1337521 九、發明說明： 【發明所屬之技術領域】 特別是指一種液冷式散 本發明是有關於一種散熱器 埶器。 【先前技術】 _如圖！所示，係我國專利公告編號第572252號「電子1337521 IX. Description of the invention: [Technical field to which the invention pertains] In particular, it relates to a liquid-cooled type. The present invention relates to a heat sink device. [Prior Art] _ Figure! As shown in the figure, China Patent Publication No. 572252 "Electronics
::之=二置產案’習知之^式散熱器是裝 運t會產&溫的電子元件11上，該液冷式散熱 :包含-水冷頭20、_冷媒22、一第一導管& 一第二導 管24、一冷凝# 25、一風扇％，及一抽送件〜該水冷 頭2〇是設置於該電子元件u上且呈中空狀，其内部形成一 流道21，該冷媒22是容置於該流道21内。 該第一導管23是與該水冷頭2〇之流道21相連通，用 以傳送因吸收該電子㈣u運轉時所產生的熱量而蒸發變 成氣態之冷媒22。該第二導管24同樣是與該水冷頭2〇之 流道21相連通’用以傳送冷凝變成液態之冷媒22。 該冷凝件25之一端是連接該第一導管23，另一端則是 連接該第二導管24 ’能將該第一導管23傳送之氣態冷媒 22冷凝成液態冷媒22後，再經由該第二導管24傳送至該 水冷頭20之流道21内。該抽送件27是設置於該第一導管 23上，用以抽送該第—導管23中之氣態冷媒22使其加速 "il至違冷凝件25。該風扇26鄰近設置於該冷凝件25，並 藉由該風扇26所產生之冷空氣而增進該冷凝件25之散熱 及冷凝效率。 5 1337521 為了使冷媒22之散熱及冷凝的效率更佳，除了如上述 奴加裝一風扇26外，一般都會將該冷凝件25之散熱面積 ^大，例如延長該冷凝件25之管路使其成彎折狀，或是在 管路上加裝散熱鰭片28以增加散熱面積，因此，該冷凝件 25之體積則會相對地加大，不利於安裝在狹小空間内。另 卜屯液冷式政熱器之散熱效果完全取決於該冷凝件25之 散熱及冷凝效率，當該冷凝件25之冷凝效率低時會直接 衫響到該液冷式散熱器的散熱功能，因此，習知之液冷式 散熱器的整體散熱效果仍可再進一步加強，而仍有許多待 改善之空間。 【發明内容】 因此，本發明之目的，即在提供一種散熱效率更高之 液冷式散熱器。 於疋’本發明之液冷式散熱器’裝設於一運轉時會產 生尚溫的元件上以輔助其散熱，該液冷式散熱器包含一中 空吸熱件、一冷卻流體、一冷凝裝置、一儲存槽一液冷 迴路，及一氣冷迴路。 該中空吸熱件是設置於該元件上，且其内部具有一流 道。該冷卻流體是容置於該中空吸熱件之流道内，該冷凝 裝置是用於冷卻該冷卻流體，該儲存槽是用於儲存該冷卻 流體，該液冷迴路具有一抽送件，且該液冷迴路是由該中 空吸熱件之流道、該冷凝裝置，及該儲存槽相連通而形成 一迴路，且該抽送件係將冷卻後之冷卻流體傳送至該中空 吸熱件之流道，以及將因吸收該元件運轉時所產生的熱量 6 1337521 而/m度上升之冷卻流體傳送至該冷凝裝置’同時藉由該抽 C件所產生之抽送壓力增加該液冷迴路内冷卻流體的循環 流動速度。 該氣冷迴路具有相互連通的一壓縮機、—冷媒儲存槽 、一冷媒控制器，及一蒸發器，該氣冷迴路是與該冷凝裝 置相連通形成一迴路，且該蒸發器是穿伸過該儲存槽並對 容置於該儲存槽中之冷卻流體進行冷卻。::之=二置产案'The conventional heat sink is the electronic component 11 that is shipped and produced on the warmth. This liquid-cooled heat sink contains: water-cooled head 20, _ refrigerant 22, a first conduit & a second conduit 24, a condensation #25, a fan %, and a pumping member - the water-cooling head 2 is disposed on the electronic component u and has a hollow shape, and the inside thereof forms a first-class channel 21, and the refrigerant 22 is It is accommodated in the flow path 21. The first duct 23 communicates with the flow path 21 of the water-cooling head 2 to transfer the refrigerant 22 which evaporates and changes to a gaseous state by absorbing heat generated during the operation of the electron (IV) u. The second conduit 24 is also in communication with the flow passage 21 of the water-cooling head 2 to transfer the refrigerant 22 which is condensed to a liquid state. One end of the condensing member 25 is connected to the first conduit 23, and the other end is connected to the second conduit 24'. The gaseous refrigerant 22 conveyed by the first conduit 23 can be condensed into a liquid refrigerant 22, and then through the second conduit. 24 is transferred to the flow path 21 of the water-cooling head 20. The pumping member 27 is disposed on the first duct 23 for pumping the gaseous refrigerant 22 in the first duct 23 to accelerate the condensing member 25. The fan 26 is disposed adjacent to the condensing member 25, and the heat dissipation and condensation efficiency of the condensing member 25 is enhanced by the cold air generated by the fan 26. 5 1337521 In order to make the heat dissipation and condensation of the refrigerant 22 more efficient, in addition to the slave fan 26 as described above, the heat dissipation area of the condensing member 25 is generally increased, for example, the pipe of the condensing member 25 is extended. The bending fins are added or the heat dissipating fins 28 are added to the pipeline to increase the heat dissipating area. Therefore, the volume of the condensing member 25 is relatively increased, which is disadvantageous for installation in a narrow space. The heat dissipation effect of the liquid cooling type heat exchanger is completely dependent on the heat dissipation and condensation efficiency of the condensation member 25. When the condensation efficiency of the condensation member 25 is low, the heat dissipation function of the liquid cooling radiator is directly applied. Therefore, the overall heat dissipation effect of the conventional liquid-cooled heat sink can be further enhanced, and there is still much room for improvement. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a liquid-cooled heat sink having a higher heat dissipation efficiency. The liquid-cooled heat sink of the present invention is installed on a component that generates a temperature to assist in heat dissipation during operation. The liquid-cooled heat sink includes a hollow heat sink, a cooling fluid, a condensing device, A storage tank, a liquid cooling circuit, and an air cooling circuit. The hollow heat absorbing member is disposed on the component and has a first-class channel inside. The cooling fluid is accommodated in the flow passage of the hollow heat absorbing device for cooling the cooling fluid, the storage tank is for storing the cooling fluid, the liquid cooling circuit has a pumping member, and the liquid cooling The circuit is formed by a flow passage of the hollow heat absorbing member, the condensing device, and the storage tank to form a circuit, and the pumping member transmits the cooled cooling fluid to the flow path of the hollow heat absorbing member, and the cause The heat generated by the operation of the element is absorbed 6 1337521 and the cooling fluid having an increase of /m is transmitted to the condensing device' while the pumping pressure generated by the pumping member increases the circulating flow velocity of the cooling fluid in the liquid cooling circuit. The air-cooling circuit has a compressor, a refrigerant storage tank, a refrigerant controller, and an evaporator, and the air-cooling circuit is connected with the condensing device to form a circuit, and the evaporator is penetrated The storage tank cools the cooling fluid contained in the storage tank.
本發明之功效在於利用該氣冷迴路中的氣態冷媒對儲 於該儲存槽中的冷卻流體形成進一步的冷 體在流至該中_件之流道時溫度更低，進== 發揮散熱效果。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。The effect of the invention is that the cold refrigerant in the air-cooling circuit forms a further cold body of the cooling fluid stored in the storage tank, and the temperature is lower when flowing to the flow channel of the middle member, and the heat dissipation effect is achieved. . The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.
如圖2所示，本發明液冷式散熱器之一較佳實施例， 裝設於-運轉時會產生高溫的元…以輔助其散孰，包 含-中空吸熱件3、-冷卻流體4、—冷凝裝置/二儲存 槽6、一液冷迴路7,及—氣冷迴路8。該中空吸㈣3是 設置於該二且其内部具有複數散熱⑼32及一流 道31’該中空吸熱件3及形成於其内之該等散_片32皆 是由導熱良好的金屬材質所製成，在本實施例中是由銅金 屬所製成，但也可由其他等效之材疋由，： 本實施例之說明為限。 所以不應以 7 1337521 該冷卻流體4是容置於該中空吸熱件3之流道31内， 在本實施例中該冷卻流體4為水，但也可為其他等效之液As shown in FIG. 2, a preferred embodiment of the liquid-cooled heat sink of the present invention is installed in a high temperature element during operation to assist in the dissipation thereof, including a hollow heat absorbing member 3, a cooling fluid 4, - condensing unit / two storage tank 6, a liquid cooling circuit 7, and - air cooling circuit 8. The hollow suction (4) 3 is disposed on the second and has a plurality of heat dissipation (9) 32 and a first-class channel 31'. The hollow heat-absorbing member 3 and the air-scattering sheet 32 formed therein are made of a metal material with good heat conductivity. In the present embodiment, it is made of copper metal, but it can also be made of other equivalent materials, and the description of the embodiment is limited. Therefore, the cooling fluid 4 should not be accommodated in the flow passage 31 of the hollow heat absorbing member 3. In the present embodiment, the cooling fluid 4 is water, but other equivalent liquids may also be used.
體（如冷媒等），所以不應以本實施例之說明為限。該冷凝裝 置5是用於將因吸收該元件9運轉時所產生的熱量而溫度 升高之冷卻流體4予以降溫，或是將該氣冷迴路8中因吸 收存於該儲存槽6内之冷卻流體4的熱量而變為氣態之冷 媒冷凝至液態。如有需要，該冷凝裝置5也可如習知般搭 配一風扇（圖未示）使用以加強其散熱及冷凝效率。該儲存槽 6是用於儲存被該冷凝裝置5所冷卻後的冷卻流體4。 該液冷迴路7具有一抽送件71 ’且該液冷迴路7是由 該中空吸熱件3之流道31、該冷凝裝置5，及該儲存槽6 相連通而形成一迴路，且該抽送件71係將冷卻後之冷卻流 體4傳送至該中空吸熱件3之流道31，以及將因吸收該元Body (such as refrigerant, etc.), so it should not be limited to the description of this embodiment. The condensing device 5 is for cooling the cooling fluid 4 whose temperature is raised by the heat generated when the element 9 is operated, or for cooling the gas cooling circuit 8 in the storage tank 6. The heat of the fluid 4 changes to a gaseous refrigerant which condenses to a liquid state. If desired, the condensing unit 5 can also be used with a fan (not shown) to enhance its heat dissipation and condensation efficiency. This storage tank 6 is for storing the cooling fluid 4 cooled by the condensing device 5. The liquid cooling circuit 7 has a pumping member 71', and the liquid cooling circuit 7 is formed by a flow path 31 of the hollow heat absorbing member 3, the condensing device 5, and the storage tank 6 to form a circuit, and the pumping member The 71 system transmits the cooled cooling fluid 4 to the flow passage 31 of the hollow heat absorbing member 3, and will absorb the element
件9運轉時所產生的熱量而溫度升高之冷卻流體*傳送至 -亥冷凝裝置5，同時該抽送件71所產生之抽送壓力亦能用 於增加該液冷迴路7内之冷卻流體4的循環流動速度。在 本實施例中’該抽送件71為—加壓幫浦，但也可使用具有 相同效能之裝置，所以並不應以本實施例之說明為限。 該氣冷迴路8具有相互連通的一塵縮機81、一冷媒儲 曰子'82》媒控制器83，及-蒸發器84，該氣冷迴路8 =該冷凝裝置5相連通並形成—迴路，且該蒸發器84是 進行=儲存槽6，並對容置於該儲存槽6中之冷卻流體4 當該元件 在運轉時，所產生的熱能則會藉由物質間 8 的熱傳導傳遞至與其相接觸的該中空吸熱件3,並藉由形成 於該中空吸熱件3内之該等散㈣片32將熱能更有效地傳 遞至容置於該流道31的冷卻流體4中，而該低溫之液態冷 部流體4遇熱後即會升溫，並藉由該液冷迴路7之抽送件 71的運轉而流至該冷凝裝置5進行冷凝。當該抽送件71在 轉寺其所產生之抽送壓力可使在該液冷迴路γ中升溫 後之冷卻流體4能更快速地被送至該冷凝裝置5進行降溫（ 動方向如圖中箭頭所示），而冷卻後之冷卻流體4也能更 快速的流至該中空吸熱件3之流道31以吸收更多該元件9 運轉時所產生的熱量，有利於加速熱量交換並達到有效散 熱之目的。 〃該氣冷迴路8内容置有冷媒，且其流動方向是如圖中 箭頭所示，而冷凝後之該冷媒是以液態型式地儲存於該冷 媒儲存槽82中，該氣冷迴路8穿伸過該儲存槽6内的蒸發 器84是藉由容於其内的氣態冷媒（冷空氣）對該儲存槽6中 之該冷卻流體4進行進一步地冷凝降溫，而該氣冷迴路8 内吸收過該冷卻流體4之熱量的氣態冷媒則會被傳送至該 冷凝裝置5進行降溫冷凝成液態，以利下—次的循環。為 了提升熱交換之效率，該氣冷迴4 8與存於該儲存槽、" 之該冷卻流體4的接觸面積必須加大，所以該蒸發器以日 呈彎折狀。 ° 疋 當該氣冷迴路8之㈣機81在運轉時，其所產生之抽 送廢力可使冷媒在該氣冷料8中以如圖中箭頭方向循環 流動。當氣態冷媒被該冷凝裝置5冷凝至液態後則會儲^ 1337521 於-冷媒儲存槽82中，再藉由該冷媒控制器83將該液態 冷媒降壓並轉化為氣態冷媒（冷空氣）’以便其進入該蒸發器 84中’又由於該蒸發器84是穿伸於該儲存槽㈣，如此-來則可藉此將容置於該儲存槽6中之冷卻流體4的溫度進 -步降溫，使該冷卻流冑4能以比在習知之液冷式散熱器 中更低溫的狀態進入該中空吸熱件3的流道31，有利於加 速熱量交換並對該元件9達到更為有效之散熱目的。 歸、内上述，本發明之液冷式散熱器，利用該氣冷迴路8 内的冷媒，使即將流至該中空吸熱件3之流道31内的冷卻 流體4能夠進一步地降溫，藉此增加該冷卻流體4進入該 中空吸熱件3之流道31後的吸熱功能，進而提升對該元件 9的散熱效率，故確實能達到本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1疋一組合示意圖，說明習知之液冷式散熱器；及 圖2是一組合示意圖，說明本發明液冷式散熱器之較 佳實施例與一元件的組合後狀態。 10 1337521 【主要元件符號說明】 3 ..........中空吸熱件 31 .........流道 32 .........散熱鰭片 4 ..........冷卻流體 5 ..........冷凝裝置 6 ..........儲存槽 7 ..........液冷迴路 71.........抽送件 8 ..........氣冷迴路 81 .........壓縮機 82 .........冷媒儲存槽 83 .........冷媒控制器 84 .........蒸發器 9 ..........元件The cooling fluid* whose temperature is generated during operation and which is increased in temperature is sent to the condensing device 5, and the pumping pressure generated by the pumping member 71 can also be used to increase the cooling fluid 4 in the liquid cooling circuit 7. Circulating flow speed. In the present embodiment, the pumping member 71 is a pressurizing pump, but a device having the same performance can also be used, and therefore should not be limited to the description of the embodiment. The air-cooling circuit 8 has a dust-reducing machine 81, a refrigerant storage scorpion '82' medium controller 83, and an evaporator 84. The air-cooling circuit 8 = the condensing device 5 is connected to form a circuit. And the evaporator 84 is a storage tank 6 and a cooling fluid 4 accommodated in the storage tank 6. When the component is in operation, the heat energy generated is transferred to and from the heat transfer between the materials 8 The hollow heat absorbing member 3 is in contact with, and the heat energy is more efficiently transmitted to the cooling fluid 4 accommodated in the flow path 31 by the equal-distribution (four) sheet 32 formed in the hollow heat absorbing member 3, and the low temperature The liquid cold portion fluid 4 is heated when it is heated, and flows to the condensing device 5 by the operation of the pumping member 71 of the liquid cooling circuit 7 to perform condensation. When the pumping pressure generated by the pumping member 71 at the turn temple can cause the cooling fluid 4 heated in the liquid cooling circuit γ to be sent to the condensing device 5 to be cooled more quickly (the moving direction is as shown by the arrow in the figure) The cooled cooling fluid 4 can also flow to the flow passage 31 of the hollow heat absorbing member 3 more quickly to absorb more heat generated by the operation of the component 9, which is beneficial to accelerate heat exchange and achieve effective heat dissipation. purpose. The air-cooling circuit 8 is provided with a refrigerant, and the flow direction thereof is as indicated by an arrow in the figure, and the condensed refrigerant is stored in the refrigerant storage tank 82 in a liquid form, and the air-cooling circuit 8 is extended. The evaporator 84 in the storage tank 6 further condenses and cools the cooling fluid 4 in the storage tank 6 by the gaseous refrigerant (cold air) contained therein, and the air-cooling circuit 8 absorbs The gaseous refrigerant of the heat of the cooling fluid 4 is sent to the condensing device 5 to be cooled and condensed into a liquid state to facilitate the next-cycle. In order to increase the efficiency of the heat exchange, the contact area of the air-cooling back to the cooling fluid 4 stored in the storage tank must be increased, so that the evaporator is bent in a daily manner. ° When the (4) machine 81 of the air-cooling circuit 8 is in operation, the pumping waste force generated by the refrigerant can cause the refrigerant to circulate in the air-cooling material 8 in the direction of the arrow in the figure. When the gaseous refrigerant is condensed to the liquid state by the condensing device 5, it is stored in the refrigerant storage tank 82, and the liquid refrigerant is depressurized and converted into gaseous refrigerant (cold air) by the refrigerant controller 83. It enters the evaporator 84 and, in turn, the evaporator 84 extends through the storage tank (four), so that the temperature of the cooling fluid 4 accommodated in the storage tank 6 can be cooled step by step. The cooling flow port 4 can enter the flow path 31 of the hollow heat absorbing member 3 in a state lower than that in the conventional liquid-cooled heat sink, which is advantageous for accelerating heat exchange and achieving more effective heat dissipation for the element 9. . In the liquid-cooled heat sink of the present invention, the cooling fluid 4 flowing into the flow path 31 of the hollow heat absorbing material 3 can be further cooled by the refrigerant in the air-cooling circuit 8 to increase the temperature. The heat absorbing function of the cooling fluid 4 after entering the flow path 31 of the hollow heat absorbing member 3 further enhances the heat dissipation efficiency of the element 9, so that the object of the present invention can be achieved. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a conventional liquid-cooled heat sink; and FIG. 2 is a combined schematic view showing a combined state of a preferred embodiment of the liquid-cooled heat sink of the present invention and a component. . 10 1337521 [Description of main component symbols] 3 .......... hollow heat absorbing member 31 ... ... flow path 32 ... ... heat sink fin 4 .. ........Cooling fluid 5 .......... Condensing device 6 .......... Storage tank 7 .......... Liquid cooling circuit 71.........pumping parts 8 .......... air-cooled circuit 81 .... compressor 82 ......... refrigerant storage Slot 83 .... refrigerant controller 84 ... ... evaporator 9 ..... components
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