[go: up one dir, main page]

TWI352099B - Conductive plastic composition - Google Patents

Conductive plastic composition Download PDF

Info

Publication number
TWI352099B
TWI352099B TW96131933A TW96131933A TWI352099B TW I352099 B TWI352099 B TW I352099B TW 96131933 A TW96131933 A TW 96131933A TW 96131933 A TW96131933 A TW 96131933A TW I352099 B TWI352099 B TW I352099B
Authority
TW
Taiwan
Prior art keywords
block
copolymer
composition
styrene
acrylate
Prior art date
Application number
TW96131933A
Other languages
Chinese (zh)
Other versions
TW200909507A (en
Inventor
Feng Jen Huang
Original Assignee
Chi Lin Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chi Lin Technology Co Ltd filed Critical Chi Lin Technology Co Ltd
Priority to TW96131933A priority Critical patent/TWI352099B/en
Publication of TW200909507A publication Critical patent/TW200909507A/en
Application granted granted Critical
Publication of TWI352099B publication Critical patent/TWI352099B/en

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Description

1352099 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種塑膠組合物。更明確言之,本發明係 關於一種導電塑膠組合物。該導電塑膠組合物較佳地用於 生產用於例如包含1€之電子零件的半導體之封裝容器之薄 【先前技術】 為了封裝及運輸包含ic之電子零件,已使用注射模製托 盤、真空成形托盤、承載帶(也稱為壓花承載帶)等。為了 防止由於來自摩擦或絕緣之靜電所引起之電子零件損壞, 已開發出一種包含熱塑性樹脂成分及導電成分之封裝容 器此類封裝谷器通常包含一封蓋膜,以用於在封裝、傳 輸及組裝時密封及緊固電子零件。該熱塑性樹脂成分通常 匕3丙烯腈-丁二烯_苯乙烯型樹脂、聚苯乙烯型樹脂、聚 氯乙烯樹脂或笨乙烯_共_ 丁乙烯樹脂,並使用細金屬粉 末、碳纖維及導電碳黑作為導電成分。 抑為了滿足小尺寸及快速封裝速度之要求,應加強封裝容 态之機械強度,目前已建議一種由複合塑膠薄片製成之刼1352099 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a plastic composition. More specifically, the present invention relates to a conductive plastic composition. The electroconductive plastic composition is preferably used for producing a thin package for a semiconductor such as an electronic component including 1 [Prior Art] In order to package and transport an electronic component including ic, an injection molded tray, vacuum forming has been used. Pallets, carrier tapes (also known as embossed carrier tapes), etc. In order to prevent damage to electronic parts caused by static electricity from friction or insulation, a package container containing a thermoplastic resin component and a conductive component has been developed. Such a packaged package typically includes a cover film for packaging, transport, and Seal and secure electronic components during assembly. The thermoplastic resin component is usually 匕3 acrylonitrile-butadiene-styrene resin, polystyrene resin, polyvinyl chloride resin or stupid ethylene-co-butylene resin, and fine metal powder, carbon fiber and conductive carbon black are used. As a conductive component. In order to meet the requirements of small size and fast packaging speed, the mechanical strength of the packaged content should be strengthened. At present, a composite of plastic sheets has been proposed.

113682.doc t 1352099 能令人滿意,且這通常會造成這兩個層彼此分離。 因此,在此領域中需要一種用於製造具有合格機械強度 之導電表面層的導電塑膠組合物,該導電表面層能夠密封 至封蓋膜且對襯底層具有令人滿意之相容性。 【發明内容】 本發明提供一種導電塑膠組合物,其包含: (A) 包含苯乙烯嵌段與丙烯酸酯嵌段的共聚物; (B) 包含烯烴嵌段與烯酸酯嵌段的共聚物;及 (C) 碳黑; 該組合物對於每100重量份之該包含苯乙烯嵌段與丙烯 酸醋嵌段的共聚物(A)含有5至40重量份之該包含稀烴嵌段 與烯酸酯嵌段的共聚物(B);且對於每1〇〇重量份之該包含 苯乙烯嵌段與丙烯酸酯嵌段的共聚物(A)含有5至35重量份 之該碳黑(C)。 另一方面’本發明提供一種導電塑膠薄片,其由上述組 合物製成。 又一方面,本發明提供一種導電複合塑膠薄片,其包含 一襯底層及層壓於該襯底層的至少一側上之一導電表面 層,其中該導電表面層由上述導電塑膠薄片製成。 【實施方式】 本發明提供一種用於製備導電塑膠薄片之新穎導電塑膠 組合物,該導電塑膠薄片具有良好之密封強度、機械強度 及表面電阻率。由根據本發明之導電塑膠薄片製成的用於 封裝及運輸電子零件㈣之封裝容器能夠㈣至封蓋膜, 113682.doc 1352099 且對襯底層具有令人滿意之相容性。 • 該導電塑膠組合物包含: (A) 包含苯乙烯嵌段與丙烯酸酯嵌段的共聚物; (B) 包含烯烴嵌段與烯酸酯嵌段的共聚物;及 (C) 碳黑; 該組合物對於每100重量份之該包含苯乙烯嵌段與丙稀 - 酸醋嵌段的共聚物(A)含有5至40重量份之該包含烯烴歲段 φ 與烯酸酯嵌段的共聚物(B);且對於每1〇〇重量份之該包含 苯乙烯嵌段與丙烯酸酯嵌段的共聚物(A)含有5至35重量份 之碳黑(C)。 • 根據本發明之組合物用於形成導電塑膠薄片。 較佳地,該導電塑膠薄片用於製造導電複合塑膠薄片, 該導電複合塑膠薄片包含一襯底層及層壓於該襯底層的至 少一側上之一導電表面層,其中該導電表面層包含上文之 組合物。 籲 此外,封裝容器包含如上文之導電複合塑膠薄片及一封 蓋膜。 ·_ 該包含苯乙烯嵌段與丙烯酸酯嵌段的共聚物(A)之苯乙 . 稀谈段經設計用於維持有利於密封至封蓋膜之低軟化點。 較佳地’該包含苯乙稀嵌段與丙烯酸酯嵌段的共聚物(A) 包含10至80 wt%之苯乙烯嵌段。 在本發明之一較佳態樣中,該包含苯乙烯嵌段與丙烯酸 醋嵌段的共聚物(A)之丙烯酸酯嵌段係選自由丙烯酸酯、 甲基丙稀酸醋、甲基丙烯酸甲酯、丙烯酸丁酯及其混合物 113682.doc 1352099 組成之群。該丙稀酸醋丧段係為對根據本發明之導電複合 塑膠薄片的襯底層具有極佳相容性之極性後段。此外,極 :丙烯酸醋敎段當施加至根據本發明之封裝容器時,對封 蓋膜具有令人滿意之密封特性。113682.doc t 1352099 is satisfactory, and this usually causes the two layers to separate from each other. Accordingly, there is a need in the art for a conductive plastic composition for making a conductive surface layer having acceptable mechanical strength that is capable of sealing to a capping film and having satisfactory compatibility with the substrate layer. SUMMARY OF THE INVENTION The present invention provides a conductive plastic composition comprising: (A) a copolymer comprising a styrene block and an acrylate block; (B) a copolymer comprising an olefin block and an enoate block; And (C) carbon black; the composition contains 5 to 40 parts by weight of the dilute hydrocarbon block and the enoate per 100 parts by weight of the copolymer (A) comprising the styrene block and the acryl vine block. The block copolymer (B); and the carbon black (C) is contained in an amount of 5 to 35 parts by weight per 1 part by weight of the copolymer (A) comprising the styrene block and the acrylate block. On the other hand, the present invention provides a conductive plastic sheet which is made of the above composition. In still another aspect, the present invention provides a conductive composite plastic sheet comprising a substrate layer and a conductive surface layer laminated on at least one side of the substrate layer, wherein the conductive surface layer is made of the conductive plastic sheet. [Embodiment] The present invention provides a novel conductive plastic composition for preparing a conductive plastic sheet having good sealing strength, mechanical strength and surface resistivity. The package container for encapsulating and transporting the electronic component (4) made of the conductive plastic sheet according to the present invention can (4) to the cover film, 113682.doc 1352099 and has satisfactory compatibility with the substrate layer. • The conductive plastic composition comprises: (A) a copolymer comprising a styrene block and an acrylate block; (B) a copolymer comprising an olefin block and an enoate block; and (C) a carbon black; The composition contains 5 to 40 parts by weight of the copolymer comprising the olefinic segment φ and the enoate block per 100 parts by weight of the copolymer (A) comprising the styrene block and the acryl-acid vine block. (B); and 5 to 35 parts by weight of the carbon black (C) per 1 part by weight of the copolymer (A) comprising the styrene block and the acrylate block. • The composition according to the invention is used to form a conductive plastic sheet. Preferably, the conductive plastic sheet is used for manufacturing a conductive composite plastic sheet, the conductive composite plastic sheet comprising a substrate layer and a conductive surface layer laminated on at least one side of the substrate layer, wherein the conductive surface layer comprises Composition of the text. In addition, the package container comprises a conductive composite plastic sheet as described above and a cover film. The styrene containing the copolymer of styrene block and acrylate block (A) is designed to maintain a low softening point which facilitates sealing to the cover film. Preferably, the copolymer (A) comprising a styrene block and an acrylate block comprises from 10 to 80% by weight of a styrene block. In a preferred aspect of the present invention, the acrylate block of the copolymer (A) comprising a styrene block and an acrylic vine block is selected from the group consisting of acrylate, methyl acetonate, and methacrylic acid. a group of esters, butyl acrylates, and mixtures thereof 113682.doc 1352099. The sulphuric acid vinegar segment is a polar rear segment having excellent compatibility with the underlayer of the electroconductive composite plastic sheet according to the present invention. Further, the acrylate vinegar nipple has a satisfactory sealing property to the sealing film when applied to the packaging container according to the present invention.

在本發明之-個較佳實施例中,該包含苯乙稀敌段與丙 共聚物⑷進—步包含二烯喪段。在一較佳 態樣中’該二稀嵌段為丁二烯。明確言之,當併入有二稀 嵌段時’共聚物⑷具有相當良好之堅固性、柔軟性及时 折性能,且容器與貨物之間的密封強度及對碳黑之附著兩 者均得到改進。 在本發明之一較佳態樣中,該包含苯乙烯嵌段與丙烯酸 酯嵌段的共聚物(A)係選自由苯乙烯_甲基丙烯酸曱醋共聚 物、苯乙烯-丁二烯-甲基丙烯酸甲酯共聚物、苯乙烯丁二 烯-丙烯酸丁酯共聚物、苯乙烯·丁二稀-甲基丙烯酸甲醋_ 丙烯腈共聚物及其混合物組成之群。In a preferred embodiment of the invention, the inclusion of the phenethyl ester and the propylene copolymer (4) further comprise a diene disintegration. In a preferred embodiment, the dilute block is butadiene. Specifically, when the dilute block is incorporated, the copolymer (4) has a relatively good firmness, flexibility, and timely folding properties, and both the seal strength between the container and the cargo and the adhesion to the carbon black are improved. . In a preferred aspect of the invention, the copolymer (A) comprising a styrene block and an acrylate block is selected from the group consisting of styrene-methacrylic acid vinegar copolymer, styrene-butadiene-methyl A group consisting of a methyl acrylate copolymer, a styrene butadiene-butyl acrylate copolymer, a styrene-butadiene-methyl methacrylate-acrylonitrile copolymer, and a mixture thereof.

根據本發明,該包含烯烴嵌段與烯酸酯嵌段的共聚物 (B)用於改進該包含苯乙烯嵌段與丙烯酸酯嵌段的共聚物 (A)與襯底層之間的相容性,且防止導電表面層與襯底層 分離。此外’該包含烯烴嵌段與烯酸酯嵌段的共聚物 亦緊固至封蓋膜。 在本發明之一個較佳態樣中,該包含烯烴嵌段與烯酸酯 嵌段的共聚物(B)之烯烴嵌段為乙稀。 在本發明之一個較佳態樣中,該包含烯烴嵌段與烯酸酯 嵌段的共聚物(B)之烯酸酯嵌段係選自由丙烯酸丁酯、曱 113682.doc 1352099 基丙烯酸酯、丙烯酸乙烯酯及其混合物組成之群。 在本發明之-個較佳態樣中,該包含烯烴钱段與稀酸醋 嵌段的共聚物(B)係選自由乙烯.丙稀酸丁酷、乙烯丙稀酸 甲酯、乙烯-丙烯酸乙烯酯及其混合物組成之群。 在本發明之一個較佳實施例中,該組合物對每1〇〇重量 份之該包含笨乙烯嵌段與丙烯酸酯嵌段的共聚物(A)含有 20至30重量份之該包含烯烴嵌段與烯酸酯嵌段的丘聚物 ⑻。 在本發明之一較佳態樣中,碳黑(c)係選自由爐黑、槽 黑、超導爐黑及導電爐黑組成之群。更佳地,碳黑(c)具 有較大比表面積,藉此可用少量碳黑獲得較高導電性等 ,·及舉例 σ 之,其可為 Degussa®、Carbot®、Denka® 或According to the invention, the copolymer (B) comprising an olefin block and an enoate block is used to improve the compatibility between the copolymer (A) comprising a styrene block and an acrylate block and a substrate layer. And preventing the conductive surface layer from separating from the substrate layer. Further, the copolymer comprising the olefin block and the enoate block is also fastened to the capping film. In a preferred aspect of the invention, the olefin block comprising the copolymer (B) of the olefin block and the enoate block is ethylene. In a preferred aspect of the present invention, the enoate block of the copolymer (B) comprising an olefin block and an enoate block is selected from the group consisting of butyl acrylate, 曱113682.doc 1352099-based acrylate, A group consisting of vinyl acrylate and mixtures thereof. In a preferred aspect of the invention, the copolymer (B) comprising an olefinic segment and a dilute vinegar block is selected from the group consisting of ethylene, butyl acrylate, ethylene methacrylate, ethylene-acrylic acid. a group of vinyl esters and mixtures thereof. In a preferred embodiment of the present invention, the composition contains 20 to 30 parts by weight of the olefin-containing copolymer per 1 part by weight of the copolymer (A) comprising a stupid ethylene block and an acrylate block. a segment of the polymer with a polyester block (8). In a preferred aspect of the invention, the carbon black (c) is selected from the group consisting of furnace black, channel black, superconducting furnace black, and conductive furnace black. More preferably, the carbon black (c) has a large specific surface area, whereby a relatively small amount of carbon black can be used to obtain higher conductivity, etc., and, for example, σ, which can be Degussa®, Carbot®, Denka® or

Ketjen Black®之高結構碳黑。該碳黑應以某一量併入,以 使6表面電阻率在102至108 〇之範圍内,且較佳地自1〇3至 10 Ώ。右表面電阻率超過1〇8β,則不能獲得足夠之抗靜 電放應’且若其小於i 〇2 β,則過高之電力生產能力將從 而破壞電子零件。對於每100重量份之該包含苯乙烯嵌段 與丙烯酸酯嵌段的共聚物(Α),碳黑(C)的量為自5至35重 里伤,較佳地自20至30重量份。若該量小於5重量份,則 不鲍獲得足夠的導電性,且表面電阻率將增大。另一方 面,若其超過35重量份,則往往難以均勻分散至樹脂中, 可模製性往往顯著變壞,且例如機械強度之特性亦會變 壞。 在本發明之一個較佳實施例中,該組合物進一步包含 113682.doc (D)笨乙稀-丁二稀共聚物、 m 乙烯·乙酸乙烯酯或氯化聚乙 烯。明確吕之,該笨乙稀· # 烯共聚物提供相當良好之 伸長強度而不會改變封裝容 教谷态與貨物之間的密封強度。 此外’可於根據本發明 ^ . 乃之組合物令添加各種添加劑,例 如潤滑劑、可塑劑、加輔 田、, 加辅助劑、補強劑(樹脂改質劑)或 用以改進組合物的流動特性 u 勒符性與模製產品之動態特性的其他 树脂成分及其混合物。High structural carbon black from Ketjen Black®. The carbon black should be incorporated in an amount such that the surface resistivity of 6 is in the range of 102 to 108 Torr, and preferably from 1 〇 3 to 10 Torr. If the right surface resistivity exceeds 1 〇 8β, sufficient antistatic charge should not be obtained and if it is less than i 〇 2 β, excessive power production capacity will destroy the electronic components. The carbon black (C) is used in an amount of from 5 to 35 parts by weight, preferably from 20 to 30 parts by weight, per 100 parts by weight of the copolymer (?) containing a styrene block and an acrylate block. If the amount is less than 5 parts by weight, sufficient conductivity is obtained without abalone, and the surface resistivity will increase. On the other hand, if it exceeds 35 parts by weight, it is often difficult to uniformly disperse into the resin, moldability tends to be remarkably deteriorated, and properties such as mechanical strength are also deteriorated. In a preferred embodiment of the invention, the composition further comprises 113682.doc (D) a stearthene-butadiene dilute copolymer, m ethylene vinyl acetate or chlorinated polyethylene. It is clear that Luzhi, the stupid ethylene copolymer provides a fairly good elongation strength without changing the sealing strength between the package and the grain. Furthermore, the composition according to the invention may be added with various additives such as lubricants, plasticizers, auxiliary fields, auxiliary agents, reinforcing agents (resin modifiers) or to improve the flow of the composition. Other resin components and mixtures thereof that characterize the dynamic properties of the molded product.

為了製備該組合物,可同時一起揉和起始物料,或可逐 步揉和起始物料且接著最後將揉和產品放在一起並再次揉 孝揉和可由例如Banbury®或Kneader®雙螺桿擠壓機之 習知機器執行。In order to prepare the composition, the starting material can be kneaded together with the starting material, or the starting material can be gradually kneaded and then finally the crucible and the product are put together and rubbed again and can be extruded by, for example, a Banbury® or Kneader® twin screw. The machine knows the machine to execute.

根據本發明,該襯底層包含熱塑性樹脂。舉例言之,該 熱塑性樹脂為丙烯腈-丁二烯苯乙烯、聚苯乙烯或聚碳酸 酉曰較佳地,該襯底層為丙烯腈-丁二烯-苯乙烯◊薄片層 之厚度較佳地在〇·!至3 〇 mm之間,且導電表面層之厚度 係導電複合塑膠薄片之厚度的2至8〇0/〇。 根據本發明,該封蓋膜被熱密封或加壓密封至導電複合 塑膠薄片之表面。較佳地,該封蓋膜係聚(對苯二曱酸乙 二酯)(PET)膜。 根據本發明之封裝容器可由任何習知方法製造,該習知 方法例如係選自由壓力成形、真空成形及熱成形組成之群 之方法。 僅於說明目的來敘述以下實例,且不限制本發明之範 圍。 113682.doc 1352099 實例1至5及比較實例1至6 表1中列舉了該組合物之含量。襯底層之材料係丙烯腈-丁二烯-笨乙烯樹脂。稱重各個材料並用高速混合機均勻 混合,接著藉由0 125 mm及0 40 mm敞開式雙螺桿擠壓機 揉合,且藉由線切方法製成顆粒狀以獲得導電塑膠薄片作 為導電表面層。該襯底層在每一側上層壓有導電表面層以 形成0.3 mm之薄片,其中導電表面層:襯底層:導電表面 層之厚度比為1:8:1。 表1 : 實例 比較實例 材料 1 2 3 4 5 1 2 3 4 5 PM-200 100 100 TI-300S 100 100 100 100 100 100 100 100 100 100 20 40 TOYOLAC920 100 EMA1209 5 15 15 15 15 25 15 15 15 15 TC020 5 EBA3107 15 EC300J 5 7 Denka 21 21 23 23 24 24 25 27 15 15 20 25 25 25 25 PH-88S 100 80 60 HP-9450 100 HI 043 5 Taipol3152 5 10 10 10 10 10 10 選擇 Y Υ Υ Υ Υ Υ Υ Υ Υ ΥAccording to the invention, the substrate layer comprises a thermoplastic resin. For example, the thermoplastic resin is acrylonitrile-butadiene styrene, polystyrene or polycarbonate. Preferably, the substrate layer is preferably a thickness of an acrylonitrile-butadiene-styrene ruthenium foil layer. Between 〇·! and 3 〇mm, and the thickness of the conductive surface layer is 2 to 8 〇 0 / 厚度 of the thickness of the conductive composite plastic sheet. According to the present invention, the cover film is heat-sealed or pressure-sealed to the surface of the electroconductive composite plastic sheet. Preferably, the capping film is a poly(ethylene terephthalate) (PET) film. The package container according to the present invention can be produced by any conventional method, such as a method selected from the group consisting of pressure forming, vacuum forming, and thermoforming. The following examples are described for illustrative purposes only and are not intended to limit the scope of the invention. 113682.doc 1352099 Examples 1 to 5 and Comparative Examples 1 to 6 Table 1 lists the contents of the composition. The material of the backing layer is acrylonitrile-butadiene-stupid vinyl. Each material was weighed and uniformly mixed by a high-speed mixer, then kneaded by a 0 125 mm and 0 40 mm open-type twin-screw extruder, and pelletized by a wire-cut method to obtain a conductive plastic sheet as a conductive surface layer. . The substrate layer was laminated with a conductive surface layer on each side to form a sheet of 0.3 mm, wherein the thickness ratio of the conductive surface layer: substrate layer: conductive surface layer was 1:8:1. Table 1: Example Comparative Example Materials 1 2 3 4 5 1 2 3 4 5 PM-200 100 100 TI-300S 100 100 100 100 100 100 100 100 100 100 20 40 TOYOLAC920 100 EMA1209 5 15 15 15 15 25 15 15 15 15 TC020 5 EBA3107 15 EC300J 5 7 Denka 21 21 23 23 24 24 25 27 15 15 20 25 25 25 25 PH-88S 100 80 60 HP-9450 100 HI 043 5 Taipol3152 5 10 10 10 10 10 10 Select Y Υ Υ Υ Υ Υ Υ Υ Υ Υ

比較實例6為ECM3, Denka®。 包含苯乙烯嵌段與丙烯酸酯嵌段的共聚物(A): 苯乙烯-曱基丙烯酸甲酯共聚物:PM-200, A&L® 苯乙烯-丁二烯-曱基丙烯酸曱酯共聚物:TI-300S,DIC® 苯乙烯-丁二烯-曱基丙烯酸曱酯-丙烯腈共聚物: 113682.doc -11 - 1352099 TOYOLAC920, Toray® 包含烯烴嵌段與烯酸酯嵌段的共聚物(B): 乙烯-丙烯酸甲酯:EMA 1209,Dupont® : TC020, ExxonComparative Example 6 is ECM3, Denka®. Copolymer comprising styrene block and acrylate block (A): styrene-methyl methacrylate copolymer: PM-200, A&L® styrene-butadiene-mercapto methacrylate copolymer : TI-300S, DIC® styrene-butadiene-decyl methacrylate-acrylonitrile copolymer: 113682.doc -11 - 1352099 TOYOLAC920, Toray® contains a copolymer of an olefin block and an enoate block ( B): Ethylene-methyl acrylate: EMA 1209, Dupont®: TC020, Exxon

Mobil® 乙烯-丙烯酸丁酯:EBA 3107, Dupont® (C) 碳黑: 碳黑:顆粒型,Denka® ; EC-300J,KETJEN BLACK INTERNATIONAL COMPANY® (D) 苯乙烯-丁二烯共聚物: 苯乙烯-丁二烯共聚物 :PH-88S, CHI MEI CORPORATION®,HP9450,FORMOSA CHEMICALS & FIBRE CORPORATION® 氫化苯乙烯-丁二烯共聚物:H1043,Asahi® ; Taipol 3152, TSRC® 如以下列舉之方法來評價實例1至5及比較實例1至6之特 性: 表面電阻率:如ASTM D-257,採用在可檢測範圍内之 表面電阻率。 密封強度:由實例1至5及比較實例1至6之薄片製備的25 mm寬之條帶藉由密封機(由E&R®製造的TP-1000)與封蓋 膜密封,且導電塑膠薄片及封蓋膜之密封強度藉由剝離測 試機(由 OVERTOP TECHNOLOGY CO., LTD.製造的 JE PFT-500)如EIA-481方法來量測。 機械特性:如ASTM D-882方法在其橫向及縱向方向上 113682.doc -12- 1352099 將實例1至5及比較實例⑴之薄片的每一者切割成寬度為 2.5 cm且長度為20 cm之五個條帶。該等五個條帶之:向 錢向抗張強度及伸長之平均值由通用抗張測試機獲得。 剝離強度:如以下列舉之方法來評估實例⑴及比較實 例1至6之薄片的每一者。 - 方法1:藉由切割於該等薄片上形成凹口,且接著藉由 . 自該凹口撕去薄片來獲得半圓形部分(約5 cm2)。稱重^半 φ *形部分。羊圓形部分之重量越大’剝離之導電表面層也 就越多。這反映了導電表面層與襯底層之間的相容性。 方法2 .由實例1至5及比較實例丨至6之薄片製備寬度為 25 mm且長度為} m的條帶,且在24〇。〇之密封溫度及4〇 psi 之壓力下藉由密封機(由E&R®製造的TP_1〇〇〇)將其密封至 封蓋膜。稱重該封蓋膜上之導電表面層之剩餘物◎剩餘物 之重量越大,剝離之導電表面層也就越多。這反映了導電 表面層與襯底層之間的相容性。 • 結果於表2及3中列舉: 表2 : 實例 比較實例 1 2 3 4 5 1 2 3 4 5 6 表面電阻率 (104歐姆/平方) 4.2 5.2 5.3 4.7 4.0 410 4.3 6.2 5.0 5.2 4.9 平均密封強度 52 62 65 65 86 43 38 50 53 57 58 密封強度超過90s N N N N Y N N N N N N 機械強度 (kg/cm2) 470 455 440 435 435 465 472 410 420 435 450 415 405 405 420 415 413 416 390 400 405 410 伸长 6 6 9 15 13 7 5 9 8 8 8 5 5 7 10 9 6 4 6 6 5 6 刹離室重(mg) 方法1 3.2 3.0 3.3 3.4 2.8 3.4 3.8 15 12 10 13 方法2 0.5 0.4 0.6 07 0.3 0.8 0.9 2.0 1.6 1.4 1.4 U3682.doc -13- 如表2 ’實例1至5之表面電阻率與比較實例2至5之表面 電阻率幾乎相同,因為碳黑含量相同(16伽%卜 實例1及2未含有(D)苯乙% 丁二稀共聚物,且其伸長率 低於實例3至5之伸長率。與比較實例2相比,實例丄添加有 5重里%之包含烯烴嵌段與烯酸酯嵌段的共聚物⑺卜且密 封強度及剝離得以改進。隨著實例2至5中增加包含稀煙嵌 飯與烯酸酯嵌段的共聚物(B),密封強度得以顯著增加。 然而,過量的共聚物(B)(例如在實例5中)造成過高密封強 又(超過90 g),其將會對封装於由薄片製成之封裝容器中 之電子零件解開封裝時造成干擾。實例丨至5之相容性優於 比較實例3至6。 上述實施例僅為說明本發明之原理及其功效,而非限制 本發月。%於此技術之人士對上述實施例所做之修改及變 化仍不違背本發明之精神。本發明之權利範圍應如後述之 申清專利範圍所列。 113682.doc -14-Mobil® Ethylene-butyl acrylate: EBA 3107, Dupont® (C) Carbon black: Carbon black: Granular, Denka®; EC-300J, KETJEN BLACK INTERNATIONAL COMPANY® (D) Styrene-butadiene copolymer: Benzene Ethylene-butadiene copolymer: PH-88S, CHI MEI CORPORATION®, HP9450, FORMOSA CHEMICALS & FIBRE CORPORATION® Hydrogenated styrene-butadiene copolymer: H1043, Asahi®; Taipol 3152, TSRC® Methods to evaluate the characteristics of Examples 1 to 5 and Comparative Examples 1 to 6: Surface resistivity: As ASTM D-257, the surface resistivity in the detectable range was employed. Sealing strength: 25 mm wide strips prepared from the sheets of Examples 1 to 5 and Comparative Examples 1 to 6 were sealed with a sealing film by a sealing machine (TP-1000 manufactured by E&R®), and a conductive plastic sheet The sealing strength of the cap film was measured by a peeling tester (JE PFT-500 manufactured by OVERTOP TECHNOLOGY CO., LTD.) such as the EIA-481 method. Mechanical properties: Each of the sheets of Examples 1 to 5 and Comparative Example (1) was cut into a width of 2.5 cm and a length of 20 cm in the lateral and longitudinal directions thereof according to the ASTM D-882 method 113682.doc -12-1352099. Five strips. The five strips: the average of the tensile strength and elongation to the money were obtained from a universal tensile tester. Peel strength: Each of the sheets of Example (1) and Comparative Examples 1 to 6 was evaluated as listed below. - Method 1: A notch is formed by cutting on the sheets, and then a semicircular portion (about 5 cm2) is obtained by tearing off the sheet from the notch. Weighing ^ half φ * shaped part. The greater the weight of the round portion of the sheep, the more the conductive surface layer is peeled off. This reflects the compatibility between the conductive surface layer and the substrate layer. Method 2. From the sheets of Examples 1 to 5 and Comparative Examples 丨 to 6, a strip having a width of 25 mm and a length of m was prepared at 24 Å. The sealing temperature of the crucible and the pressure of 4 psi are sealed to the sealing film by a sealing machine (TP_1〇〇〇 manufactured by E&R®). The remainder of the conductive surface layer on the cover film is weighed. ◎ The greater the weight of the remainder, the more the conductive surface layer is peeled off. This reflects the compatibility between the conductive surface layer and the substrate layer. • The results are listed in Tables 2 and 3: Table 2: Example Comparison Example 1 2 3 4 5 1 2 3 4 5 6 Surface Resistivity (104 ohms/square) 4.2 5.2 5.3 4.7 4.0 410 4.3 6.2 5.0 5.2 4.9 Average Seal Strength 52 62 65 65 86 43 38 50 53 57 58 Sealing strength over 90 s NNNNYNNNNNN Mechanical strength (kg/cm2) 470 455 440 435 435 465 472 410 420 435 450 415 405 405 420 415 413 416 390 400 405 410 Elongation 6 6 9 15 13 7 5 9 8 8 8 5 5 7 10 9 6 4 6 6 5 6 Brake chamber weight (mg) Method 1 3.2 3.0 3.3 3.4 2.8 3.4 3.8 15 12 10 13 Method 2 0.5 0.4 0.6 07 0.3 0.8 0.9 2.0 1.6 1.4 1.4 U3682.doc -13- As shown in Table 2, the surface resistivities of Examples 1 to 5 are almost the same as those of Comparative Examples 2 to 5 because the carbon black content is the same (16 gamma%) Examples 1 and 2 are not contained ( D) styrene-butadiene dibutyl copolymer, and its elongation is lower than that of Examples 3 to 5. Compared with Comparative Example 2, the example ruthenium added 5% by weight of the olefin-containing block and the enoate block. The copolymer (7) and the seal strength and peeling were improved. With the addition of the examples in the examples 2 to 5, The ester block copolymer (B) has a significant increase in seal strength. However, the excess copolymer (B) (for example in Example 5) causes an excessively high seal (over 90 g) which will be packaged. Interference is caused when the electronic components in the packaged container are unpacked. The compatibility of Examples 丨 to 5 is superior to Comparative Examples 3 to 6. The above embodiments are merely illustrative of the principles and effects of the present invention, and The present invention is not limited to the spirit and scope of the present invention. The scope of the present invention should be as set forth in the appended claims. 113682.doc - 14-

Claims (1)

十、申請專利範圍: 1. 一種導電塑膠組合物,其包含: (A) 包含笨乙烯嵌段與丙烯酸酯嵌段的共聚物; (B) 包含烯烴嵌段與烯酸酯嵌段的共聚物;及 (C) 碳黑; 該組合物對於每100重量份之該包含苯乙烯嵌段與丙 稀酸酯嵌段的共聚物(A)含有5至40重量份之該包含烯烴 嵌段與烯酸酯嵌段的共聚物(B);且對於每1〇〇重量份之 該包含苯乙烯嵌段與丙烯酸酯嵌段的共聚物含有5至 35重量份之該碳黑(〇。 2. 如請求項1之組合物,其中該包含苯乙烯嵌段與丙烯酸 酯嵌段的共聚物(A)包含10至80 wt%之苯乙烯嵌段。 3. 如請求項1之組合物,其中該包含苯乙烯嵌段與丙烯酸 酯嵌段的共聚物(A)之丙烯酸酯嵌段係選自由以下各項組 成之群:丙烯酸酯、曱基丙烯酸酯、甲基丙烯酸曱酯、 丙烯酸丁酯、丙烯腈及其混合物。 4·如請求項1之組合物,其中該包含笨乙烯嵌段與丙烯酸 酯嵌段的共聚物(A)進一步包含二烯嵌段。 5. 如請求項1之組合物,其中該包含笨乙烯嵌段與丙烯酸 酯嵌段的共聚物(A)係選自由以下各項組成之群:苯乙 烯-曱基丙烯酸甲酯共聚物、苯乙烯-丁二烯-曱基丙烯酸 甲酯共聚物、苯乙烯-丁二烯-丙烯酸丁酯共聚物、苯乙 烯-丁二烯-曱基丙烯酸曱酯-丙烯腈共聚物及其混合物。 6. 如請求項1之組合物,其中該包含烯烴嵌段與烯酸酯嵌 113682.doc 1352099 段的共聚物(B)之烯烴嵌段為乙烯。 月求項1之組合物’其中該包含稀烴嵌段與稀酸醋嵌 段的共聚物(B)之烯酸酯嵌段係選自由以下各項組成之 群丙稀酸丁酯、甲基丙烯酸酯' 丙烯酸乙烯酯及其混 合物。 8·如响求項1之組合物,其中該包含烯烴嵌段與烯酸酯嵌 段的共聚物(Β)係選自由以下各項組成之群:乙烯丙烯 鲅丁酯、乙烯-丙烯酸甲酯、乙烯_丙烯酸乙烯酯及其混 合物。 9·如請求項1之組合物,其對於每100重量份之該包含苯乙 烯嵌段與丙烯酸酯嵌段的共聚物(A)含有2 〇至3 〇重量份之 該包含烯烴嵌段與烯酸酯嵌段的共聚物(B)。 10.如4求項1之組合物,其中該碳黑(c)係選自由以下各項 、、且成之群.爐黑、槽黑、超導爐黑及導電爐黑。 11·如請求項1之組合物’其進一步包含(D)苯乙烯_丁二烯共 聚物、乙烯-乙酸乙烯酯或氯化聚乙烯。 12. 如請求項丨之組合物,其進一步包含添加劑。 13. 如請求項12之組合物,其中該添加劑係選自由以下各項 組成之群:潤滑劑、可塑劑、加工辅助劑、補強劑及用 以改進該組合物之流動特性與模製產品之動態特性之其 他樹脂成分及其混合物。 -種導電塑膝薄片,其包含如請求項丨之組合物。 15.如請求項14之導電塑膠薄片,其具有…至…。之表面 電阻率。 113682.doc 1352099 16. 一種導電複合塑膠薄片,其包含一襯底層及一層壓於該 n層的至少—側上之導電表面層,其中該導電表面層 包含如請求項1之組合物。 17. 如請求項16之導電複合塑夥薄片,其中該襯底層係選自 由以下各項組成之群:丙烯腈丁二烯苯乙烯、聚苯乙 稀及聚碳酸S旨。 18. 如請求項17之導電複合塑膠薄片,其中該襯底層為丙稀 腈-丁二稀-苯乙稀。 19. 一種封裝容器,其包含如請求項16之導電複合塑膠薄片 及一封蓋膜。 20. 如請求項19之導電複合塑膠薄片,其中該封蓋膜為聚(對 苯二甲酸乙二酯)膜。X. Patent Application Range: 1. A conductive plastic composition comprising: (A) a copolymer comprising a stupid ethylene block and an acrylate block; (B) a copolymer comprising an olefin block and an enoate block And (C) carbon black; the composition contains 5 to 40 parts by weight of the olefin-containing block and alkene per 100 parts by weight of the copolymer (A) comprising the styrene block and the acrylate block a copolymer (B) of an acid ester block; and containing 5 to 35 parts by weight of the carbon black (〇. 2) per 1 part by weight of the copolymer comprising the styrene block and the acrylate block. The composition of claim 1, wherein the copolymer (A) comprising a styrene block and an acrylate block comprises from 10 to 80% by weight of a styrene block. 3. The composition of claim 1, wherein the inclusion The acrylate block of the styrene block and the acrylate block copolymer (A) is selected from the group consisting of acrylate, methacrylate, methacrylate, butyl acrylate, acrylonitrile. And a mixture thereof. 4. The composition of claim 1, wherein the inclusion of the stupid ethylene block The acrylate block copolymer (A) further comprises a diene block. 5. The composition of claim 1, wherein the copolymer (A) comprising a stupid ethylene block and an acrylate block is selected from the group consisting of Group of components: styrene-methyl methacrylate copolymer, styrene-butadiene-methyl methacrylate copolymer, styrene-butadiene-butyl acrylate copolymer, styrene-butadiene - a mercapto methacrylate-acrylonitrile copolymer and a mixture thereof. 6. The composition of claim 1, wherein the olefin block comprising the olefin block and the olefin ester intercalation 113682.doc 1352099 copolymer (B) The segment is ethylene. The composition of the monthly claim 1 wherein the enoate block of the copolymer (B) comprising the dilute hydrocarbon block and the dilute vinegar block is selected from the group consisting of the following groups: The composition of claim 1, wherein the copolymer comprising the olefin block and the enoate block is selected from the group consisting of the following: Group: ethylene butyl butyl acrylate, ethylene methyl acrylate, ethylene propylene And a mixture thereof. The composition of claim 1 which contains 2 to 3 parts by weight per 100 parts by weight of the copolymer (A) comprising the styrene block and the acrylate block. The composition comprising the olefin block and the enoate block (B). The composition of claim 1, wherein the carbon black (c) is selected from the group consisting of: Black, channel black, superconducting furnace black, and conductive furnace black. 11. The composition of claim 1 which further comprises (D) a styrene-butadiene copolymer, ethylene-vinyl acetate or chlorinated polyethylene. 12. The composition of claim 1, further comprising an additive. The composition of claim 12, wherein the additive is selected from the group consisting of: a lubricant, a plasticizer, a processing aid, a reinforcing agent And other resin components and mixtures thereof for improving the flow characteristics of the composition and the dynamic properties of the molded product. A conductive plastic knee sheet comprising a composition as claimed. 15. The conductive plastic sheet of claim 14, which has ... to... Surface resistivity. 113682.doc 1352099 16. A conductive composite plastic sheet comprising a substrate layer and a conductive surface layer laminated on at least one side of the n layer, wherein the conductive surface layer comprises the composition of claim 1. 17. The electrically conductive composite sheet of claim 16, wherein the substrate layer is selected from the group consisting of acrylonitrile butadiene styrene, polystyrene, and polycarbonate. 18. The electrically conductive composite plastic sheet of claim 17, wherein the substrate layer is acrylonitrile-butadiene-styrene. 19. A package container comprising the electrically conductive composite plastic sheet of claim 16 and a cover film. 20. The electrically conductive composite plastic sheet of claim 19, wherein the cover film is a poly(ethylene terephthalate) film. 113682.doc113,682.doc
TW96131933A 2007-08-28 2007-08-28 Conductive plastic composition TWI352099B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96131933A TWI352099B (en) 2007-08-28 2007-08-28 Conductive plastic composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96131933A TWI352099B (en) 2007-08-28 2007-08-28 Conductive plastic composition

Publications (2)

Publication Number Publication Date
TW200909507A TW200909507A (en) 2009-03-01
TWI352099B true TWI352099B (en) 2011-11-11

Family

ID=44724014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96131933A TWI352099B (en) 2007-08-28 2007-08-28 Conductive plastic composition

Country Status (1)

Country Link
TW (1) TWI352099B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104659007B (en) * 2013-11-20 2019-01-08 日月光半导体制造股份有限公司 Semiconductor package and method of manufacturing the same

Also Published As

Publication number Publication date
TW200909507A (en) 2009-03-01

Similar Documents

Publication Publication Date Title
JP6311572B2 (en) Conductive polyethylene resin composition, molded article using the same, and laminate
TWI437043B (en) A conductive resin composition, and a conductive sheet using the same
JP5564343B2 (en) Polystyrene resin film and laminated sheet
TWI352099B (en) Conductive plastic composition
JP2016210824A5 (en)
JP5154081B2 (en) Composite sheet
CN101376732A (en) Conductive plastic composition
JP2010196052A (en) Polyolefin resin film and laminated sheet
CN118271738A (en) Polyolefin film and preparation method and application thereof
JP3276818B2 (en) Conductive composite plastic sheet and container
JP4713065B2 (en) Sheet using ABS resin for base material layer
JP3209393B2 (en) Conductive composite plastic sheet and container
CN101014463A (en) Conductive composite sheet
JP5860585B2 (en) Polystyrene resin sheet
JP3724918B2 (en) Conductive composite plastic sheet
JP2010196053A (en) Polyolefin resin film and laminated sheet
JPWO2012090710A1 (en) Extrusion coating resin composition, laminated film and method for producing the same
JPH10329278A (en) Conductive composite plastic sheet
JP7697161B1 (en) Cover tape and electronic component packaging including same
JP3324683B2 (en) Conductive composite plastic sheet
TWI252165B (en) Conductive plastic composition
JPH07118465A (en) Resin composition having heat resistance and electrical conductivity resistance
JP2005248024A (en) Conductive plastic composition, conductive plastic sheet, conductive composite plastic sheet, and electroconductive composite plastic container
JP5396247B2 (en) Polystyrene resin molded product
JP3202553B2 (en) Conductive composite plastic sheet and container