TWI231163B - Coated type resistor/capacitor on PCB - Google Patents

Abstract

This invention relates to a structure of coated type resistor/capacitor on PCB. Firstly, the resistor is made of conductive polymer or metal paste by printing. Secondly, the capacitor is made from printing one layer of conductive polymer or metal paste. Furthermore, connect VCC or GND copper surface after printing the dielectric material on the metal plane. Moreover, the metal plane and the conductive polymer of metal paste layer form a pair of capacitor electrodes. Finally, the dielectric material forms the dielectric layer of the capacitor.

Description

[231163 C7 D7 V. Creation instructions (/) The present invention relates to a structure of a flat-panel printed circuit board-coated resistor and capacitor, particularly a flat-plate resistor and capacitor formed simultaneously on a substrate by etching printing. According to the printed circuit board, circuits are formed on the surface or internal multilayer structure, and each circuit is mainly used for electrical connection or signal transmission between electronic components. However, with the rapid development of Gongxun and the significant increase in functional requirements, two phenomena have occurred: one is the substantial increase in the number of circuit surface adhesive components, and the other is the increasing demand for high-density printed circuits, but the aforementioned trends However, the following problems arise: 1. The number of electronic components increases, and the distance between adjacent components is shortened. When the circuit starts to work, the probability of radiated interference between components increases greatly, which directly affects the stability of circuit operation. 2 · Due to the increase in the number of electronic components, component signals may have to be transmitted through different forms of paths (such as electrical connections or signal transmission through vias), which increases the situation of line impedance mismatch and line noise. 3 · Furthermore, the increase in the number of electronic components will reduce the production yield relatively, and thus increase the manufacturing cost. 4 · In addition, the increase in the number of electronic components is not conducive to reducing the surface area of printed circuit boards. From the above, it can be known that in order to effectively solve the aforementioned problems of high-density printed circuits, in order to effectively solve the aforementioned problems, OHMEGA has proposed a technology of built-in resistors in printed circuit boards to replace the high-density printed circuits on the surface The technical principle of the resistance element is mainly based on the following formula: This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) Installation I »— 1 ^ -1 · ϋ 一 一口 ， I n · If In ti_i He n in I # Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

R n where; R: length resistance value P = resistance coefficient, thickness w two widths can be changed from the above formula can be seen in sentences, mistakes are caused by changes in L (length), W (width) degrees) … And use L (length), w (resistance required for wide production (and use θ I,)) to make the resistor in Γ using the very common multilayer printed circuit manufacturing technology, built in the structure of the circuit board The built-in resistance is formed, and the resistance in the internal circuit board structure can effectively replace the printed circuit board gauge and area pieces. Therefore, the number of components on the surface of the printed circuit board can be reduced. In addition to the built-in resistance, capacitors often use other It is formed in the form of an existing printed circuit board, which often brings two power layers (such as VCC and GND) with different potentials close to each other, and uses the large copper surface where the two are located to generate an additional capacitor to adjust the voltage. The formula is as follows: c—Crane • Iron In the Lishu formula, ε r (dielectric coefficient) is governed by the characteristics of the material, so it can be controlled by changing A (area) and (3 (distance) Required capacitance. It is feasible to embed the passive components such as resistors and capacitors in the structure of the printed circuit to effectively reduce the number of surface components and release the surface space. However, the aforementioned built-in resistors and embedded capacitors are divided into 4 books. Paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm (please read the precautions on the back before filling this page) f: I! Μ Order -----

nnu I% n H-fi'j 1231163 C7 D7 V. Creation instructions (Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by different technical means, which could not be applied in the same system, and due to Shu, + 7 & Where the wind capacitors and resistors are separately located on different substrates, there is also the possibility that materials are improperly added to increase costs. The main purpose of this article is to provide-a new type of flat resistance capacitors: first look at the board Technology at the level of insulating substrates has said that another object of the present invention is to use the above-mentioned substrate to pass through the steps of photoresist coating, image transfer, and engraving to form a built-in resistor and electrical structure. The present invention Another purpose lies in the above-mentioned secret public φ Ning · A company Dinuo Honggu system according to the following numbers, A is the area of the embedded capacitor, (mil), and K is a constant; The resistance is determined according to the following formula: 'where p is the resistivity of the resistive layer, and D, W, and T are the length, width, and thickness of the resistor, respectively.' Schema The detailed description is as follows: None (1) Schematic part · The first diagram A ~ F: is a schematic diagram of the process steps of the present invention, the second diagram mf is a process step of the flat six-resistance capacitor of the present invention _ another schematic diagram of a specific embodiment The third diagrams A ~ G are schematic diagrams of still another specific embodiment of the system of flat-type resistors and capacitors of the present invention. Knowing (two) Figure No .: Please read the notes on the back and fill in this page

The thickness of the printed dielectric material is ordered. 5 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 1231163

k 丄 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

(12) (13) Steel layer (1 5) resin (20) photoresist (30) image data (40) dielectric material (50) resistance layer (60) highly conductive material related to the present invention for making As shown in the first figure of the flat type, it includes the right "Basin 4 Scraping Valley Clothes" steps, image transfer "," image = !, base = :, "? Resistance coating core layer" "printed resistance and conductivity Layer "and other steps = :," printing medium, "please refer to section _A for the" substrate production "steps. Section (10) is used to make flat-type capacitors :: substrates with insulating properties (1U surface To be tied to the formation of a (12) (13) 〇) surface and bottom surface-copper layer, == and image transfer "steps: Please refer to Figure-Figure B, the surface and bottom surface of the soil reverse (1 0) are coated separately With photoresistance = 'the photomask with the design (transferred to the first resistance (2 ◦) and then dissolve and remove the image with the photomask,' and the photoresist within the range covered by the image, and the image data (3 0) The capacitance value of the flat-type capacitor made; "Image ㈣" step: After transferring the image data (3 Q) (20), the copper layer (1 2) covered by the image data (3) _ (1 3) After the etching step is completed, it is as shown in the second figure. No, and after the "remove photoresist" step is completed, it is the first structure.纸张 The size of this paper is applicable to the country of China 请) (Please read the notes on the back before filling in this page) 丨 Order --------- line; · — 123116 $ V. Creation Instructions (

The printing method is printed on the dielectric sound by printing: 2. This step is performed on the aforementioned substrate (10) (40), and the position of the printed dielectric material is set between the first (such as image data =); 11) The special layer (U) on the upper layer is printed by printing.-A part of the copper material (40) is made of, for example, 1 枓 (4 0). The dielectric is formed, and then, it has a high dielectric constant. The material structure is printed on the upper-layer resistor (1 2), and then printed again with a print coating (such as (50)). This layer of resistance (50) —a part of bare copper "Λ b 〇) The completed dielectric material (4., and a resistor formed between the steps described in 4.). Then, the copper layer (12) and the covered copper layer Γ Ί 9, " Clad material Section (4) uses the real resistance of the plate resistor to form a capacitor; as for the flat resistance, the resistance can be obtained by the following formula: R = PX] Yin Φ where P refers to the aforementioned resistance layer (5 copper layer (distance between ⑴, W: T = resistivity, "two widths and thicknesses. Therefore, the control resistance layer (5cn _ said) of the resistance layer (50) before the implementation only needs flat-plate resistance. I & degree can The capacitance value of the required resistance value is obtained through the following formula: c = kxerX- ~-t number: In the formula, 'ε r is the dielectric coefficient of the dielectric material (4 〇), and A is the copper layer. (2 2) and the resistance layer, then the area of heavy abundance of medium lightning 50), t is the thickness of the Department of Electrical Materials (40), and K is-constant.

Read the notes on the back first and then fill in the I 1 I order. The Ministry of Economic Affairs and Intellectual Property Bureau's Consumer Affairs Co., Ltd. Print this paper in a suitable size _ Home Fresh (CNS) A4 Specification ⑵ 0 x 297 mm) 1231163

: The aforementioned image data (30) is determined according to the common copper etched copper layer (12) and the valley value, and then connected to (&)) the dry area to enter the eighth area. And the predetermined position of the image data (30). Only one other Γ: Thousand-plate resistor is shown in the second figure. This is a schematic diagram of the embodiment of the flat-type resistor capacitor of the present invention. The order is that a copper layer is formed on both the upper and lower sides (1 2, After 1 3) (: plate (^ and copper layers (12, 13) are not shown), first block (2 G) on the copper layer =, then benefit from the second transfer mode (2n) i / The photoresist (20) in the image ㈣ is removed, which is as shown in the second figure β; the photoresist (20) in the image transfer is removed ('') ㈣, and the entire photoresist (20 = ; = Layer is as shown in the second figure c; removed, and after removing the entire photoresist (2 Q), the two-phase copper layer is completely printed in the way of adding-layer resistance = cm as the second (Shown in Figure D); _ 'uses the printing method to print a dielectric material (4 ◦) on the side of the resistive layer (50); wait: after the material is printed, the dielectric material (4 Q) is printed again. Outside = layer of highly conductive material (60); thus, a plate-type resistor is formed between two copper layers (between) and high. Conductive material (60) is formed between = copper layer (12) A capacitor. And again, see The third A ~ G drawing in the drawing of the present invention is similarly formed on the upper and lower sides of the substrate (10); steel: This paper size is applicable to China National Standard (CNS) A4 (210 X 297) Love

III _-equipment — the notes for reading I really ^ 1ί,) order --------- line shame 12311163 Five creation instructions (Supplement C7 D7 ((^, 13) 'The copper layer (12, 13) Coating-layer photoresist, and then use the image transfer method to transfer the image to the light, and then remove the light / a (20) part covered by the image transfer, and then remove the exposed part. The copper layer (1 2) is etched:,: & (2 0) ', then between the two adjacent copper layers ("" in a printed manner plus a _resistance layer (:: :( 12)) Print two = ::: Resistive layer (50). After that, add a layer of high-conductivity 6 4 ^ on the highly conductive material (60) and copper layer (1 /) (two) by printing on the setting-side. ^) An electric power is formed between ^) and a flat-type electric warp is formed with the printed circuit board at the same time, and the earth board (1 0) of the valley is pressed, and the CR is extended to book the seat board, drilling, etc. It can be constructed to have a built-in flat-type resistor and electric clothes _ board, which will help reduce the circuit life on the transmission line. 卩 Brush circuit resistance and provide better signal transmission: = 者 = ^ Brush circuit board surface Set resistance The number of capacitors can be used for one-sided space for electrical connection, signal transmission, and P-brush circuit boards. 〖Times, other processing, and function upgrades, except for the use of k-plate capacitors and resistors on the square substrate at the same time. It can also effectively reduce material waste and reduce manufacturing. Please read the precautions on the back before f write this page-1 I Bookkeeping " Ministry of Intellectual Property Bureau staff cooperation ^ Yin know agriculture in addition to the above role 纟 specific uses , The aforementioned flat-type resistor,

1231163 This paper standard is applicable to China National Standard (CNS) A4 specification (210 χ 297 public love) f〇 ^ === 5. Creation instructions: The use of the AC terminal method in high-frequency circuits is allowed to reduce the reflection noise R 〃 2 There is a resistor in series between the transmission line and the ground terminal in the traditional frequency circuit. ^ The reflected noise during the transmission process is divided by the "Xiao Xiao" number to ensure that the letter is transmitted, which is commonly known as the AC terminal method. In traditional high-frequency circuits, the external resistor R and capacitor c must be connected to the printed circuit board in the same way as a high-density printed circuit. Too much surface occupying the components will cause signal interference and good quality. The reduction of the rate and the increase of the cost of the Japanese-style flat-type resistor and the above-mentioned exchange method can effectively solve the problems caused by the circuit being too high. From the above, it can be known that the present invention uses a multilayer substrate with etching printing Method = Simultaneous formation of flat-type resistors and capacitors, and passive components such as resistors and capacitors are used in a large number on general printed circuit boards, and the invention is used to remove them; the removal of soil plates can significantly reduce the surface of printed circuit boards. Out of the number, it can make more space on the surface of the printed circuit board, power supply gas connection, chemical transmission, or other processing and function upgrading applications. It can be seen that the present invention can effectively solve the problem by using built-in resistors and capacitors. Various problems caused by circuit density. Although the present invention is described in its preferred embodiment, the principle of Embodiment 1 will be fully disclosed to a third person familiar with this technology. Therefore, any changes and modifications made from the preferred embodiment of the present invention can be easily achieved, but as long as such changes and modifications do not depart from the spirit of the creation, they should all belong to the scope of the creation. However, the description of the present invention is not intended to limit the scope of the present invention, but only for the purpose of explanation. Therefore, the patent scope of the invention should be the attached application patent 10 ------ (Please read the back of the first (Please fill in this page for attention) Order ---------% 丨

Claims (1)

1231163 ABCD 6. Scope of patent application: a dielectric material is printed on the copper layer with an appropriate area and on the resistor 罾; and a π conductive material is printed on the copper layer with an appropriate area and the dielectric The material above. 5. The printed circuit board coated resistance electric valley described in item 4 of the scope of the patent application. The overlapping highly conductive material, dielectric material and copper layer constitute a capacitor. The dielectric 1: the material is provided with a fixed dielectric. The coefficient ε r and thickness t can be obtained by controlling the overlap area A of the copper layer and the high-conductance t material. The capacitance is determined according to c =, where K is a constant. 6 The coated circuit resistance type Xiagu of the printed circuit board according to item 4 or 5 of Shen Qing's patent scope. The resistance layer printed between the copper layers constitutes a resistance, and the resistance value of the resistance is according to Λ —pxI = (f) x (F) determines' where P is the resistivity of the resistive layer, L. is the length of the gap between the copper layers, and T, ~ are the width and thickness of the resistive layer, respectively. 7—A kind of printed circuit board coated resistance capacitor is mainly a copper layer with a suitable area on the bottom surface of an insulating substrate, and a gap is formed between the copper layers; the resistor layer is printed on the substrate with a suitable area. On the copper layer and between the gaps; w the electrical material 'is printed on the copper layer with an appropriate area; and the same conductive material' is printed on the copper layer with an appropriate area and the dielectric material The former. This paper size applies to Chinese National Standards (CNS) M specifications (21〇 Office 7 public love) (Please read the notes on the back to write this page, \ 5d 1231163 A8 B8 C8 _ D8 VI. Patent scope 8 If you apply for a patent The printed circuit board coated resistance capacitor described in the seventh item of the scope, the overlapping highly conductive material, dielectric material and copper layer constitute a capacitor, and the dielectric material has a fixed dielectric constant ε r and thickness t By controlling the overlap area A of the copper layer and the highly conductive material 枓, the capacitance with the required capacitance value can be obtained. The capacitance value is determined according to C = ruler xwf, where κ is a constant. 9 Such as the 7th or 8th of the patent application scope The printed circuit board coated resistance capacitor described in the above item, the resistance layer printed between the copper layers constitutes a resistor, and the resistance value of the resistor is Λ = PX — = (^) x (A), which is determined by ATF, Among them, P refers to the resistivity of the resistive layer, and L · is the length of the gap between the copper layers t and W are the width and thickness of the resistive layer, respectively. This paper size is applicable to the Chinese National Standard (CNS) A4 (210 X Material Public Love) ------- (Please read the note I on the back to write this page),