TWI268812B - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

To provide a substrate treatment apparatus capable of accurately controlling the distance between a discharging port and a substrate and having a nozzle easy to manufacture. In the substrate treatment 1, linear gauges 81, 82 for measuring the vertical position as the position in the direction perpendicular to the substrate to be treated measure the vertical position of the discharging port 41c of the slit nozzle 41 to discharge the treatment liquid to the substrate to be treated and the measured sites P, P' and control vertical movement of the slit nozzle 41 by lift mechanisms 43, 44 to transfer the slit nozzle 41 in the direction vertical to the substrate utilizing the measured result of the vertical position.

Description

1268812 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate processing apparatus and a substrate processing method. [Prior Art]

In the conventional substrate processing apparatus, the discharge port provided at the tip end of the nozzle is brought close to the substrate, and the treatment liquid is discharged from the discharge port to the substrate, whereby the treatment liquid is applied to the substrate. In the substrate processing apparatus, since the distance between the discharge σ and the substrate affects the spray state of the treatment liquid, it is necessary to control the distance between the discharge port and the substrate to a specific distance. For this reason, various techniques have been proposed for controlling the distance between the discharge port and the substrate within a certain distance. For example, Patent Document 1 discloses a technique in which the position of the measurement surface formed in the same plane as the discharge port is measured, and the distance between the discharge port and the substrate is controlled to a specific distance by the measurement result. L seeking documents 1] [Problems to be solved by the invention] In the technique of the patent document, the measured surface and the ejection port must have high precision in the same plane position, otherwise the distance between the ejection port and the substrate cannot be controlled. At a certain distance. Therefore, in the patent 1 technique, the time and cost of the nozzle f becomes an intractable problem. Although the measurement of the discharge port position can be used instead of the measured surface position measurement, at this time, the nozzle discharge = the treatment liquid causes a measurement error, so that the distance between the discharge port and the substrate cannot be properly controlled. The present invention is developed by the present invention to solve this problem, so that it is possible to provide a substrate processing apparatus that can correctly control the distance between the ejection port and the substrate and to manufacture the nozzle. [Summary of the Invention]

In order to solve the above problems, according to the invention of the present invention, there is provided a substrate processing apparatus comprising: a measuring mechanism, a vertical position of a position in a direction perpendicular to a substrate to be processed, and a nozzle having a substrate toward the substrate The ejection σ of the processing liquid is ejected, and the measurement portion for measuring the vertical position is defined as a 'g straight moving mechanism that moves the nozzle in a direction perpendicular to the substrate' and the control mechanism, and the control mechanism thereof The vertical movement mechanism; and the control means controls the vertical movement mechanism 0 according to the invention of the request item 2 by the measurement result of the vertical position of the discharge port and the measurement portion in the request item! Further, the substrate processing apparatus further includes a memory mechanism for storing a measurement result of a vertical position of the measurement portion when the vertical position of the ejection port is a specific vertical position, and the control means moves the nozzle to the measurement by the vertical movement mechanism The result of the vertical position of the portion coincides with the measurement result memorized by the above-described memory device, thereby performing a correction process of moving the ejection port to a specific vertical position. According to the invention of claim 3, in the substrate processing apparatus of claim 2, the measurement result stored in the tamper mechanism is a measurement of the vertical position of the measurement site when the measurement result of the discharge port is a specific measurement result. result. i 1 bit According to the invention of claim 4, at the substrate of the request item 2, the substrate processing apparatus is described, and the above-described correction processing is executed in synchronization with the start of the operation. According to the invention of claim 5, the above-described correction processing is executed at a specific time at which the substrate processing apparatus of the above-mentioned substrate processing apparatus executes a specific number of substrates. According to the invention of claim 6, the substrate processing and control unit of the request item controls the distance between the substrate and the discharge port by controlling the amount of movement of the vertical position of the nozzle by the vertical movement mechanism. According to the invention of claim 7, in the substrate processing apparatus of claim 1,

Further, the horizontal movement mechanism that moves the nozzle in a direction parallel to the substrate is configured to move the nozzle in a direction to the substrate flash by the horizontal movement mechanism, and to switch the measurement between the discharge port and the measurement portion. The object of measurement of the organization. According to the invention of claim 8, the substrate processing method for processing the substrate by ejecting a processing liquid from a nozzle having a discharge port to a substrate, comprising a first measuring step of measuring the ejection in a direction perpendicular to the substrate The second vertical measurement step of the spoon vertical position measures the vertical position of the measurement portion of the nozzle defined outside the discharge port, and the vertical movement step 'Using the above-mentioned first! The measurement process and the measurement result of the second measurement process move the nozzle in a direction perpendicular to the substrate. [Effects of the Invention] According to. According to the invention of the first item 1 to the clear item 8, since the measurement results of the vertical positions of the discharge port and the measurement portion are utilized, the distance between the discharge port and the substrate can be correctly controlled, and the vertical direction of the exit port and the measurement portion are not required. The nozzles are formed in such a manner that the positions are identical, so that the nozzle can be easily fabricated. According to the invention of claim 2 or claim 3, since it is not necessary to move the discharge port 103825.doc ^68812, the outlet is attached to the vertical position of the discharge port, so even in the case of the straight stomach & treatment liquid, The vertical position of the spout is consistent with the specific dangling position. According to the request item 3, after the fact, once the vertical position of the discharge port is correctly measured, the operation is performed. The vertical position of the exit can be omitted, and the cleaning of the discharge port can be omitted. According to the request item 4^ nn. With the operation of the above-mentioned substrate processing apparatus, the operation of the substrate processing apparatus is started, and the processing is performed, so that each substrate can be solved. When the processing device is operated, the accuracy of the measured value of the straight position decreases. According to the invention of claim 5, the substrate processing apparatus performs a certain number of soils: the processing or the mother performs the correction processing at a specific time, thereby solving the substrate processing of a specific number of substrates in the base device or the vertical position per specific time. The accuracy of the measured value is reduced. According to the invention of claim 6, there is no need to provide a measuring member for measuring the vertical position and the absolute value of the nozzle, so that the invention of the substrate processing is simplified. The invention of the printing item 7 can be measured by a measuring mechanism. The vertical position of the outlet and the test portion can simplify the construction of the substrate processing apparatus. [Embodiment] <1> Configuration of Substrate Processing Apparatus> The outline of the substrate processing apparatus 1 according to the embodiment of the present invention is shown. Fig. 2 is a plan view showing the main body 1 in the earth-plate processing failure 1 which is constituted by the main body 2 and the control unit 'from above. 3 and 4 show a front view and a side view, respectively, of the body 2. 103825.doc 1268812 Substrate processing apparatus is a processing liquid coating apparatus which is a 90 s method and a surface of a substrate 90 to be processed. The substrate processing apparatus 1 &quot;° is, for example, a substrate for a flat panel display represented by a broken substrate for a liquid crystal panel, a substrate for a 曰胜田 $ 卞 ( (4), a flexible substrate, and a color chopper. The semiconductor (four) or the like, the treatment liquid can be, for example, a structure: Γ:? (hereinafter referred to as "the photoresist"). Further, the substrate 90 is a member for constituting the liquid crystal panel in the liquid helium display device, that is, an angular shape. The glass substrate for a liquid crystal panel; the processing liquid is a photoresist for forming a pattern for selectively forming an electrode layer formed on the surface of the substrate 90 for 90 seconds, and the above-described conditions are further described below. In the substrate processing apparatus! The slit coating is applied to the surface 90s of the substrate 90 by spraying the photoresist from the slit nozzle 41. <1. 1 Configuration of the body> The body 2 shown in the figure is provided a flat 3:3 that holds the substrate 9 and becomes a base of the attached devices, and a bridge structure that ejects the photoresist to the substrate 9G

4. The bridge structure 4 is horizontally movable on the platform 3 in the horizontal front-rear direction (X direction) by means of the moving means 7, 71. 〇 platform; platform 3 is composed of a solid block of rectangular parallelepiped, and the upper surface and the side surface are processed into a flat shape. The upper surface of the flat hall 3 is a horizontal plane and can be used as the holding surface % of the substrate 9 . A large number of vacuum adsorption ports are formed in the distribution surface 30. In the substrate processing apparatus, when the substrate 90 is processed, the substrate 90 is held at the holding region 91 by the vacuum suction of the vacuum suction port. 103825.doc 1268812 ^ truss bridge structure; the bridge structure 4 which is substantially horizontally across the left and right ends of the platform 3, mainly consists of a nozzle support portion 40 for the branch joint nozzle 41, and a nozzle support portion supported above the platform 3 40 lifting mechanisms 43 and 44 at both ends. The nozzle branch portion 40 is held substantially horizontally above the platform 3 by the elevating mechanisms 43, 44 and is movable up and down. The longitudinal direction is the horizontal direction of the substrate processing apparatus 1 (the Y-direction nozzle support portion 4 is mainly made of aluminum die-cast material, and the strength can be maintained by the _ &amp; ', and the driving force can be reduced. The driving force required for the movable bridge structure 4 is such that the bridge structure 4 can be moved using a motor having a small driving force. As shown in Fig. 3, a slit nozzle "" is attached to the nozzle supporting portion 4". The slit nozzle 41 is horizontal As shown in the side view of Fig. 5, the discharge portion 41b protrudes downward from the main body 41a, that is, in the direction of the substrate 9A. Further, the discharge portion 41b is connected to the discharge port 41 of the end to include a supply photoresist. According to the above configuration, the substrate processing apparatus 1 can eject the photoresist onto the substrate 90 through the ejection port 41c. The slit nozzle 41 has sufficient rigidity, and is formed by the above-described configuration. The relative position of the discharge port 41c as seen from the direction of view of the main body 41a is not changed by the deformation of the slit nozzle 41. As described above, the elevating mechanisms 43 and 44 allow the nozzle support portion 4 to be supported on the platform at both ends up and down. Above 3, make a spray The nozzle support portion 4 can be raised and lowered in a vertical direction (Z direction) perpendicular to the holding surface 30 or the substrate 90. The nozzle support portion 40 is provided with a slit nozzle 41, so that the lifting mechanism ", the material can make the slit nozzle 4 1 Moving in a direction perpendicular to the substrate 9〇, thereby becoming a mechanism for changing the distance between the ejection opening 41c and the surface 90s of the substrate 90. The lifting mechanism 43 and 44 103825.doc -10- 1268812 can cause the slit nozzle 41 to move up and down in parallel The state in the YZ plane can also be used to adjust the slit nozzle 41. In turn, the lifting mechanism 43 and 44 _ ^ 44 are described in detail. Since the lifting mechanisms 4 3 and 4 4 are basically the same, the lifting mechanism is raised under the armpit. 44, the description will be omitted with reference to Fig. 6 and Fig. 7, and the lifting mechanism 43 &lt;1 will be omitted. Here, Fig. 6 and Fig. 7 show the details of the lifting mechanism 44, the main λα m 砰, , and the field (2). The figure is equivalent to viewing the flat circle of the lifting mechanism 44 from above. m, & 10 views. Figure 7 corresponds to the front view of the lifting mechanism 44.

As shown in Figs. 6 and 7, the elevating mechanism 44 includes an AC servo motor (hereinafter referred to as "service motor") 440, a ball screw 441, and a rotary encoder material 2. The elevator structure 44 has a coupling member (not shown), and each of the feeding motor (four) or the rotary encoder 442 is attached to the coupling member and supported at a specific position. The servo motor 440 generates a lifting and lowering driving force of the nozzle supporting portion 4, and the servo motor rotates the rotating shaft according to the control signal sent from the control portion 6, and can control the rotation angle of the rotating shaft and the rotating direction according to the control signal. 0 Ball screw The upper end of the 441 is connected to the rotation shaft of the servo motor 44A, and the central axis Q is rotated as a center. The ball screw 441 is attached to the mounting hole 40h at the end of the nozzle support portion 40. The inner surface of the mounting hole 40h is a female screw structure. Therefore, the ball screw 441 is rotated by the rotation power transmitted from the servo motor 440, so that the nozzle support portion 40 (the slit nozzle 41) can be moved up and down in a wrong straight line direction. A rotary encoder 442 mounted on the upper portion of the servo motor 440 can monitor the feeding horse 103825.doc 1268812

The rotation axis position of 440 is reached, and the position address aR corresponding to the rotation axis position is fed back to the control portion 6. Further, the amount of movement (lifting distance) of the nozzle supporting portion 4 in the direction perpendicular to the vertical direction of the nozzle supporting portion 4 is determined by the rotation angle of the ball screw 44 (the rotation angle of the servo motor 440). Thereby, in the substrate processing apparatus 1, the amount of change of the position address transmitted by the rotary encoder 442 by eight feet and the amount of movement of the nozzle support portion 40 in the vertical direction correspond to 丨: 1, so the amount of change by controlling the position address AR is obtained. Then, the amount of movement of the nozzle support portion 4 in the vertical direction can be controlled. 〇Moving mechanism; As described above, the bridge structure 4 allows the substrate processing apparatus 1 to horizontally move in the horizontal front and rear directions. Hereinafter, the mobile devices 7A and 71 which enable the bridge structure 4 to achieve the horizontal movement will be described. The private devices 70, 71 respectively include a mobile road,

75 'AC linear servo motor (hereinafter referred to as "linear servo motor" "still, π and linear encoders 78, 79. In these structures, the moving rail 72, the support ^ 4 straight (four) service motor 76 and linear encoder 78 A moving mechanism for moving the lifting mechanism horizontally in the front-rear direction, a moving rail Μ, a branch block 5: a line servo motor 77 and a linear encoder 79 are moving mechanisms for moving the lifting mechanism 44 2 in the front-rear direction. (4) The structure is the same, clearly. =: The former is explained with reference to Fig. 9. The latter is repeated. The moving device 7 (the cross-sectional circle in the MtYZ plane) is shown. The side view of the mobile device 70 is shown in the drawing. At the end of @定(四), the nightmare is processed, and the length direction is the horizontal orientation of the substrate. In the substrate processing apparatus, the support block is fixed at the lower end of the lifting mechanism 43 by the moving rail 103825.doc -12-1268812 '72 and solid' 74 is a linear guide device that defines a moving direction of the elevating mechanism 43. In the substrate processing device, the branch block 74 is horizontally moved along the slide rail 72, and the moving direction of the elevating mechanism 43 is defined in the horizontal front-rear direction. The horizontal motor of the structure 43 provides a driving force. The linear motor % moves the moving portion 鸠 relative to the fixed portion 76a according to the control signal sent from the control portion 6, and controls the movement amount and the moving direction according to the control signal. The fixing portion 76a is fixed to the side of the platform 3 and moves in the moving direction of the lifting mechanism 43, and the moving portion 76b is fixed to the lower end of the lifting mechanism 43. Therefore, when the moving portion 76b moves relative to the fixing portion 76a, the lifting mechanism 43 can be held on the holding surface The horizontal encoder 78 is horizontally moved in the horizontal direction. The linear encoder 78 includes a scale portion 78a and a detecting portion Mb that detect the position of the detecting portion m corresponding to the scale portion 78a and position the detecting portion 鸠The address AL is transmitted to the control unit 6. At this time, the scale portion 78a is fixed to the fixed portion 76a and the platform 3 and extends along the moving direction of the elevating mechanism u, and the detecting portion 78b is fixed to the lower end of the elevating mechanism, and therefore, the linear encoding The position address AL transmitted by the device 78 also serves as the basis for specifying the horizontal position of the lifting mechanism 43 in the horizontal front-rear direction. 4 The above-mentioned 'substrate processing device! The lifting mechanisms 43 and 44 can be horizontally moved in the horizontal front-rear direction by the movement I, 70, 71, respectively, so that the bridge structure 4 including the slit nozzles 4 can be integrally parallel to the fixing surface 30. Or the horizontal movement of the substrate 90 in the horizontal direction. Further, the horizontal position of the slit nozzle 40 in the horizontal front-back direction can be specified according to the positional address transmitted to the control portion 6 by the straight line, the flat horses 78, 79. 103825.doc 1268812 The linear gauge is fixed to the front face 31 of the platform 3, and linear gauges 81 and 82 are fixed. The linear gauges 81 and 82 are for measuring the vertical position of the measuring object in the direction perpendicular to the substrate 90. Hereinafter, the configuration of the linear gauge 81 (82) will be described with reference to an enlarged view (side view) of Fig. 10 . The linear gauge 8 1 (82) includes a measuring device 8 11 (821) that is elastically movable up and down in the direction of the vertical line. The measuring device 8 11 (82 1) is pressed down and rebounded when subjected to downward pressure, that is, the measuring device 811 (821) is pressed down into the body portion 812 (822) fixed to the front face 31 and can be pressed. return. Then, the linear gauge 8 1 (82) can measure the cap under the measuring portion 8 (82 丨) and output the measurement result to the control portion 6. Therefore, the front end of the measuring unit 811 (821) of the linear gauge 81 (82) is brought into contact with the object to be measured, and the vertical position of the measuring object in the vertical direction can be derived by the control unit 6. In the substrate processing apparatus 1, the linear gauge 81 (82) is attached to the front surface 31 of the stage 3 in the following manner: (1) The vertical direction of the front end 8 13 (823) of the measuring portion 811 (821) in a state where no pressure is applied. The position is above the holding surface 3〇 (please refer to Fig. 1〇(4)). (2) When the amount of pressure below the measuring unit 811 (821) reaches the detectable maximum, the vertical position of the front end 813 (823) is at the holding surface 3〇 Below (please refer to the figure i (b)), the vertical position of the object to be measured can be measured within a specific range including the holding surface 30 by the linear gauge 81 (82). Further, the measured value of the linear 1 gauge 8 1 is when the front end portion 8 3 (823) is located on the fixed surface 30; k is "〇", that is, the value of the linear gauge is based on the fixed surface 30, and the holding surface 3 is距离 The distance between the object and the measuring object, or the height of the measuring object based on the holding surface 103825.doc -14-1268812 3 0. &lt;1·2 Control Section Configuration> As shown in Fig. 1, the control section 6 is constituted by a microcomputer. The memory unit 60 includes a program and data, and an arithmetic unit 61 that processes the program. The "memory unit 60" is, for example, a ram for performing temporary memory, a read-only ROM, a magnetic disk device, or the like, and may be constituted by a memory medium such as a removable optical disk or a memory card, and a reading device thereof. The front side of the frame of the frame 6 is provided with an operation portion 62 for the operator to input a command for the substrate processing device, and a display portion 63 for performing various displays. For example, various switches (including a keyboard and a mouse) are provided. It can also function as the display unit 6 as with a touch panel display. The display unit 63 can be constituted by, for example, a liquid crystal display or various lamps. The control unit 6 is connected to each component of the main body 2 via a cable (not shown) or a 1/〇 interface. Each of the portions of the substrate processing apparatus φ set 1 such as the elevating mechanisms 43 and 44 is controlled once in accordance with a command input from the operation unit 62 or a signal transmitted from each component of the main body 2. Next, the functional configuration of the control section 6 will be described. Fig. U is a view showing a functional configuration of the control unit 6 for controlling the elevation and the horizontal movement control of the slit nozzle 41. Fig. 1] (In the middle, the linear gauge control unit 〇1, the mobile device control unit 602, the elevating mechanism control unit 〇3, the initial correction control unit 604, the respective correction control units 〇5, and the coating control unit By control. 卩6 uses various hardware such as I/O interface to execute the control program to realize the function block of the function. The lifting mechanism 43, the moving mechanism 7〇 and the linear gauge 8丨 are not shown in Fig. 11, but The control unit 6 controls the same mechanism as the lift mechanism 103825.doc 1268812 44, the moving mechanism 71, and the linear gauge 82. In Fig. 11, the linear gauge control unit 601 derives from the detection result transmitted by the linear gauge 82. The vertical position of the object is measured. The mobile device control unit 602 acquires the position address AL transmitted from the linear encoder 79, and outputs a control signal to the linear servo motor 77. Further, the mobile device clamps. 卩 602 monitors the position address Al and the linear servo motor The output control signal 'by this' causes the ejection port to move at any horizontal position. The φ lifting mechanism 603 acquires the position address AR transmitted from the rotary encoder, and outputs a control signal to the linear servo motor 77. Further, the mobile device control unit outputs a control signal to the linear servo motor 44A, thereby moving the discharge port 41c at an arbitrary vertical position. The initial correction control unit 6〇4 is mainly at the discharge port 41e. In the state where the treatment liquid is not attached, the process is performed as follows: Specifically, when the vertical position of the discharge port 41c coincides with the holding surface 3〇 (the measured value of the vertical position is: &quot;〇&quot;) The initial correction control unit 604 measures the vertical position H0 defined by the measurement portion P (see FIG. 5) of the main body of the slit nozzle 41, and serves as an initial vertical.

The state in which the vertical position of the port 41c coincides with the holding surface 3〇 is referred to as the present embodiment, and as shown in Figs. 3 and 5, the lower surface of the sliding surface is measured by the linear gauge 81 (82). Do not interfere

The change is as long as it is called "original string" during the linear gauge 81 (82) measurement process. The flat portion of the main body portion 51a is selected as an example, and the relative position of the slit nozzle c is not generated. The σ position of the non-interference discharge port 103825.doc -16 - 1268812 can be selected as the measurement portion p(p,). Further, in the present embodiment, the nozzle outlet 41 is formed by matching the nozzle outlet 41c with the vertical position of the measurement site P (P'). Therefore, the slit nozzle in the present embodiment is produced in comparison with the valley. Each of the correction control units 605 performs one-time control of each of the _ persons being turned on every time the power is turned on to the substrate processing apparatus 1. The initial vertical position ρ ΐ 0 recorded in each of the correction control units 6 〇 5 and 贝 邛 , , , , , , , , , , , , , , , , , , , , , , , , 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定When the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The vertical position ' performs the origin occurrence operation. Therefore, in each of the correction processes, P can cause the processing liquid to adhere to the ejection port 41c, and the ejection port "c can be accurately moved to the origin. Further, each of the correction control units 6Q5 is interposed by the elevating mechanism control unit 6 3€ takes the position address from which the origin appears, and records it as the reference position address AR1 in the memory unit 6. The earth cloth is manufactured. The M06 is controlled when the photoresist is applied to the surface of the substrate 9〇9〇s. The lifting mechanism 44 maintains the distance between the discharge port and the surface of the base (4) at an appropriate distance. This control process is performed by using the measurement results of the vertical position of the initial correction or the timing of each of the timings and the measurement. 2. Operator's operation sequence > The substrate processing device wiper operator's operation sequence is described with reference to the flow chart. 103825.doc 17 1268812 None, the operator judges the linear S1). If the linear gauge 81, 82 needs to be correct and positive (step w and the right to be right, then the operator gauges 81, 82 after the correction on whether, 仃,,, M (steps to make a judgment to determine the correction, on the other hand 'When linear gauge 81, no need If the operator enters directly or not, it is necessary to enter the correction of the knife without correcting the linear gauges 81 and 82 (step S2). Then, the operator judges whether the initial needs to be performed. Correction (step call. In the case where (4) correction is to be performed, the operator performs the discharge port: clean operation (step S4), initial correction for the substrate processing apparatus m: after (step S5) 'make the substrate processing l is switched to automatic operation. On the other hand, when the initial correction is not required, the operator switches the board processing apparatus 1 to the automatic operation state (step S6). Further, when the substrate processing apparatus is first operated, etc. If the vertical position is not stored in the memory unit 60, or after the slit nozzle is replaced, etc., the initial vertical position stored in the memory unit is an unreasonable value, it must be executed. The initial calibration step. In addition, in the automatic operation L, in order to perform each correction, it is not necessary to clean the discharge port 41. 〇 Correction of the linear gauge; 礼礼' for the linear gauge 81(82) The correction operation is described with reference to Fig. 13. Fig. 13 is an enlarged view showing a state (side view) of the linear gauge 8丨 in the corrected state. Before the initial correction, the measuring unit 811 (821) When the front end 813 (823) is in the same vertical position as the holding surface 3〇, the linear gauge will measure the 103825.doc •18-1268812 threshold value as 〇 (or a specific value). In addition, it can also be at the front end. 8 13 (823) When the holding surface 30 is at a different vertical position, the measured value is adjusted to a specific value. Specifically, when the linear gauge 81 (82) is corrected, the operator will have a plate shape having a flat surface PL The corrector (correction tool) 83 is placed on the holding surface %, and the measuring unit 8 ιι (82 ι) which protrudes upward from the holding surface 3 向 is turned to the surface which is in contact with the holding surface 30 at this time. That is, the lower surface of the measuring portion is 811, which is a flat surface.匕, the height of the front end 813 is the same as the height of the holding surface 3〇 in a state in which the flat surface is closely adhered to the holding surface %. Then, the child-like evil is maintained, and the adjustment is made so that the measured value of the linear gauge 8丨(82) is “0′′, thereby completing the correction of the linear gauge 81 (82). &lt;3· Operation of the substrate processing apparatus &gt; The operation of the substrate processing apparatus i will be described below. In the description, the flow of the initial correction and each correction operation will be described, and the operation flow related to the automatic operation will be described. | 〇 Initial correction; Referring to FIG. 14 and The operation of the substrate processing apparatus 初始 at the time of initial calibration will be described. Fig. 14 is a flow chart showing the flow of the operation of the initial correction. Fig. 15 is a side view of the linear gauge 8 (82) and the slit nozzle when the initial correction is performed. Further, before the initial correction, the discharge port 41c is first cleaned (refer to Fig. 12), so that the linear gauge 8 1 (82) can accurately measure the position of the discharge port 41c during the initial correction. After the initial calibration is started, first, the initial correction control unit 6〇4 moves the slit nozzle 41 horizontally via the moving device control unit 602 so that the ejection ports 4丨c to 103825.doc 9 9 1268812 reach the linear gauge 81 ( 82) Above, that is, the horizontal position of the holding discharge port 41c coincides with the horizontal position of the linear gauge si (82) (Fig. H(4)) (step si〇i), the initial correction control unit 604 adjusts the origin of the discharge port 41c ( Step S102) Specifically, the initial correction control unit 6〇4 monitors the vertical position of the discharge port 4ic via the linear gauge control unit 601 and the elevation mechanism control unit 6〇3, and lowers the slit nozzle 41 (Fig. 15). (b)) When the measured value of the vertical position of the discharge port is "〇", the lowering slit nozzle 41 is stopped (Fig. 15 (c)). The initial correction control unit 604 is further introduced to the level of the mobile device control unit 6〇2. The moving slit nozzle 4 1 is moved so that the measurement portion p(p,) of the slit nozzle 4 that completes the origin reaches above the linear gauge 81 (82), that is, the horizontal position of the measurement portion p(p') is maintained. It coincides with the horizontal position of the linear gauge 81 (82) (Fig. 15 (d)) (step S103). At this time, in order to prevent the discharge port 划 from being scratched by the linear gauge 8 1 (82), the level is performed. Before moving, temporarily suspend the slit nozzle 41 to the upper side, and return the slit nozzle 41 after the horizontal movement ends. The horizontal position of the horizontal movement is shifted to the horizontal position. That is, during the horizontal movement, as long as the vertical position of the discharge port 41c before and after the movement is maintained, there is no restriction on the movement path. After the horizontal movement is completed, the initial correction control unit 6 (4) The vertical position of the measuring portion P(P,) is measured by the linear amount regulating portion 6.1, and is stored as the initial vertical position = in the memory portion 60. Further, the initial portion is stored in the memory portion 60 before being stored. In the case where the correction is at the 2nd position H〇, the initial vertical position Ho before the update is updated by the newly obtained initial vertical coverage. Thereby, the measured value of the straight position of the discharge port 4 = 103825.doc -20 - 1268812 is obtained, and the vertical position Η〇β of the measuring portion P(P,) is further made during the initial correction process by The moving mechanism μ and η horizontally move the slit nozzle 41' to realize the measurement of the linear gauge 81 (82) to switch between the suppressing discharge 410 and the detecting portion ρ(ρ,). In this way, the vertical linear gauge is used to measure the vertical position of the ψ 疋 ( 41 (: with the measurement unit Ρ (Ρ '), and the configuration of the substrate processing apparatus 1 is simplified. 〇 each correction; And Fig. 17 shows the operation of the substrate processing apparatus k at each correction. Fig. 6 shows the flowchart of the operation flow of each calibration, and Fig. 17 shows |τ &amp; - The side view of the linear gauge 81 (82) and the slit nozzle 41 is observed from the side. The individual correction control unit 6〇5 moves the seam horizontally by the mobile device control unit 602. The nozzle 41 causes the measuring unit to reach above the linear gauge 81 (82), that is, the horizontal position of the holding measuring portion ρ (ρ,) coincides with the horizontal position of the linear gauge 81 (82) (Fig. 17 (a)). (Step _) Then, each of the correction control units performs the origin adjustment on the pair of discharge ports ( (step S202). Specifically, each of the correction control units 6〇5 is interposed with the linear gauge control unit 610 and The elevating mechanism control unit 6 〇3 monitors the vertical position of the measuring unit p and lowers the slit nozzle 41 (Fig. 17(b)). When the measured value of the straight position coincides with the initial vertical position stored in the memory unit 60, the stop slit nozzle 41c (Fig. 15(c)) e is different from the initial correction, and the discharge port 不 is not measured in the original process, so Even if there is a treatment liquid on the spray, the origin of each correction can be made. Then, each correction control unit 6〇5 receives the control unit of the lifting mechanism to obtain 103825.doc 21 1268812 &quot; The address ar ' is stored in the memory unit 60 as the reference position address AR1 (step S203). The automatic operation of the substrate processing apparatus; the following is a flow chart of FIG. White saying, cable &gt; 4 4 The operation flow of the substrate processing apparatus 1 during the automatic operation will be described. The substrate processing apparatus [after starting the automatic operation, the correction control is first performed by each time. M05 is subjected to each of the above corrections, In the holding area 91 of the holding surface 30, vacuum suction Yu Bao In the region 91 (step S302), the coating control unit 606 applies a photoresist coating treatment to the surface 9〇s (step S304). In the photoresist coating process, the coating control unit 6〇6 is operated by an operator or the like. The thickness τ of the substrate 9 input as the material in the control unit 6 and the gap G suitable for the photoresist coating (for example, 5 〇μηι 3 3 pm, φ is typically 150 Km to 200 l·1111). And calculating the distance T+G between the ejection port 41c and the holding surface 3, and reading the reference position address AR1' from the memory portion 60, according to Equation 1, the rotary encoder 442 should be maintained during the photoresist coating process. The location address is AR2. At this time, the constant k is the amount of rise and fall of the slit nozzle 41 corresponding to each unit change of the position address AR, and is determined experimentally or theoretically in advance. [Number 1] 2 = View + 丄 (Γ + G)... Equation (1)

K and wherein the coating control unit 606 controls the 103825.doc -22-1268812 teleport 70, 71 via the mobile device control unit 602 to move the slit nozzle 41 c in the horizontal direction of the photoresist coating region. The calculated position address AR2 is given to the lift control unit 603, and a control signal is sent to the servo motor 44 to realize the correct position address AR2. By &amp;, the distance between the discharge port 4lc and the holding surface is maintained at T+G, and the gap between the discharge port 41c and the surface 9〇 is maintained at a certain distance.

After the substrate 90 is coated with the photoresist, it is transported to the next processing step by the transport device (step S305). Then, in the substrate processing apparatus, the number of substrates of the previous correction movement processing is different (e.g., 1), and the processing is different (step S306). Then, when the number of processed substrates reaches a certain number, then ^ to step S1 is performed again for each correction. On the other hand, when the number of processed substrates does not reach a certain number, the process returns to step S3 to start a new substrate process. With the above operation, each correction is performed each time the number of substrates processed by the substrate processing apparatus reaches a certain number. Furthermore, in step S306, depending on whether the number of substrate processes after the previous correction is moved, the processing may be performed differently according to whether the time from the previous corrections reaches a specific time, for example, when a certain time is reached. Returning to step S3011, if the specific time has not been reached, the process returns to step (10). Thereby, the control accuracy of the vertical position can be resolved for the discharge port 41 every time a specific number of substrates are processed or each time elapsed. Thereby, a precise distance can be maintained between the discharge port 41c and the surface 90s. As described above, the reference position address AR1, which is the basis of the control by the coating control unit 606, is a measurement value of the position of the vertical discharge 103825.doc -23 - 1268812 by the discharge port 41c and the measurement unit p^, the initial correction, and when each correction is performed. The measurement value of the vertical position of the measurement unit p(p,) is determined. Therefore, the application control unit 606 and the elevation mechanism control unit 603 finally control the elevating mechanism 43 and the material using the measured value. In other words, in the substrate processing apparatus 1, the origin occurrence operation is performed using the measured value of the vertical position of the discharge port 104c and the measuring portion p(p') at the time of initial calibration, and the measured value of the vertical position of the measuring portion at each correction, and The amount of change in the position address AR is controlled to control the amount of change in the vertical position from the origin, thereby controlling the distance between the discharge port 41c and the surface 90s. Since the movement amount, i.e., the relative value, is controlled, it is not necessary to provide a measuring member for measuring the absolute value of the vertical position of the slit nozzle, so that the structure of the substrate processing apparatus 1 can be simplified.

Further, in the present embodiment, as long as the vertical position of the ejection n41e is correctly detected during the initial calibration, the discharge port ❿ and the surface 90 can be maintained at the correct distance, and the discharge port does not need to be accurately measured. The vertical position of 41c can omit the cleaning operation of the discharge port 41c. Thereby, the automatic operation of the substrate processing apparatus can be easily realized. &lt;Modifications&gt; In the above-described embodiment, the case where the substrate 9 is fixed and the slit nozzle 移动 is moved in the direction perpendicular to the substrate is exemplified, and the slit nozzle is fixed and the substrate 9G is moved. The slit nozzle 41 may also move relative to the substrate %. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a substrate processing apparatus according to an embodiment of the present invention! FIG. 2 is a plan view of the body 2 of the substrate processing apparatus 1 as viewed from above. 3 is a front elevational view of the body 2 of the substrate processing apparatus 1. 4 is a side view of the body 2 of the substrate processing apparatus 1. Figure 5 is a side view of the slit nozzle 41. Fig. 6 is a plan view of the elevating mechanism 44 as viewed from above. Figure 7 is a front elevational view of the lift mechanism 44. Figure 8 is a cross-sectional view of the moving mechanism 70 in the YZ plane. Figure 9 is a side view of the moving mechanism 70. Figures 10(a)-(b) are side views showing the mechanism of the linear gauge 81 (82). Fig. 11 is a block diagram showing the functional configuration of the control unit 6 for controlling the lifting and horizontal movement of the slit nozzle 41. Fig. 12 is a view showing an operation sequence of an operator of the substrate processing apparatus 1. Figure 13 is a side view showing the linear gauge 81 (82) in a corrected state. Fig. 14 is a flow chart showing the operational flow of the initial correction. Fig. 15 (a) - (b) show a side view of the linear amount of the gauge and the slit nozzle when the initial correction is performed. Figure 16 is a flow chart showing the operational flow of each degree of correction. Fig. 17 (a) - _ shows a side view of the linear gauge and the slit nozzle viewed from the side when each correction is performed. Figure 18 is a flow chart showing the operational flow of the automatic operation. [Description of main component symbols] 1 Substrate processing apparatus 2 Main body 3 Platform 103825.doc -25- 1268812 4 Bridging structure 6 Control part 41 Sewing nozzle 41c Ejection outlet 43, 44 Elevating mechanism 70, 71 Moving mechanism 76, 77 Linear servo motor 78, 79 Linear encoder 81, 82 Linear gauge 90 Substrate P5 P1 Measuring location 440 Servo motor 442 Rotary encoder 103825.doc -26-

Claims (1)

1268812 X. Patent application scope: 1 . A substrate processing apparatus, comprising: a measuring mechanism that measures a vertical position of a position in a direction perpendicular to a substrate to be processed; and a nozzle having a discharge to the substrate a discharge port of the treatment liquid, wherein the measurement portion for measuring the vertical position is defined outside the discharge port; a vertical movement mechanism that moves the nozzle in a direction perpendicular to the substrate; and a control mechanism that controls the vertical movement mechanism The control unit controls the vertical movement mechanism by using the measurement results of the vertical position of the discharge port and the measurement site. 2. The substrate processing apparatus according to claim 1, further comprising: a memory mechanism that stores a measurement result of a vertical position of the measurement portion when a vertical position of the ejection port is a specific vertical position; and the control mechanism uses the vertical movement mechanism The measurement result of moving the nozzle to the vertical position of the measurement site coincides with the measurement result stored in the memory means, thereby performing a correction process of moving the discharge port to a specific vertical position. 3. The substrate processing apparatus according to claim 2, wherein the measurement result stored in the memory means is a measurement result of a vertical position of the measurement site when the measurement result of the vertical position of the discharge port is a specific measurement result. 4. The substrate processing apparatus of claim 2, wherein 103825.doc 1268812 is synchronized with the operation of the substrate processing apparatus to perform the above correction The substrate processing apparatus of claim 2, wherein the substrate processing apparatus performs a specific number of times of the substrate to perform the above-described correction processing for a specific time. The substrate processing apparatus of claim 1, wherein the control means controls the distance between the substrate and the ejection port by controlling the amount of movement of the vertical position of the nozzle by the vertical movement mechanism. The substrate processing apparatus according to claim 1, further comprising: a horizontal moving mechanism that moves the nozzle in a direction parallel to the substrate; and the horizontal moving mechanism moves the nozzle in a direction parallel to the substrate, thereby The measurement target of the measuring means is switched between the discharge port and the measurement site. 8. A substrate processing method, wherein the substrate is processed by ejecting a processing liquid from a nozzle having a discharge port to a substrate, and has a step of measuring a direction perpendicular to the substrate a vertical position of the discharge port; a second measurement step of measuring a vertical position of the measurement portion defined by the nozzle other than the discharge port; and a vertical movement step of using the second measurement step and the second measurement step As a result of the measurement, the nozzle is moved in a direction perpendicular to the substrate. 103825.doc