of the top cover portion 13 and the groove portion of the configuration = lower = body 2G can be matched in a paired manner, so that the wafer can be carried The function of the device which is not easy to produce offset is an embodiment of the present invention; for example, the limiting member and the groove portion may be a semi-shaped design 'which may also be a circular or square-shaped body design or the like.
明參考第4D圖，其係根據本發明之晶圓承載裝置之承載盒堆疊方 =再-較佳實施例示意圖。如第4D圖所示，上蓋體外表面u之頂 盖部分^具有至少一對L型槽部28，且設於頂蓋部分13之角落，或 者以=蓋部分13之角落為中心成對配置之方式亦可，下蓋體外表面a 之底盍部分23具有至少-對L型關件24，且設於絲部分23之角 洛’或者以底蓋部分23之角落為中心成對配置之方式亦可，當複數個 晶圓承載裝置之承載盒i相互堆疊時，L型限制件24可嵌入l型槽部 28中’藉此L型限制件24會與L型槽部28相互干涉限制，使得晶圓 承載裝置之域盒丨不易產生偏移。在此，要_的是，本發明係以”L 型”作為限·及槽部’細’其僅為―實施例，並非肋關本發明. 故只要配胁上蓋體H)之了膨卩分13之_舰置於下蓋體2〇之腳 部之限制件能夠配對地組合，缝使得晶圓承絲置之承載盒丨 產生偏移之功能者，均為本發明之實施方式；例如：_件^槽部可 以是半圓形之設計，其也可以是圓形或方形柱狀體設計等。 根據上述’請參考第3 ®，上蓋體1〇之第—容置空間較下蓋體2〇 之第二容置空間為大，因此當承載盒i不使料，可將下蓋體2〇 _ 於上蓋體10之容置空财，崎低存放間置之承载盒丨時所需之 空間；請參考第2A圖，晶圓承載裝置之承載盒i具有一對把手& 於上蓋體外表面u之-相對側壁上，以提供拿持承载盒ι之 设 請繼續參考第2A ，晶圓承載裝置之承載盒！之上蓋體的頂蓋部分 9 1353327 13具有-防呆結構16 2叫年日修正替_ 有一落差高度，防呆結構16係2蓋體之;^_分13之平面具 方❹入m l |餒外表面11向上蓋體内表面12 方如入，因此可避免上下蓋體之蓋合方向之錯誤 2〇之第二容置空間置入-晶圓承載裝置(如第5圖所示)後，= 川、如蓋合樹誤，義結構16會與配置於讀 f门目互藉此可形成一防呆之機制；接著，請繼續參考第1B圖 甜圓承載裝置之賴盒1上蓋體1G蓋緣之—姆 一 二下/體20蓋緣之一側邊具有-咬合凸部17b，且咬合缺二:： =\為/峨’因此亦可避免上彻之蓋合方向錯誤，、 請參考第2B圖，晶圓承載裝置之承載盒1具 制墊/限制墊25設於下蓋體内表面22之一相對侧壁上，其中限 =25雜侧壁延伸至底蓋部分23，__大致為—多邊型立 斜面251，藉此可協助㈣承载盒1内之容置物；請 繼、戈參考第2B圖，晶圓承載裝置之承载盒i具有至少一對第一 =同設於下蓋體絲面22之—側壁上，且此對第—頂持片％ 側邊为別與側壁以及底蓋部分23相連接，此外，更可於每個第一 片浪之-側邊增設-第二頂持片施，且第二頂持片施直交於第丄 頂持片26a，藉此可形成一頂持結構26以協助固定承載盒i内之容置 物；請繼續參考第沈圖’晶圓承載裝置之承載盒i具有至少一頂持墊 27設於下碰《面22之―_上，纽域狀爾結構％相對 應，亦具有協助頂持並固定承載盒丨内的容置物之效。 根據上述第1A圖至第4D圖所揭露之内容，置於 承綠i内之容置物係為-晶圓承載裝置3，纽置於下蓋體如之^ -谷置空間中’如第5圖所示。其中，此晶圓承載裝置3係由四個面 所組成之矩形容置空間，且此矩形容置空間具有—上開〇 31及一相對 之下開口 32 ’矩形容置空間之—對相對面由複數個間隔地排列並相對 1353327 2〇11年8月外 地對齊之肋33所形成，且麟相對面之下半部係以—曲率向内、頁 在複數個肋33的終端形成垂直斷面34，使得矩形容置空間折並 31之開口大於下開口 32，而與此對相對面相連接之一側口 35，而與此對相對面相連接之另一側邊則形成_h型連接辞構％才面 時之承載盒^下蓋體加 時，下盍體20之-對限制塾25的斜面251與晶圓承载裝置& 相對面的垂直斷面34可相互配合；下蓋體2G之雜結⑽則與 承載裝置3之綱面35可相互配合；下蓋體2()之頂雜心曰：Referring to FIG. 4D, which is a schematic diagram of a stack of carrier cassettes of a wafer carrier according to the present invention. As shown in FIG. 4D, the top cover portion of the outer surface u of the upper cover has at least one pair of L-shaped groove portions 28, and is disposed at a corner of the top cover portion 13, or is disposed in pairs with the corner of the cover portion 13 as a center. Alternatively, the bottom portion 23 of the outer surface a of the lower cover has at least a pair of L-shaped members 24, and is disposed at a corner of the wire portion 23 or in a manner of being paired with the corner of the bottom cover portion 23 as a center. Alternatively, when the carrier boxes i of the plurality of wafer carrier devices are stacked on each other, the L-shaped restriction member 24 may be embedded in the L-shaped groove portion 28, whereby the L-shaped restriction member 24 may interfere with the L-shaped groove portion 28 to each other, so that The domain cassette of the wafer carrier is less prone to offset. Here, it is to be noted that the present invention is limited to "L type" and that the groove portion is 'thin'. It is only an "embodiment" and is not a rib joint. Therefore, as long as the upper cover H) is expanded The restriction that the ship is placed on the foot of the lower cover 2 can be matched in pairs, and the function of the slit to cause the carrier of the wafer to be offset is the embodiment of the present invention; for example; The :_piece groove portion may be a semicircular design, which may also be a circular or square columnar body design or the like. According to the above, please refer to the 3rd, the upper cover 1〇-the accommodating space is larger than the second accommodating space of the lower cover 2〇, so when the carrying case i is not made, the lower cover 2〇 _ The space of the upper cover 10 is empty, and the space required for the storage case of the storage compartment is low; please refer to FIG. 2A, the carrying case of the wafer carrier has a pair of handles & u - on the opposite side of the wall, in order to provide the holding of the carrying box ι please continue to refer to the 2A, the carrier of the wafer carrier device! The top cover portion 9 1353327 13 of the upper cover body has a foolproof structure 16 2 called a year correction _ there is a drop height, the foolproof structure 16 is a 2 cover body; ^ _ 13 planes square into the ml | The outer surface 11 is inserted into the inner surface 12 of the upper cover, so that the second cover space of the upper and lower covers is prevented from being inserted into the wafer receiving device (as shown in FIG. 5). = Chuan, such as the cover tree error, the structure of the structure 16 and the configuration of the f door to each other can form a foolproof mechanism; then, please continue to refer to the 1B Figure sweet circle carrier device 1 cover 1G The edge of the cover - one of the two lower / one of the cover edge of the body 20 has a occlusal convex portion 17b, and the bite is missing two:: = \ is / 峨 ', therefore, it is also possible to avoid the wrong direction of the cover, please Referring to FIG. 2B, the carrier cassette 1 of the wafer carrier device has a pad/restriction pad 25 disposed on one of the opposite side walls of the inner surface 22 of the lower cover, wherein the limit=25 miscellaneous side wall extends to the bottom cover portion 23, _ _ roughly - a polygonal standing bevel 251, thereby assisting (4) the contents of the carrying case 1; please refer to Figure 2B, the carrying case of the wafer carrying device has A pair of first ones are disposed on the side wall of the lower cover body surface 22, and the pair of top-side holding pieces % side are connected to the side wall and the bottom cover portion 23, and more preferably The first piece of the wave-side is additionally provided - the second top piece is applied, and the second top piece is applied directly to the top holding piece 26a, whereby a holding structure 26 can be formed to assist in fixing the inside of the carrying case i容 容 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Hold and fix the contents of the carrying case inside the cassette. According to the content disclosed in the above 1A to 4D, the contents placed in the green i are the wafer carrier device 3, and the button is placed in the lower cover body as in the space of the valley. The figure shows. The wafer carrier device 3 is a rectangular accommodating space composed of four faces, and the rectangular accommodating space has an upper opening 31 and a opposite opening 32 ′ rectangular receiving space—opposite surface Formed by a plurality of ribs 33 spaced apart from each other and aligned with respect to the exterior of 1353327 2 〇 11 August, and the lower half of the opposite side of the lining is formed with a curvature inward, and the page forms a vertical section at the end of the plurality of ribs 33 34, the opening of the rectangular accommodating space fold 31 is larger than the lower opening 32, and the opposite side is connected with one side port 35, and the other side connected with the opposite side forms a _h type connection structure When the lower cover body is added, the lower cover 20 of the lower jaw 20 can be matched with the vertical section 34 of the opposite side of the wafer carrying device & the lower cover 2G The hybrid knot (10) can cooperate with the surface 35 of the carrying device 3; the top cover of the lower cover 2 () is:
載，3之Η型連接結構36接近下開口 32處可相互配合。藉二二 使阳圓承載裝置3穩固放置於晶圓承載裝置之承載盒工當中。3 ¥佳=:第二圖’其係根據本發明之晶圓承载裝置之承载盒之另- =圖。如第6圖所示，晶圓承載裝置之承載盒 具有第-容置空間之上蓋體1〇及 ⑽ 蓋體10與下蓋體20各且右Μ 1之下蓋體20，上 妒… 卜表面1卜21與—内表面12、22，上蓋 體外表面11具有-頂蓋部分13,下蓋體 上蓋 上蓋體10與下蓋體20蓋合_成第_ 1具有一底蓋部分23， 掌加\ 曼瓜成一第二容置空間，且上蓋體10夕Τ5 !：^ 13 , ^12 在於：下蓋體内表面22之角·, 取戰瓜1之特徵 個第二支撑㈣，或可於^=第，件41與至少— 個第-支严#之斜對角之角落配置至少一 二支擇件42之-侧邊二各==件幻’且於第一支榡件41與第 置3之垂直斷面34，而第—支揮件41 以支挣晶圓承載裝 似、423呈相對排列狀。 -第—支揮件42上之兩個斜板 支二與=’ 細與第二 基座.係由四個框 :φ第一支標件41具有一基錢，此 體所.·且成，其中三働體大致呈矩形，而一個框體 11 1353327 2011年8月巧曰修正替換頁 則大致呈L型’基座411之一側邊具有至少一第一 L型辅助件412以 及一第二輔助件413，第一 L型輔助件412係以一端412a與基座4ί1 相連接，第二輔助件413係以一端413a延伸自基座411之一側邊並與 基座411直交，此第二輔助件413之一端4Da與基座411相連接之一 側邊包覆支撑晶圓轉裝置3之底部，以避免晶圓承載裝置3滑動， 斜板414係由基座411與第二辅助件413相接處之一侧邊向基座4ιι 之上方延伸，而第-支禮件41之基座411兩相對側邊之斜對角處各具 有一疋位凸點415 ;如第7B圖所示，第二支撐件42具有一基座421， 此基座421係由四個框體所組成，而此四個框體大致呈矩形，基座421 之-側邊具有至少- L型輔助件422，L型輔助件422係以一側壁422& _ 與基座421相連接’其可包覆支擇晶圓承載裝置3之底部，以避免晶 圓承載裝置3滑動，且於l型輔助件422之另一側壁概垂直延伸Z · 抵持板424，斜板423係由基座421與L型辅助件422側壁422a之相 、 接處向基座421之上方延伸，而第二支樓件42之基座421兩相鄰側邊 之端角處各具有-定位凸點425。此外，第一支揮件41與第二支撑件 42係由一體成型的方式所製成。 又根據前述實施例中之說明，請參考帛2B冑，晶圓承載裝置之承 載盒1具有至少一對限制塾25設於下蓋體内表面22之一相對側壁上， 其中限制墊25係從側壁延伸至底蓋部分23，此限制塾25大致為一多 邊型立方體且具有至少—斜面251，接著請參考第8圖，於與成對限= 墊25之斜面251相鄰的兩側面上設有至少一對定位孔252 ;請繼續參 2第2B圖’晶圓承載裝置之承載盒！具有至少一對第一頂持片^同 設於下蓋體内表面22之-側壁上’且此對第一頂持片加之兩側邊分 別與側壁以及底蓋部分23相連接，此外，更可於每個第—頂持片％ 之-側邊增設-第二頂持片26b，且第二頂持片挪直交於第—頂a 26a’接者請參考第8圖’於第一頂持片％與下蓋體内表面η相鄰處 12 1353327 一側之内表面22上設有至少—對定位孔252。2G11年8月情正替換頁 曰第6議9圖，第—支撑件41與第二支撐件42配設於 曰曰圓承載裝置之承餘1下蓋體内表面22之角落，第__支撐件41各The three-way type connection structure 36 can be fitted to each other near the lower opening 32. The male circular carrying device 3 is stably placed in the carrying case of the wafer carrying device by means of two or two. 3 佳 =: The second figure ' is another -= diagram of the carrying case of the wafer carrying device according to the present invention. As shown in FIG. 6, the carrying case of the wafer carrying device has a first-accommodating space upper cover body 1 and (10) a cover body 10 and a lower cover body 20, and a right-hand side 1 lower cover body 20, the upper cover... The surface 1b 21 and the inner surface 12, 22, the outer cover outer surface 11 has a top cover portion 13, and the lower cover upper cover upper cover 10 and the lower cover 20 cover _ into the first _ 1 has a bottom cover portion 23, palm Add \ Mangua into a second accommodating space, and the upper cover 10 Τ Τ 5!: ^ 13 , ^12 lies in: the corner of the inner surface 22 of the lower cover ·, the second support (four) of the characteristics of the war melon 1 At the corners of the diagonally opposite corners of the member 41 and the at least one of the first and the second, the at least one of the two selected members 42 is disposed at the side of the second side of the member 41. The vertical section 34 of the third portion is disposed, and the first-supporting member 41 is supported by the wafer, and the 423 is arranged in a relatively aligned manner. - the first sloping plate on the first member 42 and the second pedestal. The frame is composed of four frames: φ the first standard member 41 has a base money, and the body is Wherein the three-body body is substantially rectangular, and one frame 11 1353327 August 2011, the modified replacement page is substantially L-shaped. One side of the base 411 has at least one first L-shaped auxiliary member 412 and a first The second auxiliary member 413 has a first L-shaped auxiliary member 412 connected to the base 4ί1 at one end 412a, and the second auxiliary member 413 extends from one side of the base 411 and is orthogonal to the base 411 at one end 413a. One side of the second auxiliary member 413 is connected to the base 411 to cover the bottom of the wafer transposing device 3 to prevent the wafer carrier 3 from sliding. The swash plate 414 is composed of the base 411 and the second auxiliary member. One side of the 413 junction extends to the top of the pedestal 4 ιι, and the base 411 of the first yoke 41 has a slanting 415 at opposite sides of the opposite side; as shown in FIG. 7B The second support member 42 has a base 421 which is composed of four frames, and the four frames are substantially rectangular, and the sides of the base 421 have At least the L-shaped auxiliary member 422, the L-shaped auxiliary member 422 is connected to the base 421 by a side wall 422 & _ which can cover the bottom of the wafer carrier 3 to prevent the wafer carrier 3 from sliding. The other side wall of the l-type auxiliary member 422 extends substantially perpendicularly to the Z-holding plate 424. The slanting plate 423 extends from the base 421 and the side wall 422a of the L-shaped auxiliary member 422 to the upper side of the base 421. The base 421 of the second floor member 42 has a positioning bump 425 at each end corner of the adjacent side edges. Further, the first support member 41 and the second support member 42 are integrally formed. According to the description in the foregoing embodiment, please refer to FIG. 2B, the carrier cassette 1 of the wafer carrier has at least one pair of restricting fins 25 disposed on opposite sidewalls of the inner surface 22 of the lower cover, wherein the limiting pad 25 is The side wall extends to the bottom cover portion 23, the restricting turn 25 being substantially a polygonal cube and having at least a bevel 251, and then referring to Fig. 8, on both sides adjacent to the pair of limits = the slope 251 of the pad 25. At least one pair of positioning holes 252 are provided; please continue to refer to FIG. 2B's carrying case of the wafer carrier device! Having at least one pair of first top holding sheets disposed on the side wall of the lower cover inner surface 22 and the pair of first top holding sheets and the side edges are respectively connected to the side wall and the bottom cover portion 23, and furthermore, A second top piece 26b may be added to the side of each of the first top sheets, and the second top piece is straightened to the first top a 26a'. Please refer to FIG. 8 for the first top. The inner surface 22 of the side adjacent to the inner surface η of the lower cover is provided with at least a pair of positioning holes 252. 2G11, August, the replacement page 曰 6th, 9th, the first support 41 and the second support member 42 are disposed at the corner of the inner surface 22 of the lower cover 1 of the round bearing device, and the first support member 41
具有兩個定位凸點415，其—與限制墊25之定位孔M2相互嵌合，另 一則與内表面22之定位孔252相互嵌合，第二支撐件42亦各具有兩 個定位凸點425，其一與限制墊25之定位孔252相互嵌合另一則與 頂持墊27之定位孔(未示於圖中)相互嵌合，藉此可使得每-支標件皆 為兩點嵌合D定於晶圓承餘置之承載盒匕下蓋體Μ巾，此外以嵌 合固定之方紅能使第—支撐件W與第二支#件a輕易拆卸。 *以上所述僅為本發明之較佳實施例，並非用以限定本發明之權利 範圍；同時以上的描述，對於熟知本技術領域之專門人士應可明瞭及 實施，因此其他未脫離本發明所揭示之精神下所完成鱗效改變或修 飾，均應包含在本發明之申請專利範圍中。 【圖式簡單說明】 第1A圖係晶圓承載裝置之承載盒之示意圖。There are two positioning bumps 415, which are mutually engaged with the positioning holes M2 of the limiting pad 25, and the other is engaged with the positioning holes 252 of the inner surface 22, and the second supporting members 42 each have two positioning bumps 425. One of the fixing holes 252 of the limiting pad 25 is fitted to each other, and the positioning hole (not shown) of the top holding pad 27 is fitted to each other, thereby making each of the standard components have two-point fitting. D is set in the carrying case of the wafer bearing the lower cover body wipe, and the fitting and fixing square red can easily disassemble the first support member W and the second support member a. The above description is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; the above description should be understood and implemented by those skilled in the art, and thus the other embodiments are not deviated from the present invention. The squash effect modification or modification performed under the spirit of the disclosure should be included in the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic view of a carrier of a wafer carrier device.
第1B圖係晶圓承載裝置之承載盒之示意圖 第2A圖係晶圓承載裝置之承載盒之上蓋體之示意圖。 第2B圖係晶圓承載裝置之承載盒之下蓋體之示意圖。 第3圖係晶圓承載裝置之承載虹蓋體與下蓋體疊合之示意圖 第4A圖係晶圓承載裝置之承載盒堆疊方式之示意圖。 第4B圖係晶圓承載裝置之承載盒堆疊方式之示意圖。 第4C圖係晶圓承裁裝置之承載盒堆疊方式之示意圖。 第4D圖係晶圓承載震置之承載盒堆疊方式之示意圖。 第5圖係晶圓承載裴置之承載盒之爆炸圖。 第6圖係晶圓承載裝置之承載红下蓋體之示意圖。 第7A圖係晶圓承載裝置之第一支擇件之示意圖。 13 1353327 2011年8月τί日修正替換頁 第7Β圖係晶圓承載裝置之第二支撐件之示意圖。 第8圖係晶圓承載裝置之承載盒之下蓋體之示意圖。 第9圖係晶圓承載裝置之承載盒之爆炸圖。 【主要元件符號說明】 1 晶圓承載裝置之承載盒 10 上蓋體 11 上蓋體外表面 12 上蓋體内表面 13 頂蓋部分 14 L型限制件 15 把手 16 防呆結構 17a 咬合缺口 17b 咬合凸部 20 下蓋體 21 下蓋體外表面 22 下蓋體内表面 23 底蓋部分 24 L型腳部 25 限制墊 251 斜面 252 定位孔 26 頂持結構 26a 第一頂持片 26b 第二頂持片 27 頂持墊1B is a schematic view of a carrying case of a wafer carrying device. FIG. 2A is a schematic view of a cover body of a carrying case of a wafer carrying device. Figure 2B is a schematic view of the lower cover of the carrier of the wafer carrier. Fig. 3 is a schematic view showing the stacking of the bearing cover and the lower cover of the wafer carrying device. Fig. 4A is a schematic view showing the stacking manner of the carrying case of the wafer carrying device. FIG. 4B is a schematic diagram of a stacking manner of a carrying case of a wafer carrier device. FIG. 4C is a schematic diagram of a stacking manner of a carrying case of a wafer receiving device. The 4D figure is a schematic diagram of a stacking mode of a carrier carrying a wafer. Figure 5 is an exploded view of the carrier of the wafer carrying device. Figure 6 is a schematic view of a wafer carrying device carrying a red lower cover. Figure 7A is a schematic illustration of the first alternative of the wafer carrier. 13 1353327 August 2011 τί日修正 replacement page Figure 7 is a schematic diagram of the second support of the wafer carrier. Figure 8 is a schematic view of the lower cover of the carrying case of the wafer carrying device. Figure 9 is an exploded view of the carrier of the wafer carrier. [Main component symbol description] 1 wafer carrier device carrier case 10 upper cover body 11 upper cover outer surface 12 upper cover inner surface 13 top cover portion 14 L-shaped restriction member 15 handle 16 foolproof structure 17a occlusion notch 17b occlusion projection 20 under Cover body 21 Lower cover outer surface 22 Lower cover inner surface 23 Bottom cover portion 24 L-shaped foot portion 25 Limiting pad 251 Bevel 252 Positioning hole 26 Holding structure 26a First top piece 26b Second top piece 27 Top pad
14 1353327 2011年8月％曰修正替換頁14 1353327 August 2011%曰Replacement replacement page
28 L型槽部 3 晶圓承載裝置 31 上開口 32 下開口 33 肋 34 垂直斷面 35 封閉面 36 Η型連接結構 41 第一支撐件 411 基座 412 第一L型輔助件 412a 第一 L型輔助件之一端 413 第二輔助件 413a 第二輔助件之一端 414 斜板 415 定位凸點 42 第二支撐件 421 基座 422 L型輔助件 422a L型輔助件之一側壁 422b L型輔助件之另一側壁 423 斜板 424 抵持板 425 定位凸點 1528 L-shaped groove part 3 Wafer carrying device 31 Upper opening 32 Lower opening 33 Rib 34 Vertical section 35 Closed surface 36 Η-type connection structure 41 First support 411 Base 412 First L-shaped auxiliary part 412a First L-shaped One end of the auxiliary part 413 Second auxiliary part 413a One side end of the second auxiliary part 414 Slanting plate 415 Positioning bump 42 Second support piece 421 Base 422 L-shaped auxiliary piece 422a L-shaped auxiliary part one side wall 422b L-shaped auxiliary part The other side wall 423 slanting plate 424 abuts the plate 425 to locate the bump 15