[go: up one dir, main page]

TWI299748B - Adhesive composition, its manufacturing method, and adhesive film, substrate for carrying a semiconductor device and semiconductor device using such adhesive composition - Google Patents

Adhesive composition, its manufacturing method, and adhesive film, substrate for carrying a semiconductor device and semiconductor device using such adhesive composition Download PDF

Info

Publication number
TWI299748B
TWI299748B TW90103351A TW90103351A TWI299748B TW I299748 B TWI299748 B TW I299748B TW 90103351 A TW90103351 A TW 90103351A TW 90103351 A TW90103351 A TW 90103351A TW I299748 B TWI299748 B TW I299748B
Authority
TW
Taiwan
Prior art keywords
adhesive composition
semiconductor device
substrate
epoxy resin
adhesive film
Prior art date
Application number
TW90103351A
Other languages
English (en)
Inventor
Inada Teiichi
Sumiya Keiji
Tomiyama Takeo
Hiroyuki Kawakami
Masao Suzuki
Matsuzaki Takayuki
Hatakeyama Keiichi
Yasushi Shimada
Tanaka Yuuko
Hiroyuki Kuriya
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27342410&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI299748(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TWI299748B publication Critical patent/TWI299748B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW90103351A 2000-02-15 2001-02-15 Adhesive composition, its manufacturing method, and adhesive film, substrate for carrying a semiconductor device and semiconductor device using such adhesive composition TWI299748B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000041346 2000-02-15
JP2000349739 2000-11-16
JP2000349737 2000-11-16

Publications (1)

Publication Number Publication Date
TWI299748B true TWI299748B (en) 2008-08-11

Family

ID=27342410

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90103351A TWI299748B (en) 2000-02-15 2001-02-15 Adhesive composition, its manufacturing method, and adhesive film, substrate for carrying a semiconductor device and semiconductor device using such adhesive composition

Country Status (7)

Country Link
US (9) US20030069331A1 (zh)
JP (8) JP2008193105A (zh)
KR (16) KR20080087046A (zh)
CN (1) CN1208418C (zh)
AU (1) AU2001232298A1 (zh)
TW (1) TWI299748B (zh)
WO (1) WO2001060938A1 (zh)

Families Citing this family (144)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080087046A (ko) * 2000-02-15 2008-09-29 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치
US7061084B2 (en) * 2000-02-29 2006-06-13 Advanced Semiconductor Engineering, Inc. Lead-bond type chip package and manufacturing method thereof
JP5236134B2 (ja) * 2001-01-26 2013-07-17 日立化成株式会社 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等
US20030129438A1 (en) * 2001-12-14 2003-07-10 Becker Kevin Harris Dual cure B-stageable adhesive for die attach
JP2003238925A (ja) * 2002-02-19 2003-08-27 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム
US6770371B2 (en) * 2002-07-08 2004-08-03 The Boeing Company Silane triol capped expoxy-amine adhesion promoter for adhesive-bonded metal substrates
JP4240448B2 (ja) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 樹脂層付銅箔を用いた多層プリント配線板の製造方法
JP5274744B2 (ja) * 2002-09-30 2013-08-28 日立化成株式会社 フィルム状接着剤及びこれを用いた半導体装置
JP4529357B2 (ja) * 2003-02-26 2010-08-25 日立化成工業株式会社 接着シート、ならびにこれを用いた半導体装置およびその製造方法
KR101204197B1 (ko) 2003-06-06 2012-11-26 히다치 가세고교 가부시끼가이샤 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체장치의 제조방법
JP4600640B2 (ja) * 2003-11-10 2010-12-15 信越化学工業株式会社 アクリル系接着剤シート
JP2005154687A (ja) * 2003-11-28 2005-06-16 Hitachi Chem Co Ltd 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置
US20050126706A1 (en) * 2003-12-10 2005-06-16 Bunch Richard D. Non-corrosive low temperature liquid resist adhesive
EP1557880A1 (en) * 2004-01-21 2005-07-27 Nitto Denko Corporation Resin composition for encapsulating semiconductor
JP4934284B2 (ja) * 2004-03-15 2012-05-16 日立化成工業株式会社 ダイシングダイボンドシート
JP4141403B2 (ja) 2004-04-01 2008-08-27 富士通株式会社 半導体装置及び半導体装置の製造方法
JP4816871B2 (ja) * 2004-04-20 2011-11-16 日立化成工業株式会社 接着シート、半導体装置、及び半導体装置の製造方法
TWI360153B (en) 2004-04-20 2012-03-11 Hitachi Chemical Co Ltd Adhesive sheet, semiconductor device, and producti
TW200617123A (en) * 2004-09-29 2006-06-01 Shinetsu Chemical Co Acrylic flame retardant adhesive composition and acrylic flame retardant adhesive sheet
US20060069200A1 (en) * 2004-09-29 2006-03-30 Shin-Etsu Chemical Co., Ltd. Acrylic adhesive composition and acrylic adhesive sheet
KR100635053B1 (ko) 2005-06-21 2006-10-16 도레이새한 주식회사 전자부품용 접착테이프
KR100637322B1 (ko) * 2004-10-22 2006-10-20 도레이새한 주식회사 전자부품용 접착테이프 조성물
US7332822B2 (en) * 2004-11-12 2008-02-19 Delphi Technologies, Inc. Flip chip system with organic/inorganic hybrid underfill composition
CN1327545C (zh) * 2004-12-09 2007-07-18 英赛尔科技(深圳)有限公司 用于制造软包装锂电池或聚合物锂电池的隔膜粘接胶
JP5030196B2 (ja) * 2004-12-16 2012-09-19 住友電気工業株式会社 回路接続用接着剤
JP2006182919A (ja) * 2004-12-28 2006-07-13 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
US20060182949A1 (en) * 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
KR100642889B1 (ko) * 2005-05-25 2006-11-03 엘에스전선 주식회사 반도체용 접착필름
JP2006233053A (ja) * 2005-02-25 2006-09-07 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
US20060199301A1 (en) * 2005-03-07 2006-09-07 Basheer Rafil A Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from
US7790814B2 (en) * 2005-04-05 2010-09-07 Delphi Technologies, Inc. Radiopaque polymers for circuit board assembly
JP4839934B2 (ja) * 2005-05-13 2011-12-21 日立化成工業株式会社 硬化性樹脂組成物、プリプレグ、基板、金属箔張積層板、樹脂付金属箔及びプリント配線板
KR100646481B1 (ko) * 2005-06-15 2006-11-14 엘에스전선 주식회사 반도체용 접착제 조성물 및 이를 이용한 접착 필름
JP5288150B2 (ja) * 2005-10-24 2013-09-11 株式会社スリーボンド 有機ｅｌ素子封止用熱硬化型組成物
JP4967359B2 (ja) * 2006-02-06 2012-07-04 住友ベークライト株式会社 樹脂組成物、樹脂フィルム、層間接着材および多層回路板
DE102006007108B4 (de) * 2006-02-16 2020-09-17 Lohmann Gmbh & Co. Kg Reaktive Harzmischung und Verfahren zu deren Herstellung
JP4687576B2 (ja) * 2006-02-28 2011-05-25 日立化成工業株式会社 回路接続用フィルム状接着剤
US20070212551A1 (en) * 2006-03-10 2007-09-13 Andrew Collins Adhesive composition
KR101370245B1 (ko) * 2006-05-23 2014-03-05 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법
JP2008034787A (ja) * 2006-06-30 2008-02-14 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法、並びに半導体装置およびその製造方法
US8641957B2 (en) 2006-07-05 2014-02-04 GM Global Technology Operations LLC Molding cosmetic composite panels with visible fibers from ultraviolent light resistant epoxy compositions
PL2049611T3 (pl) 2006-07-31 2019-04-30 Henkel Ag & Co Kgaa Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych
KR100909169B1 (ko) * 2006-09-11 2009-07-23 제일모직주식회사 선 경화형 반도체 조립용 접착 필름 조성물
US20080063871A1 (en) * 2006-09-11 2008-03-13 Jung Ki S Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
US7498197B2 (en) * 2006-09-13 2009-03-03 Delphi Technologies, Inc. Silica nanoparticles thermoset resin compositions
WO2008045270A1 (en) * 2006-10-06 2008-04-17 Henkel Ag & Co. Kgaa Pumpable epoxy paste adhesives resistant to wash-off
EP2084213A1 (en) * 2006-11-02 2009-08-05 Henkel AG & Co. KGaA Composition with thermally-treated silica filler for performance enhancement
KR20080047990A (ko) 2006-11-27 2008-05-30 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법
JP4458546B2 (ja) * 2006-12-07 2010-04-28 日東電工株式会社 両面接着性感圧接着シートの製造方法
KR100827057B1 (ko) * 2006-12-15 2008-05-02 엘에스전선 주식회사 다이 접착용 페이스트 조성물
DE102006061458B4 (de) * 2006-12-23 2014-06-18 Bostik Gmbh Verwendung einer selbstverlaufenden, wasserfreien Beschichtungsmasse und Fußboden, mit Laminat- oder Parkettpaneelen
JP5298428B2 (ja) * 2006-12-26 2013-09-25 Ｊｎｃ株式会社 熱硬化性樹脂組成物及び硬化膜
WO2008105169A1 (ja) * 2007-02-28 2008-09-04 Sumitomo Bakelite Co., Ltd. 半導体用接着フィルムおよびそれを用いた半導体装置
KR100844383B1 (ko) 2007-03-13 2008-07-07 도레이새한 주식회사 반도체 칩 적층용 접착 필름
JP2008260908A (ja) * 2007-03-16 2008-10-30 Hitachi Chem Co Ltd 光導波路用接着剤組成物およびこれを用いた光導波路用接着フィルム、ならびにこれらを用いた光学装置
WO2008114696A1 (ja) * 2007-03-16 2008-09-25 Hitachi Chemical Company, Ltd. 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置
JP2008247936A (ja) * 2007-03-29 2008-10-16 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP4737130B2 (ja) * 2007-04-13 2011-07-27 日立化成工業株式会社 半導体装置
KR101082448B1 (ko) * 2007-04-30 2011-11-11 주식회사 엘지화학 접착 수지 조성물 및 이를 이용한 다이싱 다이 본딩 필름
CN101821333A (zh) * 2007-07-26 2010-09-01 汉高公司 可固化的环氧树脂基粘合剂组合物
KR100934558B1 (ko) * 2007-10-08 2009-12-29 제일모직주식회사 실란커플링제와 선반응된 페놀형 경화수지를 포함하는반도체 조립용 접착 필름 조성물 및 이에 의한 접착 필름
EP2200074A4 (en) * 2007-10-09 2011-12-07 Hitachi Chemical Co Ltd METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, SEMICONDUCTOR ADHESIVE FILM USED IN THE METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
US8189147B2 (en) * 2007-10-18 2012-05-29 Sharp Kabushiki Kaisha Liquid crystal display device
JP2009099825A (ja) * 2007-10-18 2009-05-07 Hitachi Chem Co Ltd 半導体装置接着剤用アクリル系樹脂及びアクリル系樹脂組成物
US20090117324A1 (en) * 2007-11-05 2009-05-07 Seong Choon Lim Electronic substrate having cavities and method of making
TWI390621B (zh) * 2007-11-08 2013-03-21 半導體用接著片及切割膠帶一體型半導體用接著片
TW200933866A (en) * 2008-01-16 2009-08-01 Lingsen Precision Ind Ltd Chip stacking method using light hardened glue
CN102015953B (zh) * 2008-04-25 2015-01-14 Lg化学株式会社 环氧基组合物、粘合膜、切割模片粘合膜和半导体器件
US20110204382A1 (en) * 2008-05-08 2011-08-25 Base Se Layered structures comprising silicon carbide layers, a process for their manufacture and their use
JP5361264B2 (ja) 2008-07-04 2013-12-04 ローム株式会社 半導体装置
JP5298704B2 (ja) * 2008-08-26 2013-09-25 日立化成株式会社 アクリル樹脂組成物
JP4939574B2 (ja) 2008-08-28 2012-05-30 日東電工株式会社 熱硬化型ダイボンドフィルム
JP2010100840A (ja) * 2008-09-24 2010-05-06 Hitachi Chem Co Ltd 接着剤フィルム及び回路接続材料
JP5549182B2 (ja) * 2008-10-28 2014-07-16 日立化成株式会社 接着シート及びこれを用いた半導体装置の製造方法
US20140254113A1 (en) * 2008-12-02 2014-09-11 Arizona Board of Regents, a body corporate of the State of Arizona Acting for and on behalf of Arizo Method of providing an electronic device structure and related electronic device structures
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
JP5456441B2 (ja) * 2009-01-30 2014-03-26 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5805367B2 (ja) * 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5456440B2 (ja) 2009-01-30 2014-03-26 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
WO2010110069A1 (ja) * 2009-03-23 2010-09-30 日立化成工業株式会社 ダイボンディング用樹脂ペースト、それを用いた半導体装置の製造方法、及び半導体装置
KR101359831B1 (ko) * 2009-05-13 2014-02-07 히타치가세이가부시끼가이샤 접착 시트
JP5569126B2 (ja) * 2009-05-29 2014-08-13 日立化成株式会社 接着剤組成物、接着剤シート及び半導体装置の製造方法
JP5569121B2 (ja) * 2009-05-29 2014-08-13 日立化成株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
US9125603B2 (en) * 2009-08-11 2015-09-08 Abbott Diabetes Care Inc. Analyte sensor ports
CN102020960A (zh) * 2009-09-14 2011-04-20 合正科技股份有限公司 高导热及低散逸系数的增层结合胶剂制法
CN102020959B (zh) * 2009-09-14 2014-03-19 合正科技股份有限公司 高导热及低散逸系数的增层结合胶剂
JP5565931B2 (ja) * 2009-10-01 2014-08-06 株式会社Ａｄｅｋａ シリコンウエハ接着性樹脂組成物
JP5137937B2 (ja) * 2009-12-16 2013-02-06 日東電工株式会社 半導体装置製造用耐熱性粘着シート、該シートに用いる粘着剤、及び該シートを用いた半導体装置の製造方法
JP2011132430A (ja) * 2009-12-25 2011-07-07 Sekisui Chem Co Ltd 半導体チップ接合用接着剤、非導電性ペースト及び非導電性フィルム
KR101023241B1 (ko) * 2009-12-28 2011-03-21 제일모직주식회사 반도체용 접착제 조성물 및 이를 이용한 접착 필름
JP5844963B2 (ja) * 2010-03-19 2016-01-20 積水化学工業株式会社 電子部品用接着剤
WO2011125778A1 (ja) * 2010-04-01 2011-10-13 日立化成工業株式会社 接着剤組成物、接着シート及び半導体装置
JP5691244B2 (ja) * 2010-05-26 2015-04-01 日立化成株式会社 フィルム状接着剤、接着シート及び半導体装置
US20130090424A1 (en) * 2010-06-21 2013-04-11 Denki Kagaku Kogyo Kabushiki Kaisha Acrylic rubber composition, vulcanizate, hose part, and sealing part
JP5845559B2 (ja) * 2010-07-30 2016-01-20 住友ベークライト株式会社 接着体
KR101176957B1 (ko) * 2010-09-30 2012-09-07 주식회사 케이씨씨 반도체 패키지 제작용 접착제 조성물 및 접착시트
CN103249559B (zh) * 2010-11-18 2015-08-05 日立化成株式会社 半导体密封填充用膜状树脂组合物、半导体装置的制造方法和半导体装置
TWI443166B (zh) * 2010-11-23 2014-07-01 Lg Chemical Ltd 黏著劑組成物
JP5398083B2 (ja) * 2011-03-11 2014-01-29 日東電工株式会社 ダイボンドフィルム及びその用途
JP5866152B2 (ja) * 2011-06-30 2016-02-17 スリーエム イノベイティブ プロパティズ カンパニー 貫通孔を有する窓貼り用積層フィルム
US20140131691A1 (en) * 2011-07-06 2014-05-15 Mitsui Chemicals, Inc. Polymerizable epoxy composition and organic el device
CN103650649B (zh) * 2011-07-07 2017-09-29 日立化成株式会社 粘接膜、使用了该粘接膜的多层印制电路板、及该多层印制电路板的制造方法
US20130042976A1 (en) * 2011-08-19 2013-02-21 Harris Corporation Film adhesives and processes for bonding components using same
JP5626179B2 (ja) * 2011-10-24 2014-11-19 日立化成株式会社 フィルム状接着剤及びこれを用いた半導体装置
KR101391083B1 (ko) * 2011-12-27 2014-05-02 (주)엘지하우시스 전자종이용 점접착 조성물
JP5893152B2 (ja) * 2012-01-06 2016-03-23 エルジー・ケム・リミテッド 封止用フィルム
CN104169383B (zh) 2012-03-08 2016-11-09 日立化成株式会社 粘接片材及半导体装置的制造方法
WO2013148071A1 (en) 2012-03-30 2013-10-03 Waters Technologies Corporation Sample carrier for dried biological samples
US8715391B2 (en) * 2012-04-10 2014-05-06 Milliken & Company High temperature filter
CN110699024A (zh) 2012-08-03 2020-01-17 Lg化学株式会社 粘合膜和使用该粘合膜的有机电子装置封装产品
US9157014B2 (en) 2012-11-29 2015-10-13 Micron Technology, Inc. Adhesives including a filler material and related methods
CN104541333A (zh) * 2012-12-06 2015-04-22 积水化学工业株式会社 导电材料、连接结构体及连接结构体的制造方法
JP6340004B2 (ja) 2013-08-02 2018-06-06 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
US10047257B2 (en) 2013-09-27 2018-08-14 Daicel Corporation Adhesive agent composition for multilayer semiconductor
US9576872B2 (en) * 2013-12-18 2017-02-21 Infineon Technologies Ag Semiconductor devices and methods for manufacturing semiconductor devices
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2017034645A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS, a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
KR102141721B1 (ko) * 2014-01-24 2020-08-05 도레이첨단소재 주식회사 고효율 방열접착재료 및 그의 제조방법
CN105981138B (zh) * 2014-02-14 2018-12-28 三井化学东赛璐株式会社 半导体晶片表面保护用粘着膜、以及使用粘着膜的半导体晶片的保护方法和半导体装置的制造方法
JP2017518638A (ja) 2014-05-13 2017-07-06 アリゾナ・ボード・オブ・リージェンツ・フォー・アンド・オン・ビハーフ・オブ・アリゾナ・ステイト・ユニバーシティＡｒｉｚｏｎａ Ｂｏａｒｄ Ｏｆ Ｒｅｇｅｎｔｓ Ｆｏｒ Ａｎｄ Ｏｎ Ｂｅｈａｌｆ Ｏｆ Ａｒｉｚｏｎａ Ｓｔａｔｅ Ｕｎｉｖｅｒｓｉｔｙ 電子デバイスを提供する方法およびその電子デバイス
JP6013406B2 (ja) * 2014-07-24 2016-10-25 株式会社タムラ製作所 接着剤組成物および電子部品の接合方法
JP6451204B2 (ja) * 2014-10-22 2019-01-16 日立化成株式会社 樹脂組成物、プリプレグ、樹脂付き金属箔、及びこれらを用いた積層板及びプリント配線板
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
WO2016105134A1 (ko) * 2014-12-24 2016-06-30 주식회사 엘지화학 반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
KR101799499B1 (ko) 2014-12-24 2017-12-20 주식회사 엘지화학 반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
JP6883937B2 (ja) * 2015-03-19 2021-06-09 日東電工株式会社 封止用シートおよび中空パッケージの製造方法
WO2017010754A1 (ko) * 2015-07-10 2017-01-19 주식회사 엘지화학 반도체 접착용 수지 조성물 및 다이싱 다이본딩 필름
CN106715631B (zh) 2015-07-10 2019-07-30 株式会社Lg化学 半导体用粘合剂组合物和切割管芯粘结膜
JP6209803B2 (ja) * 2015-11-04 2017-10-11 リンテック株式会社 硬化性樹脂フィルム及び第１保護膜形成用シート
EP3352204A4 (en) * 2015-11-04 2019-03-20 Lintec Corporation HARDENABLE RESIN FOIL AND FIRST PROTECTIVE FOIL WRAP
KR20170053416A (ko) * 2015-11-06 2017-05-16 주식회사 엘지화학 반도체 장치 및 반도체 장치의 제조 방법
JP6710955B2 (ja) * 2015-12-16 2020-06-17 味の素株式会社 プリプレグ
JP6512133B2 (ja) * 2016-02-25 2019-05-15 株式会社オートネットワーク技術研究所 電線保護部材及びその製造方法並びにワイヤーハーネス
KR102204964B1 (ko) 2018-04-17 2021-01-19 주식회사 엘지화학 반도체 회로 접속용 접착제 조성물 및 이를 포함한 접착 필름
KR102666541B1 (ko) 2019-11-12 2024-05-20 삼성전자주식회사 반도체 패키지 및 그 제조방법
JP6893576B2 (ja) * 2019-12-02 2021-06-23 日本メクトロン株式会社 接着フィルム及びフレキシブルプリント基板
WO2021124857A1 (ja) * 2019-12-20 2021-06-24 株式会社アイセロ 熱可塑型接着剤組成物
EP4496862A1 (en) * 2022-03-22 2025-01-29 Ricoh Company, Ltd. Adhesive structure and manufacturing method thereof, electronic component and manufacturing method thereof, and adhesive layer for transfer
JPWO2023210471A1 (zh) * 2022-04-28 2023-11-02

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3496042A (en) * 1966-03-30 1970-02-17 Porvair Ltd Process for making a porous polyurethane-fabric laminate
JPS59105018A (ja) * 1982-12-07 1984-06-18 Toshiba Chem Corp 封止用樹脂組成物
GB8309993D0 (en) * 1983-04-13 1983-05-18 Smith & Nephew Ass Surgical adhesive dressing
JPS61138680A (ja) 1984-12-10 1986-06-26 Sumitomo Bakelite Co Ltd フレキシブル印刷回路用基板
JPH0629394B2 (ja) * 1987-05-29 1994-04-20 信越化学工業株式会社 カバ−レイフイルム
US5024880A (en) * 1990-01-03 1991-06-18 Minnesota Mining And Manufacturing Company Cellular pressure-sensitive adhesive membrane
US5294668A (en) * 1990-11-15 1994-03-15 Minnesota Mining And Manufacturing Company Polyolefin pressure-sensitive adhesive compositions containing macromonomers
JPH04223007A (ja) 1990-12-25 1992-08-12 Sumitomo Bakelite Co Ltd 半導体用導電性樹脂ペースト
JPH05171073A (ja) * 1991-12-20 1993-07-09 Toshiba Chem Corp 導電性ペースト
US5202361A (en) * 1991-12-23 1993-04-13 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive
JPH05315743A (ja) * 1992-05-08 1993-11-26 Nitto Denko Corp フレキシブルプリント回路板用接着剤組成物
JP3063935B2 (ja) * 1992-05-12 2000-07-12 宇部興産株式会社 接着性、耐熱性および耐カ−ル性を兼ね備えたポリイミドシロキサン組成物
JPH06104566A (ja) 1992-09-22 1994-04-15 Kanegafuchi Chem Ind Co Ltd 電気用金属箔張積層板
JP2512859B2 (ja) * 1993-04-19 1996-07-03 東芝ケミカル株式会社 半導体素子の取付け方法
US5519177A (en) * 1993-05-19 1996-05-21 Ibiden Co., Ltd. Adhesives, adhesive layers for electroless plating and printed circuit boards
US5356993A (en) * 1993-07-12 1994-10-18 Shell Oil Company Coreactive conjugated diene polymer compositions which phase separate when cured
JPH07147010A (ja) * 1993-09-28 1995-06-06 Toshiba Corp モータ装置
JPH0841438A (ja) * 1994-07-27 1996-02-13 Sumitomo Bakelite Co Ltd 低温加工性の優れた耐熱性フィルム接着剤及びその製造方法
US5550196A (en) * 1994-11-09 1996-08-27 Shell Oil Company Low viscosity adhesive compositions containing asymmetric radial polymers
JPH08157572A (ja) * 1994-12-07 1996-06-18 Mitsui Toatsu Chem Inc 変性フェノールアラルキル樹脂およびその製造方法
JPH08165410A (ja) * 1994-12-15 1996-06-25 Hitachi Chem Co Ltd 導電性樹脂ペースト組成物および半導体装置
JP3190044B2 (ja) * 1995-04-04 2001-07-16 日立化成工業株式会社 接着剤、接着フィルム及び接着剤付き金属箔
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
JP3700243B2 (ja) * 1996-05-08 2005-09-28 東レ株式会社 Ｔａｂ用接着剤付きテープおよび半導体装置
JPH1017870A (ja) * 1996-06-28 1998-01-20 Nippon Steel Corp コークス乾式消火設備のスローピングフリュー部構造
EP0831528A3 (en) * 1996-09-10 1999-12-22 Hitachi Chemical Company, Ltd. Multilayer wiring board for mounting semiconductor device and method of producing the same
AU4471797A (en) * 1996-10-08 1998-05-05 Hitachi Chemical Company, Ltd. Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
JPH10178070A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
DK0841339T3 (da) * 1996-11-06 2007-07-02 Basilea Pharmaceutica Ag Vinylpyrrolidinon-cephalosporinderivater
JP3792327B2 (ja) * 1996-12-24 2006-07-05 日立化成工業株式会社 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム
JPH10275891A (ja) 1997-03-28 1998-10-13 Hitachi Ltd 半導体装置
JPH10330724A (ja) * 1997-05-30 1998-12-15 Hitachi Chem Co Ltd 耐熱接着剤、耐熱接着剤層付き半導体チップ、耐熱接着剤層付きリードフレーム、耐熱接着剤層付きフィルム及び半導体装置
JP3915940B2 (ja) 1997-06-10 2007-05-16 日立化成工業株式会社 絶縁層用接着フィルム
JPH111670A (ja) 1997-06-13 1999-01-06 Nippon Shokubai Co Ltd 粘着製品
US6302994B1 (en) * 1997-06-18 2001-10-16 Toagosei Co., Ltd. Process for producing labeled article
US5997682A (en) * 1997-08-27 1999-12-07 Science Research Laboratory Phase-separated dual-cure elastomeric adhesive formulations and methods of using the same
JPH11140386A (ja) * 1997-11-14 1999-05-25 Hitachi Chem Co Ltd 接着フィルム、その製造法、接着フィルム付き支持部材及び半導体装置
JPH11209724A (ja) * 1998-01-30 1999-08-03 Hitachi Chem Co Ltd 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP3994498B2 (ja) * 1998-01-30 2007-10-17 日立化成工業株式会社 半導体装置の製造方法
KR100530519B1 (ko) * 1998-02-17 2006-04-21 주식회사 새 한 전자부품용 접착테이프의 제조방법
JPH11260838A (ja) 1998-03-09 1999-09-24 Hitachi Chem Co Ltd 両面接着フィルムを用いて作製した半導体装置
JPH11284114A (ja) 1998-03-27 1999-10-15 Hitachi Chem Co Ltd 半導体装置
JPH11315189A (ja) * 1998-05-07 1999-11-16 Fujitsu Ltd 半導体装置封止用樹脂組成物及びこれを用いた半導体装置
JP4049452B2 (ja) * 1998-07-02 2008-02-20 日東電工株式会社 半導体素子用接着シートおよびそれを用いた半導体装置
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
JP3678007B2 (ja) * 1998-07-10 2005-08-03 松下電器産業株式会社 電子部品実装装置における電子部品認識装置および電子部品認識方法
DE60036038T2 (de) * 1999-06-18 2008-04-30 Hitachi Chemical Co., Ltd. Klebstoff, Klebstoffgegenstand, Schaltungssubstrat für Halbleitermontage mit einem Klebstoff und eine Halbleiteranordnung die diesen Enthält
KR20080087046A (ko) * 2000-02-15 2008-09-29 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치
JP2001302998A (ja) * 2000-02-15 2001-10-31 Hitachi Chem Co Ltd 接着フィルムおよびその用途
KR100894208B1 (ko) * 2000-03-31 2009-04-22 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착 필름,반도체 탑재용 기판 및 반도체 장치
JP3913481B2 (ja) * 2001-01-24 2007-05-09 シャープ株式会社 半導体装置および半導体装置の製造方法
CN101451053A (zh) * 2004-05-18 2009-06-10 日立化成工业株式会社 粘接接合片与使用该粘接接合片的半导体装置以及其制造方法

Also Published As

Publication number Publication date
WO2001060938A1 (en) 2001-08-23
KR100928104B1 (ko) 2009-11-24
KR20020075426A (ko) 2002-10-04
JP4858459B2 (ja) 2012-01-18
JP2008202046A (ja) 2008-09-04
KR101032227B1 (ko) 2011-05-02
KR20080087044A (ko) 2008-09-29
US20120080808A1 (en) 2012-04-05
US20060100315A1 (en) 2006-05-11
KR20110008107A (ko) 2011-01-25
US20090186955A1 (en) 2009-07-23
US20110187006A1 (en) 2011-08-04
KR20130042054A (ko) 2013-04-25
JP4839564B2 (ja) 2011-12-21
KR101032257B1 (ko) 2011-05-02
JP5549559B2 (ja) 2014-07-16
CN1208418C (zh) 2005-06-29
KR20090075736A (ko) 2009-07-08
KR101237137B1 (ko) 2013-02-25
JP2008214631A (ja) 2008-09-18
KR20080087046A (ko) 2008-09-29
US8119737B2 (en) 2012-02-21
JP2008187189A (ja) 2008-08-14
KR20080080421A (ko) 2008-09-03
CN1400993A (zh) 2003-03-05
KR20090075740A (ko) 2009-07-08
JP2008193105A (ja) 2008-08-21
KR20120024973A (ko) 2012-03-14
KR20080087045A (ko) 2008-09-29
KR101289924B1 (ko) 2013-07-25
US20060106166A1 (en) 2006-05-18
KR20080081374A (ko) 2008-09-09
KR101319171B1 (ko) 2013-10-16
KR100889101B1 (ko) 2009-03-17
KR20110122196A (ko) 2011-11-09
KR100931745B1 (ko) 2009-12-14
KR100931744B1 (ko) 2009-12-14
KR20080080420A (ko) 2008-09-03
JP2008195943A (ja) 2008-08-28
JP2008195944A (ja) 2008-08-28
AU2001232298A1 (en) 2001-08-27
US7947779B2 (en) 2011-05-24
US20030069331A1 (en) 2003-04-10
KR101312197B1 (ko) 2013-09-27
US20110021005A1 (en) 2011-01-27
JP2011084743A (ja) 2011-04-28
KR100931743B1 (ko) 2009-12-14
JP4894779B2 (ja) 2012-03-14
US20070036971A1 (en) 2007-02-15
KR20090075738A (ko) 2009-07-08
KR20090075739A (ko) 2009-07-08
US20140332984A1 (en) 2014-11-13
JP2008208367A (ja) 2008-09-11
KR20080081373A (ko) 2008-09-09
KR100931742B1 (ko) 2009-12-14

Similar Documents

Publication Publication Date Title
TWI299748B (en) Adhesive composition, its manufacturing method, and adhesive film, substrate for carrying a semiconductor device and semiconductor device using such adhesive composition
EP1184419A3 (en) Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device
WO2007050287A3 (en) Semiconductor structure and method of assembly
MY126953A (en) Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same
TWI319591B (en) Method to produce semiconductor components and thin-film semiconductor components
DE602004023734D1 (de) Lösungsmittel-modifizierte harz-zusammensetzungen und verwendungsverfahren dafür
SG150377A1 (en) Adhesive sheet for producing semiconductor device, semiconductor device therewith, and manufacturing method therefor
TW200520042A (en) Semiconductor module containing circuit elements, method for manufacture thereof, and application thereof
MY138890A (en) Combinations of resin compositions and methods of use therof
ATE377843T1 (de) Multichip-schaltungsmodul und verfahren zur herstellung hierzu
TW200737373A (en) Method of packaging a semiconductor die and package thereof
WO2002024808A1 (en) Epoxy resin molding material for sealing
EP1457515A4 (en) RESIN COMPOSITION, PREPREG, LAMINATE FILM AND SEMICONDUCTOR COMPONENT
EP1233446A3 (en) Thermosetting resin composition and semiconductor device using the same
TW200511454A (en) Adhesive sheet for producing a semiconductor device
WO2002099871A3 (de) Kunststoffgehäuse mit mehreren halbleiterchips und einer umverdrahtungsplatte sowie ein verfahren zur herstellung des kunststoffgehäuses in einer spritzgussform
TW200517435A (en) Resin composition for encapsulating semiconductor device
TW200420658A (en) Epoxy resin composition and semiconductor device
EP1460889A3 (en) Plastic package with high heat dissipation and method for manufacturing the same
EP1203792A4 (en) RESIN COMPOSITION FOR SEMICONDUCTOR ENCLOSURE, SEMICONDUCTOR COMPONENT OBTAINED therefrom, AND METHOD FOR THE PRODUCTION OF SEMICONDUCTOR COMPONENTS
TW200720350A (en) Liquid epoxy resin compostie
EP1160857A3 (en) Epoxy-based adhesive for mounting a semiconductor device on a substrate
US20080009130A1 (en) Underfill and mold compounds including siloxane-based aromatic diamines
US20080038878A1 (en) Encapsulation circuitry on a substrate
EP1698460A4 (en) MULTILAYER ELEMENT

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent