1310333 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種研磨拋光機台，且特別是有關於 一種玻璃面板之研磨拋光機台。 【先前技術】 隨著 3C(Computer，Communications and Consumer)產 業的發展，有越來越多的人會使用行動裝置（handheld device)作為生活中的輔助工具。舉例而言，常見的行動裝 置包含個人數位助理（personal digital assistant ; PDA)、行 動電話（mobile phone)、智慧型手機（smart phone)等，這些 行動裝置之體積輕巧，攜帶方便，因此使用的人數越來越 多，所需之功能亦越來越廣。 為了提高行動裝置攜帶時之便利性，行動裝置之面板 常需進行玻璃薄化之製程，以使行動裝置之體積更為輕 薄。傳統式的研磨拋光機台於薄化玻璃面板時，可利用研 磨頭上貫穿孔之真空吸力，將玻璃面板吸附於研磨頭，然 而，此種方式會使玻璃面板在貫穿孔吸附處，產生凹陷之 情形，致使玻璃面板研磨不均。且若僅以真空吸附的方式 固定玻璃面板與研磨頭，在製程中常會因真空吸力不足， 造成玻璃面板拋片而導致破片。或者，在貫穿孔破真空時， 若是某些貫穿孔的空氣先衝出形成通道，則大部分的空氣 便會經由此通道離開，造成其他貫穿孔的氣量不足，而無 法完全地破除真空。 6 1310333 • 為解決上述之問題，亦有以人工的方式進行玻璃面板 之取卸片的步驟，包含以人工拍打貼附於玻璃吸著墊之玻 璃面板使玻磚__爭..與吸附於研磨頭上之玻璃吸著墊。而在 • ㈣璃面板自研磨頭取下時，須在機台内部將加工後的玻 ， 帛面板洗淨’再以人工使用氣槍吹氣，破壞研磨頭上之玻 璃吸著墊與玻璃面板之間的吸附狀態，最後，將玻璃面板 從玻璃吸著塾取下。由於過程中以清水清洗玻璃面板時， 修冑水與殘留的研磨液會流回機台，若是將其排掉，會造成 成本的提高，若不排掉，又會稀釋機台内部的研磨液濃度。 . 且人工取卸片時，容易因為人工操作時的碰撞，造成玻璃 面板之損傷，而影響產品之良率。 【發明内容】 因此本發明的主要目的就是在提供一種研磨搬光機 台，用以在清洗玻璃面板時，維持研磨液之濃度。 *根據本發明之上述目的，提出一種研磨拋光機台，用 以薄化一玻璃面板。研磨拋光機台包含一迴轉手臂、一研 磨頭，以及一研磨墊。研磨頭係與迴轉手臂相連，且研磨 頭匕3玻璃吸著塾與複數個貫穿孔。研磨塾係設置於相 對研磨頭，以藉由將玻璃面板吸附於玻璃吸著墊，使研磨 頭上之玻璃面板與研磨墊進行一拋光研磨。研磨拋光機台 更包含一卸載平台，玻璃面板係於研磨拋光機台進行一研 磨拋光步驟，並利用迴轉手臂將玻璃面板移動至卸載平台 進行一取卸片步驟。卸載平台更包含至少一吹氣管，可於 7 1310333 卸片時配置於玻璃面板與破璃吸著塾之間，以注入壓縮氣 體於玻璃面板與玻璃吸著墊之間。玻璃吸著墊係由複數個 及盤、’且成玻璃面板可猎由吸盤吸附於玻璃吸著墊。其中， 貫穿孔可配置於吸盤之間。研磨拋光機台更包含一壓力控 制’壓力控制單元係與貫穿孔相連，以提供一壓力源 於貝牙孔。其中壓力源若為一負壓源，則貫穿孔會形成真 工吸附孔，壓力源若為_壓縮氣體，則貫穿孔會形成吹氣 道。迴轉手臂可更包含-升降裝置，以提供一上提力於研 磨頭，此升降裝置可為一氣壓缸。 本發月之另-態樣係為一種研磨抛光方法，用以薄化 玻璃面板。研磨拋光方法包含一取片步驟、一預壓研磨步 =、-本體重量研磨步驟，以及一卸片步驟。取片步驟包 3利用研磨頭之複數個真空吸附孔，貼附玻璃面板於研磨 =。預壓研磨步驟包含於研磨時利用升降裝置提供上提力 :研磨頭。本體重量研好驟包含解除真空效應及上提 二利用研磨頭之本體重量進行研磨。卸片步驟包含注 =縮氣體於玻璃面板與研磨頭之間，以使玻璃面板與研 =離。上提力之大小約為本體重量之规至55%，其 步磨步驟之研磨時間為等於或少於2〇秒。其中取片 重旦研P^步驟係於卸載平台進行，預壓研磨步驟與本體 研：：係於研磨拋光機台進行，玻璃面板可利用與 相連之一迴轉手臂，移動於卸載平台與研磨拋光機 二片步驟可利用研磨頭之吹氣道，與卸載平台之 μ I缩氣體於研磨頭與麵面板之間。其卜 8 1310333 吹氣道與真空吸附孔係為配置於研磨頭之貫穿孔’並由壓 力控制單元控制。研磨頭包含玻璃吸著墊，玻璃吸著塾係 由吸盤所組成，以吸附玻璃面板於玻璃吸著墊，其中貫穿 孔係設置於吸盤之間。 藉由使用此研磨拋光機台，玻璃面板可利用迴轉手臂 之移動，而分別在卸載平台與研磨拋光機台上進行取卸片 步驟與拋光研磨步驟，如此一來，在清洗玻璃面板上殘存 之研磨液時，清水與殘存之研磨液不會回流至研磨拋光機 • 台，影響研磨液的濃度。此外，研磨拋光方法可利用預壓 研磨步驟，使玻璃面板之取片得以自動化，而不會使玻璃 • 面板因真空凹陷致使研磨不均。此外，藉由卸載平台之吹 - 氣管，可避免因貫穿孔出氣量不一致，致使卸片失敗之情 形。 【實施方式】 以下將以圖式及詳細說明清楚說明本發明之精神，任 春 何所屬技術領域中具有通常知識者在瞭解本發明之較佳實 施例後，當可由本發明所教示之技術，加以改變及修飾， 其並不脫離本發明之精神與範圍。 同時參照第1A圖及第1B圖，其係分別繪示本發明之 研磨拋光機台一較佳實施例之示意圖及局部放大圖。研磨 拋光機台100係用以研磨拋光一玻璃面板2〇〇，並將玻璃面 板200 /專化。研磨抛光機台1〇〇包含—研磨塾iio、一迴轉 手臂120,以及一研磨頭13〇。其中研磨頭13〇係與迴轉手 1310333 臂120相連’研磨墊no係設置於相對研磨頭uo。研磨頭 130包含有一玻璃吸著塾132，以及複數個貫穿孔134，其 中貫穿孔134係穿設於玻璃吸著塾132，並與一壓力控制單 元150相連通。玻璃吸著墊132可為一黑膠墊。其中迴轉 手臂120更包含一升降裝置122’以提供一上提力於研磨頭 130。 玻璃面板200可利用玻璃吸著墊132吸附於研磨頭 130 ’以利用研磨頭130與研磨塾11 〇對玻璃面板2〇〇進行 —拋光研磨，以薄化玻璃面板200。由於研磨拋光機台1〇〇 更包含一卸載平台140，利用迴轉手臂120可將研磨頭130 移動至卸載平台140，進行玻璃面板200之取卸片，因此， 利用清水以清洗玻璃面板200上殘存之研磨液時，清水及 殘存之研磨液不會回流至研磨墊110,影響到研磨塾11〇 之研磨液濃度。 參照第2圖’其係繪示本發明之拋光研磨機台另一較 佳實施例之示意圖。貫穿孔134係配置於玻璃吸著墊132 之中，並與壓力控制單元15〇相連，以藉由壓力控制單元 150提供一壓力源於貫穿孔134。當壓力控制單元15〇所提 供之壓力為負壓源時，相連之貫穿孔134會形成真空吸附 孔，以提供真空吸力，進而將玻璃面板200確實地吸附於 玻璃吸著墊132上，以進行玻璃面板200之取片動作。當 壓力控制單元150所提供之壓力源為壓縮氣體時，研磨頭 130之貫穿孔134會形成吹氣道，壓縮氣體則可經由貫穿孔 B4之吹氣道衝出，以解除玻璃面板2〇〇與玻璃吸著墊 l3l〇333 之間的吸附狀態，使玻璃面板200與研磨頭130分離，進 而完成玻璃面板200之卸片動作。 卸載平台140可更包含一吹氣管142,吹氣管142可於 破璃面板200卸片時，配置於玻璃面板2〇〇與玻璃吸著墊 132之間’以經由吹氣管142注入壓縮氣體於玻璃面板200 與玻璃吸著墊132之間’以輔助貫穿孔134之吹氣道，以 避免貫穿孔134之氣量分布不均勻，致使玻璃面板200卸 片失敗之情形。 同時參照第2圖及第3圖，第3圖係繪示第2圖中虛 線部份之局部放大圖。由第3圖中之虛線部份133的放大 圖可知’研磨頭130之玻璃吸著墊132係由複數個微小的 吸盤136所組成，此些微小的吸盤136可進一步地吸附玻 璃面板200於玻璃吸著墊132。其中，貫穿孔134係穿設於 吸盤136之間。玻璃吸著墊132之材料可為黑膠墊。 同時參照第1A圖、第1B圖及第4圖，第4圖係繪示 本發明之研磨拋光方法一較佳實施例之流程圖。研磨拋光 200。研磨拋光方法3001310333 IX. Description of the Invention: [Technical Field] The present invention relates to an abrasive polishing machine, and more particularly to a polishing and polishing machine for a glass panel. [Prior Art] With the development of the 3C (Computer, Communications and Consumer) industry, more and more people will use handheld devices as an aid in life. For example, common mobile devices include personal digital assistants (PDAs), mobile phones, smart phones, etc. These mobile devices are lightweight and easy to carry, so the number of people used More and more, the functions required are becoming more and more extensive. In order to improve the convenience of carrying the mobile device, the panel of the mobile device often needs to be thinned by the glass to make the mobile device lighter and thinner. When the conventional polishing and polishing machine is used to thin the glass panel, the glass panel can be adsorbed to the polishing head by the vacuum suction of the through hole in the polishing head. However, in this way, the glass panel is recessed at the through hole. In this case, the glass panel is unevenly ground. Moreover, if the glass panel and the polishing head are fixed only by vacuum adsorption, the vacuum suction force is often insufficient in the process, and the glass panel is thrown into pieces, resulting in fragmentation. Alternatively, if the through-hole breaks the vacuum, if some of the through-hole air first rushes out to form a passage, most of the air will exit through the passage, causing insufficient air flow to the other through-holes, and the vacuum cannot be completely broken. 6 1310333 • In order to solve the above problems, there is also a manual step of removing and unloading the glass panel, including manually slapping the glass panel attached to the glass absorbing pad to make the glass __. The glass absorbing pad on the grinding head. When the (4) glass panel is removed from the grinding head, the processed glass and enamel panel must be cleaned inside the machine', and then air blown by hand, destroying the glass absorbing pad on the polishing head and the glass panel. Adsorption state, finally, the glass panel is removed from the glass. When the glass panel is cleaned with water in the process, the repaired water and the residual slurry will flow back to the machine. If it is drained, the cost will increase. If it is not drained, the slurry inside the machine will be diluted. concentration. Moreover, when the sheet is manually taken out, it is easy to cause damage to the glass panel due to collision during manual operation, which affects the yield of the product. SUMMARY OF THE INVENTION It is therefore a primary object of the present invention to provide a polishing and polishing machine for maintaining the concentration of a polishing liquid while cleaning a glass panel. * In accordance with the above object of the present invention, an abrasive polishing machine is proposed for thinning a glass panel. The polishing and polishing machine includes a swivel arm, a grinding head, and a polishing pad. The grinding head is connected to the swing arm, and the grinding head 匕 3 glass sucks the cymbal and a plurality of through holes. The polishing raft is disposed on the opposite polishing head to perform a polishing of the glass panel and the polishing pad on the polishing head by adsorbing the glass panel to the glass absorbing pad. The polishing and polishing machine further comprises an unloading platform, the glass panel is attached to the polishing and polishing machine for a grinding and polishing step, and the glass panel is moved to the unloading platform by the rotary arm to perform a take-off and unloading step. The unloading platform further comprises at least one air blowing pipe, which can be disposed between the glass panel and the glazing absorbing raft at the time of unloading at 13 1310333 to inject a compressed gas between the glass panel and the glass absorbing pad. The glass absorbing pad is made up of a plurality of plates and discs, and the glass panel can be slid by the suction cup to the glass absorbing pad. The through holes may be disposed between the suction cups. The lapping and polishing machine further includes a pressure control 'pressure control unit connected to the through hole to provide a pressure source to the bore. If the pressure source is a negative pressure source, the through hole will form a real adsorption hole. If the pressure source is _compressed gas, the through hole will form an air blowing channel. The swivel arm may further include a lifting device to provide an upper lifting force to the grinding head, which may be a pneumatic cylinder. The other aspect of this month is a grinding and polishing method for thinning glass panels. The polishing method includes a sheet taking step, a pre-pressing step =, a body weight grinding step, and a unloading step. The take-up step package 3 uses a plurality of vacuum adsorption holes of the polishing head to attach the glass panel to the grinding =. The pre-grinding step includes providing a lifting force using a lifting device during grinding: a grinding head. The body weight grinding step includes releasing the vacuum effect and lifting the second body by using the weight of the body of the polishing head. The unloading step comprises: injecting a gas between the glass panel and the polishing head to cause the glass panel to be separated from the polishing. The lifting force is about 55% of the weight of the body, and the grinding time of the step grinding step is equal to or less than 2 sec. The P^ step of taking the film is carried out on the unloading platform, and the pre-pressure grinding step and the body research are carried out on the grinding and polishing machine. The glass panel can be used with one of the connected rotating arms, moved on the unloading platform and polished. The two steps of the machine can utilize the air blowing path of the grinding head and the gas of the unloading platform between the polishing head and the face panel. The air passage and the vacuum suction hole are disposed in the through hole ' of the polishing head and are controlled by the pressure control unit. The polishing head comprises a glass absorbing pad, and the glass absorbing system is composed of a suction cup for adsorbing the glass panel to the glass absorbing pad, wherein the through hole is disposed between the suction cups. By using the grinding and polishing machine, the glass panel can utilize the movement of the rotating arm, and the take-up and unloading steps and the polishing and grinding steps are respectively performed on the unloading platform and the polishing and polishing machine table, so that the remaining on the cleaning glass panel In the case of the polishing liquid, the clean water and the remaining polishing liquid do not flow back to the polishing and polishing machine, which affects the concentration of the polishing liquid. In addition, the grinding and polishing method can utilize the pre-pressing grinding step to automate the take-up of the glass panel without causing uneven polishing of the glass panel due to vacuum depression. In addition, by unloading the blow-pipe of the platform, it is possible to avoid the inconsistency in the outflow of the through-holes, resulting in failure of the unloading. BRIEF DESCRIPTION OF THE DRAWINGS The spirit of the present invention will be clearly described in the following drawings and detailed description. Those skilled in the art of the present invention will be able to change the teachings of the present invention. And modifications may be made without departing from the spirit and scope of the invention. Referring to Figures 1A and 1B, respectively, a schematic view and a partial enlarged view of a preferred embodiment of the polishing and polishing machine of the present invention are shown. The polishing and polishing machine 100 is used to grind and polish a glass panel 2 and to align the glass panel 200. The polishing and polishing machine 1 includes a grinding 塾iio, a turning arm 120, and a grinding head 13A. The polishing head 13 is connected to the rotating hand 1310333 arm 120. The polishing pad no is disposed on the opposite polishing head uo. The polishing head 130 includes a glass absorbing crucible 132 and a plurality of through holes 134 through which the through holes 134 are bored and communicated with a pressure control unit 150. The glass sorbent pad 132 can be a black rubber pad. The swing arm 120 further includes a lifting device 122' to provide an upper lifting force to the grinding head 130. The glass panel 200 can be adsorbed to the polishing head 130' by the glass absorbing pad 132 to perform polishing polishing using the polishing head 130 and the polishing pad 11 to thin the glass panel 200. Since the polishing and polishing machine 1 further includes an unloading platform 140, the polishing head 130 can be moved to the unloading platform 140 by the rotating arm 120, and the glass panel 200 can be taken out and discharged. Therefore, the water is used to clean the remaining glass panel 200. In the case of the polishing liquid, the clean water and the remaining polishing liquid do not flow back to the polishing pad 110, which affects the polishing liquid concentration of the polishing crucible. Referring to Figure 2, there is shown a schematic view of another preferred embodiment of the polishing machine of the present invention. The through hole 134 is disposed in the glass absorbing pad 132 and connected to the pressure control unit 15A to provide a pressure source from the through hole 134 by the pressure control unit 150. When the pressure provided by the pressure control unit 15 is a negative pressure source, the connected through holes 134 form a vacuum suction hole to provide vacuum suction, thereby reliably adsorbing the glass panel 200 on the glass absorbing pad 132 for performing. The taking action of the glass panel 200. When the pressure source provided by the pressure control unit 150 is a compressed gas, the through hole 134 of the polishing head 130 forms an air blowing passage, and the compressed gas can be punched out through the air blowing passage of the through hole B4 to release the glass panel 2 and the glass. The glass plate 200 is separated from the polishing head 130 by the adsorption state between the pads l3l and 333, thereby completing the unloading operation of the glass panel 200. The unloading platform 140 may further include a blowing pipe 142. The blowing pipe 142 may be disposed between the glass panel 2 and the glass absorbing pad 132 when the glass panel 200 is unloaded to inject compressed gas into the glass via the blowing pipe 142. The air gap between the panel 200 and the glass absorbing pad 132 is used to assist the through air 134 to avoid uneven distribution of the air volume of the through hole 134, which may cause the glass panel 200 to fail to unload. Referring also to Figures 2 and 3, FIG. 3 is a partial enlarged view of a broken line portion in FIG. As can be seen from the enlarged view of the broken line portion 133 in FIG. 3, the glass absorbing pad 132 of the polishing head 130 is composed of a plurality of minute suction cups 136, and the minute suction cups 136 can further adsorb the glass panel 200 to the glass. The pad 132 is sucked. The through holes 134 are bored between the suction cups 136. The material of the glass absorbing pad 132 may be a black rubber pad. Referring also to Figures 1A, 1B, and 4, FIG. 4 is a flow chart showing a preferred embodiment of the polishing method of the present invention. Grinding and polishing 200. Grinding and polishing method 300
方法3 00係用以薄化一玻璃面板 包含一取片步驟3 10、一預壓研磨 磨步驟330，以及一知Μ舟驟 11 1310333 預壓研磨步驟320係在研磨時利用迴轉手臂i2〇之升 降裝置122如氣壓缸，提供上提力於研磨頭13扣在此預壓 研磨步驟320中，由於玻璃面板2〇〇仍係利用貫穿孔134 之真空效應與研磨頭130貼合，此時若是直接進行研磨拋 光的動作，則谷易因為拋片而使得研磨失敗。預壓研磨步 驟320利用升降裝置丨22所提供之上提力，可緩緩地提供 預壓力於玻璃面板200與研磨頭130’使玻璃面板2〇〇藉由 此預壓力與研磨頭13〇上之玻璃吸著墊132的吸盤136緊 緊貼合。上提力之大小約為研磨頭丨3〇之本體重量的3〇% 至55%。由於此步驟之研磨時間不超過2〇秒，因此玻璃面 板200之切削量小，不至於影響研磨拋光之品質。 本體重量研磨步驟330包含解除貫穿孔134之真空效 應’此時’玻璃面板200係完全利用玻璃吸著墊丨32之吸 盤136固定於研磨頭13〇。如此一來，可避免因貫穿孔134 之真空效應’而使玻璃面板2〇〇產生凹陷致使研磨不均之 情形。此步驟中’亦包含解除升降裝置122之上提力，使 研磨頭130利用研磨頭13〇之本體重量進行研磨，以降低 研磨拋光之時間。接著，利用迴轉手臂丨2〇將研磨頭130 及玻璃面板200移動到卸載平台140。 卸片步驟340係於卸載平台14〇上進行，包含注入壓 縮氣體於玻璃面板200與研磨頭13〇之間，以解除玻璃面 板200與玻璃吸著墊132間之吸附狀態，使玻璃面板200 脫離研磨頭130。卸片步驟340之注入壓縮氣體，包含利用 研磨頭130之貫穿孔134形成之吹氣道，與配置於卸載平 12 1310333 台140之吹氣管142同時吹氣，貫穿孔134中之氣體會在 玻璃面板200與玻璃吸著墊132間產生氣道流出，吹氣管 142之氣體可經由此氣道灌入，撐開玻璃面板2〇〇與玻璃吸 著墊132’使玻璃面板200與玻璃吸著墊132脫離。此步驟 可避免因貫穿孔134之出氣量不均勻，而造成卸片失敗之 情形。 由上述本發明較佳實施例可知，應用本發明具有下列 優點。玻璃面板可利用迴轉手臂之移動，而分別在卸載平 台與研磨拋光機台上進行取卸片步驟與拋光研磨步驟，如 此一來’在清洗玻璃面板上殘存之研磨液時，清水與殘存 之研磨液不會回流至研磨拋光機台’影響研磨液的濃度。 此外，研磨拋光方法可利用預壓研磨步驟，使玻璃面板之 取片得以自動化，而不會使玻璃面板因真空凹陷致使研磨 不均。此外，藉由卸載平台之吹氣管，可避免因貫穿孔出 氣量不一致’致使卸片失敗之情形。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何所屬技術領域中具有通常知識者，在 不脫離本發明之精神和範圍内，當可作各種之更動與潤 飾，因此本發明之保護範圍當視後附之申請專利範圍所界 定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 13 1310333 第1A圖係繪示本發明之研磨拋光機台一較佳實施例 之示意圖。 、 第1Β圖係繪示本發明之研磨拋光平台一較佳實施例 之局部放大圖。 施例 第2圖係繪示本發明之拋光研磨機台另—較佳實 之示意圖。 、 第3圖係繪不第2圖申虛線部份之局部放大圖。 流程圖。 【主要元件符號說明】 100 :研磨拋光機台 110 :研磨墊 120 :迴轉手臂 122 :升降裝置 130 I研磨頭 132 :玻璃吸著墊 133 :虛線部份 140 ·•卸載平台 134 =貫穿孔 150 :壓力控制單元 136 :吸盤 3〇〇 :方法 142 :吹氣管 320 :步驟 200 :玻璃面板 340 :步驟 3 10 :步驟 330 :步驟 之 14Method 300 is used to thin a glass panel, including a take-up step 3 10, a pre-grinding and grinding step 330, and a knowing step 11 1310333. The pre-grinding step 320 is performed by using a swivel arm i2 during grinding. The lifting device 122, such as a pneumatic cylinder, provides a lifting force to the polishing head 13 to be buckled in the pre-pressure grinding step 320. Since the glass panel 2 is still attached to the polishing head 130 by the vacuum effect of the through hole 134, Directly performing the polishing and polishing action, the valley is liable to cause the grinding failure due to the throwing. The pre-grinding step 320 utilizes the lifting force provided by the lifting device 22 to slowly provide the pre-pressure to the glass panel 200 and the polishing head 130' to cause the glass panel 2 to be raked by the pre-pressure and the polishing head 13 The suction cup 136 of the glass absorbing pad 132 is tightly fitted. The amount of lifting force is about 3〇% to 55% of the weight of the body of the grinding head. Since the grinding time of this step does not exceed 2 sec seconds, the cutting amount of the glass panel 200 is small, and the quality of the polishing is not affected. The body weight grinding step 330 includes releasing the vacuum effect of the through hole 134. At this time, the glass panel 200 is completely fixed to the polishing head 13 by the suction cup 136 of the glass suction pad 32. As a result, it is possible to avoid the occurrence of unevenness in the polishing of the glass panel 2 due to the vacuum effect of the through holes 134. In this step, the lifting force on the lifting device 122 is also removed, so that the polishing head 130 is ground by the weight of the polishing head 13 to reduce the polishing and polishing time. Next, the polishing head 130 and the glass panel 200 are moved to the unloading platform 140 by the swing arm 丨2〇. The unloading step 340 is performed on the unloading platform 14 , and includes injecting compressed gas between the glass panel 200 and the polishing head 13 , to release the adsorption state between the glass panel 200 and the glass absorbing pad 132 to disengage the glass panel 200 . Grinding head 130. The compressed gas injected into the unloading step 340 includes an air blowing path formed by the through hole 134 of the polishing head 130, and is blown at the same time as the air blowing pipe 142 disposed at the unloading flat 12 1310333, and the gas in the through hole 134 is in the glass panel. An air passage is generated between the 200 and the glass absorbing pad 132, and the gas of the air blowing tube 142 can be poured through the air passage, and the glass panel 2 and the glass absorbing pad 132' are disengaged to disengage the glass panel 200 from the glass absorbing pad 132. This step can avoid the failure of the unloading due to the uneven outflow of the through holes 134. It will be apparent from the above-described preferred embodiments of the present invention that the application of the present invention has the following advantages. The glass panel can utilize the movement of the swivel arm to perform the take-up and unloading steps and the polishing and grinding steps on the unloading platform and the polishing and polishing machine table respectively, so that when the polishing liquid remaining on the glass panel is cleaned, the water and the residual grinding are cleaned. The liquid does not flow back to the grinding and polishing machine' to affect the concentration of the slurry. In addition, the abrasive polishing method can utilize the pre-pressure grinding step to automate the picking of the glass panel without causing the glass panel to be unevenly ground due to vacuum depression. In addition, by unloading the blowing pipe of the platform, it is possible to avoid the failure of the unloading due to the inconsistent outflow of the through holes. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the scope of the present invention, and it is possible to make various changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: 13 1310333 Figure 1A shows the grinding and polishing of the present invention. A schematic diagram of a preferred embodiment of the machine. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial enlarged view of a preferred embodiment of the polishing and polishing platform of the present invention. Embodiment Fig. 2 is a schematic view showing another preferred embodiment of the polishing and polishing machine of the present invention. Figure 3 is a partial enlarged view of the dotted line of Figure 2. flow chart. [Main component symbol description] 100: Grinding and polishing machine table 110: polishing pad 120: swivel arm 122: lifting device 130 I polishing head 132: glass absorbing pad 133: broken line portion 140 • unloading platform 134 = through hole 150: Pressure Control Unit 136: Suction Cup 3: Method 142: Blowing Tube 320: Step 200: Glass Panel 340: Step 3 10: Step 330: Step 14