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TWI343464B - - Google Patents

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Publication number
TWI343464B
TWI343464B TW094112680A TW94112680A TWI343464B TW I343464 B TWI343464 B TW I343464B TW 094112680 A TW094112680 A TW 094112680A TW 94112680 A TW94112680 A TW 94112680A TW I343464 B TWI343464 B TW I343464B
Authority
TW
Taiwan
Prior art keywords
gas
unit
flow path
support member
fixing plate
Prior art date
Application number
TW094112680A
Other languages
Chinese (zh)
Other versions
TW200538678A (en
Inventor
Takeichi Akihiro
Aoyama Tatsuhito
Miwa Toshikazu
Inoue Takashi
Original Assignee
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corp filed Critical Ckd Corp
Publication of TW200538678A publication Critical patent/TW200538678A/en
Application granted granted Critical
Publication of TWI343464B publication Critical patent/TWI343464B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561Gas plumbing upstream of the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17DPIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00Pipe-line systems
    • F17D1/02Pipe-line systems for gases or vapours
    • F17D1/04Pipe-line systems for gases or vapours for distribution of gas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67103Apparatus for thermal treatment mainly by conduction
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/34Hydrogen distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Details Of Valves (AREA)
  • Valve Housings (AREA)
  • Pipeline Systems (AREA)
  • Chemical Vapour Deposition (AREA)

Description

1343464 九、發明說明: 【發明所屬之技術領域】 本發明是關於一種可使用於半導體製造裝置等的氣體 供給集合單元,進一步詳細地說,是關於一種氣體供给集 S單元,其可在化溫度高的常溫下,不液化不從外部力、 熱且容易液化之二氣矽烷、WF6、HBr等製程氣體的情況下, 以高精度供給這些製程氣體。 【先前技術】 過去,作為半導體積體電路中的絕緣膜,多使用氣相 沉積的氧化矽薄膜等。類似氧化矽等的氣相沉積製程—般 在載置於成臈槽的晶圓上以化學蒸鍍法來進行。 在供給二氣矽烷等液容易液化的製程氣體時,需要對 製耘軋體的供給路線亦即高壓氣體容器、管線、質量流量 控制器、反應室等加熱。其理由4,若二氣矽烷在供給路 線的途令液化,無法正確測量流量’於是所製造之半導體 積體電路的性能惡化。另外’液化後的二氯矽烷等氣體會 堵住附有質量流量計之電磁閥的細管上,導致流量的測量 不正確。 為防止二氣矽烷等氣製程氣體的液化,在專利文獻 的氣體供給裝置中,如第9圖所示,在管線、接頭、氣體閥 62, 64及附有質量流量計之電磁間61等所構成的氣體單元 兩側’以受到在導熱區塊51、料熱區塊52所形成之支持 溝53, 54支持的方式配設帶狀的加熱器6〇,藉此將二氣 2097-7050-PF;Ahddub 5 1343464 ^ 矽烧等製程氣體加熱保溫至汽化溫度以上。 另外’如第10圖所示,導熱區塊51的上面是與附有質 量流量計之電磁閥61下方接觸的接觸面65,其加熱保溫附 有質量流量計之電磁閥6 i。 專利文獻1 :特開平7-286720號公報 【發明内容】 【發明所欲解決的課題】 不過,在專利文獻1之氣體供給裝置中,有下面的問題。 (1) 為了降低氣體供給裝置的成本,宜將其小型化和積 體化,但是,第9圖所示之氣體供給裝置在氣體單元的兩 側,以受到在導熱區塊51、副導熱區塊52所形成之支持溝 53,54支持的方式配設帶狀的加熱器6〇,所以’氣體單元 的寬度會比不需要加熱器的氣體單元來得大。 (2) 氣體供給裝置在氣體單元的兩側需要很多導埶區 •塊51及副導熱區塊52等用來加熱保溫的元件’成本提高。 因此,本發明為解決該課題,提供一種氣體供給集合 單元,其可在常溫常壓下一邊加熱保一邊供給容易液化的 製程氣體。 【用以解決課題的手段】 本發明之氣體供給集合單元Al丄 干几马了解決上述課題,具有 下面的構造。 包括:設置於出口流路的 (1) 一種氣體供給集合單元, 6 2097-7050-PF;Ahddub 1343464 第一手動閥、設置於連通該坌 遇系第一手動間和製程氣體共通流 路之位置的氣動閥'設置於 j, ^迓、該第一手動閥和氣提氣體 共通流路之位置的第二手動 4及複數個藉由流路區塊及單 元固定板連結成一整個 鬼及早 妁巩體早兀,其特徵在於包 括.支持構件,其剖面為n字 _ 子^•且嵌合上述流路區塊及單1343464 IX. Description of the Invention: Technical Field The present invention relates to a gas supply assembly unit that can be used in a semiconductor manufacturing apparatus and the like, and more particularly to a gas supply set S unit which can be at a temperature At a high normal temperature, these process gases are supplied with high precision without liquefying a process gas such as dioxane, WF6 or HBr which is not externally heated, heated and easily liquefied. [Prior Art] In the past, as an insulating film in a semiconductor integrated circuit, a vapor deposited yttrium oxide film or the like is often used. A vapor deposition process such as ruthenium oxide is generally carried out by chemical vapor deposition on a wafer placed on a crucible. When a process gas in which a liquid such as dioxane is easily liquefied is supplied, it is necessary to heat a supply path of the rolled body, that is, a high pressure gas container, a line, a mass flow controller, a reaction chamber, and the like. The reason 4 is that if the dioxane is liquefied on the supply route, the flow rate cannot be accurately measured, and the performance of the manufactured semiconductor integrated circuit deteriorates. In addition, gases such as chlorinated dichloromethane block the thin tube of the solenoid valve with the mass flow meter, resulting in incorrect flow measurement. In order to prevent liquefaction of a gas process gas such as dioxane, in the gas supply device of the patent document, as shown in Fig. 9, the pipeline, the joint, the gas valves 62, 64, and the electromagnetic chamber 61 with the mass flow meter are provided. The two sides of the gas unit are configured to be provided with a strip-shaped heater 6 支持 in a manner supported by the support grooves 53 and 54 formed by the heat-conducting block 51 and the heat-heating block 52, whereby the two gas 2097-7050- PF; Ahddub 5 1343464 ^ Process gases such as simmering are heated and kept above the vaporization temperature. Further, as shown in Fig. 10, the upper surface of the heat transfer block 51 is a contact surface 65 which is in contact with the lower side of the solenoid valve 61 to which the mass flow meter is attached, and heats and holds the solenoid valve 6 i attached to the mass flow meter. [Problem to be Solved by the Invention] However, the gas supply device of Patent Document 1 has the following problems. (1) In order to reduce the cost of the gas supply device, it is preferable to miniaturize and integrate the gas supply device, but the gas supply device shown in Fig. 9 is received on both sides of the gas unit to receive the heat transfer block 51 and the sub heat transfer portion. The strip-shaped heaters 6 are disposed in such a manner that the support grooves 53, 54 formed by the block 52 are supported, so that the width of the gas unit is larger than that of the gas unit not requiring the heater. (2) The gas supply device requires a large number of guide zones on both sides of the gas unit. • The block 51 and the sub-heat transfer block 52 are used to heat the insulated components. Accordingly, the present invention has been made to solve the above problems, and provides a gas supply collecting unit capable of supplying a process gas which is easily liquefied while being heated while being kept at a normal temperature and a normal pressure. [Means for Solving the Problem] The gas supply collecting unit A1 of the present invention solves the above problems several times and has the following structure. The utility model comprises: (1) a gas supply assembly unit disposed on the outlet flow path, 6 2097-7050-PF; Ahddub 1343464, a first manual valve disposed at a position connecting the first manual chamber of the encounter system and the common flow path of the process gas The pneumatic valve 'is disposed at the position of j, ^ 迓, the first manual valve and the stripping gas common flow path, the second manual 4 and the plurality of the flow path block and the unit fixing plate are connected to form a whole ghost and early body The early sputum is characterized in that it comprises a supporting member whose cross section is n-word _ sub-^ and is fitted with the above-mentioned flow path block and single

兀固疋板;及平面加熱器,A 其以夾在上述支持構件、上述 流路區塊及上述單元固定板 心败之間的方式來固定。 (2) 如申請專利範圍第 項之虱體供給集合單元,苴 中,上述氣體單元嵌合至上述 、 叉符構件,具有締結之導軌、 夾在上述支持構件和上述導軌 守軌之間的板狀之隔板構件。 (3) 如申請專利範圍第1 項之軋體供給集合單元,其 中,包括:一個或兩個以上的 “ 上的千面加熱器,其連接至上述 。。’ 叉符構件,其支持上述平面加熱 為,及支持構件固定板,其% & 兵將上述平面加熱器失在上述支 持構件、上述流路區塊及上 持構件。 早疋固疋板之間,以固定支 【發明效果】 本發明之氣體供給集合單 〇早70可達到下面的作用效果。 本發明之氣體供給集合罩 早π匕括設置於出口流路的第 —手動閥、設置於連通該第一 于動閥和製程氣體共通流路 之位置的氣動閥、設置於連 遇这第—手動閥和氣提氣體共 通流路之位置的第二手動閥及 孔骽/、 複數個4由流路區塊及單元 固定板連結成一整個直列的氣 礼體早π,其特徵在於包括: 2097-7050-PF;Ahddub ⑧ 1^43464 ^夺構件,其剖面為η字型且嵌合上述流路區塊及單元固 3,及平面加熱器’其以夾在上述支持構件、上述流路 :及上固定板之間的方式來固定,所以,氣體單 兀’夕形尺寸可和不需要平面加熱器之氡體單元完全相 於是,即使是集合氣體單元之後的整個氣體供給集合 二也不需要變化外形尺寸。再者’氣體單元的流路區 早疋固定板從背面加錢溫,所以,作為用來加熱保 ‘的元件,對-個氣體單元來說,只要—個平面加熱器和 個支持構件就夠了,可減少元件個數,降低成本。 另外,本發明之氣體供給集合單元,其中,上述氣體 單元敌合至上述支持構件,具有締結之導轨、夹在上述支 持構件和上述導轨之間的板狀之隔板構件,所以,藉由取 出隔板構件,可在繼續維持可使用氣體供給集合單^的狀 態下’拆卸平面加熱器’安裝其他平面加熱器。如此,容 易交換平面加熱器,容易維修。 另外,本發明之氣體供給集合單元包括:一個或兩個 以上的平面加熱n,其連接至上述氣體單元的底面而配 置,支持構件,其支持上述平面加熱器;及支持構件固定 板,其將上述平面加熱器夾在上述支持構件、上 塊及上述單元固定板之間,卩固定支持構件,所以,不需 要在每個氣體單元上分別設置一個平面加熱器和一個支持 構件,可對整個氣體供給集合單元分別設置—個或兩個以 上的平面加熱器和一個或兩個以上的支持構件,如此,用 來加熱保溫氣體供給集合單元的元件個數減少,可降低成 2097-7050-PF;Ahddub 8 本。再者’藉由減少平面加熱器的個數,可使配線變得容 易’而且也變得容易交換平面加熱器。 【實施方式】 下面將根據附加圖面說明本發明之氣體供給集合單元 的實施例。 (第1實施例) 第1圖為顯示對5個管線供給製程氣體之氣體供給集合 單元的構造的俯視圖,第2圖為第j圖的前視圖,第3圖為第 1圖的電路圖。 兩條導軌10’ 12藉由導軌固定棒13,丨4平行固定兩 端。使氣提氣體單元、製程氣體單元、氣體單元A,B,c,D 和導軌固定棒1 3,1 4平行,從左邊開始分別藉由單元固定 板,以可在水平方向沿著導軌1〇,丨2平行移動的方式來安 裝。分別安裝於氣提氣體單元、製程氣體單元、氣體單元 A, B’ C,D上之機器的電路構造如第3圖所示。 氣提氣體手動閥29透過氣提氣供給口 28,和未圖示的 氣提氣體槽連接。氣提氣體手動閥29透過氣動閥32、逆止 閥33、氣提氣體共通流路43,連接至第二手動閥25A, 25B, 25C,25D,25E—邊的埠上《在連通氣提氣體手動閥29和氣 動閥32的流路上,連通有壓力計31。第二手動閥25A,25B, 25C, 25D, 25E另一邊的埠連接至調節器24A,24B,24C, 24D,24E—邊的埠上。 製程氣體手動閥35透過製程氣體供給口 34,和未圖示 2097-7050-PF;Ahddub 9 1343464 - 的製程氣體槽連接。製程氣體手動閥35透過氣動閥37、製 程氣體共通流路44,連接至氣動閥26A,26B,26C,26D,26E 一邊的埠上。在連通製程氣體手動閥35和氣動閥37的流路 上,連通有壓力計36。 氣動閥26A,26B,26C,26D,26E另一邊的埠連接至調 節器 24A,24B,24C,24D,24E—邊的埠上。調節器 24A,24B, 24C, 24D,24E另一邊的埠透過第一手動閥22A,22B,22C, 22D,22E ’ 和製程氣體出口 21A,21B,21C,21D,21E連通。 ® 在連通調節器24A,24B,24C,24D,24E和第一手動閥22A, 22B,22C’ 22D, 23E的流路上,連通有壓力計23A,23B, 23C, 23D, 23E 。 製程氣體共通流路44的先端藉由製程氣體共通流路先 端手動閥41來密封。另外,氣提氣體共通流路43的先端藉 由氣提氣體共通流路先端手動閥38來密封。 第4圖為氣體供給集合單元之丨條管線之氣體單元之組 • 裝順序的立體圖。有關氣提氣體單元、製程氣體單元、氣 體早π A,B, C’ D中任一單元,亦完全相同。氣體單元的 各機器透過流路區塊46(參照第2圖),藉由單元固定板丨5, 連結為一整個直列。單元固定板15和配設於單元固定板15 下方的平面加熱器16嵌合至支持構件18和字型剖面。單 疋固定板15在支持構件18和導軌1〇 '導軌12之間夾住板狀 之隔板構件19’在導軌10、導軌12上藉由締結裝置⑼來固 見在說明如此没置之本發明第j實施例之氣體供給集 2〇97-7050-PF;Ahddub 10 1343464 " 合單兀的運作及其作用效果。首先說明氣體供給集合單元 的整體作用。當對半導體製程供給製程氣體時,開啟製程 氣體手動閥35及第一手動閥22A, 22B,22C, 22D,22E,透 過訊號開啟氣動閥37及氣動閥26A,26B,26C,26D,26E。 關閉氣提氣體電路的氣提氣體手動閥29及第二手動閥25八, 25B’ 25C,25D,25E,透過訊號關閉氣動閥3卜藉此,製 程氣體從未圖示之製程氣體槽,經由製程氣體供給口34、 _ 製程氣體手動閥35、氣動閥37、製程氣體共通流路44、氣 動閥 26A’ 26B, 26C,26D,26E,流至調節器 24A,24B,24C, 24D, 24E,從第一手動閥22A,22B,22C,22D,22E,經由 笔程氣體出口21A,21B,21C,21D,21E,留至供給目標。 其次,當氣體單元需要維修時,可在停止製程氣體的 供給之後實施。此時,電路暴露在大氣中,為了除去大氣 中的水氣,對電路導入氮氣亦即氣提氣體。換言之,關閉 製程氣體手動閥35,透過訊號關閉氣動閥37,遮斷製程氣 •I 體的流動。然後,開啟氣提氣體手動閥25A,25B,25C,25D, 25E,透過訊號開啟氣動閥32。如此,從未圖示的氣提氣體 槽,將氮氣亦即氣提氣體導入氣體單元A,B,c,D,E的各 管線中。換言之,氣提氣體經由氣提氣體手動閥29、氣動 閥32、逆止閥33、氣提氣體共通流路43、第二手動閥25A, 25B,25C,25D,25E,流至調節器 24A,24B,24C,24D, 24E,從第一手動閥22A,22B,22c,22D,22E,經由製程 氣體出口 21A,21B,21C,21D,21E,排出至排氣系統。然 後,在既定時間後,關閉氣提氣體手動閥29、第二手動閥 2097-7050-PF;Ahddub 11 1343464 *· 25A,25B,25C,25D,25E,透過訊號關閉氣動閥32,中止 氣提氣體的流入》 其次說明平面加熱器16的作用。關於氣提氣體單元、 製程氣體單元、氣體單元A,B,c,D,Ε中任何一者,亦完 全相同。平面加熱器16配設於單元固定板15的下方,嵌合 至支持構件1 8的门字型剖面上。當製程氣體流過氣體供給 集合單元時’對平面加熱器16通電以產生焦耳熱,此熱透 ^ 過單元固定板15,被傳送至氣提氣體單元、製程氣體單元、 氣體單元A,B,C,D,Ε的流路區塊46及流路區塊46上所安 裝的機器。如此’將熱傳送至氣體單元的流路區塊46及單 元固定板15上所安裝的機器上,藉此,製程氣體流過之單 元内部的溫度可維持在製程氣體的凝結溫度以上。於是, 可防止在製程氣體單元、氣體單元A,β,C,D,Ε内因製程 氣體液化所導致的種種不良情況。 其次,將參照顯示第1圖之A-A部剖面的第5圖及顯示平 _ 面加熱器16之拆卸的第6圖來說明隔板構件19的作用。將藉 由氣體單元E的剖面圖來作說明,其中有關氣提氣體單元' 製程氣體單元、氣體單元A,B,C,D中任一單元,亦完全 相同。配設於單元固定板丨5和單元固定板15下方的平面加 熱器16嵌合至支持構件18的门字型剖面,單元固定板15在 支持構件18和導轨1〇、導軌12之間夾住板狀之隔板構件 19,藉由缔結裝置20固定於導軌1〇、導軌12上。當需要交 換平面加熱器1 6時’拆卸締結裝置20並取出隔板構件丨6, 藉此,可在繼續維持可使用氣體供給集合單元的狀態下, 12 2097-7050-PF;Ahddub 1343464 拆卸第6圖所示之平面加熱器16,安裝上其他的平面加熱器 16° 如以上所詳細說明,根據第1實施例之氣體供給集合單 元包括設置於出口流路的第一手動閥22、設置於連通該第 —手動閥22和製程氣體共通流路44之位置的氣動閥26、設 置於連通該第一手動閥22和氣提氣體共通流路43之位置的 第一手動閥25及複數個藉由流路區塊46及單元固定板15連 ^ 結成一整個直列的氣體單元,其特徵在於包括:支持構件 18,其剖面為门字型且嵌合上述流路區塊46及單元固定板 15 ;及平面加熱器16 ’其以夾在上述支持構件18、上述流 路區塊46及上述單元固定板15之間的方式來固定,所以, 氣體單元的外形尺寸可和不需要平面加熱器16之氣體單元 完全相同。於是,即使是集合氣艎單元之後的整個氣體供 給集合單元,也不需要變化外形尺寸。再者,氣體單元的 流路區塊4 6及單元固定板15從背面加熱保溫,所以,作為 • 用來加熱保溫的元件,對一個氣體單元來說,只要一個平 面加熱器和一個支持構件就夠了,可減少元件個數,降低 成本。 另外,根據第1實施例之氣體供給集合單元,上述氣體 單元嵌合至上述支持構件18,具有締結之導軌1〇、導軌12、 夾在上述支持構件18和上述導軌10、導軌12之間的板狀之 隔板構件19,所以,容易交換平面加熱器“,容易維修。 亦即,藉由取出隔板構件19,可在繼續維持可使用氣體供 給集合單元的狀態下,拆卸平面加熱器丨6,安裝其他平面 2097-7050-PF;Ahddub 13 1343464 加熱器1 6。 (第2實施例) 接著根據附加圖面說明本發明之氣體供給集合單元的The tamping plate and the planar heater A are fixed in such a manner as to be sandwiched between the support member, the flow path block, and the unit fixing plate. (2) The corpus supply unit of claim 1, wherein the gas unit is fitted to the fork member, and has a guide rail and a plate sandwiched between the support member and the rail. a baffle member. (3) The rolling body supply assembly unit of claim 1 of the patent application, comprising: one or more "upper thousand surface heaters connected to the above-mentioned .." fork member, which supports the above plane Heating and supporting member fixing plate, wherein the % & soldier loses the planar heater to the support member, the flow path block and the upper holding member. The gas supply assembly of the present invention can achieve the following effects. The gas supply assembly cover of the present invention includes a first manual valve disposed in the outlet flow path, and is disposed in communication with the first active valve and the process. a pneumatic valve at a position of the gas common flow path, a second manual valve disposed at a position where the first manual valve and the stripping gas common flow path are connected, and a plurality of holes 4, and a plurality of 4 are connected by a flow path block and a unit fixing plate Forming an entire in-line gas ceremony early π, which is characterized by: 2097-7050-PF; Ahddub 8 1^43464 ^ member, the cross-section is η-shaped and the above-mentioned flow path block and unit solid 3 are fitted, and Flat heater It is fixed in such a manner as to be sandwiched between the above-mentioned support member, the above-mentioned flow path: and the upper fixing plate. Therefore, the gas single-shaped shape can be completely equivalent to the body unit which does not require the planar heater, even if it is a collection. The entire gas supply set 2 after the gas unit does not need to change the outer dimensions. Furthermore, the flow path area of the gas unit is earlier than the fixed plate, and the temperature is increased from the back side. Therefore, as a component for heating the heat, a gas is used. In the unit, as long as a planar heater and a supporting member are sufficient, the number of components can be reduced, and the cost can be reduced. Further, the gas supply assembly unit of the present invention, wherein the gas unit is hosted to the support member, a guide rail and a plate-shaped partition member sandwiched between the support member and the guide rail. Therefore, by removing the partition member, the plane can be disassembled while maintaining the usable gas supply assembly unit. The heater 'installs other planar heaters. Thus, it is easy to exchange the planar heaters and is easy to maintain. In addition, the gas supply assembly unit of the present invention includes: One or more plane heating n, which is connected to the bottom surface of the gas unit, a supporting member supporting the planar heater; and a supporting member fixing plate that sandwiches the planar heater on the support member Between the block and the unit fixing plate, the supporting member is fixed, so that it is not necessary to separately provide one planar heater and one supporting member on each gas unit, and one or two or more of the entire gas supply collecting unit may be separately provided. The planar heater and one or more supporting members, such that the number of components used to heat the insulating gas supply assembly unit is reduced, and can be reduced to 2097-7050-PF; Ahddub 8 is. Further by reducing the plane The number of heaters makes wiring easy~ and it becomes easy to exchange planar heaters. [Embodiment] Hereinafter, an embodiment of a gas supply assembly unit of the present invention will be described based on additional drawings. (First Embodiment) Fig. 1 is a plan view showing a structure of a gas supply assembly unit for supplying process gas to five lines, Fig. 2 is a front view of Fig. j, and Fig. 3 is a circuit diagram of Fig. 1. The two guide rails 10' 12 are fixed to the rods 13 by rails, and the crucibles 4 are fixed in parallel at both ends. The stripping gas unit, the process gas unit, the gas unit A, B, c, D and the rail fixing rods 13 3, 1 4 are parallel, and are respectively fixed from the left side by the unit fixing plate so as to be horizontally along the guide rail 1 , 丨 2 parallel move way to install. The circuit configuration of the machines mounted on the stripping gas unit, the process gas unit, and the gas units A, B' C, and D, respectively, is shown in Fig. 3. The stripping gas manual valve 29 is connected to the stripping gas tank (not shown) through the stripping gas supply port 28. The stripping gas manual valve 29 is connected to the second manual valve 25A, 25B, 25C, 25D, and 25E through the pneumatic valve 32, the check valve 33, and the stripping gas common flow path 43, and is connected to the stripping gas. A pressure gauge 31 is connected to the flow path of the manual valve 29 and the pneumatic valve 32. The second side of the second manual valve 25A, 25B, 25C, 25D, 25E is connected to the adjusters 24A, 24B, 24C, 24D, 24E. The process gas manual valve 35 is connected through a process gas supply port 34 to a process gas tank (not shown) of 2097-7050-PF; Ahddub 9 1343464. The process gas manual valve 35 is connected to the side of the pneumatic valves 26A, 26B, 26C, 26D, 26E through the pneumatic valve 37 and the process gas common flow path 44. A pressure gauge 36 is connected to the flow path connecting the process gas manual valve 35 and the pneumatic valve 37. The enthalpy on the other side of the pneumatic valves 26A, 26B, 26C, 26D, 26E is connected to the regulators 24A, 24B, 24C, 24D, 24E. The dams on the other side of the regulators 24A, 24B, 24C, 24D, 24E communicate with the process gas outlets 21A, 21B, 21C, 21D, 21E through the first manual valves 22A, 22B, 22C, 22D, 22E'. The pressure gauges 23A, 23B, 23C, 23D, 23E are connected to the flow paths of the communication regulators 24A, 24B, 24C, 24D, 24E and the first manual valves 22A, 22B, 22C' 22D, 23E. The tip end of the process gas common flow path 44 is sealed by the process gas common flow path leading end manual valve 41. Further, the tip end of the stripping gas common flow path 43 is sealed by the stripping gas common flow path tip end manual valve 38. Fig. 4 is a view showing a group of gas units of a purlin line of a gas supply assembly unit. The unit of the stripping gas unit, the process gas unit, and the gas π A, B, C' D is also identical. Each of the gas unit passes through the flow path block 46 (see Fig. 2), and is connected to the entire in-line by the unit fixing plate 丨5. The unit fixing plate 15 and the planar heater 16 disposed under the unit fixing plate 15 are fitted to the support member 18 and the letter profile. The single-plate fixing plate 15 sandwiches the plate-shaped partition member 19' between the support member 18 and the guide rail 1'' of the guide rail 12, and is fixed on the guide rail 10 and the guide rail 12 by the knotting device (9). The gas supply set of the jth embodiment of the invention is 2〇97-7050-PF; Ahddub 10 1343464 " the operation of the combined sputum and its effect. First, the overall function of the gas supply assembly unit will be explained. When the process gas is supplied to the semiconductor process, the process gas manual valve 35 and the first manual valves 22A, 22B, 22C, 22D, 22E are opened, and the pneumatic valve 37 and the pneumatic valves 26A, 26B, 26C, 26D, 26E are opened by the signal. The stripping gas manual valve 29 and the second manual valve 25, 25B' 25C, 25D, 25E of the stripping gas circuit are turned off, and the pneumatic valve 3 is closed by the signal, whereby the process gas is passed through a process gas tank not shown. Process gas supply port 34, _ process gas manual valve 35, pneumatic valve 37, process gas common flow path 44, pneumatic valves 26A' 26B, 26C, 26D, 26E, flow to regulators 24A, 24B, 24C, 24D, 24E, From the first manual valves 22A, 22B, 22C, 22D, 22E, to the supply target via the pencil gas outlets 21A, 21B, 21C, 21D, 21E. Secondly, when the gas unit needs to be repaired, it can be implemented after the supply of the process gas is stopped. At this time, the circuit is exposed to the atmosphere, and in order to remove moisture in the atmosphere, nitrogen gas, that is, stripping gas, is introduced into the circuit. In other words, the process gas manual valve 35 is closed, and the pneumatic valve 37 is closed by the signal to interrupt the flow of the process gas. Then, the stripping gas manual valves 25A, 25B, 25C, 25D, 25E are turned on, and the pneumatic valve 32 is opened by the signal. Thus, nitrogen gas, i.e., stripping gas, is introduced into each of the gas lines A, B, c, D, and E from a stripping gas tank (not shown). In other words, the stripping gas flows to the regulator 24A via the stripping gas manual valve 29, the pneumatic valve 32, the check valve 33, the stripping gas common flow path 43, and the second manual valves 25A, 25B, 25C, 25D, 25E. 24B, 24C, 24D, 24E are discharged from the first manual valves 22A, 22B, 22c, 22D, 22E to the exhaust system via the process gas outlets 21A, 21B, 21C, 21D, 21E. Then, after a predetermined time, the stripping gas manual valve 29 and the second manual valve 2097-7050-PF are closed; Ahddub 11 1343464 *· 25A, 25B, 25C, 25D, 25E, and the pneumatic valve 32 is turned off by the signal to stop the stripping Inflow of Gas Next, the function of the planar heater 16 will be described. Any one of the stripping gas unit, the process gas unit, and the gas unit A, B, c, D, and Ε is also identical. The flat heater 16 is disposed below the unit fixing plate 15 and fitted to the gate-shaped cross section of the support member 18. When the process gas flows through the gas supply assembly unit, 'the planar heater 16 is energized to generate Joule heat, which is transmitted to the stripping gas unit, the process gas unit, the gas unit A, B, C, D, Ε flow path block 46 and the machine installed on flow path block 46. Thus, heat is transferred to the flow path block 46 of the gas unit and the machine mounted on the unit fixing plate 15, whereby the temperature inside the unit through which the process gas flows can be maintained above the condensation temperature of the process gas. Thus, various disadvantages caused by the liquefaction of the process gas in the process gas unit, the gas unit A, β, C, D, and the crucible can be prevented. Next, the action of the partition member 19 will be described with reference to Fig. 5 showing a cross section of the A-A portion in Fig. 1 and Fig. 6 showing the disassembly of the flat surface heater 16. It will be explained by a sectional view of the gas unit E, in which any one of the process gas unit, the gas unit A, B, C, and D of the stripping gas unit is also identical. The planar heater 16 disposed under the unit fixing plate 丨5 and the unit fixing plate 15 is fitted to the gate-shaped cross section of the support member 18, and the unit fixing plate 15 is sandwiched between the support member 18 and the guide rail 1 and the guide rail 12. The plate-shaped partition member 19 is fixed to the guide rail 1 and the guide rail 12 by the knotting device 20. When the planar heater 16 needs to be exchanged, the disengagement device 20 is removed and the partition member 丨6 is taken out, whereby the gas supply unit can be maintained, 12 2097-7050-PF; Ahddub 1343464 disassembled. The planar heater 16 shown in Fig. 6 is mounted with another planar heater 16°. As described in detail above, the gas supply assembly unit according to the first embodiment includes a first manual valve 22 disposed at the outlet flow path, and is disposed at a pneumatic valve 26 that connects the first manual valve 22 and the process gas common flow path 44, a first manual valve 25 that is disposed at a position that communicates the first manual valve 22 and the stripping gas common flow path 43, and a plurality of The flow path block 46 and the unit fixing plate 15 are connected together to form an entire in-line gas unit, comprising: a support member 18 having a cross-section of a gate shape and fitting the flow path block 46 and the unit fixing plate 15; And the planar heater 16' is fixed between the support member 18, the flow path block 46, and the unit fixing plate 15, so that the outer shape of the gas unit can be different from that of the planar heater 1 The gas unit of 6 is identical. Thus, even if the entire gas after the collection of the gas unit is supplied to the collecting unit, it is not necessary to change the outer shape. Furthermore, the flow path block 46 of the gas unit and the unit fixing plate 15 are heated and insulated from the back surface. Therefore, as a component for heating and holding heat, for a gas unit, only one planar heater and one supporting member are required. Enough, you can reduce the number of components and reduce costs. Further, according to the gas supply assembly unit of the first embodiment, the gas unit is fitted to the support member 18, and has a guide rail 1〇, a guide rail 12, and a sandwiching between the support member 18 and the guide rail 10 and the guide rail 12. Since the plate-shaped partition member 19 is easy to exchange the flat heater, it is easy to maintain. That is, by taking out the partition member 19, the flat heater can be disassembled while maintaining the usable gas supply assembly unit. 6. Mounting other planes 2097-7050-PF; Ahddub 13 1343464 heaters 16. (Second embodiment) Next, the gas supply assembly unit of the present invention will be described based on additional drawings.

的俯圖為顯示相同之氣體供給集合單元的構造 的俯視圖,第8圖為第7圖的B_B 藉由導軌固定棒U,14平行固定兩^兩條導轨1〇, 12 製程…—— 使氣提氣體單元、 Ϊ程亂體早7°、氣體單元^,〇,[和導軌固定棒13,14 從左邊開始分別藉由單元固定板,以可在水平方向 沿者導軌10’ 12平行移動的方式來安裝。 -平面加熱器17可為-個或兩個以上,在第7及第8圖中 的示例為兩個。兩個平面加埶哭】7 十面加熱益17連接至分別固定氣提氣 體早元、製程氣體單元、氣體單元A,B,c,D,e之單元固 疋板15的下方’以垂直相交的方式配設於單元固定板㈣ 長邊方向。兩個平面加熱器17分別受到支持構錢的支 持,支持構件48藉由締結裝置49並藉由兩個支持構件固定 板47來固定。一個支持構件固定㈣和導軌固定棒㈣ 仃’安裝於製程氣體單元的左側,另一個支持構件固定板 47和導軌固定棒14平行’安裝於氣體單元E的幻則。兩個支 持構件固定板47的兩端分別固定於導軌1〇,12上。 現在說明如此設置之本發明第2實施例之氣體供給集 合早7L的運作及其作用效果。有關氣體供給集合單元的整 體作用’和第1實施例相同,戶斤以省4,在此僅說明平面加 熱器17的作用◊平面加熱器17以連接至單元固定板15下方 的方式來配設’受到支持構件48的支持。當製程氣體流過 2097-7〇5〇.pp;Ahddub 14 1J43464 軋體供給集合單元時,對平面加熱器1 7通電以產生焦耳 此二透過早疋固定板15 ’被傳送至氣提氣體單元、製 氣體單元、氣體單元A,B,c,D,E的流路區塊46上所安 裝的機Is。如此,將敲伯j — 此將熱傳送至各早兀之流路區塊46上所安 裝的機器上,藉1卜,制你A城— 错此製程軋體流過之皁元内部的溫度可維 持在裝程氣體的凝結溫度以上。於是,可防止在製程氣體 單疋氣體單元A,B,c,D’ E内因製程氣體液化所導致的 種種不良情況。 鲁 “ 人,藉由顯不之第7圖之第2實施例之氣體供給集合 單元的構造的俯視圖及顯示第7圖之B_B部剖面的第8圖來 說明平面加熱器〗7的拆卸。平面加熱器1 7從第7圖的右側方 向來看,共有左右兩個。有關左側的平面加熱器丨7的安裝 狀態,在第8圖中顯示未藉由締結裝置48來緊密接合支持構 件48,有關右側的平面加熱器17的安裝狀態,在第8圖中顯 示藉由締結裝置8緊密接合支持構件48。例如,從第7囷的 右側方向來看’當需要交換右側的平面加熱器17時,從第7 圖的右側方向來看,使之成為左側的平面加熱器丨7的狀態 (參照第8圖)’在繼續維持可使用氣體供給集合單元的狀態 下,在第7圖所示箭頭K1的方向拆卸平面加熱器丨7並在第7 圖所示箭頭K2的方向插入其他平面加熱器17後,藉由締結 裝置49將支持構件48固定於支持構件固定板47上。 如以上所詳細說明,根據第2實施例之氣體供給集合單 元’本發明之氣體供給集合單元包括:一個或兩個以上的 平面加熱器17,其連接至上述氣體單元的底面而配置;支 2097-7050-PF;Ahddub 15 1343464 、持構件48,其支持上述平面加熱器17;及支持構件固定板 47’其將上述平面加熱器17夾在上述支持構件“、上述流 路區塊46及上述單元固定板15之間,以固定支持構件/ 所以,氣體單元的外形尺寸可和不需要平面加熱器之氣體 早疋完全相同。於是,即使是集合氣體草元之後的整個氣 體供給集合單元,也不需要變化外形尺寸。再者,不需要 在每個氣體單元上分別設置一個平面加熱器17和一個支持 鲁構件48’可對整個氣體供給集合單元分別設置一個或兩個 以上的平面加熱器17和一個或兩個以上的支持構件“,如 此,用來加熱保溫氣體供給集合單元的元件個數減少,可 降低成本。再者,藉由減少平面加熱器17的個數,可使配 線變得容易,而且也變得容易交換平面加熱器17。 此外,上面已說明了本發明的實施例,但本發明不受 上述實施例的限定,可有各種應用。 广例如,雖在上述實施例中,於氣體供給集合單元上安 •裝氣動Μ ’但所安裝之流體控制冑器的種類並不受到此限 制,可作適當變化。 例如,在上述第2實施例中,當拆卸平面加熱器口時, 在第7圖所不箭頭K1的方向拆卸平面加熱器κ並在第7 圖所示箭頭K2的方向插入其他平面加熱器17,但亦可在 第:圖所示箭頭。的方向拆卸平面加熱器17並在第了圖 所示箭頭K1的方向插入其他平面加熱器 【圖式簡單說明】 16 2097-7050-PF;Ahddub j343464 第1圖為顯示本發明第1實施例之氣體供給集合單元的 構造的俯視圖。 第2圖為本發明第1實施例之氣體供給集合單元的前視 圖。 第3圖為顯示第1圖之構造的電路圖。 第4圖為顯示本發明第1實施例之氣體單元之組裝順序 的立體圖。 第5圖為第1圖之A-A部的剖面圖。 第6圖為顯示於第5圖中拆下加熱器16的圖。 第7圖為顯示本發明第2實施例之氣體供給集合單元的 構造的俯視圖。 第8圖為第7圖之B-B部的剖面圖。 第9圖習知之氣體供給裝置的立體圖。 第10圖為說明第9圖之導熱區塊的圖。The top view is a top view showing the structure of the same gas supply assembly unit, and the eighth figure is B_B of Fig. 7 by the rail fixing rods U, 14 parallelly fixing the two rails 1 〇, 12 processes... The stripping gas unit, the process block 7°, the gas unit ^, 〇, [and the rail fixing bars 13, 14 are respectively moved from the left side by the unit fixing plate so as to be movable in the horizontal direction along the guide rail 10' 12 The way to install. - The planar heaters 17 may be one or two or more, and the examples in the seventh and eighth figures are two. The two planes are 埶 】 】 】 7 面 加热 益 7 7 7 7 7 7 7 7 7 7 7 7 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接The way is arranged in the direction of the long side of the unit fixing plate (4). The two planar heaters 17 are respectively supported by the support structure, and the support member 48 is fixed by the knotting means 49 and by the two support member fixing plates 47. A support member fixing (4) and a rail fixing rod (4) 仃' are mounted on the left side of the process gas unit, and the other support member fixing plate 47 and the rail fixing rod 14 are parallel-mounted in the magical state of the gas unit E. Both ends of the two supporting member fixing plates 47 are fixed to the guide rails 1 and 12, respectively. The operation of the gas supply collection of the second embodiment of the present invention thus provided, 7L earlier, and the effect thereof will now be described. The overall function of the gas supply assembly unit is the same as that of the first embodiment, and the operation is omitted. Here, only the action of the planar heater 17 is described. The planar heater 17 is disposed to be connected to the lower side of the unit fixing plate 15. 'Supported by support component 48. When the process gas flows through the 2097-7〇5〇.pp; Ahddub 14 1J43464 rolling body supply unit, the planar heater 17 is energized to generate the joule. The second through the early fixing plate 15' is transferred to the stripping gas unit. The machine Is installed on the flow path block 46 of the gas unit, the gas unit A, B, c, D, E. In this way, the heat will be transferred to the machine installed on each of the early flow blocks 46, and the temperature of the inside of the soap body flowing through the rolling mill will be made by one. It can be maintained above the condensation temperature of the process gas. Thus, various disadvantages caused by the liquefaction of the process gas in the process gas unit gases A, B, c, and D' E can be prevented. Lu's "management" is illustrated by a plan view showing the structure of the gas supply assembly unit of the second embodiment of the seventh embodiment and an eighth diagram showing the cross section of the B_B portion of Fig. 7. The heater 17 has two left and right sides as seen from the right side of Fig. 7. Regarding the mounting state of the planar heater 丨7 on the left side, it is shown in Fig. 8 that the support member 48 is not tightly joined by the tying device 48, Regarding the mounting state of the flat heater 17 on the right side, it is shown in Fig. 8 that the support member 48 is tightly joined by the knotting device 8. For example, when viewed from the right side of the seventh turn, when it is necessary to exchange the flat heater 17 on the right side As seen from the right side of the seventh drawing, the state of the planar heater 丨7 on the left side (see Fig. 8) is shown. The arrow shown in Fig. 7 is maintained while the gas supply unit is continuously maintained. After the planar heater 丨7 is detached in the direction of K1 and the other planar heaters 17 are inserted in the direction of the arrow K2 shown in Fig. 7, the support member 48 is fixed to the support member fixing plate 47 by the splicing device 49. Description, root According to the gas supply assembly unit of the second embodiment, the gas supply assembly unit of the present invention includes: one or two or more planar heaters 17 connected to the bottom surface of the gas unit; the branch 2097-7050-PF; Ahddub 15 1343464, holding member 48 supporting the planar heater 17; and supporting member fixing plate 47' sandwiching the planar heater 17 between the support member ", the flow path block 46 and the unit fixing plate 15 To fix the support member / Therefore, the outer dimensions of the gas unit can be exactly the same as those of a gas that does not require a planar heater. Thus, even if the entire gas supply unit after the gas collecting unit is supplied, it is not necessary to change the outer shape. Furthermore, it is not necessary to separately provide one planar heater 17 and one support member 48' on each gas unit, and one or two or more planar heaters 17 and one or more may be provided for the entire gas supply assembly unit. In this way, the number of components for heating the heat-storing gas supply unit is reduced, and the cost can be reduced. Further, by reducing the number of the planar heaters 17, the wiring can be made easy and also become The planar heater 17 is easily exchanged. Further, the embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and various applications are possible. For example, in the above embodiment, the gas supply unit is provided. The upper body is equipped with a pneumatic Μ 'but the type of the fluid control device installed is not limited thereto, and can be appropriately changed. For example, in the second embodiment described above, when the planar heater port is disassembled, in Fig. 7 The planar heater κ is removed in the direction of the arrow K1 and the other planar heaters 17 are inserted in the direction of the arrow K2 shown in Fig. 7, but may also be in the arrow of the figure: Inserting the planar heater 17 and inserting other planar heaters in the direction of the arrow K1 shown in the figure [Simplified drawing] 16 2097-7050-PF; Ahddub j343464 Fig. 1 is a view showing the gas of the first embodiment of the present invention Fig. 2 is a front view of a gas supply assembly unit according to a first embodiment of the present invention. Fig. 3 is a circuit diagram showing a structure of Fig. 1. Fig. 4 is a view showing a first embodiment of the present invention. Fig. 5 is a cross-sectional view showing a portion AA of Fig. 1. Fig. 6 is a view showing a heater 16 removed in Fig. 5. Fig. 7 is a view showing the present invention. 2 is a plan view of the structure of the gas supply assembly unit of the embodiment. Fig. 8 is a cross-sectional view of the BB portion of Fig. 7. Fig. 9 is a perspective view of a conventional gas supply device. Fig. 10 is a view showing the heat conduction block of Fig. 9. Figure.

【主要元件符號說明】 10〜導軌; 1 5~單元固定板; 17〜平面加熱器; 19〜隔板構件; 25~第二手動閥; 43~氣提氣體共通流路 46~流路區塊; 4 8 ~支持構件。 12〜導轨; 16 ~平面加熱器; 18〜支持構件; 22〜第一手動閥; 26~氣動閥; ;44〜製程氣體共通流路; 47〜支持構件固定板; 17 2〇97-7050-PF;Ahddub[Main component symbol description] 10~ rail; 1 5~ unit fixing plate; 17~ plane heater; 19~ partition member; 25~ second manual valve; 43~ stripping gas common flow path 46~ flow path block ; 4 8 ~ support components. 12 ~ rail; 16 ~ plane heater; 18 ~ support member; 22 ~ first manual valve; 26 ~ pneumatic valve; 44 ~ process gas common flow path; 47 ~ support member fixed plate; 17 2〇97-7050 -PF;Ahddub

Claims (1)

1343464 十、申請專利範圍: 種氣體供給集合單元’包括:設置於出口流路的 第—手動閥、a置於連通該I手動閱和製程氣體共通流 路之位置的氣動間、設置於連通該第—手動間和氣提氣體 共通:路之位置的第二手動閥及複數個藉由流路區塊及單 70固定板連結成一整個直列的氣體單元, 其特徵在於包括:1343464 X. Patent application scope: The gas supply assembly unit 'includes: a first manual valve disposed at the outlet flow path, a a pneumatic chamber disposed at a position connecting the I manual reading and the process gas common flow path, and is disposed in the communication The first-manual chamber and the stripping gas are common: the second manual valve at the position of the road and the plurality of gas units connected by the flow path block and the single 70 fixing plate into an entire in-line unit, and are characterized by: 支持構件’其剖面為门字型且嵌合上述流路區塊及單 元固定板;及 平面加熱器,其以央在上述支持構件、上述流路區塊 及上述單元固定板之間的方式來固定。 2·如申請專利範圍第1項之氣體供給集合單元,其中, 上述氣體單兀嵌合至上述支持構件,具有締結之導軌、夾 在上述支持構件和上述導軌之間的板狀之隔板構件。The support member has a cross section of a gate shape and is fitted with the flow path block and the unit fixing plate; and a planar heater which is disposed between the support member, the flow path block, and the unit fixing plate. fixed. 2. The gas supply assembly unit of claim 1, wherein the gas unit is fitted to the support member, and has a guide rail and a plate-shaped separator member sandwiched between the support member and the guide rail. . 3·如申凊專利範圍第1項之氣體供給集合單元,其令, 包括: ' —個或兩個以上的平面加熱器,其連接至上述氣體單 元的底面而配置; 支持構件,其支持上述平面加熱器;及 支持構件固定板,其將上述平面加熱器夾在上述支持 構件上述流路區塊及上述單元固定板之間,以固定支持 構件。 2〇97^7〇50-PP?Ahddub 163. The gas supply assembly unit of claim 1, wherein the gas supply assembly unit comprises: one or two or more planar heaters connected to a bottom surface of the gas unit; and a support member supporting the above a planar heater; and a support member fixing plate that sandwiches the planar heater between the flow path block of the support member and the unit fixing plate to fix the support member. 2〇97^7〇50-PP?Ahddub 16
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