TWI342346B - Horizontal electroplating and electro-deposition method on a substrate - Google Patents

Description

1342346 IX. Description of the invention: [Technical field to which the invention pertains] A method of horizontal plating, electro-optical and electroless plating on a substrate, wherein the substrate is arranged in a substantially horizontal manner at a branch m, by making sufficient money on the substrate The liquid volume and good flow field distribution improve the uniformity of the money film when large areas of money are used. And through the contact_electrode, the material roller contacts the damage to the substrate and the substrate, and the electrode is not required in the electroless plating method.

[Prior Art] Connection: The description of the lithograph/non-electrical ore mine refers to a general inorganic metal film sinking with a film of a decomposable material such as a color (four) sheet color, a dyed film or a conductive photoresist deposition.

Generally, in a flat panel display or a semiconductor process, a conductive film (aluminum, molybdenum, and alloy) is formed on the substrate (Fig. 1 and 2: base = eve: 3⁄4 circle, glass, plastic, etc.), _ vacuum coating technology, such as the town of eight more industrial applications, often use electro-mineral / electroless plating technology to t copper, nickel, gold, silver and other metals on the 4 products 'to make it, protective layer or have the required Features (such as circuit boards). In the case of the conventional vacuum membrane technology, the substrate is fed into a cavity == the control of the gas flow of the surface, resulting in a large amount of material, such as complex equipment, energy consumption, etc.

The size of the substrate lies at the cost. A has a face, in addition to the industry's well-known vertical keys, ΐί Γ 术. The vertical plating part is limited by the substrate hanging and the electrode configuration, and has the difficulty of operating for a long time, the key film is more than the sentence of 6 1342346 ^ large ^ Λ 丄 以及 以及 以及 以及 以及 以及 以及 以及 以及 前后彳 In terms of horizontal electric ore, the difference in the size of the semiconductor or substrate, the difference in film thickness requirements, etc. (5) u The plating of the substrate or the color of the light-draining sheet, the dye, and the electric photoresist are caused by the damage of the bonding film, the uniformity of the film thickness, and the possibility of cracking of the substrate. Therefore, in order to achieve the horizontally electroplating of the desired metal film or electro-optic color filter, the dyes are used to reduce the high cost of using the vacuum system and to avoid the applicability of the plating technique. SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a method for horizontal plating/electro-/non-electrical keying on a substrate, and mainly provides a set of movable plating plate, a set of contact first electrodes, and an electroplating. A liquid injection and recovery device, a set of mesh, planar or needle-shaped second electrodes, and a horizontal electroderatic system having a cathodic electrolytic reduction or etching mechanism. The baffle maintains the proper amount of electromineral liquid on the substrate and a good flow field distribution to improve the uniformity of coating during large-area plating. And through contact with the first electrode, > 砰 砰 roller contact damage to the mineral film and the substrate, no electrode is required in the electroless plating method. When one substrate has been coated with conductive material, electrolessly plated or sputtered with conductive metal to make the substrate to be plated conductive to be positioned by the drive roller or mechanical arm into the substrate support system, four baffles (individually independent, two or two or four) a group of) respectively moving to contact the non-wiring area on the plating surface of the substrate or attached to the edge of the substrate, and contacting the first electrode to move in contact with the surface of the substrate to contact the left and right sides or four non-wiring areas to make the substrate conductive; The plating solution is injected, and the height of the plating solution is maintained by slowing down the rate of plating solution on the plating surface of the substrate. After that, when the plating liquid height rises 7 1342346 = with the substrate above the miscellaneous or needle-for-profit 帛 electric ore, color it light film color, (four) wire core, 阙 silly into the lamp 4 film filter or conductive photoresist Application 3 electric: the electric resistance program (in color reverse), by the clock liquid lasting m, the purpose of the n-second electricity comparison and the electric-key phase distribution is lost, and then the good yield = money film to chain cake and good The flow field is compared with the roller type pole, because the first column or sheet shape, and the contact area is non-personal electrode is contact money. The substrate is electrically removed. In the case of electroplating or (4), the substrate support system === can also have a lifting and tilting mechanism to present a micro-tilt angle perpendicular to or perpendicular to the substrate to achieve a better flow field distribution. In addition, the wheel liquid lost in the gap between the baffle plate and the substrate is reduced through the lower recovery tank, and the object, features and advantages of the present invention are more easily understood. The following is a preferred embodiment and is illustrated with the accompanying drawings. [Embodiment] The configuration of the present invention, and the functions and advantages that can be produced, together with the σ pattern, are described in detail below as a preferred embodiment of the present invention. The substrate horizontal metal slab and the conductive material deposition structure of the present invention are as shown in the third figure c, and please refer to the flowchart of FIG. 9. The procedure is to first drive the substrate with a drive roller (not shown). (In this example, the glass substrate) is fed to the substrate 3〇2 for positioning. In this embodiment, the substrate supporting system Z is a plurality of rollers (step 1). After the completion of the clamping, a plurality of plating slowing baffles 306 are moved and attached to the edge of the substrate 3〇1. The plating slowing baffles 306 surround the periphery of the substrate 301 to form a peripheral sealed periphery (step 11). ). In the present invention, the plating plate is made of a material having rigidity and elasticity. The first electrode 307 is moved to make contact with the non-wiring area of the substrate 301 to conduct electricity (step 12). In the present invention, the first electrode 307 is one of an anode or a cathode. In the present invention, the substrate may be a germanium wafer substrate, a glass substrate, a metal substrate, a plastic substrate, or a color filter substrate. A second electrode 304 is placed over the substrate 301 and is not in contact with the substrate 3〇1 (step 13). The second electrode 304 is an electrode having a polarity opposite to the first electrode 307. In the present invention, the second electrode 304 is a one-piece electrode which is placed above the substrate 301 in a horizontally horizontal manner. In the present invention, when the color filter is subjected to electric deposit ion, the second electrode above the substrate is a cathode. The second electrode 304 in the present invention may be an insoluble electrode (applied to metal plating) formed without participating in an electroplating reaction material. In the present invention, the second electrode 304 may be an insoluble cathode formed in a color filter or a conductive photoresist, which does not participate in the electrophotographic reaction material. The injected electro-mineral solution 305 is brought into contact with the second electrode 304 above the substrate 301 after the edge formed by the ore plate 306 (step 14). In the present invention, the plating solution 305 is injected into the plating edge 305 formed by the plating liquid barrier 306 in a slow-flow manner, and is slowly injected while slowly flowing out of the rim. The plating solution 305 is subjected to a mixing action, so that the electrolytic ions can be uniformly plated on the substrate 301. Therefore, the overflow action causes the plating solution 305 to form a good agitation, and the overflow velocity control is adjusted as needed for the actual application to achieve a better flow field distribution to obtain a desired uniform film. The loss of the plating solution 305 can be transmitted through the lower plating solution to the system 303, and the surface _, two, A, and use are used to reduce the cost. The second electrode can also be used as a mobile first electrode 3〇8 to re-transmit the SI substrate with the lower substrate 301. Step-by-step movement completes the entire substrate 301. The third embodiment of the present invention is shown in the embodiment. The same elements and their functions are shown in the same figure. In the present embodiment, the first: electric ==, a single electrode (fourth figure B) is formed. =: The fourth embodiment of the surrounding soil 3 'the actual closing towel shows the component of the invention = number ==:=: and its function is the same as the other can appreciate the first electric The r-the actual figure number indicates that the details are also the same, and the same element and the same embodiment t show the same position on the roller 502. The board = can be: the density of the key layer, the second = the figure of the base indicates 'the thin ~;, the lower; === 1342346 The actual example shows that the substrate support system is a platform 5〇2, the same The platform 502 also has a tilting mechanism that can tilt the substrate 5〇1, so that the progress of the electric ore layer can be adjusted to achieve a more uniform electric ore layer. The eighth embodiment shows a seventh embodiment of the present invention, and another embodiment of the present invention is shown in the embodiment, wherein the same elements as those of the above-described embodiments and their functions are denoted by the same reference numerals, and the details are not described again. The following only illustrates the difference between the two. In this embodiment, the first and second electrodes are removed from the electroless plating process for substrate activation or electroless plating metal film deposition, thereby achieving single-sided activation of the substrate and single-no-non-electrical The metal deposition is performed by first injecting the activated substrate treatment liquid into the periphery of the substrate to make it contact with the upper surface of the substrate, and then performing the substrate activation treatment procedure and then forming the surrounding of the electroless mineral liquid on the broadcast plate. The electroless plating process is performed after contacting the substrate with the upper portion. The other activation treatment liquid and the electroless plating solution can be recycled by the recycling system of the first embodiment to save costs. 各 The components in the embodiments of the present invention are synchronizable. The single-sided electric ore of the upper surface of the core substrate, and includes a full-scale recording of the substrate (positive 1 Plating), and in the present invention, the substrate 3〇1 can also be covered with a layer of lead. The electric φ film defines a pattern and then electroplated with Cpattern plating. The electrode (including the first electrode and the second electrode) in the present invention may be an electrode formed by coating a plating solution with a semipermeable membrane material. Contains an electroplated/electro-/electroless plating solution parameter control for pH, temperature and cyclic volts analysis, particle size distribution analysis, charge distribution, and conductivity 'instant reaction plating conditions. Please refer to Figure 2 for a display of the prior art. Knowing the technology in the process of plating medium, so it will cause coating damage, poor film uniformity and substrate breakage, but the proposed process of the case, as shown in Figure 3 (A), the roller 3〇2 will not touch The coating on the top does not cause damage to the coating, poor uniformity of the film thickness, and cracking of the substrate. 11 1342346 In summary, the humanized and considerate design of this case is quite in line with actual needs. The well-known technology has obvious breakthrough advantages, and it has indeed improved efficiency and is not easy to achieve. The case has not been disclosed or disclosed in domestic and foreign literature. The market has fulfilled the requirements of the Patent Law. Ming, Yi Guan of the Office of the spirit whom = equivalent embodiments or with change =

12 1342346 [Simple description of the drawing] Material p /) Name repair is replacing the purchase of $ 1 7F vacuum vacuum film technology = Graphical horizontal electro-minening technology Second A to c shows the preferred implementation of the present invention Side Views of Different Steps Fourth A and B illustrate different types of second electrodes in the present invention. The fifth figure is not a different arrangement of the plating solution baffle and the first electrode in the preferred embodiment of the present invention. Fig. 6 is a schematic view showing the micro-tilt angle of the substrate supporting system of the preferred embodiment of the present invention. The substrate supporting system is a plurality of rollers. Fig. 7 is a schematic view showing the micro-tilt angle of the substrate supporting system of the preferred embodiment of the present invention, wherein the substrate supporting system is a platform. Eighth Diagram The present invention is applied to the electroless plating of a single-sided substrate-activated base metal film deposition. A ninth diagram is a flow chart of the present invention. [Main component symbol description] 301 substrate 302 substrate support system 303 recovery system 304 second electrode 305 plating solution 306 plating solution slow flow baffle 307 electrode 308 second electrode 401 plating plate 402 electrode 501 substrate 502 roller 13

Claims (1)

1342346 ...... I r—-—· -»»···· . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The substrate is fed onto the substrate support system for positioning; wherein the substrate is disposed in a near horizontal direction; a plurality of plating plates are moved and attached to the edge of the substrate, and the plating plate surrounds the periphery of the substrate to form a perimeter seal Surrounding the edge; moving the first electrode to make contact with the non-wiring region of the substrate to conduct electricity; placing a second electrode above the substrate and not contacting the substrate, the polarity of the second electrode and the first electrode The polarity is reversed; and the plating solution is injected into the plating baffle to make it contact with the second electrode above the substrate for electroplating or electroforming. 2. If the method of horizontal plating on the substrate in the first application of the patent scope is included, the steps are as follows: the electro-mineral solution is injected into the circumference of the plating plate in a slow-flow manner, that is, the plating solution is slow. The injection also slowly flows out of the rim, and its action causes the plating solution to form a stirring effect, so that the electrolytic ions can be uniformly plated on the substrate. Soil 3. As in the second paragraph of the patent application, the method of horizontal electric current electroplating on the substrate, in which the loss of the plating solution can be recovered through the lower plating liquid recovery system, and reused after filtration, addition and concentration adjustment. 4. The method of claim 1, wherein the substrate supporting system is a plurality of rollers or a platform. 5. The method of claim 1, wherein the second electrode is a sheet-shaped electrode that is horizontally above the substrate. & 6. For example, in the scope of patent application, the horizontal electric current and electricity on the substrate is 1342346 --- Λ 曰 曰 曰 灵 灵 : : : : : : : : : : : : : : : : : : : : : : 其中 其中 其中 其中 其中 其中 其中 其中One of a substrate, a plastic or color filter or a conductive photoresist substrate. / soil 7. If the application of the scope of the patent range i is on the substrate, the horizontal electricity money is =, where the substrate is deposited by coating, electroless plating, sputtering, etc. - Conductive thin 8 Society as patent application scope! The second electrode is a plate-shaped, mesh-shaped or needle-shaped electrode. 9. According to the first aspect of the patent application, the horizontal electric shovel on the substrate, wherein the second electrode is placed above the substrate, and the relative spacing can be matched. For example, in the first application of the patent scope, the horizontally electroplated electric power on the substrate, the medium color filter or the conductive photoresist is extremely insoluble on the substrate. Xinle-Electrical Method, i1 in the 1st recording board, electric current, electric current, soluble electrode, or non-method, ===, on the substrate, the horizontal electric current method, the first item on the substrate Electrodes are electroplated horizontally. The electrode and the second electrode are formed by a semi-permeable membrane material enclosing a liquid money solution, 14 = 申, the patent scope of the first item on the substrate is horizontally plated on the electric square is first covered with a layer of conductive fine definition - After plating the pattern. Method, the first paragraph of the profit range on the substrate, the horizontal key electric square material, the conductive adhesive i electric material contains copper, silver, Ming, metal, conductive color material, dyeing 16 · such as towel w patent range item 1 Horizontal plating on the substrate is 1342346 months; ^ 日修 (% positive replacement page method, wherein the plating plate contains a rectangular parallelepiped or a cylinder 1^ -----1 π. As claimed in the scope of the i The horizontal plating of the substrate on the substrate is performed. The substrate lion has a tilting mechanism, and the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ - Electroplating electro-acoustic parameter control (4) Systematic analysis of pH, temperature and cycle, analysis, particle size distribution, charge distribution, conductivity, and immediate reaction plating. 19. If the towel is full-time @第丨项在The forging method "where the first electrode is disposed horizontally below the mineral floor slab and the substrate is in contact with the substrate." 20. As claimed in the patent application, on the substrate, the water method is used to rotate the money arm. The substrate is sent to the substrate support (4) for positioning. The invention claims the first aspect of the patent scope for the method of horizontal electric current electroplating on a substrate, wherein each component is a synchronously movable person. 22· a method for horizontally no electric key on a substrate, which comprises the following steps: - driving roller or machine The arm feeds the substrate onto the substrate support system for clamping; wherein the substrate is disposed in a nearly horizontal direction; and the plurality of baffles are moved and attached to the edge of the substrate, and the baffles surround the periphery of the substrate to form a peripheral sealed rim Injecting the activated substrate processing liquid into the periphery of the baffle to make contact with the substrate, and then performing a substrate activation process; and injecting the electroless plating solution into the periphery of the baffle to make the substrate and the substrate After the above contact, the electroless key procedure is performed. 23. If the method of claim 22 is applied to the horizontal electroless bond method 1342346 on the substrate, the steps are as follows: ~ Activate the substrate treatment solution and the electroless liquid solution to slow the flow. The surrounding edge formed by the injection section, that is, the activated substrate processing liquid and the electroless plating solution are plated in, and the side also slowly flows out of the surrounding edge, and the effect is to form the age. Used to activate the substrate or uniformly deposit the mineral film. With the method of the above-mentioned patent scope 22nd on the substrate: the loss of the substrate treatment liquid and the electroless plating solution can be permeable] $, addition and concentration Miscellaneous and temperature control ^ - 17