TWI237656B - Peelable adhesive composition - Google Patents

Abstract

This invention provides a peelable adhesive composition containing an adhesive resin and a compound which can generate gas from active radiation irradiation.

Description

1237656 (ii) Description of the invention: Technical field 3 to which the invention belongs 3 Technical field The present invention relates to a peelable adhesive composition. 5 [Background Art] Conventionally, when the surface of a thin plate material that is easily deformed or damaged due to external force from, for example, a wafer, is processed, such as grinding, the thin plate material is fixed to a supporting substrate with an adhesive and processed. The method of removing the finished material 10 from the adhesive and the support to obtain a processed sheet material. For the adhesive used in this application, it is required that the sheet material be firmly fixed to the supporting substrate during processing. And the so-called excellent peelability of the material which can be easily peeled from the adhesive and the supporting substrate after finishing the processing. However, conventionally, when used for such applications, it is known that there is no adhesive composition having excellent adhesiveness and peelability. [Summary of the Invention] Disclosure of the Invention 20 An object of the present invention is to provide an adhesive composition having excellent adhesion and peelability. As a result of diligent research in order to achieve the foregoing object, the inventor found that if an adhesive composition containing a resin having adhesive properties and a compound that generates a gas by irradiation with active energy rays is used, it has 1237656 After the adherence required for the adherend of the material, the adherend can be easily peeled off after processing by the gas generated by irradiation with active energy rays. Based on the foregoing knowledge, the inventor repeated various reviews to complete the present invention. 5 卩, the present invention provides a lower release adhesive composition. h A debonding adhesive composition containing a resin that adheres to the surface and a compound that generates gas by irradiation with active energy rays. 2. The release adhesive composition according to the above item 1, wherein the adhesive resin is a photosensitive resin. ι 3. The peelable adhesive composition according to item 1 or 2 above, wherein the compound that generates a gas by irradiation with active energy rays is a diazidoacetate. 4. The peelable adhesive composition according to any one of the items 1 to 3, wherein the use ratio of the aforementioned adhesive resin and the compound that generates gas by irradiation with active energy rays is relative to the resin. 100 parts by weight 'The compound is 1 to 100 parts by weight. The nature of the coupling composition of the present invention will be described in detail below. Peelable Adhesive Composition The peelable adhesive grade composition of the present invention contains an adhesive resin 20 and a compound that generates gas by irradiation with active energy rays. Therefore, the adherend to be bonded by the present composition can generate gas by irradiating active energy rays such as ultraviolet rays to the bonding layer, and can easily peel the bonding layer and the adherend by the generated gas. The adhesive resin is preferably a resin with adhesiveness at a temperature of 50 to +1, especially -40 1237656 to + 120 C. In addition, the adhesiveness should be such as adhesion (kgf / cm2) is 5 ~ 40, especially in the range of 7 ~ 30. The adhesive resin may be a thermoplastic resin or a hardening resin. For example, thermoplastic resins include: acrylic resins, amine-based acetic acid resins, polyacetic resins, paints and their derivatives, poly (vinyl acetate), and other organisms. Inflammable oxygen and its derivatives and the like, and the curable resin includes, for example, a polymerizable unsaturated group introduced into any of the aforementioned resins. In addition, the hardening resin may be a photosensitive resin having an adhesiveness of 10 in a photosensitive resin composition having adhesiveness which is hardened by active energy such as ultraviolet rays, which will be described later. In this case, light may be appropriately added as needed. Aggregate bows, photosensitizing pigments, etc. & The compound which generates a gas by irradiation with active energy rays can be suitably used, for example, S-quindiazide. Xun Kun-Nitrite Flavonic Acid is intended to produce 15 photosensitive compounds of nitrogen by active energy ray irradiation, and the adhesive layer can be peeled off by using bubbles generated by the generated nitrogen. Polyisocyanic acid ester can be suitably used as a polyhydroxydiphenyl group and a benzene compound, nitrogen, acid, 2-naphthoquinonediazidesulfonic acid, etc.,]-Quinonediazidesulfonic acid. Esters. 1 20 帛 to form the poly (phenylene diphenyl) used herein includes those represented by the following formula (I). 0 (ηο ^ Ογ ^ χ ^ οη, ⑴ 1237656 In the formula, m and η are integers of 0 to 3, and the total of m + η is 1 to 6. Specific examples of polyhydroxydiphenyl ketones can be listed as: 2 , 3,4-trihydroxydiphenyl ketone, 2,3,4,4'-tetrahydroxydiphenyl ketone, etc. On the other hand, 1,2-benzoquinonedi esterified with polyhydroxydiphenyl ketone Azide 5 sulfonic acid includes a compound represented by the following formula (II), and 1,2-naphthoquinonediazidesulfonic acid esterified with a polyhydroxydiphenyl ketone includes the following formula (III) Of compounds.

S03H

(Specific examples of ID (III) 1,2-benzoquinonediazidesulfonic acid include: 1,2-benzoquinonediazide-10 azide-4-sulfonic acid, etc. 1,2-naphthoquinonediazidesulfonic acid, etc. Specific examples of the acid include 1,2-naphthoquinonediazide-5-sulfonic acid, 1,2-naphthoquinonediazide-4-sulfonic acid, etc. The aforementioned polyhydroxydiphenyl ketone and 1,2 —The esterification reaction of quinonediazidesulfonic acids can be performed by a method known per se, for example, polyhydroxydiphenyl ketone 15 and 1,2-quinonediazidesulfonic acid or its iide (such as chloride) The reaction proceeds at this time. There is no particular limitation on the reaction ratio between the two at this time. However, in general, relative to the number q of hydroxyl groups in the polyhydroxydiphenyl ketone, it is preferred to make 1, 2- The reaction of quinonediazidesulfonic acid. The polyhydroxydiphenyl ketone and 1,2-quinonediazidesulfonic acid or its compound can be used separately, or 7656 can be used by mixing two or more kinds + In the adhesive composition, a resin having an adhesive property and a compound which generates a gas by irradiation with active energy rays are generally used to form a collection example. The resin is formed in 1 GG parts by weight of the resin. The composition is preferably a part by weight, particularly preferably 5 to 50 parts by weight. The adhesive composition of the present invention can smoothly produce a gaseous compound by adhering a resin having adhesive properties and by irradiating an active energy ray. It can be prepared by dissolving in the medium. —Zheng 10 medium can be used in combination with one or more kinds of water, organic solvents and other solvents. Organic solvents can be used such as: hydrocarbon solvents, alcohol solvents, ether solvents, Various solvents, such as ketone solvents, vinegar solvents, amine-based solvents, etc. Materials Processing Method The peelable adhesive composition of the present invention can be suitably used as an adherend of a material to be processed on a supporting substrate and on The adhesive used when peeling off the supporting base material of this material after processing. The processing method of the material using the aforementioned adhesive composition is preferably the following method. That is, the processing method of the material including the following procedure Properly carry out the processing of various materials', that is, the material layer to be processed and the photosensitive resin composition layer having adhesiveness are formed into the material layer by the peeling adhesive of the present invention. The procedure of fixing the surface to a supporting substrate with transparency; 加工 The processing procedure of the aforementioned material that has been fixed by New Zealand, and (3) Then, by removing the mutated energy from the supporting substrate, Procedure for taking out processed material. — 1237656 Procedure (1) Procedure (1) is formed by the peelable adhesive composition layer of the present invention formed on the non-processed surface of the material to be processed, and a photosensitive resin having gripping properties. $ There are no special restrictions on the aforementioned materials to be processed, which are fixed to the supporting substrate with transparency, and various materials such as grinding must be used. The materials of the foregoing materials can be plastic, metal, Glass, fiber, paper, etc. 1. The material may have any shape such as film, plate, linear, spherical, round, conical, rectangular parallelepiped, or a combination of the aforementioned shapes. In particular, it is suitable to use materials such as sheet-like materials that are easily deformed or broken by external forces and must be reinforced such as grinding. Specific materials include electronic materials such as wafers. 15 ^ The photosensitive resin composition with adhesiveness used in the foregoing procedure 可 can suitably use a photosensitive resin containing adhesive and a photopolymerization initiator, a photosensitizing pigment, etc., as needed, and by Aqueous or organic resin-turning resin composition that is hardened by irradiation with active energy rays such as ultraviolet rays. The photosensitive resin having adhesiveness is preferably a photosensitive resin having an adhesiveness at a temperature of 50 to +15 (rc, especially 204 to +120 c), and the standing resin is as follows The force (kgf / cm2) is 5 to 40, especially in the range of 7 to 30. Specific examples of the aforementioned photosensitive resin with adhesive properties are listed below. (1) Polymerizable properties such as (meth) acryl fluorenyl group The photosensitive resin 1237656, which is a photosensitive group, is exemplified by the above-mentioned photosensitive resin, which can be produced by smoothly adding a glycidyl group-containing polymerizable unsaturated compound to an acrylic resin containing a carboxyl group. The carboxyl group-containing acrylic resin can be used as an essential monomer component by using, for example, α, β-ethylenically unsaturated acids such as propylene 5 acid and methacrylic acid, and copolymerizing the selected monomer from (meth) acrylic acid. It is obtained from at least one unsaturated monomer such as esters, styrene, (meth) acrylonitrile, and (meth) acrylamide, and the aforementioned (fluorenyl) acrylic acid esters can be exemplified by methyl ( Methacrylic acid ester, ethyl (meth) acrylic acid , Propyl (meth) acrylate, 10 butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, hydroxyethyl (meth) acrylate, etc. In addition, smooth addition to containing Examples of the carboxyl group-containing acrylic resin-containing polymerizable unsaturated compound include glycidyl acrylate, glycidyl methacrylate, and glycidyl acrylate. 15 The aforementioned carboxyl group-containing acrylic resin and the glycidyl group-containing resin The addition reaction of a base unsaturated compound can be easily performed according to a method known per se, for example, in the presence of a catalyst such as tetraethylammonium bromide at 80 to 120 ° C for 1 to 5 hours, thereby easily proceeding. The photosensitive resin ⑴ can also be produced by adding a reactant of a polymerizable unsaturated compound containing a hydroxyl group and a diisocyanate compound to a acrylic acid 20-based resin containing a hydroxyl group. Examples of the compound include hydroxyalkyl (meth) acrylic acid such as 2 to 10 ethyl acrylate, 2-hydroxyethyl methyl acrylate, and 2-hydroxypropyl acrylate. Esters; N-hydroxymethacrylamidine, etc. 1237656 In addition, examples of the diisocyanate compounds include: methylphenyl diisocyanate, dimethyl diisocyanate, hexamethylene diisocyanate, and diamine diisocyanate. Isocyanate, etc. In addition, the acrylic resin containing a warp group can be used as a monomer component in which the aforementioned polymerizable unsaturated compound containing a warp group is used as an essential monomer component, and is polymerized with an ester selected from (meth) acrylic acid, Resin derived from at least one unsaturated monomer such as styrene, (meth) acrylonitrile, and (meth) acrylamide, and the (meth) acrylic acid esters can be listed as: Methyl) propanoate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (fluorenyl) propenoate, 2-ethylhexyl (meth) acrylate , Hydroxyethyl (meth) acrylate, etc. The aforementioned polymerizable unsaturated compound containing a hydroxyl group reacts with the diisocyanate compound at substantially equal molar ratios. The addition reaction between the obtained reactant and the acrylic resin containing a hydroxyl group can be carried out in accordance with a method known per se, 15 for example, by reacting at a temperature of 50 to 10 lot in a nitrogen ambient gas. Furthermore, in the photosensitive resin (i), a photosensitive resin containing an allyl group as a photosensitive group can also be obtained by adding (meth) allyl alcohol and a diisocyanate to the hydroxyl-containing acrylic resin. Based on the reactant 20 of the compound. '(ii) A photosensitive tree containing a cinnamoyl group as a photosensitive group. The aforementioned photosensitive resin (ii) can be obtained by mixing acryl-based acrylic resin and acryl-based resin in a pyridine solution in the presence of a base, for example. Substituted or unsubstituted cinnamic acid halides are produced by smooth reaction. 12 1237656 As the acrylic resin containing a warp group, those described in (i) above can be used. Further, the substituted or unsubstituted cinnamic acid halide includes a cinnamic acid halide which may have 1 to 3 substituents selected from a nitro group, a lower alkoxy group, and the like on the benzene ring. More specifically, examples include : Cinnamic acid chloride, p-nitrocinnamic acid chloride, p-methoxycinnamic acid vapor, p-ethoxycinnamic acid chloride, etc. In general, an average of 1,000 parts by weight of a 'substituted or unsubstituted cinnamic acid compound can be used in the range of 6 to 180 parts by weight of the aforementioned hydroxyl-containing acrylic resin, and 10 is preferably in the range of 30 to 140 parts by weight. The amount of the acrylic resin and the substituted or unsubstituted cinnamic acid compound may be determined according to a method known per se, for example, at a temperature of 30 to 70 ° C in the presence of a pyridine solvent. The temperature allowed the reaction to proceed. (iii) Other photosensitive resins 15 20

Prepolymers such as other photosensitive resins (iii) based on polyethylene glycol diacrylic acid, polypropylene diacrylate, and the like can also be used as the photosensitive resin.

In the photosensitive resin composition having adhesiveness, a conventionally known polymerization initiator can be used as needed, and examples thereof include: 2-methyl-1-1 [4- (methylthio) benzyl] -2-1? Porphyrin-i-ketone, 2 ~ benzyl 2-dimethylamino- 1- (4-morpholino-benzyl) -butyrazine-i, oxy-1,2-diphenylethane- ι — g iso, bis (2,4,6-trimethoxybenzylfluorenyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzylfluorenyl) -2,4,4-trie group Monopentylphosphine oxide, 2-Hydroxy-2 ~ A certain glycan τ 丞 1 ~ Benyl ~ Propane ~ -W, 1-Ethyl-cyclohexyl-phenyl-, p-dimethylamino group 13 1237656 2,4-diethylthioxanthone, isopropyl xanthone and so on. Examples of commercially available products include: Lucirin TPO (manufactured by BASF, trade names), Irg907, Irg369, Irg651, Irg819, Irgl700, Irgl800, Irgl850, DAROCURE 1173 (the above are manufactured by Chiba · Special · Chemical Company, trade names), 5 KAYACURE DMBI, KAYACURE DETX (the above are manufactured by Nippon Kayaku Co., trade name), SPEED CURE ITX (made by SIBERHEGNER company, trade name), etc. The use ratio of the photopolymerization initiator is preferably 10 parts by weight or less, preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the photosensitive resin. 10 In the photosensitive resin composition having adhesiveness, a conventionally known one can be used as the photosensitizing dye as needed. Specifically, for example, a thiodiphenylamine-based pigment, an onion-based pigment, a hexabenzobenzene-based pigment, a benzo-onion-based pigment, a perylene-based pigment, a perylene-based pigment, a merocyanine-based pigment, Photosensitizing pigments such as ketocumarin-based pigments. The ratio of use of these photosensitizing dyes is preferably within a range of 10 to 5 parts by weight based on 100 parts by weight of the photosensitive resin, and more preferably within a range of 0.1 to 5 parts by weight. Furthermore, the photosensitive resin composition having adhesiveness may further contain an ethylenically unsaturated compound, a colorant, a plasticizer, a smoothing agent, etc., as necessary. As the ethylenically unsaturated compound, a monomer containing 1 to 4 ethylenically unsaturated groups and the like can be used. The photosensitive resin composition having adhesiveness can be prepared by making the photosensitive resin having adhesiveness, and a photopolymerization initiator, a photosensitizing pigment contained in the resin smooth, disintegrated, or dispersed in a medium. The medium can be combined with one or two or more kinds of solvents such as water and organic solvents. As the organic solvent, various solvents such as carbonized core solvents, alcohol-based solvents, ether solvents, _-based solvents, system-based solvents, and amine-based solvents can be used. 5 10: = (_ Supporting substrates are made by a releasable adhesive composition. Layer and / or have a sense of nature to train the remaining layer of the tree to process the material, so that it will not be deformed or broken due to the force applied during processing such as grinding. Such a support substrate is used to fix the material Those that support a certain material and have the transparency of active energy rays such as ultraviolet rays.

In the private sequence (3), in order to transmit the active energy rays irradiated from the outside of the supporting substrate (the opposite direction to the peelable adhesive composition layer and the photosensitive resin composition layer), to decompose the contained active adhesive It is necessary to support the transparency of the substrate by forming a composition layer and generating a gas by a compound that generates gas by irradiation with active energy rays. However, it is not necessary to be colorless and transparent, and it may also contain a colorant, a filler, etc., as long as it does not substantially hinder the generation of a gas utilizing the transmission active energy ray.

According to the aforementioned procedure (1), a material to be processed / peelable adhesive agent composition layer / adhesive photosensitive resin composition layer / support substrate can be laminated in this order. For example, 'the laminated body can be obtained by method a, that is, applying a peelable adhesive composition on the non-processed surface of the material to be processed, and forming the adhesive composition layer after drying', and coating the adhesive thereon. A photosensitive photosensitive resin composition is dried, and the resin composition layer is formed, and a support substrate is affixed thereon. In addition, for example, the aforementioned laminated body can also be obtained by method b, that is, those who are pasted on the non-processed surface of the aforementioned material to form a peelable adhesive composition layer, 15 1237656, and a photosensitive material having adhesiveness on a supporting substrate. Of resin film. In the aforementioned method b, the formation of the peelable adhesive composition layer can be performed in the same manner as in the method a. In addition, the formation of the photosensitive resin composition film having adhesiveness can be performed in the same manner as in method a, and can also be performed by a method in which the photosensitive resin is coated on a release plate in advance. The composition is dried to form the photosensitive resin composition film, and is then attached to support the surface of the substrate and the photosensitive resin composition film on the release plate, and is connected from the surface of the release plate ( This photosensitive resin composition film was pressed in the opposite direction, and then the release sheet was peeled. 10 15 20

Obtained by the above procedure (1), the method of making the material to be processed / peelable adhesive composition layer / photosensitive resin composition layer with adhesive property / supporting substrate laminated in this order is not limited to the foregoing Method a, method two, etc. 'As long as the laminated body can be obtained, it can be prepared in any order.

In the aforementioned procedure (1), the coating of the peelable adhesive composition or the it resin composition having adhesiveness can be performed using a known coating machine such as a roller, a roll coater, a spiral 77 coater, a spray, a bristle, or the like. The U-drying conditions may be suitable for the thickness of the 'peelable adhesive composition layer layer in the body of 1 to W according to the content of the components of each composition used:' and preferably 2 to 30 µm. In addition, the thickness of the photosensitive resin composition layer in the accumulator 14 is generally preferably j 0 μ η, and more preferably 2 to 100 μm. ’Shoe order (2) Program (2) is added to the program that has been fixed in the program, and the material to be added is added. 16 1237656 Work and private sequence 4 program, such as grinding of the material to be defended. At the time of the processing, since the material is composed of a peelable adhesive composition 3 "the slightly sensitive photosensitive resin composition layer is firmly fixed to the supporting substrate, g) it can be processed sufficiently. 5 light sequence (3) red The sequence (3) is the procedure of peeling and taking out the processed material from the outside of the support substrate of the aforementioned laminated body after processing in the procedure (2) ... In the procedure, the outer side of the laminated body (for peelability) is laminated in order from the processed material / peelable adhesive 10 composition layer / photosensitive resin composition layer with adhesiveness / transparent support substrate. The adhesive composition layer and the photosensitive resin composition layer are in opposite directions.) The active energy ray is irradiated, the photosensitive resin composition layer is hardened and the surface adhesion is reduced or becomes #adhesive, and at the same time, the hardened photosensitive resin composition is decomposed. In the peelable adhesive composition layer between the 15 layer and the material layer of the material layer, a compound that generates a gas by irradiation with active energy rays to generate a gas, thereby hardening the layer of the photosensitive resin composition. Surface and easily strip processed materials. The aforementioned active energy lines can be used such as ultra-high pressure, high pressure, medium pressure, low 20 pressure mercury lamp, chemical lamp, carbon arc lamp, xenon lamp, metal letter lamp, tungsten tungsten Lamps, etc. are ultraviolet or visible light sources. Also, the amount of active energy ray exposure is usually 500 to 10,000j / m2. According to the present invention, the following significant effects can be obtained. (A) Peelability of the present invention The adhesive composition has the adhesiveness necessary for fixing 12 1237656 materials to be processed due to processing, and has excellent peelability when processed straws are easily peeled off by active energy® rays. 5 10 (b) According to the processing method of the material using the release adhesive composition of the present invention, the material to be processed is fixed to the ear with the release adhesive composition layer and the photosensitive resin composition layer having adhesiveness. After the substrate is held, the active energy ray is irradiated from the outside of the support (the opposite adhesive composition layer and the photosensitive resin composition layer are in opposite directions), and the darkened group depends on (C) Therefore, the aforementioned processing method using the peelable adhesive composition of the present invention is very suitable for application because it is easily derived from, for example, crystals. When the surface of a thin plate material deformed or damaged by an external force such as a circle is subjected to processing such as grinding. L PREFERRED EMBODIMENTS OF THE INVENTION The present invention will be described in more detail with the following production examples, examples, test examples, and comparative test examples. However, The present invention is not limited to the examples. X, in each example, "" part "and"% "mean" part by weight "and"% by weight ". Production Example 1 Production of a photosensitive resin having a methacryl group as a photosensitive group It took 3 hours under a turbulent environment gas to drop to 90% of propylene glycol monomethyl ether in TC. This is composed of methyl methacrylamide, 40 parts of butyl acrylic acid, 20 parts of acrylic acid, and 2 parts of azobisisobutylene. After dripping, it is allowed to mature for 1 hour and takes 1 A 1237656 mixed solution consisting of 1 azobis-methylvaleronitrile and 1Q parts of propylene glycol monomethyl ether was dropped in 1 hour, and the mixture was allowed to mature for 5 hours to obtain an acrylic resin solution. Next, 24 was added to the solution. Parts of glycidyl methacrylate, 0.12 parts of hydroquinone and 0.6 parts of tetraethylammonium bromide, reacted at 110 ° C for 5 hours while injecting air, and obtained a glass transition temperature of 20 ° C, a number of 5 average A methacrylfluorene-based photosensitive resin solution having a molecular weight of about 20,000. Production Example 2 Production of Photosensitive Resin Composition In 100 parts (solid content) of the photosensitive resin obtained in Production Example 1, added as a photopolymerization initiator 2 of 2 —methyl-1 1 4 1 (methylthio) 10 benzyl] 2 2-morinyl-propanone 1-one (trade name "lrg9 07", manufactured by Chiba Specialty Chemicals Co., Ltd.) and 0.5-2 parts of 2,4-diethyl A solution of thioxanthone (trade name "Kayacure DETX", manufactured by Nippon Kayaku Co., Ltd.) dissolved in 20 parts of propylene glycol monomethyl ether acetate, and stirred by a mechanical stirrer to obtain light sensitivity 15 Resin Composition 1. 15 Example 1 To 100 parts (solid content) of the photosensitive resin obtained in Production Example 1, a quinonediazide-based photosensitive compound that emits nitrogen by active energy ray is added. 2 of 10 parts—Cyclo-3,4—bis (6-diazo-5,6-dihydro-5— pendant oxygen-1—qinjirongoxy) -diphenyl—dissolved in 50 parts The solution in 20 propylene glycol monofluorenyl ether acetate. Also, 2 ~ 2 methyl-1,2- [4- (methylthio) phenyl] -2? Which will be used as a photopolymerization initiator is added. Rindai Propion — 1 — trade name "Irg907", manufactured by Chiba Specialty Chemicals Co., Ltd. and 0.5 parts of 2,4-diethylthioxanthone (trade name "Kayacure DETX" Nippon Kayaku (shares)) was dissolved in the solution 191,237,656 ester in 20 parts of propylene glycol monomethyl ether acetate, and was stirred by a stirrer to mechanically obtain the release of the present invention is an adhesive composition. Example 2 In Example 1, except for 2-hydroxy-1,3,4-bis (6-diazo group_5,6--5-hydrogen- $, one-oxyl group-1-naphthyloxy group) ~ diphenyl The use amount of the base group was set to 30 parts, and other components were the same as in Example 1 to obtain the peelable adhesive composition 2 of the present invention. Example 3 In Example 1, except that an equivalent amount of a copolymer of P-vinylphenol and stupid ethylene 10 (trade name "Marco Link (7 Shaolikou ^ Liyi) csti5" was used, manufactured by Maruzan Petrochemical Co., Ltd. ) Instead of the photosensitive resin obtained in Production Example 1, the same composition as in Example 丨 was used to obtain the peelable adhesive composition 3 of the present invention. Example 4 15 In Example 1, except that an equivalent amount of an acrylic resin latex (trade name "Binibulan (DJE): ^) 7043" was used, instead of Manufacturing Example 1 Except for the obtained photosensitive resin, a peelable adhesive composition 4 of the present invention was obtained with the same composition as in Example i. The adhesive composition of the present invention obtained in Examples 1 to 4 was examined for adhesion and peelability to the wafer by the following test examples. Type 5 Test Example 1 Using a spin coater, apply the peeling flake bonding agent composition 1 obtained in Example 丨 on an 8-inch wafer to a dry film thickness of 5 after drying, and apply 65 on a hot plate. . (: Drying by heating for 2 minutes. 20 1237656 BU Furthermore, using a spiral coater, the photosensitive DU resin composition 1 obtained in Production Example 2 was coated on the film to a thickness of 15 after drying, and the film was heated on a hot plate. C was heated to dry for 2 minutes, and then the glass plate was pressed on the substrate with a pressure of 0 ° to serve as a supporting substrate. 5 10 借此 Thus, a layer / photosensitivity according to the wafer / peelable adhesive composition 丄 was obtained. The layer i of the tree composition i / the glass plate is laminated in order. The commercially available double-sided tape is used to fix the wafer surface of the above-mentioned laminated body to the workbench, and the Hunan suction cup combines the outer side of the glass plate with a spring scale. After measuring the initial adhesive force (kgfW), 6,6 J / mkUV light was irradiated from the outside of the glass plate by an ultra-high pressure mercury lamp. Similarly, the adhesive force after the irradiation was measured. The initial adhesive force was 7kgfW and was used to fix the crystal. A sufficient adhesive force for round and grinding, and good adhesion. Good adhesion means that the adhesive force is 5 kgf / cm2 or more. In addition, the adhesive force after UV irradiation is 1 kgfW, and can be easily removed from the adhesive layer. Adhesion of wafer peeling Good release. Good release means that the adhesive force is 2 kgf / cm2 or less.> Test Example 2 In Test Example 1, except that the peelable adhesive composition 2 obtained in Example 2 was used instead of the peelable adhesive. Except for composition 丨, the other components are the same as those in Subtraction Example 1, and the initial adhesion and the adhesion after UV irradiation are measured. Test Example 3 In Test Example 1, except that the peelable adhesive composition 3 obtained in Example 3 was used Except for the peelable adhesive composition, other components were the same as those in Test Example 1, and the initial adhesion force and the adhesion force after 11 ¥ irradiation were measured. 21 1237656 Test Example 4 In Test w 'except using Example 4 Except for the peelable adhesive composition 4 instead of the peelable adhesive composition 丨, the rest of the composition is the same as that of the test, and the _ return force and _radial adhesive force: measured in the wide display test examples 丨 ~ 4_ Adhesive force and-Adhesive force after irradiation. Initial adhesion of test example (kgf / cm2)

Repeated peeling after Uv irradiation _ initial force after UV irradiation (kgf / cS ^ X TT r i-if-t ±. »W · ΊΓΙ Comparative test example 1 ~~ ------ 2 2 3---- ------- ^ 4 __8 8 7 9 Jade good good good girl? '1 1 0.9 1.2 1.5 i good good good f Use commercially available double-sided tape to fix the heart + said gate inch wafer as support The 10 glass substrates of the base material are then peeled off from the glass plate after the wafer research. However, the peeling is difficult & if the wafer is barely peeled, the wafer is damaged. None) 22

Claims (1)

Pick up and apply for patent bacteria: Patent application No. 92121677 Patent Application Replacement 2005/4/22 1. A peelable adhesive composition, which contains a resin with adhesive properties, and can be irradiated by active energy rays A quinonediazide sulfonate which is a gas generating compound. 2. The releasable adhesive composition according to item 1 of the patent application scope, wherein the above-mentioned adhesive resin resin is a photosensitive resin. 3. The peelable adhesive composition according to item 1 or 2 of the scope of patent application, wherein the usage ratio of the resin with adhesive properties and the compound that generates gas by irradiation with active energy rays is 100 parts by weight relative to the resin The compound is 1 to 100 parts by weight. 4. · A material processing method, comprising: a fixing step of inspecting a non-processed surface of a material to be processed through a peeling adhesive composition layer as described in the patented feSI item 1 and an adhesion-sensitive tree The material layer is fixed on a transparent supporting substrate; the processing step is a processing of the aforementioned material that has been fixed; the processing substrate is taken out by the aforementioned supporting substrate, and after the foregoing processing step, Those who irradiate the active energy ray from the outside to peel off the material generating gas.