CN108342756A - On multilager base plate horizontal plating electricity and electroless plating method - Google Patents
On multilager base plate horizontal plating electricity and electroless plating method Download PDFInfo
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- CN108342756A CN108342756A CN201710062624.XA CN201710062624A CN108342756A CN 108342756 A CN108342756 A CN 108342756A CN 201710062624 A CN201710062624 A CN 201710062624A CN 108342756 A CN108342756 A CN 108342756A
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- 238000007747 plating Methods 0.000 title claims abstract description 134
- 230000005611 electricity Effects 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000007772 electroless plating Methods 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 claims abstract description 200
- 239000000243 solution Substances 0.000 claims abstract description 79
- 239000007788 liquid Substances 0.000 claims abstract description 63
- 238000002347 injection Methods 0.000 claims abstract description 11
- 239000007924 injection Substances 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 238000009713 electroplating Methods 0.000 claims description 41
- 230000004913 activation Effects 0.000 claims description 16
- 238000011084 recovery Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000003086 colorant Substances 0.000 claims description 6
- 239000000975 dye Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 238000011536 re-plating Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000004064 recycling Methods 0.000 claims 2
- 241001562042 Physa Species 0.000 claims 1
- 239000010408 film Substances 0.000 description 27
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- 239000000203 mixture Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
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- 241001416181 Axis axis Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 206010068052 Mosaicism Diseases 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 238000010849 ion bombardment Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
On a kind of multilager base plate horizontal plating electricity method, include the following steps:At least two substrates are sent into substrate support system and are positioned so that at least two substrate is configured with nearly horizontal direction in a plane；Plating solution surrounding edge is attached into at least two substrate peripheries edge and forms the surrounding edge of a peripheral sealing；Mobile first electrode group, which makes to contact with the non-wiring region of each substrate, is allowed to conductive；One second electrode group is placed in above each substrate and is not in contact with each substrate, the second electrode group polarity is opposite with the first electrode group polarity；Injection electroplate liquid carries out being electroplated after the plating solution surrounding edge is allowed to contact with second electrode group substrate above or electric program.
Description
Technical field
The present invention relates to plating electricity and electroless-plating, on especially a kind of multilager base plate horizontal plating electricity and without electric
Electroplating method, wherein substrate one substantially configure in a manner of horizontal in support system, maintain to fit foot on substrate by paper plate
Liquid measure and good Flow Field Distribution is electroplated, film uniformity is plated when improving large-area electroplating.And by contacting an electrode, idler wheel of preventing
The injury to plated film and substrate is contacted, electrode is not needed in electroless plating method.
Background technology
Illustrate that carried plating/electroless-plating refers to general inorganic metal film deposition below;Electricity refer to organic conductive
Property material membrane deposition such as colored filter colorant, dye film or electric conductivity photoresist deposition.
Generally in flat-panel screens or manufacture of semiconductor, as shown in Fig. 1 and 2, in substrate (Silicon Wafer, glass, plastics
Deng) on form a conductive film (metals such as aluminium, molybdenum, chromium, copper or using it as the alloy of principal component), utilize vacuum coating technology more
To reach.And in remaining commercial Application, then often with plating/electroless deposition technique will such as copper, nickel, gold, silver metal plating in
On industrial products, a decorative layer, protective layer are formed it into or with required characteristic (such as circuit board).
For existing vacuum coating technology, substrate is sent into a cavity, then by vacuumizing, cavity voltage and gas
The control of body flow, generate ion bombardment target make target material surface atom got and through diffusional deposition in substrate.With regard to this skill
Art, because needing vacuum environment, adding the factors such as equipment complex and expensive, energy consumption, to increase being fabricated to for large-size substrate application
This.
And in terms of existing electroplating technology, other than being vertically electroplated known to industry, also it is applied to the water of circuit board
Ordinary telegram coating technology.Vertical plated parts are limited to the fixation, hanging and electrode configuration of substrate, and have that the operating time is longer, plated film
The difficulty of Steering etc. when uniformity is poor, large scale operation is not easy and front and back processing procedure level turns vertical；But just horizontal electricity
For plating, be applied to semiconductor or planar display substrates when, due to the difference of substrate size external form, the difference of film thickness demand with
The difference of substrate tolerance level etc., designed with existing conductive roller and coating bath applied to circuit board level plating will be unfavorable for it is aforementioned
The plating of substrate or colored filter colorant, dyestuff or electric conductivity photoresist electricity, cause plating membrane damage, film thickness uniformity bad with
And the possibility of substrate breakage.
Therefore, for reach be electroplated in a horizontal manner required metallic film or electricity colored filter colorant, dyestuff, to subtract
Less using the high cost of vacuum system and the applicable sex chromosome mosaicism for avoiding adopting existing electroplating technology.Inventor is based on to industry and skill
The understanding of art, before it is proposed that solving the problems, such as this one method, but these methods still fail to reach highest in technology and spatially
Efficiency to improve the defect of the prior art, and make application invention people institute so inventor proposes more efficient way again
The solution of proposition can handle simultaneously plating/electricity/the coating problem of electroless-plating etc., without different machinery of purchasing
Come handle respectively plating/electricity/electroless-plating.
Invention content
To solve the problems, such as above description, the present invention propose on a kind of multilager base plate horizontal plating/electricity/electroless-plating side
Method, it is main propose one have one group of movable plating solution plate washer, one group of contact first electrode group, electroplate liquid injection and retracting device,
One group of netted, planar or acicular second electrode group and the horizontal electroplating system that mechanism is restored or etched with catholyte.
It maintains to fit the plating liquid measure of foot and good Flow Field Distribution on substrate by plating solution plate washer, plated film is uniform when improving large-area electroplating
Property.And by contacting first electrode group, idler wheel of preventing contacts the injury to plated film and substrate, electricity is not needed in electroless plating method
Pole.
It has been coated with by conductive material when one, electroless-plating or sputter conductive metal make the substrate of face conduction to be electroplated to pass
When dynamic idler wheel or mechanical arm enter substrate support system positioning, four plating solution baffles (it is individual it is independent, two-by-two or with four for one
Group) it moves respectively and is contacted with the non-wiring region on electroplating substrate face or is attached at substrate edges, contact first electrode group cooperation
Non- wiring region mobile and that the left and right sides or four sides are contacted with the corresponding substrate surface makes the corresponding substrate conducting；Simultaneously
Electroplate liquid is injected, is slowed down by plating solution on electroplating substrate face is lost in speed by plating solution plate washer and maintains certain plating solution height.Later, when
Plating solution height rise and with after netted or needle-shaped indissolubility second electrode group contact above substrate, progress thin film electroplating, colour
Optical filter colorant, dyestuff or electric conductivity photoresist electricity program (in colored filter or electric conductivity photoresist electricity application when the first/the
Two electrode groups define opposite with plating), by plating solution lasting injection and loss, reach plating solution stirring and good Flow Field Distribution
Purpose, and then obtain good uniform plated film.
It is compared with roller type first/second electrode, since first/second electrode group is the column for having contact in the present invention
Or sheet, and contact zone is non-wiring region, can avoid line areas plated film and scratches and coordinate the appropriately configured of first/second electrode group
Improve plating film uniformity.After the completion of electroplating substrate, for the plated film that cathode surface is likely to form, can by additional electrolysis or
Wet etching mechanism removes.Plating or electricity program carry out when, substrate support system in addition to horizontal arrangement, also can have lifting
With inclined mechanism one and the perpendicular or parallel micro- degree of tilt of substrate approach axis axis is presented, to reach more preferably Flow Field Distribution.
In addition, in the electroplate liquid that plating solution plate washer and substrate gap are lost in, is recycled, passed through by lower section plating solution recovery system
Filtering, additive supplement are reused after being adjusted with concentration, reduce cost.
Also, multiple substrates can be carried out at the same time plating in same program in the present invention, it is possible to accelerate processing procedure,
Reduce the time.In addition the structure for applying multilayer, can make space efficiency utilization higher.Therefore the present invention can be promoted greatly
The whole efficiency of time and space utilization, less than in the prior art.
The present invention propose on a kind of multilager base plate horizontal plating electricity method, include the following steps:By at least two substrates
It is sent into substrate support system and is positioned, so that at least two substrate is configured with nearly horizontal direction in a plane；
The movement of plating solution surrounding edge is pasted at least two substrate edges, which surrounds the periphery of at least two substrate,
Form the surrounding edge of a peripheral sealing；Mobile first electrode group, which makes to contact with the non-wiring region of each substrate, is allowed to conductive；By one second electricity
Pole group is placed in the top of each substrate, and is not in contact with each substrate, the polarity of the second electrode group and the first electrode group polarity
On the contrary；And injection electroplate liquid carries out being electroplated after the plating solution surrounding edge is allowed to contact with second electrode group substrate above or electric journey
Sequence；Wherein at least two substrate, the plating solution surrounding edge, the first electrode group, the second electrode group and the electroplate liquid form a base
Plate electroplating unit.
Wherein, further include that step is:
Electroplate liquid injects the plating solution surrounding edge in a manner of flowing slowly, i.e. electroplate liquid is slowly injected on one side, also slowly flows out the plating on one side
Liquid surrounding edge, effect makes electroplate liquid form the effect stirred, so electrolytic ion can equably plate on the substrate.
Wherein, the loss of electroplate liquid is recycled by lower section plating solution recovery system, by filtering, adding and concentration tune
It is re-used after whole.
Wherein, which is multiple idler wheels or a mobile platform or suction vacuum entity platform.
Wherein, which is multiple first electrodes, and each first electrode contacts the corresponding substrate respectively, and should
Multiple first electrodes are located at same current potential.
Wherein, substrate is silicon wafer substrate, glass substrate, metal substrate, plastic base or colored filter or electric conductivity
Photoresist substrate.
Wherein, a conductive film is deposited on substrate in a manner of coating, electroless-plating or sputter.
Wherein, which is at least one plate electrode or at least one mesh electrode or at least one needle-shaped electricity
Pole group, each plate electrode or each mesh electrode or each needle electrode group correspond to the substrate, and at least one plate electrode respectively
Or at least one mesh electrode or at least one needle electrode group are located at same current potential.
Wherein, which is placed in above substrate, and relative spacing can coordinate adjustment.
Wherein, colored filter or electric conductivity photoresist electricity when the second electrode group above substrate be that insolubility is cloudy
Pole.
Wherein, in metal plating, which is an insolubility electrode for being not involved in electroplating reaction, or is one
Quasi- metallization is formed by soluble anode.
Wherein, the first electrode group and the second electrode group are to be formed by electrode by semipermeable membrane material package electroplate liquid.
Wherein, it is first covered with layer of conductive film on substrate and defines re-plating after a pattern.
Wherein, plating electricity material include copper, silver, aluminium, conductive colorant, dyestuff, conductive rubber.
Wherein, which has inclined mechanism, to adjust plating solution Flow Field Distribution uniformity.
Wherein, which configures in a horizontal manner is in contact in the lower section of the plating solution surrounding edge with the substrate.
Wherein, substrate is sent into the substrate support system with live roller or mechanical arm and is positioned.
Wherein, which is placed on a supporting rack of a mounting frame, wherein the mounting frame is equipped with
Multiple supporting racks in longitudinal arrangement, each supporting rack is respectively to an accommodating electroplating substrate unit；Wherein in the substrate of bottom
The lower section of electroplating unit configures a plating solution recovery system, and the electroplate liquid being lost in the plating solution surrounding edge passes through the plating solution recovery system
It is recycled, is re-used after filtering, adding and adjusted with concentration.
The present invention also proposes horizontal electroless plating method on a kind of multilager base plate, includes the following steps:With live roller or
At least two substrates are sent into substrate support system and are positioned by mechanical arm；Wherein at least two substrate is with close horizontal
Direction configures in a plane；One plating solution surrounding edge movement is pasted to substrate edges, which surrounds the periphery of substrate,
Form the surrounding edge of a peripheral sealing；Injection activation processing substrate liquid is allowed in the plating solution surrounding edge and is connect above at least two substrate
Substrate activation process program is carried out after touch；And injection electroless-plating liquid in the plating solution surrounding edge be allowed to at least two substrate
Electroless-plating program is carried out after side's contact；Wherein at least two substrate, the plating solution surrounding edge, the activation processing substrate liquid and the nothing
Electric electroplate liquid forms an electroplating substrate unit.
Wherein, further include that step is:
Activation processing substrate liquid and electroless-plating liquid inject the plating solution surrounding edge in a manner of flowing slowly, that is, activate processing substrate liquid and nothing
Electric electroplate liquid is slowly injected on one side, also slowly flows out the plating solution surrounding edge on one side, it acts as stirring action is formed, equably to live
Change substrate or uniform deposition plated film.
Wherein, the loss for activating processing substrate liquid and electroless-plating liquid, is recycled by lower section plating solution recovery system, is passed through
Filtering, addition re-use after being controlled with temperature control and pH after being adjusted with concentration.
Wherein, which is placed on a supporting rack of a mounting frame, wherein the mounting frame is equipped with
Multiple supporting racks in longitudinal arrangement, each supporting rack is respectively to an accommodating electroplating substrate unit；Wherein in the substrate of bottom
The lower section of electroplating unit configures a plating solution recovery system, the activation processing substrate liquid and electroless-plating being lost in the plating solution surrounding edge
Liquid is recycled by the plating solution recovery system, is re-used after filtering, adding and adjusted with concentration.
Description of the drawings
Fig. 1 shows existing vacuum coating technology.
Fig. 2 shows existing horizontal electroplating technology.
Fig. 3 A to 3C show the side view of present pre-ferred embodiments different step
The second electrode group of different types in Fig. 4 A and 4B display present invention.
Fig. 5 shows the plating solution plate washer configuration mode different from first electrode group of present pre-ferred embodiments.
Fig. 6 shows the micro- degree of tilt schematic diagram of present pre-ferred embodiments substrate support system, the wherein substrate support system
For multiple idler wheels.
Fig. 7 shows the micro- degree of tilt schematic diagram of present pre-ferred embodiments substrate support system, the wherein substrate support system
For a mobile platform.
Fig. 8 display present invention is applied to single substrate activation and the metal film deposition of electroless-plating.
The flow chart of Fig. 9 display present invention.
Substrate is respectively implanted in the schematic diagram display present invention of Figure 10 in different directions using roller group to be integrated again.
Second electrode group is the structure of monolithic in Figure 11 display present invention.
Figure 12 shows the first electrode group, the connection diagram of the second electrode group and power supply.
The structure of Figure 13 display present invention application multiple electroplating substrate units composition multilayers.
Another embodiment of the substrate support system of Figure 14 display present invention.
Reference sign
301a substrates
301b substrates
301c substrates
301d substrates
302 substrate support systems
303 plating solution recovery systems
304 second electrode groups
3041 second electrode groups
3042 second electrode groups
3045 second electrode sheets
3046 mesh electrodes
3047 columns (needle) shape electrode group
305 electroplate liquids
306 plating solution plate washers
3065 plating solution surrounding edges
307 first electrode groups
3075 first electrodes
308 second electrode groups
500 roller groups
502 idler wheels
503 mobile platforms
504 inhale vacuum entity platform
600 power supplys
700 electroplating substrate units.
Specific implementation mode
Purpose, features and advantages to keep the present invention above-mentioned are easier to understand, and following spy enumerates preferred embodiment, and matches
Close description of the drawings.
The now just structure composition of the present invention, and the effect of can be generated and advantage, coordinate attached drawing lifts the one of the present invention preferably
Detailed description are as follows for embodiment.
Substrate level metallic film, the conductive material sedimentary structure such as Fig. 3 A to 3C of the present invention is painted, and is please referred to Fig. 9's
Flow chart, the program be first with live roller or mechanical arm (not shown) by least two substrate 301a, 301b, 301c,
301d, (in the present embodiment be four glass substrates) are sent into substrate support system 302 and are positioned so that this at least two
Substrate 301a, 301b, 301c, 301d are configured with nearly horizontal direction in a plane.In the present embodiment, substrate support system
System 302 simultaneously supports four glass substrate (steps 10) for multiple idler wheels 502.But such supporting way is not limited to
The present invention, can also be as shown in Figure 10, can also be respectively implanted substrate in different directions using different roller groups 500
301a, 301b, 301c, 301d, then these substrates 301a, 301b, 301c, 301d are incorporated into a plane.
Multiple plating solution plate washers 306 are moved after the completion of positioning and are pasted to the edges substrate 301a, 301b, 301c, 301d, this
A little plating solution plate washers 306 surround the periphery of substrate 301a, 301b, 301c, 301d, form the surrounding edge (step 11) of a peripheral sealing.
Plating solution plate washer in the present invention, for the material composition with rigidity, elasticity.Multiple plating solution plate washer 306 forms a plating solution surrounding edge
3065, it can also be replaced with the plating solution surrounding edge of different shape in of the invention.
Mobile first electrode group 307, which makes to contact with the non-wiring regions substrate 301a, 301b, 301c, 301d, is allowed to conductive (step
It is rapid 12).The first electrode group 307 is one kind of anode or cathode in the present invention.Wherein the first electrode group 307 is multiple parallel connections
First electrode 3075, each first electrode 3075 contacts the corresponding substrate respectively.
Substrate can be silicon wafer substrate, glass substrate, metal substrate, plastic base or colored filter in the present invention
Substrate.
One second electrode group 304 is placed in the top of substrate 301a, 301b, 301c, 301d, and not with the substrate
301a, 301b, 301c, 301d are in contact (step 13).The second electrode 304 be and the 307 opposite polarity electricity of first electrode
Pole.In the present invention second electrode 304 be a sheet of electrode, by slightly be in it is horizontal in a manner of be placed in substrate 301a, 301b,
The top of 301c, 301d.Second electrode group 304 can be the structure of monolithic in the present invention, as shown in figure 11；Or second electrode
Group 304 can also be multi-disc second electrode sheet 3045, each second electrode sheet 3045 correspond to respectively substrate 301a, 301b, 301c,
301d, as shown in Figure 3A.
Wherein at least two substrate 301a, 301b, 301c, 301d, the plating solution surrounding edge 3065, the first electrode group 307,
The second electrode group 304 and the electroplate liquid 305 form an electroplating substrate unit 700.
As shown in figure 12, the first electrode group 307 can optionally form the first electrode of multiple parallel connections in the present invention
3075, preferably, these first electrodes 3075 one end parallel with one another to power supply 600, so that it is located at identical current potential.Together
The second electrode group 304 of sample can optionally form the second electrode sheet 3045 of multiple parallel connections, preferably, these second electrodes
The other end parallel with one another to power supply 600 of piece 3045, so that it is located at identical current potential.
In the present invention when to colored filter carry out electricity (electric deposition) when, the above substrate
Two electrode groups 304 are cathode.Second electrode group 304 in the present invention can be not involved in plating (electroplating) reaction for one
Material is formed by insolubility electrode group (being applied to metal plating).Second electrode group 304 in the present invention, in colorized optical filtering
Piece or electric conductivity photoresist electricity in can be that one be not involved in electroplating reaction material and be formed by insolubility cathode.
Injection electroplate liquid 305 in the plating solution plate washer 306 be formed by plating solution surrounding edge 3065 be allowed to substrate 301a, 301b,
Galvanizing process (step 14) is carried out after second electrode group 304 contacts above 301c, 301d.Electroplate liquid 305 in the present invention is with slow
The mode of stream injects the plating solution plate washer 306 and is formed by plating solution surrounding edge 3065, i.e. electroplate liquid 305 is slowly injected on one side, on one side
The plating solution surrounding edge 3065 is slowly flowed out, effect makes electroplate liquid 305 form the effect stirred, so electrolytic ion can be equably
It is plated on the substrate 301a, 301b, 301c, 301d.Therefore overflow effect makes electroplate liquid 305 form a good stirring, overflow
Speed control is adjusted according to needed for actually application, reaches preferable Flow Field Distribution, obtains required uniform film.And electroplate liquid
305 loss can be recycled by lower section plating solution recovery system 303, again sharp after filtering, adding and adjusted with concentration
With reducing cost.
Fig. 3 C show that the second embodiment of the present invention, wherein the second electrode group are alternatively the packaged type of tool mobile mechanism
Second electrode group 308, make with lower substrate 301a, 301b, 301c, 301d formed parcel plating, electricity region, then by gradually
It is mobile complete full substrate 301a, 301b, 301c, 301d plating, electricity program.In electroplating process, pass through the patch of plating solution plate washer 306
It is attached, slow down the loss of electroplate liquid 305 on the faces substrate 301a, 301b, 301c, 301d.
Fig. 4 A and 4B show the third embodiment of the present invention, and another embodiment of the present invention is shown in the embodiment, wherein
Component identical with a upper embodiment and its function indicate that details also repeats no more with identical reference numeral, hereafter only say
It is both bright not exist together.The second electrode group 3041 is one or more mesh electrodes 3046 (Fig. 4 A) or one in the present embodiment
Or multiple column (needle) shape electrode groups 3047 (Fig. 4 B) are formed.Each column (needle) shape electrode group 3047 includes multiple columns (needle) shape electricity
Pole.This is within the scope of the present invention.
Fig. 5 shows the fourth embodiment of the present invention, another embodiment of the present invention is shown in the embodiment, wherein with upper one
Both the identical component of embodiment and its function indicate that details also repeats no more with identical reference numeral, hereafter only illustrate
It does not exist together.In the present embodiment the first electrode group 307 configure in a horizontal manner in the lower section of the plating solution surrounding edge 3065 and with this
Substrate 301a, 301b, 301c, 301d are in contact.Similarly the second electrode group 3042 can be one or more in the present embodiment
A mesh electrode, or one or more column (needle) shape electrode groups, each column (needle) shape electrode group includes multiple columns (needle) shape electrode.
Fig. 6 shows the fifth embodiment of the present invention, another embodiment of the present invention is shown in the embodiment, wherein with upper one
Both the identical component of embodiment and its function indicate that details also repeats no more with identical reference numeral, hereafter only illustrate
It does not exist together.Show that multiple idler wheel 502 (can also be multiple roller groups independently shown in Fig. 10 in the present embodiment
500) there is an inclined mechanism, can therefore tilt the substrate 301c, 301d, so the density of adjustable electroplated layer, reaches more
Even electroplated layer.
Fig. 7 shows the sixth embodiment of the present invention, another embodiment of the present invention is shown in the embodiment, wherein with upper one
Both the identical component of embodiment and its function indicate that details also repeats no more with identical reference numeral, hereafter only illustrate
It does not exist together.Show that the substrate support system 302 is a mobile platform 503 in the present embodiment, similarly the mobile platform 503 also has
There is an inclined mechanism, can therefore tilt the substrate 301c, 301d, so the density of adjustable electroplated layer, reaches electricity evenly
Coating.
As shown in figure 14, the substrate support system 302 or a suction vacuum entity platform 504 in the present invention.
Fig. 8 shows the seventh embodiment of the present invention, another embodiment of the present invention is shown in the embodiment, wherein with upper one
Both the identical component of embodiment and its function indicate that details also repeats no more with identical reference numeral, hereafter only illustrate
It does not exist together.First and second electrode group is removed and carries out substrate activation in electroless-plating processing procedure or without electricity by display in the present embodiment
Electroplating metal film deposits, so as to reaching single side activation substrate and single side electroless-plating metal deposit.Wherein first injection activation substrate
Treatment fluid is allowed to carry out at substrate activation with after substrate 301a, 301b, 301c, 301d overlying contact in the plating solution surrounding edge 3065
Manage program.Electroless-plating liquid is reinjected to be allowed to connect with above the substrate 301a, 301b, 301c, 301d in the plating solution surrounding edge 3065
Electroless-plating program is carried out after touch.In addition, activation process liquid can recycle system with electroless-plating liquid by the plating solution of first embodiment
System 303, which recycle, saves cost.
Wherein, at least two substrate 301a, 301b, 301c, 301d, the plating solution surrounding edge 3065, the activation processing substrate
Liquid and the electroless-plating liquid form an electroplating substrate unit 700.
Each component in various embodiments of the present invention is can synchronizing moving.
Refer to the one-side electroplating of upper surface of base plate, and includes that substrate is electroplated (panel plating) comprehensively.And in the present invention
It can also first be covered with layer of conductive film on substrate 301a, 301b, 301c, 301d and define re-plating (pattern after a pattern
plating)。
Electrode (including first electrode group and second electrode group) in the present invention can wrap up electricity by semipermeable membrane material
Plating solution is formed by electrode.
3 are please referred to Fig.1, wherein the eighth embodiment of the present invention is shown, wherein the display present invention can apply the frame of multilayer
Structure is practiced, the space built with saving system.It is another in the other construction in lower section of above-mentioned electroplating substrate unit 700 of the invention
One electroplating substrate unit 700, and the needs of visual space sequentially multiple electroplating substrate units of framework 700 layer by layer in this way.This reality
It further includes that a mounting frame 800 is used to support multiple electroplating substrate unit 700 to apply in example, which is in equipped with multiple
The supporting rack 801 of longitudinal arrangement.Wherein each electroplating substrate unit 700 is located on the corresponding supporting rack 801, and is fixed on
In the mounting frame 800.But the only framework of plating solution recovery system 303 is in the lower section of bottom one layer of horizontal electroplating device.
It may also include in the present invention and pH, temperature and cycle carried out by a plating/electricity/electroless-plating liquid parameter control system
Analysis, particle diameter distribution analysis, distribution of charges, electrical conductivity are lied prostrate, situation is electroplated in real time reaction.
Plated film can be contacted by please referring to Fig.2 display prior art idler wheel in processing procedure, so plating membrane damage, film thickness can be caused
Uniformity is bad and substrate breakage, but processing procedure mode proposed by the invention, and as shown in Figure 3A, idler wheel 502 can't contact
The plated film of top, so plating membrane damage, film thickness uniformity will not be caused bad and the situation of substrate breakage.And in the present invention
Multiple substrates can be carried out at the same time plating in same program, it is possible to accelerate processing procedure, reduce the time.In addition multilayer is applied
Structure, can make space efficiency utilization higher.Therefore the present invention can greatly promote the entirety of time and space utilization
Efficiency, less than in the prior art.
In conclusion the design of consideration of hommization of the present invention, quite meets actual demand.Its specific improvement prior art
Defect obviously has the advantages that breakthrough progress compared to the prior art, the enhancement that has effects that really, and non-is easy to reach.
The present invention does not disclose or is exposed in domestic and external document in the market, has met the regulation of Patent Law.
Above-mentioned detailed description is illustrating for a possible embodiments of the invention, but the embodiment is not to limit
Protection scope of the present invention processed, all equivalence enforcements or change without departing from carried out by technical spirit of the present invention are intended to be limited solely by this hair
In bright protection domain.
Claims (22)
1. on a kind of multilager base plate horizontal plating electricity method, which is characterized in that include the following steps:
At least two substrates are sent into substrate support system and are positioned, so that at least two substrate is with nearly horizontal side
To configuration in a plane；
The movement of plating solution surrounding edge is pasted at least two substrate edges, which surrounds the week of at least two substrate
Side forms the surrounding edge of a peripheral sealing；
Mobile first electrode group, which makes to contact with the non-wiring region of each substrate, is allowed to conductive；
One second electrode group is placed in the top of each substrate, and is not in contact with each substrate, the polarity of the second electrode group with should
First electrode group polarity is opposite；And
Injection electroplate liquid carries out being electroplated after the plating solution surrounding edge is allowed to contact with second electrode group substrate above or electric program；
Wherein, at least two substrate, the plating solution surrounding edge, the first electrode group, the second electrode group and the electroplate liquid form one
Electroplating substrate unit.
2. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that further include that step is:
Electroplate liquid injects the plating solution surrounding edge in a manner of flowing slowly, i.e. electroplate liquid is slowly injected on one side, also slowly flows out the plating on one side
Liquid surrounding edge, effect makes electroplate liquid form the effect stirred, so electrolytic ion can equably plate on the substrate.
3. on multilager base plate as claimed in claim 2 horizontal plating electricity method, which is characterized in that the loss of electroplate liquid is led to
It crosses lower section plating solution recovery system to be recycled, be re-used after filtering, adding and adjusted with concentration.
4. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that the substrate support system is
Multiple idler wheels or a mobile platform inhale vacuum entity platform.
5. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that the first electrode group is more
A first electrode, each first electrode contacts the corresponding substrate respectively, and multiple first electrode is located at same current potential.
6. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that substrate is silicon wafer physa
Plate, glass substrate, metal substrate, plastic base or colored filter or electric conductivity photoresist substrate.
7. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that with coating, nothing on substrate
The mode of electricity plating or sputter deposits a conductive film.
8. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that the second electrode group is extremely
A few plate electrode or at least one mesh electrode or at least one needle electrode group, each plate electrode or each mesh electrode or
Each needle electrode group corresponds to the substrate, and at least one plate electrode or at least one mesh electrode or at least one needle respectively
Shape electrode group is located at same current potential.
9. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that the second electrode group is placed in
Above substrate, relative spacing can coordinate adjustment.
10. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that colored filter is led
Electrical photoresist electricity when the second electrode group above substrate be insolubility cathode.
11. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that, should in metal plating
Second electrode group is an insolubility electrode for being not involved in electroplating reaction, or is formed by soluble sun for a quasi- metallization
Pole.
12. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that the first electrode group and
The second electrode group is to be formed by electrode by semipermeable membrane material package electroplate liquid.
13. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that be first covered on substrate
Layer of conductive film defines re-plating after a pattern.
14. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that plating electricity material packet
Include copper, silver, aluminium, conductive colorant, dyestuff, conductive rubber.
15. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that the substrate support system
With inclined mechanism, to adjust plating solution Flow Field Distribution uniformity.
16. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that the first electrode group with
Horizontal mode configuration is in contact in the lower section of the plating solution surrounding edge with the substrate.
17. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that with live roller or machine
Substrate is sent into the substrate support system and is positioned by tool arm.
18. on multilager base plate as described in claim 1 horizontal plating electricity method, which is characterized in that by the electroplating substrate list
Member merging one mounting frame a supporting rack on, wherein the mounting frame be equipped with multiple supporting racks in longitudinal arrangement, each
Support is respectively to an accommodating electroplating substrate unit；Wherein plating solution recycling is configured in the lower section of the electroplating substrate unit of bottom
System, the electroplate liquid being lost in the plating solution surrounding edge is recycled by the plating solution recovery system, by filtering, addition and concentration
It is re-used after adjustment.
19. horizontal electroless plating method on a kind of multilager base plate, which is characterized in that include the following steps:
At least two substrates are sent into substrate support system with live roller or mechanical arm and are positioned；Wherein, this is at least
Two substrates are configured with nearly horizontal direction in a plane；
One plating solution surrounding edge movement is pasted to substrate edges, which surrounds the periphery of substrate, forms a peripheral sealing
Surrounding edge；
Injection activation processing substrate liquid is allowed in the plating solution surrounding edge and carries out substrate activation after at least two substrates overlying contact
Processing routine；And
Injection electroless-plating liquid is allowed in the plating solution surrounding edge and carries out electroless-plating program after at least two substrates overlying contact；
Wherein, at least two substrate, the plating solution surrounding edge, the activation processing substrate liquid and the electroless-plating liquid form substrate electricity
Plate unit.
20. horizontal electroless plating method on multilager base plate as claimed in claim 19, which is characterized in that further include that step is:
Activation processing substrate liquid and electroless-plating liquid inject the plating solution surrounding edge in a manner of flowing slowly, that is, activate processing substrate liquid and nothing
Electric electroplate liquid is slowly injected on one side, also slowly flows out the plating solution surrounding edge on one side, it acts as stirring action is formed, equably to live
Change substrate or uniform deposition plated film.
21. horizontal electroless plating method on multilager base plate as claimed in claim 20, which is characterized in that activation processing substrate liquid
And the loss of electroless-plating liquid, recycled by lower section plating solution recovery system, through filtering, add with concentration adjust after with temperature
It is re-used after degree control and pH controls.
22. horizontal electroless plating method on multilager base plate as claimed in claim 19, which is characterized in that by the electroplating substrate list
Member merging one mounting frame a supporting rack on, wherein the mounting frame be equipped with multiple supporting racks in longitudinal arrangement, each
Support is respectively to an accommodating electroplating substrate unit；Wherein plating solution recycling is configured in the lower section of the electroplating substrate unit of bottom
System, the activation processing substrate liquid being lost in the plating solution surrounding edge and electroless-plating liquid are returned by the plating solution recovery system
It receives, is re-used after filtering, adding and adjusted with concentration.
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| CN201710062624.XA CN108342756A (en) | 2017-01-24 | 2017-01-24 | On multilager base plate horizontal plating electricity and electroless plating method |
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| CN201710062624.XA CN108342756A (en) | 2017-01-24 | 2017-01-24 | On multilager base plate horizontal plating electricity and electroless plating method |
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| CN111379007A (en) * | 2018-12-31 | 2020-07-07 | 乐金显示有限公司 | Apparatus for electroforming and apparatus for horizontal electroforming |
| CN113943967A (en) * | 2021-10-14 | 2022-01-18 | 浙江爱旭太阳能科技有限公司 | Horizontal electroplating equipment for solar photovoltaic product and jig thereof |
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