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TWI264271B - Heat sink - Google Patents

Heat sink

Info

Publication number
TWI264271B
TWI264271B TW094115552A TW94115552A TWI264271B TW I264271 B TWI264271 B TW I264271B TW 094115552 A TW094115552 A TW 094115552A TW 94115552 A TW94115552 A TW 94115552A TW I264271 B TWI264271 B TW I264271B
Authority
TW
Taiwan
Prior art keywords
fin
heat sink
baffle
central area
oblique vent
Prior art date
Application number
TW094115552A
Other languages
Chinese (zh)
Other versions
TW200640354A (en
Inventor
Alex Hsia
Yu-Hung Huang
Chin-Ming Chen
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW094115552A priority Critical patent/TWI264271B/en
Priority to US11/287,393 priority patent/US20060260785A1/en
Application granted granted Critical
Publication of TWI264271B publication Critical patent/TWI264271B/en
Publication of TW200640354A publication Critical patent/TW200640354A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink includes at least one first fin and at least one second fin. In the present invention, the first fin has at least one oblique vent. A side of the oblique vent has a baffle, the first and second fin are disposed parallelly, and the second fin is located on the side of the baffle of the first fin. The second fin has at least one oblique vent. The heat sink can guide airflow into a central area thereof to prevent the hub of a fan from blocking airflow at the central area, so that the dissipation efficiency is improved.
TW094115552A 2005-05-13 2005-05-13 Heat sink TWI264271B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094115552A TWI264271B (en) 2005-05-13 2005-05-13 Heat sink
US11/287,393 US20060260785A1 (en) 2005-05-13 2005-11-28 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094115552A TWI264271B (en) 2005-05-13 2005-05-13 Heat sink

Publications (2)

Publication Number Publication Date
TWI264271B true TWI264271B (en) 2006-10-11
TW200640354A TW200640354A (en) 2006-11-16

Family

ID=37447257

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115552A TWI264271B (en) 2005-05-13 2005-05-13 Heat sink

Country Status (2)

Country Link
US (1) US20060260785A1 (en)
TW (1) TWI264271B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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TWI289648B (en) * 2005-07-07 2007-11-11 Ama Precision Inc Heat sink structure
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins
US20070119566A1 (en) * 2005-11-30 2007-05-31 Xue-Wen Peng Heat dissipation device
JP2008217189A (en) * 2007-03-01 2008-09-18 Nec Corp Electronic equipment
TWM336475U (en) * 2008-03-03 2008-07-11 Tai Sol Electronics Co Ltd Heat dissipater with internal flow guiding function
CN101888765A (en) * 2009-05-15 2010-11-17 鸿富锦精密工业（深圳）有限公司 Heat sink
US10506719B2 (en) * 2013-01-15 2019-12-10 Blackberry Limited Thermal dissipater apparatus for use with electronic devices
TW201502459A (en) * 2013-07-10 2015-01-16 Hon Hai Prec Ind Co Ltd Heat sink
JP6437481B2 (en) * 2016-04-01 2018-12-12 ミネベアミツミ株式会社 Lighting device

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Also Published As

Publication number Publication date
TW200640354A (en) 2006-11-16
US20060260785A1 (en) 2006-11-23

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