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CN101376732A - Conductive plastic composition - Google Patents

Conductive plastic composition Download PDF

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Publication number
CN101376732A
CN101376732A CNA2008100067237A CN200810006723A CN101376732A CN 101376732 A CN101376732 A CN 101376732A CN A2008100067237 A CNA2008100067237 A CN A2008100067237A CN 200810006723 A CN200810006723 A CN 200810006723A CN 101376732 A CN101376732 A CN 101376732A
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block
acrylate
styrene
olefin
multipolymer
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黄奉仁
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Chi Lin Technology Co Ltd
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Chi Lin Technology Co Ltd
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Abstract

The present invention provides a conductive plastic composition comprising: a copolymer comprising a styrene block and an acrylate block; (B) a copolymer comprising an olefin block and an enoate block; and (C) carbon black. The composition contains 5 to 40 parts by weight of the copolymer (B) containing an olefin block and an enoate block per 100 parts by weight of the copolymer containing a styrene block and an acrylate block; and 5 to 35 parts by weight of the carbon black (C) per 100 parts by weight of the copolymer containing a styrene block and an acrylate block.

Description

导电塑料组合物 conductive plastic composition

技术领域 technical field

本发明涉及一种塑料组合物。更明确地说,本发明涉及一种导电塑料组合物。所述导电塑料组合物优选地用于生产用于例如包含IC的电子零件的半导体的封装容器的薄片。The present invention relates to a plastic composition. More specifically, the present invention relates to an electrically conductive plastic composition. The conductive plastic composition is preferably used for producing sheets for packaging containers for semiconductors such as electronic parts including ICs.

背景技术 Background technique

为了封装和运输包含IC的电子零件,已使用注射模制托盘、真空成形托盘、承载带(也称为压花承载带)等。为了防止由于来自摩擦或绝缘的静电所引起的电子零件损坏,已开发出一种包含热塑性树脂成分和导电成分的封装容器。此类封装容器通常包含一封盖膜,以用于在封装、传输和组装时密封和紧固电子零件。所述热塑性树脂成分通常包含丙烯腈-丁二烯-苯乙烯型树脂、聚苯乙烯型树脂、聚氯乙烯树脂或苯乙烯-共-丁乙烯树脂,并使用细金属粉末、碳纤维和导电碳黑作为导电成分。For packaging and shipping electronic parts containing ICs, injection molded trays, vacuum formed trays, carrier tapes (also called embossed carrier tapes), etc. have been used. In order to prevent electronic parts from being damaged due to static electricity from friction or insulation, a packaging container including a thermoplastic resin component and a conductive component has been developed. Such packaging containers typically include a lidding film to seal and secure electronic components during packaging, transport and assembly. The thermoplastic resin component generally contains acrylonitrile-butadiene-styrene type resin, polystyrene type resin, polyvinyl chloride resin or styrene-co-butylene resin, and uses fine metal powder, carbon fiber and conductive carbon black as a conductive component.

为了满足小尺寸和快速封装速度的要求,应加强封装容器的机械强度。目前已建议一种由复合塑料薄片制成的封装容器,此常规复合塑料薄片包含一衬底层和层压在所述衬底层的至少一侧上的一导电表面层。鉴于其极佳机械强度,所述衬底层最常用的材料是丙烯腈-丁二烯-苯乙烯(ABS)、聚苯乙烯(PS)和聚碳酸酯(PC)。但另一方面,此常规薄片为了密封到封盖膜,所述常规导电表面层的材料受到限制。因而,常规衬底层与导电表面层之间的兼容性不能令人满意,且这通常会造成这两个层彼此分离。In order to meet the requirements of small size and fast packaging speed, the mechanical strength of the packaging container should be enhanced. There has been proposed a packaging container made of a composite plastic sheet, the conventional composite plastic sheet comprising a substrate layer and a conductive surface layer laminated on at least one side of said substrate layer. The most commonly used materials for the substrate layer are acrylonitrile-butadiene-styrene (ABS), polystyrene (PS) and polycarbonate (PC) due to their excellent mechanical strength. But on the other hand, the material of the conventional conductive surface layer is limited in order to seal this conventional sheet to the lidding film. Thus, the compatibility between the conventional substrate layer and the conductive surface layer is not satisfactory, and this often results in separation of these two layers from each other.

因此,在此领域中需要一种用于制造具有合格机械强度的导电表面层的导电塑料组合物,所述导电表面层能够密封到封盖膜且对衬底层具有令人满意的兼容性。Therefore, there is a need in the art for an electrically conductive plastic composition for producing an electrically conductive surface layer with acceptable mechanical strength, capable of sealing to a lidding film and having satisfactory compatibility with a substrate layer.

发明内容 Contents of the invention

本发明提供一种导电塑料组合物,其包含:The invention provides a conductive plastic composition comprising:

(A)包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物;(A) a copolymer comprising styrene blocks and acrylate blocks;

(B)包含烯烃嵌段和烯酸酯嵌段的共聚物;以及(B) a copolymer comprising olefin blocks and acrylate blocks; and

(C)碳黑;(C) carbon black;

所述组合物对于每100重量份的所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)含有5到40重量份的所述包含烯烃嵌段和烯酸酯嵌段的共聚物(B);且对于每100重量份的所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)含有5到35重量份的所述碳黑(C)。The composition contains 5 to 40 parts by weight of the copolymer comprising olefin blocks and acrylate blocks per 100 parts by weight of the copolymer (A) comprising styrene blocks and acrylate blocks (B); and containing 5 to 35 parts by weight of the carbon black (C) per 100 parts by weight of the copolymer (A) comprising a styrene block and an acrylate block.

在另一方面,本发明提供一种导电塑料薄片,其由上述组合物制成。In another aspect, the present invention provides a conductive plastic sheet made of the above composition.

在又一方面,本发明提供一种导电复合塑料薄片,其包含衬底层和层压在所述衬底层的至少一侧上的一导电表面层,其中所述导电表面层由上述导电塑料薄片制成。In yet another aspect, the present invention provides a conductive composite plastic sheet comprising a substrate layer and a conductive surface layer laminated on at least one side of the substrate layer, wherein the conductive surface layer is made of the above-mentioned conductive plastic sheet become.

附图说明 Description of drawings

none

具体实施方式 Detailed ways

本发明提供一种用于制备导电塑料薄片的新颖导电塑料组合物,所述导电塑料薄片具有良好的密封强度、机械强度和表面电阻率。由根据本发明的导电塑料薄片制成的用于封装和运输电子零件或IC的封装容器能够密封到封盖膜,且对衬底层具有令人满意的兼容性。The present invention provides a novel conductive plastic composition for preparing conductive plastic sheets having good sealing strength, mechanical strength and surface resistivity. A packaging container for packaging and transporting electronic parts or ICs made of the conductive plastic sheet according to the present invention can be sealed to a lidding film and has satisfactory compatibility with a substrate layer.

所述导电塑料组合物包含:The conductive plastic composition comprises:

(A)包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物;(A) a copolymer comprising styrene blocks and acrylate blocks;

(B)包含烯烃嵌段和烯酸酯嵌段的共聚物;以及(B) a copolymer comprising olefin blocks and acrylate blocks; and

(C)碳黑;(C) carbon black;

所述组合物对于每100重量份的所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)含有5到40重量份的所述包含烯烃嵌段和烯酸酯嵌段的共聚物(B);且对于每100重量份的所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)含有5到35重量份的碳黑(C)。The composition contains 5 to 40 parts by weight of the copolymer comprising olefin blocks and acrylate blocks per 100 parts by weight of the copolymer (A) comprising styrene blocks and acrylate blocks (B); and containing 5 to 35 parts by weight of carbon black (C) per 100 parts by weight of the copolymer (A) comprising a styrene block and an acrylate block.

根据本发明的组合物用于形成导电塑料薄片。The compositions according to the invention are used to form conductive plastic sheets.

优选地,所述导电塑料薄片用于制造导电复合塑料薄片,所述导电复合塑料薄片包含一衬底层和层压在所述衬底层的至少一侧上的一导电表面层,其中所述导电表面层包含上文所述的组合物。Preferably, the conductive plastic sheet is used to manufacture a conductive composite plastic sheet comprising a substrate layer and a conductive surface layer laminated on at least one side of the substrate layer, wherein the conductive surface The layers comprise the compositions described above.

此外,封装容器包含如上文所述的导电复合塑料薄片和一封盖膜。Additionally, the packaging container comprises a conductive composite plastic sheet and a lidding film as described above.

所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)的苯乙烯嵌段经设计用于维持有利于密封到封盖膜的低软化点。优选地,所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)包含10到80wt%的苯乙烯嵌段。The styrene blocks of the copolymer (A) comprising styrene blocks and acrylate blocks are designed to maintain a low softening point that facilitates sealing to the lidding film. Preferably, the copolymer (A) comprising styrene blocks and acrylate blocks comprises 10 to 80 wt% of styrene blocks.

在本发明的优选态样中,所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)的丙烯酸酯嵌段选自由丙烯酸酯、甲基丙烯酸酯、甲基丙烯酸甲酯、丙烯酸丁酯和其混合物组成的群组。所述丙烯酸酯嵌段是对根据本发明的导电复合塑料薄片的衬底层具有极佳兼容性的极性嵌段。此外,极性丙烯酸酯嵌段当施加到根据本发明的封装容器时,对封盖膜具有令人满意的密封特性。In a preferred aspect of the present invention, the acrylate block of the copolymer (A) comprising a styrene block and an acrylate block is selected from acrylate, methacrylate, methyl methacrylate, butyl acrylate Groups consisting of esters and mixtures thereof. The acrylate block is a polar block having excellent compatibility with the substrate layer of the conductive composite plastic sheet according to the present invention. Furthermore, the polar acrylate blocks have satisfactory sealing properties for lidding films when applied to packaging containers according to the invention.

在本发明的一个优选态样中,所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)进一步包含二烯嵌段。在较优选态样中,所述二烯嵌段是丁二烯。明确地说,当并入有二烯嵌段时,共聚物(A)具有相当良好的坚固性、柔软性和耐折性能,且容器与货物之间的密封强度和对碳黑的附着两者均得到改进。In a preferred aspect of the present invention, the copolymer (A) comprising styrene blocks and acrylate blocks further comprises diene blocks. In a more preferred aspect, the diene block is butadiene. Specifically, when the diene block is incorporated, the copolymer (A) has fairly good firmness, flexibility and folding resistance, and both the seal strength between the container and the cargo and the adhesion to carbon black have been improved.

在本发明的较优选态样中,所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)选自由苯乙烯-甲基丙烯酸甲酯共聚物、苯乙烯-丁二烯-甲基丙烯酸甲酯共聚物、苯乙烯-丁二烯-丙烯酸丁酯共聚物、苯乙烯-丁二烯-甲基丙烯酸甲酯-丙烯腈共聚物和其混合物组成的群组。In a more preferred aspect of the present invention, the copolymer (A) comprising styrene blocks and acrylate blocks is selected from the group consisting of styrene-methyl methacrylate copolymer, styrene-butadiene-methyl The group consisting of methyl acrylate copolymer, styrene-butadiene-butyl acrylate copolymer, styrene-butadiene-methyl methacrylate-acrylonitrile copolymer and mixtures thereof.

根据本发明,所述包含烯烃嵌段和烯酸酯嵌段的共聚物(B)用于改进所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)与衬底层之间的兼容性,且防止导电表面层与衬底层分离。此外,所述包含烯烃嵌段和烯酸酯嵌段的共聚物(B)还紧固到封盖膜。According to the invention, the copolymer (B) comprising olefin blocks and acrylate blocks is used to improve the compatibility between the copolymer (A) comprising styrene blocks and acrylate blocks and the substrate layer properties, and prevent the conductive surface layer from separating from the substrate layer. Furthermore, the copolymer (B) comprising olefin blocks and enolate blocks is also fastened to the lidding film.

在本发明的一个优选态样中,包含烯烃嵌段和烯酸酯嵌段的共聚物(B)的烯烃嵌段是乙烯。In a preferred aspect of the present invention, the olefin block of the copolymer (B) comprising an olefin block and an enolate block is ethylene.

在本发明的一个优选态样中,所述包含烯烃嵌段和烯酸酯嵌段的共聚物(B)的烯酸酯嵌段选自由丙烯酸丁酯、甲基丙烯酸酯、丙烯酸乙烯酯和其混合物组成的群组。In a preferred aspect of the present invention, the acrylate block of the copolymer (B) comprising olefin block and acrylate block is selected from butyl acrylate, methacrylate, vinyl acrylate and other A group of mixtures.

在本发明的一个较优选态样中,所述包含烯烃嵌段和烯酸酯嵌段的共聚物(B)选自由乙烯-丙烯酸丁酯、乙烯-丙烯酸甲酯、乙烯-丙烯酸乙烯酯和其混合物组成的群组。In a more preferred aspect of the present invention, the copolymer (B) comprising olefin blocks and acrylate blocks is selected from the group consisting of ethylene-butyl acrylate, ethylene-methyl acrylate, ethylene-vinyl acrylate and other A group of mixtures.

在本发明的一个优选态样中,所述组合物对每100重量份的所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A)含有20到30重量份的所述包含烯烃嵌段和烯酸酯嵌段的共聚物(B)。In a preferred aspect of the present invention, the composition contains 20 to 30 parts by weight of the olefin block-containing block and acrylate block copolymer (B).

在本发明的优选实施例中,碳黑(C)选自由炉黑、槽黑、超导炉黑和导电炉黑组成的群组。更优选地,碳黑(C)具有较大比表面积,借此可用少量碳黑获得较高导电性等级。举例来说,其可以是

Figure A200810006723D00061
或Ketjen 
Figure A200810006723D00062
的高结构碳黑。所述碳黑应以某一量并入,以使表面电阻率在102到108Ω的范围内,且优选地从103到106Ω。如果表面电阻率超过108Ω,那幺不能获得足够的抗静电效应,且如果其小于102Ω,那幺过高的电力生产能力将从而破坏电子零件。对于每100重量份的所述包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A),碳黑(C)的量为从5到35重量份,优选地从20到30重量份。如果所述量小于5重量份,那幺不能获得足够的导电性,且表面电阻率将增大。另一方面,如果其超过35重量份,那幺往往难以均匀分散到树脂中,可模制性往往显着变坏,且例如机械强度的特性亦会变坏。In a preferred embodiment of the present invention, the carbon black (C) is selected from the group consisting of furnace black, channel black, superconducting furnace black and conductive furnace black. More preferably, the carbon black (C) has a larger specific surface area, whereby a higher conductivity grade can be obtained with a small amount of carbon black. For example, it could be
Figure A200810006723D00061
or Ketjen
Figure A200810006723D00062
high structure carbon black. The carbon black should be incorporated in an amount such that the surface resistivity is in the range of 10 2 to 10 8 Ω, and preferably from 10 3 to 10 6 Ω. If the surface resistivity exceeds 10 8 Ω, sufficient antistatic effect cannot be obtained, and if it is less than 10 2 Ω, excessive power production capability will thereby destroy electronic parts. The amount of carbon black (C) is from 5 to 35 parts by weight, preferably from 20 to 30 parts by weight, per 100 parts by weight of the copolymer (A) comprising styrene blocks and acrylate blocks. If the amount is less than 5 parts by weight, sufficient conductivity cannot be obtained and surface resistivity will increase. On the other hand, if it exceeds 35 parts by weight, uniform dispersion in the resin tends to be difficult, moldability tends to remarkably deteriorate, and characteristics such as mechanical strength also deteriorate.

在本发明的一个优选实施例中,所述组合物进一步包含(D)苯乙烯-丁二烯共聚物、乙烯-乙酸乙烯酯或氯化聚乙烯。明确地说,所述苯乙烯-丁二烯共聚物提供相当良好的伸长强度而不会改变封装容器与货物之间的密封强度。In a preferred embodiment of the present invention, the composition further comprises (D) styrene-butadiene copolymer, ethylene-vinyl acetate or chlorinated polyethylene. In particular, the styrene-butadiene copolymers provide fairly good elongation strength without altering the strength of the seal between the packaging container and the cargo.

此外,可向根据本发明的组合物添加各种添加剂,例如润滑剂、可塑剂、加工辅助剂、增强剂(树脂改性剂)或用以改进组合物的流动特性和模制产品的动态特性的其它树脂成分以及其混合物。Furthermore, various additives can be added to the composition according to the invention, such as lubricants, plasticizers, processing aids, reinforcing agents (resin modifiers) or to improve the flow properties of the composition and the dynamic properties of molded products Other resin components and their mixtures.

为了制备所述组合物,可同时一起揉和起始物料,或可逐步揉和起始物料且接着最后将揉和产品放在一起并再次揉和。揉和可由例如

Figure A200810006723D00071
Figure A200810006723D00072
双螺杆挤压机的常规机器实现。To prepare the composition, the starting materials can be kneaded together at the same time, or the starting materials can be kneaded step by step and then finally the kneaded products are brought together and kneaded again. Kneading can be done by eg
Figure A200810006723D00071
or
Figure A200810006723D00072
A conventional machine realization of a twin-screw extruder.

根据本发明,此衬底层包含热塑性树脂。举例来说,所述热塑性树脂是丙烯腈-丁二烯-苯乙烯、聚苯乙烯或聚碳酸酯。优选地,所述衬底层是丙烯腈-丁二烯-苯乙烯。薄片层的厚度优选地在0.1到3.0mm之间,且导电表面层的厚度是导电复合塑料薄片的厚度的2到80%。According to the invention, this substrate layer comprises a thermoplastic resin. For example, the thermoplastic resin is acrylonitrile-butadiene-styrene, polystyrene or polycarbonate. Preferably, the substrate layer is acrylonitrile-butadiene-styrene. The thickness of the foil layer is preferably between 0.1 and 3.0 mm, and the thickness of the conductive surface layer is 2 to 80% of the thickness of the conductive composite plastic foil.

根据本发明,此封盖膜被热密封或加压密封到导电复合塑料薄片的表面。优选地,所述封盖膜是聚(对苯二甲酸乙二酯)(PET)膜。According to the present invention, the lidding film is heat-sealed or pressure-sealed to the surface of the conductive composite plastic sheet. Preferably, the lidding film is a poly(ethylene terephthalate) (PET) film.

根据本发明的封装容器可由任何常规方法制造,所述常规方法例如是选自由压力成形、真空成形和热成形组成的群组的方法。Packaging containers according to the invention may be manufactured by any conventional method, for example a method selected from the group consisting of pressure forming, vacuum forming and thermoforming.

仅出于说明目的来给出以下实例,且不希望其限制本发明的范围。The following examples are given for illustrative purposes only and are not intended to limit the scope of the invention.

实例1到5以及比较实例1到6Examples 1 to 5 and comparative examples 1 to 6

表1中列举了所述组合物的含量。衬底层的材料是丙烯腈-丁二烯-苯乙烯树脂。称重各个材料并用高速混合机均匀混合,接着借助于ψ125mm和ψ40mm敞开式双螺杆挤压机揉合,且通过线切方法制成颗粒状以获得导电塑料薄片作为导电表面层。此衬底层在每一侧上层压有导电表面层以形成0.3mm的薄片,其中导电表面层:衬底层:导电表面层的厚度比为1:8:1。Table 1 lists the content of the composition. The material of the substrate layer is acrylonitrile-butadiene-styrene resin. Each material was weighed and uniformly mixed with a high-speed mixer, then kneaded by means of ψ125 mm and ψ40 mm open twin-screw extruders, and granulated by a wire cutting method to obtain conductive plastic flakes as a conductive surface layer. This substrate layer was laminated on each side with a conductive surface layer to form a 0.3mm sheet, with a conductive surface layer:substrate layer:conductive surface layer thickness ratio of 1:8:1.

表1:Table 1:

Figure A200810006723D00073
Figure A200810006723D00073

Figure A200810006723D00081
Figure A200810006723D00081

比较实例6是ECM3,

Figure A200810006723D00082
Comparative example 6 is ECM3,
Figure A200810006723D00082

包含苯乙烯嵌段和丙烯酸酯嵌段的共聚物(A):Copolymer (A) comprising styrene blocks and acrylate blocks:

苯乙烯-甲基丙烯酸甲酯共聚物:PM-200,

Figure A200810006723D00083
Styrene-methyl methacrylate copolymer: PM-200,
Figure A200810006723D00083

苯乙烯-丁二烯-甲基丙烯酸甲酯共聚物:TI-300S,

Figure A200810006723D00084
Styrene-butadiene-methyl methacrylate copolymer: TI-300S,
Figure A200810006723D00084

苯乙烯-丁二烯-甲基丙烯酸甲酯-丙烯腈共聚物:TOYOLAC920,

Figure A200810006723D00085
Styrene-butadiene-methyl methacrylate-acrylonitrile copolymer: TOYOLAC920,
Figure A200810006723D00085

包含烯烃嵌段和烯酸酯嵌段的共聚物(B):Copolymer (B) comprising olefin blocks and enolate blocks:

乙烯-丙烯酸甲酯:EMA 1209,TC020,Exxon 

Figure A200810006723D00087
Ethylene-methyl acrylate: EMA 1209, TC020, Exxon
Figure A200810006723D00087

乙烯-丙烯酸丁酯:EBA 3107,

Figure A200810006723D00088
Ethylene-butyl acrylate: EBA 3107,
Figure A200810006723D00088

(C)碳黑:(C) carbon black:

碳黑:颗粒型,

Figure A200810006723D00089
EC-300J,KETJEN BLACK INTERNATIONAL  Carbon black: granular type,
Figure A200810006723D00089
EC-300J, KETJEN BLACK INTERNATIONAL

(D)苯乙烯-丁二烯共聚物:(D) Styrene-butadiene copolymer:

苯乙烯-丁二烯共聚物:PH-88S,CHI MEI 

Figure A200810006723D000811
HP9450,FORMOSACHEMICALS & FIBRE 
Figure A200810006723D000812
Styrene-butadiene copolymer: PH-88S, CHI MEI
Figure A200810006723D000811
HP9450, FORMOSACHEMICALS & FIBER
Figure A200810006723D000812

氢化苯乙烯-丁二烯共聚物:H1043,

Figure A200810006723D000813
Taipol 3152. Hydrogenated styrene-butadiene copolymer: H1043,
Figure A200810006723D000813
Taipol 3152.

根据以下列举的方法来评价实例1到5以及比较实例1到6的特性:The characteristics of Examples 1 to 5 and Comparative Examples 1 to 6 were evaluated according to the methods enumerated below:

表面电阻率:根据ASTM D-257,采用在可检测范围内的表面电阻率。Surface Resistivity: According to ASTM D-257, the surface resistivity within the detectable range is used.

密封强度:由实例1到5以及比较实例1到6的薄片制备的25mm宽的条带通过密封机(由制造的TP-1000)与封盖膜密封,且导电塑料薄片和封盖膜的密封强度借助于剥离测试机(由OVERTOP TECHNOLOGY CO.,LTD.制造的JE PFT-500)根据EIA-481方法来测量。Seal Strength: 25 mm wide strips prepared from the sheets of Examples 1 to 5 and Comparative Examples 1 to 6 were passed through a sealing machine (by Manufactured TP-1000) was sealed with the lidding film, and the sealing strength of the conductive plastic sheet and the lidding film was tested according to the EIA-481 method by means of a peel tester (JE PFT-500 manufactured by OVERTOP TECHNOLOGY CO., LTD.) Measurement.

机械特性:根据ASTM D-882方法在其横向和纵向方向上将实例1到5以及比较实例1到6的薄片的每一者切割成宽度为2.5cm且长度为20cm的五个条带。所述五个条带的横向和纵向抗张强度以及伸长的平均值由通用抗张测试机获得。Mechanical Properties: Each of the sheets of Examples 1 to 5 and Comparative Examples 1 to 6 were cut in their transverse and longitudinal directions according to the ASTM D-882 method into five strips of width 2.5 cm and length 20 cm. The average values of transverse and longitudinal tensile strength and elongation of the five strips were obtained by a universal tensile testing machine.

剥离强度:根据以下列举的方法来评估实例1到5以及比较实例1到6的薄片的每一者。Peel Strength: Each of the sheets of Examples 1 to 5 and Comparative Examples 1 to 6 was evaluated according to the method listed below.

方法1:通过切割在所述薄片上形成凹口,且接着通过从所述凹口撕去薄片来获得半圆形部分(约5cm2)。称重所述半圆形部分。半圆形部分的重量越大,剥离的导电表面层也就越多。这反映了导电表面层与衬底层之间的兼容性。Method 1: A notch is formed on the sheet by cutting, and then a semicircular portion (about 5 cm 2 ) is obtained by tearing off the sheet from the notch. The semicircular part is weighed. The greater the weight of the half-circle, the more the conductive surface layer will be stripped away. This reflects the compatibility between the conductive surface layer and the substrate layer.

方法2:由实例1到5以及比较实例1到6的薄片制备宽度为25mm且长度为1m的条带,且在240℃的密封温度和40psi的压力下通过密封机(由

Figure A200810006723D00091
制造的TP-1000)将其密封到封盖膜。称重所述封盖膜上的导电表面层的剩余物。剩余物的重量越大,剥离的导电表面层也就越多。这反映了导电表面层与衬底层之间的兼容性。Method 2: Strips with a width of 25 mm and a length of 1 m were prepared from the sheets of Examples 1 to 5 and Comparative Examples 1 to 6, and passed through a sealing machine at a sealing temperature of 240° C. and a pressure of 40 psi (by
Figure A200810006723D00091
Manufactured TP-1000) seal it to the lidding film. The remainder of the conductive surface layer on the lidding film was weighed. The greater the weight of the residue, the more the conductive surface layer will be stripped. This reflects the compatibility between the conductive surface layer and the substrate layer.

结果在表2和3中列举:The results are listed in Tables 2 and 3:

表2:Table 2:

根据表2,实例1到5的表面电阻率与比较实例2到5的表面电阻率几乎相同,因为碳黑含量是相同的(16.67wt%)。According to Table 2, the surface resistivities of Examples 1 to 5 are almost the same as those of Comparative Examples 2 to 5 because the carbon black content is the same (16.67 wt%).

实例1和2未含有(D)苯乙烯-丁二烯共聚物,且其伸长率低于实例3到5的伸长率。与比较实例2相比,实例1添加有5重量%的包含烯烃嵌段和烯酸酯嵌段的共聚物(B),且密封强度和剥离得以改进。随着实例2到5中增加包含烯烃嵌段和烯酸酯嵌段的共聚物(B),密封强度得以显着增加。然而,过量的共聚物(B)(例如在实例5中)造成过高密封强度(超过90g),其将会对封装在由薄片制成的封装容器中的电子零件解开封装时造成干扰。实例1到5的兼容性优于比较实例3到6。Examples 1 and 2 did not contain (D) styrene-butadiene copolymer, and their elongation was lower than that of Examples 3 to 5. Compared with Comparative Example 2, Example 1 was added with 5% by weight of the copolymer (B) containing an olefin block and an enolate block, and seal strength and peeling were improved. As the copolymer (B) comprising olefin block and enolate block was added in Examples 2 to 5, the seal strength was significantly increased. However, an excessive amount of copolymer (B) (for example, in Example 5) results in excessively high sealing strength (over 90 g), which would interfere with unpacking electronic parts packaged in a packaging container made of a sheet. The compatibility of Examples 1 to 5 is better than that of Comparative Examples 3 to 6.

尽管已说明并描述了本发明的多个实施例,但所属领域的技术人员可作出各种修改和改进。希望本发明不限于如说明的特定形式,且不脱离本发明精神和范围的所有修改在所附权利要求书中界定的范围内。While various embodiments of the invention have been illustrated and described, various modifications and improvements will occur to those skilled in the art. It is intended that the invention not be limited to the particular forms as illustrated and that all modifications which do not depart from the spirit and scope of the invention come within the purview of the appended claims.

Claims (20)

1. conductive plastic composites, it comprises:
(A) comprise the multipolymer of styrene block and acrylate block;
(B) comprise the multipolymer of olefin block and olefin(e) acid ester block; And
(C) carbon black;
Described composition is for the described multipolymer that comprises styrene block and acrylate block of per 100 weight parts
(A) contain the described multipolymer (B) that comprises olefin block and olefin(e) acid ester block of 5 to 40 weight parts; And the described carbon black (C) that contains 5 to 35 weight parts for the described multipolymer (A) that comprises styrene block and acrylate block of per 100 weight parts.
2. composition according to claim 1, the wherein said multipolymer (A) that comprises styrene block and acrylate block comprise 10 to 80wt% styrene block.
3. composition according to claim 1, the wherein said acrylate block that comprises the multipolymer (A) of styrene block and acrylate block is selected from the group that is made up of and the following: acrylate, methacrylic ester, methyl methacrylate, butyl acrylate, vinyl cyanide and its mixture.
4. composition according to claim 1, the wherein said multipolymer (A) that comprises styrene block and acrylate block further comprises diene block.
5. composition according to claim 1, the wherein said multipolymer (A) that comprises styrene block and acrylate block is selected from the group that is made up of and the following: styrene-methylmethacrylate copolymer, styrene butadiene-methylmethacrylate copolymer, styrene butadiene-butyl acrylate copolymer, styrene butadiene-methyl methacrylate-acrylonitrile copolymer and its mixture.
6. composition according to claim 1, the wherein said olefin block that comprises the multipolymer (B) of olefin block and olefin(e) acid ester block is an ethene.
7. composition according to claim 1, the wherein said olefin(e) acid ester block that comprises the multipolymer (B) of olefin block and olefin(e) acid ester block is selected from the group that is made up of and the following: butyl acrylate, methacrylic ester, vinyl acrylate and its mixture.
8. composition according to claim 1, the wherein said multipolymer (B) that comprises olefin block and olefin(e) acid ester block is selected from the group that is made up of and the following: ethylene-propylene acid butyl ester, ethylene-methyl acrylate, ethylene-propylene vinyl acetate and its mixture.
9. composition according to claim 1, its described multipolymer (A) that comprises styrene block and acrylate block for per 100 weight parts contains the described multipolymer (B) that comprises olefin block and olefin(e) acid ester block of 20 to 30 weight parts.
10. composition according to claim 1, wherein said carbon black (C) is selected from the group that is made up of and the following: furnace black, channel black, super conducting furnace black and conductive furnace black.
11. composition according to claim 1, it further comprises (D) styrene-butadiene copolymer, ethane-acetic acid ethyenyl ester or chlorinatedpolyethylene.
12. composition according to claim 1, it further comprises additive.
13. composition according to claim 12, wherein said additive is selected from the group that is made up of and the following: lubricant, plasticizer, processing aids, toughener and in order to other resinous principle of the kinetic characteristic of the flow characteristics of improving described composition and moulded product with and composition thereof.
14. a conductive plastics thin slice, it comprises composition according to claim 1.
15. conductive plastics thin slice according to claim 14, it has 10 2To 10 8The surface resistivity of Ω.
16. a conduction composite plastic thin slice, it comprises substrate layer and is laminated to conductive surface layer at least one side of described substrate layer, and wherein said conductive surface layer comprises composition according to claim 1.
17. conduction composite plastic thin slice according to claim 16, wherein said substrate layer is selected from the group that is made up of and the following: acrylonitrile-butadiene-styrene (ABS), polystyrene and polycarbonate.
18. conduction composite plastic thin slice according to claim 17, wherein said substrate layer is an acrylonitrile-butadiene-styrene (ABS).
19. a packaging container, it comprises conduction composite plastic thin slice according to claim 16 and capping film.
20. conduction composite plastic thin slice according to claim 19, wherein said capping film are poly-(ethylene glycol terephthalate) films.
CNA2008100067237A 2007-08-28 2008-01-28 Conductive plastic composition Pending CN101376732A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102993552A (en) * 2012-12-19 2013-03-27 上海邦中新材料有限公司 Anti-static adhesive resin on aluminum surface
US10026519B2 (en) 2010-06-18 2018-07-17 Union Carbide Chemicals & Plastics Technology Llc Electrically conductive, olefin multiblock copolymer compositions
US10096404B2 (en) 2013-09-20 2018-10-09 Dow Global Technologies Llc Process for degassing crosslinked power cables

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10026519B2 (en) 2010-06-18 2018-07-17 Union Carbide Chemicals & Plastics Technology Llc Electrically conductive, olefin multiblock copolymer compositions
CN102993552A (en) * 2012-12-19 2013-03-27 上海邦中新材料有限公司 Anti-static adhesive resin on aluminum surface
US10096404B2 (en) 2013-09-20 2018-10-09 Dow Global Technologies Llc Process for degassing crosslinked power cables

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